CN115355680A - Automatic wafer spin-drying device - Google Patents
Automatic wafer spin-drying device Download PDFInfo
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- CN115355680A CN115355680A CN202211277437.0A CN202211277437A CN115355680A CN 115355680 A CN115355680 A CN 115355680A CN 202211277437 A CN202211277437 A CN 202211277437A CN 115355680 A CN115355680 A CN 115355680A
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- limiting
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B11/00—Machines or apparatus for drying solid materials or objects with movement which is non-progressive
- F26B11/02—Machines or apparatus for drying solid materials or objects with movement which is non-progressive in moving drums or other mainly-closed receptacles
- F26B11/08—Machines or apparatus for drying solid materials or objects with movement which is non-progressive in moving drums or other mainly-closed receptacles rotating about a vertical or steeply-inclined axis
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
- F26B25/001—Handling, e.g. loading or unloading arrangements
- F26B25/003—Handling, e.g. loading or unloading arrangements for articles
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
- F26B25/02—Applications of driving mechanisms, not covered by another subclass
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B25/00—Details of general application not covered by group F26B21/00 or F26B23/00
- F26B25/06—Chambers, containers, or receptacles
- F26B25/14—Chambers, containers, receptacles of simple construction
- F26B25/16—Chambers, containers, receptacles of simple construction mainly closed, e.g. drum
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides an automatic device that spin-dries of wafer, includes: workstation, bearing mechanism, transfer mechanism, moving mechanism. A tank body is arranged in the center of the workbench; the bearing mechanism comprises a rotating seat which is rotatably arranged in the tank body, a plurality of bearing units are arranged on the rotating seat, and each bearing unit comprises a bearing seat which moves along the radius of the rotating seat and is used for bearing the wafer frame; the transfer mechanism is arranged above the workbench and comprises a supporting plate moving along the vertical direction, and two clamping parts which are symmetrically arranged and synchronously move and rotate in the radial direction are arranged on the supporting plate; the moving mechanism is arranged on the periphery of the tank body and is arranged on the bottom surface of the workbench, and comprises a plurality of moving units which are uniformly arranged along the circumferential direction at intervals, each moving unit comprises two rotating rods which are symmetrically arranged, and the rotating rods rotate around the axes of the rotating rods while moving along the axial direction of the rotating rods, so that the bearing seat can be moved. The wafer frame can be automatically transferred and limited in the spin-drying process, so that the transfer efficiency is improved, and the labor intensity is reduced.
Description
Technical Field
The invention relates to the technical field of chip production and processing equipment, in particular to an automatic wafer spin-drying device.
Background
Wafers are silicon wafers used in the fabrication of semiconductor chips, and various circuit structures are fabricated on the surface of the wafer to make it an electronic component having a specific electrical function. In the production process of semiconductor chips, wafers need to be subjected to corrosion process treatment for multiple times, the wafers need to be cleaned after each corrosion, the residue of corrosive liquid is reduced to the greatest extent, and a large amount of water drops are attached to the surfaces of the wafers after the cleaning is finished. In the prior art, the method for cleaning water drops on the surface of the wafer is that the wafer is placed in a spin dryer for spin-drying, the placing process is carried out manually, and in the process of spin-drying the wafer, because the rotation speed is high, the weight of a common wafer frame is large in order to ensure the stability, so that the process of manually taking the wafer frame is very labor-consuming.
Disclosure of Invention
To the not enough of above-mentioned relevant prior art, this application provides an automatic device that spin-dries of wafer, can shift the wafer frame automatically to carry on spacingly to it at the in-process that spin-dries, when improving transfer efficiency, alleviate intensity of labour again, have stronger practicality.
In order to achieve the above object, the present invention employs the following techniques:
an automatic wafer spin-drying device, comprising: workstation, bearing mechanism, transfer mechanism, moving mechanism.
A tank body is arranged in the center of the workbench, and concave parts for passing through the conveyor belt are arranged on two sides of the tank body of the workbench; the bearing mechanism comprises a rotating seat which is rotatably arranged in the tank body, the bottom surface of the rotating seat has a preset distance from the bottom of the tank body, a plurality of bearing units which are uniformly spaced are arranged on the rotating seat along the circumferential direction, each bearing unit comprises a bearing seat which moves along the radius of the rotating seat and is used for bearing a wafer frame, and limiting plates are further arranged at two ends of the bearing seat in the length direction and are used for limiting the wafer frame; the transfer mechanism is arranged above the workbench and comprises a supporting plate moving along the vertical direction, and two clamping parts which are symmetrically arranged and synchronously move and rotate in the radial direction are arranged on the supporting plate and used for clamping the wafer frame; the moving mechanism is arranged on the periphery of the tank body and is arranged on the bottom surface of the workbench, and comprises a plurality of moving units which are uniformly arranged along the circumferential direction at intervals, each moving unit comprises two rotating rods which are symmetrically arranged, and the rotating rods rotate around the axes of the rotating rods when moving along the axial direction of the rotating rods, so that the bearing seat can be moved.
