CN116544137A - Wafer cleaning system - Google Patents
Wafer cleaning system Download PDFInfo
- Publication number
- CN116544137A CN116544137A CN202310160258.7A CN202310160258A CN116544137A CN 116544137 A CN116544137 A CN 116544137A CN 202310160258 A CN202310160258 A CN 202310160258A CN 116544137 A CN116544137 A CN 116544137A
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- Prior art keywords
- wafer
- cleaning
- ring seat
- cleaning tank
- wafers
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- 238000004140 cleaning Methods 0.000 title claims abstract description 141
- 235000012431 wafers Nutrition 0.000 claims abstract description 164
- 230000007246 mechanism Effects 0.000 claims abstract description 43
- 239000007921 spray Substances 0.000 claims description 31
- 239000007788 liquid Substances 0.000 claims description 18
- 230000005540 biological transmission Effects 0.000 claims description 11
- 238000007599 discharging Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 238000005406 washing Methods 0.000 description 13
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 241000252254 Catostomidae Species 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 210000001503 joint Anatomy 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000000053 physical method Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention provides a wafer cleaning system, and relates to the technical field of semiconductor manufacturing. The wafer cleaning system comprises a wafer conveying box and a wafer cleaning mechanism, wherein a plurality of wafers are stacked in the wafer conveying box at equal intervals up and down, the wafer cleaning mechanism comprises a plurality of cleaning tanks which are arranged up and down, a ring-shaped ring seat with the inner diameter matched with the wafers is rotatably arranged in the cleaning tanks, clamping pieces are arranged on the inner wall of the ring seat, rotary columns are rotatably arranged on the side parts of the cleaning tanks, a plurality of supporting rods are respectively arranged on the upper part and the lower part of the cleaning tanks and are connected with the rotary columns, an upper cleaning component and a lower cleaning component are respectively arranged at the bottoms of the supporting rods on the upper part and the tops of the supporting rods on the lower part of the cleaning tanks, and the wafer cleaning system further comprises a wafer positioning mechanism and a wafer moving mechanism. The invention realizes batch cleaning of wafers, and greatly improves the cleaning efficiency of the wafers.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a wafer cleaning system.
Background
Wafer refers to a silicon wafer used for manufacturing silicon semiconductor circuits, the original material of which is silicon. The high-purity polycrystalline silicon is dissolved and then doped with silicon crystal seed, and then slowly pulled out to form cylindrical monocrystalline silicon. The silicon ingot is ground, polished, and sliced to form a silicon wafer, i.e., a wafer. Wafer cleaning refers to the process of removing contaminants and oxides from the wafer surface by chemical or physical methods during the fabrication of integrated circuits, so that the wafer surface meets the cleanliness requirements.
In the prior art, the wafer cleaning equipment can only clean one wafer, cannot realize batch cleaning, has lower cleaning efficiency and needs to be solved.
Disclosure of Invention
The invention aims to develop a wafer cleaning system which accommodates a plurality of wafers to be cleaned simultaneously and improves the cleaning efficiency of the wafers.
The invention is realized by the following technical scheme:
a wafer cleaning system, comprising:
a wafer transfer box in which a plurality of wafers are stacked at equal intervals up and down;
wafer cleaning mechanism includes:
a plurality of cleaning tanks arranged up and down;
the ring seat is in a ring shape with the inner diameter matched with the wafer and is rotationally arranged in the cleaning tank;
the clamping piece is arranged on the inner wall of the ring seat;
the rotating column is rotationally arranged at the side part of the cleaning tank;
a plurality of struts which are respectively arranged at the upper part and the lower part of the cleaning tank and are connected with the rotating column;
the upper cleaning component is arranged at the bottom of the supporting rod at the upper part of the cleaning tank;
the lower cleaning component is arranged at the top of the supporting rod at the lower part of the cleaning tank;
the system also comprises a wafer positioning mechanism and a wafer moving mechanism, wherein the wafer moving mechanism is used for transferring wafers among the wafer conveying box, the wafer positioning mechanism and the wafer cleaning mechanism, and the wafers enter the wafer cleaning mechanism after being positioned in the wafer positioning mechanism.
Optionally, go up the cleaning element and including locating the first shower nozzle and the second shower nozzle of branch bottom, first shower nozzle and second shower nozzle all communicate with the liquid pipeline, first shower nozzle still communicates with the gas pipeline.
