CN115476012A - Application of Cu-Ti brazing filler metal with high Cu atomic ratio in ceramic-metal brazing - Google Patents
Application of Cu-Ti brazing filler metal with high Cu atomic ratio in ceramic-metal brazing Download PDFInfo
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- CN115476012A CN115476012A CN202211313813.7A CN202211313813A CN115476012A CN 115476012 A CN115476012 A CN 115476012A CN 202211313813 A CN202211313813 A CN 202211313813A CN 115476012 A CN115476012 A CN 115476012A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
- B23K1/206—Cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/18—Dissimilar materials
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E30/00—Energy generation of nuclear origin
- Y02E30/30—Nuclear fission reactors
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Abstract
An application of a Cu-Ti solder with high Cu atomic ratio in ceramic and metal brazing relates to the technical field of application of Cu-Ti solder with high Cu atomic ratio. The invention aims to solve the problem that the existing eutectic composition Cu-23Ti (wt.%) solder is adopted to carry out Ti 3 SiC 2 When the ceramic and Nb are connected by brazing, the brittle CuTi compound generated in the joint causes the problem of low shear strength of the joint. The method comprises the following steps: according to Ti 3 SiC 2 Sequentially assembling ceramic/Ti foil/Cu foil/Nb to obtain an assembly part to be welded; placing the assembly to be welded into a vacuum brazing furnace at 5 x 10 ‑2 Keeping the temperature for 5-60 min under the vacuum degree of Pa and the brazing temperature of 950-1010 ℃, and cooling to room temperature after the brazing is finished. The invention can obtain the application of the Cu-Ti solder with high Cu atomic ratio in the brazing of ceramics and metals.
Description
Technical Field
The invention relates to the technical field of application of Cu-Ti solder with high Cu atomic ratio, in particular to application of Cu-Ti solder with high Cu atomic ratio in ceramic and metal brazing.
Background
Ti 3 SiC 2 The ceramic has the advantages of good room temperature and high temperature strength, oxidation resistance, corrosion resistance, good machinability and the like, and is expected to become a novel high-temperature structural material to be used as kiln furniture materials, turbine blade parts, high-temperature parts of aeroengines and the like. Nb is used as a high-temperature material and a structural material, is widely applied to the fields of aerospace and the like, and is prepared by Ti 3 SiC 2 The ceramic and the metal Nb are reliably connected, so that the advantages of the ceramic and the metal Nb can be fully exerted, and the application field of the material is widened. Wherein the eutectic composition Cu-23Ti (wt.%) solder can realize Ti 3 SiC 2 Direct braze joining of ceramics to Nb, but large amounts of brittle CuTi compounds are generated in the joint, resulting in a braze joint with reduced shear strength.
Disclosure of Invention
The invention aims to solve the problem that the existing eutectic composition Cu-23Ti (wt.%) solder is adopted to carry out Ti 3 SiC 2 When the ceramic is connected with the Nb in a brazing mode, the brittle CuTi compound generated in the joint causes the problem of low shear strength of the joint, and the application of the Cu-Ti brazing filler metal with high Cu atomic ratio in the brazing of the ceramic and the metal is provided.
The Cu-Ti solder with the high Cu atomic ratio is a Cu-10Ti solder, and the Cu-10Ti solder is used for contact reaction brazing of ceramics and metals.
The ceramic is Ti 3 SiC 2 And the metal is Nb.
