CN113117979A

CN113117979A - Semiconductor wafer processing device

Info

Publication number: CN113117979A
Application number: CN202110455584.1A
Authority: CN
Inventors: 不公告发明人
Original assignee: Individual
Current assignee: Individual
Priority date: 2021-04-26
Filing date: 2021-04-26
Publication date: 2021-07-16

Abstract

The invention discloses a semiconductor wafer processing device, and belongs to the technical field of semiconductor wafer production. A semiconductor wafer processing device comprises a workbench and a wafer body, wherein a motor is arranged on the workbench, the output end of the motor is connected with a first rotating shaft, the top of the first rotating shaft is fixedly connected with a placing disc, the wafer body is placed in the placing disc, the top of the workbench is connected with a packaging plate, and the top of the packaging plate is provided with a gluing mechanism matched with the wafer body; the invention can uniformly coat the photoresist on the surface of the wafer body, can recycle the dripped redundant photoresist, avoids resource waste, saves processing cost, can perform ash removal treatment on the processing environment, prevents dust in the air from contacting with the photoresist, and ensures that a complete template circuit can be formed on the surface of the wafer body in the subsequent photoetching process.

Description

Semiconductor wafer processing device

Technical Field

The invention relates to the technical field of semiconductor wafer production, in particular to a semiconductor wafer processing device.

Background

The semiconductor refers to a material with electric conductivity between a conductor and an insulator at normal temperature, and is applied to the fields of integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power conversion and the like. During chip manufacturing, a large number of semiconductor wafers are required, and in the semiconductor wafer processing process, photolithography is an important link, before photolithography, a process of coating photoresist on a wafer is required, and the photoresist is a carrying medium for photolithography imaging, and has the function of converting optical information after diffraction and filtering in a photolithography system into chemical energy by using the principle of photochemical reaction, thereby completing the copying of a mask pattern.

The existing semiconductor wafer processing and treating device can cause the phenomenon that redundant photoresist drips from the surface of a wafer when the photoresist is coated and cannot be recycled, so that the resource waste is easily caused, the processing cost is increased, and meanwhile, dust in the air is extremely easy to contact with the photoresist, so that the subsequent photoetching imaging effect can be influenced, and the final quality of wafer processing is further influenced.

Disclosure of Invention

The invention aims to solve the problems that in the prior art, when a semiconductor wafer processing device is used for coating photoresist, redundant photoresist drips from the surface of a wafer and cannot be recycled, so that resource waste is easily caused, the processing cost is increased, and meanwhile, dust in the air is easily contacted with the photoresist, so that the subsequent photoetching imaging effect is influenced, and further the final quality of wafer processing is influenced.

In order to achieve the purpose, the invention adopts the following technical scheme:

the utility model provides a semiconductor wafer processing apparatus, includes workstation and wafer body, be equipped with the motor on the workstation, the output of motor is connected with first pivot, the top fixedly connected with of first pivot places the dish, wafer body places in placing the dish, the top of workstation is connected with the encapsulation board, the top of encapsulation board is equipped with the rubber coating mechanism with wafer body matched with, the top fixedly connected with of workstation stores up glues the pond, it retrieves the mechanism to store up to be equipped with the colloid in gluing the pond, fixedly connected with retrieves mechanism matched with bent axle with the colloid in the first pivot, the inner wall fixedly connected with fixed plate of encapsulation board, be equipped with on the fixed plate and construct matched with deashing mechanism with the rubber coating.

In order to carry out sufficient rubber coating treatment on the wafer body, preferably, the rubber coating mechanism comprises a rubber storage box, a water pump and a nozzle, the rubber storage box and the water pump are fixedly connected to the top of the packaging plate, a first guide pipe is connected between the water pumping end of the water pump and the rubber storage box, the water outlet end of the water pump is connected with a second guide pipe, the nozzle is connected to one end, far away from the water pump, of the second guide pipe, and the nozzle is located right above the wafer body.

In order to retrieve the unnecessary colloid that produces the rubber coating and recycle, it is further, the colloid is retrieved the mechanism and is glued case, piston, back flow and rubber suction pipe including taking out, take out gluey case fixed connection and store up in the gluey pond, piston sliding connection is in taking out gluey incasement, the outer wall of bent axle rotates and is connected with the connecting rod, the one end that the bent axle was kept away from to the connecting rod rotates with the lateral wall of piston and links to each other, rubber suction pipe connects on the bottom lateral wall of taking out gluey case, the both ends of back flow are linked together with taking out gluey case and storing up gluey case respectively, the back flow is inhaled and is all equipped with the.

