CN115318529B - Apparatus for processing semiconductor or electrical solid state devices during manufacturing or processing - Google Patents
Apparatus for processing semiconductor or electrical solid state devices during manufacturing or processing Download PDFInfo
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- CN115318529B CN115318529B CN202211262483.3A CN202211262483A CN115318529B CN 115318529 B CN115318529 B CN 115318529B CN 202211262483 A CN202211262483 A CN 202211262483A CN 115318529 B CN115318529 B CN 115318529B
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 24
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 239000007787 solid Substances 0.000 title claims abstract description 16
- 239000003292 glue Substances 0.000 claims abstract description 37
- 238000011084 recovery Methods 0.000 claims abstract description 25
- 239000007921 spray Substances 0.000 claims abstract description 21
- 238000000034 method Methods 0.000 claims abstract description 15
- 239000000428 dust Substances 0.000 claims description 30
- 238000005507 spraying Methods 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 7
- 229920000742 Cotton Polymers 0.000 claims description 3
- 230000000694 effects Effects 0.000 claims description 3
- 229920002120 photoresistant polymer Polymers 0.000 abstract description 29
- 235000012431 wafers Nutrition 0.000 description 25
- 238000010521 absorption reaction Methods 0.000 description 4
- 238000000206 photolithography Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000006552 photochemical reaction Methods 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B16/00—Spray booths
- B05B16/20—Arrangements for spraying in combination with other operations, e.g. drying; Arrangements enabling a combination of spraying operations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
- B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
- B05B13/0221—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts
- B05B13/0228—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts the movement of the objects being rotative
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B14/00—Arrangements for collecting, re-using or eliminating excess spraying material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B9/00—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour
- B05B9/03—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material
- B05B9/04—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump
- B05B9/047—Spraying apparatus for discharge of liquids or other fluent material, without essentially mixing with gas or vapour characterised by means for supplying liquid or other fluent material with pressurised or compressible container; with pump supply being effected by follower in container, e.g. membrane or floating piston, or by deformation of container
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/04—Cleaning by suction, with or without auxiliary action
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Abstract
The invention discloses a device for processing a semiconductor or an electric solid device in the manufacturing or processing process, which comprises a processing bin, wherein flow guide pipes are arranged on two sides of the bottom of the processing bin, a recovery bin is arranged at the bottoms of two groups of flow guide pipes, a driving motor is arranged in the middle of the bottom of the processing bin, and a top plate is arranged at the output end of the driving motor. When the wafer on the placing rod is rotated through the top plate, the four groups of driving plates are driven to move, the bevel edges of the driving plates push the piston rod upwards, the inside of the glue storage box is pressurized through the first one-way valve, the internal pressure of the glue storage box is increased, glue in the glue storage box can be sprayed out through the spray heads, the piston rod moves up and down in the piston cylinder due to the fact that the driving plates are arranged at certain intervals, the inside of the glue storage box is intermittently pressurized, photoresist is sprayed out through the spray heads intermittently, and the quantity of sprayed photoresist is greatly reduced.
Description
Technical Field
The present invention relates to the field of semiconductor processing technology, and in particular to apparatus for processing semiconductors or electrical solid state devices during manufacturing or processing.
Background
The semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature, and is applied to the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like. During chip manufacturing, a large number of semiconductor wafers are required, and in the semiconductor wafer processing process, photolithography is an important link, before photolithography, a process of coating photoresist on a wafer is required, and the photoresist is a carrying medium for photolithography imaging, and has the function of converting optical information after diffraction and filtering in a photolithography system into chemical energy by using the principle of photochemical reaction, thereby completing the copying of a mask pattern.
Current semiconductor wafer processing apparatus have several disadvantages:
1. when glue is sprayed on a semiconductor wafer, the glue is generally sprayed by a water pump, but the glue spraying amount cannot be well controlled during spraying, so that a large amount of glue is remained on the wafer, redundant glue can be thrown away under the centrifugal action, and the waste of photoresist is caused.
