CN115464299A - Preformed lead-free soldering lug capable of reducing soldering cavity and preparation method and application thereof - Google Patents
Preformed lead-free soldering lug capable of reducing soldering cavity and preparation method and application thereof Download PDFInfo
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- CN115464299A CN115464299A CN202111226182.0A CN202111226182A CN115464299A CN 115464299 A CN115464299 A CN 115464299A CN 202111226182 A CN202111226182 A CN 202111226182A CN 115464299 A CN115464299 A CN 115464299A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
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- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to B23K, in particular to a preformed lead-free soldering lug for reducing soldering hollow and a preparation method thereof. The soldering lug comprises the following components in percentage by weight: at least one of the following trace elements: up to 0.1wt% elemental germanium; up to 0.01wt% elemental phosphorus; the invention provides a low-void preformed lead-free soldering lug, which has better oxidation resistance, wettability and mechanical property by adding trace elements of phosphorus and germanium or a combination of phosphorus and germanium, and meanwhile, voids generated during welding are obviously reduced, so that the welding quality is improved. The invention is suitable for semiconductor packaging welding, in particular to packaging welding of an IGBT power module, and by adopting the tin-silver-copper series or tin-antimony series lead-free soldering lug, cavities generated during welding are obviously reduced, and the heat dissipation effect and the reliability of a semiconductor device are obviously improved.
Description
Technical Field
The present invention relates to B23K, and more particularly, to a preformed lead-free solder fillet with reduced solder voiding and a method for preparing the same.
Background
Tin-lead solders for electronic industry have been used for over fifty years, and various lead-free solders such as tin-silver, tin-antimony, tin-copper, tin-bismuth, tin-zinc and the like are developed in succession in countries around the world in order to reduce the pollution of lead to the environment and the influence on human health. In the using process of the tin solder, because the using temperature is higher, tin and the like are easily oxidized, CN104070299A provides the tin solder of the anti-aging solder strip consisting of Sn, bi, sb, ge, in, pb and (SnP + Ga), has good solder fluidity and anti-aging capability, and can be used for the photovoltaic solder strip.
However, the current antioxidant research is mainly to control the oxidation resistance in the solder melting process, and the main concern is surface antioxidant, but for the semiconductor device packaging welding, especially for the preformed soldering lug for a high-end IGBT power module, the packaging process is mainly performed under a reducing atmosphere, such as hydrogen or formic acid, and finally vacuum is drawn to reduce the welding hollow, so compared with the solder, the soldering lug for packaging is more concerned about the influence of the internal oxygen-containing condition and the external oxide layer thickness and growth condition on the packaging.
In addition, in the packaging and welding of semiconductor devices, such as the packaging and welding of IGBT power modules, tin-antimony and tin-silver-copper preformed lead-free tin sheets are mainly used for welding, and certain cavities are easily generated on a welding interface, so that the heat dissipation and reliability of the devices are reduced, therefore, in order to reduce the generation of cavities on the welding interface of semiconductor power devices, particularly IGBT modules, the development of a novel low-cavity preformed lead-free welding sheet becomes the direction of industrial research, and in order to improve the welding reliability, the wettability and mechanical properties of the welding sheet in the welding process are also required to be improved.
Disclosure of Invention
In order to solve the above problems, a first aspect of the present invention provides a preformed lead-free solder tab for reducing solder voids, the solder tab comprising the following components in percentage by weight:
(a) At least one of the following metal elements:
up to 8wt% elemental silver;
up to 2wt% elemental copper;
up to 15wt% antimony element;
(b) At least one of the following trace elements:
up to 0.1wt% elemental germanium;
up to 0.01wt% elemental phosphorus;
(c) The balance of tin element.