In order to drive the ash removing mechanism to work, preferably, a groove is formed in the workbench, the motor is fixedly connected in the groove, a first belt wheel is fixedly connected to the first rotating shaft, a second rotating shaft is connected to the groove in the rotating mode, a second belt wheel is fixedly connected to the second rotating shaft, and a belt is connected between the first belt wheel and the second belt wheel.

In order to prevent the dust from being stained on the wafer body during gluing, the ash removal mechanism comprises a reciprocating screw rod, a power-on plate and a current-conducting plate, a sliding groove is formed in the fixing plate, the reciprocating screw rod is rotatably connected in the sliding groove, a first bevel gear is fixedly connected to one end, away from the groove, of the second rotating shaft, a second bevel gear is fixedly connected to the reciprocating screw rod and meshed with the first bevel gear, the current-conducting plate is in threaded connection with the reciprocating screw rod, the power-on plate is fixedly connected in the sliding groove, and the side wall of the current-conducting plate is attached to the side wall of the current-conducting plate.

In order to carry out mask irradiation to the wafer body after the rubber coating and form the pattern, it is preferred, fixedly connected with baffle between workstation and the encapsulation board, the board is placed to the top fixedly connected with of workstation, the top inner wall of encapsulation board is connected with ultraviolet lamp, place fixedly connected with mask plate between board and the ultraviolet lamp, the top of workstation is rotated and is connected with the third pivot, be equipped with on the third pivot with mask plate matched with fixture.

In order to make the wafer body after the rubber coating preserve fixedly when the mask plate shines, it is further, fixture includes first grip block and second grip block, the equal threaded connection of first grip block and second grip block is in the third pivot, the lateral wall fixedly connected with connecting plate of mask plate, the bottom of first grip block and the top of second grip block offset with the both sides outer wall of connecting plate respectively, the top of third pivot is rotated and is connected with the handle.

In order to contain the dust cleaned by the ash cleaning mechanism, the bottom of the fixing plate is fixedly connected with a supporting plate, and the top of the supporting plate is fixedly connected with an ash storage box matched with the current conducting plate.

In order to make the excessive glue flow into the glue storage tank during gluing, the side wall of the placing tray is preferably provided with a plurality of groups of leaking grooves.

In order to better recycle the redundant colloid, preferably, one end of the rubber suction pipe, which is far away from the rubber suction box, is connected with a suction nozzle.

Compared with the prior art, the invention provides a semiconductor wafer processing device, which has the following beneficial effects:

1. this semiconductor wafer processing apparatus, when carrying out the photoetching process among the wafer course of working, at first place the wafer body in placing the dish, the starter motor, then start the water pump, spout glue to the center of wafer body, then the wafer body is followed and is placed the dish and rotate, makes even the painting on the surface of wafer body of photoresist through the centrifugal force that the rotation produced.

2. This semiconductor wafer processing apparatus, motor start, the bent axle will also rotate, and the colloid recovery mechanism work this moment retrieves in the storage glue case with unnecessary colloid.

3. This semiconductor wafer processing device, at the photoetching in-process, when the motor starts, will drive reciprocal lead screw and rotate, and the ash removal mechanism work this moment prevents that wafer body surface from being infected with the dust.

4. This semiconductor wafer processing apparatus, after to wafer body rubber coating, place the wafer body and place the board on, fix it through fixed establishment, then open ultraviolet lamp, through ultraviolet irradiation, can form the circuit pattern unanimous on with the mask plate on wafer body surface.

The device has the advantages that the parts which are not involved are the same as or can be realized by adopting the prior art, the surface of the wafer body can be uniformly coated with the photoresist, meanwhile, the dripped redundant photoresist can be recycled, the resource waste is avoided, the processing cost is saved, the ash removal treatment can be carried out on the processing environment, the dust in the air is prevented from contacting with the photoresist, and the complete template circuit can be formed on the surface of the wafer body in the subsequent photoetching process.

