CN111940945A - Sn-Zn-In-Ga lead-free solder and preparation method thereof - Google Patents

Sn-Zn-In-Ga lead-free solder and preparation method thereof Download PDF

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Publication number
CN111940945A
CN111940945A CN202010702484.XA CN202010702484A CN111940945A CN 111940945 A CN111940945 A CN 111940945A CN 202010702484 A CN202010702484 A CN 202010702484A CN 111940945 A CN111940945 A CN 111940945A
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alloy
solder
lead
free solder
melting
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徐冬霞
曹福磊
褚亚东
杨毅博
任鹏凯
和平安
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Henan University of Technology
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Henan University of Technology
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/40—Making wire or rods for soldering or welding

Abstract

The invention provides a lead-free solder for microelectronic industry and a preparation method thereof, wherein the lead-free solder comprises 7.0-10.0 wt% of Zn, 0.05-5.0 wt% of In, 0.05-2.0 wt% of Ga and the balance of Sn, and the content of inevitable impurities is less than 0.2%. The solder has the advantages of less components, low melting temperature, excellent wettability, oxidation resistance and mechanical property, can form good welding joints with various semiconductor materials with different properties in the microelectronic industry, and is suitable for popularization and application.

Description

Sn-Zn-In-Ga lead-free solder and preparation method thereof
Technical Field
The invention relates to a lead-free solder, In particular to a novel Sn-Zn-In-Ga quaternary lead-free solder alloy and a preparation method thereof, belonging to the technical field of welding materials.
Background
For a long time, Sn-Pb solder is widely applied to connection and assembly of electronic products due to the advantages of low melting point, low cost, good wettability and the like, and plays a dominant role in electronic soldering connection materials. However, in recent years, with the deep understanding of the harmfulness of lead and its alloys and the increasing awareness of environmental protection, countries and related organizations in the world have legislation to limit the application of lead and its alloys in electronic packaging, and therefore, the development of a novel lead-free solder instead of the conventional Sn-Pb solder is urgent.
At present, lead-free solders developed at home and abroad mainly include Sn-Ag series, Sn-Cu series, Sn-Bi series, Sn-Ag-Cu series, Sn-Zn series, etc., but these alloys have more or less defects. The most widely used alloys of Sn99Ag0.3Cu0.7, Sn96.5Ag3.0Cu0.5 and Sn99.3Cu0.7 have melting points about 40 ℃ higher than that of the traditional Sn63Pb37 solder, and the existing process parameters and equipment need to be upgraded or purchased again during application, so that the production cost is increased. The microstructure of the Sn42Bi58 eutectic solder alloy consists of a coarse Bi-rich phase and a beta-Sn matrix, wherein the Bi-rich phase is a brittle phase, has poor thermal conductivity and is easy to coarsen in the service process, so the use of the Sn-Bi solder alloy is greatly limited in the packaging field with higher welding reliability requirements. Compared with other alloys, the Sn-Zn solder has wide raw material sources and low cost, the melting point of the Sn91Zn9 eutectic is similar to that of the Sn63Pb37 alloy, and the mechanical property is excellent, so that the Sn-Zn solder is considered to be the most possible substitute for the traditional Sn-Pb solder. However, Zn is easy to oxidize, which has adverse effect on the wettability of the solder and limits the application of Sn-Zn solder.
Disclosure of Invention
The invention aims to provide the Sn-Zn-In-Ga quaternary lead-free solder with low melting point, good comprehensive performances such as spreadability, oxidation resistance, mechanical property and the like.
The technical scheme adopted by the invention is specifically as follows:
the Sn-Zn-In-Ga lead-free solder comprises 7.0-10.0 wt% of Zn, 0.05-5.0 wt% of In, 0.05-2.0 wt% of Ga and the balance of Sn, wherein the content of unavoidable impurities is less than 0.2%.
Further Zn is 9.0% by weight of the solder.
The further In accounts for 0.5-4.0% of the solder by weight percent.
Further, the weight percentage of Ga in the solder is 0.1-1.5%.
