CN115406275A - Controllable quick-response phase-change heat storage system, processing method and heat transfer method - Google Patents
Controllable quick-response phase-change heat storage system, processing method and heat transfer method Download PDFInfo
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
- B22F10/20—Direct sintering or melting
- B22F10/28—Powder bed fusion, e.g. selective laser melting [SLM] or electron beam melting [EBM]
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y10/00—Processes of additive manufacturing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y80/00—Products made by additive manufacturing
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0283—Means for filling or sealing heat pipes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/06—Control arrangements therefor
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Abstract
The invention discloses a controllable quick-response phase change heat storage system and a heat transfer method thereof, wherein the heat storage system comprises a phase change material, a honeycomb framework, a heat conduction enhancement loop module, a heat controllable valve and a metal packaging shell. The heat conduction enhanced loop module has high heat conduction performance, the on-off of a heat conduction channel of the heat controllable valve at a specific temperature is controllable, the large specific surface area of the honeycomb framework and the high phase change latent heat of the phase change material are combined, the heat conduction enhanced loop module has the characteristics of large heat capacity, high heat conduction coefficient and the like, and has the advantages of high heat absorption corresponding speed, strong heat consumption and absorption capacity, small temperature fluctuation interval and the like. The invention also discloses a processing method of the controllable quick-response phase change heat storage system, which is used for carrying out 3D printing on metal parts in the phase change heat storage system as a whole and is beneficial to eliminating thermal contact resistance between a honeycomb framework and a metal packaging shell in a conventional phase change device.
Description
Technical Field
The invention relates to a controllable quick-response phase change heat storage system and a heat transfer method, belonging to the field of heat control of aerospace electronic products.
Background
In recent years, satellite systems are continuously developed towards the directions of integration, miniaturization, high performance and the like, for example, digital products represented by high-speed and integrated data processing and high-power amplification products represented by power amplification, the heat consumption of a single chip, a single plate and a complete machine is improved by 3-5 times compared with the previous generation products, the local or instantaneous power can reach hundreds of watts per square centimeter, the high integration level of the products enables the effective heat dissipation space to be gradually reduced, the heat dissipation space in many occasions is closed or semi-closed, the effective heat dissipation space is very narrow and has very high heat flux density, meanwhile, the requirement on the temperature control precision of the products is higher and higher, the traditional heat dissipation mode can not meet the design requirement of the products, and a more efficient heat dissipation mode needs to be developed.
In the aspect of space safety, space electron beam weapons, high-power microwave weapons and the like are the key points of attention of all countries at present, a large amount of heat is released when the weapon products work, a thermal control technology becomes a bottleneck technology of the products, and a high-efficiency heat transfer method is urgently needed to be developed to solve the problem of high-temperature failure of the products.
For products which are started up for a short time or periodically, the phase-change material is used for absorbing heat generated when the products work and releasing the heat when the products do not work, so that high-level temperature control of the products can be realized. The phase-change material has no moving part in thermal control and high reliability, but as a non-metallic material, the phase-change material has poor heat transfer performance in the phase-change process, cannot quickly absorb heat generated by a high-power product during working, ensures that the temperature of the high-power product exceeds the design requirement of overheating, and has obvious thermal hysteresis.
Disclosure of Invention
The invention aims to overcome the defects and provides a controllable quick-response phase-change heat storage system and a heat transfer method thereof, which solve the problem of short-time power and large heat consumption of the conventional heat transfer system, have the characteristics of large heat capacity, high heat conductivity coefficient and the like, and are very suitable for disposable or periodically-working electronic products with short time, high power and high heat flow density.
Another object of the present invention is to provide a method for processing a controllable and fast-response phase change heat storage system, which solves the problem of large thermal contact resistance between a honeycomb framework and a metal packaging shell in a conventional phase change device, and performs 3D printing on metal components in the phase change heat storage system as a whole, thereby facilitating elimination of thermal contact resistance between the honeycomb framework and the metal packaging shell in the conventional phase change device.