The preformed soldering lug for packaging and soldering the semiconductor device mainly comprises the following components: tin-lead pads and lead-free pads. The lead-free soldering lug mainly comprises: the invention controls the main alloy composition in the lead-free soldering lug by controlling the dosage of a component and c component in the soldering lug, promotes the improvement of mechanical strength and ductility, improves the usability in the packaging process, and has the advantages that although the reducing atmosphere can prevent further oxidation in the packaging process, the oxidation layer and the internal oxygen content of the soldering lug can also influence the packaging.
As a preferable technical scheme of the invention, the soldering lug comprises the following components in percentage by weight:
(a) At least one of the following metal elements:
up to 5wt% elemental silver;
up to 1wt% elemental copper;
up to 13wt% antimony element;
(b) At least one of the following trace elements:
up to 0.05wt% elemental germanium;
up to 0.008wt% elemental phosphorus;
(c) The balance of tin element.
As a preferable technical scheme of the invention, the soldering lug comprises the following components in percentage by weight:
(a) At least one of the following metal elements:
0.3 to 5wt% of elemental silver, and there may be mentioned, for example, 0.3wt%, 0.5wt%, 0.7wt%, 1wt%, 1.2wt%, 1.5wt%, 1.7wt%, 2wt%, 2.2wt%, 2.5wt%, 2.7wt%, 3wt%, 3.2wt%, 3.5wt%, 3.7wt%, 4wt%, 4.2wt%, 4.5wt%, 4.7wt%, 5wt%;
0 to 1% by weight of copper, and there may be mentioned, for example, 0.1%, 0.2%, 0.3%, 0.4%, 0.5%, 0.6%, 0.7%, 0.8%, 0.9%, 1%;
(b) At least one of the following trace elements:
0.001 to 0.05wt% of germanium element, which may be exemplified by 0.001wt%, 0.005wt%, 0.01wt%, 0.015wt%, 0.02wt%, 0.025wt%, 0.03wt%, 0.035wt%, 0.04wt%, 0.045wt%, 0.05wt%;
0.0005 to 0.008wt% of phosphorus, which may be exemplified by 0.0005wt%, 0.0015wt%, 0.003wt%, 0.006wt%;0.008wt%
(c) The balance of tin element.
As a preferable technical scheme of the invention, the soldering lug comprises the following components in percentage by weight:
(a) At least one of the following metal elements:
0.3-5 wt% of silver element;
0-1 wt% of copper element;
(b) At least one of the following trace elements:
0.001-0.05 wt% of germanium element;
0.0005 to 0.008wt% of phosphorus element;
(c) The balance of tin element.
As a preferable technical scheme of the invention, the soldering lug comprises the following components in percentage by weight:
(a) At least one of the following metal elements:
3-13 wt% of antimony element;
(b) At least one of the following trace elements:
0.001-0.05 wt% of germanium element;
0.0005 to 0.008wt% of phosphorus element;
(c) The balance of tin element.
As a preferred technical scheme of the invention, the soldering lug comprises the following components in percentage by weight:
(a) At least one of the following metal elements:
3 to 13% by weight of antimony, and there may be mentioned, for example, 3%, 3.5%, 4%, 4.5%, 5%, 5.5%, 6%, 6.5%, 7%, 7.5%, 8%, 8.5%, 9%, 9.5%, 10%, 10.5%, 11%, 11.5%, 13%;
(b) At least one of the following trace elements:
0.001 to 0.05% by weight of elemental germanium, which may be exemplified by 0.001%, 0.005%, 0.01%, 0.015%, 0.02%, 0.025%, 0.03%, 0.035%, 0.04%, 0.05%;
0.0005 to 0.008wt% of phosphorus, which may be exemplified by 0.0005wt%, 0.0015wt%, 0.003wt%, 0.006wt%;0.008wt%
(c) The balance of tin element.
As a preferable technical scheme of the invention, the soldering lug comprises the following components in percentage by weight:
(a) At least one of the following metal elements:
3-13 wt% of antimony element;
(b) At least one of the following trace elements:
0.001-0.05 wt% of germanium element;
0.0005 to 0.008wt% of phosphorus element;
(c) The balance of tin element.
