CN115325854A - Heat exchanger and method for manufacturing same - Google Patents

Heat exchanger and method for manufacturing same Download PDF

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Publication number
CN115325854A
CN115325854A CN202210768204.4A CN202210768204A CN115325854A CN 115325854 A CN115325854 A CN 115325854A CN 202210768204 A CN202210768204 A CN 202210768204A CN 115325854 A CN115325854 A CN 115325854A
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CN
China
Prior art keywords
substrate
coating
groove
heat exchanger
base body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202210768204.4A
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Chinese (zh)
Other versions
CN115325854B (en
Inventor
余书睿
薛明
唐建华
黄海
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hangzhou Lvneng New Energy Auto Parts Co ltd
Hangzhou Sanhua Research Institute Co Ltd
Original Assignee
Hangzhou Lvneng New Energy Auto Parts Co ltd
Hangzhou Sanhua Research Institute Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hangzhou Lvneng New Energy Auto Parts Co ltd, Hangzhou Sanhua Research Institute Co Ltd filed Critical Hangzhou Lvneng New Energy Auto Parts Co ltd
Priority to CN202210768204.4A priority Critical patent/CN115325854B/en
Publication of CN115325854A publication Critical patent/CN115325854A/en
Priority to PCT/CN2023/103006 priority patent/WO2024002119A1/en
Application granted granted Critical
Publication of CN115325854B publication Critical patent/CN115325854B/en
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Anticipated expiration legal-status Critical

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D1/00Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
    • F28D1/02Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
    • F28D1/04Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits
    • F28D1/053Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with tubular conduits the conduits being straight
    • F28D1/05316Assemblies of conduits connected to common headers, e.g. core type radiators
    • F28D1/05333Assemblies of conduits connected to common headers, e.g. core type radiators with multiple rows of conduits or with multi-channel conduits
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00Tubular elements; Assemblies of tubular elements
    • F28F1/02Tubular elements of cross-section which is non-circular
    • F28F1/022Tubular elements of cross-section which is non-circular with multiple channels
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00Tubular elements; Assemblies of tubular elements
    • F28F1/10Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/126Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element consisting of zig-zag shaped fins
    • F28F1/128Fins with openings, e.g. louvered fins
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/18Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F19/00Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers
    • F28F19/02Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers by using coatings, e.g. vitreous or enamel coatings
    • F28F19/04Preventing the formation of deposits or corrosion, e.g. by using filters or scrapers by using coatings, e.g. vitreous or enamel coatings of rubber; of plastics material; of varnish
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F21/00Constructions of heat-exchange apparatus characterised by the selection of particular materials
    • F28F21/08Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
    • F28F21/081Heat exchange elements made from metals or metal alloys
    • F28F21/084Heat exchange elements made from metals or metal alloys from aluminium or aluminium alloys
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/26Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Geometry (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)

Abstract

The application provides a heat exchanger, including base member and colored coating, the base member includes first base member and second base member, and at least one in first base member and the second base member has the recess, and partly recess intussuseption is filled with adhesive or solder, and the adhesive or the solder of filling in the recess all contact with first base member and second base member, and at least part coating is located the recess. The first base member of heat exchanger that this application provided is connected reliably between second base member, and the coating firmly combines with the base member. The present application also provides a method of manufacturing a heat exchanger, comprising: providing a first substrate and a second substrate, wherein at least one of the first substrate and the second substrate is provided with a groove, connecting the first substrate and the second substrate, enabling an adhesive or a welding flux filled in the groove to be in contact with both the first substrate and the second substrate, coating a colored coating, and at least partially positioning the coating in the groove. The manufacturing method can manufacture the heat exchanger with the first substrate and the second substrate which are reliably connected and the coating and the heat exchanger substrate are firmly combined.

Description

Heat exchanger and method for manufacturing same
Technical Field
The application relates to the technical field of heat exchange, in particular to a heat exchanger and a manufacturing method thereof.
Background
In heat exchangers, the connections between the components may be made using adhesives or solder. For example, to achieve a connection between the two components, an adhesive or solder may be provided on the outer surface of one of the two components, which are then assembled. However, because the outer surfaces of the components are smooth, less adhesive and less solder remains on the surfaces of the components, making a reliable connection between the two components difficult to achieve.
In addition, in some cases, the heat exchanger needs to be distinguished, and since the surface of the heat exchanger in the related art mostly presents the color of the substrate, it is difficult to satisfy the requirement for easy distinguishing.
Therefore, there is a need for improvement in the related art to improve the reliability of connection between components in the heat exchanger and to facilitate the distinction of the heat exchanger.
Disclosure of Invention
In order to solve the technical problem, the application provides a heat exchanger which is reliable in connection between components and convenient to distinguish, and the application further provides a manufacturing method of the heat exchanger.
A first aspect of the present application provides a heat exchanger, which includes a substrate and a coating layer, wherein the coating layer is coated on at least part of the surface of the substrate;
the substrate comprises a first substrate and a second substrate, at least one of the first substrate and the second substrate is provided with a groove, and the groove is formed by inwards sinking from the outer surface of at least one of the first substrate and the second substrate;
the grooves comprise a first groove and a second groove, the first groove is filled with adhesive or solder, the adhesive or the solder filled in the first groove is contacted with both the first base body and the second base body, the coating is covered on the outer surface of at least one of the first base body and the second base body, and at least part of the coating is positioned in the second groove;
the coating includes a color additive selected from at least one of an organic pigment, an inorganic pigment, and a dye.
In the present application, at least one of the first base and the second base has a groove including a first groove and a second groove. The first groove is filled with adhesive or solder, and the adhesive or solder filled in the first groove is contacted with the first base body and the second base body. The first groove can accommodate more adhesive or welding flux for connecting the first base body and the second base body, so that the connection between the first base body and the second base body is more reliable. The coating is at least partially positioned in the second groove, so that the bonding force of the coating and the heat exchanger substrate can be increased. In addition, the coating of the present application includes a color additive that enables coloring of the heat exchanger surface, facilitating differentiation of the heat exchanger.
A second aspect of the present application provides a manufacturing method of a heat exchanger, the manufacturing method including the steps of:
providing a first substrate and a second substrate, at least one of the first substrate and the second substrate having a groove formed recessed inward from an outer surface of at least one of the first substrate and the second substrate, the groove comprising a first groove and a second groove;
connecting the first substrate and the second substrate so that the first groove is filled with adhesive or solder, and the adhesive or the solder filled in the first groove is in contact with both the first substrate and the second substrate;
disposing a coating on at least a portion of an exterior surface of at least one of the first substrate and the second substrate such that at least a portion of the coating is located within the second recess, the coating including a color additive selected from at least one of an organic pigment, an inorganic pigment, and a dye.
The manufacturing method provided by the application is characterized in that at least one of the first base body and the second base body is provided with a groove, and the groove comprises a first groove and a second groove. When the first base body and the second base body are connected, the first groove can contain more adhesive or welding flux for connecting the first base body and the second base body, and therefore the connection between the first base body and the second base body is more reliable. When the coating is coated, the coating is at least partially positioned in the second groove, so that the bonding force between the coating and the heat exchanger substrate can be increased. In addition, the coating provided by the manufacturing method of the application comprises a color additive, and the color additive can color the surface of the heat exchanger and facilitate the differentiation of the heat exchanger. Therefore, the manufacturing method provided by the application can manufacture the heat exchanger which is reliable in connection between the first substrate and the second substrate, firmly combined with the heat exchanger substrate and convenient to distinguish.
Drawings
FIG. 1 is a schematic view of a heat exchanger provided in accordance with an embodiment of the present application;
FIG. 2 is a schematic illustration of a connection between a first substrate and a second substrate provided in accordance with an embodiment of the present application;
FIG. 3 is a schematic view of another angled connection of a first substrate and a second substrate provided in accordance with an embodiment of the present application;
FIG. 4 is a schematic illustration of a connection of a first substrate and a second substrate provided in accordance with an embodiment of the present application;
FIG. 5 is an enlarged schematic view of portion a of FIG. 3 in one embodiment of the subject application;
FIG. 6 is an enlarged schematic view of a portion a of FIG. 3 in another embodiment of the present application;
FIG. 7 is a schematic view of a first substrate provided in accordance with one embodiment of the present application;
FIG. 8 is a schematic view of a second substrate provided in accordance with an embodiment of the present application;
FIG. 9 is a schematic illustration of a surface coating of a first substrate provided in accordance with an embodiment of the present application;
FIG. 10 is a schematic illustration of a surface coating of a second substrate provided in accordance with an embodiment of the present application;
FIG. 11 is a flow chart of a method of manufacturing a heat exchanger provided in accordance with an embodiment of the present application;
FIG. 12 is a flowchart illustrating a step S1 of a method for manufacturing a heat exchanger according to an embodiment of the present application;
FIG. 13 is a flow chart illustrating a step S2 of a method for manufacturing a heat exchanger according to an embodiment of the present application;
FIG. 14 is a flow chart of step S2 of a method of manufacturing a heat exchanger according to another embodiment of the present application;
FIG. 15 is a flow chart illustrating step S3 of a method for manufacturing a heat exchanger according to an embodiment of the present application;
FIG. 16 is a scanning electron micrograph of a first substrate after grit blasting according to one embodiment of the present application;
FIG. 17 is a schematic view of a thermal management system provided in an embodiment of the present application.
Detailed Description
For better understanding of the technical solutions of the present application, the following detailed description is provided for embodiments of the present application with reference to the accompanying drawings.
It should be understood that the embodiments described are only a few embodiments of the present application, and not all embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments in the present application without making any creative effort belong to the protection scope of the present application.
In heat exchangers, the connections between the various components may be made using adhesives or solder. For example, to achieve a connection between the two components, an adhesive or solder may be provided on the outer surface of one of the two components, which are then assembled. However, because the outer surface of the component is smooth, less adhesive and less solder remains on the surface of the component, making a reliable connection between the two components difficult to achieve. In addition, since the outer surface of the member is smooth, it is difficult for the coating to be firmly bonded to the outer surface of the member.
To this end, the present application provides a heat exchanger, such as shown in fig. 1, 3, 5, and 6, including a base including a first base 11 and a second base 12, at least one of the first base 11 and the second base 12 having a groove 3 formed by recessing inward from an outer surface of at least one of the first base 11 and the second base 12. The grooves comprise a first groove 31 and a second groove 32, the first groove 31 is filled with adhesive or solder, the adhesive or solder filled in the first groove 31 is in contact with both the first base body 11 and the second base body 12, the coating 2 covers the outer surface of at least one of the first base body 11 and the second base body 12, and at least part of the coating 2 is positioned in the second groove 32.