Drawings

FIG. 1 is a schematic structural diagram of a semiconductor wafer processing apparatus according to the present invention;

FIG. 2 is an enlarged view of a portion A of the semiconductor wafer processing apparatus of the present invention shown in FIG. 1;

FIG. 3 is an enlarged view of a portion B of the apparatus for processing a semiconductor wafer according to the present invention in FIG. 1;

FIG. 4 is an enlarged view of a portion C of the semiconductor wafer processing apparatus of the present invention shown in FIG. 1;

FIG. 5 is a schematic diagram of a part of a colloid recycling mechanism of a semiconductor wafer processing apparatus according to the present invention;

FIG. 6 is a side cross-sectional view of a mounting plate in the semiconductor wafer processing apparatus according to the present invention;

FIG. 7 is a schematic view of a placement tray of a semiconductor wafer processing apparatus according to the present invention.

In the figure: 1. a work table; 101. grooving; 102. a motor; 103. a first rotating shaft; 104. placing a tray; 105. a wafer body; 106. a leak groove; 107. a first pulley; 108. a crankshaft; 109. a glue pumping box; 110. a piston; 111. a return pipe; 112. a hose suction pipe; 113. a suction nozzle; 114. a one-way valve; 115. a second rotating shaft; 116. a second pulley; 117. a first bevel gear; 118. a partition plate; 119. placing the plate; 120. a third rotating shaft; 121. a handle; 122. a first clamping plate; 123. a second clamping plate; 124. a mask plate; 125. a connecting plate; 2. a glue storage pool; 3. a package board; 301. a water pump; 302. a nozzle; 303. a fixing plate; 304. a chute; 305. a reciprocating screw rod; 306. a second bevel gear; 307. a power-on plate; 308. a conductive plate; 309. a support plate; 310. a dust storage box; 311. an ultraviolet lamp; 4. glue storage box.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.

Example 1:

referring to fig. 1-7, a semiconductor wafer processing device, including workstation 1 and wafer body 105, be equipped with motor 102 on workstation 1, the output of motor 102 is connected with first pivot 103, the top fixedly connected with of first pivot 103 places dish 104, wafer body 105 is placed in placing dish 104, the top of workstation 1 is connected with packaging plate 3, packaging plate 3's top is equipped with the rubber coating mechanism with wafer body 105 matched with, the top fixedly connected with of workstation 1 stores up gluey pond 2, store up gluey pond 2 and be equipped with the colloid and retrieve the mechanism, fixedly connected with on the first pivot 103 retrieves mechanism matched with bent axle 108 with colloid, the inner wall fixedly connected with fixed plate 303 of packaging plate 3, be equipped with the deashing mechanism with rubber coating mechanism matched with on fixed plate 303.

Glue coating mechanism is including storing up gluey case 4, water pump 301 and nozzle 302, stores up gluey case 4 and the equal fixed connection of water pump 301 at the top of packaging plate 3, and the end of drawing water of water pump 301 is connected with first pipe with storing up between gluey case 4, and the play water end of water pump 301 is connected with the second pipe, and nozzle 302 is connected and is served in one of keeping away from water pump 301 at the second pipe, and nozzle 302 is located wafer body 105 directly over.

In the invention, when a photoetching process in a wafer processing process is carried out, firstly, a wafer body 105 is placed in a placing disc 104, a motor 102 is started, the motor 102 drives the placing disc 104 to rotate by using a first rotating shaft 103, then a water pump 301 is started, the photoresist in a photoresist storage tank 4 can be pumped out by the water pump 301, the photoresist is sprayed to the center of the wafer body 105 through a nozzle 302, then the wafer body 105 rotates along with the placing disc 104, and the photoresist is uniformly coated on the surface of the wafer body 105 by centrifugal force generated by rotation.

Example 2:

referring to fig. 1, 3, 4 and 7, basically the same as in embodiment 1, further, in order to recycle the excess glue generated by gluing, the glue recycling mechanism includes a glue pumping box 109, a piston 110, a return pipe 111 and a glue sucking pipe 112, the glue pumping box 109 is fixedly connected in the glue storage pool 2, the piston 110 is slidably connected in the glue pumping box 109, the outer wall of the crankshaft 108 is rotatably connected with a connecting rod, one end of the connecting rod, which is far away from the crankshaft 108, is rotatably connected with the side wall of the piston 110, the glue sucking pipe 112 is connected to the side wall of the bottom of the glue pumping box 109, two ends of the return pipe 111 are respectively communicated with the glue pumping box 109 and the glue storage box 4, and a check valve 114 is arranged in the glue sucking pipe 112 of the return pipe 111.