The preparation method of the Sn-Zn-In-Ga lead-free solder comprises the following steps of,
(1) weighing raw materials Sn and Zn according to the weight ratio of 1:1, placing the raw materials in a crucible of a vacuum induction melting furnace, vacuumizing, and introducing argon for melting, wherein the melting temperature is 550-650 ℃, the melting time is 30-40 min, and the vacuum degree is 10-4Pa, preparing to obtain intermediate alloy Sn-Zn, repeatedly smelting the alloy for 3 times, pouring the alloy into a metal mold after remelting for the last time, and cooling and solidifying in an argon atmosphere;
(2) weighing raw materials Sn and In according to the weight ratio of 1:1, placing the raw materials In a crucible of a vacuum induction melting furnace, vacuumizing, and introducing argon for melting, wherein the melting temperature is 450-550 ℃, the melting time is 30-40 min, and the vacuum degree is 10-4Pa, preparing to obtain an intermediate alloy Sn-In, repeatedly smelting the alloy for 3 times, remelting the alloy for the last time, pouring the alloy into a metal mold, and cooling and solidifying the alloy In an argon atmosphere;
(3) weighing raw materials Sn and Ga according to the weight ratio of 1:1, placing the raw materials in a crucible of a vacuum induction melting furnace, vacuumizing, and introducing argon for melting, wherein the melting temperature is 450-550 ℃, the melting time is 30-40 min, and the vacuum degree is 10-4Pa, preparing to obtain intermediate alloy Sn-Ga, repeatedly smelting the alloy for 3 times, pouring the alloy into a metal mold after remelting for the last time, and cooling and solidifying in an argon atmosphere;
(4) the Sn-Zn, Sn-In and Sn-Ga alloy prepared by the method are mixed according to the weight percentage of Zn to solder of 7.0-10.0%, the weight percentage of In to solder of 0.05-5.0%, the weight percentage of Ga to solder of 0.05-2.0% and the balance Sn, and are smelted In a vacuum induction smelting furnace at the smelting temperature of 450-550 ℃, the smelting time of 30-40 min and the vacuum degree of 10-4Pa, and the content of inevitable impurities In the Sn-Zn-In-Ga lead-free solder is less than 0.2 percent.
According to the invention, 0.05% -5.0% of In is added into the Sn-Zn solder, and the melting point of the Sn91Zn9 alloy is 198 ℃, which is still 15 ℃ higher than that (183 ℃) of the traditional Sn63Pb37 solder, so that the problems of equipment parameter change and the like still exist In practical application. The addition of In can reduce the melting point of the solder alloy, and simultaneously can slow down the oxidation of Zn and enhance the oxidation resistance of the Sn-Zn alloy. However, In the microstructure, due to the addition of In, the solder forms irregular long-strip acicular dendrites, the mechanical property of the solder is reduced, and the bonding strength of a welding spot is reduced, so that the element Ga with a certain percentage content is also added In the invention.
According to the invention, 0.05% -2.0% of Ga is added into Sn-Zn solder. Because the chemical property of Zn in the Sn-Zn alloy is more active, the Zn is easy to oxidize in the alloy smelting and brazing processes, so that the wettability of the solder is reduced, and the solder cannot be well spread. Ga is taken as a surface active element, and is enriched on the surface when being added into Sn-Zn solder to form a layer of compact protective film, so that the contact between solder alloy and the surrounding air can be effectively prevented, the oxidation of the solder alloy is slowed down, and the wettability of the solder is improved. In addition, proper amount of Ga is added into the solder, so that the growth of long-strip needle-shaped crystals can be inhibited, and the mechanical property of the solder can be improved.
The Sn-Zn-based lead-free solder alloy has the advantages that the melting point is not greatly different from that of the traditional Sn63Pb37 solder, and meanwhile, the Sn-Zn-based lead-free solder alloy has excellent wetting property, oxidation resistance and mechanical property. Compared with the traditional lead-free solder, the solder does not contain noble metal Ag and has low cost.
The invention adopts the vacuum induction melting furnace to prepare the solder, replaces the interference of elements such as Na, K and the like on the solder alloy when the solder is melted by adopting protective salt in the prior art, reduces the influence factors, simultaneously adopts the inert gas atmosphere protection to reduce the burning loss rate of the solder alloy during melting, and also avoids the introduction of impurities.
Drawings
FIG. 1 is a microstructure of a Sn-Zn-In lead-free solder alloy to which Ga is not added.
FIG. 2 is a microstructure of a Sn-Zn-In-Ga quaternary lead-free solder alloy with 0.3% Ga added.