In order to achieve the purpose of the invention, the invention provides the following technical scheme:
a controllable quick response phase change heat storage system comprises a metal packaging shell, a phase change material, a honeycomb framework, a heat conduction enhancement loop module and a heat controllable valve;
the number n of the heat conduction enhanced loop modules is more than 1, the n heat conduction enhanced loop modules are arranged in the metal packaging shell and are sequentially distributed along the heat transfer direction, the n enhanced loop modules are sequentially marked as 1,2 \8230, 8230and n-level heat conduction enhanced loop modules along the heat transfer direction, wherein a heat controllable valve is arranged between every two adjacent levels of heat conduction enhanced loop modules;
recording the heat conduction enhancement loop modules of two adjacent stages as an i-th stage heat conduction enhancement loop module and an i + 1-th stage heat conduction enhancement loop module respectively, wherein i is more than or equal to 1 and is less than or equal to n-1; when the heat controllable valve is opened, the heat conduction path between the two adjacent stages of heat conduction enhancement loop modules is switched on, when the heat controllable valve is closed, the heat conduction path between the two adjacent stages of heat conduction enhancement loop modules is switched off, and when the heat conduction path between the two adjacent stages of heat conduction enhancement loop modules is switched on, heat is quickly transferred into the i +1 th stage of heat conduction enhancement loop module from the i-th stage of heat conduction enhancement loop module;
the honeycomb framework is filled in the metal packaging shell, and the phase-change material is distributed in the honeycomb framework.
Further, the heat conduction enhancement loop module comprises an evaporator, a condenser, a steam pipeline, a liquid pipeline, a Tesla valve and a heat transfer working medium, wherein the steam pipeline is connected with an outlet of the evaporator and an inlet of the condenser;
the number of the heat controllable valves is n-1, wherein the ith heat controllable valve is arranged between the condenser of the ith level heat conduction enhancement loop module and the evaporator of the (i + 1) th level heat conduction enhancement loop module.
Furthermore, the outer surface of one end of the metal packaging shell is used as a heat absorption surface of the phase-change heat storage system to be in contact with a product to be radiated, the outer surface of the other end of the metal packaging shell is used as a heat radiation surface of the phase-change heat storage system to be in contact with an external environment with lower temperature, an evaporator of the 1 st-stage heat conduction enhanced loop module is in contact with the inner surface of one end of the metal packaging shell, and a condenser of the nth-stage heat conduction enhanced loop module is in contact with the inner surface of the other end of the metal packaging shell;
the heat transfer working medium in the heat conduction enhanced loop module is water, acetone or methanol and the like.
Furthermore, the evaporator, the condenser, the steam pipeline, the liquid pipeline and the Tesla valve in the metal packaging shell, the honeycomb framework and the heat conduction enhanced loop module are made of the same material.
Further, the same material is aluminum alloy, copper alloy or pure copper with the thermal conductivity of more than 180W/m ℃; the thermal controllable valve is made of Cu-Zn-Al shape memory alloy material; the phase change material is paraffin.
Furthermore, the heat controllable valve is sheet-shaped, a closed cavity for accommodating the ith heat controllable valve is arranged between the condenser of the ith heat conduction enhanced loop module and the evaporator of the (i + 1) th heat conduction enhanced loop module, when the temperature of the condenser of the ith heat conduction enhanced loop module is lower than a preset threshold value, the ith heat controllable valve is in a free state in the closed cavity, and when the temperature of the condenser of the ith heat conduction enhanced loop module is not lower than the preset threshold value, the ith heat controllable valve is heated and expanded to be simultaneously contacted with the condenser of the ith heat conduction enhanced loop module and the evaporator of the (i + 1) th heat conduction enhanced loop module, so that heat is transferred into the (i + 1) th heat conduction enhanced loop module from the ith heat conduction enhanced loop module.
Furthermore, a honeycomb framework is filled between the metal packaging shell and the heat conduction enhancement loop module, the honeycomb framework is in contact with the metal packaging shell and the heat conduction enhancement loop module at the same time, and the honeycomb framework and a phase change material are not arranged between the condenser of the ith-level heat conduction enhancement loop module and the evaporator of the (i + 1) th-level heat conduction enhancement loop module.
Further, the metal packaging shell and the honeycomb framework are integrally processed and molded;
the metal packaging shell is of a closed structure.
A heat transfer method of a controllable quick response phase change heat storage system comprises the following steps:
the metal packaging shell receives heat of a product to be radiated and transmits the heat to the heat conduction enhancement loop module;
after the evaporator of the heat conduction enhanced loop module absorbs heat, the liquid heat transfer working medium in the evaporator is converted into a gaseous heat transfer working medium, the gaseous heat transfer working medium enters the condenser through the steam pipeline and is condensed into the liquid heat transfer working medium in the condenser, and the liquid heat transfer working medium returns to the evaporator again through the liquid pipeline provided with the Tesla valve;
when the temperature of a condenser in the ith-stage heat conduction enhanced loop module is not lower than a preset threshold value, a heat controllable valve arranged between the ith-stage heat conduction enhanced loop module and the (i + 1) th-stage heat conduction enhanced loop module is opened, a rapid heat conduction path between the ith-stage heat conduction enhanced loop module and the (i + 1) th-stage heat conduction enhanced loop module is communicated, and heat is transferred into the (i + 1) th-stage heat conduction enhanced loop module from the ith-stage heat conduction enhanced loop module;
the heat conduction enhanced loop module transmits heat to the phase change material, and the phase change material wrapping the whole heat conduction enhanced loop module participates in heat exchange at the moment;
when the product to be radiated works, the heat absorption surface of the phase-change heat storage system absorbs the heat of the product, the phase-change material melts at constant temperature to absorb the heat, when the product to be radiated stops working, the heat dissipation surface of the phase-change heat storage system transfers the heat to the external environment, the phase-change material solidifies to release the heat, and the cold quantity required by the product to be radiated in the next working process is stored.
