CN115386843B - Vapor deposition device and correction method - Google Patents
Vapor deposition device and correction method Download PDFInfo
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- CN115386843B CN115386843B CN202110564237.2A CN202110564237A CN115386843B CN 115386843 B CN115386843 B CN 115386843B CN 202110564237 A CN202110564237 A CN 202110564237A CN 115386843 B CN115386843 B CN 115386843B
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- 238000000034 method Methods 0.000 title claims abstract description 17
- 238000007740 vapor deposition Methods 0.000 title claims description 33
- 238000001704 evaporation Methods 0.000 claims abstract description 151
- 238000001514 detection method Methods 0.000 claims abstract description 137
- 230000008020 evaporation Effects 0.000 claims abstract description 135
- 230000003760 hair shine Effects 0.000 abstract description 3
- 239000000758 substrate Substances 0.000 description 7
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- 230000009286 beneficial effect Effects 0.000 description 3
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- 238000007689 inspection Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
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- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 241001522301 Apogonichthyoides nigripinnis Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
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- 229910001416 lithium ion Inorganic materials 0.000 description 1
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- 239000010935 stainless steel Substances 0.000 description 1
- 229910001256 stainless steel alloy Inorganic materials 0.000 description 1
- 230000008022 sublimation Effects 0.000 description 1
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- 238000007738 vacuum evaporation Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The application discloses a correction device, an evaporation device and a correction method. The correction device comprises a cover plate, a base and a laser source, wherein the cover plate is connected with a shell of the detection device, a mounting hole is formed in the cover plate, the mounting hole is positioned in the extending direction of the detection hole of the detection device, perpendicular to the cover plate, and the laser source is connected with the cover plate through the mounting hole. When detection device installs many times, because the mounting hole is located detection device's detection hole perpendicular to the extending direction of apron, then laser source also is located detection hole perpendicular to the extending direction of apron, consequently, correcting unit passes through laser source emission laser and shines to evaporation source's predetermineeing on the evaporating nozzle, can correct the position of detection piece, when making detection device install many times, detection piece can both be fixed in same position, need not to carry out the adjustment by a wide margin to various parameters of evaporation source, thereby avoid the evaporation rate that detection piece detected to appear the deviation, and then improved evaporation rate's detection accuracy and evaporation stability.
Description
Technical Field
The invention relates to the technical field of evaporation coating, in particular to an evaporation device and a correction method.
Background
Vacuum evaporation coating refers to a process of heating, evaporating or sublimating a solid material in a specific vacuum environment, and condensing or depositing the solid material on the surface of a glass substrate to form a surface film layer. After the solid material is heated and evaporated or sublimated in the evaporation Crucible (flexible), the solid material rises and is sent out through an evaporation Nozzle (nozle) above the evaporation Crucible, when the evaporation source is moved to the position above the substrate to be positioned or the substrate is moved to the position above the evaporation source, the temperature of the evaporated material is gradually reduced after the evaporated material leaves the evaporation Crucible and is heated, the speed of evaporation movement is also gradually reduced, and finally a film layer is deposited on the surface of the substrate to be evaporated.
For mass production lines, the evaporation rate of the substrate to be evaporated in the evaporation process is detected by a film formation rate detection device (QCM), and the stability of the QCM determines the stability of the evaporation rate. However, QCM is unstable after a certain period of use, and therefore the QCM needs to be detached for inspection. However, when the QCM is installed again, various parameters such as the temperature, the speed and the correction (Tooling) value of the evaporation source need to be adjusted greatly according to the installation position of the QCM in the prior art, so that the operation is troublesome, the evaporation rate detected by the QCM is easy to deviate, and the detection accuracy of the evaporation rate is reduced.
Disclosure of Invention
The application provides a correction device, an evaporation device and a correction method to solve the problem that detection accuracy of evaporation rate can be reduced when a detection device is installed again in the prior art.
In a first aspect, the present application provides a correction device for connect detection device, detection device includes the casing and is located detection piece in the casing, have the exposure on the casing the detection hole of detection piece, the detection piece is used for detecting the evaporation rate of evaporation source, the evaporation source includes the evaporation nozzle, correction device includes: the device comprises a cover plate, a base and a laser source;
the cover plate is connected with the shell, and is provided with a mounting hole which is positioned in the direction perpendicular to the extending direction of the cover plate;
the laser source is connected with the cover plate through the mounting hole and is used for emitting laser to irradiate onto a preset evaporation nozzle of the evaporation source.