The Cu-10Ti solder is used for Ti 3 SiC 2 The contact reaction brazing of the ceramic and the metal Nb is carried out according to the following steps:
1. ti (titanium) 3 SiC 2 Pre-welding treatment of ceramic and Nb: mixing Ti 3 SiC 2 Cutting the ceramic and Nb into predetermined sizes, and cutting Ti 3 SiC 2 Polishing and cleaning the surfaces to be welded of the ceramic and the Nb; the Ti 3 SiC 2 Al element with mass fraction of 0.5-2.0% is dissolved in the ceramic;
2. preparing Cu-10Ti solder: cutting Cu foil and Ti foil into pieces 3 SiC 2 Polishing the Cu foil and the Ti foil according to the standard that the mass fraction of Ti in the Cu-10Ti brazing filler metal is 10%, then processing the Cu foil and the Ti foil until the surfaces are flat, and then cleaning;
3. assembling a test piece to be welded and carrying out vacuum contact reaction brazing: according to Ti 3 SiC 2 Sequentially assembling ceramic/Ti foil/Cu foil/Nb to obtain an assembly part to be welded; placing the assembly to be welded into a vacuum brazing furnace at 5 x 10 -2 Keeping the temperature for 5-60 min under the vacuum degree of Pa and the brazing temperature of 950-1010 ℃, cooling to room temperature after the brazing is finished, and finishing the Ti 3 SiC 2 And (3) performing contact reaction brazing on the ceramic, the Cu-10Ti brazing filler metal and the metal Nb.
The invention has the beneficial effects that:
(1) The invention uses the Cu-Ti solder with low Ti content and high Cu atomic ratio, and because the Ti content is low, cu with good plasticity exists in a welding seam in a large amount 4 Ti effectively reduces the generation of CuTi brittle compounds in the welding line, thereby having excellent mechanical property and brazing Ti 3 SiC 2 The shearing strength of the ceramic and metal rear joint reaches more than 130 MPa.
(2) The invention uses Cu and Ti foils with small thickness to form the composite brazing filler metal, and the brazing filler metal with high Cu atomic ratio in non-eutectic components can be melted and liquid-phase expanded at relatively low temperature by a contact reaction brazing method, thereby realizing the welding at relatively low temperature.
The invention can obtain the application of the Cu-Ti brazing filler metal with high Cu atomic ratio in ceramic and metal brazing.
Drawings
FIG. 1 is a Cu-Ti solder of example 1 in which Ti is mixed with a Cu-Ti solder having a high Cu atomic ratio 3 SiC 2 A microstructure back scattering picture of a soldered joint after contact reaction brazing of the ceramic and the Nb;
FIG. 2 isComparative example 1 Ti was alloyed with a conventional Cu-Ti eutectic solder 3 SiC 2 And (3) performing contact reaction brazing on the ceramic and the Nb, and then performing back scattering picture on the microstructure of the brazed joint.
Detailed Description
The first embodiment is as follows: the Cu-Ti solder with high Cu atomic ratio is a Cu-10Ti solder, and the Cu-10Ti solder is used for contact reaction soldering of ceramics and metals.
The second embodiment is as follows: the present embodiment differs from the present embodiment in that: the ceramic is Ti 3 SiC 2 And (3) ceramic.
Other steps are the same as in the first embodiment.
The third concrete implementation mode: the first or second differences from the present embodiment are as follows: the metal is Nb.
The other steps are the same as those in the first or second embodiment.
The fourth concrete implementation mode is as follows: the difference between this embodiment and one of the first to third embodiments is: the Cu-10Ti solder is used for Ti 3 SiC 2 The contact reaction brazing of the ceramic and the metal Nb is carried out according to the following steps:
1. ti (titanium) 3 SiC 2 Pre-welding treatment of ceramic and Nb: mixing Ti 3 SiC 2 Cutting the ceramic and Nb into predetermined sizes, and cutting Ti 3 SiC 2 Polishing and cleaning the surfaces to be welded of the ceramics and the Nb; the Ti 3 SiC 2 Al element with mass fraction of 0.5-2.0% is dissolved in the ceramic;
2. preparing Cu-10Ti solder: cutting Cu foil and Ti foil into pieces 3 SiC 2 Polishing the Cu foil and the Ti foil according to the standard that the mass fraction of Ti in the Cu-10Ti brazing filler metal is 10%, then processing the Cu foil and the Ti foil until the surfaces are flat, and then cleaning;
3. assembling a test piece to be welded and carrying out vacuum contact reaction brazing: according to Ti 3 SiC 2 Sequentially assembling ceramic/Ti foil/Cu foil/Nb to obtain an assembly part to be welded; will be weldedThe parts were placed in a vacuum brazing furnace at 3X 10 -3 Pa～5×10 -2 Keeping the temperature for 5-60 min under the vacuum degree of Pa and the brazing temperature of 950-1010 ℃, cooling to room temperature after the brazing is finished, and finishing the Ti 3 SiC 2 And (3) performing contact reaction brazing on the ceramic, the Cu-10Ti brazing filler metal and the Nb.