A processing method of a controllable quick-response phase-change heat storage system comprises the following steps:
the method adopts a 3D printing method, and utilizes the same material, and adopts a metal packaging shell, a honeycomb framework, an evaporator, a condenser, a steam pipeline, a liquid pipeline and a Tesla valve in a heat conduction enhanced loop module as a whole to carry out layered printing;
placing an ith heat-controllable valve between a condenser of the ith-level heat-conduction enhanced loop module and an evaporator of the (i + 1) th-level heat-conduction enhanced loop module in the printing process, and forming a closed cavity for accommodating the ith heat-controllable valve;
in the printing process, a first injection hole is reserved on the metal packaging shell, and a second injection hole is reserved on an evaporator or a condenser of the heat conduction enhancement loop module;
after printing, phase change materials are uniformly distributed in the honeycomb framework through the first injection metal packaging shell, and heat transfer working media of the heat conduction enhancement loop module are injected into the evaporator or the condenser through the second injection holes.
Compared with the prior art, the invention has the following beneficial effects:
(1) The method that the heat controllable valve is connected with the heat conduction enhancement loops which are adjacently connected in series is adopted, so that the heat transfer capacity of the phase change heat storage system is improved, and the autonomous control of the phase change opportunity of the phase change heat storage system is realized;
(2) The annular heat conduction enhanced loop module comprising the Tesla valve is utilized to optimize the internal heat conduction capability of the phase change heat storage system, and the response speed of the phase change heat storage system is greatly improved;
(3) The invention provides a method for integrally forming an external packaging structure and an internal heat conduction enhanced structure of a phase change heat storage system by using a laser cladding forming method, and designs materials, thereby eliminating the thermal contact resistance between the internal structures such as a heat conduction enhanced body, an annular heat conduction enhanced loop module and the like and the packaging structure, and eliminating the problem of thermal expansion mismatching among different parts in the device;
(4) The method for controlling the heat conduction enhancement loop by adopting the heat controllable valve is flexible and reliable, and the material, the thermal expansion coefficient, the preset threshold value and the like of the heat controllable valve can be designed according to specific requirements.
Drawings
FIG. 1 is a schematic diagram of a controllable fast response phase change thermal storage system of the present invention;
FIG. 2 illustrates the operation of the heat conduction enhancement circuit module according to the present invention;
FIG. 3 is a schematic view of the heat exchange surface of the condenser and the evaporator of the present invention.
Detailed Description
The features and advantages of the present invention will become more apparent and appreciated from the following detailed description of the invention.
The word "exemplary" is used exclusively herein to mean "serving as an example, embodiment, or illustration. Any embodiment described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments. While the various aspects of the embodiments are presented in drawings, the drawings are not necessarily drawn to scale unless specifically indicated.
The invention provides a controllable quick-response phase change heat storage system and a heat transfer method thereof, wherein the heat storage system comprises a phase change material, a honeycomb framework, a heat conduction enhancement loop module, a heat controllable valve and a metal packaging shell. The heat conduction enhanced loop module has high heat conduction performance, the on-off of a heat conduction channel of the heat controllable valve is controllable at a specific temperature, the heat conduction enhanced loop module combines the large specific surface area of the honeycomb framework and the high phase change latent heat of the phase change material, has the characteristics of large heat capacity, high heat conduction coefficient and the like, is very suitable for short-time, high-power and high-heat-flow-density electronic products which work at one time or periodically, and has the advantages of high heat absorption corresponding speed, strong heat consumption and absorption capacity, small temperature fluctuation range and the like.
The invention discloses a controllable quick response phase change heat storage system, which comprises: the heat conduction enhancement circuit comprises a metal packaging shell, a phase change material, a honeycomb framework, a heat conduction enhancement circuit module and a heat controllable valve;
the heat conduction enhancing loop modules are embedded into the metal packaging shell in a multi-stage series arrangement mode, a heat controllable valve is arranged between a condenser and an evaporator of each two adjacent stages of annular heat conduction enhancing loop modules, the honeycomb framework high heat conduction materials are uniformly filled, and finally the liquid phase change materials are filled into the metal packaging shell, so that the phase change materials are fully and uniformly distributed in the metal packaging shell.
