CN115341197B - Spray cooling integrated plate and spray system for metal organic chemical vapor deposition - Google Patents
Spray cooling integrated plate and spray system for metal organic chemical vapor deposition Download PDFInfo
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- CN115341197B CN115341197B CN202211122699.XA CN202211122699A CN115341197B CN 115341197 B CN115341197 B CN 115341197B CN 202211122699 A CN202211122699 A CN 202211122699A CN 115341197 B CN115341197 B CN 115341197B
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/45565—Shower nozzles
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
- C23C16/45563—Gas nozzles
- C23C16/45572—Cooled nozzles
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- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
The invention relates to a spray cooling integrated plate and a spray system for metal organic chemical vapor deposition, which comprises a body, wherein the body is provided with a first cooling pipeline and a second cooling pipeline which are communicated with cooling media, and inflow paths and outflow paths of the first cooling pipeline and the second cooling pipeline are opposite; a spray channel is arranged in the middle of the body, two sides of the spray channel are respectively provided with a plurality of spray holes, and a plurality of sprays Kong Cuola on the same side are distributed; the first cooling pipeline is provided with a first cooling pipeline inlet and a first cooling pipeline outlet, the cooling medium flows in from the first cooling pipeline inlet and is divided into a plurality of paths, and after the cooling mediums in the plurality of paths pass through a back-and-forth path in the body, the cooling mediums in the plurality of paths are combined into one path to flow out from the first cooling pipeline outlet; the second cooling pipeline is located in the middle of the spraying channel and is arranged along the length direction of the body. The invention ensures that the flow of the chemical source gas flow is more stable and the utilization rate is higher, the chemical source gas flow can be more fully mixed with oxygen, and is favorable for producing high-performance films by MOCVD.
Description
Technical Field
The invention relates to the technical field of high-temperature superconducting material preparation, in particular to a spray cooling integrated plate and a spray system for metal organic chemical vapor deposition.
Background
The high-temperature superconducting material has wide application prospect in the fields of electric power, new energy, medical equipment, national defense equipment and the like. A plurality of companies at home and abroad are dedicated to the industrialized development, application and display of the high-temperature superconducting tape, and the high-temperature superconducting tape is forming an emerging industry. The high temperature superconductive strip is one with metal oxide film coated on the surface, and has thickness of 50-100 microns, width of 4-20 mm, length of several cm and length of several kilometers.
One of the mainstream methods for preparing superconducting layers of superconducting tapes is MOCVD (metal organic chemical vapor deposition) process. The MOCVD method is to pump metal organic chemical source into evaporator in vacuum environment, the evaporator and the conveying pipeline are provided with heating system, the chemical source vapor is conveyed to the spraying system of the deposition cavity through heating, and after being dispersed homogeneously, mixed with oxygen, etc. in the spraying system, the metal organic chemical source is delivered to the surface of superconductive belt material, the superconductive belt material is adhered to arc plate, the arc plate is heated to 1000 deg.c, and under the high temperature condition, the chemical source and oxygen can deposit superconductive film on the surface of superconductive belt material. At present, the structure of the existing spraying system is shown in fig. 1, and the spraying path is as follows: spray chamber-spray plate-cooling plate-oxygen plate-baffle plate.
However, existing spray systems suffer from the following disadvantages: (1) At high temperature, the cooling plate and the spray plate are in poor contact due to large temperature difference and different thermal deformation, and finally the cooling effect is poor, and the temperature of the spray plate is not easy to control; (2) The chemical source air flow flows through a plurality of right angles, turbulence is easy to form, and most of the chemical source air flow is directly pumped by a vacuum pump due to the fact that no baffle plates are arranged on two sides, so that film formation on the surface of a strip material can not be achieved, and the chemical source utilization rate is low; (3) The oxygen board directly receives the heat radiation of arc, and the temperature is higher, leads to the chemical source near the oxygen hole of oxygen board to take place the reaction with oxygen easily, serious can block up the oxygen hole.
Disclosure of Invention
Aiming at the defects of the prior art, the invention discloses a spray cooling integrated plate and a spray system for metal organic chemical vapor deposition.
