CN115401569B - Copper ingot mould polishing spray device and method thereof - Google Patents

Copper ingot mould polishing spray device and method thereof Download PDF

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Publication number
CN115401569B
CN115401569B CN202211130905.1A CN202211130905A CN115401569B CN 115401569 B CN115401569 B CN 115401569B CN 202211130905 A CN202211130905 A CN 202211130905A CN 115401569 B CN115401569 B CN 115401569B
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CN
China
Prior art keywords
polishing
copper ingot
assembly
chain
spraying
Prior art date
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Active
Application number
CN202211130905.1A
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Chinese (zh)
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CN115401569A (en
Inventor
卜建中
张海珍
朱鹏飞
刘庆广
陈静伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ningbo Jintian Copper Group Co Ltd
Original Assignee
Ningbo Jintian Copper Group Co Ltd
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Publication date
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Priority to CN202211130905.1A priority Critical patent/CN115401569B/en
Publication of CN115401569A publication Critical patent/CN115401569A/en
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
    • B24B19/20—Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding dies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B16/00—Spray booths
    • B05B16/20—Arrangements for spraying in combination with other operations, e.g. drying; Arrangements enabling a combination of spraying operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/005—Feeding or manipulating devices specially adapted to grinding machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B51/00—Arrangements for automatic control of a series of individual steps in grinding a workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

The invention discloses a copper ingot mould polishing spray device, which comprises: chain machine and controller have the conveyer chain on the chain machine, install a plurality of moulds on the conveyer chain, a plurality of moulds include: a plurality of copper ingot moulds and a plurality of foot ingot moulds; the chain type machine is positioned on the upper side of the conveying chain and provided with a grinding area, and the chain type machine is positioned on the lower side of the conveying chain and provided with a spraying area; the chain machine is provided with a counting mechanism, and the counting mechanism counts the number of the moulds entering the polishing area; the chain type machine is arranged above the polishing area and is provided with a polishing mechanism, the polishing mechanism is provided with a detection assembly, the detection assembly is used for judging whether a die below the polishing mechanism is a copper ingot die or not, and the polishing mechanism is used for polishing an inner cavity of the copper ingot die; the chain machine is located the below of spraying region and is equipped with spraying mechanism, and spraying mechanism is used for spraying copper ingot mould and foot spindle mould's inner chamber. According to the invention, the copper ingot mould is automatically identified and judged, and the polishing and spraying of the copper ingot mould are automated, so that the efficiency is high.

Description

Copper ingot mould polishing spray device and method thereof
Technical Field
The invention relates to the technical field of valve bodies, in particular to a polishing spray device and a method for a copper ingot mould.
Background
Copper ingots generally refer to copper alloy ingots, the shape of the copper ingots is mainly ship-shaped, and the copper ingots are manufactured into various bathroom products through remelting and casting. The preparation process of the copper ingot mainly comprises the steps of casting molten copper alloy into a copper ingot mould, cooling and forming, and demoulding and stacking. Compared with a common copper ingot, the foot ingot has the same total height as the copper ingot, but the center of the foot ingot is provided with a bulge so as to generate two feet, the foot ingot is stacked on the bottommost layer, and a fork truck can stretch fork feet into the foot ingot for movable loading and unloading.
The copper ingot moulds are arranged on the chain machine one by one and circulate along with the movement of the chain wheel. The casting machine casts the copper alloy solution into the moving moulds one by one, the copper alloy is cooled in the moulds and moves to the other end of the chain machine, and when the moulds move out of the upper end face of the chain machine and enter the lower end face, the copper ingot is automatically separated from the moulds. A plurality of pin ingot molds are inserted among the plurality of copper ingot molds.
In order to ensure the surface quality of the copper ingot and facilitate demolding, the copper ingot mold needs to be polished and sprayed with a demolding agent. In the prior art, a manual mode is adopted to polish and spray a release agent to the inner cavity of the copper ingot mould, so that the labor intensity is high, the efficiency is low, and the operation environment is poor, therefore, the copper ingot mould polishing spray agent device with high automation degree needs to be developed to replace manual work.