Furthermore, two symmetrically-arranged sliding chutes are respectively formed in two ends of the bearing seat in the length direction, sliding rods are arranged in the sliding chutes, first springs are sleeved on the sliding rods, the lower end of each limiting plate is sleeved on the corresponding sliding rod, two ends of each first spring are connected with the inner side face of each limiting plate and one end of each sliding chute respectively, and the first springs are in a stretching state all the time.
Further, bear seat length direction both ends and still be equipped with the first spacing hole that runs through, it is equipped with the spacing hole of a plurality of seconds along the circumferencial direction to rotate the seat, and during the application, first spacing hole is aligned with the spacing hole of second, wear to be equipped with the stopper in the spacing hole of second, the stopper lower extreme is equipped with the connecting rod, the connecting rod lower extreme wears to locate on the link, the link is installed in rotating the seat bottom, still the cover is equipped with the second spring on the connecting rod, the bottom of link and stopper is received respectively to the second spring both ends, the connecting rod lower extreme still is equipped with the baffle, the link bottom surface is received in the baffle butt, during the application, first spacing hole is passed to the stopper upper end, and at least some is located first spacing hole top.
Further, the baffle bottom surface is equipped with the T-shaped groove along rotating a diameter direction, and the T-shaped inslot cooperation has the T-shaped piece, and T-shaped piece below is connected in the fourth telescopic link, and the stiff end of fourth telescopic link is connected on the removal of first horizontal straight line mechanism is served, and first horizontal straight line mechanism is installed in jar body bottom.
Furthermore, the center of the rotating seat is also provided with a vertical rod, and the upper end of the vertical rod is provided with a plurality of clamping plates with uniform intervals along the circumferential direction and used for limiting the wafer frame.
Further, the limiting plate lateral surface still is equipped with branch, and the branch side is equipped with the rectangular hole that runs through, bears a weight of seat length direction both ends and still is equipped with transverse arrangement's gag lever post respectively, and the gag lever post is installed on rotating the seat, and during the gag lever post wore to locate rectangular hole, the one end lateral surface that the limiting plate was kept away from to the gag lever post still was equipped with the rake, and the length in rectangular hole is greater than the distance that the limiting plate removed, and the thickness of rake equals the distance that the limiting plate removed.
Furthermore, the surface of the rotating seat is provided with a plurality of spacing grooves with uniform intervals along the circumferential direction, the bottom surface of the bearing seat is provided with a guide block, the guide block is arranged in the spacing grooves, the spacing grooves are also provided with guide rods, and the guide rods are sleeved with the guide blocks.
Further, the both sides face that the spacing groove is close to the one end at rolling seat center all is equipped with the recess, wear to be equipped with the fixture block in the recess, one side that the rolling seat center was kept away from to the fixture block is the arc, the guide block both sides face all is equipped with the draw-in groove, during the application, fixture block one end is located the draw-in groove, recess one end still is equipped with vertical arrangement and runs through the perpendicular groove of rolling seat bottom surface, and separate with the baffle between recess and the perpendicular groove, the fixture block other end is equipped with the nose bar, nose bar one end is passed the baffle and is arranged in perpendicular groove, it is equipped with the third spring still to overlap on the nose bar, fixture block and baffle are received respectively at the third spring both ends, still be equipped with on the nose bar and keep off the ring, keep off the ring and be arranged in perpendicular inslot, be used for receiving the baffle.
Furtherly, nose bar one end still is equipped with the connecting block, and the connecting block both sides all are equipped with the chute, and the chute orientation is close to the one end tilt up of fixture block, rotates the seat below and still is equipped with the U-shaped frame, and U-shaped frame below is connected in the removal end of third telescopic link, and the third telescopic link is installed in the bottom of the jar body, and U-shaped frame both ends all are equipped with two symmetrical arrangement's push rod, and during the application, the push rod gets into and erects in the groove to cooperate with the chute.
Further, the backup pad surface is equipped with two guide ways that are central symmetry, the guide way includes straightway and segmental arc, the length direction of the length direction perpendicular to concave part of straightway, the segmental arc is located the region of the jar body, wear to be equipped with the slider in the guide way, slider top surface and bottom surface all are equipped with the flange, and perpendicular to each other between two flanges, wherein the flange that is located the top surface is connected with the removal end of first telescopic link, the stiff end of first telescopic link is installed on the turning block, the turning block is rotationally installed in the backup pad, the turning block cover is located in the axis of rotation, the axis of rotation is worn to locate on the support, and first motor is connected to axis of rotation one end, first motor is installed on the support, the support is located in the backup pad.
Furthermore, the clamping part comprises two clamping blocks which are symmetrically arranged, the two sides of the convex plate positioned on the bottom surface are both provided with second telescopic rods, the clamping blocks are respectively connected to the moving ends of the second telescopic rods, the structure of each clamping block is L-shaped, and the horizontal parts of the two clamping blocks face the convex plate.