The technical scheme adopted by the invention is as follows:
the spray cooling integrated plate comprises a body, wherein the body is provided with a first cooling pipeline and a second cooling pipeline which are communicated with cooling media, and inflow and outflow paths of the first cooling pipeline and the second cooling pipeline are opposite;
a spray channel is arranged in the middle of the body, two sides of the spray channel are respectively provided with a plurality of spray holes, and a plurality of sprays Kong Cuola on the same side are distributed;
the first cooling pipeline is provided with a first cooling pipeline inlet and a first cooling pipeline outlet, the cooling medium flows in from the first cooling pipeline inlet and is divided into a plurality of paths, and after the cooling medium in the plurality of paths passes through a back-and-forth path in the body, the cooling medium in the plurality of paths is combined into one path to flow out from the first cooling pipeline outlet;
the second cooling pipeline is positioned in the middle of the spraying channel and is arranged along the length direction of the body; the second cooling pipeline is provided with a second cooling pipeline inlet and a second cooling pipeline outlet; the cooling medium flows in from the inlet of the second cooling pipeline and flows out from the outlet of the second cooling pipeline.
The method is further technically characterized in that: the spraying holes on the same side are distributed in multiple rows, the spraying holes on the same row are on the same horizontal line, and the circle centers of the spraying holes on two adjacent rows are not on the same vertical line.
The method is further technically characterized in that: a plurality of connection holes are provided along the circumference of the body.
The method is further technically characterized in that: the body is also provided with a thermocouple.
The method is further technically characterized in that: the cooling medium is gas or liquid.
A spray system for metalorganic chemical vapor deposition, comprising:
a diffusion plate provided with a diffusion channel for diffusing the chemical source gas flow;
the spray cooling integrated plate is used for cooling the chemical source air flow;
the heat insulation module is used for insulating heat radiation of the spray cooling integrated plate;
an oxygen plate arranged below the heat insulation module for conveying oxygen;
the guide plate is arranged below the oxygen plate, uniformly disperses the air flow flowing down from the spray cooling integrated plate, changes the oxygen flow direction, and mixes the oxygen with the air flow flowing down from the spray cooling integrated plate;
a flow blocking module restricts the flow of chemical source gas from the deposition zone.
The method is further technically characterized in that: the heat insulation module comprises at least one group of first heat insulation sheets, at least one group of heat insulation plates and at least one group of second heat insulation sheets, wherein the first heat insulation sheets are arranged between the spray cooling integrated plate and the heat insulation plates, and the second heat insulation sheets are arranged on two sides of the spray cooling integrated plate.
The method is further technically characterized in that: the cross section of the guide plate is triangular.
The method is further technically characterized in that: the baffle plate comprises a first baffle plate and a second baffle plate, wherein the first baffle plate is arranged on two sides of the length of the guide plate, and the second baffle plate is arranged on two sides of the width of the guide plate.
The method is further technically characterized in that: the first baffle plate comprises a first connecting plate and a second connecting plate which are arranged in an L shape, and the section of the second connecting plate is arc-shaped.
Compared with the prior art, the technical scheme of the invention has the following advantages:
1. the spray cooling integrated plate provided by the invention has the advantages of high cooling efficiency, uniform cooling and difficult deformation at high temperature.
2. The spraying system for metal organic chemical vapor deposition has the advantages of small volume and low cost.
3. The spraying system for metal organic chemical vapor deposition provided by the invention has flexible structural design and is easy to detach.
4. The spraying system for metal organic chemical vapor deposition provided by the invention has the advantages that the flow of the chemical source air flow is more stable, the utilization rate is higher, the chemical source air flow is more fully mixed with oxygen, and the high-performance film is produced by metal organic chemical vapor deposition.
Drawings
In order that the invention may be more readily understood, a more particular description of the invention will be rendered by reference to specific embodiments thereof that are illustrated in the appended drawings.
Fig. 1 is a schematic view of a conventional shower system.
Fig. 2 is a front view of the shower system of the present invention.
Fig. 3 is a side view of the spray system of the present invention.
Fig. 4 is an exploded view of the spray system of the present invention.
Fig. 5 is a schematic structural view of a spray cooling integrated plate in the present invention.
Fig. 6 is an enlarged schematic view of a portion of the spray channel of fig. 5.
