CN115332391A - Solar cell photo-assisted metallization manufacturing device and method - Google Patents
Solar cell photo-assisted metallization manufacturing device and method Download PDFInfo
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- CN115332391A CN115332391A CN202211000256.3A CN202211000256A CN115332391A CN 115332391 A CN115332391 A CN 115332391A CN 202211000256 A CN202211000256 A CN 202211000256A CN 115332391 A CN115332391 A CN 115332391A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 34
- 238000000034 method Methods 0.000 title abstract description 38
- 238000007747 plating Methods 0.000 claims abstract description 173
- 238000005507 spraying Methods 0.000 claims abstract description 90
- 230000003213 activating effect Effects 0.000 claims abstract description 64
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- 239000007921 spray Substances 0.000 claims abstract description 8
- 238000005286 illumination Methods 0.000 claims abstract description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 37
- 239000010949 copper Substances 0.000 claims description 23
- 230000033001 locomotion Effects 0.000 claims description 19
- 238000007772 electroless plating Methods 0.000 claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 16
- 229910052802 copper Inorganic materials 0.000 claims description 16
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- 239000002184 metal Substances 0.000 claims description 15
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- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 13
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- 239000010931 gold Substances 0.000 claims description 8
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- 229910000881 Cu alloy Inorganic materials 0.000 claims description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 7
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The invention relates to the technical field of solar cell preparation, in particular to a solar cell photo-assisted metallization manufacturing device and a method, which comprises a shell, a slotting unit, an activating solution unit, a chemical plating solution unit, a gas unit and a conveying unit, wherein the shell is provided with a plurality of grooves; the chemical plating solution unit comprises an electrostatic plating solution spraying device and a light source component, wherein the electrostatic plating solution spraying device sprays plating solution towards the solar cell under an electrostatic field, and the light source component provides illumination with set wavelength for at least partial position of the solar cell; the activating solution unit is correspondingly arranged in front of at least part of the chemical plating solution unit, and the activating solution is sprayed to the solar cell; the gas unit provides a nitrogen atmosphere environment for the interior space. The invention can utilize the surface plasma resonance effect generated when each layer of metal nano particles are irradiated by light sources with different wavelengths during metallization to cause local temperature rise of the surface, provide the required condition temperature for the next layer of chemical plating, and further reduce the requirement for external energy supply in the requirement for increasing the chemical plating reaction temperature.
Description
Technical Field
The invention relates to the technical field of solar cell preparation, in particular to a solar cell photo-assisted metallization manufacturing device and method.
Background
The industrialization efficiency of passivated contact solar cells, such as tunneling oxide layer passivation contact (TOPCon) and Silicon Heterojunction (SHJ) cells, is rapidly improved in nearly two years; while the metallization of passivated contact solar cells presents new challenges compared to Ag or Al screen printing processes used in the mature PERC process flow; in particular, screen printing processes can be used for metallization of TOPCon and SHJ solar cells, but for double-sided passivated contact solar cells the material costs are greatly increased due to the need to print silver (Ag) or silver-aluminum (AgAl) pastes on the front and back sides of the solar cell.
At present, technologies such as electroplating and chemical plating have been developed for the metallization problem of solar cells, but both have defects to some extent in the implementation process, specifically as follows:
the defect of uneven electroplating thickness caused by uneven current distribution in the electroplating process is always difficult to avoid; compared with the prior art, the chemical plating has wide application due to the characteristics of uniform thickness and uniform plating capacity, when the chemical plating is carried out, as long as the surface of a part is contacted with the plating solution, the consumed components in the plating solution can be timely supplemented, the plating thickness of the part to be plated is basically the same, even if the groove, the gap and the blind hole are also the same, the traditional chemical plating has excellent performance, for example, on a good substrate bottom layer, a good metal wire can be obtained through activation treatment; however, the electroless plating requires a large amount of plating solution, and the required temperature is high, such as the temperature required for electroless plating reaches 85-90 ℃, the deposition process is not controlled when the temperature is too high, the plating solution becomes unstable, the temperature rise can cause the plating solution to spontaneously decompose or precipitate or even fail, the deposition rate can gradually decrease, and meanwhile, the production cost of metallization of the solar cell can also be increased.
How to overcome the above-mentioned drawbacks and provide a manufacturing apparatus and method that are more stable and relatively optimized in terms of process and cost becomes a problem to be solved by those skilled in the art.
Disclosure of Invention
The invention provides a solar cell photo-assisted metallization manufacturing device and method, which effectively solve the problems pointed out in the background technology.
In order to achieve the purpose, the invention adopts the technical scheme that:
a solar cell photo-assisted metallization manufacturing device comprises a shell, a slotting unit, an activating solution unit, a chemical plating solution unit, a gas unit and a transmission unit, wherein the slotting unit, the activating solution unit, the chemical plating solution unit, the gas unit and the transmission unit are arranged in the inner space of the shell;
the conveying unit conveys the solar cells in the inner space according to a set route;
the grooving unit, the activating solution unit and the chemical plating solution unit are used in pairs in groups, and two units in each group are symmetrically arranged on two sides of the conveying unit;
the slotting unit is arranged on one side of an inlet of the shell, and an electrode slot is scribed on the surface of the solar cell sheet through laser;
in the transmission direction of the solar cell, the chemical plating solution units are provided with at least two groups at the rear section of the slotting unit, each chemical plating solution unit comprises an electrostatic plating solution spraying device and a light source component, the electrostatic plating solution spraying device sprays plating solution towards the solar cell under an electrostatic field, and the light source component provides illumination with set wavelength for at least partial position of the solar cell;
the activating solution unit is correspondingly arranged in front of at least part of the chemical plating solution unit, and is used for spraying activating solution to the solar cell;
the gas unit provides a nitrogen atmosphere environment for the interior space.