Furthermore, one end of the rotating rod penetrates through the moving block, the moving block is connected to the moving end of the second horizontal linear mechanism, the second horizontal linear mechanism is installed on the bottom surface of the workbench and located in the diameter direction of the second horizontal linear mechanism, one end of the moving block is connected with the second motor, the second motor is installed on the moving block, the other end of the rotating rod is arranged in a hollow mode, threads are arranged in the rotating rod, one side, away from the center of the rotating seat, of the guide block is provided with a threaded rod, one end, away from the center of the rotating seat, of the limiting groove is also provided with a through hole, and when the guide block is used, the other end of the rotating rod penetrates through the through hole and is connected with the threaded rod.
The invention has the beneficial effects that:
1. the wafer frame can be automatically transferred into the tank body for spin-drying, and is limited in the spin-drying process, and because the wafer frame is limited in all directions in the spin-drying process, the wafer frame can be made of lighter materials, so that the wafer frame is convenient for workers to take, the transfer efficiency is improved, and the labor intensity is reduced;
2. the bearing mechanism limits the wafer frame by utilizing the combined action of the limiting plate and the limiting rod, so that the wafer frame is kept stable in the rotating process, the wafer is prevented from being broken as much as possible, the bearing seat can move along the diameter direction of the rotating seat, the wafer frame can be smoothly placed into the bearing unit by the transfer mechanism, and the clamping block and the limiting block can be actively retracted, so that the smooth movement of the bearing seat is ensured;
3. the water tanks are arranged on two sides of the limiting groove of the rotating seat, so that water drops thrown off from the wafer flow into the tank body from the water tanks, the water drops are prevented from being gathered in the limiting groove, meanwhile, the edge of the inner part of the tank body is lower than the center of the tank body, liquid flows out from the edge of the tank body, and other parts are prevented from being influenced by the liquid gathered in the tank body;
4. the clamping part can move along the linear direction of the first telescopic rod and can rotate along the arc-shaped section of the guide groove, so that the wafer frame clamped by the clamping part can be smoothly placed into the bearing unit;
5. the internal thread is arranged at one end of the rotating rod, and the rotating rod can move along the axis direction and can rotate, so that the automatic movement of the bearing seat is realized.
Drawings
The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present disclosure.
Fig. 1 is a perspective view of the overall structure of an embodiment of the present application.
Fig. 2 is a front view of an embodiment of the present application.
Fig. 3 is a schematic cross-sectional structure diagram of a carrying mechanism according to an embodiment of the present application.
Fig. 4 is an enlarged schematic view of a portion a of fig. 3.
Fig. 5 is an enlarged schematic view of B of fig. 3.
Fig. 6 is a schematic mounting diagram of a carrying unit according to an embodiment of the present application.
Fig. 7 is a perspective view of a rotating base according to an embodiment of the present application.
Fig. 8 is a perspective view of a carrying unit according to an embodiment of the present application.
Fig. 9 is a schematic bottom view perspective view of a carrying unit according to an embodiment of the application.
Fig. 10 is a perspective view of a transfer mechanism according to an embodiment of the present application.
Fig. 11 is a perspective view of a moving mechanism according to an embodiment of the present application.
Description of reference numerals: 100-workbench, 200-bearing mechanism, 300-transferring mechanism, 400-moving mechanism, 101-tank, 102-concave part, 201-rotating seat, 202-bearing seat, 203-limit plate, 204-sliding groove, 205-sliding rod, 206-first spring, 207-limit groove, 208-guide block, 209-guide rod, 210-threaded rod, 211-through hole, 212-first limit hole, 213-second limit hole, 214-limit block, 215-connecting rod, 216-connecting frame, 217-second spring, 218-baffle, 219-supporting rod, 220-elongated hole, 221-limit rod, 222-groove, 223-clamping block, 224-clamping groove, 225-vertical groove, 226-baffle 227-convex rod, 228-third spring, 229-baffle ring, 230-connecting block, 231-inclined groove, 232-U-shaped frame, 233-third telescopic rod, 234-push rod, 235-upright rod, 236-clamping plate, 237-T-shaped groove, 238-T-shaped block, 239-fourth telescopic rod, 240-rotating shaft, 241-third motor, 242-positioning groove, 243-water groove, 301-supporting plate, 302-guiding groove, 303-sliding block, 304-convex plate, 305-first telescopic rod, 306-rotating block, 307-rotating shaft, 308-bracket, 309-first motor, 310-clamping block, 311-second telescopic rod, 401-rotating shaft, 402-moving block and 403-second motor.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the following detailed description of the embodiments of the present invention is provided with reference to the accompanying drawings, but the described embodiments of the present invention are a part of the embodiments of the present invention, not all of the embodiments of the present invention.
As shown in fig. 1 to 11, the embodiment of the present application provides an automatic spin-drying device for a wafer, including: a work table 100, a carrying mechanism 200, a transferring mechanism 300 and a moving mechanism 400.