The inventor finds that by adding 0.0005-0.008% of phosphorus into a tin-silver-copper, tin-silver or tin-antimony soldering lug, the characteristic that phosphorus is easier to combine with oxygen than metal elements is utilized, on one hand, oxygen in the lead-free alloy can be rapidly removed, the microconstituents in the alloy are easier to be uniform, on the other hand, an extremely dense oxide layer can be formed on the surface of the lead-free alloy, and further oxidation of the lead-free alloy is prevented, so that the lead-free alloy can play a good role in oxygen removal and oxidation resistance, but the stability is poor.
The inventor finds that 0.001-0.05% of germanium is added in the tin-silver-copper, tin-silver or tin-antimony soldering lug, and by utilizing the characteristic that the germanium is easier to combine with oxygen than tin, silver and antimony, the germanium is similar to phosphorus, on one hand, oxygen in the lead-free alloy can be rapidly removed, so that microscopic components in the alloy are easier to be uniform, on the other hand, a very compact oxide layer can be formed on the surface of the lead-free alloy, further oxidation of the lead-free alloy is prevented, good oxygen removal and oxidation resistance effects are achieved, and meanwhile, the germanium has good stability.
The inventor further finds that after phosphorus and germanium are simultaneously added into the tin-silver-copper, tin-silver or tin-antimony soldering lug according to a certain proportion, the two elements can play a good synergistic role, so that the oxygen removal and oxidation resistance capabilities are further enhanced.
In addition, the inventor finds that when phosphorus, germanium and the like are added, compared with trace elements such as gallium and the like, the wettability of a soldering lug is improved, the reduction of cavities is promoted, and the stability of mechanical properties is not influenced, which is probably because in the smelting process, phosphorus, germanium and the like remove internal oxygen, meanwhile, the internal microconstituents of the alloy are improved, the uniformity of the microconstituents and the degree of alloying are improved, the wettability is improved, meanwhile, the thin oxide layer is obtained while the surface compact oxide layer is promoted by controlling the content of phosphorus and germanium components, the surface oxygen content and the internal oxygen content are reduced, so that the generation of cavities in a welding interface is reduced, the uniform microconstitution also enables the solder to have better fluidity and wettability, and when vacuum is extracted in the final stage of welding, more gas is discharged, so that the number of cavities is further reduced. The thin and dense oxide layer can also hinder oxide layer growth, thereby improving storage stability.
The composition of the tab further includes unavoidable impurities such as oxygen and the like, and is not particularly limited.
As a preferable technical scheme of the invention, the preparation raw materials of the soldering lug comprise:
the component A comprises: comprises at least one of the following preparation raw materials; the component A can adopt pure metal or metal alloy, and can achieve a relatively uniform soldering lug structure, wherein when the metal alloy is adopted as the intermediate alloy, the microstructure uniformity can be further improved compared with the pure metal, and in addition, the component A alloy can be prepared by a melting and casting method well known in the field, and the composition and the preparation method of metal elements in the alloy are not specifically limited:
silver or tin-silver alloy; in one embodiment, the method of making a tin-silver alloy of the present invention comprises: heating tin to 1000-1100 deg.c in medium frequency induction furnace, adding silver, and casting to form Sn-Ag alloy after the tin is completely molten. In the tin-silver alloy, the weight percentage of silver is 10 to 50wt%, and may be, for example, 10wt%, 15wt%, 20wt%, 30wt%, 35wt%, 40wt%, 45wt%, 50wt%.
Copper or tin-copper alloys; in one embodiment, the method of making a tin-copper alloy of the present invention comprises: heating tin to 1100-1200 deg.c in medium frequency induction furnace, adding copper and casting to form Sn-Cu alloy after complete melting. In the tin-copper alloy, the weight percentage of copper is 5 to 20wt%, and 5wt%, 7wt%, 10wt%, 12wt%, 15wt%, 17wt%, 20wt% may be mentioned.