Fig. 7 is a perspective view of a spray cooled integrated plate in accordance with the present invention.
Fig. 8 is a schematic view of the structure of the first heat insulating sheet in the present invention.
Fig. 9 is a schematic view of the structure of the heat insulating plate of the present invention.
Fig. 10 is a schematic view of the structure of a second heat insulating sheet in the present invention.
Fig. 11 is a schematic structural view of an oxygen panel in the present invention.
Fig. 12 is a schematic view of the structure of the baffle in the present invention.
Fig. 13 is a schematic structural view of a first baffle plate in the present invention.
Fig. 14 is a schematic structural view of a second baffle plate in the present invention.
FIG. 15 is a schematic view of a diffusion plate according to the present invention.
Fig. 16 is an enlarged partial schematic view of fig. 15.
Description of the specification reference numerals: 1. spraying and cooling the integrated plate; 11. spraying holes; 12. a first cooling line; 13. a first cooling line inlet; 14. a first cooling line outlet; 15. a second cooling line; 16. a connection hole; 17. a second cooling line inlet; 18. a second cooling line outlet; 2. a first heat insulating sheet; 3. a heat insulating plate; 4. a second heat insulating sheet; 5. an oxygen plate; 6. a deflector; 7. a first baffle plate; 8. a second baffle plate; 9. a diffusion plate; 10. an arc-shaped plate.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and specific examples, which are not intended to be limiting, so that those skilled in the art will better understand the invention and practice it.
The foregoing and other features, aspects and advantages of the present invention will become more apparent from the following detailed description of the embodiments, read in conjunction with the accompanying drawings. The directional terms mentioned in the following embodiments are, for example: upper, lower, left, right, front or rear, etc., are merely references to the directions of the drawings. Thus, directional terminology is used for the purpose of illustration and is not intended to be limiting of the invention, and furthermore, like reference numerals refer to like elements throughout the embodiments.
Example 1:
referring to fig. 5 to 7, a spray cooling integrated plate includes a body provided with a first cooling pipe 12 and a second cooling pipe 15 which are introduced with a cooling medium, and inflow and outflow paths of the first cooling pipe 12 and the second cooling pipe 15 are opposite;
a spray channel is arranged in the middle of the body, two sides of the spray channel are respectively provided with a plurality of spray holes 11, and the spray holes 11 on the same side are distributed in a staggered manner;
the first cooling pipeline 12 is provided with a first cooling pipeline inlet 13 and a first cooling pipeline outlet 14, the cooling medium flows in from the first cooling pipeline inlet 13 and is divided into a plurality of paths, and after the cooling mediums in the plurality of paths pass through a back-and-forth path in the body, the cooling mediums in the plurality of paths are combined into one path to flow out from the first cooling pipeline outlet 14;
the second cooling pipeline 15 is positioned in the middle of the spraying channel and is arranged along the length direction of the body; the second cooling line 15 is provided with a second cooling line inlet 17 and a second cooling line outlet 18; the cooling medium flows in from the second cooling line inlet 17 and out from the second cooling line outlet 18.
The above-mentioned integrative board of spray cooling that provides solves current cooling plate and spray plate under the high temperature, because the difference in temperature is big, and the thermal deformation volume is different and causes both to contact poorly, finally leads to the cooling effect not good, sprays the difficult problem of controlling of board temperature.
In this embodiment, the spray holes 11 on the same side are arranged in a plurality of columns, and the spray holes 11 on the same column are on the same horizontal line, and the centers of the spray holes 11 on two adjacent columns are not on the same vertical line. Specifically, the spraying holes 11 are six rows, and three rows of spraying holes 11 are arranged on each side of the spraying passage. Wherein, the first cooling pipeline inlet 13 is closer to the spray holes 11 for improving the cooling efficiency of the spray holes 11; the first cooling line outlet 14 is located further from the densely sprayed holes for cooling the non-sprayed hole areas. The second cooling line 15 runs through the middle of the spray channel for increasing the cooling efficiency of the spray holes 11.
In this embodiment, the first cooling pipeline 12 is a two-in two-out gas pipeline, that is, the cooling medium flows in from the first cooling pipeline inlet 13 and then is divided into two paths, and after the two paths of cooling medium pass through a back and forth path in the spray cooling integrated board 1, the two paths of cooling medium are combined into one path and flow out from the first cooling pipeline outlet 14.