The other steps are the same as those in the first to third embodiments.
The fifth concrete implementation mode: the difference between this embodiment and the first to the fourth embodiments is: in the first step, ti 3 SiC 2 And gradually polishing the surfaces to be welded of the ceramic and the Nb by adopting 240-600-mesh sand paper.
The other steps are the same as those in the first to fourth embodiments.
The sixth specific implementation mode is as follows: the difference between this embodiment and one of the first to fifth embodiments is: the cleaning process in the first step is as follows: ti after polishing 3 SiC 2 Putting the ceramic and the Nb into a cleaning agent, and ultrasonically cleaning for 10-20 min in an ultrasonic cleaning machine; the cleaning agent is alcohol or acetone.
The other steps are the same as those in the first to fifth embodiments.
The seventh embodiment: the difference between this embodiment and one of the first to sixth embodiments is: in the second step, the thicknesses of the Cu foil and the Ti foil are both 50-500 mu m.
The other steps are the same as those in the first to sixth embodiments.
The specific implementation mode eight: the difference between this embodiment and the first to seventh embodiments is: the polishing process in the second step is as follows: and (3) gradually polishing the two surfaces of the Cu foil and the Ti foil by using sand paper of 240-600 meshes.
The other steps are the same as those in the first to seventh embodiments.
The specific implementation method nine: the difference between this embodiment and the first to eighth embodiments is: the cleaning process in the second step is as follows: putting the polished Cu foil and Ti foil into a cleaning agent, and ultrasonically cleaning for 10-20 min in an ultrasonic cleaning machine; the cleaning agent is alcohol or acetone.
The other steps are the same as those in the first to eighth embodiments.
The detailed implementation mode is ten: the difference between this embodiment and the first to ninth embodiments is: and in the third step, after the brazing is finished, cooling to room temperature at a cooling rate of 4-6 ℃/min.
The other steps are the same as those in the first to ninth embodiments.
The following examples were used to demonstrate the beneficial effects of the present invention:
example 1: the brazing filler metal in this example was Cu-10Ti (wt.%); cu-10Ti solder for Ti 3 SiC 2 The contact reaction brazing of the ceramic and the metal Nb is carried out according to the following steps:
1. ti 3 SiC 2 Pretreatment of the ceramic and Nb before welding: mixing Ti 3 SiC 2 Cutting the ceramic to 5 × 5 × 5mm 3 Cutting Nb into 3X 10X 15mm 3 And adding Ti 3 SiC 2 Sequentially and gradually polishing the surfaces to be welded of the ceramic and the Nb by using 240, 400 and 600-mesh sand paper, and then polishing the Ti 3 SiC 2 Putting the ceramic and the Nb into a cleaning agent, and ultrasonically cleaning for 15min in an ultrasonic cleaning machine; the cleaning agent is alcohol or acetone; the Ti 3 SiC 2 Al element with mass fraction of 0.5-2.0% is dissolved in the ceramic;
2. preparing Cu-10Ti solder: cutting Cu foil and Ti foil into pieces of 5.5X 5.5mm in area by using a diamond wire cutter 2 According to the standard that the mass fraction of Ti in the Cu-10Ti brazing filler metal is 10%, sequentially polishing two surfaces of a Cu foil and a Ti foil by adopting sand paper of 240 meshes, 400 meshes and 600 meshes, polishing the Cu foil to about 31mg and polishing the Ti foil to about 7mg, clamping the brazing filler metal foil by using two flat surfaces, applying pressure to flatten the Cu foil and the Ti foil, then putting the Cu foil and the Ti foil into alcohol, and ultrasonically cleaning for 15min in an ultrasonic cleaning machine; the ratio of the thickness of the Cu foil to the Ti foil was about 10:1;
3. assembling a test piece to be welded and carrying out vacuum contact reaction brazing: according to Ti 3 SiC 2 ceramic/Ti foil/Cu foil/Nb sequence, ti using graphite blocks 3 SiC 2 Compacting the ceramic, the Ti foil, the Cu foil and the Nb to obtain an assembly part to be welded; placing the assembly to be welded into a vacuum brazing furnace at 5 x 10 -2 Vacuum degree of Pa andand (3) preserving the heat for 10min at the brazing temperature of 990 ℃, cooling to room temperature at the cooling rate of 5 ℃/min after the brazing is finished, and taking out the test piece to finish the process.