The metal packaging shell is a closed metal outer cavity, is preferably processed by a laser cladding forming technology (3D printing), is made of a material with high thermal conductivity and low expansion rate, is generally aluminum alloy, copper alloy or pure copper, has the thermal conductivity of more than 180W/m ℃, and can flexibly change the shape of the cavity according to the heat conduction requirement of a system. Of course, the semi-closed cavity can be packaged by metal in a machining mode, and then the sealed metal outer cavity is realized in a welding mode.
The heat conduction enhanced loop module is a one-way rapid heat transfer loop and comprises a heat transfer working medium, a Tesla valve, an evaporator, a condenser, a steam pipeline and a liquid pipeline, wherein the evaporator is close to a high-temperature surface of the phase change heat storage system, the condenser is close to a low-temperature surface, the heat transfer working medium can be water, acetone, methanol and the like which are compatible with a pipe body material of the heat conduction enhanced loop module, and the working temperature range of the heat transfer working medium is matched with a phase change temperature zone of a phase change material. The phase-change heat storage system is provided with a plurality of stages of heat conduction enhancing loop modules which are arranged in series, an evaporator of the 1 st stage annular heat conduction enhancing loop module is directly contacted with a heat absorption surface of the phase-change heat storage system, heat transfer working medium liquid in the evaporator absorbs heat and evaporates, when heat borne by a heat controllable valve expands to a condenser communicated with the 1 st stage heat conduction enhancing loop module and a 2 nd stage heat conduction enhancing loop module evaporator, an outer heat dissipation surface of the condenser is connected with the heat absorption surface of the 2 nd stage evaporator through the heat controllable valve to transfer heat, and therefore multistage series connection is achieved. In the heat conduction enhancement loop module, the evaporator absorbs heat, the heat transfer working medium is evaporated from a liquid state to a gaseous state, enters the condenser through the steam pipeline, is condensed into liquid, then passes through the liquid pipeline, and returns to the evaporator again through the Tesla valve to continuously take away the heat.
The heat controllable valve is made of metal material with high heat conductivity and high expansion rate, and is arranged between the two stages of heat conduction enhancement loop modules, and between the outer surface of the condenser of the upper stage of annular heat conduction enhancement loop module and the outer surface of the evaporator of the lower stage of annular heat conduction enhancement loop module.
Under the condition that a multistage heat conduction enhancement loop module and a heat controllable valve are not arranged, liquid and solid interfaces of a phase change material move downwards step by step (namely along the heat transfer direction) in the phase change process, only the phase change material on one solid-liquid interface participates in phase change at one moment, and the heat exchange efficiency is low at the moment. The multistage heat conduction enhanced loop module is arranged, so that the heat of the previous stage heat conduction enhanced loop module can be rapidly guided into the periphery of the next stage heat conduction enhanced loop module, the three-dimensional phase change materials around the heat conduction enhanced loop module receiving the heat can exchange heat simultaneously, and whether a certain stage heat conduction enhanced loop module participates in heat exchange is controlled by the heat controllable valve between the multistage heat conduction enhanced loop modules, so that the phase change time can be controlled, and the heat exchange efficiency is improved.
A controllable quick response heat transfer method comprises the following specific heat transfer steps:
(1) The metal packaging shell receives external instantaneous large heat;
(2) After the evaporator of the heat conduction enhanced loop module rapidly absorbs heat, the heat transfer working medium is evaporated from a liquid state to a gas state, enters the condenser through the steam pipeline, is condensed into liquid, then passes through the liquid pipeline, and returns to the evaporator again through the Tesla valve to continuously take away the heat;
(3) Phase-change materials around the heat conduction enhancement loop module in the phase-change heat storage system start to melt at constant temperature to absorb heat along with the circulation work of the heat conduction enhancement loop module;
(4) When a certain stage of heat conduction enhancement loop module can not completely absorb heat, a heat controllable valve with high heat conductivity and high expansion rate between the stage of heat conduction enhancement loop module and the next stage of heat conduction enhancement loop module is simultaneously in close contact with the outer surfaces of a condenser of the stage of heat conduction enhancement loop module and an evaporator of the next stage of heat conduction enhancement loop module, so that the heat is absorbed by the next stage of heat conduction enhancement loop module, and the internal circulation of the next stage of heat conduction enhancement loop module is started;
(5) And (4) sequentially triggering subsequent heat conduction enhancement loop modules in the phase change heat storage system according to the working principle of the step (4).