FIG. 3 is a microstructure of a Sn-Zn-In-Ga quaternary lead-free solder alloy with 0.5% Ga added.
FIG. 4 is a microstructure of a Sn-Zn-In-Ga quaternary lead-free solder alloy with 0.7% Ga added.
FIG. 5 is a microstructure of a Sn-Zn-In-Ga quaternary lead-free solder alloy with 1.0% Ga added.
Detailed Description
The technical solution of the present invention is further described in detail with reference to specific embodiments. The present invention is not limited to these examples.
Example 1
An Sn-Zn-In-Ga lead-free solder is composed of the following components In percentage by weight: 7.0% of Zn, 0.5% of In, 1.0% of Ga, and the balance of Sn, and also contains unavoidable impurities.
The preparation method of the Sn-Zn-In-Ga lead-free solder alloy comprises the following steps:
(1) weighing raw materials Sn and Zn according to the weight ratio of 1:1, placing the raw materials in a crucible of a vacuum induction melting furnace, vacuumizing, and introducing argon for melting, wherein the melting temperature is 550-650 ℃, the melting time is 30-40 min, and the vacuum degree is 10-4Pa, preparing to obtain intermediate alloy Sn-Zn, repeatedly smelting the alloy for 3 times, pouring the alloy into a metal mold after remelting for the last time, and cooling and solidifying in an argon atmosphere;
(2) weighing raw materials Sn and In according to the weight ratio of 1:1, placing the raw materials In a crucible of a vacuum induction melting furnace, vacuumizing, and introducing argon for melting, wherein the melting temperature is 450-550 ℃, the melting time is 30-40 min, and the vacuum degree is 10-4Pa, preparing to obtain an intermediate alloy Sn-In, repeatedly smelting the alloy for 3 times, remelting the alloy for the last time, pouring the alloy into a metal mold, and cooling and solidifying the alloy In an argon atmosphere;
(3) weighing raw materials Sn and Ga according to the weight ratio of 1:1, placing the raw materials in a crucible of a vacuum induction melting furnace, vacuumizing, and introducing argon for melting, wherein the melting temperature is 450-550 ℃, the melting time is 30-40 min, and the vacuum degree is 10-4Pa, preparing to obtain intermediate alloy Sn-Ga, repeatedly smelting the alloy for 3 times, pouring the alloy into a metal mold after remelting for the last time, and cooling and solidifying in an argon atmosphere;
(4) the Sn-Zn, Sn-In and Sn-Ga alloy prepared by the method are 7.0 percent of Zn In the weight of the solder and 7.0 percent of In the weight of the solderThe percentage is 0.5 percent, Ga accounts for 1.0 percent of the weight of the solder, and the rest is Sn, and the mixture is smelted in a vacuum induction smelting furnace, wherein the smelting temperature is 450-550 ℃, the smelting time is 30-40 min, and the vacuum degree is 10-4Pa, and the content of inevitable impurities In the Sn-Zn-In-Ga lead-free solder is less than 0.2 percent.
Example 2
An Sn-Zn-In-Ga lead-free solder is composed of the following components In percentage by weight: 7.0% of Zn, 1.0% of In, 0.5% of Ga, and the balance of Sn, and also contains unavoidable impurities.
The preparation method of the lead-free solder alloy of this embodiment is the same as that of embodiment 1, except that the weight percentage of the Sn-Zn-In-Ga lead-free solder alloy is added according to the proportion In this embodiment, and is not described herein again.
Example 3
An Sn-Zn-In-Ga lead-free solder is composed of the following components In percentage by weight: 7.0% of Zn, 0.5% of In, 2.0% of Ga, and the balance of Sn, and also contains unavoidable impurities.
The preparation method of the lead-free solder alloy of this embodiment is the same as that of embodiment 1, except that the weight percentage of the Sn-Zn-In-Ga lead-free solder alloy is added according to the proportion In this embodiment, and is not described herein again.
Example 4
An Sn-Zn-In-Ga lead-free solder is composed of the following components In percentage by weight: 8.0% of Zn, 0.5% of In, 0.05% of Ga, and the balance of Sn, and also contains inevitable impurities.
The preparation method of the lead-free solder alloy of this embodiment is the same as that of embodiment 1, except that the weight percentage of the Sn-Zn-In-Ga lead-free solder alloy is added according to the proportion In this embodiment, and is not described herein again.