Antimony or tin-antimony alloys; in one embodiment, the method of making a tin-antimony alloy of the present invention comprises: heating tin to 660-720 ℃ in a medium-frequency induction furnace, adding antimony, and casting the tin-antimony alloy after the tin is completely melted. In the tin-antimony alloy, the weight percentage of antimony is 30-60 wt%, and 30wt%, 40wt%, 45wt%, 50wt%, 55wt% and 60wt% can be enumerated.
And the component B comprises: comprises at least one of the following preparation raw materials: the inventors found that the dispersion of trace elements, especially phosphorus and other metals with poor compatibility, can be promoted by adding the trace elements of the present invention to tin or other raw materials by way of alloying, and that the dispersion of germanium in tin or other metals is also promoted by way of alloying because of the higher melting point of germanium, the microstructure enhancement and the formation of dense surface oxide layers are promoted, and that the content control is also facilitated by using the trace element alloy as an intermediate alloy because the trace elements of the present invention are added in a small amount and the content is not controllable. The B-component trace element alloy can be prepared by a melting and casting method well known in the field, and the composition and the preparation method of elements in the alloy are not particularly limited:
a tin-phosphorus alloy; in one embodiment, the method of making a tin-phosphorus alloy of the present invention comprises: mixing tin and phosphorus, covering the mixture with protective molten salt, putting the mixture into a sealing box, then putting the sealing box into a muffle furnace, heating the mixture to 750-850 ℃, and casting and cooling the mixture to obtain the tin-phosphorus alloy after the mixture is completely melted. In the tin-phosphorus alloy, the weight percentage of phosphorus is 1 to 10wt%, and 1wt%, 2wt%, 3wt%, 4wt%, 5wt%, 6wt%, 7wt%, 8wt%, 9wt%, 10wt% may be mentioned.
A tin-germanium alloy; in one embodiment, the method of making a tin-germanium alloy of the present invention comprises: heating tin to 960-1050 ℃ in a medium frequency induction furnace, adding germanium, and casting the tin-germanium alloy after the tin is completely melted. In the tin-germanium alloy, the weight percentage of germanium is 0.5 to 3wt%, and may be, for example, 0.5wt%, 0.7wt%, 1wt%, 1.2wt%, 1.5wt%, 1.7wt%, 2wt%, 2.2wt%, 2.5wt%, 2.7wt%, 3wt%.
And C, component C: including tin. The purity of the raw materials prepared by the method is higher than 99.95wt%.
In a second aspect, the present invention provides a method for preparing a preformed lead-free solder tab with reduced solder voids, comprising: and melting the component C, sequentially adding the component B and the component C, melting, casting and rolling to obtain the lead-free soldering lug.
As a preferable technical solution of the present invention, the method for preparing the lead-free solder tab comprises: heating the component C to 380-450 ℃ for melting, sequentially adding the component B and the component C for melting, cooling to 300-350 ℃ after all the components are melted, casting and rolling to obtain the lead-free soldering lug.
As a preferable technical solution of the present invention, the method for preparing the lead-free solder tab comprises: heating the component C to 380-450 ℃ for melting, sequentially adding the component B and the component C for melting, cooling to 300-350 ℃ after the components are completely melted, casting, rolling, cleaning, blanking or cutting into preformed lead-free soldering pieces.
The invention provides an application of the preformed lead-free soldering lug with the reduced soldering hollow, which is used for packaging and soldering a semiconductor device, in particular for packaging and soldering an IGBT power module.
Compared with the prior art, the invention has the following beneficial effects:
(1) The invention provides a low-void preformed lead-free soldering lug, which has better oxidation resistance, wettability and mechanical property by adding trace elements of phosphorus and germanium or a combination of the phosphorus and the germanium, and simultaneously, voids generated during welding are obviously reduced, so that the welding quality is improved.