Example 1:
this embodiment will be described in further detail with reference to fig. 1 to 3.
As shown in fig. 1, in this embodiment, the metal package casing 1 is a copper alloy with a thermal conductivity greater than 350W/m ℃, an XZ surface (an upper surface of the metal package casing 1 in fig. 1) of the metal package casing 1 contacts with an electronic device and a device which generate heat, after heat is rapidly transferred to the metal package casing 1, a honeycomb framework 3 is filled in the metal package casing 1, and the framework adopts a honeycomb structure, and the material of the framework is the same as that of the metal package casing 1, and the framework is integrally formed, so that thermal contact resistance between an inner wall of the upper surface of the metal package casing and the upper surface of the honeycomb framework in the heat transfer process can be eliminated. In the figure, the heat conduction enhancement loop modules 4 are uniformly distributed in the inner cavity of the metal packaging shell 1 along the heat transfer direction-Y direction. The heat conduction enhanced loop module 4 is an annular one-way rapid heat transfer loop and comprises a heat transfer working medium, a Tesla valve, an evaporator, a condenser, a steam pipeline and a liquid pipeline, wherein the evaporator is close to a high-temperature surface of the phase change heat storage system, the condenser is close to a low-temperature surface, the evaporator, the condenser, the steam pipeline, the liquid pipeline and the Tesla valve are made of copper alloy materials, and the heat transfer working medium can be water, acetone, methanol and other substances compatible with the pipe body material of the heat conduction enhanced loop module 4. The Tesla valve is a passive one-way conducting valve with a fixed geometry, which can make the fluid flow in one way, namely the fluid flow in the forward direction but block in the reverse direction. Because the fluid has inertia, the flow resistance is different when the fluid passes through the valve in different directions, thereby realizing one-way circulation. The Tesla valve has the advantages of simple structure, convenient processing, long service life and the like, and can generate the effect of flow direction control only by virtue of the geometric shape of the Tesla valve.
The thermally controllable valve 5 is a metal material with high thermal conductivity and high expansion rate, and is installed between the two stages of heat conduction enhancement loop modules 4, and more specifically, in fig. 3, 301 denotes a condenser of the previous stage of heat conduction enhancement loop module, 304 denotes an evaporator of the next stage of heat conduction enhancement loop module, the thermally controllable valve 5 is installed between an outer surface 302 of the condenser of the previous stage of heat conduction enhancement loop module and an outer surface 303 of the evaporator of the next stage of heat conduction enhancement loop module, and there is no phase change material between the outer surface 302 of the condenser of the previous stage of heat conduction enhancement loop module and the outer surface 303 of the evaporator of the next stage of heat conduction enhancement loop module.
The phase change heat storage system is provided with a plurality of stages of heat conduction enhancement loop modules 4 which are connected in series, an evaporator of the 1 st stage of heat conduction enhancement loop module 4 is directly contacted with a high-temperature surface (heat absorption surface) of the phase change heat storage system, a liquid heat transfer working medium in the evaporator absorbs heat and evaporates, the heat dissipation surface of a condenser is connected with the heat absorption surface of the 2 nd stage of heat conduction enhancement loop module 4 evaporator through a heat controllable valve 5 to transfer heat, the heat controllable valve 5 is made of Cu-Zn-Al shape memory alloy materials, the heat controllable valve 5 expands and deforms by heating, when the heat controllable valve 5 is expanded to the condenser communicated with the 1 st stage of heat conduction enhancement loop module 4 and the 2 nd stage of heat conduction enhancement loop module 4, the heat is transferred from the 1 st stage of heat conduction enhancement loop module 4 to the 2 nd stage of heat conduction enhancement loop module 4, so that multi-stage series distribution is achieved, the series stages can be increased according to the required value of heat consumption, or the controllable valve 5 is used for controlling whether the annular heat conduction enhancement loop module 4 to work.
Inside the heat conduction enhancement loop module 4, the evaporator absorbs heat, and the heat transfer working medium is evaporated from liquid state to gaseous state, enters the condenser through the steam pipeline, condenses to liquid, passes through the liquid pipeline, returns to the evaporator again through the Tesla valve and continues to take away heat. The condenser of the last stage heat conduction enhanced loop module 4 directly contacts the low temperature surface (heat release surface) of the phase change heat storage system, and the last stage heat conduction enhanced loop module 4 directly utilizes the external low temperature of the low temperature surface to release heat. The honeycomb framework 3 is uniformly distributed between the inner cavity of the metal packaging shell 1 and the outer wall of the heat conduction enhancement loop module 4. And finally, under the vacuum environment in the metal packaging shell 1, filling the liquefied phase-change material 2 and the working medium in the heat conduction enhancement loop module 4, and fully filling the liquid phase-change material 2 in the shell after the liquid phase-change material is solidified. The phase change material 2 is typically a paraffin wax with a high latent heat, or other higher end material.