Disclosure of Invention
Aiming at the problems of polishing and spraying a release agent of the existing copper ingot mold, the invention aims to provide a polishing spray device for the copper ingot mold, which has high automation degree and high efficiency.
The specific technical scheme is as follows:
a copper ingot mold polishing spray device comprising: chain machine and controller, have the conveying chain of circulation transport on the chain machine, install a plurality of moulds on the conveying chain, a plurality of the mould includes: a plurality of copper ingot moulds and a plurality of foot ingot moulds;
the chain type machine is positioned on the upper side of the conveying chain and provided with a grinding area, and the chain type machine is positioned on the lower side of the conveying chain and provided with a spraying area;
a counting mechanism is arranged on the chain machine and positioned at the front side of the polishing area, and the counting mechanism counts the number of the dies entering the polishing area;
the chain machine is arranged above the polishing area and is provided with a polishing mechanism, the polishing mechanism is provided with a detection assembly, the detection assembly is used for judging whether the die below the polishing mechanism is the copper ingot die or not, and the polishing mechanism is used for polishing the inner cavity of the copper ingot die;
the chain type machine is arranged below the spraying area and is used for spraying the inner cavities of the copper ingot mould and the foot ingot mould;
the controller receives signals of the detection assembly and the counting mechanism, controls conveying of the conveying chain on the chain machine, controls the polishing mechanism to polish the inner cavity of the copper ingot mould, and controls the spraying mechanism to spray the inner cavities of the copper ingot mould and the foot ingot mould.
The copper ingot mould polishing spray device, wherein, grinding machanism includes:
a lateral movement assembly mounted on the sharpening area of the chain machine;
the lifting assembly is arranged on the transverse moving assembly, and the transverse moving assembly drives the lifting assembly to move along the first direction and/or the second direction;
at least a grinding component, the grinding component install in on the lifting component, the lifting component drive the grinding component goes up and down, grinding mechanism is right the inner chamber of copper ingot mould is polished.
The copper ingot mould polishing spray device, wherein, polishing assembly includes: the polishing driving piece is arranged on the lifting assembly, the main body is arranged on the polishing driving piece, and the polishing driving piece drives the main body to rotate;
the bottom of the main body is provided with a plurality of first brush bodies which are arranged at equal intervals along the peripheral side of the main body, the peripheral side of the main body is provided with a plurality of second brush bodies, and the second brush bodies are arranged at equal intervals along the peripheral side of the main body;
the main part is round platform form setting, and a plurality of the first brush body is all located the bottom of main part, the first brush body is round platform form brush body, and a plurality of the second brush body is all located on the conical surface of main part, the second brush body is the bar brush body, the slope of second brush body is decurrent.
The copper ingot mould is polished and is spouted agent device, wherein, be equipped with dust extraction subassembly on the polishing subassembly, dust extraction subassembly includes: the dust collection device comprises a dust collection cover and a dust collector, wherein the main body is arranged in the dust collection cover, and the dust collection cover is communicated with the dust collector.
Foretell copper ingot mould spray device that polishes, wherein, detection component locates on the dust absorption cover, detection component includes: the device comprises a detection driving piece and an inductor, wherein the detection driving piece drives the inductor to press downwards, and the inductor judges whether a die below the polishing mechanism is the copper ingot die or not.
The copper ingot mould polishing spray device, wherein, the lateral shifting subassembly includes:
the foot rest is arranged on the chain machine;
the two first sliding rails are respectively arranged at two ends of the foot rest and are parallel;
the two ends of the cross beam are respectively in sliding fit with the two first sliding rails, and the cross beam moves along the first direction;
the base is in sliding fit with the cross beam, and moves along a second direction which is perpendicular to the first direction;
the lifting plate is in sliding fit with the base, the lifting plate moves longitudinally, the first direction and the second direction are respectively perpendicular to the moving direction of the lifting plate, and the dust hood and the polishing assembly are both arranged on the lifting plate.
