CN115386843A - Correction device, vapor deposition device, and correction method - Google Patents
Correction device, vapor deposition device, and correction method Download PDFInfo
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- CN115386843A CN115386843A CN202110564237.2A CN202110564237A CN115386843A CN 115386843 A CN115386843 A CN 115386843A CN 202110564237 A CN202110564237 A CN 202110564237A CN 115386843 A CN115386843 A CN 115386843A
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- 238000000034 method Methods 0.000 title claims abstract description 17
- 238000007740 vapor deposition Methods 0.000 title claims description 10
- 238000001704 evaporation Methods 0.000 claims abstract description 168
- 230000008020 evaporation Effects 0.000 claims abstract description 167
- 238000001514 detection method Methods 0.000 claims abstract description 158
- 238000007689 inspection Methods 0.000 abstract description 10
- 239000011248 coating agent Substances 0.000 abstract description 9
- 238000000576 coating method Methods 0.000 abstract description 9
- 230000005540 biological transmission Effects 0.000 abstract description 3
- 238000009434 installation Methods 0.000 description 7
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- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
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- 238000010438 heat treatment Methods 0.000 description 1
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- 238000004519 manufacturing process Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001256 stainless steel alloy Inorganic materials 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
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Abstract
The application discloses a correction device, an evaporation device and a correction method. The correcting device comprises a cover plate, a base and a laser source, wherein the cover plate is connected with a shell of the detecting device, a mounting hole is formed in the cover plate, the mounting hole is located in the extending direction of the detecting hole of the detecting device, which is perpendicular to the cover plate, and the laser source is connected with the cover plate through the mounting hole. When detection device installs many times, because the mounting hole is located detection device's inspection hole perpendicular to apron the extending direction, then the laser source also is located the extending direction of inspection hole perpendicular to apron, therefore, correcting unit passes through laser source transmission laser irradiation to the evaporation coating source predetermine on the evaporation nozzle, can rectify the position of detecting the piece, when making detection device install many times, the detecting piece can both be fixed in same position, need not to adjust by a wide margin the various parameters in evaporation coating source, thereby avoid the deviation to appear in the evaporation coating rate that detecting the piece detected, and then improved the detection accuracy and the evaporation coating stability of evaporation coating rate.
Description
Technical Field
The invention relates to the technical field of evaporation coating, in particular to a correction device, an evaporation device and a correction method.
Background
Vacuum evaporation coating refers to a process of forming a surface film layer by heating, evaporating or sublimating a solid material, and condensing or depositing the solid material on the surface of a glass substrate in a specific vacuum environment. After the solid material is heated and evaporated or sublimated in an evaporation Crucible (Crucible), the solid material rises and is emitted through an evaporation Nozzle (Nozzle) above the evaporation Crucible, when an evaporation source moves to the position above a substrate to be positioned or the substrate moves to the position above the evaporation source, the evaporated material is gradually cooled after leaving the evaporation Crucible and being heated, the evaporation movement speed is also gradually reduced, and finally a film layer is formed on the surface of the substrate to be evaporated through deposition.
For a production line, the evaporation rate of a substrate to be evaporated in the evaporation process is detected by a film forming rate detection device (QCM), and the stability of the QCM determines the stability of the evaporation rate. However, the QCM is unstable after a certain period of use, and thus, the QCM needs to be disassembled for inspection. However, when the QCM is installed again, in the prior art, various parameters such as temperature, rate and correction (toiling) value of the evaporation source need to be adjusted again to a large extent according to the installation position of the QCM, which not only causes troublesome operation, but also easily causes deviation of the evaporation rate detected by the QCM, thereby reducing the detection accuracy of the evaporation rate.
Disclosure of Invention
The application provides a correcting device, an evaporation device and a correcting method, which aim to solve the problem that the detection accuracy of the evaporation rate is reduced when a detection device is installed again in the prior art.
In a first aspect, the present application provides a calibration device for connecting a detection device, the detection device includes a housing and a detection element located in the housing, the housing has a detection hole exposing the detection element, the detection element is used for detecting an evaporation rate of an evaporation source, the evaporation source includes an evaporation nozzle, and the calibration device includes: the device comprises a cover plate, a base and a laser source;
the cover plate is connected with the shell, and the cover plate is provided with a mounting hole which is positioned in the extending direction of the detection hole vertical to the cover plate;
the laser source is connected with the cover plate through the mounting hole and used for emitting laser to irradiate the preset evaporation nozzle of the evaporation source.