Comparative example 1: the braze in this comparative example was Cu-23Ti (wt.%);
1. ti 3 SiC 2 Pretreatment of the ceramic and Nb before welding: mixing Ti 3 SiC 2 Cutting the ceramic to 5 × 5 × 5mm 3 Cutting Nb into 3X 10X 15mm 3 And adding Ti 3 SiC 2 Sequentially and gradually polishing the surfaces to be welded of the ceramic and the Nb by using 240, 400 and 600 meshes of sand paper, and then polishing the Ti 3 SiC 2 Putting the ceramic and Nb into a cleaning agent, and ultrasonically cleaning for 15min in an ultrasonic cleaning machine; the cleaning agent is alcohol or acetone; the Ti 3 SiC 2 Al element with the mass fraction of 0.5 to 2.0 percent is dissolved in the ceramic;
2. preparing a Cu and Ti composite solder foil: cutting Cu foil and Ti foil into pieces with area of 5.5 × 5.5mm by using diamond wire cutting machine 2 Sequentially polishing two surfaces of a Cu foil and a Ti foil by adopting sand paper of 240 meshes, 400 meshes and 600 meshes, polishing the Cu foil to about 11mg and polishing the Ti foil to about 7mg, clamping a brazing filler metal foil by using two flat surfaces, applying pressure to flatten the Cu foil and the Ti foil, putting the Cu foil and the Ti foil into alcohol, and ultrasonically cleaning for 15min in an ultrasonic cleaning machine;
3. assembling a test piece to be welded and carrying out vacuum contact reaction brazing: according to Ti 3 SiC 2 ceramic/Ti foil/Cu foil/Nb sequence, using graphite blocks to mix Ti 3 SiC 2 Compacting the ceramic, the Ti foil, the Cu foil and the Nb to obtain an assembly part to be welded; placing the assembly to be welded into a vacuum brazing furnace at 5 x 10 -2 And (3) keeping the temperature of the vacuum degree of Pa and the brazing temperature of 990 ℃ for 10min, cooling to room temperature at the cooling rate of 5 ℃/min after the brazing is finished, and taking out the test piece to finish the process.
FIG. 1 is a Cu-Ti solder of example 1 prepared by melting Ti with a Cu-Ti solder having a high Cu atomic ratio 3 SiC 2 A microstructure back scattering picture of a soldered joint after contact reaction brazing of the ceramic and the Nb; FIG. 2 is a comparative example 1 in which Ti is alloyed with a conventional Cu-Ti eutectic solder 3 SiC 2 After the ceramic is in contact reaction with Nb for brazingMicrostructure backscatter pictures of brazed joints.