A tank body 101 is arranged in the center of the workbench 100, concave parts 102 for passing through a conveyor belt are arranged on two sides of the tank body 101 of the workbench 100, and the conveyor belt conveys the wafer frames to two sides of the tank body 101; the bearing mechanism 200 comprises a rotating seat 201 which is rotatably arranged in the tank body 101, the bottom surface of the rotating seat 201 has a preset distance from the bottom of the tank body 101, a plurality of bearing units with uniform intervals are arranged on the rotating seat 201 along the circumferential direction, each bearing unit comprises a bearing seat 202 which moves along the radius of the rotating seat 201 and is used for bearing a wafer frame, and limiting plates 203 are further arranged at two ends of the bearing seat 202 in the length direction and are used for limiting the wafer frame; the transfer mechanism 300 is arranged above the workbench 100 and comprises a support plate 301 moving along the vertical direction, and two clamping parts which are symmetrically arranged and synchronously move and rotate in the radial direction are arranged on the support plate 301 and used for clamping the wafer frame; the moving mechanism 400 is disposed on the periphery of the tank 101 and mounted on the bottom surface of the worktable 100, and includes a plurality of moving units uniformly arranged at intervals along the circumferential direction, and each moving unit includes two rotating rods 401 symmetrically arranged, and the rotating rods 401 rotate around their axes while moving along their axes for moving the carrying base 202.
Specifically, as shown in fig. 2 to 3, a rotating shaft 240 is disposed on the bottom surface of the rotating base 201, the lower end of the rotating shaft 240 penetrates through the tank 101 and is connected to a third motor 241, and in order to ensure that the rotating base 201 is stable during the rotation process, a ring groove is further disposed on the bottom surface of the rotating base 201 along the circumferential direction, a plurality of support rods uniformly arranged at intervals are disposed on the bottom surface of the inside of the tank 101 along the circumferential direction, and the upper ends of the support rods are fitted in the ring groove.
Specifically, as shown in fig. 8 to 9, two symmetrically arranged sliding grooves 204 are respectively disposed at two ends of the bearing seat 202 in the length direction, a sliding rod 205 is disposed in the sliding groove 204, a first spring 206 is sleeved on the sliding rod 205, the lower end of the limiting plate 203 is sleeved on the sliding rod 205, two ends of the first spring 206 are respectively connected to the inner side surface of the limiting plate 203 and one end of the sliding groove 204, the first spring 206 is always in a stretching state, the wafer frame is placed between the two limiting plates 203, and a plurality of positioning grooves 242 are further disposed on the bearing seat 202, and a bump below the wafer frame is clamped in the positioning groove 242.
Specifically, as shown in fig. 6 to 9, the surface of the rotating seat 201 is provided with a plurality of spacing grooves 207 with uniform intervals along the circumferential direction, the bottom surface of the bearing seat 202 is provided with a guide block 208, the guide block 208 is arranged in the spacing groove 207, the spacing groove 207 is further provided with a guide rod 209, the guide block 208 is sleeved on the guide rod 209, the bearing seat 208 moves along the length direction of the spacing groove 207, and the guide rod 209 plays a role in guiding and spacing.
Specifically, as shown in fig. 3 to 9, two ends of the bearing seat 202 in the length direction are further provided with a first through limiting hole 212, the rotating seat 201 is provided with a plurality of second limiting holes 213 along the circumferential direction, and when the bearing seat 202 is applied, that is, when the bearing seat 202 moves from the outer end to the inner end of the limiting groove 207, the first limiting hole 212 is aligned with the second limiting holes 213, a limiting block 214 penetrates through the second limiting holes 213, and one side of the limiting block 214 away from the center of the rotating seat 201 is arc-shaped, when the bearing seat 202 contacts the limiting block 214, the limiting block 214 can be smoothly pressed into the second limiting holes 213, the lower end of the limiting block 214 is provided with a connecting rod 215, the lower end of the connecting rod 215 is penetrated through the connecting frame 216, the connecting frame 216 is mounted at the bottom of the rotating seat 201, the connecting rod 215 is further sleeved with a second spring 217, two ends of the second spring 217 are respectively abutted to the bottoms of the connecting frame 216 and the limiting block 214, while the second spring 217 is always in a compressed state, when the bearing seat 202 moves towards the center of the rotating seat 201, the limiting block 214 is completely pressed into the second limiting hole 213, the limiting hole 213, and the limiting block 213 penetrates through the limiting hole 213, and the limiting block 218 penetrates through the limiting block 214, and the baffle plate 218 is provided with the limiting block 218, the limiting block 218.
Specifically, as shown in fig. 3 to 9, in order to enable the carrying seat 202 to move smoothly from the inner end to the outer end of the limiting groove 207, a T-shaped groove 237 is formed in the bottom surface of the baffle 218 along the diameter direction of the rotating seat 201, a T-shaped block 238 is fitted in the T-shaped groove 237, the lower portion of the T-shaped block 238 is connected to a fourth telescopic rod 239, the fixed end of the fourth telescopic rod 239 is connected to the moving end of the first horizontal linear mechanism, the first horizontal linear mechanism is installed at the bottom of the tank 101, and the first horizontal mechanism drives the fourth telescopic rod 239 to move, so that the T-shaped block 238 can move out of the T-shaped groove 237, thereby avoiding interference when the rotating seat 201 rotates.
