CN115502584A - Copper-clad ceramic substrate slicing process - Google Patents
Copper-clad ceramic substrate slicing process Download PDFInfo
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- CN115502584A CN115502584A CN202211479159.7A CN202211479159A CN115502584A CN 115502584 A CN115502584 A CN 115502584A CN 202211479159 A CN202211479159 A CN 202211479159A CN 115502584 A CN115502584 A CN 115502584A
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- copper
- ceramic substrate
- laser
- clad ceramic
- slicing process
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- 239000000758 substrate Substances 0.000 title claims abstract description 46
- 239000000919 ceramic Substances 0.000 title claims abstract description 44
- 238000000034 method Methods 0.000 title claims abstract description 23
- 230000008569 process Effects 0.000 title claims abstract description 21
- 238000012545 processing Methods 0.000 claims abstract description 40
- 239000010453 quartz Substances 0.000 claims abstract description 17
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 17
- 238000005520 cutting process Methods 0.000 claims abstract description 16
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 7
- 238000003754 machining Methods 0.000 claims description 6
- 230000007246 mechanism Effects 0.000 claims description 6
- 230000000694 effects Effects 0.000 description 6
- 239000011224 oxide ceramic Substances 0.000 description 5
- 229910052574 oxide ceramic Inorganic materials 0.000 description 5
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 5
- 238000011160 research Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229910052573 porcelain Inorganic materials 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004579 marble Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000005459 micromachining Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000005482 strain hardening Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
Abstract
The invention discloses a copper-clad ceramic substrate slicing process, relates to the field of ceramic substrate processing, and aims to solve the problem that a copper-clad ceramic substrate generates taper during slicing and cutting, and the technical scheme is as follows: a copper-clad ceramic substrate slicing process comprises the following steps: the laser emits light, and the emitted light beam reaches a beam expander, and the beam expander expands a laser spot from 15 microns to 50 microns; the expanded light beam passes through at least one reflecting mirror to guide laser to a processing position from the laser; the light beam passing through the reflector passes through a scanning galvanometer to generate a graph to be processed; and then the light beam passes through a telecentric quartz field lens, and the laser is projected onto the copper-clad ceramic substrate for division. According to the copper-clad ceramic substrate slicing process, the vibrating mirror is matched with the telecentric quartz field lens, so that bevel edge taper cannot be generated during cutting of the copper-clad ceramic substrate, and the yield is high.
Description
Technical Field
The invention relates to the field of cutting design of a copper-clad ceramic substrate, in particular to a copper-clad ceramic substrate slicing process.
Background
A Copper-clad ceramic substrate (DBC substrate) is an electronic base material made by directly sintering a Copper foil on a ceramic surface using a DBC (Direct Bond coater) technique. The copper-clad ceramic substrate has the characteristics of excellent thermal cyclicity, stable shape, good rigidity, high thermal conductivity and high reliability, the copper-clad surface can be etched to form various patterns, and the copper-clad ceramic substrate is a pollution-free and nuisanceless green product, has quite wide use temperature, can be from-55 ℃ to 850 ℃, has a thermal expansion coefficient close to that of silicon, and has quite wide application field.
In the process of manufacturing the copper-clad ceramic substrate, a product with an etched pattern is generally cut by a laser machine so as to be divided into individual products. The ceramic belongs to typical hard and brittle materials which are difficult to process, and the alumina ceramic core with the curvature and the complex structure further increases the processing difficulty of the ceramic core, and is still a difficult problem in the processing industry till now. The picosecond laser provides a good way for researching a method for solving the problem by virtue of the good cold working characteristic of the picosecond laser. At present, relatively few researches are carried out on processing alumina ceramics by using picosecond laser machine, the latest research is that Lu Haijiang of the university of Jiangsu uses a picosecond laser with the wavelength of 1064nm to carry out threshold value test and calculation on an alumina flat plate, holes are punched on the flat plate, and the processed micropores have the defects of large roughness, a melting layer at the inlet and large taper (Lu Haijiang. Research on thermodynamic effect micromachining technology of engineering ceramics [ D ]. Jiangsu university, 2017.). Zhou Xiang of the university of china science and technology also uses a picosecond laser with a wavelength of 1064nm to punch holes on a thin alumina plate with a thickness of 28mmx21mmx0.6mm (Zhou Xiang. Picosecond laser processing brittle material technology and mechanism research [ D ] university of china science and technology, 2017.). The need for complex ceramic core tooling has been largely unmet by mere drilling. At present, the research on machining an alumina ceramic core with a curvature complex structure by using a picosecond laser with the wavelength of 532nm is not reported yet, and the problem that the potential of good machining capability of the picosecond laser with the wavelength of 532nm is not discovered exists.
In the conventional use mode at present, a galvanometer type cutting mode is matched with a common non-telecentric field lens, the cutting depth of a product can reach 30-50%, the cutting effect can be met, particularly the cutting depth of thick porcelain (more than 0.5 mm) can reach more than 50%, and otherwise, the bevel edge (taper) can appear.