Further, the electrostatic plating solution spraying device comprises a miniature ultrasonic device, and the miniature ultrasonic device is arranged at a plating solution spraying end of the electrostatic plating solution spraying device.
The solar cell further comprises a slotting unit, an activating solution unit and a chemical plating solution unit which comprise power devices, wherein the power devices respectively control the positions of a laser emission end, an activating solution spraying end or a plating solution spraying end;
the power device comprises an X-axis power assembly and a Y-axis power assembly;
the X-axis power assembly drives the Y-axis power assembly to perform linear motion along the X-axis direction, and the Y-axis power assembly drives the laser emission end, the activating solution spraying end or the plating solution spraying end to perform linear motion along the Y-axis direction respectively.
Further, the X-axis power assembly comprises a first motor, a frame, a screw structure and a guide strip;
the two screw rod structures are arranged in parallel, and two ends of the screw rod structures are respectively connected with the frame in a rotating manner;
the first motor is fixed on the frame and provides rotation power for at least one screw structure;
the guide strip is sleeved outside the two screw rod structures through two through threaded holes respectively, and the threaded holes are matched with the external threads of the screw rod structures;
the guide strip is used for installing the Y-axis power assembly.
Further, the Y-axis power system comprises a mounting seat and a belt transmission assembly;
the guide strip is provided with a guide structure for linearly guiding the mounting seat;
the belt transmission assembly provides linear motion power for the mounting seat;
the mounting seat fixes the laser emitting end, the activating solution spraying end or the plating solution spraying end.
Furthermore, the guide structure is a through groove body arranged on the guide strip;
the two opposite ends of the mounting seat are respectively provided with a sunken area, and the edge of the through groove body is locally embedded into the sunken areas and is attached to the inner wall of the sunken areas.
Further, the belt conveying assembly comprises two wheel bodies, a belt and a second motor;
the two wheel bodies are installed on the guide strip, the belt is sleeved outside the two wheel bodies, and the local position of the belt and the installation seat are relatively fixed in the guide direction of the guide structure.
Further, the conveying unit comprises a reciprocating conveying device and a limiting clamp;
the limiting clamp is fixed on the reciprocating conveying device and is used for fixing the solar cell; the reciprocating conveying device drives the solar cell pieces to move along the set route through the limiting belts;
the limiting clamp is provided with a reference position for positioning the solar cell.
Further, the gas unit comprises a gas supply pipeline for supplying gas required by a nitrogen atmosphere environment to the inner space;
the air supply pipeline is provided with a row of concave areas along the length direction, the side wall of each concave area is provided with a plurality of air holes communicated with the inside and the outside of the air supply pipeline, and the ventilation direction of each air hole faces to the center of the concave area.
A solar cell photo-assisted metallization manufacturing method adopts the solar cell photo-assisted metallization manufacturing device for manufacturing Ni/Cu/Sn alloy electrodes on solar cell sheets;
the method comprises the following steps:
providing a nitrogen atmosphere environment, conveying the solar cell slices according to a set route in the nitrogen atmosphere environment, and respectively executing the following steps at set positions of the set route;
etching an electrode groove on the surface of at least one side of the solar cell sheet by laser;
spraying a palladium-gold core-shell nano solution as an activation solution at the position of the electrode groove; irradiating the spraying position of the activating liquid by a light source with a set wavelength; electrostatic spraying chemical nickel plating solution on the position of the electrode tank to form a metal nickel layer;
spraying silver nanoparticle solution as activating solution at the position of the electrode tank; irradiating the spraying position of the activating liquid by a light source with a set wavelength; electrostatically spraying chemical copper plating solution at the position of the electrode tank to form a metal copper layer;
and electrostatically spraying chemical tin plating solution at the position of the electrode tank to form a metallic tin layer.
Through the technical scheme of the invention, the following technical effects can be realized:
according to the invention, the surface local temperature rise caused by the surface plasma resonance effect generated when each layer of metal nano particles is irradiated by light sources with different wavelengths in metallization can be utilized to provide the required condition temperature for the next layer of chemical plating, so that the requirement for external energy supply in the requirement for raising the reaction temperature of chemical plating is reduced, and the problem caused by the temperature rise of the plating solution is effectively relieved; the plating solution is sprayed, so that the using amount of the plating solution can be reduced compared with the method of immersing the part into the plating solution, and meanwhile, the influence of the temperature on the plating solution is also reduced.
Through the arrangement of the power device, the laser emission end, the activating solution spraying end or the plating solution spraying end can obtain a motion track which is consistent with that of the electrode groove, and in this way, the activating solution and the plating solution can be sprayed corresponding to the arrangement position of the electrode groove, so that the use amount is effectively reduced; from the control point of view, when the continuous production is realized, the power devices corresponding to the laser emission end, the activating solution spraying end or the plating solution spraying end can be synchronously controlled, so that the manufacturing accuracy is effectively ensured, and the control of the spraying range can be realized only through the change of the spray head.