In this application, at least one of the first and second substrates has a groove, including a first groove and a second groove. The first groove is filled with adhesive or solder, and the adhesive or solder filled in the first groove is contacted with the first base body and the second base body. The first groove can accommodate more adhesive or welding flux for connecting the first base body and the second base body, so that the connection between the first base body and the second base body is more reliable. The coating is at least partially positioned in the second groove, so that the bonding force of the coating and the heat exchanger substrate can be increased.
In some embodiments, the substrate includes a third substrate 13, and the adhesive or solder filled in the first recess 31 is in contact with the third substrate. That is, the adhesive or solder filled in the first groove 31 is in contact with each of the first substrate 11, the second substrate 12, and the third substrate 13, thereby achieving the connection of the first substrate 11, the second substrate 12, and the third substrate 13.
Illustratively, as shown in fig. 1, the heat exchanger 100 includes a plurality of heat exchange tubes 101, a plurality of fins 102, and two headers 103. The heat exchange tube 101 is fixedly connected with the collecting pipe 103, the heat exchange tube 101 is hermetically connected with the collecting pipe 103, and the inner cavity of the heat exchange tube 101 is communicated with the inner cavity of the collecting pipe 103. A plurality of heat exchange tubes 101 are arranged along the length direction of the header 103. The thickness direction of the heat exchange tube 101 is parallel to the length direction of the header 103, and the width direction of the heat exchange tube 101 is perpendicular to the length direction of the header 103. The thickness direction of the heat exchange tube 101 may refer to an X direction in fig. 1 and 2, the width direction of the heat exchange tube 101 may refer to a Y direction in fig. 2, and the length direction of the heat exchange tube 101 may refer to a Z direction in fig. 1 and 2. Wherein, the X direction, the Y direction and the Z direction are mutually vertical. The fin 102 is located between two adjacent heat exchange tubes 101, and the fin 102 is fixedly connected to the two adjacent heat exchange tubes 101. The fins 102 are corrugated along the length of the heat exchange tube 101. The arrangement of the fins 102 can increase the heat exchange area of two adjacent heat exchange tubes 101, and improve the heat exchange efficiency of the heat exchanger 100. In some embodiments, a window structure may be disposed in a partial region of the fin 102 to form a louver-type fin, so as to further enhance heat exchange.
In some embodiments, a heat exchange tube 101 is provided with a plurality of independent channels (microchannels) arranged in parallel inside, as shown in fig. 3, and the heat exchanger thus formed is a microchannel heat exchanger. In some embodiments, the heat exchange tubes 101, fins 102, and headers 103 in a microchannel heat exchanger are all made of a material comprising aluminum/aluminum alloy.
In order to achieve the connection between the heat exchange tube 101, the fin 102 and the current collecting tube 103, a solder may be provided on the outer surfaces of the fin 102 and the current collecting tube 103. After the heat exchange tube 101, the fin 102 and the current collecting tube 103 are arranged, the whole assembly is heated to a temperature higher than the melting point of the solder to melt the solder, and then cooled to solidify the solder, thereby realizing the fixed connection among the heat exchange tube 101, the fin 102 and the current collecting tube 103 through the solder. Because the surfaces of the heat exchange tube 101, the fin 102 and the collecting tube 103 are smooth, only a small amount of solder 4 can be left between the heat exchange tube 101 and the fin 102 and between the heat exchange tube 101 and the collecting tube 103 for welding, as shown in fig. 4, for example, the connection reliability between the heat exchange tube 101, the fin 102 and the collecting tube 103 is poor.
Furthermore, during use of the heat exchanger, it may be necessary to distinguish between different heat exchangers, for example when more than two heat exchangers are provided in the same module of the thermal management system, the different heat exchangers being used to perform different functions. Most of the existing heat exchangers present the color of a base material, and at most, the colors are slightly different in size or shape, so that the colors are difficult to distinguish from the appearance, and the heat exchangers are inconvenient to install, inspect or maintain. For this purpose, the surface of the heat exchanger can be colored, so that the heat exchanger is easy to distinguish. In the related art, since the surfaces of the heat exchange pipe 101, the fins 102, and the current collecting pipe 103 are smooth, it is difficult to firmly bond with the coating.
In some embodiments, as shown in FIG. 1, heat exchanger 100 comprises a substrate and a coating 2, coating 2 being applied to at least a portion of a surface of the substrate. The base body includes first base body 11, second base body 12 and third base body 13, and first base body 11 is heat exchange tube 101, and second base body 12 is fin 102, and third base body 13 is pressure manifold 103. At least one of the first substrate 11, the second substrate 12 and the third substrate 13 has a groove 3. That is, the groove 3 may be provided only on one of the first substrate 11, the second substrate 12, and the third substrate 13, may be provided on any two of the first substrate 11, the second substrate 12, and the third substrate 13, or may be provided on all of the first substrate 11, the second substrate 12, and the third substrate 13. The grooves 3 include a first groove 31 and a second groove 32. The groove 3 is formed from at least one of the first substrate 11, the second substrate 12, and the third substrate 13 recessed inward from the outer surface. For example, the grooves 3 provided in the first substrate 11 are formed by being recessed inward from the outer surface of the first substrate 11, as shown in fig. 5 and 6, for example.
The first groove 31 is filled with an adhesive or solder 4, and the adhesive or solder 4 filled in the first groove 31 contacts at least two of the first substrate 11, the second substrate 12 and the third substrate 13. That is, the adhesive or solder 4 filled in the first groove 31 may be used to connect any two of the first substrate 11, the second substrate 12, and the third substrate 13, or may be used to connect the first substrate 11, the second substrate 12, and the third substrate 13. For example, if the adhesive or solder 4 filled in the first groove 31 is in contact with the first substrate 11 and the second substrate 12, the adhesive or solder 4 filled in the first groove 31 can achieve the connection of the first substrate 11 and the second substrate 12, as shown in fig. 5 and 6. If the adhesive or solder filled in the first groove 31 is in contact with all of the first substrate 11, the second substrate 12, and the third substrate 13, the adhesive or solder filled in the first groove 31 can achieve the connection of the first substrate 11, the second substrate 12, and the third substrate 13. The adhesive or solder filled in the first groove 31 may be completely located in the first groove 31, as shown in fig. 5, for example, or the adhesive or solder filled in the first groove 31 may be partially located in the first groove 31 and partially overflow the first groove 31, as shown in fig. 6, for example.
In this manner, the first groove 31 can accommodate more adhesive or solder for connecting at least two of the first substrate 11, the second substrate 12, and the third substrate 13, so that the connection between at least two of the first substrate 11, the second substrate 12, and the third substrate 13, that is, the connection between at least two of the heat exchange tube 101, the fin 102, and the current collecting tube 103, is more reliable.
The coating 2 is coated on the outer surface of at least one of the first substrate 11, the second substrate 12 and the third substrate 13, and at least part of the coating 2 is positioned in the second groove 32, as shown in fig. 5 and 6. The roughness of the outer surface of at least one of the first substrate 11, the second substrate 12 and the third substrate 13 is increased through the second groove 32, so that the bonding force between the coating 2 and the outer surface of at least one of the first substrate 11, the second substrate 12 and the third substrate 13 can be improved, and the coating 2 and the heat exchanger substrate are firmly bonded.
In some embodiments, the first substrate 11 has a first recess 31 and a second recess 32. The adhesive or solder filled in the first groove 31 is in contact with the first base 11, and the adhesive or solder filled in the first groove 31 is in contact with at least one of the second base 12 and the third base 13, as shown in fig. 5 and 6. In this way, the first recess 31 can accommodate more adhesive or solder for connecting the first substrate 11 with the second substrate 12, or for connecting the first substrate 11 with the third substrate 13, or for connecting the first substrate 11 with the second substrate 12 and the third substrate 13. The second grooves 32 formed in the first substrate 12 can enhance the roughness of the outer surface of the first substrate 11, so that the coating 2 can be firmly bonded to the outer surface of the first substrate 11, that is, the coating 2 can be firmly bonded to the substrate of the heat exchange tube 101.
Specifically, as shown in fig. 3, 5, and 6, for example, the outer surface of the first substrate 11 includes a first face 111 and a second face 112. First surface 111 intersects second surface 112, and the contour of first surface 111 is at least partially the intersection of first surface 111 and second surface 112. The first substrate 11 is connected with at least one of the second substrate 12 and the third substrate 13 through the first surface 111, at least part of the second surface 112 is coated with the coating 2, the first substrate 11 is recessed from the first surface 111 to form a first groove 31, and the first substrate 11 is recessed from the second surface 112 to form a second groove 32.
When the first base 11 is connected to the second base 12 through the first face 111, the adhesive or solder 4 filled in the first groove 31 is in contact with the first face 111, and the adhesive or solder filled in the first groove 31 is in contact with the second base 12, as shown in fig. 5 and 6. In this way, the first recess 111 can accommodate more adhesive or solder 4 for a reliable connection of the first face 111 to the second base body 12, i.e. of the first base body 11 to the second base body 12.
When the first base 11 is connected to the third base 13 through the first face 111, the adhesive or solder filled in the first groove 31 is in contact with the first face 111, and the adhesive or solder filled in the first groove 31 is in contact with the third base 13. In this way, the first groove 111 can accommodate more adhesive or solder for achieving a reliable connection of the first face 111 with the third base 13, that is, the first base 11 with the third base 13.
At least a portion of the second surface 112 is covered with the coating 2, as shown in fig. 5 and 6, the second groove 32 formed in the first substrate 11 can increase the roughness of the second surface 112, so that the coating 2 can be firmly bonded to the second surface 112, that is, the coating 2 can be firmly bonded to the first substrate 11 or the heat exchange tube 101.
In some embodiments, one first substrate 11 has at least two first surfaces 111, and at least a portion of the second surface 112 is located between two adjacent first surfaces 111 of the same first substrate 11, as shown in fig. 7. In some embodiments, the first substrate 11 is connected to said second substrate 12 through at least one of said first faces 111, and the first substrate 11 is connected to said third substrate through at least one of said first faces 111. Specifically, in some embodiments, as shown in fig. 7, the first surface 111 includes a first sub-surface 1111 and a second sub-surface 1112, the first substrate 11 is connected to the second substrate 12 through the first sub-surface 1111, and the first substrate 11 is connected to the third substrate 13 through the second sub-surface 1112. The first groove 31 includes a first sub-groove (not shown) and a second sub-groove (not shown). The first sub-groove is formed to be recessed from the first sub-surface 1111 toward the inside of the first substrate 11, and the second sub-groove is formed to be recessed from the first sub-surface 1112 toward the inside of the first substrate 11. The first sub-groove is filled with adhesive or solder, the adhesive or solder filled in the first sub-groove is in contact with the first sub-surface 1111, and the adhesive or solder filled in the first sub-groove is in contact with the second substrate 12. In this way, reliable connection of the first substrate 11 and the second substrate 12 can be achieved. The second sub-groove is filled with adhesive or solder, the adhesive or solder filled in the second sub-groove contacts the second sub-surface 1112, and the adhesive or solder filled in the second sub-groove contacts the third base 13. In this way, reliable connection of the first substrate 11 and the third substrate 13 can be achieved.