There is therefore a need to propose a solution to the above mentioned problems.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a copper-clad ceramic substrate slicing process, which cuts by matching a laser with a telecentric quartz field lens and a galvanometer, thereby reducing the generation of bevel edges during slicing and improving the yield of the copper-clad ceramic substrate.
The technical purpose of the invention is realized by the following technical scheme: a copper-clad ceramic substrate slicing process comprises the following steps: the laser emits light, and the emitted light beam reaches a beam expander, and the beam expander expands a laser spot from 15 microns to 50 microns; the expanded light beam passes through at least one reflecting mirror to guide the laser to a processing position from the laser; the light beam passing through the reflector passes through a scanning galvanometer to generate a graph required to be processed; and then the light beam passes through a telecentric quartz field lens, and the laser is projected onto the copper-clad ceramic substrate for division.
The invention is further configured to: the laser is an infrared picosecond laser.
The invention is further configured to: the focal length of the field lens is above F330.
The invention is further configured to: the cutting range of the copper-clad ceramic substrate is more than 190 × 190mm.
The invention is further configured to: the copper-clad ceramic substrate is a copper-clad aluminum oxide ceramic substrate.
The invention is further configured to: the thickness of the copper-clad aluminum oxide ceramic substrate is more than 0.5mm.
The invention is further configured to: the processing platform is provided with at least three laser range finders, the laser range finders detect the distance from the processing platform to the telecentric quartz field lens in real time, and the laser range finders are not located on the same straight line.
The invention is further configured to: the processing platform is provided with an adjusting mechanism for adjusting the processing platform to keep the processing platform completely parallel to the telecentric quartz field lens.
The invention is further configured to: the adjusting mechanism comprises spherical friction pieces which are mutually sleeved, and the machining platform is kept stable through friction force between the spherical friction pieces.
The invention is further configured to: the processing platform is also provided with a level gauge.
In conclusion, the invention has the following beneficial effects: in a conventional use mode, only laser model selection is regarded as important, field lens model selection is not regarded as important, in a conventional cutting mode, a vibrating mirror type cutting mode is used in combination with a common non-telecentric field lens, the cutting depth of a product can reach 30-50%, the cutting effect can be met, particularly, the cutting depth of thick porcelain (more than 0.5 mm) can reach more than 50%, otherwise, a bevel edge (taper) can appear.
Drawings
FIG. 1 shows telecentric lens optical path characteristics and telecentric lens processing characteristics;
fig. 2 shows the optical path characteristics of the non-telecentric lens and the processing characteristics of the non-telecentric lens.
Detailed Description
The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will become apparent to those skilled in the art from the present disclosure.
In the invention, the usable lasers comprise carbon dioxide laser 30-150w, optical fiber nanosecond laser 30-150w, infrared picosecond laser 100-150w and ultraviolet nanosecond laser 50-80w, and the products are processed by matching with automation equipment, CCD positioning and vacuum adsorption equipment and the lasers.
Wherein the picosecond level laser uses a telecentric quartz field lens and a galvanometer mode more than F330 to cut:
infrared picosecond laser sends the light source, and the light source passes through the beam expander, and the effect of beam expander makes laser spot grow thick, enlarges to about 50 microns by 15 microns, the leading cause: laser source energy density is great, if not expand and can injure the speculum, then the light beam passes through first speculum again, passes through the second speculum again, passes through the third speculum again, and wherein the speculum effect: guiding the laser from the laser position to the machining position, the number of times of which is determined by the actual machining according to the equipment position; then the light beam passes through a scanning galvanometer, the scanning galvanometer is used for generating a graph required to be processed, and finally the light beam passes through an F330 telecentric quartz field lens and has the following functions: laser is projected onto a product, and each light path is ensured to be vertical to the surface of the product by 90 degrees, so that the light beam reaches the copper-clad ceramic substrate to divide the substrate.
Meanwhile, in the laser projection process, a laser range finder arranged on the processing platform monitors the distance from the telecentric quartz field lens in real time from the surface of the processing platform, and at least three laser range finders are arranged, the three laser range finders are not on the same straight line, so that the processing platform and the telecentric quartz field lens can be detected to be always kept in a horizontal state, when the data detected by the three laser range finders are different, the processing platform and the telecentric quartz field lens are not completely parallel, the position of the processing platform relative to the telecentric quartz field lens needs to be adjusted at the moment, the processing platform is ensured to be completely parallel to the telecentric quartz field lens, the processing platform is therefore provided with an adjustment mechanism, which may be arranged to provide the bottom of the processing platform with spherical protrusions made of a substance with a higher density, such as marble, a base is arranged on the ground, a spherical groove matched with the spherical bulge is arranged in the base, the spherical bulge is arranged in the spherical groove to form fit, and because the spherical protrusions have larger density and the surface is in more contact with the spherical grooves, the relative friction force is larger, the processing platform can keep absolute stability and can not generate deviation in normal use, and when the levelness of the processing platform needs to be adjusted, the processing platform is slightly adjusted by applying an external force manually, or a mechanical structure can be arranged to slightly adjust the processing platform, thereby keeping the data detected by at least three laser range finders consistent, enabling the incidence angle of the laser to be kept at 90 degrees, of course, a level meter can be arranged on the processing platform to detect whether the processing platform is in a horizontal state, so that the processing platform and the telecentric quartz field lens can be conveniently adjusted.