In some possible implementations, the outgoing direction of the laser source is located in a direction in which the mounting hole is perpendicular to the extending direction of the cover plate.
In some possible implementations, the orthographic projection of the mounting hole on the side of the cover plate away from the housing is located at the center of the orthographic projection of the detection hole on the side of the housing near the cover plate.
In some possible implementations, the calibration device further includes a base connected to the cover plate, the mounting hole is located in the base, and the laser source is connected to the base through the mounting hole.
In some possible implementations, the orthographic projection of the base on the side of the cover plate away from the housing overlaps the orthographic projection of the detection aperture on the side of the housing near the cover plate.
In some possible implementations, the front projection of the cover plate on the side of the housing adjacent to the cover plate overlaps with the front projection of the housing on the side of the cover plate adjacent to the housing.
In some possible implementations, the cover plate has at least one second threaded hole thereon that corresponds to the at least one first threaded hole on the housing.
In some possible implementations, the mounting hole is a third threaded hole, and the laser source has external threads thereon that are adapted to the third threaded hole.
In a second aspect, the present application provides an evaporation device, comprising: a detection device, a vapor deposition source, and a correction device as described above;
the detection device comprises a shell and a detection piece positioned in the shell, wherein the shell is provided with a detection hole exposing the detection piece, and the detection piece is used for detecting the evaporation rate of an evaporation source; the correction device is connected with the detection device and is used for emitting laser to irradiate on a preset evaporation nozzle of the evaporation source.
In a third aspect, the present application provides a correction method, comprising:
the detection device is movably arranged in the evaporation source;
connecting the correction device as described above with the detection device;
and opening the laser source and adjusting the position of the detection device to enable the laser emitted by the laser source to irradiate onto a preset evaporation nozzle of the evaporation source, and fixing the detection device.
The application provides a correcting unit includes apron and laser source, and the apron is connected with detection device's casing, has the mounting hole on the apron, and the mounting hole is located detection device's detection hole perpendicular to apron extending direction on, and the laser source passes through the mounting hole to be connected with the apron for on the evaporation nozzle is preset to the transmission laser irradiation to the evaporation source. When detection device installs many times, because the mounting hole is located detection device's detection hole perpendicular to the extending direction of apron, then laser source also is located detection hole perpendicular to the extending direction of apron, be located same straight line with the detection piece, consequently, correcting unit passes through laser source emission laser and shines to the evaporation nozzle of predetermineeing of evaporation source on, can correct the position of detection piece, when making detection device install many times, the detection piece can both be fixed in same position, prevent that the position of detection piece from appearing deviating, need not to carry out the adjustment by a wide margin to various parameters of evaporation source, thereby avoid the evaporation rate that the detection piece detected to appear deviating, and then improved the detection accuracy and the evaporation stability of evaporation rate.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the description of the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a calibration device according to an embodiment of the present application;
FIG. 2 is a schematic diagram of a cover plate and a base of a calibration device according to an embodiment of the present disclosure;
FIG. 3 is a top view of a calibration device according to an embodiment of the present application;
FIG. 4 is a schematic diagram of a detection device according to an embodiment of the present disclosure;
FIG. 5 is a top view of a detection device according to an embodiment of the present disclosure;
FIG. 6 is a schematic diagram of a calibration device and a detection device according to an embodiment of the present disclosure;
FIG. 7 is an exploded view of a calibration device and detection device connection according to an embodiment of the present application;
FIG. 8 is a schematic diagram of a detection device for detecting vapor deposition rate according to an embodiment of the present disclosure;
fig. 9 is a schematic view of an evaporation device according to an embodiment of the present disclosure;
fig. 10 is a flowchart of a correction method according to an embodiment of the present application.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to fall within the scope of the invention.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically connected, electrically connected or can be communicated with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art as the case may be.
In this application, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, and may also include the first and second features not being in direct contact but being in contact with each other by way of additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
The following disclosure provides many different embodiments or examples for implementing different structures of the present application. In order to simplify the disclosure of the present application, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present application. Furthermore, the present application may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not in themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present application provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize the application of other processes and/or the use of other materials.