In this embodiment, a plurality of attachment holes 16 are provided along the perimeter of the body. Preferably, the connection holes 16 are screw holes for assembling the shower cooling integrated plate 1.
In this embodiment, the body is also provided with a thermocouple. Specifically, the body is provided with four thermocouple holes, thermocouples are installed in the thermocouple holes, and the four thermocouples respectively measure the temperature of the chemical source air flow sprayed by the spraying holes 11, so that the spraying and cooling integrated plate 1 can be cooled and temperature controlled.
In this embodiment, the cooling medium is a gas or a liquid. Preferably, the cooling medium is compressed air, which can be supplied with a pressure of at most 7 kg by means of an air compressor.
The working principle of this embodiment is as follows:
the cooling medium is led into a first cooling line 12 and a second cooling line 15, which are independent of each other, and the pressure of the first cooling line 12 and the pressure of the second cooling line 15 are individually adjustable.
The compressed air flows in from the first cooling pipeline inlet 13 and then is divided into two paths, and after the two paths of compressed air pass through a back and forth path in the spray cooling integrated plate 1, the two paths of compressed air are combined into one path to flow out from the first cooling pipeline outlet 14; the second cooling pipeline 15 adopts a left-in and right-out cooling path, namely compressed air flows in from the second cooling pipeline inlet 17 and flows out from the second cooling pipeline outlet 18. When in use, the gas pressure of the first cooling pipeline 12 and the second cooling pipeline 15 is regulated, so that the purpose of uniform temperature of the spray cooling integrated plate 1 is achieved.
In summary, the spray plate and the cooling plate are integrated, so that the cooling efficiency is high and the cooling is uniform.
Example 2:
2-4, a spray system for metal organic chemical vapor deposition, comprising:
a diffusion plate 9 provided with a diffusion passage for diffusing the chemical source gas flow;
spray cooling the panel 1 as provided in example 1, cooling the chemical source gas stream;
the heat insulation module is used for insulating heat radiation of the spray cooling integrated plate;
an oxygen plate 5 disposed under the heat insulation module for transporting oxygen;
the deflector 6 is arranged below the oxygen plate 5, uniformly disperses the air flow flowing down from the spray cooling integrated plate 1, changes the oxygen flow direction, and mixes the oxygen with the air flow flowing down from the spray cooling integrated plate 1;
a flow blocking module restricts the flow of chemical source gas from the deposition zone.
The spraying system for metal organic chemical vapor deposition solves the problems of the existing spraying system, for example, the cooling plate and the spraying plate are not in good contact due to large temperature difference and different thermal deformation at high temperature, and finally the cooling effect is not good, and the temperature of the spraying plate is not easy to control; the chemical source air flow flows through a plurality of right angles, turbulence is easy to form, and most of the chemical source air flow is directly pumped by a vacuum pump due to the fact that no baffle plates are arranged on two sides, so that film formation on the surface of a strip material can not be achieved, and the chemical source utilization rate is low; the oxygen board directly receives the heat radiation of arc, and the temperature is higher, leads to the chemical source near the oxygen hole of oxygen board to take place the reaction with oxygen easily, serious can block up the oxygen hole.
Referring to fig. 15 and 16, in this embodiment, the diffusion channel is provided with diffusion holes, and the holes of the diffusion holes are staggered from the holes of the spray holes 11 of the spray cooling integrated plate 1, so that the diffusion plate can break up the air flow, and the purpose of making the air flow deposited on the substrate more uniform is achieved.
Referring to fig. 8 to 10, in the present embodiment, the heat insulation module includes at least one set of first heat insulation sheets 2, at least one set of heat insulation sheets 3, and at least one set of second heat insulation sheets 4, the first heat insulation sheets 2 are disposed between the spray cooling integrated plate 1 and the heat insulation sheets 3, and the second heat insulation sheets 4 are disposed on both sides of the spray cooling integrated plate 1.
Specifically, one set of heat insulation plates 3 is arranged on the front and rear sides of the spray cooling integrated plate 1, two sets of first heat insulation plates 2 are arranged on the front and rear sides of the spray cooling integrated plate 1, and one set of second heat insulation plates 4 are arranged on the left and right sides of the spray cooling integrated plate 1.