According to the invention, the electrode groove is carved by laser, and the Ni/Cu/Sn alloy electrode is formed by depositing the metal electrode in the electrode groove in combination with photo-assisted chemical plating, so that each formed metal electrode coating is compact, uniform and pinhole-free, the adhesion with a solar cell is high, the contact resistance can be smaller than 1mohm by controlling the manufacturing process, the metal electrode coating can resist high temperature welding of 250 ℃ at most and can not fall off, the stress is small, and the metal electrode coating can resist high and low temperature impact and high humidity and heat cycle.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the description of the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present invention, and it is also possible for those skilled in the art to obtain other drawings based on the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a solar cell photo-assisted metallization fabrication apparatus;
FIG. 2 is a frame diagram of the electrostatic plating solution spraying apparatus and a schematic diagram of the spraying toward the solar cell;
FIG. 3 is a schematic view of the power plant at a first angle;
FIG. 4 is a schematic view of the power plant at a second angle;
FIG. 5 is an enlarged view of a portion of FIG. 4 at C;
FIG. 6 is an enlarged view of a portion of FIG. 4 at D;
FIG. 7 is an enlarged view of a portion of FIG. 3 at E;
FIG. 8 is a schematic view of the solar cell before and after being mounted with respect to the position-limiting clamp;
FIG. 9 is a partial schematic view of a spacing clip;
FIG. 10 is a schematic view of the structure of the air supply line;
FIG. 11 is a partial sectional view of the air supply line;
FIG. 12 is a flow chart of a solar cell photo-assisted metallization fabrication method;
reference numerals: 1. a housing; 2. a slotting unit; 3. an activating liquid unit; 4. an electroless plating solution unit; 41. an electrostatic plating solution spraying device; 41a, an electrostatic generating part; 41b, a plating solution supply part; 41c, a gun body; 42. a light source part; 5. a gas unit; 51. an air supply pipeline; 51a, a recessed region; 51b, a vent hole; 6. a transfer unit; 61. a limiting clamp; 61b, a first reference block; 61c, a second reference block; 61d, a first extrusion block; 61e, a second extrusion block; 61f, a guide rod; 61g, a stop block; 61h, a spring; 7. a solar cell sheet; 8. a power plant; 81. an X-axis power assembly; 81a, a first motor; 81b, a frame; 81c, a screw structure; 81d, a guide strip; 81e, a bearing; 82. a Y-axis power assembly; 82a, a mounting seat; 82b, a wheel body; 82c, a belt; 82d, bolt structure.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Example one
As shown in fig. 1 to 11, a photo-assisted metallization manufacturing device for a solar cell comprises a housing 1, a slotting unit 2, an activating solution unit 3, an electroless plating solution unit 4, a gas unit 5 and a transmission unit 6, wherein the slotting unit 2, the activating solution unit 3, the electroless plating solution unit 4, the gas unit and the transmission unit are mounted in the inner space of the housing 1; the conveying unit 6 conveys the solar cells 7 in the internal space according to a set route; the slotting unit 2, the activating solution unit 3 and the chemical plating solution unit 4 are used in pairs in groups, and two units in each group are symmetrically arranged at two sides of the conveying unit 6; the slotting unit 2 is arranged on one side of the inlet of the shell 1, and an electrode slot is engraved on the surface of the solar cell 7 through laser; in the transmission direction of the solar cell piece 7, at least two groups of chemical plating solution units 4 are arranged at the rear section of the slotting unit 2, each chemical plating solution unit 4 comprises an electrostatic plating solution spraying device 41 and a light source part 42, the electrostatic plating solution spraying device 41 sprays plating solution towards the solar cell piece 7 under an electrostatic field, and the light source part 42 provides illumination with set wavelength for at least partial position of the solar cell piece 7; wherein, the activating solution unit 3 is correspondingly arranged in front of at least part of the chemical plating solution unit 4, and sprays activating solution to the solar cell 7; the gas unit 5 provides a nitrogen atmosphere environment for the internal space.
In the working process, the laser of the slotting unit 2 can be selected to be green light of 532nm conventionally, and the electrode groove can be etched on the surface of the solar cell sheet 7 according to a set track through setting of a program, wherein the slotting unit 2 is arranged on two sides of the transmission unit 6, so that the etching can be selected to be directed at one side or two sides of the solar cell sheet 7, or two opposite sides of two attached solar cell sheets 7, and the like.
In the invention, the activating solution unit 3 and the electroless plating solution unit 4 can be set in a modular structure, the specific setting number and setting position are specifically selected according to the manufacturing process, in the invention, taking the electroless plating of the Ni/Cu/Sn alloy electrode on the solar cell 7 as an example, the activating solution unit 3 is required to be adopted for catalyzing the electroless plating solution unit 4 for performing electroless nickel plating and electroless copper plating, and the electroless plating solution unit 4 for performing electroless tin plating can realize autocatalysis due to the electroless tin plating, so that the activating solution unit 3 is not required to be activated, and the use of the activating solution unit 3 is omitted.
In the electroless plating solution unit 4, the electrostatic plating solution spraying device 41 is inevitably used, and the plating solution is sprayed; the light source unit 42 is selectively turned on, and is provided to increase the surface temperature of the solar cell sheet 7 to obtain a better electroless plating layer, and to be turned off when a specific plating layer does not need to be heated. Specifically, in the process of implementing the chemical plating of the Ni/Cu/Sn alloy electrode, when the nickel plating is performed, the light source component 42 may provide 520nm green light irradiation conditions for the position of the electrode slot on the solar cell 7, and when the copper plating is performed, the light source component 42 may provide 420nm blue light irradiation conditions for the position of the electrode slot on the solar cell 7; in the case of tin plating, since the oxidation-reduction reaction can be performed by electroless tin plating at normal temperature, the light source member 42 can be turned off.
