CN115476032A - 激光加工装置 - Google Patents
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- 230000003287 optical effect Effects 0.000 claims abstract description 13
- 238000001816 cooling Methods 0.000 claims description 13
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 238000012986 modification Methods 0.000 description 8
- 230000004048 modification Effects 0.000 description 8
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 2
- 239000002346 layers by function Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 239000012768 molten material Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
本发明提供激光加工装置,其能够抑制扫描光学***带来的噪音。激光加工装置的激光束照射单元包含:激光振荡器,其射出激光束;聚光器,其将从激光振荡器射出的激光束会聚而向保持工作台所保持的被加工物照射;以及扫描单元,其配设于激光振荡器与聚光器之间的光路上,扫描激光束而向聚光器引导,该扫描单元具有扫描镜。扫描镜配设于腔室的内部,腔室包含:第一窗部,其使从激光振荡器射出的激光束透过并向扫描镜引导;以及第二窗部,其使通过扫描镜而扫描的激光束向聚光器透过。
Description
技术领域
本发明涉及激光加工装置。
背景技术
作为将在正面上层叠有包含Low-k膜等的功能层的半导体晶片进行分割而芯片化的方法,提出了在照射激光束而将层叠的功能层去除之后通过切削刀具的切削加工进行分割的加工方法(参照专利文献1)。
但是,该方法中,为了防止由于激光束的照射而产生的碎屑等熔融物未充分排出而回填到加工槽内,需要多次照射激光束而形成充分宽度的加工槽,存在生产率差的问题。
为了解决该问题,开发了一种激光加工装置,其中,在激光振荡器与聚光器之间配置有扫描激光束的扫描光学***,一边扫描激光束一边照射,由此能够防止熔融物的回填,并且能够实施有效的加工(参照专利文献2)。
专利文献1:日本特开2005-064231号公报
专利文献2:日本特开2016-068149号公报
但是,当使上述的扫描光学***高速运转时会产生喧哗的声音,因此存在操作者难以在装置周边持续作业的课题。
发明内容
由此,本发明的目的在于提供激光加工装置,其能够抑制扫描光学***带来的噪音。
根据本发明,提供激光加工装置,其中,该激光加工装置具有:保持工作台,其对被加工物进行保持;激光束照射单元,其对该保持工作台所保持的被加工物会聚照射脉冲状的激光束而实施加工;以及移动单元,其使该保持工作台和该激光束的聚光点相对地移动,该激光束照射单元包含:激光振荡器,其射出激光束;聚光器,其将从该激光振荡器射出的激光束会聚而向该保持工作台所保持的被加工物照射;以及扫描单元,其配设于该激光振荡器与该聚光器之间的光路上,扫描该激光束而向该聚光器引导,该扫描单元具有扫描镜,该扫描镜配设于腔室的内部,该腔室包含:第一窗部,其使从该激光振荡器射出的激光束透过并向该扫描镜引导;以及第二窗部,其使通过该扫描镜而扫描的激光束向该聚光器透过。
优选该腔室与能够对该腔室的内部进行减压的吸引源连通。
优选该腔室还包含能够对该腔室的内部进行冷却的冷却单元。
根据本发明,能够抑制扫描光学***带来的噪音。
附图说明
图1是示出实施方式的激光加工装置的结构例的立体图。
图2是示出图1所示的激光加工装置的激光束照射单元的概略结构的示意图。
图3是将变形例的激光束照射单元的扫描单元的周边放大而示出的示意图。
标号说明