The copper ingot mould polishing spray device, wherein, spraying mechanism includes: the sliding assembly is arranged on the chain machine, the sliding assembly drives the spraying assembly to move, and the spraying assembly sprays the inner cavities of the copper ingot mould and the foot ingot mould;
the spray assembly includes: the nozzle is arranged on the sliding assembly and is communicated with the lubricant storage box;
the sliding assembly includes:
the rack is arranged on the chain type machine;
the second sliding rail is arranged on the rack;
the sliding plate is in sliding fit with the second sliding rail, and the sliding plate moves along the second direction;
at least one guide post, the said guide post locates on the said slide;
the guide plate is in sliding fit with the guide post, the guide plate moves along the first direction, and the nozzle is arranged on the guide plate.
The copper ingot mould polishing spray device, wherein, the counting mechanism includes:
the mounting piece is arranged on the chain machine;
the rotating shaft is rotatably arranged on the mounting piece;
the counting switch is arranged on the mounting piece;
the first induction block and the second induction block are arranged at two ends of the rotating shaft respectively, the counting switch is matched with the first induction block, and the second induction block is matched with a sprocket on the conveying chain.
A method wherein the copper ingot mold polishing spray device of any one of the above is used, the method comprising:
step S1: the controller controls the conveying chain to convey a plurality of dies;
step S2: the counting mechanism counts the number of the dies entering the polishing area;
step S3: the controller receives signals of the counting mechanism, and when the number of the moulds entering the polishing area is consistent with the number of the moulds set by the controller, the controller controls the conveying chain to stop conveying;
step S4: the controller controls the detection assembly to judge whether the die below the polishing mechanism is the copper ingot die currently or not, if yes, the step S5 is executed, and if not, the step S6 is executed;
step S5: the controller controls the polishing mechanism to polish the inner cavity of the copper ingot mould below the polishing mechanism, and step S6 is executed:
step S6: and the controller judges whether all the moulds in the polishing area are completely detected by the detection assembly, if yes, the step S1 is returned, if not, the polishing mechanism is controlled to move to the position above the next mould, and the step S4 is returned.
The method is characterized in that after the controller controls the conveying chain to stop conveying, the controller controls the spraying mechanism to spray the inner cavities of the copper ingot mould and the foot ingot mould in the spraying area.
Compared with the prior art, the technical scheme has the following positive effects:
according to the invention, the copper ingot mould is automatically identified and judged, and the polishing and spraying of the copper ingot mould are fully automatic, so that the efficiency is high;
according to the invention, the dust collection assembly is additionally arranged, dust collection operation is performed while polishing, and the quality of the operation environment is improved.
Drawings
FIG. 1 is a schematic diagram of the overall structure of a polishing spray device for a copper ingot mold;
fig. 2 is a schematic diagram of the overall structure of a polishing spray device for a copper ingot mold according to the present invention;
FIG. 3 is a schematic structural view of a polishing mechanism of a copper ingot mold polishing spray device of the present invention;
fig. 4 is a schematic structural view of a spraying mechanism of a polishing spray device for copper ingot mold according to the present invention;
fig. 5 is a schematic structural view of a polishing component of a polishing spray device for copper ingot mold according to the present invention;
FIG. 6 is a schematic diagram of a counting mechanism of a copper ingot mold polishing spray device;
fig. 7 is a schematic structural view of a dust hood of a polishing spray device for copper ingot mold according to the present invention;
FIG. 8 is an enlarged view of the copper ingot mold polishing spray apparatus of the present invention at A in FIG. 1;
FIG. 9 is an enlarged view of the copper ingot mold polishing spray apparatus of the present invention at B in FIG. 5;
in the accompanying drawings: 1. a chain machine; 2. a conveyor chain; 3. a mold; 4. a polishing mechanism; 5. a spraying mechanism; 6. polishing the area; 7. a spraying area; 8. a counting mechanism; 9. a detection assembly; 21. a sprocket; 31. copper ingot mould; 32. a foot ingot mould; 41. a lateral movement assembly; 42. a lifting assembly; 43. a polishing assembly; 44. a dust collection assembly; 411. a foot rest; 412. a first slide rail; 413. a cross beam; 414. a base; 415. a lifting plate; 432. a main body; 4321. a first brush body; 4322. a second brush body; 441. a dust hood; 51. a sliding assembly; 511. a frame; 512. a second slide rail; 513. a slide plate; 514. a guide post; 515. a guide plate; 52. a spray assembly; 521. a nozzle; 81. a mounting member; 82. a rotating shaft; 83. a counting switch; 84. a first sensing block; 85. a second sensing block; 91. detecting a driving piece; 92. an inductor.