In some possible implementations, the exit direction of the laser source is located in the extending direction in which the mounting hole is perpendicular to the cover plate.
In some possible implementations, an orthographic projection of the mounting hole on a side of the cover plate away from the housing is located at the center of an orthographic projection of the detection hole on a side of the housing close to the cover plate.
In some possible implementations, the calibration device further includes a base connected to the cover plate, the mounting hole is located in the base, and the laser source is connected to the base through the mounting hole.
In some possible implementations, an orthographic projection of the base on a side of the cover plate away from the housing overlaps with an orthographic projection of the detection aperture on a side of the housing adjacent to the cover plate.
In some possible implementations, an orthographic projection of the cover plate on a side of the housing adjacent to the cover plate overlaps with an orthographic projection of the housing on a side of the cover plate adjacent to the housing.
In some possible implementations, the cover plate has at least one second threaded hole thereon corresponding to the at least one first threaded hole on the housing.
In some possible implementations, the mounting hole is a third threaded hole, and the laser source has an external thread thereon that is adapted to the third threaded hole.
In a second aspect, the present application provides an evaporation apparatus, comprising: a detection device, a vapor deposition source and the correction device;
the detection device comprises a shell and a detection piece positioned in the shell, wherein the shell is provided with a detection hole for exposing the detection piece, and the detection piece is used for detecting the evaporation rate of an evaporation source; the correcting device is connected with the detecting device and used for emitting laser to irradiate the preset evaporation nozzle of the evaporation source.
In a third aspect, the present application provides a calibration method, including:
movably mounting a detection device in an evaporation source;
connecting the correction device as described above with the detection device;
and opening the laser source and adjusting the position of the detection device, so that the laser emitted by the laser source is irradiated to a preset evaporation nozzle of an evaporation source, and then fixing the detection device.
The application provides a correcting unit includes apron and laser source, and the apron is connected with detection device's casing, has the mounting hole on the apron, and the mounting hole is located detection device's inspection hole perpendicular to apron the extending direction on, and the laser source passes through the mounting hole and is connected with the apron for on the evaporation coating source predetermines evaporation nozzle is shone to the emission laser. When detection device installs many times, because the mounting hole is located detection device's inspection hole perpendicular to apron extending direction, then the laser source also is located inspection hole perpendicular to apron extending direction, be located same straight line with the detection piece, therefore, correcting unit passes through laser source transmission laser irradiation to the evaporation source predetermine on the evaporation nozzle, can rectify the position of detection piece, when making detection device install many times, the detection piece can both be fixed in same position, prevent that the deviation from appearing in the position of detection piece, need not to adjust by a wide margin the various parameters of evaporation source, thereby avoid the evaporation rate that the detection piece detected to appear the deviation, and then improved evaporation rate's detection accuracy and evaporation stability.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic diagram of a calibration device according to an embodiment of the present application;
FIG. 2 is a schematic diagram of a cover plate and a base of a calibration device according to an embodiment of the present disclosure;
FIG. 3 is a top view of a calibration device provided in an embodiment of the present application;
FIG. 4 is a schematic view of a detection apparatus provided in an embodiment of the present application;
FIG. 5 is a top view of a detection device according to an embodiment of the present application;
FIG. 6 is a schematic diagram of a calibration device and a detection device according to an embodiment of the present application;
FIG. 7 is an exploded view of a calibration device coupled to a detection device according to an embodiment of the present application;
fig. 8 is a schematic diagram illustrating a detection apparatus for detecting an evaporation rate according to an embodiment of the present disclosure;
fig. 9 is a schematic view of an evaporation apparatus according to an embodiment of the present application;
fig. 10 is a flowchart of a calibration method according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without inventive step based on the embodiments of the present invention, are within the scope of protection of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, features defined as "first" and "second" may explicitly or implicitly include one or more of the described features. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the description of the present application, it should be noted that, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, a fixed connection, a detachable connection, or an integral connection; may be mechanically, electrically or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize the application of other processes and/or the use of other materials.
The correcting device is used for being connected with the detecting device so as to correct the position of a detecting piece of the detecting device. When detection device installs many times, because the mounting hole is located detection device's inspection hole perpendicular to apron extending direction, then the laser source also is located inspection hole perpendicular to apron extending direction, be located same straight line with the detection piece, therefore, correcting unit passes through laser source transmission laser irradiation to the evaporation source predetermine on the evaporation nozzle, can rectify the position of detection piece, when making detection device install many times, the detection piece can both be fixed in same position, prevent that the deviation from appearing in the position of detection piece, need not to adjust by a wide margin the various parameters of evaporation source, thereby avoid the evaporation rate that the detection piece detected to appear the deviation, and then improved evaporation rate's detection accuracy and evaporation stability.