According to the invention, the heat transfer performance in the phase change heat storage system is optimized through the heat conduction enhancement loop module 4, the multistage series connection of the heat conduction enhancement loop is realized through the heat controllable valve 5, and the heat transfer effect is further optimized, so that the controllable and quick response phase change heat storage is realized.
In the aspect of implementation and processing of the whole system, two modes are generally adopted, 1, a traditional machining mode is adopted, firstly, a semi-closed cavity (the semi-closed cavity is a combination of a side wall and an upper cover plate) of a metal packaging shell 1 of copper alloy and a lower cover plate structural member of the metal packaging shell 1 are processed by a lathe according to a drawing, each part of a heat conduction enhancing loop module 4 is welded and embedded into a honeycomb framework 3, after the whole combination of the honeycomb framework 3 and the heat conduction enhancing loop module 4 is installed into the semi-closed cavity of the metal packaging shell 1, the combination is welded and sealed with the lower cover plate structural member of the metal packaging shell 1, small holes filled with a phase change material 2 and a heat transfer working medium inside the heat conduction enhancing loop module 4 are reserved during sealing, and finally, the small holes are sealed after the phase change material 2 and the heat transfer working medium are filled. 2. Preparing a copper alloy material by adopting a 3D printing mode, in the processing process, printing from an XZ surface shown in figure 1, printing out the XZ surface of a metal packaging shell 1 (the upper end surface or the lower end surface of the metal packaging shell 1 in figure 1), then sequentially printing a condenser, a gas pipeline, a liquid pipeline and an evaporator shown in figure 2 at the position where a heat conduction enhancement loop module 4 is arranged according to a design drawing, printing a honeycomb framework in a space where the heat conduction enhancement loop module 4 is not designed, taking the case of printing from the lower end surface of the metal packaging shell 1 as an example, after the last stage of heat conduction enhancement loop module 4 is printed, arranging a pre-processed controllable valve 5 on the upper surface of an evaporator of the last stage of heat conduction enhancement loop module 4, and then continuing to perform integral 3D printing, wherein the controllable valve 5 is sealed in a narrow cavity through the upper surface of the evaporator of the last stage of heat conduction enhancement loop module 4 and the lower surface and the peripheral structure of the condenser and the adjacent stage of the first stage of heat conduction enhancement loop module 4, and the Y-direction size of the cavity is just equal to the size of the adjacent two stages of heat conduction enhancement loop modules 5, and the metal packaging shell 1 and the multi-stage heat conduction enhancement loop modules 3 are repeatedly. Thermal contact resistance between the honeycomb framework and the metal packaging shell in the conventional phase change device can be eliminated through a laser cladding forming technology (3D printing).
In the printing process, the heat conduction enhancement loop module 4 is reserved with a small hole, the purpose is to inject heat transfer working medium after printing is finished and then seal the heat transfer working medium, and the small hole is reserved in the metal packaging shell 1 in the printing process to conveniently inject the phase change material 2.
The embodiment also provides a controllable quick response heat transfer method, which comprises the following steps in combination with fig. 2:
(1) The metal packaging shell 1 receives external instantaneous large heat;
(2) The heat conduction enhancement loop module 4 is composed of an evaporator, a condenser, a steam pipeline and a liquid pipeline, wherein the evaporator is close to the high-temperature surface of the phase-change heat storage system, and the condenser is close to the low-temperature surface. In order to improve the one-way heat conduction capability of the heat conduction enhanced loop, a Tesla valve is used, due to the special structure of the Tesla valve, working media can only flow in one way, continuous one-way reliable power is provided for the annular heat conduction enhanced loop, liquid is separated from gas through the Tesla valve, the heat exchange efficiency of the evaporator is improved, the air passage resistance is reduced by 30% compared with that of a traditional flat heat pipe, and the maximum heat transfer power is improved by 100%. After the evaporator of the heat conduction enhanced loop module 4 absorbs heat rapidly, the heat transfer working medium is evaporated from a liquid state to a gas state, enters the condenser through the steam pipeline, is condensed into liquid, then passes through the liquid pipeline, and returns to the evaporator again through the Tesla valve to continuously take away the heat;
(3) The phase-change materials 2 around the heat conduction enhanced loop module 4 in the phase-change heat storage system start to melt at constant temperature to absorb heat along with the circulation work of the heat conduction enhanced loop module 4;
(4) When the i-th stage heat conduction enhancement loop module 4 cannot completely absorb heat, the heat controllable valve 5 with high heat conductivity and high expansion rate on the outer surface of the condenser is tightly contacted with the outer surface of the evaporator of the i + 1-th stage heat conduction enhancement loop module 4, so that the heat is absorbed by the i + 1-th stage heat conduction enhancement loop module 4, and the i + 1-th stage heat conduction enhancement loop module 4 is circularly started;
(5) And (5) sequentially triggering subsequent heat conduction enhancement loop modules 4 in the phase change heat storage system according to the working principle of the step (4).