Detailed Description
The invention is further described below with reference to the drawings and specific examples, which are not intended to be limiting.
FIG. 1 is a schematic diagram of the overall structure of a polishing spray device for a copper ingot mold;
fig. 2 is a schematic diagram of the overall structure of a polishing spray device for a copper ingot mold according to the present invention;
FIG. 3 is a schematic structural view of a polishing mechanism of a copper ingot mold polishing spray device of the present invention;
fig. 4 is a schematic structural view of a spraying mechanism of a polishing spray device for copper ingot mold according to the present invention;
fig. 5 is a schematic structural view of a polishing component of a polishing spray device for copper ingot mold according to the present invention;
FIG. 6 is a schematic diagram of a counting mechanism of a copper ingot mold polishing spray device;
fig. 7 is a schematic structural view of a dust hood of a polishing spray device for copper ingot mold according to the present invention;
FIG. 8 is an enlarged view of the copper ingot mold polishing spray apparatus of the present invention at A in FIG. 1;
fig. 9 is an enlarged view of a copper ingot mold polishing spray apparatus of fig. 5 at B, as shown in fig. 1-9, showing a copper ingot mold polishing spray apparatus of a preferred embodiment, comprising: chain machine 1 and controller (not shown in the figure), have the conveyer chain 2 that circularly carried on chain machine 1, install a plurality of moulds 3 on the conveyer chain 2, a plurality of moulds 3 include: a plurality of copper ingot molds 31 and a plurality of dummy ingot molds 32.
Further, as a preferred embodiment, the chain conveyor 1 is provided with a grinding area 6 at the upper side of the conveyor chain 2, and the chain conveyor 1 is provided with a spraying area 7 at the lower side of the conveyor chain 2.
Further, as a preferred embodiment, the chain machine 1 is provided with a counting mechanism 8 at the front side of the grinding area 6, and the counting mechanism 8 counts the number of the molds 3 entering the grinding area 6.
Further, as a preferred embodiment, the chain machine 1 is provided with the polishing mechanism 4 above the polishing area 6, the polishing mechanism 4 is provided with the detecting component 9, the detecting component 9 is used for judging whether the die 3 below the polishing mechanism 4 is the copper ingot die 31, and the polishing mechanism 4 is used for polishing the inner cavity of the copper ingot die 31.
Further, as a preferred embodiment, the chain machine 1 is provided with a spraying mechanism 5 below the spraying area 7, and the spraying mechanism 5 is used for spraying the inner cavities of the copper ingot mold 31 and the dummy ingot mold 32.
Further, as a preferred embodiment, the controller receives the signals of the detecting component 9 and the counting mechanism 8, and the controller controls the conveying of the conveying chain 2 on the chain machine 1, controls the polishing mechanism 4 to polish the inner cavity of the copper ingot mould 31, and controls the spraying mechanism 5 to spray the inner cavities of the copper ingot mould 31 and the dummy ingot mould 32.
Further, as a preferred embodiment, the present invention shows a method of polishing a spray device using the copper ingot mold described above, the method comprising:
step S1: the controller controls the conveying chain 2 to convey a plurality of moulds 3;
step S2: the counting mechanism 8 counts the number of the moulds 3 entering the polishing area 6;
step S3: the controller receives signals of the counting mechanism 8, and when the number of the moulds 3 entering the polishing area 6 is consistent with the number of the moulds 3 set by the controller, the controller controls the conveying chain 2 to stop conveying;
step S4: the controller controls the detection assembly 9 to judge whether the die 3 below the current polishing mechanism 4 is a copper ingot die 31 or not, if yes, the step S5 is executed, and if not, the step S6 is executed;
step S5: the controller controls the polishing mechanism 6 to polish the inner cavity of the copper ingot mold 31 below the polishing mechanism, and step S6 is executed:
step S6: the controller judges whether all the molds in the polishing area 6 are detected by the detecting assembly 9, if yes, the step S1 is returned, if not, the polishing mechanism 4 is controlled to move to the position above the next mold 3, and the step S4 is returned.