2. Meanwhile, after the photoresist is uniformly coated on the surface of the wafer, redundant photoresist can be thrown away under the centrifugal action, a large amount of photoresist can directly drip and cannot be well utilized, the photoresist is wasted, and the processing cost is increased.
3. During processing of a semiconductor wafer, the surface of the wafer needs to be ensured to be clean and free of impurities and dust, and the influence of the dust on the surface on the wafer processing and the final quality of the wafer processing are prevented when the wafer is processed.
Disclosure of Invention
It is an object of the present invention to provide an apparatus for processing semiconductor or electrical solid state devices during manufacturing or processing that addresses the problems associated with the background art discussed above.
In order to achieve the purpose, the invention provides the following technical scheme: a device for handling semiconductor or electric solid device in manufacturing or processing procedure, including the processing storehouse, the both sides of processing storehouse bottom are provided with the honeycomb duct, and are two sets of the bottom of honeycomb duct is provided with retrieves the storehouse, the intermediate position department of processing storehouse bottom is provided with driving motor, the driving motor output is provided with the roof, logical groove has been seted up to the inside edge of roof, the inboard that leads to the groove is provided with annular stock guide, the edge at roof top is provided with four groups of drive plates, the intermediate position department at processing storehouse top is provided with four groups and places the pole, the intermediate position department at processing storehouse top is provided with spraying mechanism, the both ends at processing storehouse top are provided with negative-pressure air fan, and are two sets of negative-pressure air fan's input is provided with the dust absorption pipe, and is two sets of the bottom of dust absorption pipe is provided with album dirt ring.
Preferably, spraying mechanism glues box, shower head, first check valve, piston cylinder, reset spring, piston rod, second check valve and recovery tube including storing up, it is located the intermediate position department at processing storehouse top to store up gluey box, the bottom of storing up gluey box both sides is provided with first check valve, and is two sets of one side that first check valve kept away from each other is provided with the piston cylinder, the inside top of piston cylinder is provided with reset spring, reset spring's bottom is provided with the piston rod, the bottom of storing up gluey box is provided with the shower head, one side that the box was glued in the storage was kept away from to the piston cylinder is provided with the second check valve, and is two sets of the other end of second check valve is connected with the recovery tube.
Preferably, four groups of arc-shaped grooves are formed in the position, close to the circle center of the top plate, of the placing rod, and rubber pads are arranged at the bottoms of the inside of the ao grooves.
Preferably, the bottom of the piston cylinder extends to the interior of the processing treatment bin, and the piston cylinder is communicated with the interiors of the first one-way valve and the second one-way valve.
Preferably, the piston rod consists of a piston and a push rod, the push rod is positioned at the bottom of the piston, and the piston is in sliding fit with the piston cylinder.
Preferably, the dust collecting ring is positioned above the four groups of placing rods, and the spray header is positioned above the dust collecting ring.
Preferably, the other end of the recovery pipe is connected with the bottom of the recovery bin.
Preferably, the edge of the bottom of the processing bin is provided with a guide ring, and the inner side of the guide ring is obliquely arranged.
Preferably, connecting blocks are arranged at two ends inside the through groove and fixedly connected with the annular material guide plate.
Preferably, the outside of driving motor is provided with the motor storehouse, and the inboard in motor storehouse is provided with the amortization cotton.
Compared with the prior art, the invention provides a device for processing a semiconductor or an electric solid device in the manufacturing or processing process, which has the following beneficial effects:
1. when the wafer on the placing rod is rotated through the top plate, the four groups of driving plates are driven to move, the inclined edges of the driving plates push the piston rod upwards, the inside of the glue storage box is pressurized through the first check valve, the internal pressure of the glue storage box is increased, glue inside the glue storage box can be sprayed out through the spray heads, the piston rod moves up and down inside the piston cylinder due to the fact that the driving plates are arranged at certain intervals, the inside of the glue storage box is intermittently pressurized, photoresist is intermittently sprayed out through the spray heads, and the spraying amount of the photoresist is greatly reduced.