Optionally, the lower cleaning component comprises a third spray head and a cleaning brush which are arranged at the top of the supporting rod, and the third spray head is communicated with the liquid pipeline.
Optionally, the washing tank bottom is sealed and open-top, all be equipped with the lifter between third shower nozzle, cleaning brush and the branch, lifter drive third shower nozzle, cleaning brush go up and down, the washing tank bottom is equipped with and supplies third shower nozzle, cleaning brush to pass and gliding swinging tank, the washing tank bottom of swinging tank both sides is the inclined plane, the washing tank edge is the higher end of inclined plane, washing tank bottom lateral wall is equipped with the calandria.
Optionally, be equipped with the fender cover that is the sphere form at branch top, third shower nozzle, cleaning brush are located and are kept off the cover middle part, keep off the cover center and be the lowest, keep off cover center department intercommunication has the drain pipe.
Optionally, be equipped with the support in the washing tank, the ring seat rotates to locate on the support, be equipped with the ring tooth on the ring seat outer wall, correspond the position on the support rotate be equipped with ring tooth engaged gear, be equipped with on the support with gear drive connection's motor.
Optionally, the wafer positioning mechanism includes the pillar, slide on the pillar and be equipped with a plurality of locating stations that quantity corresponds with the washing tank, slide on the locating station and be equipped with two locating pieces, two the lateral wall that the locating piece is close to each other is the convex with wafer form adaptation.
Optionally, the wafer moving mechanism includes but the first movable element of three-way removal, be equipped with triaxial arm on the first movable element, be equipped with the carriage on the triaxial arm, be equipped with a plurality of forks that set up at equidistant in vertical direction on the carriage, the interval adaptation between interval and the wafer in the wafer transport box between the fork, the quantity of fork corresponds with the washing tank.
Optionally, the wafer moving mechanism further comprises a second moving assembly capable of moving in three directions, a supporting column is arranged on the second moving assembly, supports, the number of which corresponds to that of the cleaning tank, are slidably arranged on the supporting column, and sucking discs are arranged at the ends of the supports.
Optionally, the holder is including locating the round pad platform on the ring seat inner wall, be equipped with a plurality of draw-in grooves on the ring seat inner wall of pad platform top, it is equipped with the fixture block to slide on the draw-in groove inner wall, the fixture block is along the radial direction elastic sliding of ring seat, the correspondence is equipped with the elastic component of being connected with the fixture block in the ring seat, the top of fixture block is the inclined plane structure and towards the tip of ring seat centre of a circle for the lower end of this inclined plane structure, be equipped with a plurality of inserted bars that are the L shape on the support, the horizontal part and the leg joint at sucking disc top of inserted bar, the position and the draw-in groove of the vertical portion of inserted bar correspond.
The beneficial effects of the invention are as follows:
the invention realizes the movement, positioning and cleaning of the wafers in batches, and greatly improves the cleaning efficiency of the wafers.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a block diagram of the present invention;
FIG. 2 is a diagram of the connection of the slider to the scissor frame;
FIG. 3 is a block diagram of a positioning table;
FIG. 4 is a structural view of a cleaning tank;
fig. 5 is a block diagram of the support.
Detailed Description
Hereinafter, only certain exemplary embodiments are briefly described. As will be recognized by those skilled in the pertinent art, the described embodiments may be modified in numerous different ways without departing from the spirit or scope of the present invention. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive.
In the description of the invention, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," etc. indicate or are based on the orientation or positional relationship shown in the drawings, merely for convenience of description of the invention and to simplify the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the invention.
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.
As shown in fig. 1 to 5, the invention discloses a wafer cleaning system, which comprises a wafer moving mechanism, a wafer positioning mechanism and a wafer cleaning mechanism, wherein a wafer conveying box 1 is a container for storing wafers, the wafers are stacked in the wafer conveying box 1 at equal intervals up and down, the wafer moving mechanism moves the wafers in the wafer conveying box 1 into the wafer positioning mechanism, and after the wafer positioning mechanism finishes the wafer positioning, the wafer moving mechanism moves the wafers into the wafer cleaning mechanism for cleaning.