Preferably, the polishing mechanism 4 and the detecting assembly 9 sequentially detect and polish the molds in the polishing area 6, and after the controller judges that the detecting assembly 9 completely completes detection of all the molds in the polishing area 6, the polishing mechanism 4 and the detecting assembly 9 move to the position above the forefront mold 3 in the polishing area 6.
Further, as a preferred embodiment, after the controller controls the conveyor chain 2 to stop conveying, the controller controls the spraying mechanism 5 to spray the inner cavities of the copper ingot mold 31 and the dummy ingot mold 32 in the spraying area 7.
Preferably, the spraying mechanism 5 sprays only the inner cavity of the die 3 passing through the polishing mechanism 4.
Preferably, the spraying area 7 is located at the lower side of the conveyor chain 2 of the chain machine 1, after polishing the copper ingot mold 31, the copper ingot mold 31 enters the spraying area 7, the opening of the inner cavity of the copper ingot mold 31 at the moment faces downwards, impurities in the inner cavity can be piled or attached after polishing, the impurities can be cleaned up through spraying, and the spraying mechanism 5 and the polishing mechanism 4 are simultaneously carried out, so that the automation degree is high and the efficiency is high.
The foregoing is merely a preferred embodiment of the present invention, and is not intended to limit the embodiments and the protection scope of the present invention.
The present invention has the following embodiments based on the above description:
in a further embodiment of the present invention, and with continued reference to fig. 1-9, the grinding mechanism 4 comprises: the device comprises a transverse moving assembly 41, at least one lifting assembly 42 and at least one grinding assembly 43, wherein the transverse moving assembly 41 is arranged on a grinding area 6 of the chain machine 1, the lifting assembly 42 is arranged on the transverse moving assembly 41, the lifting assembly 41 drives the lifting assembly 42 to move along a first direction and/or a second direction, the grinding assembly 43 is arranged on the lifting assembly 42, the lifting assembly 42 drives the grinding assembly 43 to lift, and the grinding assembly 43 grinds an inner cavity of the copper ingot mould 31.
In a further embodiment of the present invention, the sharpening assembly 43 comprises: a sanding drive member (not shown) disposed on the lifting assembly 42 and a main body 432 mounted on the sanding drive member, the sanding drive member driving the main body 432 in rotation.
Preferably, the grinding drive is a motor.
In a further embodiment of the present invention, the bottom of the main body 432 is provided with a plurality of first brush bodies 4321, the plurality of first brush bodies 4321 are arranged at equal intervals along the circumference of the main body, the circumference of the main body 432 is provided with a plurality of second brush bodies 4322, and the plurality of second brush bodies 4322 are arranged at equal intervals along the circumference of the main body.
In a further embodiment of the present invention, the main body 432 is arranged in a truncated cone shape, the plurality of first brush bodies 4321 are all arranged at the bottom of the main body 432, the first brush bodies 4321 are truncated cone-shaped brush bodies, the plurality of second brush bodies 4322 are all arranged on the conical surface of the main body 432, the second brush bodies 4322 are bar-shaped brush bodies, and the second brush bodies 4322 are inclined downwards.
Preferably, the bottom of the inner cavity of the copper ingot mould 31 is polished by the first brush 4321, and because the first brush 4321 is in a round table shape, an inclination is formed between the first brush 4321 and the bottom of the inner cavity of the copper ingot mould 31, and the second brush 4322 is used for polishing the side wall of the inner cavity of the copper ingot mould 31 downwards in an inclined manner, so that the effect is good.
In a further embodiment of the present invention, the polishing assembly 43 is provided with a dust collection assembly 44, and the dust collection assembly 44 includes: a suction hood 441 and a suction machine (not shown), the main body 432 is installed in the suction hood 441, and the suction hood 441 communicates with the suction machine.