As can be seen by comparing FIG. 1 with FIG. 2, the dark gray CuTi brittle compounds in the joint of FIG. 1 are obviously reduced, and the substrate phase is mainly Cu with better plasticity 4 Ti and Cu, it can be seen that the joint performance is effectively improved after the Cu-Ti solder with high Cu atomic ratio is adopted in the embodiment 1.
An electronic universal tester is used for carrying out a shearing test, and the loading speed is 0.5mm/min. The test result shows that: example 1 the room temperature shear strength of the joints obtained by the contact reaction brazing method using Cu-10Ti (wt.%) brazing filler metal reached 130MPa, whereas the room temperature shear strength of the joints obtained by the contact reaction brazing method using Cu-23Ti (wt.%) brazing filler metal in comparative example 1 reached only 70MPa under the same parameters.
Claims (10)
1. The application of the Cu-Ti solder with high Cu atomic ratio in ceramic and metal brazing is characterized in that the Cu-Ti solder with high Cu atomic ratio is Cu-10Ti solder, and the Cu-10Ti solder is used for contact reaction brazing of ceramic and metal.
2. The use of a high Cu atomic ratio Cu-Ti solder in ceramic to metal brazing as claimed in claim 1, wherein the ceramic is Ti 3 SiC 2 A ceramic.
3. Use of a high Cu atomic ratio Cu-Ti braze as claimed in claim 1 in ceramic to metal brazing, characterized in that the metal is Nb.
4. Use of a high Cu atomic ratio Cu-Ti solder as claimed in claim 1, 2 or 3 in ceramic to metal brazing, characterized in that the Cu-10Ti solder is used for Ti 3 SiC 2 The contact reaction brazing of the ceramic and the metal Nb is carried out according to the following steps:
1. ti (titanium) 3 SiC 2 Pre-welding treatment of ceramic and Nb: mixing Ti 3 SiC 2 Cutting the ceramic and Nb into predetermined sizes, and cutting Ti 3 SiC 2 To-be-welded faces of ceramic and NbPolishing and cleaning; the Ti 3 SiC 2 Al element with the mass fraction of 0.5 to 2.0 percent is dissolved in the ceramic;
2. preparing Cu-10Ti solder: cutting Cu foil and Ti foil into pieces 3 SiC 2 Polishing the Cu foil and the Ti foil according to the standard that the mass fraction of Ti in the Cu-10Ti brazing filler metal is 10%, then processing the Cu foil and the Ti foil until the surfaces are flat, and then cleaning;
3. assembling a test piece to be welded and carrying out vacuum contact reaction brazing: according to Ti 3 SiC 2 Sequentially assembling ceramic/Ti foil/Cu foil/Nb to obtain an assembly part to be welded; placing the assembly to be welded into a vacuum brazing furnace at 3 x 10 -3 Pa～5×10 -2 Keeping the temperature for 5-60 min under the vacuum degree of Pa and the brazing temperature of 950-1010 ℃, cooling to room temperature after the brazing is finished, and finishing the Ti 3 SiC 2 And (3) performing contact reaction brazing on the ceramic, the Cu-10Ti brazing filler metal and the metal Nb.
5. The use of a high Cu atomic ratio Cu-Ti solder as claimed in claim 4 in ceramic to metal brazing, wherein in step one Ti is added 3 SiC 2 And gradually polishing the surfaces to be welded of the ceramics and the Nb by adopting 240-600-mesh sand paper.
6. The use of the high Cu atomic ratio Cu-Ti solder in ceramic to metal brazing according to claim 4, wherein the cleaning process in the first step is: ti after polishing 3 SiC 2 Putting the ceramic and the Nb into a cleaning agent, and ultrasonically cleaning for 10-20 min in an ultrasonic cleaning machine; the cleaning agent is alcohol or acetone.
7. The use of a Cu-Ti solder with high Cu atomic ratio for ceramic-to-metal brazing as claimed in claim 4, wherein the thickness of the Cu foil and the Ti foil in step two is 50-500 μm.