More specifically, as shown in fig. 6, the center of the rotating base 201 is further provided with an upright 235, and a plurality of clamping plates 236 with uniform intervals are arranged at the upper end of the upright 235 along the circumferential direction and used for limiting the upper and lower directions of the wafer frame.
Specifically, as shown in fig. 6 to 9, a support rod 219 is further disposed on the outer side surface of the limiting plate 203, a through elongated hole 220 is disposed on the side surface of the support rod 219, two ends of the bearing seat 202 in the length direction are further provided with a transversely disposed limiting rod 221, the limiting rod 221 is mounted on the rotating seat 201, the limiting rod 221 penetrates through the elongated hole 220, an inclined portion is further disposed on the outer side surface of one end of the limiting rod 221 away from the limiting plate 203, the length of the elongated hole 220 is greater than the moving distance of the limiting plate 203, the thickness of the inclined portion is equal to the moving distance of the limiting plate 203, when the moving mechanism 400 drives the bearing seat 202 to move, the support rod 219 moves along the length direction of the limiting rod 221 until the outer end of the elongated hole 220 contacts with the inclined portion, and the limiting plate 203 moves towards two ends of the bearing seat 202 under the limitation of the inclined portion.
Specifically, as shown in fig. 3 to 9, two side surfaces of one end of the limiting groove 207 close to the center of the rotating seat 201 are provided with a groove 222, a latch 223 penetrates through the groove 222, one side of the latch 223 far away from the center of the rotating seat 201 is arc-shaped, so that when the guide block 208 contacts with the latch 223, the latch 223 can be pressed into the groove 222 by the guide block 208, two side surfaces of the guide block 208 are provided with a latch groove 224, when the bearing seat 202 is located at one end of the limiting groove 207 close to the center of the rotating seat 201, the latch groove 224 is aligned with the groove 222, one end of the latch 223 is located in the latch groove 224, so as to limit the bearing seat 202 and prevent it from sliding freely, one end of the groove 222 is further provided with a vertical groove 225 vertically arranged and penetrating through the bottom surface of the rotating seat 201, and the groove 222 is separated from the vertical groove 225 by a partition 226, the other end of the latch 223 is provided with a protruding rod 227, one end of the protruding rod 227 penetrates through the partition 226 and is located in the vertical groove 225, the protruding rod 227 is further sleeved with a third spring 228, two ends of the third spring 228 respectively abut against the latch 223 and the partition 226, and the partition 229, and the third spring 228 is located in the vertical groove 229, and the partition 229 when the third spring 228 is located in the partition 229, and the partition 229 under the partition 229.
More specifically, as shown in fig. 3 to 4 and 6 to 9, in order that the fixture block 223 does not limit the movement of the bearing seat 202 when the bearing seat 202 moves, a connecting block 230 is further disposed at one end of the protruding rod 227, inclined slots 231 are disposed at both sides of the connecting block 230, the inclined slots 231 incline upward toward one end close to the fixture block 223, a U-shaped frame 232 is further disposed below the rotating seat 201, the lower portion of the U-shaped frame 232 is connected to the moving end of the third telescopic rod 233, the third telescopic rod 233 is mounted at the bottom of the tank 101, two symmetrically disposed push rods 234 are disposed at both ends of the U-shaped frame 232, when in use, the push rods 234 move upward under the pushing of the third telescopic rod 233 and enter the vertical slots 225, and the push rods 234 are engaged with the inclined slots 231, so that the protruding rod 227 moves toward both ends with the continued movement of the push rods 234, and further compresses the third spring 228, and at this time, the fixture block 223 moves out of the fixture block 224.
Specifically, as shown in fig. 1, 2, and 10, two guide grooves 302 are formed in the surface of the support plate 301, the guide grooves 302 are centrosymmetrically, the guide grooves 302 include linear sections and arc sections, the length direction of the linear sections is perpendicular to the length direction of the concave portion 102, the arc sections are located in an area above the tank 101, a slider 303 is inserted into the guide grooves 302, the top surface and the bottom surface of the slider 303 are both provided with a protruding plate 304, and the side surfaces of the two protruding plates 304 are perpendicular to each other, wherein the protruding plate 304 located on the top surface is connected to the moving end of the first telescopic rod 305, the first telescopic rod 305 drives the slider 303 to move along the linear sections of the guide grooves 302, the fixed end of the first telescopic rod 305 is mounted on the rotating block 306, the rotating block 306 is rotatably mounted on the support plate 301, the rotating block 306 is sleeved on the rotating shaft 307, the rotating shaft 307 is inserted on the support 308, one end of the first motor 309 is connected to the first motor 309, the first motor 309 is mounted on the support 308, the support 308 is mounted on the support plate 301, the first motor 309 drives the rotating shaft 307 to rotate, and the rotating block 307 drives the rotating shaft 307 to rotate, so that the sliding block 303 moves along the arc sections.
Specifically, as shown in fig. 10, the clamping portion includes two clamping blocks 310 symmetrically arranged, the two sides of the protruding plate 304 on the bottom surface are both provided with second telescopic rods 311, the clamping blocks 310 are respectively connected to the moving ends of the second telescopic rods 311, the clamping blocks 310 are L-shaped, the horizontal portions of the two clamping blocks 310 face the protruding plate 304, and the two clamping blocks 310 move toward each other, so as to clamp the wafer frame.