2. According to the invention, the piston rod continuously moves up and down in the piston cylinder, so that a medium in the piston cylinder can enter from the second one-way valve end and be extruded out from the first one-way valve end, the recovery pipe can move towards the interior of the piston cylinder in one direction, the photoresist collected in the recovery bin is sucked into the interior of the piston cylinder and is extruded into the interior of the photoresist storage box through the first one-way valve, the photoresist is recycled, and the processing cost is greatly saved.
3. According to the invention, the dust collecting ring is arranged above the top plate in the processing bin, so that dust attached to the white surface of the wafer and dust in the surrounding environment can be completely sucked into the dust suction pipe by the dust collecting ring through the two groups of negative pressure fans, and then the dust is discharged out of the processing bin through the negative pressure fans, so that the semiconductor wafer is not influenced by the external environment when being processed, and the influence of the dust on the processing quality of the wafer is reduced.
Drawings
FIG. 1 is a front cross-sectional view of the present invention;
FIG. 2 is a side cross-sectional view of the present invention;
FIG. 3 is a top view of the present invention;
FIG. 4 is a top plan view of the top plate of the present invention;
fig. 5 is a perspective view of a drive plate of the present invention.
In the figure: 1. a processing treatment bin; 2. a spraying mechanism; 201. a glue storage box; 202. a shower head; 203. a first check valve; 204. a piston cylinder; 205. a return spring; 206. a piston rod; 207. a second one-way valve; 208. a recovery pipe; 3. a drive plate; 4. placing a rod; 5. a recovery bin; 6. a drive motor; 7. a flow guide pipe; 8. a through groove; 9. an annular material guide plate; 10. a dust collecting ring; 11. a top plate; 12. a negative pressure fan; 13. a dust suction pipe.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-5, the present invention provides the following technical solutions: a device for handling semiconductor or electric solid device in manufacturing or processing procedure, including processing storehouse 1, the both sides of processing storehouse 1 bottom are provided with honeycomb duct 7, the bottom of two sets of honeycomb ducts 7 is provided with retrieves storehouse 5, the intermediate position department of processing storehouse 1 bottom is provided with driving motor 6, driving motor 6 output is provided with roof 11, logical groove 8 has been seted up to the inside edge of roof 11, the inboard that leads to groove 8 is provided with annular stock guide 9, the edge at roof 11 top is provided with four groups of drive plates 3, the intermediate position department at processing storehouse 1 top is provided with four groups and places pole 4, the intermediate position department at processing storehouse 1 top is provided with spraying mechanism 2, the both ends at processing storehouse 1 top are provided with negative pressure air fan 12, the input of two groups of negative pressure air fan 12 is provided with dust absorption pipe 13, the bottom of two groups of dust absorption pipe 13 is provided with album dirt ring 10.
As a preferable embodiment of the present embodiment: the spraying mechanism 2 comprises a glue storage box 201, a spray header 202, a first one-way valve 203, a piston cylinder 204, a reset spring 205, a piston rod 206, a second one-way valve 207 and a recovery tube 208, the glue storage box 201 is located at the middle position of the top of the processing treatment bin 1, the bottoms of the two sides of the glue storage box 201 are provided with the first one-way valve 203, one side, away from each other, of the two sets of first one-way valves 203 is provided with the piston cylinder 204, the top inside the piston cylinder 204 is provided with the reset spring 205, the bottom of the reset spring 205 is provided with the piston rod 206, the bottom of the glue storage box 201 is provided with the spray header 202, one side, away from the glue storage box 201, of the piston cylinder 204 is provided with the second one-way valve 207, the other end of the two sets of second one-way valves 207 is connected with the recovery tube 208, and photoresist can be uniformly sprayed.
As a preferable embodiment of the present embodiment: four groups of arc-shaped grooves are formed in the position, close to the circle center of the top plate 11, of the placing rod 4, and rubber pads are arranged at the bottoms of the inside of the arc-shaped grooves, so that the placing rod 4 is softer in contact with the wafer.