1:激光加工装置;10:保持工作台;20、20-1:激光束照射单元;21:激光束;211:聚光点;22:激光振荡器;26:聚光器;30:扫描单元;31:扫描镜;33、33-1:腔室;34:第一窗部;35、35-1:第二窗部;36:吸引源;37:冷却单元;40:移动单元;100:被加工物。
具体实施方式
以下,参照附图对本发明的实施方式进行详细说明。本发明并不被以下实施方式所记载的内容限定。另外,在以下所记载的构成要素中包含本领域技术人员能够容易想到的内容、实质上相同的内容。另外,以下所记载的结构可以适当组合。另外,可以在不脱离本发明的主旨的范围内进行结构的各种省略、置换或变更。
首先,根据附图对本发明的实施方式的激光加工装置1的结构进行说明。图1是示出实施方式的激光加工装置1的结构例的立体图。在以下的说明中,X轴方向是水平面上的一个方向。Y轴方向是在水平面上与X轴方向垂直的方向。Z轴方向是与X轴方向和Y轴方向垂直的方向。实施方式的激光加工装置1中,加工进给方向是X轴方向,分度进给方向是Y轴方向。
如图1所示,激光加工装置1具有保持工作台10、激光束照射单元20、移动单元40、显示单元50以及控制单元60。实施方式的激光加工装置1是通过激光束照射单元20对保持工作台10所保持的被加工物100照射脉冲状的激光束21而对被加工物100进行加工的装置。激光加工装置1对被加工物100的加工例如是在被加工物100的正面上形成槽的槽加工或沿着分割预定线将被加工物100切断的切断加工等。
在实施方式中,被加工物100是以硅(Si)、蓝宝石(Al2O3)、砷化镓(GaAs)、碳化硅(SiC)或钽酸锂(LiTa3)等作为基板101的圆板状的半导体器件晶片、光器件晶片等晶片。另外,被加工物100不限于实施方式,在本发明中,可以不是圆板状。
被加工物100具有:呈格子状设定于基板101的正面102的分割预定线103;以及形成于由分割预定线103划分的区域的器件104。器件104例如是IC(Integrated Circuit,集成电路)或LSI(Large Scale Integration,大规模集成)等集成电路、CCD(Charge CoupledDevice,电感耦合元件)、或CMOS(Complementary Metal Oxide Semiconductor,互补金属氧化物半导体)等图像传感器。例如将粘贴有环状的框架110且直径大于被加工物100的外径的粘贴带111粘贴于被加工物100的背面105而将被加工物100支承于框架110的开口内。
保持工作台10利用保持面11对被加工物100进行保持。保持面11是由多孔陶瓷等形成的圆板形状。在实施方式中,保持面11是与水平方向平行的平面。保持面11例如经由真空吸引路径而与真空吸引源连接。保持工作台10对载置于保持面11上的被加工物100进行吸引保持。在保持工作台10的周围配置有多个对支承被加工物100的框架110进行夹持的夹持部12。
保持工作台10通过旋转单元13绕与Z轴方向平行的轴心旋转。旋转单元13支承于X轴方向移动板14。旋转单元13和保持工作台10借助X轴方向移动板14而通过移动单元40的X轴方向移动单元41在X轴方向上移动。旋转单元13和保持工作台10借助X轴方向移动板14、X轴方向移动单元41和Y轴方向移动板15而通过移动单元40的Y轴方向移动单元42在Y轴方向上移动。
激光束照射单元20是对保持工作台10所保持的被加工物100照射具有用于加工被加工物100的规定波长的脉冲状的激光束21的单元。在实施方式中,激光束照射单元20的一部分支承于支承柱4的前端,支承柱4的基端部安装在从装置主体2立设的立设部3上。后文对激光束照射单元20的详细构成进行说明。
移动单元40是使保持工作台10和从激光束照射单元20照射的激光束21的聚光点(例如,参照图3的聚光点211)相对地移动的单元。移动单元40包含X轴方向移动单元41和Y轴方向移动单元42。
X轴方向移动单元41是使保持工作台10和从激光束照射单元20照射的激光束21的聚光点(例如,参照图3的聚光点211)在作为加工进给方向的X轴方向上相对地移动的单元。在实施方式中,X轴方向移动单元41使保持工作台10在X轴方向上移动。在实施方式中,X轴方向移动单元41设置于激光加工装置1的装置主体2上。X轴方向移动单元41将X轴方向移动板14支承为在X轴方向上移动自如。