Referring to fig. 1 to 9, in an embodiment of the present application, a calibration device 100 is provided for connecting a detection device 200, the detection device 200 includes a housing 201 and a detection element 202 located in the housing 201, the housing 201 has a detection hole 203 exposing the detection element 202, the detection element 202 is used for detecting an evaporation rate of an evaporation source 300, and the evaporation source 300 includes an evaporation nozzle 302. The correction device 100 includes: a cover plate 1 and a laser source 3;
the cover plate 1 is connected with the shell 201, the cover plate 1 is provided with a mounting hole 21, and the mounting hole 21 is positioned in the extending direction of the detection hole 203 vertical to the cover plate 1;
the laser source 3 is connected to the cover plate 1 through the mounting hole 21, and is used for emitting laser to irradiate a preset evaporation nozzle 301 of the evaporation source 300.
It should be noted that, when the detection apparatus 200 is installed for multiple times, because the installation hole 21 is located in the direction in which the detection hole 203 of the detection apparatus 200 is perpendicular to the extending direction of the cover plate 1, that is, the installation hole 21 and the detection hole 203 are located on the same straight line, the laser source 3 is also located in the direction in which the detection hole 203 is perpendicular to the extending direction of the cover plate 1, and is located on the same straight line as the detection piece 202, therefore, the correction apparatus 100 emits laser light through the laser source 3 to irradiate the preset evaporation nozzle 301 of the evaporation source 300, so as to adjust the preset angle θ between the planes in which the detection piece 202 and the preset evaporation nozzle 301 are located, and then correct the position of the detection piece 202, so that when the detection apparatus 200 is installed for multiple times, the detection piece 202 can be fixed at the same position, so that the preset angle θ between the plane in which the detection piece 202 and the preset evaporation nozzle 301 are located is located, thereby preventing the position of the detection piece 202 from deviating, and there is no need to greatly adjust various parameters of the evaporation source 300, thereby preventing the evaporation rate detected by the detection piece 202 from deviating, and further improving the detection accuracy and stability of the evaporation rate.
In this embodiment, the evaporation source 300 may be a point evaporation source, a line evaporation source, or a surface evaporation source. The point evaporation source means that there is only one evaporation nozzle 302, and the film formation region is evaporated or sublimated upward in a conical shape centered on the one evaporation nozzle 302. The line vapor deposition source is a plurality of vapor deposition nozzles 302 arranged linearly, and the film layer region 400 is formed by linear movement of the line vapor deposition source in parallel below the substrate while the vapor deposition substrate is generally stationary. The surface evaporation source means that a plurality of evaporation nozzles 302 are arranged in a whole surface and correspond to the film layer region 400 to be formed.
When the evaporation source 300 is a point evaporation source, the evaporation nozzle 301 is preset as the evaporation nozzle 302 on the point evaporation source. When the evaporation source 300 is a line evaporation source or a surface evaporation source, the preset evaporation nozzle 301 is one evaporation nozzle 302 of the plurality of evaporation nozzles 302, for example, when the evaporation source 300 is a line evaporation source, the detection device 200 is located on the right side of the evaporation source 300, and the preset evaporation nozzle 301 is the third evaporation nozzle 302 from the right to the left in the row of evaporation nozzles 302, which is the position where the inventor detects the evaporation rate most accurately according to the detection and verification of the multiple evaporation rate. Of course, the preset evaporation nozzle 301 may be selected according to actual conditions, and the application is not limited herein.
The following describes a method of using the calibration device 100 of the present application:
firstly, the calibration device 100 is connected with the detection device 200, the calibration device 100 emits laser light through the laser source 3 to irradiate on the preset evaporation nozzle 301 of the evaporation source 300, at this time, the preset angle θ between the plane where the detection piece 202 and the preset evaporation nozzle 301 are located can be adjusted, so that the position of the detection piece 202 is determined, and then the detection device 200 is fixed.
Then, the calibration apparatus 100 is removed, and various parameters of the vapor deposition source 300 are adjusted so that the detector 202 can stably detect the vapor deposition rate.