Specifically, on the principle of temperature rise, the invention can utilize the surface plasma resonance effect generated when each layer of metal nano particles are irradiated by light sources with different wavelengths during metallization to cause local temperature rise of the surface, and provide the required condition temperature for the next layer of chemical plating, thereby reducing the requirement on external energy supply in the requirement of chemical plating reaction temperature rise; based on the principle, different activating solutions can be adopted for different plating solutions, in the embodiment, when chemical nickel plating is carried out, the activating solution can adopt a palladium-gold core-shell nano solution which comprises core palladium particles and a shell gold film, the composite particles have dual functions of catalysis and surface plasma resonance, and at least part of required temperature is provided for the reaction of the chemical nickel plating solution by utilizing the absorption enhancement effect of the composite gain metal nano particles; during electroless copper plating, the activating solution can be a silver nanoparticle solution, and at least part of the required temperature can be provided for the electroless copper plating solution reaction on the solar cell 7.
In the process, the realization of the corresponding plating layer is promoted based on the plasma resonance effect, compared with the mode of heating the plating solution for the part to enter in the prior art, the energy consumption for heating the plating solution which is stored in a centralized way can be greatly saved by a local heating mode, and the unstable condition of the plating solution which is possibly generated at high temperature can be avoided; in the present application, the plating solution used for spraying may be directly sprayed in a state of normal temperature or in a state of being appropriately heated, and the technical purpose to be achieved is to enable the plating layer on the solar cell to achieve a set effect, specifically, as a preferred mode, the electrostatic plating solution spraying apparatus 41 includes an electrostatic generating portion 41a, a plating solution supplying portion 41b, and a gun body 41c; the electrostatic generating part 41a is used for forming an electrostatic field between the gun body 41c and the solar cell 7, and the plating solution supplying part 41b sprays the plating solution to the solar cell 7 through the gun body 41c; wherein, the heating unit is arranged on the part of the gun body 41c and/or the pipeline between the gun body 41c and the plating solution supply part 41b to heat the plating solution, when the heating unit is arranged, the heating mode of the invention can be effectively assisted, and when the limit value of temperature rise, the speed of temperature rise and the control precision of temperature rise have higher requirements, the heat can be supplied as an auxiliary means. As shown in fig. 2, a position a where a heating unit can be installed is shown, the position is located at a local part of the gun body 41c, meanwhile, a position B where the heating unit can be installed is also shown, the position is located on a pipeline between the gun body 41c and the plating solution supply part 41B, the heating mode of the heating unit for the plating solution in the invention is different from the mode of heating the whole plating solution in the existing mode, because the plating solution is subjected to heat exchange in a flowing state when passing through the heating unit, the influence is small, and the effect of obtaining the plating layer subsequently is increased only through temperature rise, wherein, the forms of the optional heating units are more, and the mode of attaching the heating sheet is a convenient and low-cost mode. Wherein, the diameter range of the nozzle hole position of the gun body 41c can be selected from 50 μm-160 μm, the plating layer of the bottom layer is more suitable for the nozzle with larger diameter, and the plating layer of the top layer is more suitable for the nozzle with smaller diameter.
And aiming at different activating solutions, light sources with different wavelengths can be selected for irradiation, and the power of the light sources can be adjusted in the process to control the required chemical plating temperature.
In order to avoid the blockage of the plating solution nozzle, the electrostatic plating solution spraying device 41 preferably includes a micro ultrasonic device, which is installed at the plating solution spraying end of the electrostatic plating solution spraying device 41, and performs ultrasonic treatment on the electroless plating solution in the spraying process to prevent the plating solution from depositing and blocking the nozzle; specifically to the above embodiments, the miniature ultrasonic device may be mounted on the gun body 41 c.
The grooving unit 2, the activating solution unit 3 and the chemical plating solution unit 4 are used in pairs respectively for the purpose of directly finishing the synchronous metallization work of two sides of the solar cell 7 when needed; the electrostatic plating solution spraying device 41 of the present invention can adopt the prior art, wherein the voltage of the electrostatic field can be selected according to the needs, and the range of 10kv to 15kv is suitable, for example, when chemical nickel plating is performed, the chemical plating solution can be sprayed onto the solar cell sheet 7 by the electrostatic plating solution spraying device 41 under the action of the electrostatic field of 10kV, and when chemical copper plating is performed, the chemical plating solution can be sprayed onto the solar cell sheet 7 by the electrostatic plating solution spraying device 41 under the action of the electrostatic field of 15kV, and the above numerical values can be specifically adjusted according to the requirements.
The photo-assisted electrostatic spraying of the chemical plating solution is carried out on the surface of the solar cell piece 7, wherein the spraying mode can also reduce the consumption of the plating solution, thereby reducing the cost; and providing a solution for reducing the required condition temperature in the chemical plating process, and reducing the influence on the plating solution by means of local temperature rise through targeted illumination; the preparation of the corrosion-resistant and wear-resistant metallized electrode of the solar cell can be realized through the implementation of the method, so that the economic benefit is further improved as large-capacity production equipment.