The correcting device is used for being connected with the detecting device to correct the position of a detecting piece of the detecting device. When detection device installs many times, because the mounting hole is located detection device's detection hole perpendicular to the extending direction of apron, then laser source also is located detection hole perpendicular to the extending direction of apron, be located same straight line with the detection piece, consequently, correcting unit passes through laser source emission laser and shines to the evaporation nozzle of predetermineeing of evaporation source on, can correct the position of detection piece, when making detection device install many times, the detection piece can both be fixed in same position, prevent that the position of detection piece from appearing deviating, need not to carry out the adjustment by a wide margin to various parameters of evaporation source, thereby avoid the evaporation rate that the detection piece detected to appear deviating, and then improved the detection accuracy and the evaporation stability of evaporation rate.
Referring to fig. 1 to 9, in an embodiment of the present application, a calibration device 100 is provided, and is used for connecting with a detection device 200, where the detection device 200 includes a housing 201 and a detection member 202 disposed in the housing 201, the housing 201 has a detection hole 203 exposing the detection member 202, the detection member 202 is used for detecting a vapor deposition rate of a vapor deposition source 300, and the vapor deposition source 300 includes a vapor deposition nozzle 302. The correction device 100 includes: a cover plate 1 and a laser source 3;
the cover plate 1 is connected with the shell 201, the cover plate 1 is provided with a mounting hole 21, and the mounting hole 21 is positioned in the direction perpendicular to the extending direction of the cover plate 1 of the detection hole 203;
the laser source 3 is connected to the cover plate 1 through the mounting hole 21 for emitting laser light to irradiate onto the preset evaporation nozzle 301 of the evaporation source 300.
It should be noted that, when the detecting device 200 is installed for multiple times, since the mounting hole 21 is located in the direction in which the detecting hole 203 of the detecting device 200 is perpendicular to the extending direction of the cover plate 1, that is, the mounting hole 21 and the detecting hole 203 are located on the same straight line, the laser source 3 is also located in the extending direction in which the detecting hole 203 is perpendicular to the cover plate 1 and on the same straight line as the detecting piece 202, so that the correcting device 100 irradiates the preset evaporating nozzle 301 of the evaporating source 300 with the laser source 3 to adjust the position of the detecting piece 202 by the preset angle θ between the plane of the detecting piece 202 and the plane of the preset evaporating nozzle 301, so that the detecting piece 202 can be fixed at the same position when the detecting device 200 is installed for multiple times, the preset angle θ between the detecting piece 202 and the plane of the preset evaporating nozzle 301 is made, thereby preventing the position of the detecting piece 202 from deviating, and avoiding the deviation of various parameters of the evaporating source 300, thereby improving the accuracy and stability of the detecting the evaporating rate.
In this embodiment, the vapor deposition source 300 may be a point vapor deposition source, a line vapor deposition source, or a surface vapor deposition source. The point evaporation source means that there is only one evaporation nozzle 302, and the film formation area is conical upward evaporation or sublimation centered on the one evaporation nozzle 302. The line vapor deposition source refers to a plurality of vapor deposition nozzles 302 arranged linearly, and the film region 400 is typically formed by linear movement of the line vapor deposition source in parallel under the substrate when the vapor deposition substrate is stationary. The surface evaporation source refers to that the plurality of evaporation nozzles 302 are distributed in the whole surface, and correspond to the film region 400 to be formed.
When the vapor deposition source 300 is a point vapor deposition source, the preset vapor nozzle 301 is the one vapor nozzle 302 on the point vapor deposition source. When the evaporation source 300 is a linear evaporation source or a surface evaporation source, the preset evaporation nozzle 301 is one evaporation nozzle 302 of the plurality of evaporation nozzles 302, for example, when the evaporation source 300 is a linear evaporation source, the detection device 200 is located on the right side of the evaporation source 300, the preset evaporation nozzle 301 is the third evaporation nozzle 302 from right to left in a row of evaporation nozzles 302, which is verified by the inventor according to multiple evaporation rate detection, and the preset evaporation nozzle 301 is the most accurate position for detecting the evaporation rate. Of course, the preset evaporating nozzle 301 may be selected according to practical situations, and the present application is not limited herein.
The following describes a method of using the correction device 100 of the present application:
first, the calibration device 100 is connected to the detection device 200, the calibration device 100 irradiates laser onto the preset evaporation nozzle 301 of the evaporation source 300 through the laser source 3, and at this time, the preset angle θ between the detection element 202 and the plane of the preset evaporation nozzle 301 can be adjusted, so that the position of the detection element 202 is determined, and then the detection device 200 is fixed.