As a preferable embodiment of the present embodiment: the bottom of the piston cylinder 204 extends to the interior of the processing treatment bin 1, and the piston cylinder 204 is communicated with the interiors of the first one-way valve 203 and the second one-way valve 207, so that the photoresist can be conveniently recycled.
As a preferable aspect of the present embodiment: the piston rod 206 is composed of a piston and a push rod, the push rod is located at the bottom of the piston, and the piston is in sliding fit with the piston cylinder 204, so that the interior of the glue storage box 201 can be pressurized conveniently through the piston cylinder 204.
As a preferable embodiment of the present embodiment: the dust collecting ring 10 is positioned above the four groups of placing rods 4, and the spray header 202 is positioned above the dust collecting ring 10, so that the dust collecting ring can collect dust more completely.
As a preferable aspect of the present embodiment: the other end of the recovery pipe 208 is connected with the bottom of the recovery bin 5, so that the glue inside the recovery bin 5 can be recycled conveniently.
As a preferable aspect of the present embodiment: the edge of processing storehouse 1 bottom is provided with the water conservancy diversion ring, and the inboard of water conservancy diversion ring is the slope setting, prevents that the photoresist from remaining in the inside of processing storehouse 1.
As a preferable embodiment of the present embodiment: the connecting blocks are arranged at two ends inside the through groove 8 and fixedly connected with the annular material guide plate 9, so that the top plate 11 is prevented from falling off from the edge.
As a preferable aspect of the present embodiment: the outside of driving motor 6 is provided with the motor storehouse, and the inboard in motor storehouse is provided with the amortization cotton, reduces the noise that driving motor 6 produced.
Embodiment 1, as shown in fig. 1 and 5, the driving motor 6 is turned on again to drive the top plate 11 to rotate, the top plate 11 can drive the wafer to rotate through the placing rod 4, meanwhile, the four groups of driving plates 3 rotate simultaneously, when the driving plates 3 rotate, the oblique sides of the driving plates 3 can contact with the bottom of the piston rod 206, at this time, under the effect of the oblique sides of the driving plates 3, the piston rod 206 can push the piston rod 206 upwards, the piston rod 206 extrudes the air inside the piston cylinder 204 into the glue storage box 201 through the first check valve 203 through the piston, the inside of the glue storage box 201 is pressurized, at this time, the glue storage box 201 sprays the photoresist to the surface of the wafer through the spray head 202, because the groups of driving plates 3 are arranged at certain intervals, the piston rod 206 moves up and down inside the piston cylinder 204, the inside of the glue storage box 201 is intermittently pressurized, so that the photoresist is intermittently sprayed out through the spray head 202, and the amount of the photoresist is greatly reduced.
In embodiment 2, as shown in fig. 1 to 4, while the spray head 202 sprays, the rotating wafer can uniformly coat the photoresist on the surface, and the excess photoresist can be thrown off to the surface of the ring-shaped material guide plate 9, and drops into the flow guide pipe 7 through the through groove 8, and is collected through the recovery bin 5, and when the piston rod 206 moves downward inside the piston cylinder 204 under the elastic force of the return spring 205, the medium cannot be supplemented into the piston cylinder 204 through the first check valve 203, and can only be input through the second check valve 207, and at this time, the recovery pipe 208 can only move in one direction, so that the photoresist collected inside the recovery bin 5 is adsorbed and conveyed into the piston cylinder 204, and is conveyed into the photoresist storage box 201 through the first check valve 203 for recycling.