Example 5
An Sn-Zn-In-Ga lead-free solder is composed of the following components In percentage by weight: 8.0% Zn, 1.5% In, 1.5% Ga, and the balance Sn, and further includes unavoidable impurities.
The preparation method of the lead-free solder alloy of this embodiment is the same as that of embodiment 1, except that the weight percentage of the Sn-Zn-In-Ga lead-free solder alloy is added according to the proportion In this embodiment, and is not described herein again.
Example 6
An Sn-Zn-In-Ga lead-free solder is composed of the following components In percentage by weight: 8.0% Zn, 0.2% In, 2.0% Ga, and the balance Sn, and further includes unavoidable impurities.
The preparation method of the lead-free solder alloy of this embodiment is the same as that of embodiment 1, except that the weight percentage of the Sn-Zn-In-Ga lead-free solder alloy is added according to the proportion In this embodiment, and is not described herein again.
Example 7
An Sn-Zn-In-Ga lead-free solder is composed of the following components In percentage by weight: 9.0% Zn, 0.05% In, 0.5% Ga, and the balance Sn, and further includes unavoidable impurities.
The preparation method of the lead-free solder alloy of this embodiment is the same as that of embodiment 1, except that the weight percentage of the Sn-Zn-In-Ga lead-free solder alloy is added according to the proportion In this embodiment, and is not described herein again.
Example 8
An Sn-Zn-In-Ga lead-free solder is composed of the following components In percentage by weight: 9.0% Zn, 1.0% In, 0.1% Ga, and the balance Sn, and further includes unavoidable impurities.
The preparation method of the lead-free solder alloy of this embodiment is the same as that of embodiment 1, except that the weight percentage of the Sn-Zn-In-Ga lead-free solder alloy is added according to the proportion In this embodiment, and is not described herein again.
Example 9
An Sn-Zn-In-Ga lead-free solder is composed of the following components In percentage by weight: 9.0% Zn, 5.0% In, 0.1% Ga, and the balance Sn, and further includes unavoidable impurities.
The preparation method of the lead-free solder alloy of this embodiment is the same as that of embodiment 1, except that the weight percentage of the Sn-Zn-In-Ga lead-free solder alloy is added according to the proportion In this embodiment, and is not described herein again.
Example 10
An Sn-Zn-In-Ga lead-free solder is composed of the following components In percentage by weight: 10.0% Zn, 2.0% In, 0.5% Ga, and the balance Sn, and further includes unavoidable impurities.
The preparation method of the lead-free solder alloy of this embodiment is the same as that of embodiment 1, except that the weight percentage of the Sn-Zn-In-Ga lead-free solder alloy is added according to the proportion In this embodiment, and is not described herein again.
Example 11
An Sn-Zn-In-Ga lead-free solder is composed of the following components In percentage by weight: 10.0% of Zn, 0.1% of In, 1.5% of Ga, and the balance of Sn, and also contains inevitable impurities.
The preparation method of the lead-free solder alloy of this embodiment is the same as that of embodiment 1, except that the weight percentage of the Sn-Zn-In-Ga lead-free solder alloy is added according to the proportion In this embodiment, and is not described herein again.
Example 12
An Sn-Zn-In-Ga lead-free solder is composed of the following components In percentage by weight: 10.0% Zn, 2.5% In, 1.0% Ga, and the balance Sn, and further includes unavoidable impurities.
The preparation method of the lead-free solder alloy of this embodiment is the same as that of embodiment 1, except that the weight percentage of the Sn-Zn-In-Ga lead-free solder alloy is added according to the proportion In this embodiment, and is not described herein again.
Comparative example 1
The lead-free solder comprises the following components in percentage by weight: 37% of Pb and 63% of Sn, and also unavoidable impurities.
The preparation method of the Sn-Pb solder comprises the following steps:
weighing the mixed Sn and Pb according to the proportion, placing the Sn and Pb in a crucible of a vacuum induction melting furnace, vacuumizing, and introducing argon for melting, wherein the melting temperature is 550-650 ℃, the melting time is 30-40 min, and the vacuum degree is 10-4Pa, and preparing the Sn-Pb solder.The solder alloy is repeatedly smelted for 3 times, and is poured into a metal mold after being remelted for the last time, and is cooled and solidified in an argon atmosphere.