Then, after the preset using time, the detecting device 200 is detached for inspection, after the inspection is finished, the correcting device 100 is connected with the detecting device 200, the laser source 3 of the correcting device 100 emits laser to irradiate the preset evaporation nozzle 301 of the evaporation source 300, at this time, the preset angle θ between the plane where the detecting piece 202 and the preset evaporation nozzle 301 are located can be adjusted again, so that the position of the detecting piece 202 is determined, and then the detecting device 200 is fixed.
In some embodiments, the detecting member 202 may be a crystal plate, and during the evaporation process, the oscillation frequency of the crystal plate may be converted into the evaporation rate, so that the evaporation rate may be detected. In addition, the oscillation frequency of the crystal oscillator can be converted into the film thickness of the film layer area 400, so that the film thickness of the film layer area 400 can be detected. Of course, the detecting member 202 may be made of other materials, and the application is not limited thereto.
In some embodiments, referring to fig. 8 and 9, when the detecting element 202 is capable of stably detecting the evaporation rate, the detecting element 202 is usually disposed obliquely to the evaporation source 300, and the predetermined angle θ between the detecting element 202 and the plane of the predetermined evaporation nozzle 301 means that the predetermined angle θ is formed between a line connecting the detecting element 202 and the predetermined evaporation nozzle 301 and the plane of the predetermined evaporation nozzle 301. In order to correct the position of the detection piece 202 more accurately, the emitting direction of the laser source 3, that is, the emitting direction of the laser is located in the extending direction of the mounting hole 21 perpendicular to the cover plate 1 and is located on the same straight line with the mounting hole 21, so that the laser can replace the connection line between the detection piece 202 and the preset evaporation nozzle 301, the position of the detection piece 202 can be corrected more intuitively, and the preset angle θ between the connection line between the detection piece 202 and the preset evaporation nozzle 301 and the plane where the preset evaporation nozzle 301 is located is ensured.
In this embodiment, the shape of the laser source 3 may be a long cylinder, but may also be other shapes, for example, a rectangle, a circular truncated cone, or a cone, which is not limited herein. In addition, can adopt infrared laser source 3 among the laser source 3, improve the visibility of laser to, adopt lithium electronic type battery as the power among the laser source 3, need not to produce the interference to correcting detection piece 202 position through power cord external power source, avoid the power cord.
In this embodiment, in order to improve the stability of the detecting element 202 in detecting the evaporation rate, a connecting line between the detecting element 202 and the predetermined evaporation nozzle 301 is a connecting line between a center point of the detecting element 202 and a center point of the predetermined evaporation nozzle 301, therefore, an orthographic projection of the mounting hole 21 on a side of the cover plate 1 away from the housing 201 is located at a center of an orthographic projection of the detecting hole 203 on a side of the housing 201 close to the cover plate 1, and the center points of the laser source 3 and the detecting element 202 can be located on the same straight line, so that the laser can replace the connecting line between the center point of the detecting element 202 and the center point of the predetermined evaporation nozzle 301, thereby improving the accuracy in correcting the position of the detecting element 202.
In some embodiments, referring to fig. 1 to 3, 6 and 7, the calibration device further includes a base 2 connected to the cover plate 1, a mounting hole 21 is located in the base 2, and the laser source 3 is connected to the base 2 through the mounting hole 21. That is, the mounting hole 21 may not be disposed on the cover plate 1, but disposed in the base 2, and then the base 2 is connected to the cover plate 1, and the laser source 3 is connected to the base 2, so that the cover plate 1 may not be directly connected to the laser source 3, and thus the thickness of the cover plate 1 may be made thinner, thereby saving cost.
In this embodiment, please refer to fig. 3, fig. 5 and fig. 7, an orthographic projection of the base 2 on a side of the cover plate 1 away from the housing 201 is overlapped with an orthographic projection of the detection hole 203 on a side of the housing 201 close to the cover plate 1, that is, the base 2 and the mounting hole 21 are located on the same straight line, and the orthographic projections of the base 2 and the mounting hole 21 may have the same size, when the mounting hole 21 is located at the center of the base 2, the mounting hole 21 is also correspondingly located at the center of the detection hole 203, so that the laser also corresponds to the center of the detection hole 203, which is beneficial for the laser to correspond to the center point of the detection piece 202, so that the laser may replace the connecting line between the center point of the detection piece 202 and the center point of the preset evaporation nozzle 301, so as to improve the accuracy of correcting the position of the detection piece 202.