The wafer moving mechanism comprises a first moving assembly 2, a three-axis mechanical arm 3 is arranged on the first moving assembly 2, and a wafer bearing assembly is arranged on the three-axis mechanical arm 3. The first moving assembly 2 drives the three-axis mechanical arm 3 to move along the X-axis direction, the Y-axis direction and the Z-axis direction, and the three-axis mechanical arm 3 drives the wafer bearing assembly to move out the wafer in the wafer conveying box 1.
The wafer bearing assembly comprises a bearing frame 4 connected with the triaxial mechanical arm 3, three fork frames 5 are arranged on the bearing frame 4, the fork frames 5 are U-shaped and horizontally arranged, foot pads are arranged on the fork frames 5, the three fork frames 5 are arranged at equal intervals in the vertical direction, and the interval distance between the fork frames 5 is matched with the interval distance between wafers in the wafer conveying box 1. The three-axis mechanical arm 3 drives the bearing frame 4 to move, so that the three fork frames 5 respectively enter the gaps below the adjacent three wafers in the wafer conveying box 1, the bearing frame 4 ascends, the three fork frames 5 respectively fork the three wafers, and the three-axis mechanical arm 3 drives the bearing frame 4 to move outwards to move out the three wafers.
The wafer positioning mechanism comprises a support column 6, three positioning tables 7 are arranged on the side portions of the support column 6, the positioning tables 7 are horizontally arranged, sliding blocks 8 are arranged on the side portions of the positioning tables 7, sliding rails connected with the sliding blocks 8 in a sliding mode are vertically arranged on the side portions of the support column 6, and the three positioning tables 7 can vertically slide on the support column 6 through the matching of the sliding blocks 8 and the sliding rails.
The slide rail of the support column 6 is internally provided with a scissor frame 10, the scissor frame 10 is vertically arranged, the hinged parts at two sides of the scissor frame 10 are rotationally connected with sliding columns, the side wall of the sliding block 8 is horizontally provided with sliding grooves 9 which are in sliding connection with the sliding columns, the sliding blocks 8 of the three positioning tables 7 are equidistantly arranged at three hinged parts at the side parts of the scissor frame 10, and the sliding columns at the hinged parts slide in the sliding grooves 9 at the side parts of the sliding blocks 8.
The two ends of the bottom of the scissor frame 10 are respectively provided with driving blocks 12 in a rotating way, a supporting column 6 at the lower part of the scissor frame 10 is internally provided with driving screws 11 in a rotating way, two sides of each driving screw 11 are respectively in threaded fit with the two driving blocks 12, the directions of the threads of the two sides of each driving screw 11 and the threads of the two driving blocks 12 are opposite, so that when the driving screws 11 rotate, the two driving blocks 12 synchronously and reversely move, and a motor in transmission connection with the driving screws 11 is correspondingly arranged in the supporting column 6 as a driving source of the motor. The driving screw 11 rotates, the two driving blocks 12 are close to or far away from each other, the scissor frame 10 correspondingly stretches or shortens, the space between the hinged parts of the lateral parts of the scissor frame 10 correspondingly increases or decreases, the space between the three sliding blocks 8 is kept at equal space when the space between the three sliding blocks 8 increases or decreases, and the three positioning tables 7 respectively move along with the three sliding blocks 8. In the lifting process of the three sliding blocks 8 along with the expansion and contraction of the scissor frame 10, a sliding column at the hinged position of the side part of the scissor frame 10 adaptively slides in a sliding groove 9 of the sliding blocks 8.
The positioning table 7 is provided with two positioning blocks 14 in a sliding manner, the side walls of the two positioning blocks 14, which are close to each other, are arc-shaped and are matched with the shape of a wafer, the side parts of the two positioning blocks 14 are provided with transmission rods 15, the transmission rods 15 are L-shaped, the transmission rods 15 are provided with racks 16 parallel to the sliding direction of the positioning blocks 14, a first gear 17 which is rotationally arranged on the positioning table 7 is arranged between the racks 16 of the two transmission rods 15, and the two racks 16 are respectively meshed with the first gear 17 at two sides. The positioning table 7 is also provided with an air cylinder 18, the expansion and contraction direction of a piston rod of the air cylinder 18 is parallel to the sliding direction of the positioning block 14, the piston rod of the air cylinder 18 is connected with one of the transmission rods 15, the air cylinder 18 drives one of the transmission rods 15 to slide, and the other transmission rod 15 synchronously and reversely slides through the transmission of the first gear 17 and the rack 16, so that the two positioning blocks 14 are close to or far away from each other. The positioning table 7 between the two positioning blocks 14 is provided with a slot 13 which is matched with the fork frame 5, the fork frame 5 places the wafer on the positioning table 7 between the two positioning blocks 14, the fork frame 5 can pass through the slot 13, and the two positioning blocks 14 are mutually close to position the wafer.