The invention has been described in detail with reference to specific embodiments and illustrative examples, but the description is not intended to be construed in a limiting sense. Those skilled in the art will appreciate that various equivalent substitutions, modifications or improvements may be made to the technical solution of the present invention and its embodiments without departing from the spirit and scope of the present invention, which fall within the scope of the present invention. The scope of the invention is defined by the appended claims.
Those skilled in the art will appreciate that those matters not described in detail in the present specification are well known in the art.
Claims (10)
1. A controllable quick-response phase change heat storage system is characterized by comprising a metal packaging shell (1), a phase change material (2), a honeycomb framework (3), a heat conduction enhancement loop module (4) and a heat controllable valve (5);
the number n of the heat conduction enhanced loop modules (4) is more than 1, n heat conduction enhanced loop modules (4) are arranged in the metal packaging shell (1) and are sequentially distributed along the heat transfer direction, the n enhanced loop modules (4) are sequentially marked as 1,2 \8230; n-level heat conduction enhanced loop modules respectively along the heat transfer direction, and a heat controllable valve (5) is arranged between two adjacent levels of heat conduction enhanced loop modules;
recording the heat conduction enhancement loop modules of two adjacent stages as an i-th stage heat conduction enhancement loop module and an i + 1-th stage heat conduction enhancement loop module respectively, wherein i is more than or equal to 1 and is less than or equal to n-1; when the heat controllable valve (5) is opened, the heat conduction path between the adjacent two stages of heat conduction enhancement loop modules is switched on, when the heat controllable valve (5) is closed, the heat conduction path between the adjacent two stages of heat conduction enhancement loop modules is switched off, and when the heat conduction path between the adjacent two stages of heat conduction enhancement loop modules is switched on, heat is transferred into the i +1 th stage of heat conduction enhancement loop module from the i th stage of heat conduction enhancement loop module;
the honeycomb framework (3) is filled in the metal packaging shell (1), and the phase-change material (2) is distributed in the honeycomb framework (3).
2. The controllable fast response phase change thermal storage system according to claim 1, wherein the heat conduction enhancement loop module (4) comprises an evaporator, a condenser, a steam pipeline connecting an outlet of the evaporator and an inlet of the condenser, a liquid pipeline connecting an inlet of the evaporator and an outlet of the condenser, a Tesla valve arranged on the liquid pipeline and a heat transfer working medium which flows circularly;
the number of the heat controllable valves (5) is n-1, wherein the ith heat controllable valve (5) is arranged between the condenser of the ith stage heat conduction enhancement loop module and the evaporator of the (i + 1) th stage heat conduction enhancement loop module.
3. The controllable and fast-response phase-change heat storage system as claimed in claim 2, wherein the outer surface of one end of the metal packaging shell (1) is used as the heat absorption surface of the phase-change heat storage system to be contacted with a product to be cooled, the outer surface of the other end of the metal packaging shell (1) is used as the heat dissipation surface of the phase-change heat storage system to be contacted with the external environment, the evaporator of the 1 st-stage heat conduction enhanced loop module is contacted with the inner surface of one end of the metal packaging shell (1), and the condenser of the nth-stage heat conduction enhanced loop module is contacted with the inner surface of the other end of the metal packaging shell (1);
the heat transfer working medium in the heat conduction enhanced loop module (4) is water, acetone or methanol.
4. A controllable fast response phase change thermal storage system according to claim 2 characterized in that the evaporator, condenser, steam pipe, liquid pipe and tesla valve in the metal encapsulating shell (1), the honeycomb frame (3) and the heat conduction enhanced loop module (4) are all made of the same material.
5. The controllable fast response phase change thermal storage system according to claim 4, wherein the same material is aluminum alloy, copper alloy or pure copper with thermal conductivity more than 180W/m ℃; the thermal controllable valve (5) is made of Cu-Zn-Al shape memory alloy material; the phase change material (2) is paraffin.