Specifically, as shown in fig. 1 and fig. 11, one end of a rotating rod 401 penetrates through a moving block 402, the moving block 402 is connected to a moving end of a second horizontal linear mechanism, the second horizontal linear mechanism is installed on the bottom surface of the workbench 100 and is arranged along the diameter direction of the workbench, one end of the moving block 402 is connected with a second motor 403, the second motor 403 is installed on the moving block 402, the other end of the rotating rod 401 is hollow and is provided with a thread inside, a threaded rod 210 is arranged on one side of a guide block 208 away from the center of the rotating seat 201, and a through hole 211 is also arranged at one end of a limiting groove 207 away from the center of the rotating seat 201 and penetrates through the through hole 211 and is connected with the threaded rod 210, so that the bearing seat 202 is driven to move.
Specifically, as shown in fig. 3 and 6, in order to prevent water drops thrown from the wafer from accumulating on the rotating base 201, water grooves 243 are provided on both side surfaces of one end of the stopper groove 207 away from the center of the rotating base 201, one end of the water groove 243 penetrates through the rotating base 201, and one end of the water groove is inclined downward, and at the same time, the circumferential side of the inner bottom surface of the tank 101 is lower than the center thereof, so that water flows out along the circumferential side of the tank 101.
Specifically, as shown in fig. 2, fig. 3, and fig. 10, the vertical lifting mechanism, the first horizontal linear mechanism, and the second horizontal linear mechanism can be driven by a motor screw rod, that is, the fixed ends of the support plate 301 and the fourth telescopic rod 239, and the moving block 402 are respectively sleeved on one screw rod, and the motor drives the screw rod to rotate, so as to drive the fixed ends of the support plate 301 and the fourth telescopic rod 239, and the moving block 402 to move.
With reference to fig. 1 to fig. 11, the detailed operation of the automatic wafer spin-drying device of the present embodiment is described as follows:
firstly, a wafer frame is conveyed to two sides of a tank body 101 through a conveyor belt, a vertical lifting mechanism is started to enable a supporting plate 301 to descend, then a second telescopic rod 311 is started to enable two clamping blocks 310 to move oppositely, the two clamping blocks 310 clamp handles of the wafer frame, then the vertical lifting mechanism is started again to enable the supporting plate 301 to ascend, at the moment, a first telescopic rod 305 is started to enable two sliding blocks 303 to move oppositely, the sliding blocks 303 move from the outer ends to the inner ends of guide grooves 302, then the supporting plate 301 descends, the wafer frame is placed on a bearing seat 202, a protruding block below the wafer frame is matched in a positioning groove 242, the second telescopic rod 311 is started to enable the two clamping blocks 310 to move reversely, the wafer frame is loosened, the supporting plate 301 ascends again, the operation opposite to the operation is repeated, the wafer frame on the conveyor belt is clamped again, the sliding blocks 303 move oppositely again, at the moment, a first motor 309 is started to drive a rotating shaft 307 to rotate, the rotating shaft 307 drives a rotating block 306 to rotate, so that the rotating shaft 307 drives the rotating block 306 to rotate, the arc-shaped sliding blocks 303 to move along the guide grooves 302, at the supporting plate 301 descends, at the supporting plate 301, the two wafer frame is placed on the bearing seat 202 again, and then the supporting plate 301 ascends again;
then, the second horizontal linear mechanism is started, so that the moving block 402 moves towards the tank body 101, the rotating rod 401 moves along with the moving block, at this time, the second motor 403 is synchronously started, so that the rotating rod 401 is driven to rotate, the threaded portion of the rotating rod 401 is connected with the threaded rod 210, after the connection is stable, the rotating rod 401 stops rotating, at this time, the rotating rod 401 continues to move, and the bearing seat 202 is pushed to move towards the center of the rotating seat 201, in the process, the supporting rod 219 outside the limiting plate 203 gradually moves from the portion with the inclined portion of the limiting rod 221 to the portion without the inclined portion, so that the two limiting plates 203 on the bearing seat 202 move towards each other under the action of the first spring 206 and clamp the wafer frame, and when the bearing seat 202 stops moving, the fixture block 223 is ejected from the groove 222 under the action of the third spring 228, the fixture 223 enters the fixture grooves 224 on the two side faces of the guide block 208, so that the bearing seat 202 is clamped, and the fixture plate 236 contacts with the top face of the wafer frame, so that the wafer frame is limited vertically, the first limiting hole 212 of the rotating seat 202 is aligned with the second limiting seat 201, the second limiting hole 213, and the second limiting plate 213 is ejected from the upper end of the second limiting block 214, so that the stop block 214 is pushed out of the second limiting plate 214, and the stop block 214 is connected with the stop block 213, so that the stop block 214, and the stop block 214 is pushed out of the stop block 213, so that the stop block 214; then, the rotating rod 401 is reversely rotated, and the rotating rod 401 is moved in the direction opposite to the previous direction, so that the rotating rod 401 is moved out of the limit groove 207; at this time, the third motor 241 is started to rotate the rotating base 201, and the wafer is spun;
after the spin-drying is finished, the first horizontal linear mechanism is started to enable the fourth telescopic rod 239 to move towards the connecting frame 216, the T-shaped block 238 above the fourth telescopic rod 239 is matched in the T-shaped groove 237 on the bottom surface of the baffle 218, then the fourth telescopic rod 239 is started to enable the T-shaped block 238 to drive the baffle 218 to descend, so that the limiting block 214 descends until all the T-shaped block enters the second limiting hole 213, meanwhile, the third telescopic rod 233 is synchronously started to enable the U-shaped frame 232 to ascend, the push rod 234 above the U-shaped frame 232 forces the clamping block 223 to move towards the groove 222, so that the limiting on the bearing seat 202 is released, finally, the bearing seat 202 is moved to the initial position by the moving mechanism 400 again, the wafer frame is transferred to the conveying belt by the transfer mechanism 300, and the steps are opposite to the steps and are not repeated.