In this embodiment, the orthographic projections of the base 2 and the detection hole 203 may be both circular, and the diameter R1 of the orthographic projection of the base 2 on the side of the cover plate 1 away from the housing 201 is the same as the diameter R2 of the orthographic projection of the detection hole 203 on the side of the housing 201 close to the cover plate 1. Of course, the orthographic projection of the base 2 and the detection hole 203 may also be other shapes, such as a rectangle, a triangle, or a pentagon, and the application is not limited herein.
In some embodiments, referring to fig. 3, fig. 5 and fig. 7, an orthographic projection of the cover plate 1 on a side of the housing 201 close to the cover plate 1 overlaps with an orthographic projection of the housing 201 on a side of the cover plate 1 close to the housing 201, that is, the size of the orthographic projection of the cover plate 1 and the size of the orthographic projection of the housing 201 may be the same, the cover plate 1 may just cover the housing 201, and the edges of the two are flush, which is beneficial to overlapping the orthographic projection of the base 2 and the detection hole 203, so as to improve the accuracy of correcting the position of the detection element 202.
In this embodiment, the orthographic projections of the cover plate 1 and the housing 201 may be both circular, and the diameter R3 of the orthographic projection of the cover plate 1 on the side of the housing 201 close to the cover plate 1 is the same as the diameter R4 of the orthographic projection of the housing 201 on the side of the cover plate 1 close to the housing 201. Of course, the orthographic projection of the cover plate 1 and the housing 201 may also be other shapes, such as a rectangle, a triangle or a pentagon, and the application is not limited herein.
In some embodiments, referring to fig. 1, fig. 2, fig. 4, fig. 6 and fig. 7, the cover plate 1 has at least one second threaded hole 11 corresponding to at least one first threaded hole 204 on the housing 201, and a screw 4 can be used to connect the cover plate 1 and the housing 201 through the first threaded hole 204 and the second threaded hole 11 to facilitate the connection and the disconnection between the cover plate 1 and the housing 201.
In this embodiment, the number of the first threaded holes 204 and the second threaded holes 11 is at least two, and since the at least two first threaded holes 204 correspond to the at least two second threaded holes 11, when the at least two screws 4 are used to respectively penetrate through the at least two first threaded holes 204 and the at least two second threaded holes 11, the connection position between the cover plate 1 and the housing 201 is fixed, so that the relative position between the cover plate 1 and the housing 201 is not changed, therefore, by reasonably setting the positions of the first threaded holes 204 and the second threaded holes 11, when the cover plate 1 is connected with the housing 201, the orthographic projection of the base 2 overlaps with the orthographic projection of the detection hole 203, which is beneficial to improving the accuracy of correcting the position of the detection member 202.
In some embodiments, the mounting hole 21 is a third threaded hole, and the laser source 3 has an external thread adapted to the third threaded hole. Through external screw thread and the cooperation of third screw hole, can install laser source 3 on apron 1 or base 2 in will giving laser source 3 screw in mounting hole 21 promptly, be convenient for laser source 3 and apron 1 or base 2 between be connected and dismantle.
In addition, the orthographic projections of the laser source 3 and the mounting hole 21 on the surface of the cover plate 1 away from the shell 201 can be overlapped, so that the laser emitted by the laser source 3 corresponds to the center of the detection piece 202, and the accuracy of correcting the position of the detection piece 202 is improved.
In this embodiment, referring to fig. 3, the orthographic projections of the laser source 3 and the mounting hole 21 may be both circular, and the diameter R5 of the orthographic projection of the laser source 3 on the side of the cover plate 1 away from the housing 201 is the same as the diameter R6 of the orthographic projection of the mounting hole 21 on the side of the cover plate 1 away from the housing 201. Of course, the orthographic projection of the laser source 3 and the mounting hole 21 may have other shapes, such as a rectangle, a triangle, or a pentagon, which is not limited herein.
In some embodiments, the base 2 and the cover plate 1 are integrally formed, so that the overall strength of the base 2 and the cover plate 1 is improved, and the position stability of the calibration detection member 202 is improved.
In this embodiment, the base 2 and the cover plate 1 may be made of the same material, for example, stainless steel, iron, copper or aluminum alloy, which is not limited herein. In addition, the thickness of the cover plate 1 may be 1.3mm to 1.7mm, and of course, the thickness of the cover plate 1 may be set to other values according to practical situations, and the application is not limited herein.