Comparative example 2
The Sn-Ag-Cu series lead-free solder with the most wide application comprises the following components in percentage by weight: 3.0% Ag, 0.5% Cu, and the balance Sn, and also includes unavoidable impurities.
Sn-Ag-Cu solder preparation method
(1) Weighing raw materials Sn and Ag according to the weight ratio of 1:1, placing the raw materials in a crucible of a vacuum induction melting furnace, vacuumizing, and introducing argon for melting, wherein the melting temperature is 650-750 ℃, the melting time is 30-40 min, and the vacuum degree is 10-4Pa, and preparing the intermediate alloy Sn-Ag. Repeatedly smelting the alloy for 3 times, remelting the alloy for the last time, pouring the remelted alloy into a metal mold, and cooling and solidifying the remelted alloy in an argon atmosphere;
(2) weighing raw materials Sn and Cu according to the weight ratio of 1:1, placing the raw materials in a crucible of a vacuum induction melting furnace, vacuumizing, and introducing argon for melting, wherein the melting temperature is 650-750 ℃, the melting time is 30-40 min, and the vacuum degree is 10-4Pa, and preparing the intermediate alloy Sn-Cu. Repeatedly smelting the alloy for 3 times, remelting the alloy for the last time, pouring the remelted alloy into a metal mold, and cooling and solidifying the remelted alloy in an argon atmosphere;
(3) the Sn-Ag and Sn-Cu alloy prepared by the method comprises the following components in percentage by weight: mixing 3.0% of Ag, 0.5% of Cu and the balance of Sn, and smelting in a vacuum induction smelting furnace at the temperature of 450-550 ℃, for 30-40 min and under the vacuum degree of 10-4Pa, preparing the Sn-Ag-Cu lead-free solder, and also comprising inevitable impurities.
Table 1 shows the solder composition and the main properties:
Zn In Ga Sn melting Point (. degree.C.) Spreading Rate (%) Tensile Strength (MPa)
Example 1 7.0% 0.5% 1.0% Balance of 196.5 71.2 70.6
Example 2 7.0% 1.0% 0.5% Balance of 192.7 70.6 61.4
Example 3 7.0% 0.5% 2.0% Balance of 194.8 69.1 76.9
Example 4 8.0% 0.5% 0.05% Balance of 198.3 66.4 60.3
Example 5 8.0% 1.5% 1.5% Balance of 190.6 71.4 72.9
Example 6 8.0% 0.2% 2.0% Balance of 201.8 67.5 77.4
Example 7 9.0% 0.05% 0.5% Balance of 202.5 76.6 62.5
Example 8 9.0% 1.0% 0.1% Balance of 193.2 73.5 55.6
Example 9 9.0% 5.0% 0.1% Balance of 185.7 72.9 54.1
Example 10 10.0% 2.0% 0.5% Balance of 190.6 69.4 58.5
Example 11 10.0% 0.1% 1.5% Balance of 193.9 72.3 74.2
Example 12 10.0% 2.5% 1.0% Balance of 189.7 71.6 69.1
Comparative example 1 183 81.8 51.9
Comparative example 2 217 66.5 45.6
Table 1 is a table of the compositions of 12 Sn-Zn-In-Ga quaternary lead-free solders, In which the compositions are In mass percent, and also the melting point, spreading ratio and tensile strength of each example solder and two comparative example solders are given. As can be seen from the table, the melting points of the examples 1 to 12 of the present invention are much lower than those of Sn96.5Ag3.0Cu0.5 which is most widely used, i.e., comparative example 2, and are close to those of the conventional Sn63Pb37 solder, i.e., comparative example 1. The spreading ratios of the examples 1 to 12 of the invention are improved compared with the comparative example 2 and are closer to the comparative example 1. The tensile strength of examples 1-12 of the present invention is significantly increased over comparative example 1 and comparative example 2.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various changes and modifications can be made without departing from the overall concept of the present invention, and these should also be considered as the protection scope of the present invention.

Claims (5)

1. An Sn-Zn-In-Ga lead-free solder is characterized In that: in the lead-free solder, Zn accounts for 7.0-10.0 wt% of the solder, In accounts for 0.05-5.0 wt% of the solder, Ga accounts for 0.05-2.0 wt% of the solder, and the balance is Sn, and the content of inevitable impurities is less than 0.2%.