8. The use of the Cu-Ti solder with high Cu atomic ratio in the brazing of ceramics and metals according to claim 4, wherein the polishing process in the second step is as follows: and (3) gradually polishing the two surfaces of the Cu foil and the Ti foil by using sand paper of 240-600 meshes.
9. The use of the high Cu atomic ratio Cu-Ti solder in the ceramic to metal brazing according to claim 4, wherein the cleaning process in the second step is as follows: putting the polished Cu foil and Ti foil into a cleaning agent, and ultrasonically cleaning for 10-20 min in an ultrasonic cleaning machine; the cleaning agent is alcohol or acetone.
10. The application of the Cu-Ti solder with high Cu atomic ratio in the brazing of ceramics and metals according to claim 4, characterized in that the solder in the third step is cooled to room temperature at a cooling rate of 4-6 ℃/min after the brazing is finished.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211313813.7A CN115476012B (en) | 2022-10-25 | 2022-10-25 | Application of high Cu atomic ratio Cu-Ti brazing filler metal in brazing of ceramic and metal |
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| CN202211313813.7A CN115476012B (en) | 2022-10-25 | 2022-10-25 | Application of high Cu atomic ratio Cu-Ti brazing filler metal in brazing of ceramic and metal |
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| CN115476012A true CN115476012A (en) | 2022-12-16 |
| CN115476012B CN115476012B (en) | 2023-08-01 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115991609A (en) * | 2023-01-09 | 2023-04-21 | 南京理工大学 | Ceramic-metal discharge plasma connection method |
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| GB817659A (en) * | 1955-02-28 | 1959-08-06 | Sylvania Electric Prod | Improvements in and relating to the metallizing of ceramic or cermet materials |
| US4924033A (en) * | 1988-03-04 | 1990-05-08 | Kabushiki Kaisha Toshiba | Brazing paste for bonding metal and ceramic |
| JPH02124779A (en) * | 1988-10-31 | 1990-05-14 | Tatsuo Ishikawa | Joint body of ceramic and metal |
| CN101987402A (en) * | 2010-11-30 | 2011-03-23 | 哈尔滨工业大学 | Cu-Sn-Ti solder and method for brazing Ti2AlC ceramics and Cu with same |
| DE102014115839A1 (en) * | 2014-10-30 | 2016-05-04 | Bundesrepublik Deutschland, Vertreten Durch Den Bundesminister Für Wirtschaft Und Energie, Dieser Vertreten Durch Den Präsidenten Der Bundesanstalt Für Materialforschung Und -Prüfung (Bam) | Method for applying a solder material |
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2022
- 2022-10-25 CN CN202211313813.7A patent/CN115476012B/en active Active
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| GB817659A (en) * | 1955-02-28 | 1959-08-06 | Sylvania Electric Prod | Improvements in and relating to the metallizing of ceramic or cermet materials |
| US4924033A (en) * | 1988-03-04 | 1990-05-08 | Kabushiki Kaisha Toshiba | Brazing paste for bonding metal and ceramic |
| JPH02124779A (en) * | 1988-10-31 | 1990-05-14 | Tatsuo Ishikawa | Joint body of ceramic and metal |
| CN101987402A (en) * | 2010-11-30 | 2011-03-23 | 哈尔滨工业大学 | Cu-Sn-Ti solder and method for brazing Ti2AlC ceramics and Cu with same |
| DE102014115839A1 (en) * | 2014-10-30 | 2016-05-04 | Bundesrepublik Deutschland, Vertreten Durch Den Bundesminister Für Wirtschaft Und Energie, Dieser Vertreten Durch Den Präsidenten Der Bundesanstalt Für Materialforschung Und -Prüfung (Bam) | Method for applying a solder material |
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| CN115991609A (en) * | 2023-01-09 | 2023-04-21 | 南京理工大学 | Ceramic-metal discharge plasma connection method |
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