The wafer moving mechanism further comprises a second moving component 20, and the second moving component 20 is the same as the first moving component 2 and can also perform three-way movement. The second moving assembly 20 is provided with a support column 21, three supports 22 are slidably arranged on the support column 21, the supports 22 vertically lift on the support column 21, and a linear sliding table is correspondingly arranged on the support column 21 to serve as a driving source of the supports 22. The bottom of the free end of the bracket 22 is provided with a sucker 24, and the sucker 24 is used for sucking the wafer on the positioning table 7.
The wafer cleaning mechanism comprises three cleaning tanks 25 which are arranged at equal intervals up and down, the bottoms of the cleaning tanks 25 are closed, and the tops of the cleaning tanks are open. A support 28 is arranged in the cleaning tank 25, and a connecting rod connected with the inner wall of the cleaning tank 25 is arranged at the side part of the support 28. The support 28 is rotatably provided with a ring seat 29, the ring seat 29 is in a ring shape, the outer wall of the ring seat 29 is provided with ring teeth 33, the corresponding position on the support 28 is rotatably provided with a second gear 34 meshed with the ring teeth 33, the support 28 is provided with a motor in transmission connection with the second gear 34, the motor is operated to drive the second gear 34 to rotate, and the second gear 34 and the ring teeth 33 are driven to drive the ring seat 29 to rotate.
The inner diameter of the ring seat 29 is adapted to the diameter of the wafer, a circle of pad table 30 is arranged on the inner wall of the ring seat 29, a plurality of clamping grooves 31 are arranged on the inner wall of the ring seat 29 above the pad table 30, and the clamping grooves 31 are arranged at equal intervals in the circumferential direction of the inner wall of the ring seat 29. The clamping block 32 is slidably arranged on the inner wall of the clamping groove 31, the clamping block 32 elastically slides along the radial direction of the ring seat 29, an elastic piece connected with the clamping block 32 is correspondingly arranged in the ring seat 29, the elastic piece can be a spring, the top of the clamping block 32 is of an inclined surface structure, and the end part facing the circle center of the ring seat 29 is the lower end of the inclined surface structure. The wafer is placed between the pad 30 and the clamp block 32 in the ring 29, and the pad 30 and the clamp block 32 serve as a clamping member for the wafer.
The support 22 is provided with a plurality of inserted bars 23, the inserted bars 23 are L-shaped, the horizontal part of the inserted bars 23 is connected with the support 22 at the top of the sucker 24, and the vertical part of the inserted bars 23 corresponds to the clamping groove 31. After the wafer is adsorbed by the sucker 24, the support 22 moves to enable the sucker 24 to place the wafer on the ring seat 29, the support 22 drives the sucker 24 to enter the position above the ring seat 29, at the moment, the wafer and the ring seat 29 are in a coaxial state, the clamping grooves 31 are respectively positioned under the vertical parts of the inserting rods 23, the support 22 descends, the inserting rods 23 are inserted into the clamping grooves 31, the inserting rods 23 are matched with the inclined surface structures at the tops of the clamping blocks 32, the clamping blocks 32 slide towards the inner sides of the clamping grooves 31, after the wafer is placed on the pad table 30 along with the descent of the support 22, the sucker 24 is separated from the wafer, the support 22 ascends, and after the vertical parts of the inserting rods 23 leave the clamping grooves 31, the clamping blocks 32 slide out of the tops of the wafer under the elastic force of the elastic pieces. Through holes 19 matched with the vertical parts of the inserted rods 23 are formed in the corresponding positions of the positioning table 7, so that the vertical parts of the inserted rods 23 can be inserted into the through holes 19 when the sucking discs 24 suck wafers on the positioning table 7.