6. The controllable and fast-response phase-change heat storage system as claimed in claim 2, wherein the thermal controllable valve (5) is sheet-shaped, a closed cavity for accommodating the i-th thermal controllable valve (5) is provided between the condenser of the i-th stage heat conduction enhanced loop module and the evaporator of the i + 1-th stage heat conduction enhanced loop module, when the temperature of the condenser of the i-th stage heat conduction enhanced loop module is lower than a preset threshold value, the i-th thermal controllable valve (5) is in a free state in the closed cavity, and when the temperature of the condenser of the i-th stage heat conduction enhanced loop module is not lower than the preset threshold value, the i-th thermal controllable valve (5) is heated and expanded to be simultaneously in contact with the condenser of the i-th stage heat conduction enhanced loop module and the evaporator of the i + 1-th stage heat conduction enhanced loop module, so that heat is transferred from the i-th stage heat conduction enhanced loop module to the i + 1-th stage heat conduction enhanced loop module.
7. The controllable and fast-response phase-change heat storage system as claimed in claim 6, wherein the honeycomb framework (3) is filled between the metal packaging shell (1) and the heat conduction enhanced loop module (4), the honeycomb framework (3) is in contact with the metal packaging shell (1) and the heat conduction enhanced loop module (4) at the same time, and the honeycomb framework (3) and the phase-change material (2) are not arranged between the condenser of the i-th-stage heat conduction enhanced loop module and the evaporator of the i + 1-th-stage heat conduction enhanced loop module.
8. The controllable rapid response phase change thermal storage system according to claim 1, wherein the metal packaging shell (1) and the honeycomb framework (3) are integrally formed;
the metal packaging shell (1) is of a closed structure.
9. A method of transferring heat in a controllable rapid response phase change thermal storage system according to any one of claims 2-6, comprising:
the metal packaging shell (1) receives heat of a product to be cooled and transmits the heat to the heat conduction enhancement loop module (4);
after the evaporator of the heat conduction enhancement loop module (4) absorbs heat, the liquid heat transfer working medium in the evaporator is converted into a gaseous heat transfer working medium, the gaseous heat transfer working medium enters the condenser through the steam pipeline and is condensed into the liquid heat transfer working medium in the condenser, and the liquid heat transfer working medium returns to the evaporator again through the liquid pipeline provided with the Tesla valve;
when the temperature of a condenser in the i-th-level heat conduction enhanced loop module is not lower than a preset threshold value, a heat controllable valve (5) arranged between the i-th-level heat conduction enhanced loop module and the i + 1-th-level heat conduction enhanced loop module is opened, a heat conduction path between the i-th-level heat conduction enhanced loop module and the i + 1-th-level heat conduction enhanced loop module is communicated, and heat is transferred into the i + 1-th-level heat conduction enhanced loop module through the i-th-level heat conduction enhanced loop module;
the heat conduction enhancement loop module (4) transmits heat to the phase change material (2);
when the product to be cooled works, the phase-change material (2) melts at a constant temperature to absorb heat, when the product to be cooled stops working, the phase-change material (2) transfers the heat to the external environment through the metal packaging shell (1), and the phase-change material (2) is solidified again.
10. The method for processing a controllable fast response phase change thermal storage system according to any one of claims 1 to 8,
the heat conduction enhancement loop module (4) comprises an evaporator, a condenser, a steam pipeline connected with an outlet of the evaporator and an inlet of the condenser, a liquid pipeline connected with an inlet of the evaporator and an outlet of the condenser, a Tesla valve arranged on the liquid pipeline and a heat transfer working medium which flows circularly;
the method comprises the steps that a 3D printing method is adopted, and the same material is used, and the evaporator, the condenser, the steam pipeline, the liquid pipeline and the Tesla valve in the metal packaging shell (1), the honeycomb framework (3) and the heat conduction enhancement loop module (4) are integrally subjected to layered printing;
placing an ith heat controllable valve (5) between a condenser of the ith-level heat conduction enhanced loop module and an evaporator of the (i + 1) th-level heat conduction enhanced loop module in the printing process, and forming a closed cavity for accommodating the ith heat controllable valve (5);
in the printing process, a first injection hole is reserved on the metal packaging shell (1), and a second injection hole is reserved on an evaporator or a condenser of the heat conduction enhancement loop module (4);
after printing, phase change material (2) is injected into the metal packaging shell (1) through the first injection hole, so that the phase change material (2) is uniformly distributed in the honeycomb framework (3), and heat transfer working medium of the heat conduction enhancement loop module (4) is injected into the evaporator or the condenser through the second injection hole.
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