Then, the calibration device 100 is removed, and various parameters of the vapor deposition source 300 are adjusted, so that the detection element 202 can stably detect the vapor deposition rate.
Then, after the preset use time, the detection device 200 is detached for inspection, after the inspection is completed, the correction device 100 is connected with the detection device 200, the correction device 100 irradiates laser to the preset evaporation nozzle 301 of the evaporation source 300 through the laser source 3, at this time, the preset angle θ between the detection piece 202 and the plane where the preset evaporation nozzle 301 is located can be adjusted again, so that the position of the detection piece 202 is determined, and then the detection device 200 is fixed.
In some embodiments, the detecting member 202 may be a crystal oscillator, and during the evaporation process, the oscillation frequency of the crystal oscillator may be converted into the evaporation rate, so that the evaporation rate may be detected. In addition, the film thickness of the film layer region 400 can be converted by the oscillation frequency of the crystal oscillator, so that the film thickness of the film layer region 400 can be detected. Of course, the detecting member 202 may be made of other materials, which is not limited herein.
In some embodiments, referring to fig. 8 and 9, when the detecting member 202 can stably detect the evaporation rate, the detecting member 202 is generally inclined with respect to the evaporation source 300, and the predetermined angle θ between the detecting member 202 and the plane of the predetermined evaporation nozzle 301 refers to the predetermined angle θ between the connecting line of the detecting member 202 and the predetermined evaporation nozzle 301 and the plane of the predetermined evaporation nozzle 301. In order to more accurately correct the position of the detecting member 202, the emitting direction of the laser source 3, that is, the emitting direction of the laser is located in the direction in which the mounting hole 21 is perpendicular to the extending direction of the cover plate 1 and is located on the same line with the mounting hole 21, so that the laser can replace the connection line between the detecting member 202 and the preset evaporation nozzle 301, thereby facilitating more visual correction of the position of the detecting member 202 and ensuring that a preset angle θ is formed between the connection line between the detecting member 202 and the preset evaporation nozzle 301 and the plane in which the preset evaporation nozzle 301 is located.
In this embodiment, the laser source 3 may be a long cylindrical shape, but may be other shapes, for example, a rectangular shape, a truncated cone shape, or a conical shape, which is not limited herein. In addition, the laser source 3 can adopt an infrared laser source 3 to improve the visibility of laser, and the laser source 3 adopts a lithium-ion battery as a power supply, so that the power supply is not required to be externally connected with the power supply through a power supply wire, and the power supply wire is prevented from interfering the position of the correction detection piece 202.
In this embodiment, in order to improve the stability of the evaporation rate detected by the detecting member 202, the line between the detecting member 202 and the preset evaporation nozzle 301 is the line between the center point of the detecting member 202 and the center point of the preset evaporation nozzle 301, so that the orthographic projection of the mounting hole 21 on the side of the cover plate 1 away from the housing 201 is located at the center of the orthographic projection of the detecting hole 203 on the side of the housing 201 close to the cover plate 1, the center points of the laser source 3 and the detecting member 202 can be located on the same line, so that the laser can replace the line between the center point of the detecting member 202 and the center point of the preset evaporation nozzle 301, so as to improve the accuracy of correcting the position of the detecting member 202.
In some embodiments, referring to fig. 1 to 3, 6 and 7, the calibration device further includes a base 2 connected to the cover 1, a mounting hole 21 is formed in the base 2, and the laser source 3 is connected to the base 2 through the mounting hole 21. That is, the mounting hole 21 may be provided in the base 2 instead of the cover plate 1, and then the base 2 is connected to the cover plate 1, and the laser source 3 is connected to the base 2, so that the cover plate 1 does not need to be directly connected to the laser source 3, and the thickness of the cover plate 1 can be made thinner, thereby saving the cost.
In this embodiment, referring to fig. 3, 5 and 7, the front projection of the base 2 on the side of the cover plate 1 away from the housing 201 and the front projection of the detection hole 203 on the side of the housing 201 close to the cover plate 1 overlap, that is, the base 2 and the mounting hole 21 are located on the same straight line, and the size of the front projection of the base 2 and the size of the front projection of the mounting hole 21 may be the same, when the mounting hole 21 is located at the center of the base 2, the mounting hole 21 is correspondingly located at the center of the detection hole 203, so that the laser also corresponds to the center of the detection hole 203, which is beneficial to the center point of the detection piece 202, so that the laser can replace the line connecting the center point of the detection piece 202 and the center point of the preset evaporation nozzle 301, so as to improve the accuracy of correcting the position of the detection piece 202.