The side of the cleaning tank 25 is rotatably provided with a rotating column 27, the rotating column 27 is provided with four supporting rods 26, and the four supporting rods 26 are respectively positioned above the cleaning tank 25 at the top, below the cleaning tank 25 at the bottom and between two adjacent cleaning tanks 25, so that one supporting rod 26 exists above and below each cleaning tank 25. An upper cleaning component is arranged at the bottom of the supporting rod 26 above the cleaning tank 25, and a lower cleaning component is arranged at the top of the supporting rod 26 below the cleaning tank 25.
The upper cleaning assembly comprises a first spray head 39 and a second spray head 40 which are arranged at the bottom of the support rod 26, the first spray head 39 and the second spray head 40 are communicated with a liquid pipeline, and the first spray head 39 is also communicated with a gas pipeline. The lower cleaning component comprises a baffle cover 38 arranged at the top of the supporting rod 26, the baffle cover 38 is spherical, the center of the baffle cover 38 is the lowest end, a third spray head 36 and a cleaning brush 37 are arranged in the middle of the baffle cover 38, and a lower liquid pipe is communicated with the center of the baffle cover 38. The third spray head 36 is communicated with the liquid pipeline, lifting pieces are arranged among the third spray head 36, the cleaning brush 37 and the supporting rods 26, the lifting pieces drive the third spray head 36 and the cleaning brush 37 to vertically lift, and the lifting pieces can be electric push rods. The rotary column 27 rotates, and the first spray head 39, the second spray head 40, the third spray head 36 and the cleaning brush 37 can reciprocate on the upper part and the lower part of the wafer along with the rotation.
The bottom of the cleaning tank 25 is provided with a swinging groove 35 for the third spray head 36 and the cleaning brush 37 to pass through and slide, and the track of the swinging groove 35 is matched with the swinging track of the third spray head 36 and the cleaning brush 37. The rotating column 27 rotates to drive the third spray head 36 and the cleaning brush 37 to rotate to the bottom of the cleaning tank 25, so that the third spray head 36 and the cleaning brush 37 are positioned right below the swinging tank 35, the lifting piece drives the third spray head 36 and the cleaning brush 37 to lift, so that the third spray head 36 and the cleaning brush 37 enter the bottom of the cleaning tank 25, the rotating column 27 rotates, and the third spray head 36 and the cleaning brush 37 reciprocate in the swinging tank 35. The bottoms of the cleaning tanks 25 on both sides of the swinging tank 35 are inclined planes, and the edges of the cleaning tanks 25 are the higher ends of the inclined planes. The side wall of the bottom of the cleaning tank 25 is provided with a drain pipe, the interior of the cleaning tank 25 is sucked through the drain pipe, and liquid in the cleaning tank 25 is timely discharged, so that the liquid is prevented from overflowing out of the cleaning tank 25.
The wafer carrying assembly moves out three wafers in the wafer conveying box 1, the space between the three positioning tables 7 is matched with the three wafers, the wafer carrying assembly stretches the scissor frame 10 after placing the three wafers into the three positioning tables 7, the space between the three positioning tables 7 is increased, the positioning blocks 14 on the three positioning tables 7 move to finish positioning the wafers, the space between the three supports 22 on the supporting columns 21 is matched with the three positioning tables 7, the second moving assembly 20 drives the supports 22 to move, the suckers 24 at the ends of the three supports 22 are respectively lowered to the positions above the three positioning tables 7, the suckers 24 absorb the positioned wafers and respectively move the three wafers to the positions above the three cleaning tanks 25 along with the lowering of the supports 22, the three wafers respectively enter the three ring seats 29, the clamping rods 23 are firstly pushed to slide by the clamping grooves 31, the clamping blocks 32 are placed on the pad tables 30, the supports 22 are lifted up, the clamping rods 23 are separated from the clamping grooves 31, and the clamping blocks 32 are ejected to realize the placement of the wafers on the ring seats 29. The suction cup 24 on the support 22 leaves above the cleaning tank 25 along with the second moving assembly 20, the motor on the support 28 drives the ring seat 29 to rotate, and the ring seat 29 drives the wafer to rotate. The rotary column 27 rotates to enable the four supporting rods 26 to be located above and below the three cleaning tanks 25, the third spray head 36 penetrates through the swinging groove 35 to be located below the wafer under the driving of the lifting piece, the cleaning brush 37 penetrates through the swinging groove 35 to be in contact with the lower surface of the wafer under the driving of the lifting piece, the rotary column 27 rotates in a reciprocating mode, the first spray head 39 and the second spray head 40 swing on the wafer Fang Wangfu to clean the upper surface of the wafer, and the third spray head 36 and the cleaning brush 37 are matched with each other to swing in a reciprocating mode on the lower portion of the wafer to clean the lower surface of the wafer. The liquid in the cleaning process flows to the bottom of the cleaning tank 25, the bottom of the cleaning tank 25 is an inclined plane, the edge of the swinging tank 35 is the higher end of the inclined plane, the liquid cannot flow out of the cleaning tank 25, the draining pipe keeps sucking in the cleaning process, the liquid in the cleaning tank 25 is pumped out, the liquid drops in the air in the cleaning tank 25 are also sucked by the draining pipe, part of the liquid falls into the baffle cover 38 below the cleaning tank 25 after flowing out of the swinging tank 35, and the liquid is discharged by the liquid discharging pipe at the center of the baffle cover 38, so that the liquid accumulation is avoided.