In order to further reduce the usage amount of the plating solution and the activating solution, preferably, the spraying of the solutions is performed according to the opening position of the electrode tank, and in order to achieve the above purpose, as shown in fig. 3~6, the slotting unit 2, the activating solution unit 3 and the electroless plating solution unit 4 all include a power device 8, and the power device 8 performs position control for a laser emission end, an activating solution spraying end or a plating solution spraying end respectively; the power device 8 comprises an X-axis power assembly 81 and a Y-axis power assembly 82; the X-axis power assembly 81 drives the Y-axis power assembly 82 to perform linear motion along the X-axis direction, and the Y-axis power assembly 82 drives the laser emission end, the activating solution spraying end or the plating solution spraying end to perform linear motion along the Y-axis direction respectively.
Referring to fig. 3 and 4, in the implementation process, the power parts of the X-axis power assembly 81 and the Y-axis power assembly 82 are controlled, so that the laser emission end, the activating solution spraying end or the plating solution spraying end can obtain a movement track which is consistent with the electrode tank through the movement combination in the X-axis and Y-axis directions, and in this way, the activating solution and the plating solution can be sprayed corresponding to the arrangement positions of the electrode tank, so that the usage amount is effectively reduced, wherein the X-axis direction and the Y-axis direction are arranged in the horizontal and vertical directions; from the control point of view, when the continuous production is realized, the power device 8 corresponding to the laser emission end, the activating solution spraying end or the plating solution spraying end can be synchronously controlled, so that the manufacturing accuracy is effectively ensured.
As specific structures of the X-axis power assembly 81 and the Y-axis power assembly 82, the present invention provides a specific embodiment in which the X-axis power assembly 81 includes a first motor 81a, a frame 81b, a screw structure 81c, and a guide bar 81d; two screw structures 81c are arranged in parallel, and two ends of each screw structure are respectively connected with the frame 81b in a rotating manner; the first motor 81a is fixed on the frame 81b and provides rotational power for at least one of the screw structures 81 c; the guide strip 81d is sleeved outside the two screw structures 81c through two through threaded holes respectively, and the threaded holes are matched with the external threads of the screw structures 81 c; the guide bar 81d mounts the Y-axis power module 82.
By controlling the first motor 81a, one of the screw structures 81c can rotate according to a set rotation speed, and the guide strip 81d can perform linear motion along the axial direction of the screw structure 81c under the common limitation of the two screw structures 81c, so as to realize position adjustment in the X-axis direction.
Wherein, the first motor 81a preferably provides the rotating power for the two screw structures 81c at the same time, and the equidirectional and uniform rotation of the two screw structures 81c is easily realized through the transmission structure, in the present invention, because the guide strip 81d needs to install and guide the movement of the Y-axis power assembly 82, the length thereof is longer, and the double screw structure 81c can effectively ensure the stability and reliability of the movement thereof.
In the process of installing the screw structure 81c, as shown in fig. 5, a bearing 81e may be first installed on the frame 81b, and the screw structure 81c is supported and fixed by the bearing 81e to realize the rotational connection with respect to the frame 81 b.
And wherein the Y-axis power system may preferably include a mount 82a and a belt drive assembly; a guide structure is arranged on the guide strip 81d to linearly guide the mounting seat 82 a; the belt transmission assembly provides linear motion power for the mounting seat 82 a; wherein the mount 82a fixes the laser emitting end, the activating solution spraying end or the plating solution spraying end.
In the preferred embodiment, the guide bar 81d is used as a mounting and guiding structure to realize the stable movement of the mounting seat 82a, and the mounting seat 82a is used for fixing the laser emitting end, the activating solution spraying end or the plating solution spraying end, so that the etching position of the laser, the spraying position of the activating solution and the spraying position of the plating solution can be stably controlled, and the technical purpose can be effectively realized.
The guide structure is a through groove body arranged on the guide strip 81d, and is a preferable mode; the opposite ends of the mounting seat 82a are respectively provided with a recessed area 51a, penetrate through the edge of the groove body and are partially embedded into the recessed area 51a, and are attached to the inner wall of the recessed area 51 a. In this way, a more convenient guide structure is provided, and the mounting seat 82a can obtain stable guide by partially covering the guide strip 81 d.
Wherein, the belt transmission component comprises two wheel bodies 82b, a belt 82c and a second motor; the two wheels 82b are both mounted on the guide bar 81d, the belt 82c is sleeved outside the two wheels 82b, and a local position of the belt 82c is fixed relative to the mounting seat 82a in the guiding direction of the guiding structure.
In the implementation process, the power output of the second motor can drive one of the wheel bodies 82b to rotate, and the friction force between the belt 82c and the wheel body 82b can realize the synchronous rotation of the other wheel body 82b and the reciprocating motion of the belt 82c, so that the mounting seat 82a can be driven to move in the movement process of the belt 82 c. In order to avoid the belt 82c slipping relative to the wheel 82b, the wheel 82b may be provided as a gear, and teeth engaged with the gear are correspondingly provided on the inner side of the belt 82c, in which case, the partial relative fixation of the belt 82c to the mounting seat 82a may be realized by providing a rack on the mounting seat 82a, and engaging the rack with the teeth on the inner side of the belt 82c, as shown in fig. 6.
In order to better realize the fixation of the laser emission end, the activating solution spraying end or the plating solution spraying end, as shown in fig. 7, a hole position may be correspondingly disposed on the mounting seat 82a for the local penetration of the above structures, and for the fixation of the penetration portion, a bolt structure 82d penetrating the side wall of the mounting seat 82a and being in threaded connection with the side wall of the mounting seat 82a may be adopted for extrusion fixation.