The above is only a preferred embodiment of the present invention and is not intended to limit the present invention, and it is apparent that those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. The utility model provides an automatic device that spin-dries of wafer which characterized in that includes:
the conveying device comprises a workbench (100), wherein a tank body (101) is arranged in the center of the workbench (100), and concave parts (102) for allowing a conveying belt to pass through are arranged on two sides of the tank body (101) of the workbench (100);
the bearing mechanism (200) comprises a rotating seat (201) rotatably arranged in the tank body (101), the bottom surface of the rotating seat (201) has a preset distance from the bottom of the tank body (101), a plurality of bearing units with uniform intervals are arranged on the rotating seat (201) along the circumferential direction, each bearing unit comprises a bearing seat (202) which radially moves along the rotating seat (201) and is used for bearing a wafer frame, and limiting plates (203) are further arranged at two ends of the bearing seat (202) in the length direction and used for limiting the wafer frame;
the transfer mechanism (300) is arranged above the workbench (100) and comprises a supporting plate (301) moving along the vertical direction, and two clamping parts which are symmetrically arranged and synchronously move and rotate in the radial direction are arranged on the supporting plate (301) and used for clamping the wafer frame;
moving mechanism (400), locate jar body (101) week side and install in the bottom surface of workstation (100) includes a plurality of mobile unit that evenly arrange along the circumferencial direction interval, mobile unit includes dwang (401) of two symmetrical arrangement, just dwang (401) rotate around self axis when moving along its axis direction, are used for removing bear seat (202).
2. The automatic wafer spin-drying device of claim 1, wherein two symmetrically arranged sliding grooves (204) are respectively formed in two ends of the bearing seat (202) in the length direction, a sliding rod (205) is arranged in each sliding groove (204), a first spring (206) is sleeved on each sliding rod (205), the lower end of each limiting plate (203) is sleeved on each sliding rod (205), two ends of each first spring (206) are respectively connected with the inner side surface of each limiting plate (203) and one end of each sliding groove (204), and each first spring (206) is always in a stretching state.
3. The automatic wafer spin-drying device according to claim 1, wherein a first through limiting hole (212) is further formed in each of two ends of the carrier (202) in the length direction, a plurality of second limiting holes (213) are formed in the rotating base (201) in the circumferential direction, and when the device is used, the first limiting holes (212) are aligned with the second limiting holes (213), a limiting block (214) penetrates through each second limiting hole (213), a connecting rod (215) is arranged at the lower end of each limiting block (214), the lower end of each connecting rod (215) penetrates through a connecting frame (216), the connecting frame (216) is mounted at the bottom of the rotating base (201), a second spring (217) is further sleeved on each connecting rod (215), two ends of each second spring (217) are respectively abutted to the bottoms of the connecting frame (216) and the limiting block (214), a baffle (218) is further arranged at the lower end of each connecting rod (215), the baffle (218) is abutted to the bottom surface of the connecting frame (216), and when the device is used, the upper end of each limiting block (214) penetrates through the first limiting hole (212), and at least a part of each limiting hole is located above the corresponding limiting hole (212);
the bottom surface of the baffle plate (218) is provided with a T-shaped groove (237) along the diameter direction of the rotating seat (201), a T-shaped block (238) is matched in the T-shaped groove (237), the lower part of the T-shaped block (238) is connected to a fourth telescopic rod (239), the fixed end of the fourth telescopic rod (239) is connected to the moving end of a first horizontal linear mechanism, and the first horizontal linear mechanism is installed at the bottom of the tank body (101).
4. The automatic wafer spin-drying device of claim 1, wherein an upright (235) is further disposed at the center of the rotating base (201), and a plurality of clamping plates (236) with uniform intervals are disposed at the upper end of the upright (235) along the circumferential direction for limiting the wafer frame.