When the wafer is washed and moved out of the washing tank 25, a wafer moving mechanism and a wafer positioning mechanism can be additionally arranged and specially used for moving and positioning the washed wafer, the wafer is placed into the wafer conveying box 1, in the process, the third spray head 36 and the cleaning brush 37 are driven by the lifting piece to descend and leave the swinging groove 35 through the swinging groove 35, the rotating post 27 rotates to enable the supporting rod 26 to drive the upper washing component and the lower washing component to swing and leave the upper part and the lower part of the washing tank 25, the support 22 drives the inserting rod 23 and the sucker 24 to enter the washing tank 25, the inserting rod 23 enters the clamping groove 31 to push the clamping block 32 to slide, the clamping block 32 is retracted into the ring seat 29 at the inner side of the clamping groove 31, the sucker 24 is used for sucking the wafer, after the spacing between the three positioning tables 7 of the wafer positioning mechanism is matched with the suckers 24 on the three supports 22, the supports 22 drive the wafer to enter the three positioning tables 7, the spacing adjustment between the three positioning tables 7 is matched with the spacing between the three fork frames 5 on the bearing frame 4, and the three wafer is placed into the wafer conveying box 1 after the three fork frames 5 bear the three wafers. The two sets of wafer moving mechanisms and the two sets of wafer positioning mechanisms are respectively used for the wafer to be cleaned and the cleaned wafer, so that the cleaned wafer is prevented from being polluted.
The invention realizes the movement, positioning and cleaning of the wafers in batches, and greatly improves the cleaning efficiency of the wafers.
The above embodiments are only preferred embodiments of the present invention, and are not limiting to the technical solutions of the present invention, and any technical solution that can be implemented on the basis of the above embodiments without inventive effort should be considered as falling within the scope of protection of the patent claims of the present invention.
Claims (10)
1. A wafer cleaning system, comprising:
a wafer transfer box in which a plurality of wafers are stacked at equal intervals up and down;
wafer cleaning mechanism includes:
a plurality of cleaning tanks arranged up and down;
the ring seat is in a ring shape with the inner diameter matched with the wafer and is rotationally arranged in the cleaning tank;
the clamping piece is arranged on the inner wall of the ring seat;
the rotating column is rotationally arranged at the side part of the cleaning tank;
a plurality of struts which are respectively arranged at the upper part and the lower part of the cleaning tank and are connected with the rotating column;
the upper cleaning component is arranged at the bottom of the supporting rod at the upper part of the cleaning tank;
the lower cleaning component is arranged at the top of the supporting rod at the lower part of the cleaning tank;
the system also comprises a wafer positioning mechanism and a wafer moving mechanism, wherein the wafer moving mechanism is used for transferring wafers among the wafer conveying box, the wafer positioning mechanism and the wafer cleaning mechanism, and the wafers enter the wafer cleaning mechanism after being positioned in the wafer positioning mechanism.
2. The wafer cleaning system of claim 1, wherein the upper cleaning assembly comprises a first showerhead and a second showerhead disposed at the bottom of the support bar, the first showerhead and the second showerhead each in communication with the liquid conduit, the first showerhead further in communication with the gas conduit.