The working principle is as follows: firstly, a wafer to be processed is placed above the four groups of placing rods 4, two groups of negative pressure fans 12 are started to work, and the two groups of negative pressure fans 12 are matched with each other through the dust suction pipe 13 and the dust collection ring 10, so that dust in the processing bin 1 and dust on the surface of the wafer can be adsorbed, and the influence of the external environment during wafer processing can be avoided;
then, the driving motor 6 is turned on to drive the top plate 11 to rotate, the top plate 11 can drive the wafer to rotate through the placing rod 4, meanwhile, four groups of driving plates 3 rotate simultaneously, when the driving plates 3 rotate, the oblique sides of the driving plates 3 can be in contact with the bottoms of the piston rods 206, at the moment, the piston rods 206 can be pushed upwards under the effect of the oblique sides of the driving plates 3, the piston rods 206 extrude air inside the piston cylinders 204 into the glue storage box 201 through the pistons via the first check valves 203, the inside of the glue storage box 201 is pressurized, at the moment, the glue storage box 201 sprays the photoresist onto the surface of the wafer through the spray heads 202, and due to the fact that the driving plates 3 are arranged at certain intervals, the piston rods 206 move up and down inside the piston cylinders 204, the inside of the glue storage box 201 is intermittently pressurized, the photoresist is intermittently sprayed out through the spray heads 202, and the spraying amount of the photoresist is greatly reduced;
meanwhile, when the spray head 202 sprays, when the piston rod 206 moves downwards in the piston cylinder 204, the medium cannot be supplemented to the interior of the piston cylinder 204 through the first one-way valve 203, the medium can only be input through the second one-way valve 207, and the recovery pipe 208 can only move in one direction, so that the photoresist collected in the recovery bin 5 is adsorbed and conveyed to the interior of the piston cylinder 204, and then conveyed to the interior of the photoresist storage box 201 through the first one-way valve 203 for recovery and utilization.
Finally, it should be noted that the above-mentioned contents are only used for illustrating the technical solutions of the present invention, and do not limit the protection scope of the present invention, and those skilled in the art can make simple modifications or equivalent substitutions on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.
Claims (8)
1. Apparatus for processing semiconductor or electrical solid state devices in a manufacturing or processing process, comprising a process silo (1), characterized in that: flow guide pipes (7) are arranged on two sides of the bottom of the processing bin (1), a recovery bin (5) is arranged at the bottom of each of the two flow guide pipes (7), a driving motor (6) is arranged at the middle position of the bottom of the processing bin (1), a top plate (11) is arranged at the output end of the driving motor (6), a through groove (8) is formed in the edge of the inner part of the top plate (11), an annular material guide plate (9) is arranged on the inner side of the through groove (8), four groups of driving plates (3) are arranged at the edge of the top plate (11), four groups of placing rods (4) are arranged at the middle position of the top of the processing bin (1), a spraying mechanism (2) is arranged at the middle position of the top of the processing bin (1), negative pressure fans (12) are arranged at two ends of the top of the processing bin (1), dust collection pipes (13) are arranged at the input ends of the two groups of the negative pressure fans (12), and dust collection pipes (10) are arranged at the bottom of the two groups of the dust collection pipes (13); the spraying mechanism (2) comprises a glue storage box (201), a spray head (202), first one-way valves (203), piston cylinders (204), reset springs (205), piston rods (206), second one-way valves (207) and recovery pipes (208), wherein the glue storage box (201) is located in the middle of the top of the processing bin (1), the first one-way valves (203) are arranged at the bottoms of two sides of the glue storage box (201), the piston cylinders (204) are arranged on the sides, away from each other, of the two groups of first one-way valves (203), the reset springs (205) are arranged at the tops of the piston cylinders (204), the piston rods (206) are arranged at the bottoms of the reset springs (205), the spray head (202) is arranged at the bottom of the glue storage box (201), the second one-way valves (207) are arranged on the sides, away from the glue storage box (201), of the piston cylinders (204), and the other ends of the two groups of second one-way valves (207) are connected with the recovery pipes (208); the bottom of the piston cylinder (204) extends to the interior of the processing treatment bin (1), the piston cylinder (204) is communicated with the interiors of the first one-way valve (203) and the second one-way valve (207),
the driving motor (6) drives the top plate (11) to rotate, the top plate (11) drives a workpiece to rotate through the placing rod (4), meanwhile, the four groups of driving plates (3) rotate simultaneously, the oblique edges of the driving plates (3) are in contact with the bottom of the piston rod (206) when the driving plates (3) rotate, and the piston rod (206) is pushed upwards under the effect of the oblique edges of the driving plates (3).