5. The automatic wafer spin-drying device of claim 1, wherein a support rod (219) is further arranged on the outer side surface of the limiting plate (203), a through elongated hole (220) is formed in the side surface of the support rod (219), transversely arranged limiting rods (221) are further arranged at two ends of the length direction of the bearing seat (202) respectively, the limiting rods (221) are mounted on the rotating seat (201), the limiting rods (221) penetrate through the elongated hole (220), an inclined portion is further arranged on the outer side surface of one end of the limiting plate (203), the length of the elongated hole (220) is larger than the moving distance of the limiting plate (203), and the thickness of the inclined portion is equal to the moving distance of the limiting plate (203).
6. The automatic wafer spin-drying device of claim 1, wherein a plurality of spacing grooves (207) are uniformly arranged on the surface of the rotating base (201) along the circumferential direction, a guide block (208) is arranged on the bottom surface of the carrying base (202), the guide block (208) is arranged in the spacing grooves (207), a guide rod (209) is further arranged in the spacing grooves (207), and the guide block (208) is sleeved on the guide rod (209).
7. The automatic wafer spin-drying device according to claim 6, wherein two side surfaces of one end of the limiting groove (207) close to the center of the rotating base (201) are provided with grooves (222), fixture blocks (223) penetrate through the grooves (222), one side of the fixture blocks (223) far away from the center of the rotating base (201) is arc-shaped, two side surfaces of the guide block (208) are provided with clamping grooves (224), when in use, one end of the fixture blocks (223) is located in the clamping grooves (224), one end of each groove (222) is further provided with vertical grooves (225) which are vertically arranged and penetrate through the bottom surface of the rotating base (201), the grooves (222) and the vertical grooves (225) are separated by partition plates (226), the other ends of the fixture blocks (223) are provided with protruding rods (227), one ends of the protruding rods (227) penetrate through the partition plates (226) and are located in the vertical grooves (225), the protruding rods (227) are further sleeved with third springs (228), two ends of the third springs (228) are respectively connected to the fixture blocks (223) and the partition plates (226), one end of each protruding rod (227) is provided with a blocking ring (229), and the blocking ring (229) for abutting against the vertical ring (229);
protruding rod (227) one end still is equipped with connecting block (230), connecting block (230) both sides all are equipped with chute (231), just chute (231) orientation is close to the one end tilt up of fixture block (223), it still is equipped with U-shaped frame (232) to rotate seat (201) below, the removal end in third telescopic link (233) is connected to U-shaped frame (232) below, third telescopic link (233) install in the bottom of jar body (101), U-shaped frame (232) both ends all are equipped with two symmetrical arrangement's push rod (234), during the application, push rod (234) get into in erecting groove (225), and with chute (231) cooperation.
8. The automatic wafer spin-drying device according to claim 1, wherein two guide grooves (302) are formed in the surface of the support plate (301) in a centrosymmetric manner, each guide groove (302) comprises a straight line section and an arc-shaped section, the length direction of the straight line section is perpendicular to the length direction of the concave portion (102), the arc-shaped section is located in the area of the tank body (101), a sliding block (303) penetrates through the guide grooves (302), the top surface and the bottom surface of the sliding block (303) are both provided with protruding plates (304), the two protruding plates (304) are perpendicular to each other, the protruding plates (304) located on the top surface are connected with the moving end of a first telescopic rod (305), the fixed end of the first telescopic rod (305) is mounted on a rotating block (306), the rotating block (306) is rotatably mounted on the support plate (301), the rotating block (306) is sleeved on the support plate (307), the rotating shaft (307) penetrates through a support (308), one end of the rotating shaft (307) is connected with a first motor (309), the first motor (309) is mounted on the support plate (308), and the support plate (308) is mounted on the support plate (301).
9. The wafer automatic spin-drying device of claim 8, characterized in that the clamping portion comprises two symmetrically arranged clamping blocks (310), the two sides of the convex plate (304) on the bottom surface are provided with second telescopic rods (311), the clamping blocks (310) are respectively connected to the moving ends of the second telescopic rods (311), the structure of the clamping blocks (310) is L-shaped, and the horizontal portions of the two clamping blocks (310) face the convex plate (304).
10. The automatic wafer spin-drying device according to claim 6, wherein one end of the rotating rod (401) is inserted into a moving block (402), the moving block (402) is connected to a moving end of a second horizontal linear mechanism, the second horizontal linear mechanism is installed on a bottom surface of the worktable (100) and located in a diameter direction of the worktable, one end of the moving block (402) is connected to a second motor (403), the second motor (403) is installed on the moving block (402), the other end of the rotating rod (401) is hollow and provided with threads inside, one side of the guide block (208) away from the center of the rotating base (201) is provided with a threaded rod (210), one end of the limiting groove (207) away from the center of the rotating base (201) is also provided with a through hole (211), and when the device is used, the other end of the rotating rod (401) penetrates through the through hole (211) and is connected with the threaded rod (210).
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| CN202211277437.0A CN115355680B (en) | 2022-10-19 | 2022-10-19 | Automatic wafer spin-drying device |
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| CN202211277437.0A CN115355680B (en) | 2022-10-19 | 2022-10-19 | Automatic wafer spin-drying device |
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| CN115355680B (en) | 2023-01-03 |
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