In some embodiments, referring to fig. 9, in order to more accurately correct the position of the detecting element 202, the evaporation source 300 may further include a cover 303 covering the predetermined evaporation nozzle 301, wherein the center of the cover 303 corresponds to the center of the predetermined evaporation nozzle 301, and the center of the cover 303 is provided with a target. When the position of the detecting member 202 is corrected, the laser light emitted from the laser light source 3 is irradiated onto the target. After the calibration of the detecting member 202 is completed, the cover 303 can be removed from the predetermined evaporation nozzle 301, thereby preventing the influence of the evaporation coating.
In this embodiment, the size of the target is larger than the size of the spot of the laser emitted by the laser source 3, so as to facilitate the laser to irradiate on the target, for example, the diameter of the target may be 2mm, and the diameter of the spot of the laser is 0.8mm, and of course, the diameter of the target and the diameter of the spot of the laser may both be set to other values according to practical situations, and the present application is not limited herein.
In addition, the range distance of laser is greater than laser source 3 and predetermines the distance between the evaporation nozzle 301 to ensure that laser can shine to the bull's eye, for example, the range distance of laser can be greater than 100cm, of course, the range distance of laser can set up other values according to actual conditions, and this application does not do the restriction here.
In this embodiment, the shape of the cover 303 may be a cylinder to facilitate covering the cover 303 on the preset evaporation nozzle 301, but of course, the shape of the cover 303 may also be other shapes, for example, a rectangle or a circular truncated cone, and the application is not limited herein.
Referring to fig. 9, based on the calibration apparatus 100, an evaporation apparatus is further provided in an embodiment of the present application, including: the detection device 200 comprises a housing 201 and a detection piece 202 positioned in the housing 201, the housing 201 is provided with a detection hole 203 exposing the detection piece 202, the detection piece 202 is used for detecting the evaporation rate of the evaporation source 300, and the correction device 100 is connected with the detection device 200 and is used for emitting laser to irradiate a preset evaporation nozzle 301 of the evaporation source 300.
It should be noted that, when the detection device 200 is installed for multiple times, because the installation hole 21 is located in the extending direction of the detection hole 203 of the detection device 200 perpendicular to the cover plate 1, that is, the installation hole 21 and the detection hole 203 are located on the same straight line, the laser source 3 is also located in the extending direction of the detection hole 203 perpendicular to the cover plate 1, and is located on the same straight line as the detection piece 202, therefore, the correction device 100 emits laser light to the preset evaporation nozzle 301 of the evaporation source 300 through the laser source 3 to adjust the preset angle θ between the planes of the detection piece 202 and the preset evaporation nozzle 301, so as to correct the position of the detection piece 202, so that when the detection device 200 is installed for multiple times, the detection piece 202 can be fixed at the same position, so that the preset angle θ between the plane of the detection piece 202 and the preset evaporation nozzle 301 is formed, thereby preventing the position of the detection piece 202 from deviating, and there is no need to greatly adjust various parameters of the evaporation source 300, thereby preventing the evaporation rate detected by the detection piece 202 from deviating, and further improving the detection accuracy and stability of the evaporation rate.
Referring to fig. 10, based on the calibration apparatus 100, an embodiment of the present invention further provides a calibration method, including:
step S1, movably installing a detection device 200 in an evaporation source;
step S2, connecting the calibration device 100 and the detection device 200 as described above;
and S3, opening the laser source 3 and adjusting the position of the detection device 200, so that the laser emitted by the laser source 3 irradiates the preset evaporation nozzle 301 of the evaporation source 300, and then fixing the detection device 200.
It should be noted that the evaporation source 300 may include a cavity and an evaporation crucible located in the cavity, the evaporation nozzle 302 is disposed on the evaporation crucible, and the detection device 200 may be installed on the cavity of the evaporation source 300. When the detection device 200 is installed for multiple times, because the installation hole 21 is located in the direction in which the detection hole 203 of the detection device 200 is perpendicular to the extension direction of the cover plate 1, that is, the installation hole 21 and the detection hole 203 are located on the same straight line, the laser source 3 is also located in the direction in which the detection hole 203 is perpendicular to the extension direction of the cover plate 1, and is located on the same straight line as the detection piece 202, the correction device 100 emits laser through the laser source 3 to irradiate the preset evaporation nozzle 301 of the evaporation source 300, so as to adjust the preset angle θ between the planes in which the detection piece 202 and the preset evaporation nozzle 301 are located, and thus correct the position of the detection piece 202, when the detection device 200 is installed for multiple times, the detection piece 202 can be fixed at the same position, so that the preset angle θ between the plane in which the detection piece 202 and the preset evaporation nozzle 301 are located is present, thereby preventing the position of the detection piece 202 from deviating, and there is no need to substantially adjust various parameters of the evaporation source 300, thereby preventing the evaporation rate detected by the detection piece 202 from deviating, and further improving the detection accuracy and the stability of the evaporation rate.