In the implementation process, when the installation seat 82a fixes the plating solution spraying end, since the electroless plating solution unit 4 includes the electrostatic plating solution spraying device 41 and the light source component 42, the installation seat 82a can also be used as the installation structure of the light source component 42, as shown in fig. 7, and the light source and the plating solution spraying position can move synchronously, thereby always playing a predetermined role in the corresponding position of the electrode bath; of course, this is only one way of fixing the light source member 42, and when the electrostatic plating solution spraying apparatus 41 is provided with a position for mounting the light source member 42, the light source member 42 may be mounted in combination with the electrostatic plating solution spraying apparatus 41 to obtain a synchronous movement, and the above-mentioned ways are within the scope of the present invention.
As a preference of the above embodiment, the transfer unit 6 includes a reciprocating transfer device and a stopper clip 61;
the limiting clamp 61 is fixed on the reciprocating conveying device and used for fixing the solar cell 7; the reciprocating conveying device drives the solar cell 7 to move along a set route through the limiting clamp 61;
the stopper clip 61 has a reference position for positioning the solar cell sheet 7.
To reciprocal conveyer, can adopt the conveyer belt device among the prior art, and in order to guarantee to the stable support of conveyer belt, can set up a plurality of running rollers and support the conveyer belt, and spacing clamp 61 is installed on the conveyer belt through the position of setting for making the conveyer belt under the speed of setting for, can reach fluting unit 2, activation liquid unit 3 and chemical plating liquid unit 4 according to the beat of setting for under the circumstances of guaranteeing continuous production, make the electrode bath position and metallization process all accurately go on.
Also for the purpose of accurate positioning, it is necessary to set a reference position on the spacing clip 61, so as to ensure that the solar cell 7 is always accurately positioned, and to ensure the realization of the above-mentioned continuous production purpose. As a simpler mode, a groove body for accommodating the local part of the solar cell piece 7 can be directly arranged on the limiting clamp 61, and the positioning is realized by the way that the side wall of the groove body is partially attached to the solar cell piece 7, wherein the local side wall of the groove body can be used as a reference position to ensure that the solar cell piece 7 can be accurately positioned in the horizontal direction, but the mode is only suitable for the solar cell piece 7 with a fixed size; in addition to the above manner, the limiting clamp 61 may be configured as a general-purpose structure capable of fixing solar cells 7 with different size ranges, as shown in fig. 9, as a specific manner, the limiting clamp 61 may include two reference blocks and two pressing blocks, such as a first reference block 61b, a second reference block 61c, a first pressing block 61d and a second pressing block 61e, which are fixedly arranged, wherein the first reference block 61b may be used in combination with the first pressing block 61d, and the second reference block 61c may be used in combination with the second pressing block 61e, wherein the two reference blocks may provide a reference for attaching and positioning the solar cells 7 within a certain size range through a suitable interval and control of their sizes, and the first pressing block 61d and the second pressing block 61e may press and fix the solar cells 7 in a stable attaching position with the two reference blocks through elastic pressing.
As a preferable mode in the above embodiment, an elastic component is provided between the reference block and the pressing block used in a group, the elastic component includes a guide rod 61f penetrating through the reference block and the pressing block, an outer wall of the guide rod 61f is attached to the penetrating position, both ends of the guide rod 61f are provided with stoppers 61g to prevent the guide rod 61f from being detached from the penetrating position, wherein at least one end of the guide rod 61f is sleeved with a spring 61h, one end of the spring 61h abuts against the stopper 61g, and the other end abuts against the reference block and/or the pressing block, and after the solar cell 7 is inserted, the reference block and the pressing block relatively generate a pressing force on the solar cell 7 by a restoring force generated by pressing the spring 61 h.
Of course, the above-mentioned optimization is only one structure capable of achieving the technical purpose of the present invention, and other structures capable of achieving the same technical purpose are also within the scope of the present invention.
As a preference of the above embodiment, the gas unit 5 includes a gas supply line 51 for supplying a gas required for a nitrogen atmosphere environment to the internal space; the air supply pipe 51 is provided with a row of recessed regions 51a along the longitudinal direction, the side walls of the recessed regions 51a are provided with a plurality of air holes 51b communicating the inside and the outside of the air supply pipe 51, and the air direction of each air hole 51b is toward the center of the recessed region 51 a.
As shown in fig. 10 and 11, in the above-described preferred embodiments, a structure capable of reducing the concentrated impact when the gas enters is provided, and the gas flowing out of the respective vent holes 51b collides with each other at the center of the concave area 51a to lose the concentrated directivity, and enters the inner space in a more dispersed manner, which can reduce the influence of the gas impact on the metallization process.
The recessed area 51a may be obtained by stamping, in order to better realize the stamping process, the air supply pipeline 51 may be divided into different parts, wherein one part of the recessed area 51a is obtained by stamping, and the part is preferably a flat plate structure, and during the stamping process, the recessed area 51a is preferably a spherical area, which can reduce the risk of defects generated by stamping, wherein the vent hole 51b may be drilled after stamping.
In the implementation process, in order to realize the collection of waste liquid, the diversion trenches can be arranged on two sides of the conveying unit 6, the diversion trenches are connected with the waste liquid tank, and the waste liquid tank is used for recovering the activating liquid and the chemical plating liquid collected by the diversion trenches.