In some embodiments, a first substrate 11 has at least two first sub-surfaces 1111, and at least a portion of the second surface 112 is located between two adjacent first sub-surfaces 1111 of the same first substrate 11, as shown in fig. 7. In this way, one first substrate 11 is connected to the second substrate 12 through at least two first sub-surfaces 1111, which increases the reliability of the connection between the first substrate 11 and the second substrate. In some embodiments, at least two first sub-faces 1111 are aligned along a length direction (refer to a Z direction shown in fig. 1 and 2) of the heat exchange tube. As shown in fig. 3 and 7, the first substrate 11 has a flat shape, the first substrate 11 has a side wall 110, the side wall 110 is perpendicular to a thickness direction of the heat exchange tube 101, a plurality of first sub-surfaces 1111 are provided to an outer surface of the side wall 110, and the plurality of first sub-surfaces 1111 are arranged in a length direction (Z direction) of the heat exchange tube, a part of the second surface 112 is provided to the outer surface of the side wall 110, and a part of the second surface 112 is located between the adjacent two first sub-surfaces 1111. The second surface 112 is connected with the first sub-surface 1111, and the connection line of the second surface 112 and the first sub-surface 1111 is the contour line of the first sub-surface 1111.
In some embodiments, first recess 31 renders first face 111 a roughened face, and second recess 32 renders second face 112 a roughened face. In some embodiments, the roughness of each of the first and second faces 111, 112 is 0.5 μm to 10 μm. In some embodiments, the roughness of the first and second faces 111 and 112 is formed by grit blasting.
In other embodiments, second substrate 12 has a first recess 31 and a second recess 32. The adhesive or solder filled in the first groove 31 is in contact with the second substrate 12, and the adhesive or solder filled in the first groove 31 is in contact with at least one of the first substrate 11 and the third substrate 13. In this manner, the first recess 31 can accommodate more adhesive or solder for connecting the second substrate 12 with the first substrate 11, and/or the second substrate 12 with the third substrate 13. The second grooves 32 formed in the second substrate 12 can enhance the roughness of the outer surface of the second substrate 12, so that the coating 2 can be firmly bonded to the outer surface of the second substrate 12, that is, the coating 2 can be firmly bonded to the fins 102.
In some embodiments, the outer surface of the second substrate 12 includes a third surface 121 and a fourth surface 122, the third surface 121 and the fourth surface 122 meet, and the contour of the third surface 121 is at least partially the meeting line of the third surface 121 and the fourth surface 122, as shown in fig. 8. The second substrate 12 is connected to at least one of the first substrate 11 and the third substrate 13 through a third surface 121, at least a portion of a fourth surface 122 is coated with the coating 2, the second substrate 12 is recessed inward from the third surface 121 to form a first groove 31, and the second substrate 12 is recessed inward from the fourth surface 122 to form a second groove 32.
In other embodiments, the third substrate 13 has a first recess 31 and a second recess 32. The adhesive or solder filled in the first groove 31 is in contact with the third base 13, and the adhesive or solder filled in the first groove 31 is in contact with at least one of the first base 11 and the second base 12. In this manner, the first recess 31 can accommodate more adhesive or solder for connecting the third substrate 13 with the first substrate 11, and/or the third substrate 13 with the second substrate 12. The second grooves 32 formed in the third substrate 13 can enhance the roughness of the outer surface of the third substrate 13, so that the coating 2 can be firmly bonded to the outer surface of the third substrate 13, that is, the coating 2 can be firmly bonded to the header 103.
In some embodiments, the outer surface of the third substrate 13 includes a fifth surface (not shown) and a sixth surface (not shown), the fifth surface and the sixth surface being joined, and the outline of the fifth surface is at least partially the line joining the fifth surface and the sixth surface. The third base 13 is connected to at least one of the first base 11 and the third base 13 through a fifth surface, at least a portion of the sixth surface is covered with the coating 2, the third base 13 is recessed from the fifth surface to form a first groove 31, and the third base 13 is recessed from the sixth surface to form a second groove 32.
Due to the particularity of the application environment and the application conditions of the heat exchanger, for example, the temperature change amplitude of the surface of the heat exchanger is large in the heat exchange process, and the like, the composite material provided by the related art is difficult to form a proper colored coating on the surface of the heat exchanger. The colored coating formed by coating the composite material in the related art on the surface of the heat exchanger can be easily peeled off from the surface of the heat exchanger, or the coating can cause the heat exchange efficiency of the heat exchanger to be reduced. Still other coatings do not meet the requirements of green and environmental protection due to the pungent smell generated during the preparation process. Accordingly, the present application also provides colored coatings suitable for use in heat exchangers.
In some embodiments, the coating 2 includes a color additive selected from at least one of an organic pigment, an inorganic pigment, and a dye. The colored coating may impart a color to the outer surface of at least one of the first substrate 11, the second substrate 12, and the third substrate 13, thereby serving to facilitate heat exchanger differentiation.
In practical application, different colors of coatings can be coated on the surfaces of different heat exchangers or different areas of the heat exchangers according to use requirements, so that the heat exchangers can be distinguished from each other in appearance conveniently. The color of the colored coating is realized by adjusting the type and content of the pigment. In addition, the coating isolates the heat exchanger substrate from the external environment, and reduces the corrosion of the external environment to the heat exchanger, so the durability of the heat exchanger is improved to a certain extent.
In some embodiments, the color additive is selected from C 18 H 10 Cl 2 N 2 O 2 ,C 32 Cl 16 CuN 8 ,C 32 H 16 CuN 8 ,C 35 H 23 Cl 2 N 3 O 2 ,C 12 H 10 N 6 O 4 ,C 17 H 13 CaClN 4 O 7 S 2 At least one of mica, titanium dioxide, tin dioxide and ferric oxide. That is, the color additive may be selected from C 18 H 10 C l2 N 2 O 2 (pigment Red), C 32 Cl 16 CuN 8 (Green), C 32 H 16 CuN 8 (blue), C 35 H 23 Cl 2 N 3 O 2 (purple), C 12 H 10 N 6 O 4 (orange), C 17 H 13 CaClN 4 O 7 S 2 (yellow), any one of mica, titanium dioxide, tin dioxide and ferric oxide (golden), or a mixture of any two or more of mica, titanium dioxide, tin dioxide and ferric oxide in any proportion. In the actual coloring process, the color requirements of the colored coating may be various, and some colors may only need one organic pigment, inorganic pigment or dye, while other colors may need more than two organic pigments, more than two inorganic pigments, more than two dyes, or organic pigments, inorganic pigments and dyes. 1l
In some embodiments, the color additive has a particle size of 1 to 5 μm. The smaller the granularity of the color additive is, the more uniform and fine the colored coating is, and the formed colored coating on the surface of the heat exchanger is beautiful. And the small particle size of the color additive is also beneficial to the firm adhesion of the color additive on the surface of the heat exchanger.
In some embodiments, the thickness of the coating 2 is 8 to 16 μm. Furthermore, the average thickness of the coating is 10-11 μm, and the coating is thin, so that the heat exchange efficiency of the heat exchanger is not greatly influenced.
In some embodiments, the coating 2 has a standard deviation of thickness of less than 0.8 μm. The film thickness of the colored coating is uniform, so that the colored coating has good consistency on the adhesion of the heat exchanger surface, and the partial peeling of the color additive and the colored coating is reduced.
In some embodiments, the coating 2 comprises silica, at least a portion of the silica surface having bound thereto the functional group- (CH) 2 ) 3 -O-CH 2 -CH-OCH 2 And a hydroxyl group-OH. The addition of the silicon dioxide can increase the adhesive force and the density of the coating, and the silicon dioxide has wide source and low price. Surface functional group- (CH) 2 ) 3 -O-CH 2 -CH-OCH 2 So that the silica nanoparticles are uniformly dispersed in the sol, and the silica nanoparticles in the formed coating are also uniformly dispersed, thereby improving the uniformity and consistency of the coating. The hydroxyl-OH makes the silica nano-particles hydrophilic, thereby making the colored coating hydrophilic, thereby making the water on the surface of the coating easy to discharge, reducing the accumulation of a large amount of water on the surface of the coating, and reducing the erosion of impurities in the water to the coating, thereby enabling the coating to maintain strong adhesion to the substrate for a long time. In some embodiments, at least a portion of the silica has a particle size of 55 to 65nm.
In some embodiments, the coating 2 further comprises titanium dioxide. The titanium dioxide has hydrophilicity and photocatalytic activity, and the titanium dioxide and the silicon dioxide are matched to form a binary oxide system, so that the hydrophilicity and the self-cleaning property of the coating are enhanced. In some embodiments, at least a portion of the titanium dioxide has a particle size of 5 to 10nm.
In some embodiments, the coating 2 has an average thickness, and at least a portion of the coating 2 overlying at least a portion of the surface of the first substrate 11 has a thickness less than the average thickness; and/or, the thickness of at least part of the coating layer 2 covering at least part of the surface of the second substrate 12 is smaller than the average thickness.
The coating 2 of the present application is different from hydrophilic, hydrophobic, antibacterial, etc. coatings that require improvement in the overall outer surface performance of the heat exchanger. The coating 2 of the present application is applied to the surface of the heat exchanger to facilitate the distinction of the heat exchanger from the appearance. Therefore, in some surfaces of the heat exchanger, such as shown in fig. 9 and 10, where the first substrate 11 is used to form the inner side surface 1121 of the external channel of the heat exchanger 100, the second substrate 12 is used to form the inner surface 12-1 of the external channel in cooperation with the inner side surface 1121 of the first substrate 11, and the like, the coating 2 need not be entirely covered thereon, and the thickness of the coating thereon may not be limited. The coating 2 is coated on the heat exchanger, so that the color of the appearance of the heat exchanger is not changed greatly, and because the space formed between the two heat exchange tubes and between the heat exchange tubes and the fins is small, light cannot reach the space, and a certain visual blind area is caused. In the visual blind area, it is difficult to distinguish the color of the surface of the heat exchanger from the appearance of the heat exchanger.