2. An apparatus for processing a semiconductor or electrical solid state device in a manufacturing or processing process according to claim 1, wherein: four groups of arc-shaped grooves are formed in the position, close to the circle center of the top plate (11), of the placing rod (4), and rubber pads are arranged at the bottoms of the arc-shaped grooves.
3. An apparatus for processing a semiconductor or electrical solid state device in a manufacturing or processing process according to claim 1, wherein: the piston rod (206) is composed of a piston and a push rod, the push rod is located at the bottom of the piston, and the piston is in sliding fit with the piston cylinder (204).
4. An apparatus for processing a semiconductor or electrical solid state device in a manufacturing or processing process according to claim 1, wherein: the dust collecting ring (10) is positioned above the four groups of placing rods (4), and the spray header (202) is positioned above the dust collecting ring (10).
5. An apparatus for processing a semiconductor or electrical solid state device in a manufacturing or processing process according to claim 1, wherein: the other end of the recovery pipe (208) is connected with the bottom of the recovery bin (5).
6. An apparatus for processing a semiconductor or electrical solid state device in a manufacturing or processing process according to claim 1, wherein: the edge of the bottom of the processing treatment bin (1) is provided with a flow guide ring, and the inner side of the flow guide ring is obliquely arranged.
7. An apparatus for processing a semiconductor or electrical solid state device in a manufacturing or processing process according to claim 1, wherein: connecting blocks are arranged at two ends inside the through groove (8), and the connecting blocks are fixedly connected with the annular material guide plate (9).
8. An apparatus for processing a semiconductor or electrical solid state device in a manufacturing or processing process according to claim 1, wherein: the outside of driving motor (6) is provided with the motor storehouse, and the inboard in motor storehouse is provided with the amortization cotton.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211262483.3A CN115318529B (en) | 2022-10-14 | 2022-10-14 | Apparatus for processing semiconductor or electrical solid state devices during manufacturing or processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211262483.3A CN115318529B (en) | 2022-10-14 | 2022-10-14 | Apparatus for processing semiconductor or electrical solid state devices during manufacturing or processing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115318529A CN115318529A (en) | 2022-11-11 |
| CN115318529B true CN115318529B (en) | 2023-04-14 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202211262483.3A Active CN115318529B (en) | 2022-10-14 | 2022-10-14 | Apparatus for processing semiconductor or electrical solid state devices during manufacturing or processing |
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| CN (1) | CN115318529B (en) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9421567B2 (en) * | 2014-09-08 | 2016-08-23 | Alpha And Omega Semiconductor Incorporated | Recycle photochemical to reduce cost of material and environmental impact |
| CN107899826B (en) * | 2017-11-24 | 2019-05-17 | 石瑞敏 | A kind of machining plate surface spray-painting plant |
| CN109027647B (en) * | 2018-06-08 | 2020-03-24 | 温州实事传媒有限公司 | Lubricant coating equipment for auxiliary installation of heat collecting pipe of solar water heater |
| CN111013973A (en) * | 2019-12-06 | 2020-04-17 | 湖州金丰新材有限公司 | Aluminum product processing sprays paint and uses quick drying device |
| CN213592511U (en) * | 2020-08-03 | 2021-07-02 | 深圳市华科泰塑胶制品有限公司 | A equipment of polishing for plastic mould |
| WO2022120616A1 (en) * | 2020-12-09 | 2022-06-16 | 浙江义乌舒美佳科技股份有限公司 | Automatic edge spraying device for placemats |
| CN113117979A (en) * | 2021-04-26 | 2021-07-16 | 高彬 | Semiconductor wafer processing device |
| CN215270914U (en) * | 2021-05-25 | 2021-12-24 | 成都市佳月鞋业有限公司 | Leather shoe processing edge gluing and positioning equipment |
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