Y轴方向移动单元42是使保持工作台10和从激光束照射单元20照射的激光束21的聚光点(例如,参照图3的聚光点211)在作为分度进给方向的Y轴方向上相对地移动的单元。在实施方式中,Y轴方向移动单元42使保持工作台10在Y轴方向上移动。在实施方式中,Y轴方向移动单元42设置于激光加工装置1的装置主体2上。Y轴方向移动单元42将Y轴方向移动板15支承为在Y轴方向上移动自如。
X轴方向移动单元41和Y轴方向移动单元42分别包含例如周知的滚珠丝杠、周知的脉冲电动机以及周知的导轨。滚珠丝杠设置成绕轴心旋转自如。脉冲电动机使滚珠丝杠绕轴心旋转。X轴方向移动单元41的导轨固定地设置于Y轴方向移动板15,将X轴方向移动板14支承为在X轴方向上移动自如。Y轴方向移动单元42的导轨固定地设置于装置主体2,将Y轴方向移动板15支承为在Y轴方向上移动自如。
显示单元50是由液晶显示装置等构成的显示部。显示单元50例如将加工条件的设定画面、未图示的拍摄单元所拍摄的被加工物100的状态、加工动作的状态等显示在显示面51上。在显示单元50的显示面51包含触摸面板的情况下,显示单元50可以包含输入部。输入部能够接受操作者登记加工内容信息等各种操作。输入部可以是键盘等外部输入装置。显示单元50通过来自输入部等的操作而切换显示在显示面51上的信息或图像。显示单元50可以包含通知装置。通知装置发出声和光中的至少一方而对激光加工装置1的操作者通知预先设定的通知信息。通知装置也可以是扬声器或发光装置等外部通知装置。
控制单元60分别控制激光加工装置1的上述各构成要素而使激光加工装置1执行对被加工物100的加工动作。控制单元60是计算机,该控制单元60包含:作为运算单元的运算处理装置;作为存储单元的存储装置;以及作为通信单元的输入输出接口装置。运算处理装置例如包含CPU(Central Processing Unit,中央处理器)等微处理器。存储装置具有ROM(Read Only Memory,只读存储器)或RAM(Random Access Memory,随机存取存储器)等存储器。运算处理装置根据保存在存储装置的规定程序而进行各种运算。运算处理装置按照运算结果,经由输入输出接口装置而将各种控制信号输入至上述各构成要素,进行激光加工装置1的控制。
接着,对激光束照射单元20的结构进行详细说明。图2是对图1所示的激光加工装置1的激光束照射单元20的概略结构进行说明的说明图。如图2所示,激光束照射单元20具有:激光振荡器22;声光元件(Acousto-Optic Deflector:AOD)23;反射镜24、25;聚光器26;扫描单元30;以及腔室33。
激光振荡器22射出具有用于加工被加工物100的规定波长的激光束21。在实施方式中,激光束照射单元20所照射的激光束21是对于被加工物100具有吸收性的波长的激光束。
声光元件23通过施加规定的高频而使从激光振荡器22射出的激光束21的光路向规定的方向(在实施方式中为Y轴方向)偏转并进行扫描。声光元件23与所施加的高频的频率对应而调整使激光束21的光路偏转的角度。由此,激光束21在Y轴方向上进行扫描。
在实施方式中,反射镜24、25设置于声光元件23与扫描单元30之间的光路上。反射镜24、25将从激光振荡器22射出并通过声光元件23偏转的激光束21传递至扫描单元30。
通过扫描单元30而扫描的激光束21入射至聚光器26。聚光器26将从激光振荡器22射出的激光束会聚而向保持工作台10所保持的被加工物100照射。聚光器26在实施方式中是fθ透镜。聚光器26是将多个透镜组合而成的透镜组。
扫描单元30是配设于激光振荡器22与聚光器26之间的光路上且扫描激光束21而向聚光器26引导的单元。在实施方式中,扫描单元30包含多边形扫描器,但本发明中也可以包含共振扫描器。扫描单元30包含扫描镜31和扫描电动机32。
扫描镜31设置成能够绕与分度进给方向(Y轴方向)平行的轴心旋转或摆动。在实施方式中,扫描镜31分别设置于绕轴心旋转的多棱柱体(在实施方式中为八棱柱体)的侧面上。扫描镜31的轴心保持于未图示的镜支托。聚光器26的前侧焦点定位于在扫描单元30中从反射镜25侧入射激光束21的扫描镜31上。扫描电动机32输出用于使扫描镜31绕轴心旋转或摆动的旋转驱动力。