In some embodiments, the channels of the heat exchanger 100 comprise external channels for external fluid communication, the second face 112 of the first substrate 11 comprises an internal side surface 1121, the internal side surface 1121 is used for forming the external channels, and the internal side surface 1121 has a first edge region 1113, a second edge region 1114 and an intermediate region 1115, as shown in fig. 2 and 9. Along the direction F of fluid flow, the first edge region 1113 is proximate to fluid inlet e1 relative to middle region 1115, the second edge region 1114 is proximate to fluid outlet e2 relative to middle region 1115, and middle region 1115 is located between first edge region 1113 and second edge region 1114. The thickness of the coating overlying first edge region 1113 and second edge region 1114 is greater than the thickness of the coating overlying intermediate region 1115.
In some embodiments, first edge region 1113, second edge region 1114, and middle region 1115 may have a regular shape, such as a rectangle, square, etc., or first edge region 1113, second edge region 1114, and middle region 1115 may have an irregular shape, such as shown in fig. 9.
In some embodiments, none of the first edge region 1113, the second edge region 1114, and the intermediate region 1115 are coated. In some embodiments, the coating thickness on inner side 1121 of first substrate 11 is less than 8 μm. In some embodiments, the inner side surface 1121 of the first base 11 is a side wall 110 of the first base 11 perpendicular to the thickness direction (X direction).
In some embodiments, the heat exchanger has internal channels for internal fluid flow of a coolant, or the like, and external channels for external fluid flow of a coolant, such as air, or the like. The external fluid is a refrigerant, a coolant, or the like that flows through the internal passage. In fact, it is preferred that the inner side of the first substrate is not coated with a coloured coating, in which case the heat exchange tube surface needs to be masked during the spraying. However, in the process of spraying the heat exchanger, in order to simplify the process and reduce the processing cost, the inner side surface of the heat exchange tube is not shielded, but directly sprayed, so that the composite material is inevitably sprayed to some areas of the inner side surface of the heat exchange tube. When spraying, can make the spraying direction and heat exchange tube medial surface become certain angle to reduce the area or the thickness of the coloured coating that the heat exchange tube medial surface was covered and is established, thereby under the condition that does not influence heat exchanger outward appearance colour, reduce the reduction of the heat exchange efficiency of coloured coating to the heat exchanger to a great extent.
In some embodiments, the channels of the heat exchanger include external channels for external fluid communication, as shown in fig. 2 and 10, the fourth face 122 of the second substrate 12 has a first peripheral region 1221, a second peripheral region 1222, and a central region 1223, the first peripheral region 1221 is adjacent to the fluid inlet e1 relative to the central region 1223, the second peripheral region 1222 is adjacent to the fluid outlet e2 relative to the central region 1223, the central region 1223 is located between the first peripheral region 1221 and the second peripheral region 1222, and the thickness of the coating layer overlying the first peripheral region 1221 and the second peripheral region 1212 is greater than the thickness of the colored coating layer overlying the central region 1223 along the fluid flow direction F. In some embodiments, the first peripheral area 1221, the second peripheral area 1222, and the central area 1223 can have a regular shape, such as a rectangle, a square, etc., or the first peripheral area 1221, the second peripheral area 1222, and the central area 1223 can have an irregular shape, such as shown in fig. 10. In some embodiments, the first peripheral region 1221, the second peripheral region 1222, and the central region 1223 are not coated with a colored coating.
In practice, it is most preferred that the inner surface 12-1 of the second substrate 12 not be coated with a colored coating, in which case masking of the surface of the second substrate 12 is required during the spraying process. However, in the process of spraying the heat exchanger 100, in order to simplify the process and reduce the cost, the inner surface 12-1 of the second substrate 12 may not be masked, but directly sprayed, so that the composite material is inevitably sprayed to some surfaces of the second substrate 12. During spraying, the spraying direction may form a certain angle with the inner surface 12-1 of the second substrate 12 to reduce the area or thickness of the coating layer coated on the second substrate 12, thereby greatly reducing the decrease of the heat exchange efficiency of the heat exchanger 100 caused by the coating layer 2 without affecting the appearance color of the heat exchanger 100. In some embodiments, the coating thickness of the inner surface 12-1 of the second substrate 12 is less than 8 μm.
The present application further provides a thermal management system, as shown in fig. 17, the thermal management system includes a compressor 2, a first heat exchanger 1001, a throttling device 3, and a second heat exchanger 1002, wherein the color of the surface of the first heat exchanger 1001 is different from the color of the surface of the second heat exchanger 1002; when a refrigerant flows in the thermal management system, the refrigerant flows into the first heat exchanger 1001 through the compressor 2, flows into the throttling device 3 after heat exchange occurs in the first heat exchanger 1001, and then flows into the second heat exchanger 1002, and flows into the compressor 2 again after heat exchange occurs in the second heat exchanger 1002. Since the surfaces of the first heat exchanger 1001 and the second heat exchanger 1002 have different colors, for example, the surface of the first heat exchanger is red, and the surface of the second heat exchanger is green, it is convenient to distinguish the first heat exchanger from the second heat exchanger in appearance. In some embodiments, the first heat exchanger 1001 is a condenser and the second heat exchanger 1002 is an evaporator. In some embodiments, a reversing device 4 is also provided in the thermal management system.
In some embodiments, at least a portion of the surface of one of the first heat exchanger 1001 and the second heat exchanger 1002 is coated with a colored coating, and the color of the colored coating is different from the color of the base material of the first heat exchanger 1001 and the second heat exchanger 1002; alternatively, at least a portion of the surface of the first heat exchanger 1001 is coated with a first colored coating, and at least a portion of the surface of the second heat exchanger 1002 is coated with a second colored coating, where the color of the first colored coating is different from the color of the second colored coating. Therefore, the first heat exchanger and the second heat exchanger are distinguished by covering one of the two heat exchangers with the colored coating and distinguishing the colors of the colored coating and the heat exchanger base material; or different colored coatings are coated on the surfaces of the two heat exchangers, and the first heat exchanger and the second heat exchanger are distinguished through the colored coatings with different colors.
In the present application, the colors may be completely different or partially different. The color difference may be a difference in the chromaticity of the color, e.g., red, green, blue; alternatively, it may be a shade of color, such as deep red, light red; alternatively, the colors may be gradually changed in different ways, such as gradually increasing the color from the periphery to the inside and gradually decreasing the color from the inside to the periphery; or a different color that is otherwise present.
In order to form the coating layer on the surface of the substrate of the heat exchanger, the corresponding coating can be prepared, and the coating is coated on the surface of the heat exchanger by means of dip coating, spray coating, brush coating, curtain coating or roller coating and cured. As described above, since the surfaces of the heat exchange tube, the header and the fin are smooth, it is difficult for the coating to firmly adhere to the surfaces of the heat exchange tube, the header and the fin base. In order to enable the coating to be firmly attached to the surface of the heat exchanger base body, the surface to be coated may be sandblasted before the corresponding coating is applied. The sand blasting treatment can increase the surface roughness, and further increase the bonding force between the coating and the surface.
Specifically, after the heat exchanger is assembled, the heat exchanger may be subjected to sand blasting, and then the composite material is sprayed on the surface of the heat exchanger and cured to form the colored coating layer 2. However, because the assembled components of the heat exchanger are shielded from each other during the sandblasting process, a portion of the outer surface of the heat exchanger cannot be in contact with the sandblasting. For example, in the microchannel heat exchanger 100 shown in fig. 1, the fin 102 is located between two adjacent heat exchange tubes 101, and the gap between the fin 102 and the heat exchange tube 101 adjacent to the fin is small. During the sand blasting, it is difficult for the abrasive to reach a portion of the outer surface of the heat exchange pipe 101, resulting in difficulty in achieving a desired roughness for the portion of the outer surface of the heat exchange pipe 101 by the sand blasting. In addition, in the sand blasting process, due to the high stacking density of the fins 102, the abrasive is easily clamped between the fins 102 or between the fins 102 and the heat exchange tube 101, and is difficult to remove. Moreover, the sand blasting treatment of the assembled heat exchanger may damage the heat exchanger, for example, in the sand blasting process, the abrasive ejected at high speed generates impact force on the joint of the heat exchange pipe and the collecting pipe and the joint of the heat exchange pipe and the fin, which causes connection failure and even leakage of the heat exchange pipe.
To this end, the present application provides a method of manufacturing a heat exchanger, as shown in fig. 11, the method of manufacturing including the steps of:
s1, providing a first base body 11 and a second base body 12, wherein at least one of the first base body 11 and the second base body 12 is provided with a groove 3, the groove 3 is formed by inwards sinking from the outer surface of at least one of the first base body 11 and the second base body 12, and the groove 3 comprises a first groove 31 and a second groove 32.
And S2, connecting the first base body 11 with the second base body 12, so that the first groove 31 is filled with adhesive or solder, and the adhesive or solder filled in the first groove 31 is contacted with both the first base body 11 and the second base body 12.
S3, disposing a coating 2 on an outer surface of at least one of the first substrate 11 and the second substrate 12 such that at least a portion of the coating 2 is disposed within the second recess 32, the coating 2 including a color additive selected from at least one of an organic pigment, an inorganic pigment, and a dye.
It will be appreciated that in the present application, the steps of providing the first substrate 11 and the second substrate 12 are also performed before the step S2 of joining the first substrate 11 and the second substrate 12 and before the step S3 of applying the coating. That is, the first substrate 11 and the second substrate 12 are first provided, and then the steps of attaching and coating are performed. Therefore, in the present application, step S1 precedes steps S2 and S3. However, the present application does not limit the order of step S2 and step S3, and step S2 may be before step S3 or after step S3.
In some embodiments, the heat exchanger 100 further comprises a third base 13, in particular the method of manufacturing the heat exchanger further comprises the steps of:
s1', providing a third substrate 13;
s2', the first substrate 11, the second substrate 12, and the third substrate 13 are connected such that the adhesive or the solder filled in the first groove 31 is in contact with each of the first substrate 11, the second substrate 12, and the third substrate 13.
Illustratively, in some embodiments, a method of manufacturing a heat exchanger includes the steps of:
the method comprises the following steps of S1, providing a first base body 11, a second base body 12 and a third base body 13, wherein the first base body 11 is used for forming a heat exchange tube 101, the second base body 12 is used for forming a fin 102, the third base body 13 is used for forming a collecting pipe 103, at least one of the first base body 11, the second base body 12 and the third base body 13 is provided with a groove 3, the groove 3 is formed by inwards recessing from the outer surface of at least one of the first base body 11, the second base body 12 and the third base body 13, and the groove 3 comprises a first groove 31 and a second groove 32.