Preferably, dust collection assembly 44 collects the flying dust that produces when polishing of polishing subassembly 43, can prevent flying dust pollution, clears up through dust collection assembly 44 and spraying mechanism 7's two processes, and copper ingot mould 31 inner chamber meets the requirements and operational environment is good.
In a further embodiment of the present invention, the detecting assembly 9 is disposed on the dust hood 441, and the detecting assembly 9 includes: the detection driving member 91 and the sensor 92 are detected, the detection driving member 91 drives the sensor 92 to press down, and the sensor 92 judges whether the die 3 below the polishing mechanism 4 is the copper ingot die 31 or not.
Preferably, the detection driving member 91 is a cylinder.
In a further embodiment of the present invention, the lateral movement assembly 41 comprises: foot rest 411, two first slide rail 412, crossbeam 413, base 414 and lifter plate 415, foot rest 411 is located on chain machine 1, two first slide rail 412 are located the both ends of foot rest 411 respectively, two first slide rail 412 are parallel, the both ends of crossbeam 413 respectively with two first slide rail 412 sliding fit, crossbeam 413 moves along first direction, base 414 and crossbeam 413 sliding fit, base 414 moves along the second direction, the second direction is perpendicular with the first direction, lifter plate 415 and base 414 sliding fit, lifter plate 415 moves along vertically, first direction, the second direction is perpendicular with lifter plate 415's movable direction respectively, the dust hood 441 and the grinding component 43 are all located on the lifter plate 415.
Preferably, the lateral movement assembly 41 slides through a worm gear, a rack gear, or a driving member, which may be a cylinder, an oil cylinder, or the like, is disposed on the first sliding rail 412, the cross beam 413, and the lifting plate 415.
In a further embodiment of the invention, the spraying mechanism 5 comprises: the sliding assembly 51 and the spraying assembly 52 are arranged on the chain machine 1, the sliding assembly 51 drives the spraying assembly 52 to move, and the spraying assembly 52 sprays the inner cavities of the copper ingot mould 31 and the dummy ingot mould 32.
In a further embodiment of the present invention, the spray coating assembly 52 includes: at least one nozzle 521 and a lubricant reservoir (not shown), the nozzle 521 being provided on the slide assembly 51, the nozzle 521 being in communication with the lubricant reservoir.
In a further embodiment of the present invention, the sliding assembly 51 includes: the frame 511, at least one second slide rail 512, at least one slide plate 513, at least one guide post 514 and at least one guide plate 515, wherein the frame 511 is arranged on the chain machine 1, the second slide rail 512 is arranged on the frame 511, the slide plate 513 is in sliding fit with the second slide rail 512, the slide plate 513 moves along the second direction, the guide post 514 is arranged on the slide plate 513, the guide plate 515 is in sliding fit with the guide post 514, the guide plate 515 moves along the first direction, and the nozzle 521 is arranged on the guide plate 515.
Preferably, the sliding component 51 slides through a worm gear, a worm gear and a rack, or a driving piece is arranged on the second sliding rail 515, and the driving piece can be a cylinder, an oil cylinder, and the like.
In a further embodiment of the invention, the counting mechanism 8 comprises: mounting 81, pivot 82, count switch 83, first sensing piece 84 and second sensing piece 85, mounting 81 are located on the chain machine 1, and pivot 82 rotates to locate on the mounting 81, and count switch 83 locates on the mounting 81, and both ends of pivot 82 are located respectively to first sensing piece 84, second sensing piece 85, and count switch 83 cooperates with first sensing piece 84, and second sensing piece 85 cooperates with sprocket 21 on the conveying chain 2.
Preferably, after the second sensing block 85 contacts with the sprocket 21 on the conveying chain 2, the second sensing block 85, the rotating shaft and the first sensing block 84 rotate together, the counting switch 8 senses the number of the sprocket 21 through the first sensing block 84, and the number of the molds 3 can be obtained due to the fact that the sprocket 21 is arranged at intervals with the molds 3, and the rotated second sensing block 85 resets through dead weight.