Example two
As shown in fig. 12, a solar cell photo-assisted metallization manufacturing method adopts the solar cell photo-assisted metallization manufacturing device in the above embodiment, and is used for manufacturing a Ni/Cu/Sn alloy electrode on a solar cell sheet 7;
the method comprises the following steps:
s1: providing a nitrogen atmosphere environment, conveying the solar battery pieces 7 according to a set route in the nitrogen atmosphere environment, and respectively executing the following steps at set positions of the set route;
s2: etching an electrode groove on the surface of at least one side of the solar cell 7 by laser;
s3: spraying a palladium-gold core-shell nano solution as an activating solution at the position of the electrode tank; irradiating the spraying position of the activating liquid by a light source with a set wavelength; electrostatic spraying chemical nickel plating solution on the position of the electrode tank to form a metal nickel layer;
s4: spraying silver nanoparticle solution as activating solution at the position of the electrode tank; irradiating the spraying position of the activating liquid by a light source with a set wavelength; electrostatically spraying chemical copper plating solution at the position of the electrode tank to form a metal copper layer;
s5: and (4) electrostatically spraying chemical tin plating solution at the position of the electrode tank to form a metallic tin layer.
As described in the above embodiments, the set wavelength may include 520nm green light, 420nm blue light, 580nm yellow light, etc., and in this embodiment, 520nm green light may be used for the palladium-gold core-shell nano solution of the activation solution, and 420nm blue light is preferably used for the silver nano particle solution.
In the above embodiment, the palladium-gold core-shell nano solution comprises an inner core palladium particle and an outer shell gold film, and the composite particle has dual functions of catalysis and surface plasmon resonance; the absorption enhancement effect of the composite gain metal nano particles is utilized to provide the required temperature for the reaction of the chemical nickel plating solution under the illumination condition. Similarly, the activation solution in the copper plating activation region is a silver nanoparticle solution, and a layer of uniform catalytic nucleation is also formed on the surface of the solar cell 7, so that the purpose of providing the reaction temperature is finally achieved.
Aiming at the nickel plating process, under the temperature environment provided by irradiation of 520nm green light on an electrode groove, chemical plating solution can be sprayed to a set position of a solar cell 7 under the action of a 10kV electrostatic field, the chemical plating solution generates oxidation-reduction reaction at a proper temperature in the electrode groove, and a metal nickel layer can be formed within a set time; in the copper plating process, the electroless plating solution is sprayed to a set position of the solar cell 7 under the action of an electrostatic field of 15kV, and the electroless plating solution is subjected to redox reaction at a proper temperature in an electrode tank, so that a metal copper layer can be formed within a set time.
In the above process, the relationship between the spray areas of the activating solution and the plating solution may be: the spraying area of the activating solution is larger than that of the plating solution, but the two spraying areas are preferably controlled within a set range, and when the metalized plating area on the solar cell 7 is continuously sprayed by electrostatic spraying, the width and the thickness of the metalized plating area can be accurately controlled, so that the waste of the electroless plating solution is effectively reduced; the area range of the temperature increase on the solar cell 7 can be properly enlarged by properly increasing the spraying area of the activating solution, a more uniform temperature environment can be provided for the oxidation-reduction reaction generated by the plating solution, and the method is favorable for forming a uniform metalized area.
According to the invention, the electrode groove is carved by laser, and the Ni/Cu/Sn alloy electrode is formed by combining with photo-assisted chemical plating and depositing in the electrode groove, so that each formed metal electrode coating is compact, uniform and pinhole-free, the adhesion with a solar cell 7 is high, the contact resistance can be controlled to be less than 1mohm by controlling the manufacturing process, the highest welding temperature of 250 ℃ can be resisted, the falling-off is avoided, the stress is small, the high-low temperature impact resistance is resisted, and the high-humidity heat cycle resistance is resisted.
Since the chemical tinning can be autocatalytic and does not need to be activated, the chemical tinning directly enters a chemical tinning area after the chemical copper plating is finished; meanwhile, the chemical tin plating can carry out oxidation-reduction reaction at normal temperature, so that no extra light source is needed for irradiation, and the chemical tin plating solution is sprayed on the solar cell 7 under the action of the electrostatic field of 15kV, thus completing the whole metallization process.
The metal plating is carried out by adopting an electrostatic spraying mode, and three chemical plating solutions are prepared, so that the nickel plating time can be controlled to be 20-30s, the copper plating time can be controlled to be 10-15s, and the tin plating time can be controlled to be 10-12s; the solar cell metallization batch production can be realized.
After metallization is finished, annealing treatment of the solar cell is required; wherein the annealing treatment adopts gradient temperature rise for annealing; if the temperature is increased in a gradient way, the temperature is kept for 10min at 490 ℃ in the first stage, for 10min at 640 ℃ in the second stage and for 5 min at 870 ℃ in the third stage.
The foregoing shows and describes the general principles, principal features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (10)
1. The solar cell photo-assisted metallization manufacturing device is characterized by comprising a shell, a slotting unit, an activating solution unit, a chemical plating solution unit, a gas unit and a conveying unit, wherein the slotting unit, the activating solution unit, the chemical plating solution unit, the gas unit and the conveying unit are arranged in the inner space of the shell;
the conveying unit conveys the solar cells in the inner space according to a set route;
the grooving unit, the activating solution unit and the chemical plating solution unit are used in pairs in groups, and two units in each group are symmetrically arranged on two sides of the conveying unit;
the slotting unit is arranged on one side of the inlet of the shell, and an electrode slot is engraved on the surface of the solar cell sheet through laser;
in the transmission direction of the solar cell, the chemical plating solution units are provided with at least two groups at the rear section of the slotting unit, each chemical plating solution unit comprises an electrostatic plating solution spraying device and a light source component, the electrostatic plating solution spraying device sprays plating solution towards the solar cell under an electrostatic field, and the light source component provides illumination with set wavelength for at least partial position of the solar cell;
the activating solution unit is correspondingly arranged in front of at least part of the chemical plating solution unit, and is used for spraying activating solution to the solar cell;
the gas unit provides a nitrogen atmosphere environment for the interior space.