And S2, connecting the first base body 11, the second base body 12 and the third base body 13, so that the first groove 31 is filled with adhesive or solder, and the adhesive or solder filled in the first groove 31 is in contact with at least two of the first base body 11, the second base body 12 and the third base body 13.
And S3, coating 2 is arranged on the outer surface of at least one of the first substrate 11, the second substrate 12 and the third substrate 13, so that at least part of the coating 2 is positioned in the second groove 32, wherein the coating 2 comprises a color additive, and the color additive is selected from at least one of organic pigment, inorganic pigment and dye.
In the manufacturing method provided by the present application, since the groove 3 is provided on at least one of the first substrate 11, the second substrate 12, and the third substrate 13, the groove 3 includes the first groove 31 and the second groove 32. When the first base body 11, the second base body 12 and the third base body 13 are connected, the first groove 31 can accommodate more adhesive or solder for connecting at least two of the first base body 11, the second base body 12 and the third base body 13, so that the connection between at least two of the first base body 11, the second base body 12 and the third base body 13, that is, the connection between at least two of the header 103, the heat exchange tube 101 and the fin 102, is more reliable. When the coating is applied, the coating 2 is at least partially located within the second recess 32, and the second recess 32 is capable of increasing the bonding force of the coating 2 to at least one of the first substrate 11, the second substrate 12, and the third substrate 13. Therefore, according to the manufacturing method provided by the present application, a heat exchanger in which the connection between the heat exchange tube 101, the fin 102, and the header pipe 103 is reliable and the coating 2 is firmly bonded to the heat exchanger base body can be manufactured.
In some embodiments, the grooves 3 are formed by grit blasting. That is, the present application first prepares the first substrate 11 and the second substrate 12 having grooves on their surfaces through a sand blasting process, and then performs the steps of connecting the first substrate 11 and the second substrate 12, and coating at least one of the first substrate 11 and the second substrate 12.
In some embodiments, as shown in fig. 12, step S1, namely providing the first substrate 11 and the second substrate 12, comprises the steps of:
s11, providing base materials, wherein the base materials comprise a first base material for forming a first base body 11 and a second base material for forming a second base body 12;
and S12, performing sand blasting treatment on the outer surface of at least one of the first base material and the second base material.
In some embodiments, at least one of the first substrate and the second substrate has a size larger than the corresponding base, and therefore, the step S1 of providing the first base 11 and the second base 12 further includes the following steps:
and S13, cutting at least one of the first base material and the second base material, as shown in figure 12.
The benefits of grit blasting include, in the first aspect, the removal of residual oxide, oil, etc., from the surface of the substrate, resulting in a cleaner metal substrate surface. And in the second aspect, a better micro rough surface structure is formed on the surface of the base material under the sand blasting and polishing effects of the abrasive, so that the bonding force between the base material and other coating materials is increased, and the leveling and decoration of the coating are facilitated. In the third aspect, the cutting and impact of the blasting strengthens the mechanical properties of the surface of the metal base material, improving the fatigue resistance of the metal base material. In the fourth aspect, the sand blasting can remove irregular structures such as burrs on the surface of the metal base material, and a small round angle is formed on the surface of the metal base material, so that the surface of the metal base material is more smooth and beautiful, and the subsequent treatment is facilitated. After sand blasting treatment, the surface tissue form of the metal base material is changed, and metal grains are more refined and compact. After the sand blasting treatment, more hydroxyl groups are formed on the surface of the metal base material, and in the process of connecting the subsequent functional film layer, the hydroxyl groups of the functional film layer and the hydroxyl groups of the metal base material are subjected to dehydration condensation, so that the functional film layer and the metal base material can be connected through covalent bonds, and the covalent bonds are relatively stable in connection mode, thereby being beneficial to improving the durability of the connection with the functional film layer.
In addition, the treatment mode of the sand blasting process has the characteristics of high efficiency, low cost and suitability for large-surface-area cleaning treatment of the metal base material, and furthermore, the grinding material adopted by the sand blasting process can be recycled, so that the cost can be further reduced.
Next, step S1 will be described by taking a microchannel heat exchanger as an example.
In some embodiments, step S1, providing the first substrate 11, the second substrate 12 and the third substrate 13, comprises the steps of:
s11, providing base materials, wherein the base materials comprise a first base material for forming a first base body 11, a second base material for forming a second base body 12 and a third base material for forming a third base body 13;
and S12, performing sand blasting treatment on the outer surface of at least one of the first base material, the second base material and the third base material.
In some embodiments, the first substrate has the same length, thickness and width as the first substrate 11, and the first substrate 11 can be obtained by performing sand blasting. In some embodiments, the second substrate has the same thickness, width, and length as the second substrate 12, and the second substrate is subjected to sand blasting to obtain the second substrate 12. In some embodiments, the third substrate has the same length, outer diameter, and inner diameter as the third base 13, and the third base 13 is obtained by performing sand blasting on the third substrate.
In other embodiments, the length of the first substrate is greater than the length of the first base 11, the length of the second substrate is greater than the length of the second base 12, and the length of the third substrate is greater than the length of the third base 13.
In some embodiments, step S1 of providing the first substrate 11, the second substrate 12 and the third substrate 13 further comprises the steps of:
and S13, cutting at least one of the first base material, the second base material and the third base material.
As such, the first base material is made to have the same dimensions (e.g., length, width, and thickness) as the first base 11, the second base material is made to have the same dimensions (e.g., length, width, and thickness) as the second base 12, and the third base material is made to have the same dimensions (e.g., length, outer diameter, and inner diameter) as the third base 13.
In some embodiments, the first base material has the same thickness and width as the first base 11, and has the same internal structure as the first base 11, except that the first base material has a length greater than the first base 11, and all structural parameters of the first base material are the same as the first base 11 (as shown in fig. 7), and providing the first base 11 further comprises: the first base material is cut so that the length of the first base material is the same as the length of the first base 11. The thickness direction of the first base material refers to the X direction shown in fig. 1 and 2, and the width direction of the first base material refers to the Y direction in fig. 2.
In some embodiments, the first substrate has an inner cavity and an opening, the inner cavity of the first substrate is communicated with the outside of the first substrate through the opening, the inner cavity of the first substrate is used for forming an inner cavity of the heat exchange tube 101 for flowing a cooling liquid or a cooling medium, and the inner cavity of the first substrate comprises a plurality of channels, and the plurality of channels can be used for forming a plurality of micro channels of the heat exchange tube 101. In some embodiments, the first substrate is provided with a plurality of openings, and the first substrate is provided with a plurality of openings. In this manner, the ingress of abrasive used for blasting into the internal cavity of the first substrate through the opening can be reduced.
In some embodiments, the second substrate has the same thickness and width as second base 12, all of the structural parameters of the second substrate are the same as second base 12 (as shown in fig. 8) except that the length of the second substrate is greater than second base 12, and providing second base 12 further comprises: the second base material 12 is cut such that the length of the second base material is the same as the length of the second base body 12. The thickness direction of the second base material refers to the X direction shown in fig. 1 and 2, and the width direction of the second base material refers to the Y direction in fig. 2.
In some embodiments, the third substrate has an outer diameter and an inner diameter that are both the same as the third base 13, and the third substrate has an internal structure that is the same as the third base 13, all structural parameters of the third substrate are the same as the third base 13 except that the third substrate has a length that is greater than the third base 13, providing the third base 13 further comprises: the third base material is cut so that the length of the third base material is the same as the length of the third base 13.
In some embodiments, the third substrate has an inner cavity and an opening, the inner cavity of the third substrate is communicated with the outside of the third substrate through the opening, and the inner cavity of the third substrate is used for forming an inner cavity of the collecting pipe 103 for flowing the cooling liquid or the cooling medium. In some embodiments, the openings of the third substrate are plugged prior to grit blasting the outer surface of the third substrate. In this manner, the ingress of abrasive used for blasting into the internal cavity of the third substrate through the opening can be reduced.
The step of cutting the first substrate, the second substrate, and the third substrate may be performed before or after the blasting. Taking the example of processing the first base material into the first base body 11, the thickness and the width of the first base material are the same as those of the first base body 11, and the outer surface of the first base material may be subjected to sand blasting firstly, and then the sand blasted first base material may be cut according to the length of the first base body 11 to obtain the first base body 11; alternatively, the first base material subjected to the sandblasting process is cut according to the length of the first base body, and then the first base material after the cutting is subjected to the sandblasting process, so that the first base body 11 is obtained.
In some embodiments, step S12 of sandblasting an outer surface of at least one of the first substrate, the second substrate, and the third substrate includes: the abrasive is mixed in compressed air and sprayed by a spray gun toward an outer surface of at least one of the first base material, the second base material, and the third base material. Further, the abrasive may be corundum, such as brown corundum, white corundum, black corundum, garnet, etc. The abrasive can also be a grit of the silicon carbide type, such as black silicon carbide, green silicon carbide, and the like. Of course, when the abrasive is selected, other kinds of gravels can be selected, such as glass beads, steel shot, steel grit, ceramic grit, resin grit, walnut grit, and the like.
In some embodiments, the abrasive has a particle size between 30 mesh and 280 mesh. Specifically, the particle size of the abrasive may be 30 mesh, 50 mesh, 80 mesh, 120 mesh, 150 mesh, 180 mesh, 200 mesh, 220 mesh, 250 mesh, 280 mesh, or the like. The selection of the grain diameter of the abrasive can influence the construction of the rough surface on the surface of the metal base material, when the grain diameter mesh number of the abrasive is relatively large, the rough surface on the surface of the metal base material can be finer, and when the grain diameter mesh number is too large, the roughness of the rough surface can be difficult to ensure. When the particle size is too small, the formation of a rough surface having a certain roughness is relatively slow, and the roughening effect is poor. In some embodiments, the abrasive can have a particle size ranging between 100 mesh to 200 mesh. Therefore, the grain diameter of the grinding material is not too large or too small, and accordingly, a more ideal rough surface structure is more easily obtained.
In some embodiments, the distance between the spray gun and the respective spray location of the outer surface of at least one of the first substrate, the second substrate, and the third substrate is between 20mm and 100 mm. Specifically, the distance between the nozzle of the spray gun and the corresponding spraying position of the outer surface of the heat exchanger is simply recorded as the sand blasting distance, the sand blasting distance is too close, pits are easily formed in the surface of the metal base material, the overall rough surface is poor in appearance, the sand blasting distance is too far, the impact force of abrasive materials is poor, and the surface form degree of the metal base material is poor. The blasting distance may be selected in this application to be 20mm, 30mm, 40mm, 50mm, 60mm, 70mm, 80mm, 90mm, 100mm, etc. In some embodiments, the blasting distance may be between 50mm and 100 mm.