As shown in fig. 11, in the present embodiment, oxygen delivery pipes are provided on both sides of the oxygen plate 5, and dense oxygen holes are uniformly distributed on the oxygen plate 5, and oxygen flows into the oxygen plate 5 through the oxygen delivery pipes and uniformly flows out of the oxygen plate 5 through the oxygen holes.
As shown in fig. 12, in the present embodiment, the cross-sectional shape of the baffle 6 is triangular. The triangular deflector 6 functions as follows: (1) The air flow flowing down from the spray cooling integrated plate 1 is uniformly dispersed, so that turbulence is reduced; (2) Changing the flow direction of oxygen to fully mix the oxygen with the air flow flowing down from the spray plate; (3) Helping the oxygen panel 5 to isolate heat from the radiation, lowering the temperature of the oxygen panel 5, and reducing the amount of reaction of the chemical source on the oxygen panel 5.
Referring to fig. 13 and 14, in the present embodiment, the baffle includes a first baffle 7 and a second baffle 8, the first baffle 7 being disposed on both sides of the length of the baffle 6, and the second baffle 8 being disposed on both sides of the width of the baffle 6.
Specifically, to effectively limit the chemical source gas flow from being pumped, and improve the effect of the chemical source gas flow rate, the first baffle 7 includes a first connection plate and a second connection plate that are L-shaped, and the section of the second connection plate is arc-shaped.
In this embodiment, the strip guide device further comprises an arc-shaped plate 10, wherein the arc-shaped plate 10 is arranged below the baffle plate, and the arc-shaped plate 10 is used for placing the strip.
The present embodiment can further optimize the entire spray system through simulation calculation, such as the spray holes 11 of the spray cooling integrated plate 1, the heat insulation plate 3, the deflector 6, the size and/or shape of the baffle plate, and the like.
The working principle of this embodiment is as follows:
firstly, chemical source air flow (the temperature is 270-300 ℃) moves downwards from top to bottom, reaches the spray cooling integrated plate 1 firstly, and continues to move downwards after the chemical source air flow is uniformly dispersed through the spray holes 11 of the spray cooling integrated plate 1;
secondly, after passing through the first heat insulation sheet 2, the heat insulation sheet 3 and the second heat insulation sheet 4, the chemical source air flows to the oxygen plate 5 and is evenly mixed with scattered oxygen (the temperature is more than 300 ℃) from the oxygen plate 5, and then the chemical source air continuously moves downwards.
Then, the mixed gas flow obtained by mixing the chemical source gas flow and the oxygen gas reaches the baffle 6, and after being further dispersed in the front-rear direction due to the shape of the baffle 6, the mixed gas flow continues to move downward.
Finally, the mixed air flow reaches the first baffle 7 and the second baffle 8, and as the gaps between the first baffle 7 and the second baffle 8 and the arc 10 below are small, most of the mixed air flow can continue to move downwards to reach the strip on the surface of the arc 10 (the temperature is about 1000 ℃), and film is formed on the surface of the strip at high temperature, so that the effect of preparing a superconducting layer is achieved, and only a small part of the mixed air flow of chemical source and oxygen is directly pumped by a vacuum pump.
In summary, in this embodiment, the cooling pipeline is directly integrated into the spray plate to form the spray cooling integrated plate 1, and a heat insulation module is added, for example, various heat insulation boards are added, so that the problem of poor cooling effect is solved; the deflector 6 is added below the oxygen plate 5, so that the phenomenon of more turbulence in the chemical source air flow is improved, and the oxygen plate 5 can be helped to isolate heat; the first baffle plate 7 and the second baffle plate 8 are added in the embodiment, so that the chemical source gas flow is more difficult to be pumped by a vacuum pump, and the utilization rate of the chemical source gas flow is improved.
In the description of the embodiments of the present invention, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "connected," and "connected" should be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
It is apparent that the above examples are given by way of illustration only and are not limiting of the embodiments. Other variations and modifications of the present invention will be apparent to those of ordinary skill in the art in light of the foregoing description. It is not necessary here nor is it exhaustive of all embodiments. And obvious variations or modifications thereof are contemplated as falling within the scope of the present invention.