在实施方式中,通过声光元件23而偏转的激光束21入射至扫描单元30。扫描单元30利用扫描镜31使激光束21朝向聚光器26在与XZ平面平行的方向上反射,并且使扫描镜31绕与Y轴方向平行的轴心旋转,由此使激光束21在X轴方向上扫描。
腔室33在内部配设扫描镜31。腔室33具有第一窗部34和第二窗部35。第一窗部34和第二窗部35以使激光束21透过的方式配置在将腔室33的内部与周围的环境分离的壁部上。第一窗部34使从激光振荡器22射出的激光束21透过并向扫描镜31引导。第二窗部35使由扫描镜31扫描的激光束21向聚光器26透过。
【变形例】
接着,根据附图对变形例的激光束照射单元20-1的结构进行说明。另外,关于变形例的激光束照射单元20-1,对与实施方式的激光束照射单元20相同的结构标注相同的标号并省略说明。图3是将变形例的激光束照射单元20-1的扫描单元30的周边放大而示出的说明图。
变形例的激光束照射单元20-1与实施方式的激光束照射单元20相比,取代腔室33而具有腔室33-1。腔室33-1与实施方式的腔室33同样地,将扫描镜31配设于内部。另外,腔室33-1不在内部配设扫描单元30的扫描电动机32。
腔室33-1具有第一窗部34和第二窗部35-1。第一窗部34和第二窗部35-1以使激光束21透过的方式配置在将腔室33的内部与周围的环境分离的壁部上。第一窗部34使从激光振荡器22射出的激光束21透过并向扫描镜31引导。
变形例的第二窗部35-1作为聚光器26而设置,该聚光器26将扫描镜31所扫描的激光束21会聚而向保持工作台10所保持的被加工物100进行照射。第二窗部35-1固定设置于腔室33-1。聚光器26在将腔室33的内部与周围的环境分离的壁部上配置成使激光束21透过的窗状。即,变形例的腔室33-1具有作为聚光器26的透镜支托的功能。由此,聚光器26在相对于扫描镜31的距离和位置固定的状态下进行单元化。
另外,变形例的腔室33-1与吸引源36连通。吸引源36能够对腔室33-1的内部进行减压。腔室33-1例如被减压至大气压的1/10倍左右。通过对腔室33-1内部进行减压,能够减小扫描镜31旋转时的空气阻力,因此能够抑制噪音的产生。另外,通过对腔室33-1内部进行减压,能够抑制在内部产生的声音的泄漏。
另外,变形例的腔室33-1还具有冷却单元37。冷却单元37能够冷却腔室33-1的内部。冷却单元37例如以冷却部在扫描镜31的轴心方向上夹着扫描镜31的方式配置。冷却单元37与冷却源38连接,例如利用从冷却源38提供的冷却水对腔室33-1的内部进行水冷。
如以上说明的那样,实施方式以及变形例所涉及的激光加工装置通过将高速运转的扫描镜31配设在腔室33、33-1的内部,能够抑制噪音。
并且,变形例的激光加工装置通过对腔室33-1的内部进行减压,能够抑制由扫描镜31的高速旋转引起的噪音的产生,并且能够抑制声音泄漏。另外,通过对腔室33-1的内部进行冷却,能够降低因扫描镜31的高速运转而产生的热带来的热负荷,因此能够抑制加工位置偏移等加工不良的产生。
另外,本发明并不限于上述实施方式。即,能够在不脱离本发明的主旨的范围内进行各种变形而实施。
Claims (3)
1.一种激光加工装置,其中,
该激光加工装置具有:
保持工作台,其对被加工物进行保持;
激光束照射单元,其对该保持工作台所保持的被加工物会聚照射脉冲状的激光束而实施加工;以及
移动单元,其使该保持工作台和该激光束的聚光点相对地移动,
该激光束照射单元包含:
激光振荡器,其射出激光束;
聚光器,其将从该激光振荡器射出的激光束会聚而向该保持工作台所保持的被加工物照射;以及
扫描单元,其配设于该激光振荡器与该聚光器之间的光路上,扫描该激光束而向该聚光器引导,该扫描单元具有扫描镜,
该扫描镜配设于腔室的内部,
该腔室包含:
第一窗部,其使从该激光振荡器射出的激光束透过并向该扫描镜引导;以及
第二窗部,其使通过该扫描镜而扫描的激光束向该聚光器透过。
2.根据权利要求1所述的激光加工装置,其中,
该腔室与能够对该腔室的内部进行减压的吸引源连通。
3.根据权利要求1或2所述的激光加工装置,其中,
该腔室还包含能够对该腔室的内部进行冷却的冷却单元。
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