In some embodiments, the spray angle α of the spray gun satisfies 0 < α ≦ 90. The ejection angle of the spray gun refers to an angle between the incident direction of the abrasive and a plane in which the outer surface of at least one of the first base material, the second base material, and the third base material is located, and specifically, the ejection angle α of the spray gun is 15 °, 30 °, 45 °, 60 °, 75 °, 90 °, and so on. The spray angle α of the spray gun is too small, the interference angle between the metal base material and the abrasive is small, and it is difficult to form a rough surface, and the spray angle α of the spray gun may be an acute angle of 90 ° or less. In some embodiments of the present application, the spray angle α of the spray gun is 45 °.
In some embodiments, the pressure of the compressed air is 0.45MPa to 0.65MPa, and specifically, the pressure of the compressed air is 0.45MPa, 0.5MPa, 0.55MPa, 0.6MPa, 0.65MPa. Because the collecting pipes, the fins and the heat exchange tubes of all parts of the heat exchanger are mostly made of aluminum materials in the industry, and correspondingly, the aluminum materials are relatively soft, the pressure of compressed air cannot be too high, otherwise, the parts are easily damaged. Of course, the pressure of the compressed air must not be too low, otherwise it is difficult to form a rough surface. In some embodiments of the present application, the pressure of the compressed air is 0.45MPa.
In some embodiments, the outer surface of at least one of the first, second, and third substrates may be grit blasted using a grit blaster.
In some embodiments, as shown in fig. 13, the outer surface of at least one of the first substrate 11 and the second substrate 12 is provided with solder, and step S2, connecting the first substrate 11 and the second substrate 12, includes the steps of:
s21, assembling the first substrate 11 and the second substrate 12;
s22, heating the first substrate 11 and the second substrate 12 to melt the solder;
and S23, cooling the first substrate 11 and the second substrate 12 to solidify the solder.
In other embodiments, as shown in fig. 14, step S2, i.e., connecting the first substrate 11 and the second substrate 12, comprises the steps of:
s21', at least one of the first substrate 11 and the second substrate 12 is coated with an adhesive;
s22', assembling the first substrate 11 and the second substrate 12;
s23', and curing the adhesive.
Assembling the first base body 11 and the second base body 12 means that the first base body 11 and the second base body 12 are placed according to their positions in the heat exchanger 100.
Step S2 will be described below by taking the microchannel heat exchanger described above as an example. In some embodiments, in step S2, the first substrate 11, the second substrate 12, and the third substrate 13 are connected by an adhesive or solder. For the connection of the first substrate 11 and the second substrate 12, the first substrate 11 may be connected to the second substrate 12 by solder or an adhesive. For example, all of the first substrates 11 may be connected to the second substrate 12 by solder, or all of the first substrates 11 may be connected to the second substrate by adhesive, or a part of the first substrates 11 may be connected to the second substrate 12 by solder and another part of the first substrates 11 may be connected to the second substrate 12 by adhesive, or several of the plurality of first substrates 11 may be connected to the second substrate 12 by solder and the other several of the plurality of first substrates 11 may be connected to the second substrate 12 by adhesive. Likewise, the connection of the first substrate 11 to the third substrate 13, and the connection of the second substrate 12 to the third substrate 13, may be performed in various ways.
In some embodiments, at least one of the first substrate 11, the second substrate 12 and the third substrate 13 is covered with solder, and the step S2 of connecting the first substrate 11, the second substrate 12 and the third substrate 13 includes:
s21, assembling the first substrate 11, the second substrate 12 and the third substrate 13;
s22, heating the first substrate 11, the second substrate 12 and the third substrate 13 to melt the solder;
and S23, cooling the first substrate 11, the second substrate 12 and the third substrate 13 to solidify the solder.
For example, when the first substrate 11, the second substrate 12, and the third substrate 13 are connected, first, solder is applied to the second substrate 12 and the third substrate 13, and the recess 3 is provided in the first substrate 11. Then, the first substrate 11, the second substrate 12, and the third substrate 13 are assembled, and thereafter, the first substrate 11, the second substrate 12, and the third substrate 13 are placed in a heating furnace and heated, so that the solder is melted and filled in the first grooves 31 provided in the first substrate 11. The solder filled in the first recess 31 recessed from the first sub-surface 111 toward the inside of the first base 11 is in contact with the first base 11 and the second base 12, and this portion of the solder is used to achieve the connection of the first base 11 and the second base 12. The solder filled in the first groove 31 recessed from the second sub-surface 112 toward the inside of the first base 11 contacts the first base 11 and the third base 13, and this portion of the solder is used to realize the connection of the first base 11 and the third base 13. In the present application, the first surface 111, the second surface 112, the first sub-surface 1111, and the second sub-surface 1112 are not regions divided in advance before the first base 11, the second base 12, and the third base 13 are assembled, but regions defined according to the relative positional relationship between the first base 11 and the second base 12, and the relative positional relationship between the first base 11 and the third base 13 after the first base 11, the second base 12, and the third base 13 are assembled. For example, the area where the outer surface of the sidewall 110 of the first substrate 11 is connected to the second substrate 12 is defined as a first sub-surface 1111, and the area where the outer surface of the sidewall 110 of the first substrate 11 is connected to the third substrate 13 is defined as a second sub-surface 1112.
The solder may be melted by putting the first substrate 11, the second substrate 12, and the third substrate 13 into a heating furnace after they are integrally assembled. In the present application, the grooves formed on the outer surface of at least one of the first substrate 11, the second substrate 12, and the third substrate 13 by the sand blast processing are not affected at a high temperature in a temperature range where the solder is melted, or in a temperature range where the furnace is passed, that is, the roughness of the outer surface of the first substrate 11, the second substrate 12, and the third substrate 13, on which the grooves are formed, is substantially maintained before and after the furnace is passed.
In other embodiments, step S2, namely, connecting the first substrate 11, the second substrate 12 and the third substrate 13, comprises:
s21', covering an adhesive on at least one of the first base body 11, the second base body 12 and the third base body 13;
s22', assembling the first substrate 11, the second substrate 12 and the third substrate 13;
s23', and curing the adhesive.
For example, when the first substrate 11, the second substrate 12, and the third substrate 13 are connected, first, an adhesive is applied to the second substrate 12 and the third substrate 13, and the first substrate 11 is provided with the recess 3. Then, the first substrate 11, the second substrate 12, and the third substrate 13 are assembled, and at least a part of the adhesive provided on the second substrate 12 and the third substrate 13 is caused to flow into the first groove 31 provided on the first substrate 11 before the adhesive is cured. The adhesive filled in the first groove 31 recessed from the first sub-surface 111 toward the inside of the first base 11 is in contact with the first base 11 and the second base 12, and this portion of the adhesive is used to achieve the connection between the first base 11 and the second base 12. The adhesive filled in the first groove 31 recessed from the second sub-surface 112 toward the inside of the first base 11 is in contact with the first base 11 and the third base 13, and this portion of the adhesive is used to connect the first base 11 and the third base 13. The way of curing the adhesive varies according to the kind of the adhesive, for example, some adhesives may be cured by natural air drying.
In some embodiments, as shown in fig. 15, step S3 of providing a coating 2 on an outer surface of at least one of the first substrate 11 and the second substrate 12 comprises the steps of:
s31, providing a composite material for forming the coating layer 2, the composite material including a color additive selected from at least one of an organic pigment, an inorganic pigment, and a dye;
and S32, coating the composite material on at least part of the outer surface of at least one of the first substrate 11 and the second substrate 12, and curing to form the coating 2.
Step S3 will be described below by taking the microchannel heat exchanger described above as an example. In some embodiments, step S3 of providing a coating 2 on an outer surface of at least one of the first substrate 11, the second substrate 12, and the third substrate 13, comprises the steps of:
s31, providing a composite material for forming the coating layer 2, the composite material including a color additive selected from at least one of an organic pigment, an inorganic pigment, and a dye;
and S32, coating the composite material on at least part of the outer surface of at least one of the first substrate 11, the second substrate 12 and the third substrate 13, and curing to form the coating 2.
In some embodiments, the composite material comprises 90 to 99 parts of sol and 1 to 10 parts of color additive, wherein the sol comprises an alcohol solvent, and the alcohol solvent accounts for 15 to 30 percent of the sol.
In some embodiments, the sol comprises silica nanoparticles, wherein at least a portion of the silica nanoparticles have a functional group- (CH) bonded to the surface thereof 2 ) 3 -O-CH 2 -CH-OCH 2 And a hydroxyl group-OH. Surface functional group- (CH) 2 ) 3 -O-CH 2 -CH-OCH 2 So that the silica nanoparticles are uniformly dispersed in the sol, and the silica nanoparticles in the formed coating are also uniformly dispersed, thereby improving the uniformity and consistency of the coating. The hydroxyl-OH makes the silica nano-particles hydrophilic, thereby making the colored coating hydrophilic, thereby making the water on the surface of the coating easy to discharge, reducing the accumulation of a large amount of water on the surface of the coating, and reducing the erosion of impurities in the water to the coating, thereby enabling the coating to maintain strong adhesion to the substrate for a long time. In some embodiments, at least a portion of the silica nanoparticles have a particle size of 55 to 65nm. In some embodiments, the sol comprises an alcohol-soluble sol comprising twoSilica nanoparticles having a functional group- (CH) bonded to the surface thereof 2 ) 3 -O-CH 2 -CH-OCH 2 And a hydroxyl group-OH. The alcohol-soluble sol means that colloidal particles are dispersed in an alcohol solvent.
In some embodiments, the sol contains titanium dioxide nanoparticles. The addition of titanium dioxide nano particles enables silicon dioxide and titanium dioxide to form a binary oxide system in the sol, and the interaction and substitution of titanium and silicon atoms in different coordination states can stabilize Ti-O and Si-O structures, so that the adhesive force of the sol is enhanced, and the hydrophilic property of the coating is improved. In some embodiments, at least a portion of the titanium dioxide nanoparticles have a particle size of 5 to 10nm.
In some embodiments, step 31, providing a composite material for forming the coating 2, comprises the steps of:
s311, preparing a sol, wherein the sol comprises an alcohol solvent, and the alcohol solvent accounts for 15% -30% of the sol;
and S312, mixing 90-99 parts of the sol and 1-10 parts of a color additive by mass to obtain the composite material.
The preparation method of the composite material and the composite material are based on the same inventive concept, and the description of the composite material part can be referred to for relevant characteristics such as the composition and the proportion of the raw materials of the composite material, and the description is omitted here.