The infrared picosecond laser is matched with the focal length range of F330 or more, the cutting range is the use of the telecentric lens of 190x 190mm or more, the laser can be enabled to be in the range of the copper-clad ceramic substrate (190 x140 mm), the laser incidence angle is kept within 90 +/-2 degrees, and the degree is greatly improved particularly when the copper-clad aluminum oxide ceramic substrate with the thickness of 0.5mm or more is sliced, namely, as shown in figure 1, the incidence angle of the telecentric lens is 90 degrees, the stress direction is vertical during slicing, and unnecessary bevel edges (taper angle) can not appear after the copper-clad aluminum oxide ceramic substrate is sliced. For better showing and comparing, fig. 2 shows the light path characteristics of the non-telecentric lens and the processing characteristics of the non-telecentric lens, the non-telecentric lens has an incident angle of not 90 degrees on the surface of the product, and the stress direction is not vertical when slicing, so that redundant bevel edges (taper) appear after slicing; the scheme of the invention is shown in figure 1, the incidence angle of the telecentric lens is 90 degrees, the stress direction is vertical during slicing, and no redundant bevel edge (taper) appears after slicing.
According to the invention, the copper-clad ceramic substrate can be processed and sliced by using different laser light sources, and the bending resistance of the ceramic chip can be improved to different degrees by matching the laser with the galvanometer and the telecentric field lens.
The cutting mode of the far-center field lens over the infrared picosecond laser, the vibrating mirror and the F330 can ensure that the copper-coated aluminum oxide ceramic substrate with the thickness of over 0.5mm does not need to be spliced, the processing is finished at one time, the efficiency is improved, meanwhile, the quality of the far-center field lens can be improved (the splicing is not needed), the overlapping of at least 15 micrometers is realized in the conventional splicing mode, the laser processing is carried out twice in the range, and the product damage is influenced in multiples; the telecentric field lens can lead the product taper to be infinitely close to 90 degrees, and can further improve the size precision of the product.
The above description is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments, and all technical solutions belonging to the idea of the present invention belong to the protection scope of the present invention. It should be noted that modifications and embellishments within the scope of the invention may occur to those skilled in the art without departing from the principle of the invention, and are considered to be within the scope of the invention.
Claims (10)
1. The copper-clad ceramic substrate slicing process is characterized by comprising the following steps of:
the laser emits light, the emitted light beam reaches a beam expander, and a laser spot is expanded from 15 micrometers to 50 micrometers by the beam expander;
the expanded light beam passes through at least one reflecting mirror to guide laser from the laser to the processing platform;
the light beam passing through the reflector passes through a scanning galvanometer to generate a graph to be processed;
and then the light beam passes through a telecentric quartz field lens, and the laser is projected onto the copper-clad ceramic substrate for division.
2. The copper-clad ceramic substrate slicing process according to claim 1, wherein the laser is an infrared picosecond laser.
3. The copper-clad ceramic substrate slicing process according to claim 2, wherein the field lens focal length is F330 or more.
4. The copper-clad ceramic substrate slicing process according to claim 3, wherein the cutting range of the copper-clad ceramic substrate is more than 190x 190mm.
5. The copper-clad ceramic substrate slicing process according to claim 1 or 4, wherein the copper-clad ceramic substrate is a copper-clad alumina ceramic substrate.
6. The copper-clad ceramic substrate slicing process according to claim 5, wherein the thickness of the copper-clad alumina ceramic substrate is more than 0.5mm.
7. The copper-clad ceramic substrate slicing process according to claim 1, wherein at least three laser range finders are arranged on the processing platform, the laser range finders detect the distance from the processing platform to the telecentric quartz field lens in real time, and the at least three laser range finders are not located on the same straight line.
8. The copper-clad ceramic substrate slicing process according to claim 7, wherein: the processing platform is provided with an adjusting mechanism for adjusting the processing platform to keep the processing platform completely parallel to the telecentric quartz field lens.
9. The copper-clad ceramic substrate slicing process according to claim 8, wherein: the adjusting mechanism comprises spherical friction pieces which are mutually sleeved, and the machining platform is kept stable through friction force between the spherical friction pieces.
10. The copper-clad ceramic substrate slicing process according to claim 9, wherein: the processing platform is also provided with a level gauge.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211479159.7A CN115502584A (en) | 2022-11-24 | 2022-11-24 | Copper-clad ceramic substrate slicing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211479159.7A CN115502584A (en) | 2022-11-24 | 2022-11-24 | Copper-clad ceramic substrate slicing process |
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| Publication Number | Publication Date |
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| CN115502584A true CN115502584A (en) | 2022-12-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202211479159.7A Pending CN115502584A (en) | 2022-11-24 | 2022-11-24 | Copper-clad ceramic substrate slicing process |
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Application publication date: 20221223 |