(2) According to the invention, by adding trace phosphorus and germanium, the thickness of the oxide film on the surface of the obtained soldering lug is obviously reduced while the oxide film is compact, the oxygen content in the obtained soldering lug is low, the soldering lug has a uniform microstructure, the growth of the oxide film can be effectively reduced, and the improvement of the service cycle is promoted.
(3) In addition, the alloy containing trace elements is added as an intermediate alloy to participate in smelting, so that the dispersion of phosphorus, germanium and the like can be further promoted, the further removal of internal oxygen is promoted, the thickness and the oxygen content of a surface oxidation film are reduced, the improvement of wetting and oxygen resistance can be further promoted, and welding cavities are reduced.
(4) The invention is suitable for the packaging and welding of semiconductors, in particular to the packaging and welding of IGBT power modules, and by adopting the tin-silver-copper series or tin-antimony series lead-free soldering lug, the cavities generated during welding are obviously reduced, and the heat dissipation effect and the reliability of semiconductor devices are obviously improved.
Detailed Description
Examples
Examples 1-10 and comparative examples 1-5 provide a preformed lead-free solder sheet having the composition, in weight percent, as shown in table 1:
TABLE 1
Examples 1 to 10 and comparative examples 1 to 5 provide a preformed lead-free solder sheet prepared from the raw materials shown in table 2:
TABLE 2
The preparation method of the tin-silver alloy in examples 1 to 6 and comparative examples 1 to 3 includes: and heating tin to 1050 ℃ in a medium-frequency induction furnace, adding silver, and casting the tin-silver alloy after the tin is completely melted.
The method for preparing the tin-copper alloy in examples 1 to 4 and comparative examples 1 to 2 includes: heating tin to 1150 deg.c in medium frequency induction furnace, adding copper, and casting to form Sn-Cu alloy after the tin is completely molten.
The preparation method of the tin-antimony alloy in examples 7 to 10 and comparative examples 4 to 5 includes: heating tin to 700 ℃ in a medium-frequency induction furnace, adding antimony, and casting the tin-antimony alloy after the tin is completely melted.
The preparation method of the tin-phosphorus alloy in the embodiments 1, 2, 4, 6-9 comprises the following steps: mixing tin and phosphorus, covering the mixture with protective molten salt, putting the mixture into a sealing box, then putting the box into a muffle furnace, heating the box to 800 ℃, and casting and cooling the box to form the tin-phosphorus alloy after the tin and the phosphorus are completely molten.
The preparation method of the tin-germanium alloy in the embodiments 2 to 7, 9 and 10 includes: heating tin to 1000 ℃ in a medium-frequency induction furnace, adding germanium, and casting the tin-germanium alloy after the tin is completely melted.
Examples 1 to 10 and comparative examples 1 to 5 provide a method for preparing a preformed lead-free solder tab comprising: heating the component C to 400 ℃ for melting, sequentially adding the component B and the component C for melting, cooling to 300-350 ℃ after the components are completely melted, casting, rolling, cleaning, blanking or cutting into preformed lead-free soldering lugs.
Evaluation of Performance
1. Melting point: the melting points of the lead-free solder chips provided in the examples and comparative examples were tested and the results are shown in Table 3.
2. Mechanical properties: the lead-free solder sheets provided in examples and comparative examples were tested for tensile strength and elongation according to GBT 228.1-2010, and the results are shown in table 3.
3. Oxidation resistance: the lead-free solder pieces provided in examples and comparative examples were left to stand at a temperature of 30 ℃ higher than the melting point for 1min, and the color change of the solder pieces was observed, wherein the solder pieces first became dark and then yellow and finally became darker and gray as oxidation increased, and the oxidation resistance was evaluated by the color change, wherein the solder pieces were set to be bright and not dark, the solder pieces slightly turned dark was set to be good, the solder pieces turned yellow was set to be poor, and the solder pieces turned gray was set to be poor, as a result, see table 3.