The invention automatically identifies and judges the copper ingot mould 31, and realizes full automation on polishing and spraying of the copper ingot mould 31, thereby having high efficiency;
the dust collection assembly 44 is additionally arranged, dust collection operation is performed while polishing, and the operation environment is improved.
The foregoing description is only illustrative of the preferred embodiments of the present invention and is not to be construed as limiting the scope of the invention, and it will be appreciated by those skilled in the art that equivalent substitutions and obvious variations may be made using the description and illustrations of the present invention, and are intended to be included within the scope of the present invention.

Claims (10)

1. The utility model provides a copper ingot mould polish spray device which characterized in that includes: chain machine and controller, have the conveying chain of circulation transport on the chain machine, install a plurality of moulds on the conveying chain, a plurality of the mould includes: a plurality of copper ingot moulds and a plurality of foot ingot moulds;
the chain type machine is positioned on the upper side of the conveying chain and provided with a grinding area, and the chain type machine is positioned on the lower side of the conveying chain and provided with a spraying area;
a counting mechanism is arranged on the chain machine and positioned at the front side of the polishing area, and the counting mechanism counts the number of the dies entering the polishing area;
the chain machine is arranged above the polishing area and is provided with a polishing mechanism, the polishing mechanism is provided with a detection assembly, the detection assembly is used for judging whether the die below the polishing mechanism is the copper ingot die or not, and the polishing mechanism is used for polishing the inner cavity of the copper ingot die;
the chain type machine is arranged below the spraying area and is used for spraying the inner cavities of the copper ingot mould and the foot ingot mould;
the controller receives signals of the detection assembly and the counting mechanism, controls conveying of the conveying chain on the chain machine, controls the polishing mechanism to polish the inner cavity of the copper ingot mould, and controls the spraying mechanism to spray the inner cavities of the copper ingot mould and the foot ingot mould.
2. The copper ingot mold polishing spray apparatus of claim 1, wherein the polishing mechanism comprises:
a lateral movement assembly mounted on the sharpening area of the chain machine;
the lifting assembly is arranged on the transverse moving assembly, and the transverse moving assembly drives the lifting assembly to move along the first direction and/or the second direction;
at least a grinding component, the grinding component install in on the lifting component, the lifting component drive the grinding component goes up and down, the grinding component is right the inner chamber of copper ingot mould is polished.
3. The copper ingot mold grinding spray apparatus of claim 2 wherein the grinding assembly comprises: the polishing driving piece is arranged on the lifting assembly, the main body is arranged on the polishing driving piece, and the polishing driving piece drives the main body to rotate;
the bottom of the main body is provided with a plurality of first brush bodies which are arranged at equal intervals along the peripheral side of the main body, the peripheral side of the main body is provided with a plurality of second brush bodies, and the second brush bodies are arranged at equal intervals along the peripheral side of the main body;
the main part is round platform form setting, and a plurality of the first brush body is all located the bottom of main part, the first brush body is round platform form brush body, and a plurality of the second brush body is all located on the conical surface of main part, the second brush body is the bar brush body, the slope of second brush body is decurrent.
4. A copper ingot mould polish spray device as claimed in claim 3, wherein the polish assembly is provided with a dust extraction assembly comprising: the dust collection device comprises a dust collection cover and a dust collector, wherein the main body is arranged in the dust collection cover, and the dust collection cover is communicated with the dust collector.
5. The copper ingot mold polishing spray device of claim 4, wherein the detection assembly is provided on the dust hood, the detection assembly comprising: the device comprises a detection driving piece and an inductor, wherein the detection driving piece drives the inductor to press downwards, and the inductor judges whether a die below the polishing mechanism is the copper ingot die or not.
6. The copper ingot mold grinding and spray apparatus of claim 5 wherein the lateral movement assembly comprises:
the foot rest is arranged on the chain machine;
the two first sliding rails are respectively arranged at two ends of the foot rest and are parallel;
the two ends of the cross beam are respectively in sliding fit with the two first sliding rails, and the cross beam moves along the first direction;
the base is in sliding fit with the cross beam, and moves along a second direction which is perpendicular to the first direction;
the lifting plate is in sliding fit with the base, the lifting plate moves longitudinally, the first direction and the second direction are respectively perpendicular to the moving direction of the lifting plate, and the dust hood and the polishing assembly are both arranged on the lifting plate.