2. The photo-assisted metallization manufacturing device for solar cells according to claim 1, characterized in that the electrostatic plating solution spraying device comprises a micro ultrasonic device, and the micro ultrasonic device is installed at a plating solution spraying end of the electrostatic plating solution spraying device.
3. The solar cell photo-assisted metallization manufacturing device according to claim 1 or 2, wherein the slotting unit, the activating solution unit and the electroless plating solution unit each comprise a power device, and the power devices respectively perform position control for a laser emitting end, an activating solution spraying end or a plating solution spraying end;
the power device comprises an X-axis power assembly and a Y-axis power assembly;
the X-axis power assembly drives the Y-axis power assembly to perform linear motion along the X-axis direction, and the Y-axis power assembly drives the laser emission end, the activating solution spraying end or the plating solution spraying end to perform linear motion along the Y-axis direction respectively.
4. The solar cell photo-assisted metallization manufacturing apparatus according to claim 3, wherein the X-axis power assembly comprises a first motor, a frame, a screw structure and a guide bar;
two screw structures are arranged in parallel, and two ends of each screw structure are respectively and rotatably connected with the frame;
the first motor is fixed on the frame and provides rotation power for at least one screw structure;
the guide strip is sleeved outside the two screw rod structures through two through threaded holes respectively, and the threaded holes are matched with the external threads of the screw rod structures;
the guide strip is used for installing the Y-axis power assembly.
5. The solar cell photo-assisted metallization fabrication apparatus of claim 4, wherein the Y-axis power system comprises a mount and a belt transport assembly;
the guide strip is provided with a guide structure for linearly guiding the mounting seat;
the belt transmission assembly provides linear motion power for the mounting seat;
the mounting seat fixes the laser emitting end, the activating solution spraying end or the plating solution spraying end.
6. The photo-assisted metallization manufacturing device for solar cells according to claim 5, characterized in that the guiding structure is a through slot body arranged on the guiding strip;
the two opposite ends of the mounting seat are respectively provided with a sunken area, and the edge of the through groove body is locally embedded into the sunken area and is attached to the inner wall of the sunken area.
7. The photo-assisted metallization device for solar cells of claim 5, wherein the belt conveyor assembly comprises two wheels, a belt and a second motor;
the two wheel bodies are arranged on the guide strip, the belt is sleeved outside the two wheel bodies, and the local position of the belt and the installation seat are relatively fixed in the guide direction of the guide structure.
8. The solar cell photo-assisted metallization manufacturing device according to claim 1, wherein the transfer unit comprises a reciprocating transfer device and a spacing clip;
the limiting clamp is fixed on the reciprocating conveying device and is used for fixing the solar cell slice; the reciprocating conveying device drives the solar cell pieces to move along the set route through the limiting belts;
the limiting clamp is provided with a reference position for positioning the solar cell.
9. The solar cell photo-assisted metallization manufacturing apparatus according to claim 1, wherein the gas unit includes a gas supply line for supplying a gas required for a nitrogen atmosphere environment to the internal space;
the air supply pipeline is provided with a row of concave areas along the length direction, the side wall of each concave area is provided with a plurality of vent holes communicated with the inside and the outside of the air supply pipeline, and the ventilation direction of each vent hole faces to the central position of the concave area.
10. A solar cell photo-assisted metallization manufacturing method, which adopts the solar cell photo-assisted metallization manufacturing device of any one of the claims 1~9 for manufacturing Ni/Cu/Sn alloy electrodes on solar cell sheets;
it is characterized by comprising:
providing a nitrogen atmosphere environment, conveying the solar cell slices according to a set route in the nitrogen atmosphere environment, and respectively executing the following steps at set positions of the set route;
etching an electrode groove on the surface of at least one side of the solar cell sheet by laser;
spraying a palladium-gold core-shell nano solution as an activation solution at the position of the electrode groove; irradiating the spraying position of the activating liquid by a light source with a set wavelength; electrostatic spraying chemical nickel plating solution on the position of the electrode tank to form a metal nickel layer;
spraying silver nanoparticle solution as activating solution at the position of the electrode tank; irradiating the spraying position of the activating liquid by a light source with a set wavelength; electrostatically spraying chemical copper plating solution at the position of the electrode tank to form a metal copper layer;
and (3) electrostatically spraying chemical tin plating solution at the position of the electrode tank to form a metallic tin layer.
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| CN114703468A (en) * | 2022-03-21 | 2022-07-05 | 晶澳（扬州）太阳能科技有限公司 | Method for plating nickel layer on silicon substrate and preparation method of solar cell nickel electrode |
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| EP2234165A2 (en) * | 1998-06-03 | 2010-09-29 | Everlight Electronics Co., Ltd. | Photoelectric transmitting or receiving device and manufacturing method thereof |
| US20100124619A1 (en) * | 2008-11-14 | 2010-05-20 | Palo Alto Research Center Incorporated | Solar cell metallization using inline electroless plating |
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