In the above embodiments, the descriptions of the respective embodiments have respective emphasis, and parts that are not described in detail in a certain embodiment may refer to the above detailed descriptions of other embodiments, and are not described herein again.
In specific implementation, each component or structure may be implemented as an independent entity, or may be combined arbitrarily, and implemented as the same entity or several entities, where specific implementation of each component or structure may refer to the foregoing embodiment, and details are not described herein.
The above detailed description is provided for the calibration apparatus, the evaporation apparatus, and the calibration method provided in the embodiments of the present invention, and the principle and the embodiment of the present invention are described herein by applying specific examples, and the description of the above embodiments is only provided to help understanding the method and the core idea of the present invention; meanwhile, for those skilled in the art, according to the idea of the present invention, the specific embodiments and the application range may be changed, and in summary, the content of the present specification should not be construed as limiting the present invention.
Claims (10)
1. A correcting device for connecting a detection device, wherein the detection device comprises a shell and a detection piece positioned in the shell, the shell is provided with a detection hole for exposing the detection piece, the detection piece is used for detecting the evaporation rate of an evaporation source, the evaporation source comprises an evaporation nozzle, and the correcting device is characterized by comprising: a cover plate and a laser source;
the cover plate is connected with the shell, and the cover plate is provided with a mounting hole which is positioned in the extending direction of the detection hole vertical to the cover plate;
the laser source is connected with the cover plate through the mounting hole and used for emitting laser to irradiate the preset evaporation nozzle of the evaporation source.
2. The correction device according to claim 1, wherein an emission direction of the laser source is located in the extending direction in which the mounting hole is perpendicular to the cover plate.
3. The alignment device of claim 2 wherein the orthographic projection of said mounting hole on the side of said cover plate remote from said housing is centered on the orthographic projection of said detection hole on the side of said housing adjacent said cover plate.
4. The alignment device of claim 1 further comprising a base coupled to the cover plate, the mounting holes being located in the base, the laser source being coupled to the base through the mounting holes.
5. The device of claim 4 wherein an orthographic projection of said base on a side of said cover remote from said housing overlaps an orthographic projection of said detection aperture on a side of said housing proximate said cover.
6. The device of claim 1 wherein an orthographic projection of said cover on a side of said housing adjacent said cover overlaps an orthographic projection of said housing on a side of said cover adjacent said housing.
7. The device of any one of claims 1 to 6, wherein the cover plate has at least one second threaded hole thereon corresponding to the at least one first threaded hole on the housing.
8. The device of any one of claims 1 to 6, wherein the mounting hole is a third threaded hole, and the laser source has an external thread thereon adapted to the third threaded hole.
9. An evaporation apparatus, comprising: a detection device, a vapor deposition source, and the correction device according to any one of claims 1 to 8;
the detection device comprises a shell and a detection piece positioned in the shell, wherein the shell is provided with a detection hole for exposing the detection piece, and the detection piece is used for detecting the evaporation rate of an evaporation source;
the correcting device is connected with the detecting device and used for emitting laser to irradiate the preset evaporation nozzle of the evaporation source.
10. A method of calibration, comprising:
movably mounting a detection device in an evaporation source;
connecting a correction device according to any one of claims 1 to 8 to the detection device;
and opening the laser source and adjusting the position of the detection device, so that the laser emitted by the laser source is irradiated to a preset evaporation nozzle of an evaporation source, and then fixing the detection device.