2. The Sn-Zn-In-Ga lead-free solder according to claim 1, wherein: further Zn is 9.0% by weight of the solder.
3. The Sn-Zn-In-Ga lead-free solder according to claim 1, wherein: the further In accounts for 0.5-4.0% of the solder by weight percent.
4. The Sn-Zn-In-Ga lead-free solder according to claim 1, wherein: further, the weight percentage of Ga in the solder is 0.1-1.5%.
5. The method of producing the Sn-Zn-In-Ga lead-free solder according to claim 1, wherein: the method specifically comprises the following steps of,
(1) weighing according to the weight ratio of 1:1Putting the measured raw materials Sn and Zn into a crucible of a vacuum induction melting furnace, vacuumizing, and introducing argon for melting, wherein the melting temperature is 550-650 ℃, the melting time is 30-40 min, and the vacuum degree is 10-4Pa, preparing to obtain intermediate alloy Sn-Zn, repeatedly smelting the alloy for 3 times, pouring the alloy into a metal mold after remelting for the last time, and cooling and solidifying in an argon atmosphere;
(2) weighing raw materials Sn and In according to the weight ratio of 1:1, placing the raw materials In a crucible of a vacuum induction melting furnace, vacuumizing, and introducing argon for melting, wherein the melting temperature is 450-550 ℃, the melting time is 30-40 min, and the vacuum degree is 10-4Pa, preparing to obtain an intermediate alloy Sn-In, repeatedly smelting the alloy for 3 times, remelting the alloy for the last time, pouring the alloy into a metal mold, and cooling and solidifying the alloy In an argon atmosphere;
(3) weighing raw materials Sn and Ga according to the weight ratio of 1:1, placing the raw materials in a crucible of a vacuum induction melting furnace, vacuumizing, and introducing argon for melting, wherein the melting temperature is 450-550 ℃, the melting time is 30-40 min, and the vacuum degree is 10-4Pa, preparing to obtain intermediate alloy Sn-Ga, repeatedly smelting the alloy for 3 times, pouring the alloy into a metal mold after remelting for the last time, and cooling and solidifying in an argon atmosphere;
(4) the Sn-Zn, Sn-In and Sn-Ga alloy prepared by the method are mixed according to the weight percentage of Zn to solder of 7.0-10.0%, the weight percentage of In to solder of 0.05-5.0%, the weight percentage of Ga to solder of 0.05-2.0% and the balance Sn, and are smelted In a vacuum induction smelting furnace at the smelting temperature of 450-550 ℃, the smelting time of 30-40 min and the vacuum degree of 10-4Pa, and the content of inevitable impurities In the Sn-Zn-In-Ga lead-free solder is less than 0.2 percent.
CN202010702484.XA 2020-07-21 2020-07-21 Sn-Zn-In-Ga lead-free solder and preparation method thereof Withdrawn CN111940945A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112958941A (en) * 2021-03-19 2021-06-15 湖南大学 Sn-Bi-In-Zn-Ga low-melting-point high-entropy alloy lead-free solder and preparation method and application thereof
CN113182727A (en) * 2021-04-08 2021-07-30 北京科技大学 Chlorine ion corrosion resistant Sn-Ag-Cu-Nd lead-free solder alloy and preparation method thereof
CN117548897A (en) * 2023-11-27 2024-02-13 北京理工大学 Solid solution strengthening solder and preparation method of high-reliability interconnection joint thereof

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112958941A (en) * 2021-03-19 2021-06-15 湖南大学 Sn-Bi-In-Zn-Ga low-melting-point high-entropy alloy lead-free solder and preparation method and application thereof
CN112958941B (en) * 2021-03-19 2022-03-29 湖南大学 Sn-Bi-In-Zn-Ga low-melting-point high-entropy alloy lead-free solder and preparation method and application thereof
CN113182727A (en) * 2021-04-08 2021-07-30 北京科技大学 Chlorine ion corrosion resistant Sn-Ag-Cu-Nd lead-free solder alloy and preparation method thereof
CN117548897A (en) * 2023-11-27 2024-02-13 北京理工大学 Solid solution strengthening solder and preparation method of high-reliability interconnection joint thereof

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