4. Wettability: the lead-free solder fillets provided in the examples and comparative examples were coated with flux, the side with flux was placed on an encapsulating board, and the heat was maintained at a temperature of 30 ℃ above the melting point for 30 seconds according to GBT 11364-2008, and spreading factors were tested, wherein the spreading factor was preferably greater than 85%, more preferably greater than 80%, less than or equal to 85%, generally less than or equal to 80%, greater than 77%, less preferably less than or equal to 77%, greater than or equal to 75%, and less than or equal to 75%, and the results are shown in table 3.
5. Void ratio: the lead-free solder pads provided in examples and comparative examples were soldered to a package board under formic acid in a reducing atmosphere, evacuated at the final stage of soldering, and tested for pad voidage according to X-ray, where the low was less than 1%, the low was 1 to 2% (excluding 2%), and the high was 2% or more, and the results are shown in table 3.
6. Thickness of the surface oxide layer: the thickness of the surface oxide layer of the lead-free solder sheet provided in the example and the comparative example was measured, and the thickness of the lead-free solder sheet immediately after the preparation and the thickness of the lead-free solder sheet after the room temperature storage for two weeks were measured, respectively, and it was found that the thickness of the surface oxide layer of the lead-free solder sheet provided in the example immediately after the preparation was 2 to 3nm (excluding 3 nm) and increased to 3 to 4nm after the storage for two weeks, while the thickness of the surface oxide layer of the lead-free solder sheet provided in the comparative example immediately after the preparation was 3 to 5nm and increased to 6 to 8nm after the storage for two weeks.
Table 3 performance characterization test
According to test results, the preformed lead-free soldering lug provided by the invention has high mechanical property, wettability and oxidation resistance, can reduce soldering cavities when used for packaging semiconductors, and is suitable for packaging semiconductors, especially high-end IGBT power modules.
Claims (10)
1. A preformed lead-free solder tab for reducing solder voiding, said solder tab comprising the following components in weight percent:
(a) At least one of the following metal elements:
up to 8wt% elemental silver;
up to 2wt% elemental copper;
up to 15wt% elemental antimony;
(b) At least one of the following trace elements:
up to 0.1wt% elemental germanium;
up to 0.01wt% elemental phosphorus;
(c) The balance of tin element.
2. The preformed lead-free solder tab with reduced solder voiding of claim 1, wherein the solder tab comprises the following components in weight percent:
(a) At least one of the following metal elements:
up to 5wt% elemental silver;
up to 1wt% elemental copper;
up to 13wt% elemental antimony;
(b) At least one of the following trace elements:
up to 0.05wt% elemental germanium;
up to 0.008wt% elemental phosphorus;
(c) The balance of tin element.
3. The solder void reducing preformed lead-free solder tab of claim 2, wherein the solder tab comprises the following components in weight percent:
(a) At least one of the following metal elements:
0.3-5 wt% of silver element;
0-1 wt% of copper element;
(b) At least one of the following trace elements:
0.001-0.05 wt% of germanium element;
0.0005 to 0.008wt% of phosphorus element;
(c) The balance of tin element.
4. The solder void reducing preformed lead-free solder tab of claim 2, wherein the solder tab comprises the following components in weight percent:
(a) At least one of the following metal elements:
3-13 wt% of antimony element;
(b) At least one of the following trace elements:
0.001-0.05 wt% of germanium element;
0.0005 to 0.008wt% of phosphorus element;
(c) The balance of tin element.
5. The preformed lead-free solder tab with reduced solder voiding of any one of claims 1 to 4 wherein the solder tab is prepared from raw materials comprising:
the component A comprises: comprises at least one of the following preparation raw materials:
silver or tin-silver alloys;
copper or tin-copper alloys;
antimony or tin-antimony alloys;
and B component: comprises at least one of the following raw materials:
a tin-phosphorus alloy;
a tin germanium alloy.
And C, component C: including tin.