In this embodiment, the orthographic projections of the base 2 and the detection hole 203 may be both circular, and then the diameter R1 of the orthographic projection of the base 2 on the side of the cover plate 1 away from the housing 201 and the diameter R2 of the orthographic projection of the detection hole 203 on the side of the housing 201 near the cover plate 1 are the same. Of course, the orthographic projection of the base 2 and the detection hole 203 may have other shapes, for example, rectangular, triangular or pentagonal shapes, which are not limited herein.
In some embodiments, referring to fig. 3, 5 and 7, the front projection of the cover plate 1 on the side of the housing 201 near the cover plate 1 overlaps with the front projection of the housing 201 on the side of the cover plate 1 near the housing 201, that is, the dimensions of the front projections of the cover plate 1 and the housing 201 may be the same, and the cover plate 1 may just cover the housing 201 with the edges of the two being flush, which is beneficial to overlapping the front projections of the base 2 and the detection hole 203, so as to improve the accuracy of correcting the position of the detection element 202.
In this embodiment, the front projections of the cover plate 1 and the housing 201 may be both circular, and then the diameter R3 of the front projection of the cover plate 1 on the side of the housing 201 close to the cover plate 1 is the same as the diameter R4 of the front projection of the housing 201 on the side of the cover plate 1 close to the housing 201. Of course, the front projection of the cover plate 1 and the housing 201 may have other shapes, for example, rectangular, triangular or pentagonal, etc., which are not limited herein.
In some embodiments, referring to fig. 1, 2, 4, 6 and 7, the cover plate 1 has at least one second threaded hole 11 corresponding to the at least one first threaded hole 204 on the housing 201, and the cover plate 1 and the housing 201 may be connected by passing a screw 4 through the first threaded hole 204 and the second threaded hole 11 to facilitate connection and disconnection between the cover plate 1 and the housing 201.
In this embodiment, the number of the first threaded holes 204 and the second threaded holes 11 is at least two, because the at least two first threaded holes 204 and the at least two second threaded holes 11 are corresponding, when the at least two screws 4 are adopted to pass through the at least two first threaded holes 204 and the at least two second threaded holes 11 respectively, the connection position between the cover plate 1 and the housing 201 is fixed, so that the relative position between the cover plate 1 and the housing 201 is unchanged, therefore, when the cover plate 1 is connected with the housing 201, the front projection of the base 2 and the front projection of the detection hole 203 overlap, which is beneficial to improving the accuracy of correcting the position of the detection piece 202 by reasonably setting the positions of the first threaded holes 204 and the second threaded holes 11.
In some embodiments, the mounting hole 21 is a third threaded hole, and the laser source 3 has external threads thereon that fit into the third threaded hole. The laser source 3 can be arranged on the cover plate 1 or the base 2 by matching the external threads with the third threaded holes, namely screwing the laser source 3 into the mounting hole 21, so that the connection and the disassembly between the laser source 3 and the cover plate 1 or the base 2 are convenient.
In addition, the front projections of the laser source 3 and the mounting hole 21 on the surface of the cover plate 1 far from the housing 201 may also overlap, so that the center of the detecting element 202 corresponding to the laser emitted by the laser source 3 is convenient, and the accuracy of correcting the position of the detecting element 202 is improved.
In this embodiment, referring to fig. 3, the front projections of the laser source 3 and the mounting hole 21 may be circular, and then the diameter R5 of the front projection of the laser source 3 on the side of the cover plate 1 away from the housing 201 is the same as the diameter R6 of the front projection of the mounting hole 21 on the side of the cover plate 1 away from the housing 201. Of course, the front projection of the laser source 3 and the mounting hole 21 may have other shapes, for example, rectangular, triangular, pentagonal, etc., which are not limited herein.
In some embodiments, the base 2 is integrally formed with the cover 1, so as to improve the overall strength of the base 2 and the cover 1, and thus improve the stability of the position of the calibration test piece 202.