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Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003096557A (en) * | 2001-09-25 | 2003-04-03 | Sanyo Electric Co Ltd | Apparatus and method for manufacturing organic el element |
| CN202099376U (en) * | 2011-05-06 | 2012-01-04 | 宁波表面工程研究中心 | Surface film deposition device |
| CN102400103A (en) * | 2011-10-31 | 2012-04-04 | 友达光电股份有限公司 | Vapor deposition apparatus and vapor deposition method |
| CN203349788U (en) * | 2013-05-22 | 2013-12-18 | 光驰科技(上海)有限公司 | Optical film thickness monitoring system |
| JP2014123505A (en) * | 2012-12-21 | 2014-07-03 | Konica Minolta Inc | Vapor deposition device and vapor deposition method |
| JP2014133907A (en) * | 2013-01-08 | 2014-07-24 | Mitsubishi Electric Corp | Film deposition device |
| CN204918742U (en) * | 2015-08-31 | 2015-12-30 | 上海和辉光电有限公司 | Be used for improving evaporation source consent device |
| CN107287575A (en) * | 2017-05-22 | 2017-10-24 | 茆胜 | Coating system and film plating process |
| CN209113979U (en) * | 2018-09-28 | 2019-07-16 | 北京铂阳顶荣光伏科技有限公司 | Heating system and deposition system is deposited |
| CN209128528U (en) * | 2018-10-24 | 2019-07-19 | 广东聚华印刷显示技术有限公司 | Evaporation coating device |
| CN110670044A (en) * | 2019-11-27 | 2020-01-10 | 昆山国显光电有限公司 | Film formation thickness detection device, detection method and evaporation equipment |
| CN111118466A (en) * | 2018-10-31 | 2020-05-08 | 佳能特机株式会社 | Alignment system, film forming apparatus, alignment method, film forming method, and method for manufacturing electronic device |
| CN112319069A (en) * | 2020-09-18 | 2021-02-05 | 季华实验室 | Laser displacement sensor correction method and device and ink-jet printer |
| CN112458407A (en) * | 2020-11-27 | 2021-03-09 | 江苏集萃有机光电技术研究所有限公司 | Crystal oscillator measuring system, measuring method and device |
| CN112824553A (en) * | 2019-11-20 | 2021-05-21 | 佳能特机株式会社 | Alignment apparatus, alignment method, film forming apparatus, and film forming method |
-
2021
- 2021-05-24 CN CN202110564237.2A patent/CN115386843B/en active Active
Patent Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003096557A (en) * | 2001-09-25 | 2003-04-03 | Sanyo Electric Co Ltd | Apparatus and method for manufacturing organic el element |
| CN202099376U (en) * | 2011-05-06 | 2012-01-04 | 宁波表面工程研究中心 | Surface film deposition device |
| CN102400103A (en) * | 2011-10-31 | 2012-04-04 | 友达光电股份有限公司 | Vapor deposition apparatus and vapor deposition method |
| JP2014123505A (en) * | 2012-12-21 | 2014-07-03 | Konica Minolta Inc | Vapor deposition device and vapor deposition method |
| JP2014133907A (en) * | 2013-01-08 | 2014-07-24 | Mitsubishi Electric Corp | Film deposition device |
| CN203349788U (en) * | 2013-05-22 | 2013-12-18 | 光驰科技(上海)有限公司 | Optical film thickness monitoring system |
| CN204918742U (en) * | 2015-08-31 | 2015-12-30 | 上海和辉光电有限公司 | Be used for improving evaporation source consent device |
| CN107287575A (en) * | 2017-05-22 | 2017-10-24 | 茆胜 | Coating system and film plating process |
| CN209113979U (en) * | 2018-09-28 | 2019-07-16 | 北京铂阳顶荣光伏科技有限公司 | Heating system and deposition system is deposited |
| CN209128528U (en) * | 2018-10-24 | 2019-07-19 | 广东聚华印刷显示技术有限公司 | Evaporation coating device |
| CN111118466A (en) * | 2018-10-31 | 2020-05-08 | 佳能特机株式会社 | Alignment system, film forming apparatus, alignment method, film forming method, and method for manufacturing electronic device |
| CN112824553A (en) * | 2019-11-20 | 2021-05-21 | 佳能特机株式会社 | Alignment apparatus, alignment method, film forming apparatus, and film forming method |
| CN110670044A (en) * | 2019-11-27 | 2020-01-10 | 昆山国显光电有限公司 | Film formation thickness detection device, detection method and evaporation equipment |
| CN112319069A (en) * | 2020-09-18 | 2021-02-05 | 季华实验室 | Laser displacement sensor correction method and device and ink-jet printer |
| CN112458407A (en) * | 2020-11-27 | 2021-03-09 | 江苏集萃有机光电技术研究所有限公司 | Crystal oscillator measuring system, measuring method and device |
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| Publication number | Publication date |
|---|---|
| CN115386843B (en) | 2024-03-01 |
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