6. The preformed lead-free solder fillet reducing solder voiding as recited in claim 5, wherein the mass percentage of phosphorus in said tin-phosphorus alloy is in the range of 2 to 10wt%.
7. The preformed lead-free solder fillet with reduced solder void as in claim 5, wherein the mass percent of germanium in the tin-germanium alloy is 0.1-5 wt%.
8. A method for preparing a preformed lead-free solder fillet with reduced solder voiding according to any one of claims 5 to 7, comprising: and melting the component C, sequentially adding the component B and the component C, smelting, casting and rolling to obtain the lead-free soldering lug.
9. The method of making a solder void reducing preformed lead-free solder tab of claim 8, wherein the method of making the lead-free solder tab comprises: and heating the component C to 380-450 ℃ for melting, sequentially adding the component B and the component C for melting, cooling to 300-350 ℃, casting and rolling to obtain the lead-free soldering lug.
10. Use of a solder void reducing preformed lead-free solder tab according to any of claims 1 to 7 for package soldering of semiconductor devices.
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1195592A (en) * | 1997-02-15 | 1998-10-14 | 三星电子株式会社 | Leadless alloy for soldering flux |
| CN1400081A (en) * | 2001-06-28 | 2003-03-05 | 千住金属工业株式会社 | Lead-free welding flux alloy |
| CN1613597A (en) * | 2003-11-07 | 2005-05-11 | 中国科学院金属研究所 | Tin and silver co-crystal solder without lead against oxidation |
| WO2005089999A1 (en) * | 2004-03-19 | 2005-09-29 | Senju Metal Industry Co., Ltd | Lead-free solder ball |
| JP2008093701A (en) * | 2006-10-12 | 2008-04-24 | Fuji Electric Holdings Co Ltd | Solder alloy |
| CN101342642A (en) * | 2008-08-25 | 2009-01-14 | 杨嘉骥 | Oxidation resistant low-silver lead-free solder |
| CN107177752A (en) * | 2017-06-05 | 2017-09-19 | 雅拓莱焊接科技（惠州）有限公司 | A kind of inexpensive dystectic leadless welding alloy and preparation method thereof |
| JP2019058950A (en) * | 2017-09-27 | 2019-04-18 | 株式会社タムラ製作所 | Lead-free solder alloy, electronic circuit board, and electronic control device |
-
2021
- 2021-10-21 CN CN202111226182.0A patent/CN115464299A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1195592A (en) * | 1997-02-15 | 1998-10-14 | 三星电子株式会社 | Leadless alloy for soldering flux |
| CN1400081A (en) * | 2001-06-28 | 2003-03-05 | 千住金属工业株式会社 | Lead-free welding flux alloy |
| CN1613597A (en) * | 2003-11-07 | 2005-05-11 | 中国科学院金属研究所 | Tin and silver co-crystal solder without lead against oxidation |
| WO2005089999A1 (en) * | 2004-03-19 | 2005-09-29 | Senju Metal Industry Co., Ltd | Lead-free solder ball |
| JP2008093701A (en) * | 2006-10-12 | 2008-04-24 | Fuji Electric Holdings Co Ltd | Solder alloy |
| CN101342642A (en) * | 2008-08-25 | 2009-01-14 | 杨嘉骥 | Oxidation resistant low-silver lead-free solder |
| CN107177752A (en) * | 2017-06-05 | 2017-09-19 | 雅拓莱焊接科技（惠州）有限公司 | A kind of inexpensive dystectic leadless welding alloy and preparation method thereof |
| JP2019058950A (en) * | 2017-09-27 | 2019-04-18 | 株式会社タムラ製作所 | Lead-free solder alloy, electronic circuit board, and electronic control device |
Non-Patent Citations (1)
| Title |
|---|
| 陈建勋;赵兴科;刘大勇;黄继华;邹旭晨;: "电子组装用SnAgCu系无铅钎料的研究进展", 材料工程, no. 09 * |
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