In this embodiment, the base 2 and the cover plate 1 may be made of the same material, for example, stainless steel, iron, copper or aluminum alloy, which is not limited herein. In addition, the thickness of the cover plate 1 may be 1.3mm to 1.7mm, and of course, the thickness of the cover plate 1 may be set to other values according to practical situations, which is not limited herein.
In some embodiments, referring to fig. 9, in order to more accurately correct the position of the detecting member 202, the evaporation source 300 may further include a cover 303 covering the preset evaporation nozzle 301 on the preset evaporation nozzle 301, wherein the center of the cover 303 corresponds to the center of the preset evaporation nozzle 301, and the center of the cover 303 is provided with a target. When the position of the detecting member 202 is corrected, the laser beam emitted from the laser source 3 is irradiated onto the bulls-eye, thereby completing the correction. After the calibration of the detecting member 202 is completed, the cover 303 can be removed from the predetermined evaporating nozzle 301, thereby avoiding the influence of the evaporation film.
In this embodiment, the size of the target is larger than the size of the spot of the laser light emitted from the laser light source 3, so that the laser light can be conveniently irradiated onto the target, for example, the diameter of the target may be 2mm, the diameter of the spot of the laser light is 0.8mm, and of course, the diameter of the target and the diameter of the spot of the laser light may be set to other values according to practical situations, which is not limited herein.
In addition, the range distance of the laser is greater than the distance between the laser source 3 and the preset evaporation nozzle 301, so as to ensure that the laser can irradiate the target, for example, the range distance of the laser may be greater than 100cm, and of course, the range distance of the laser may be set to other values according to practical situations, which is not limited herein.
In this embodiment, the shape of the cover 303 may be cylindrical so as to cover the cover 303 on the preset evaporation nozzle 301, and of course, the shape of the cover 303 may be other shapes, for example, a rectangular shape or a truncated cone shape, etc., which is not limited herein.
Referring to fig. 9, based on the correction device 100, an evaporation device is further provided in the embodiment of the present application, including: the detection device 200, the vapor deposition source 300 and the correction device 100 as described above, wherein the detection device 200 comprises a housing 201 and a detection member 202 disposed in the housing 201, the housing 201 is provided with a detection hole 203 exposing the detection member 202, the detection member 202 is used for detecting the vapor deposition rate of the vapor deposition source 300, and the correction device 100 is connected with the detection device 200 and is used for emitting laser to irradiate onto a preset evaporation nozzle 301 of the vapor deposition source 300.
It should be noted that, when the detecting device 200 is installed for multiple times, since the mounting hole 21 is located in the direction in which the detecting hole 203 of the detecting device 200 is perpendicular to the extending direction of the cover plate 1, that is, the mounting hole 21 and the detecting hole 203 are located on the same straight line, the laser source 3 is also located in the extending direction in which the detecting hole 203 is perpendicular to the cover plate 1 and on the same straight line as the detecting piece 202, so that the correcting device 100 irradiates the preset evaporating nozzle 301 of the evaporating source 300 with the laser source 3 to adjust the position of the detecting piece 202 by the preset angle θ between the plane of the detecting piece 202 and the plane of the preset evaporating nozzle 301, so that the detecting piece 202 can be fixed at the same position when the detecting device 200 is installed for multiple times, the preset angle θ between the detecting piece 202 and the plane of the preset evaporating nozzle 301 is made, thereby preventing the position of the detecting piece 202 from deviating, and avoiding the deviation of various parameters of the evaporating source 300, thereby improving the accuracy and stability of the detecting the evaporating rate.
Referring to fig. 10, based on the correction device 100, an embodiment of the present application further provides a correction method, including:
step S1, movably mounting a detection device 200 in an evaporation source;
step S2, connecting the calibration device 100 described above with the detection device 200;
step S3, the laser source 3 is turned on and the position of the detecting device 200 is adjusted, so that the laser emitted by the laser source 3 irradiates the preset evaporation nozzle 301 of the evaporation source 300, and the detecting device 200 is fixed.