The above-mentioned mixing manner of the sol and the color additive includes, but is not limited to, mechanical mixing, and in other embodiments, various common mixing manners known in the art may also be adopted, such as an ultrasonic mixing manner or a combination of mechanical mixing and ultrasonic mixing, and the like.
In some embodiments, step S311, i.e., preparing the sol, comprises the steps of: according to the mass portion, 34 to 36 portions of alcohol-soluble silica sol, 55 to 57 portions of water-soluble silica sol and 4 to 6 portions of titanium dioxide sol are weighed, 3 to 5 portions of pH regulator are used for regulating the pH value to 3.0 to 4.0, and the mixture is stirred in water bath at the temperature of 40 to 60 ℃ for 3 to 5 hours. The alcohol-soluble sol refers to a sol in which colloidal particles are distributed in an alcohol solvent, and the water-soluble sol refers to a sol in which colloidal particles are distributed in water. In some embodiments, the titanium dioxide sol is a water soluble sol or an alcohol soluble sol.
In some embodiments, the silica nanoparticles in the water-soluble silica sol have a particle size of 55 to 65nm and a solid content of 45 to 55%. In some embodiments, the particle size of the silica nanoparticles in the alcohol-soluble silica sol is less than the particle size of the silica nanoparticles in the water-soluble silica sol. In some embodiments, the silica nanoparticles in the silica sol have a particle size of 60nm and a solids content of 50%. In some embodiments, the water-soluble silica sol has a PH of 9.
In some embodiments, the alcohol-soluble silica sol can be prepared by: weighing 50-56 parts of alcohol solvent and 0.5-1.5 parts of surfactant by mass, and carrying out ultrasonic dispersion for 5-15 min; adding 36-40 parts of silane precursor, mixing in water bath at 40-60 ℃ for 20-40 min, and stirring at 200-300 rpm; 5 to 7 portions of water and 0.5 to 2 portions of pH regulator are dripped, the dripping is controlled within 5 to 15min, the water bath reaction is carried out for 22 to 26 hours, and the alcohol-soluble silicon dioxide sol is obtained, wherein at least part of the silane precursor contains functional group- (CH) 2 ) 3 -O-CH 2 -CH-OCH 2
In some embodiments, the alcohol solvent includes an alcohol solvent having 1 to 10 carbon atoms, preferably an alcohol solvent having 1 to 8 carbon atoms, and more preferably an alcohol solvent having 1 to 4 carbon atoms. Further, in some embodiments, the solvent is any one of methanol, ethanol, isopropanol, benzyl alcohol and ethylene glycol or a mixture of any two or more thereof in any ratio. Therefore, the source is wide, the method is easy to obtain, and the cost is low.
In some embodiments, the surfactant includes, but is not limited to, at least one of sodium dodecyl sulfate, sodium dodecyl benzene sulfonate, and hexadecyl benzene sulfonic acid. Further, in some embodiments, the surfactant is sodium lauryl sulfate. Therefore, the cost is low, the source is wide, and the using effect is good.
In some embodiments, the silane precursor comprises glycidoxypropyltrimethoxysilane (abbreviated as KH-560) and tetraethoxysilane. Thus, the sol prepared contained silica nanoparticles having a functional group- (CH) bonded to the surface thereof 2 ) 3 -O-CH 2 -CH-OCH 2 And a hydroxyl group-OH. In other embodiments, the silane precursor may also be of other types.
In some embodiments, the pH adjusting agent comprises an organic acid or an inorganic acid. In some embodiments, the pH adjusting agent includes, but is not limited to, at least one of formic acid, acetic acid. Further, in some embodiments, the pH adjusting agent is formic acid.
The equations or reaction mechanisms involved in the alcohol-soluble silica sol prepared according to the present application can be shown as follows:
1) Hydrolysis and condensation of tetraethoxysilane: si (OCH) 2 CH 3 ) 4 +2H 2 O→SiO 2 +4C 2 H 5 OH。
2) Hydrolysis of KH 560: R-Si (OCH) 3 ) 3 +3H 2 O→R-Si(OH) 3 +CH 3 OH
Condensation polymerization of KH 560: R-Si (OH) 3 +R-Si(OH) 3 →R-Si(OH) 2 -O-Si(OH) 2 -R+H 2 O
R-Si(OH) 3 +R-Si(OCH 3 ) 3 →R-Si(OH) 2 -O-Si(OH) 2 -R+CH 3 OH
Wherein R represents a long chain group- (CH) in KH560 2 ) 3 -O-CH 2 -CH-OCH 2 KH560 has the following structural formula (I):
Figure BDA0003726421730000221
3) Condensation of KH560 with silicon hydroxyl groups: R-Si (OH) 3 +Si(OH) 4 →R-Si(OH) 2 -O-Si(OH) 3 +H 2 O。
In the sol prepared by the present applicationThe silica nano-particles are synthesized in situ, and the surface of the silica nano-particles is combined with a functional group- (CH) 2 ) 3 -O-CH 2 -CH-OCH 2 So that the silicon dioxide nano particles in the coating formed by the composite material are uniformly distributed, and the uniformity and consistency of the coating are improved. The alcohol-soluble silica sol prepared by the method can form a film on the surface of a substrate independently. As the surface of the silicon dioxide nano particle contains a large number of hydroxyl (-OH) hydrophilic groups, the hydroxyl groups and the hydroxyl groups are dehydrated and condensed to form a space network structure. Since the silica sol is an alcohol-soluble sol prepared by an alcohol solvent, the alcohol solvent enables the color additive to be uniformly dispersed. In the process of forming the colored coating on the composite material, the silica sol is subjected to dehydration condensation, so that the color additive and the silica nanoparticles can be uniformly adhered to the surface of the substrate, and the colored coating with strong adhesion, uniform film thickness and color and good durability is formed. In addition, the hydroxyl on the surface of the silicon dioxide nano particle enables the coating to show hydrophilicity, enhances the drainage effect of the colored coating, reduces the erosion of impurities in external water or air to the coating, and further improves the durability of the colored coating.
In some embodiments, before step S2 (i.e., connecting the first substrate 11 and the second substrate 12), or before step S3 (i.e., coating the outer surface of at least one of the first substrate 11 and the second substrate 12), the following steps are further included:
s41, performing ultrasonic cleaning treatment on at least one of the first substrate 11 and the second substrate 12;
and S42, drying at least one of the first substrate 11 and the second substrate 12 after the ultrasonic cleaning treatment.
Step S41 may clean the abrasive remaining on the outer surface of at least one of the first substrate 11 and the second substrate 12, and reduce the abrasive remaining on the outer surface of the first substrate 11 and the second substrate 12.
Steps S41 and S42 will be described below by taking the microchannel heat exchanger described above as an example. In some embodiments, before step S2 (i.e., connecting the first substrate 11, the second substrate 12, and the third substrate 13), or before step S3 (i.e., coating the outer surface of at least one of the first substrate 11, the second substrate 12, and the third substrate 13), the following steps are further included:
s41, performing ultrasonic cleaning treatment on at least one of the first matrix 11, the second matrix 12 and the third matrix 13;
and S42, drying at least one of the first matrix 11, the second matrix 12 and the third matrix 13 after the ultrasonic cleaning treatment.
Step S41 may clean the abrasive remaining on the outer surface of at least one of the first substrate 11, the second substrate 12, and the third substrate 13 to prevent the abrasive remaining on the outer surface of the first substrate 11, the second substrate 12, or the third substrate 13 from affecting the heat exchange efficiency of the heat exchanger and the coating of the subsequent coating.
In order to facilitate understanding of the present invention, multiple sets of experimental verification were performed in the present application. In order to facilitate performance detection, the first base material for forming the heat exchange tube is subjected to sand blasting, and a colored coating is coated on the outer surface of the first base material subjected to sand blasting.
Example 1
Step 1 Sand blasting
A first substrate is obtained, the width and the thickness of the first substrate are the same as those of the heat exchange tube, and the internal structure of the first substrate is the same as that of the heat exchange tube. The outer surface of the first substrate is relatively smooth.
And sealing the opening of the first base material by using a sealant to prevent the abrasive from entering the inner cavity in the sand blasting process, and then putting the sealed first base material into a sand blasting machine for sand blasting treatment to obtain a first matrix (sand blasting heat exchange tube). The grain diameter of the abrasive is 120 meshes, the pressure of compressed air is 0.45MPa, the sand blasting angle is 45 degrees, namely the included angle between the spraying direction and the outer surface of the first base material is 45 degrees, and the distance between the spray gun and the first base material during sand blasting is 50mm.
And (3) carrying out sand blasting treatment on the first base material, then carrying out spray washing by using absolute ethyl alcohol, removing the residual abrasive on the surface, and then naturally airing or drying at 40 ℃.
Step 2 coating of the coating
Step 2.1 preparation of composite Material
In the present embodiment, the sol includes an alcohol-soluble silica sol, a water-soluble silica sol, and a titania sol. The alcohol-soluble silica sol is prepared by self, is transparent in appearance, and contains approximately 54% of absolute ethyl alcohol. The water-soluble silica sol and the titanium dioxide sol are both commercially available products, and the titanium dioxide sol is also a water-soluble sol. Wherein the particle size of colloidal particles in the water-soluble silica sol is 55-65 nm, the solid content is about 50%, and the pH value is 9. The particle size of colloid particles in the titanium dioxide sol is 5-10 nm, and the solid content of the titanium dioxide sol is about 3%. The color additive is commercially available pigment Red 254 with a chemical composition C 18 H 10 Cl 2 N 2 O 2
2.1.1 preparation of the Sol
Carrying out ultrasonic dispersion on 54 parts by mass of absolute ethyl alcohol and 1 part by mass of sodium dodecyl sulfate for 10min; adding 31 parts of KH-560 and 7 parts of tetraethoxysilane, mechanically stirring for 30min at the water bath condition of 50 ℃, stirring at the speed of 250rpm, then adding 6 parts of water and 1 part of formic acid dropwise into the system, controlling the dropwise addition to be finished within 10min, and reacting for 24h at the water bath condition of 50 ℃ to obtain alcohol-soluble silica sol, wherein the surface of the silica nanoparticles contained in the alcohol-soluble silica sol is combined with functional groups- (CH) 2 ) 3 -O-CH 2 -CH-OCH 2 And a hydroxyl group-OH.
And (2) uniformly mixing 35 parts of the prepared alcohol-soluble silica sol, 56 parts of water-soluble silica sol and 5 parts of water-soluble titanium dioxide sol, adjusting the pH value of a system to about 3.0 by adopting 4 parts of pH value regulator formic acid, and stirring and reacting for about 4 hours under the water bath condition of about 50 ℃ to obtain the sol. After mixing, the proportion of the absolute ethyl alcohol in the mixed sol was about 24%, wherein the proportion of the absolute ethyl alcohol added in the process of preparing the alcohol-soluble sol was 18.9%.