7. The copper ingot mold grinding and spraying device of claim 6, wherein the spraying mechanism comprises: the sliding assembly is arranged on the chain machine, the sliding assembly drives the spraying assembly to move, and the spraying assembly sprays the inner cavities of the copper ingot mould and the foot ingot mould;
the spray assembly includes: the nozzle is arranged on the sliding assembly and is communicated with the lubricant storage box;
the sliding assembly includes:
the rack is arranged on the chain type machine;
the second sliding rail is arranged on the rack;
the sliding plate is in sliding fit with the second sliding rail, and the sliding plate moves along the second direction;
at least one guide post, the said guide post locates on the said slide;
the guide plate is in sliding fit with the guide post, the guide plate moves along the first direction, and the nozzle is arranged on the guide plate.
8. The copper ingot mold grinding and spraying device of claim 7, wherein the counting mechanism comprises:
the mounting piece is arranged on the chain machine;
the rotating shaft is rotatably arranged on the mounting piece;
the counting switch is arranged on the mounting piece;
the first induction block and the second induction block are arranged at two ends of the rotating shaft respectively, the counting switch is matched with the first induction block, and the second induction block is matched with a sprocket on the conveying chain.
9. A method of using the copper ingot mould grinding spray apparatus of any one of claims 1 to 8, the method comprising:
step S1: the controller controls the conveying chain to convey a plurality of dies;
step S2: the counting mechanism counts the number of the dies entering the polishing area;
step S3: the controller receives signals of the counting mechanism, and when the number of the moulds entering the polishing area is consistent with the number of the moulds set by the controller, the controller controls the conveying chain to stop conveying;
step S4: the controller controls the detection assembly to judge whether the die below the polishing mechanism is the copper ingot die currently or not, if yes, the step S5 is executed, and if not, the step S6 is executed;
step S5: the controller controls the polishing mechanism to polish the inner cavity of the copper ingot mould below the polishing mechanism, and step S6 is executed:
step S6: and the controller judges whether all the moulds in the polishing area are completely detected by the detection assembly, if yes, the step S1 is returned, if not, the polishing mechanism is controlled to move to the position above the next mould, and the step S4 is returned.
10. The method of claim 9, wherein the controller controls the spraying mechanism to spray the copper ingot mold and the cavities of the footingot mold in the spraying area after the controller controls the conveyor chain to stop conveying.
CN202211130905.1A 2022-09-16 2022-09-16 Copper ingot mould polishing spray device and method thereof Active CN115401569B (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101202903B1 (en) * 2011-05-09 2012-11-19 창원대학교 산학협력단 Grinding device of large ingot production mold
CN102962412A (en) * 2012-10-09 2013-03-13 南通曼特威金属材料有限公司 Foot ingot die for realizing continuous production and foot ingot produced thereby
KR20130134133A (en) * 2012-05-30 2013-12-10 현대제철 주식회사 Polishing device of mold
CN209094495U (en) * 2018-08-29 2019-07-12 温州力恩环保设备科技有限公司 A kind of cast metals process units
CN211465897U (en) * 2019-10-23 2020-09-11 肇庆市大正铝业有限公司 Online automatic scavenging machine of mould for aluminum alloy ingot production

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101202903B1 (en) * 2011-05-09 2012-11-19 창원대학교 산학협력단 Grinding device of large ingot production mold
KR20130134133A (en) * 2012-05-30 2013-12-10 현대제철 주식회사 Polishing device of mold
CN102962412A (en) * 2012-10-09 2013-03-13 南通曼特威金属材料有限公司 Foot ingot die for realizing continuous production and foot ingot produced thereby
CN209094495U (en) * 2018-08-29 2019-07-12 温州力恩环保设备科技有限公司 A kind of cast metals process units
CN211465897U (en) * 2019-10-23 2020-09-11 肇庆市大正铝业有限公司 Online automatic scavenging machine of mould for aluminum alloy ingot production

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