Claims (9)
1. A spray system for metalorganic chemical vapor deposition, characterized by: comprising the following steps:
a diffusion plate (9) provided with a diffusion channel for diffusing the chemical source gas flow;
the spray cooling integrated plate (1) is used for cooling the chemical source airflow; the spray cooling integrated plate (1) comprises a body, wherein the body is provided with a first cooling pipeline (12) and a second cooling pipeline (15) which are communicated with cooling media, and inflow and outflow paths of the first cooling pipeline (12) and the second cooling pipeline (15) are opposite;
a spraying channel is arranged in the middle of the body, a plurality of spraying holes (11) are respectively formed in two sides of the spraying channel, and the spraying holes (11) on the same side are distributed in a staggered manner;
the first cooling pipeline (12) is provided with a first cooling pipeline inlet (13) and a first cooling pipeline outlet (14), cooling media flow in from the first cooling pipeline inlet (13) and are divided into multiple paths, and after the multiple paths of cooling media pass through a back-and-forth path in the body, the multiple paths of cooling media are combined into one path to flow out from the first cooling pipeline outlet (14);
the second cooling pipeline (15) is positioned in the middle of the spraying channel and is arranged along the length direction of the body; the second cooling pipeline (15) is provided with a second cooling pipeline inlet (17) and a second cooling pipeline outlet (18); the cooling medium flows in from the second cooling pipeline inlet (17) and flows out from the second cooling pipeline outlet (18);
the heat insulation module is used for insulating heat radiation of the spray cooling integrated plate;
an oxygen plate (5) disposed below the heat insulation module for transporting oxygen;
the guide plate (6) is arranged below the oxygen plate (5), uniformly disperses the air flow flowing down from the spray cooling integrated plate (1), changes the flow direction of the oxygen, and mixes the oxygen with the air flow flowing down from the spray cooling integrated plate (1);
a flow blocking module restricts the flow of chemical source gas from the deposition zone.
2. The spray system for metal organic chemical vapor deposition of claim 1, wherein: the spraying holes (11) on the same side are distributed in a plurality of rows, the spraying holes (11) on the same row are on the same horizontal line, and the circle centers of the spraying holes (11) on two adjacent rows are not on the same vertical line.
3. The spray system for metal organic chemical vapor deposition of claim 1, wherein: a plurality of attachment holes (16) are provided along the perimeter of the body.
4. The spray system for metal organic chemical vapor deposition of claim 1, wherein: the body is also provided with a thermocouple.
5. The spray system for metal organic chemical vapor deposition of claim 1, wherein: the cooling medium is gas or liquid.
6. The spray system for metal organic chemical vapor deposition of claim 1, wherein: the heat insulation module comprises at least one group of first heat insulation sheets (2), at least one group of heat insulation plates (3) and at least one group of second heat insulation sheets (4), wherein the first heat insulation sheets (2) are arranged between the spray cooling integrated plate (1) and the heat insulation plates (3), and the second heat insulation sheets (4) are arranged on two sides of the spray cooling integrated plate (1).
7. The spray system for metal organic chemical vapor deposition of claim 1, wherein: the cross section of the guide plate (6) is triangular.
8. The spray system for metal organic chemical vapor deposition of claim 1, wherein: the flow blocking module comprises a first flow blocking plate (7) and a second flow blocking plate (8), wherein the first flow blocking plate (7) is arranged on two sides of the length of the flow guiding plate (6), and the second flow blocking plate (8) is arranged on two sides of the width of the flow guiding plate (6).
9. The spray system for metal organic chemical vapor deposition of claim 8, wherein: the first baffle plate (7) comprises a first connecting plate and a second connecting plate which are arranged in an L shape, and the section of the second connecting plate is arc-shaped.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211122699.XA CN115341197B (en) | 2022-09-15 | 2022-09-15 | Spray cooling integrated plate and spray system for metal organic chemical vapor deposition |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211122699.XA CN115341197B (en) | 2022-09-15 | 2022-09-15 | Spray cooling integrated plate and spray system for metal organic chemical vapor deposition |
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| CN115341197B true CN115341197B (en) | 2023-08-11 |
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Citations (12)
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