2.1.2 mixing the Sol with the color additive
According to the mass parts, 95 parts of sol and 5 parts of red pigment are mechanically mixed for 20min, and are sanded for 30min by using a sand mill, so that the composite material is obtained.
Step 2.2 formation of the coating
And (3) spraying the composite material prepared in the step (2.1) on the first substrate which is obtained in the step (1) and subjected to sand blasting treatment and has no coating on the surface, namely coating the composite material on the surface of the first substrate in a spraying manner, and curing in a 200 ℃ oven for 30min after dip coating is finished to obtain a sample with a red coating on the surface.
Examples 2 to 7
Examples 2 to 7 are different from example 1 in the kind of the color additive and/or the compounding ratio of the sol to the color additive, and the rest of examples 2 to 7 are the same as example 1.
In example 2, 95 parts of sol and 5 parts of pigment green 7 were mixed, and the main chemical composition of the pigment green 7 was C 32 Cl 16 CuN 8
In example 3, 95 parts of sol and 5 parts of pigment blue 15:3, mixing, pigment blue 15:3 has a main chemical composition of C 32 H 16 CuN 8
In example 4, 95 parts of the sol and 5 parts of pigment Violet 23 were mixed, the main chemical composition of pigment Violet 23 being C 35 H 23 Cl 2 N 3 O 2
In example 5, 92 parts of sol and 8 parts of a gold pigment, wherein the gold pigment is a mixture of mica, titanium dioxide, tin dioxide and ferric oxide, were mixed.
In example 6, 90 parts of sol and 10 parts of pigment orange 64 were mixed, and pigment orange 64 had a main chemical composition of C 12 H 10 N 6 O 4
In example 7, 90 parts of sol and 10 parts of pigment yellow 191 were mixed, and the main chemical composition of the pigment yellow 191 was C 17 H 13 CaClN 4 O 7 S 2
Comparative example 1
In the actual production process of the heat exchanger, in order to realize the assembly of the heat exchange tube, the fins and the current collecting tube, the outer surfaces of the fins and the current collecting tube are covered with the solder, and the heat exchange tube, the fins and the current collecting tube need to be heated in order to melt the solder. In order to simulate the actual production process of the heat exchanger to examine whether the process of the furnace heating affects the roughness of the sandblasted surface, the sample was prepared in the method of the present comparative example.
This comparative example differs from example 1 in that the first substrate was furnace heated after step 1 and before step 2. Specifically, in this embodiment, the following steps are further included after step 1 and before step 2: and heating the first matrix at 580-620 ℃ for 40-60 min.
Comparative example 2
To examine whether the order of the sand blast treatment and the overburning heating step affects the roughness of the sand blast treated surface, the present comparative example preceded step 1 (i.e., sand blast treatment) with the heating step of comparative example 1.
This comparative example is different from comparative example 1 in that the first base material was heated first and then the heat-treated first base material was subjected to the blast treatment, and the rest of this comparative example is the same as comparative example 1.
Performance testing
1. Roughness measurement
Fig. 16 is a scanning electron micrograph of the surface of the first substrate subjected to the sandblasting treatment in example 1. As can be seen in fig. 16, the grit blasting imparts a matte finish to the outer surface of the first substrate.
The surface roughness of the first substrate that was not subjected to the sand blast treatment, the first substrate subjected to only the sand blast treatment in example 1, the first substrate subjected to the sand blast treatment and the furnace heating in comparative example 1, and the first substrate subjected to the furnace heating and the sand blast treatment in comparative example 2 were measured, respectively.
The surface roughness of the first substrate that was not subjected to the blast treatment was 0.2047. The surface roughness of the first substrate subjected to only the blast treatment in example 1 was 2.7600. The surface roughness of the first substrate in comparative example 1 after the sand blast treatment and the furnace heating in this order was 2.8368. The surface roughness of the first substrate in comparative example 2 after the furnace heating and the blast treatment in this order was 2.8369.
It follows that the overburning, whether performed before or after grit blasting, does not have a significant effect on the surface roughness of the grit blasted first substrate.
2. Adhesion test
The test samples of examples 1 to 7 were subjected to the hundred grid test. The hundred-grid knife test is to cut and penetrate the coating on the substrate in a grid pattern, classify the patterns finished by grid division according to six grades, and evaluate the resistance of the coating to be separated from the substrate.
Hundred grid test ISO rating:
level 0: the edges of the cut are completely smooth, and the edges of the grid are not peeled off;
level 1: small pieces are peeled off at the intersection of the cuts, and the actual damage in the grid cutting area is not more than 5%;
and 2, stage: the edges and/or the intersections of the notches are peeled, and the peeled area is 5 to 15 percent of the grid marking area;
and 3, stage: part or the whole of the grid is peeled off along the edge of the cut, and/or part of the grid is peeled off by the whole grid, and the peeled area is 15% -35% of the grid area;
4, level: the edge of the cut is largely peeled off or some square grids are partially or completely peeled off, and the peeled area is 35 to 65 percent of the area of the grid marking area;
stage 5: beyond the upper level.
The test samples of examples 1 to 7 all had a class 0 ISO rating by the guillotine test. It can be seen that the colored coating of the present application has strong adhesion to the substrate.
3. Coating thickness test
The coating thicknesses of examples 1 to 7 were measured by a high-precision chart coating thickness gauge, and the results are shown in Table 1.
TABLE 1 coating thicknesses for examples 1-7
Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example 7
Thickness (μm) 11.9 14.0 15.7 14.3 15.0 8.1 10.1
From the results in Table 1, it can be seen that the thickness of the colored coating layer formed by curing on the surface of the heat exchanger is in the range of 8-16 μm, and the influence of the thinner colored coating layer on the heat exchange efficiency of the heat exchanger is small.
The application also performs a film thickness uniformity test on the colored coatings on the surfaces of the samples prepared in the examples 1 and 5, and the specific test method comprises the following steps: and randomly selecting 10 test points on the surface of the sample with the colored coating, and respectively carrying out film thickness test.
The thickness of the red coating measured at the sample surface test point of example 1 was: 11.2. Mu.m, 10.2. Mu.m, 10.1. Mu.m, 11.8. Mu.m, 10.4. Mu.m, 9.6. Mu.m, 10.5. Mu.m, 9.4. Mu.m, 9.7. Mu.m, 9.5. Mu.m, 10.2. Mu.m. The average film thickness was 10.2 μm with a standard deviation of 0.736. Mu.m.
The thickness of the golden coating measured on the sample surface test point of example 5 is: 11.8. Mu.m, 12.0. Mu.m, 11.3. Mu.m, 11.1. Mu.m, 12.8. Mu.m, 12.1. Mu.m, 12.8. Mu.m, 11.2. Mu.m, 10.3. Mu.m, 12.6. Mu.m, 11.8. Mu.m. The average film thickness was 11.8. Mu.m, and the standard deviation was 0.782. Mu.m.
From the above test results, it can be seen that, since the color additives and fillers in the composite material of the present application are uniformly distributed in the coating, the thickness of the colored coating on the surface of the sample has good consistency, and the adhesive force is strong and has good consistency.
While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims (10)

1. A heat exchanger, characterized by: the heat exchanger comprises a substrate and a coating, wherein the coating is arranged on at least part of the surface of the substrate,
the base body comprises a first base body and a second base body, at least one of the first base body and the second base body is provided with a groove, and the groove is formed by inwards recessing from the outer surface of at least one of the first base body and the second base body;
the grooves comprise a first groove and a second groove, the first groove is filled with adhesive or solder, the adhesive or the solder filled in the first groove is contacted with both the first base body and the second base body, the coating is covered on the outer surface of at least one of the first base body and the second base body, and at least part of the coating is positioned in the second groove;
the coating includes a color additive selected from at least one of an organic pigment, an inorganic pigment, and a dye.
2. The heat exchanger of claim 1, wherein: the base body comprises a third base body, and the adhesive or the solder filled in the first groove is in contact with the third base body.
3. The heat exchanger of claim 1, wherein: the heat exchanger comprises a heat exchange tube, fins and a collecting tube, the first base body is the heat exchange tube, and the second base body is the fins or the collecting tube;
the first substrate is provided with a first groove and a second groove, the outer surface of the first substrate comprises a first surface and a second surface, the first surface is connected with the second surface, the first substrate is connected with the second substrate through the first surface, at least part of the second surface is covered with the coating, the first substrate is inwards sunken from the first surface to form the first groove, and the first substrate is inwards sunken from the second surface to form the second groove.
4. The heat exchanger of claim 3, wherein: the first substrate is provided with at least two first faces, and at least part of the second face is positioned between two adjacent first faces of the same first substrate.
5. The heat exchanger of claim 3, wherein: the first surface and the second surface are both rough surfaces, and the roughness ranges from 0.5 mu m to 10 mu m.
6. A method of manufacturing a heat exchanger, the method comprising the steps of:
providing a first substrate and a second substrate, at least one of the first substrate and the second substrate having a groove formed recessed inward from an outer surface of at least one of the first substrate and the second substrate, the groove comprising a first groove and a second groove;
connecting the first substrate and the second substrate so that the first groove is filled with adhesive or solder, and the adhesive or the solder filled in the first groove is in contact with both the first substrate and the second substrate;
providing a coating on at least a portion of an exterior surface of at least one of the first substrate and the second substrate such that at least a portion of the coating is located within the second groove, the coating comprising a color additive selected from at least one of an organic pigment, an inorganic pigment, and a dye.
7. The method of manufacturing a heat exchanger according to claim 6, comprising the steps of:
providing a third substrate;
connecting the first substrate, the second substrate, and the third substrate such that the adhesive or the solder filled in the first groove is in contact with each of the first substrate, the second substrate, and the third substrate.
8. The method of manufacturing according to claim 6, wherein said providing a first substrate and a second substrate comprises the steps of:
providing a substrate comprising a first substrate for forming the first matrix and a second substrate for forming the second matrix;
grit blasting an exterior surface of at least one of the first substrate and the second substrate.
9. The method of manufacturing according to claim 8, wherein said providing a first substrate and a second substrate comprises the steps of:
cutting at least one of the first substrate and the second substrate.
10. The method of manufacturing according to claim 6, wherein providing a coating on at least a portion of an exterior surface of at least one of the first substrate and the second substrate comprises the steps of:
providing a composite material for forming the coating, the composite material including a color additive selected from at least one of an organic pigment, an inorganic pigment, and a dye;
coating the composite material on at least part of the outer surface of at least one of the first substrate and the second substrate, and curing to form the coating.
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