3. The wafer cleaning system of claim 1, wherein the lower cleaning assembly comprises a third spray head and a cleaning brush disposed on top of the support bar, the third spray head in communication with the liquid line.
4. The wafer cleaning system according to claim 3, wherein the bottom of the cleaning tank is closed and the top of the cleaning tank is open, lifting pieces are arranged among the third spray head, the cleaning brush and the supporting rods, the lifting pieces drive the third spray head and the cleaning brush to lift, swinging grooves for the third spray head and the cleaning brush to pass through and slide are formed in the bottom of the cleaning tank, the bottoms of the cleaning tanks on two sides of the swinging grooves are inclined planes, the edges of the cleaning tank are higher ends of the inclined planes, and the side walls of the bottom of the cleaning tank are provided with calandria.
5. The wafer cleaning system according to claim 3, wherein a baffle cover in a spherical shape is arranged at the top of the supporting rod, the third nozzle and the cleaning brush are arranged in the middle of the baffle cover, the center of the baffle cover is the lowest end, and the center of the baffle cover is communicated with the liquid discharging pipe.
6. The wafer cleaning system of claim 1, wherein a support is disposed in the cleaning tank, the ring seat is rotatably disposed on the support, ring teeth are disposed on an outer wall of the ring seat, gears meshed with the ring teeth are rotatably disposed at corresponding positions on the support, and a motor connected with the gears in a transmission manner is disposed on the support.
7. The wafer cleaning system of claim 1, wherein the wafer positioning mechanism comprises a support column, a plurality of positioning tables corresponding to the cleaning tank are slidably arranged on the support column, two positioning blocks are slidably arranged on the positioning tables, and side walls of the two positioning blocks, which are close to each other, are arc-shaped and are matched with the wafer.
8. The wafer cleaning system of claim 1, wherein the wafer moving mechanism comprises a first moving assembly capable of moving in three directions, a three-axis mechanical arm is arranged on the first moving assembly, a bearing frame is arranged on the three-axis mechanical arm, a plurality of fork frames are arranged on the bearing frame at equal intervals in the vertical direction, the intervals among the fork frames are matched with the intervals among the wafers in the wafer conveying box, and the number of the fork frames corresponds to the cleaning tank.
9. The wafer cleaning system of claim 8, wherein the wafer moving mechanism further comprises a second moving assembly capable of moving in three directions, a supporting column is arranged on the second moving assembly, a plurality of supports corresponding to the cleaning tank are slidably arranged on the supporting column, and suction cups are arranged at the ends of the supports.
10. The wafer cleaning system according to claim 9, wherein the clamping member comprises a ring of pad table arranged on the inner wall of the ring seat, a plurality of clamping grooves are formed in the inner wall of the ring seat above the pad table, clamping blocks are slidably arranged on the inner wall of the clamping grooves, the clamping blocks elastically slide along the radial direction of the ring seat, elastic members connected with the clamping blocks are correspondingly arranged in the ring seat, the top of the clamping blocks is of an inclined surface structure, the end part facing the center of the ring seat is the lower end of the inclined surface structure, a plurality of L-shaped inserting rods are arranged on the support, the horizontal parts of the inserting rods are connected with the support of the top of the sucker, and the vertical parts of the inserting rods correspond to the clamping grooves.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310160258.7A CN116544137A (en) | 2023-02-24 | 2023-02-24 | Wafer cleaning system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202310160258.7A CN116544137A (en) | 2023-02-24 | 2023-02-24 | Wafer cleaning system |
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| Publication Number | Publication Date |
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| CN116544137A true CN116544137A (en) | 2023-08-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202310160258.7A Pending CN116544137A (en) | 2023-02-24 | 2023-02-24 | Wafer cleaning system |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117059530A (en) * | 2023-10-11 | 2023-11-14 | 恒超源洗净科技(深圳)有限公司 | Silicon wafer cleaning tank and cleaning equipment with same |
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2023
- 2023-02-24 CN CN202310160258.7A patent/CN116544137A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117059530A (en) * | 2023-10-11 | 2023-11-14 | 恒超源洗净科技(深圳)有限公司 | Silicon wafer cleaning tank and cleaning equipment with same |
| CN117059530B (en) * | 2023-10-11 | 2023-12-08 | 恒超源洗净科技(深圳)有限公司 | Silicon wafer cleaning tank and cleaning equipment with same |
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