It should be noted that, the evaporation source 300 may include a cavity and an evaporation crucible located in the cavity, the evaporation nozzle 302 is disposed on the evaporation crucible, and the detection device 200 may be mounted on the cavity of the evaporation source 300. When the detection device 200 is installed for multiple times, since the installation hole 21 is located in the direction in which the detection hole 203 of the detection device 200 is perpendicular to the extension direction of the cover plate 1, that is, the installation hole 21 and the detection hole 203 are located on the same straight line, the laser source 3 is also located in the direction in which the detection hole 203 is perpendicular to the extension direction of the cover plate 1 and is located on the same straight line as the detection piece 202, so that the correction device 100 irradiates laser to the preset evaporation nozzle 301 of the evaporation source 300 through the laser source 3 to adjust the preset angle θ between the detection piece 202 and the plane in which the preset evaporation nozzle 301 is located, that is, the position of the detection piece 202 can be fixed at the same position, so that the preset angle θ between the detection piece 202 and the plane in which the preset evaporation nozzle 301 is located is achieved, the position deviation of the detection piece 202 is prevented, the deviation of various parameters of the evaporation source 300 is not required to be greatly adjusted, the deviation of the evaporation rate detected by the detection piece 202 is avoided, and the detection accuracy and the evaporation rate stability are improved.
In the foregoing embodiments, the descriptions of the embodiments are focused on, and the portions of one embodiment that are not described in detail in the foregoing embodiments may be referred to in the foregoing detailed description of other embodiments, which are not described herein again.
In the implementation, each component or structure may be implemented as an independent entity, or may be implemented as the same entity or several entities in any combination, and the implementation of each component or structure may be referred to the foregoing embodiments and will not be repeated herein.
The foregoing has described in detail a correction device, vapor deposition device and correction method according to embodiments of the present invention, and specific examples have been applied to illustrate the principles and embodiments of the present invention, and the above description of the embodiments is only for aiding in understanding the method and core idea of the present invention; meanwhile, as those skilled in the art will have variations in the specific embodiments and application scope in light of the ideas of the present invention, the present description should not be construed as limiting the present invention.
Claims (9)
1. An evaporation device, comprising:
an evaporation source comprising an evaporation nozzle;
the detection device comprises a shell and a detection piece positioned in the shell, wherein the shell is provided with a detection hole exposing the detection piece, and the detection piece is used for detecting the evaporation rate of an evaporation source; and
the correction device comprises a cover plate and a laser source; the cover plate is connected with the shell, and is provided with a mounting hole which is positioned in the direction perpendicular to the extending direction of the cover plate; the laser source is connected with the cover plate through the mounting hole and is used for emitting laser to irradiate onto the evaporation nozzle of the evaporation source.
2. The vapor deposition device according to claim 1, wherein an emission direction of the laser source is in a direction in which the mounting hole is perpendicular to the extending direction of the cover plate.
3. The vapor deposition device according to claim 2, wherein the orthographic projection of the mounting hole on the side of the cover plate away from the housing is located at the center of the orthographic projection of the detection hole on the side of the housing close to the cover plate.
4. The vapor deposition device of claim 1, further comprising a base coupled to the cover plate, the mounting hole being in the base, the laser source being coupled to the base through the mounting hole.
5. The vapor deposition device according to claim 4, wherein the front projection of the base on the side of the cover plate away from the case overlaps with the front projection of the detection hole on the side of the case close to the cover plate.
6. The vapor deposition device according to claim 1, wherein the front projection of the cover plate on the side of the case close to the cover plate overlaps with the front projection of the case on the side of the cover plate close to the case.
7. The vapor deposition device according to any one of claims 1 to 6, wherein the cover plate has at least one second screw hole thereon corresponding to the at least one first screw hole on the housing.
8. The vapor deposition device according to any one of claims 1 to 6, wherein the mounting hole is a third screw hole, and the laser source has external screw threads thereon that are adapted to the third screw hole.
9. A correction method, comprising:
the detection device is movably arranged in the evaporation source; the evaporation source comprises an evaporation nozzle; the detection device comprises a shell and a detection piece positioned in the shell, wherein the shell is provided with a detection hole exposing the detection piece, and the detection piece is used for detecting the evaporation rate of an evaporation source;
connecting the detection device with a correction device; wherein the correction device includes: a cover plate and a laser source; connecting the cover plate with the shell; the cover plate is provided with a mounting hole, and the mounting hole is positioned in the direction that the detection hole is perpendicular to the extending direction of the cover plate; the laser source is connected with the cover plate through the mounting hole;
and opening the laser source and adjusting the position of the detection device to enable the laser emitted by the laser source to irradiate onto a preset evaporation nozzle of the evaporation source, and fixing the detection device.
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