A plurality of groups of leakage grooves 106 are formed in the side wall of the placing disc 104; for the dripping of excess photoresist.

One end of the rubber suction pipe 112, which is far away from the rubber suction box 109, is connected with a suction nozzle 113; for pumping away the photoresist.

In the invention, when the glue is uniformly coated, redundant photoresist drops to the bottom of the glue storage pool 2 through the leakage groove 106 on the placing disc 104, the device can recycle the photoresist entering the bottom of the glue storage pool 2, and the specific working process is as follows: after the motor 102 is started, the first rotating shaft 103 rotates, the crankshaft 108 on the first rotating shaft 103 also rotates at the moment, the crankshaft 108 drives the piston 110 to slide in the glue extracting box 109 in a reciprocating mode through the connecting rod, suction force is constantly generated, the glue extracting box 109 sucks photoresist into the glue extracting box 109 through the suction nozzle 113 at the moment, then the photoresist is pushed by the piston 110 to enter the glue storage box 4 through the return pipe 111 for continuous use, resource waste can be avoided through the arrangement, and the processing cost is saved.

Example 3:

referring to fig. 1, 2 and 6, basically the same as embodiment 1, further, in order to drive the ash removing mechanism to work, a slot 101 is provided on the working platform 1, the motor 102 is fixedly connected in the slot 101, a first pulley 107 is fixedly connected to the first rotating shaft 103, a second rotating shaft 115 is rotatably connected to the slot 101, a second pulley 116 is fixedly connected to the second rotating shaft 115, and a belt is connected between the first pulley 107 and the second pulley 116.

The ash cleaning mechanism comprises a reciprocating screw rod 305, an electrifying plate 307 and a conductive plate 308, a sliding groove 304 is formed in the fixing plate 303, the reciprocating screw rod 305 is rotatably connected in the sliding groove 304, a first bevel gear 117 is fixedly connected to one end, away from the slot 101, of the second rotating shaft 115, a second bevel gear 306 connected with the first bevel gear 117 in a meshed mode is fixedly connected to the reciprocating screw rod 305, the conductive plate 308 is connected to the reciprocating screw rod 305 in a threaded mode, the electrifying plate 307 is fixedly connected in the sliding groove 304, and the side wall of the conductive plate 308 is attached to the side wall of.

A supporting plate 309 is fixedly connected to the bottom of the fixing plate 303, and a dust box 310 fitted to the conductive plate 308 is fixedly connected to the top of the supporting plate 309.

In the invention, in the photoetching process, dust in the air can contact with the photoresist to influence the subsequent photoetching effect, the device can carry out ash removal treatment, and the specific working process is as follows: when the motor 102 is started and the first rotating shaft 103 rotates, the first belt wheel 107 on the first rotating shaft 103 drives the second belt wheel 116 to rotate, and further drives the second rotating shaft 115 to rotate, the first bevel gear 117 on the second rotating shaft 115 continues to drive the second bevel gear 306 to rotate, and further drives the reciprocating screw 305 to rotate, at this time, the conductive plate 308 screwed on the reciprocating screw 305 reciprocates on the reciprocating screw 305, and when the conductive plate 308 is in contact with the electrifying plate 307, the conductive plate 308 is electrified, so that dust in air is adsorbed, and when the conductive plate 308 moves to be completely separated from the electrifying plate 307, electric charges carried by the conductive plate disappear, and the dust adsorbed on the surface of the conductive plate falls into the dust storage box 310, so that dust cleaning work is realized, and at this time, the influence of the dust on photoetching can be eliminated.

Example 4:

referring to fig. 1, substantially the same as embodiment 1, further, in order to perform mask irradiation on the wafer body 105 after the glue coating to form a pattern, a partition 118 is fixedly connected between the worktable 1 and the packaging plate 3, a placing plate 119 is fixedly connected to the top of the worktable 1, an ultraviolet lamp 311 is connected to the inner wall of the top of the packaging plate 3, a mask plate 124 is fixedly connected between the placing plate 119 and the ultraviolet lamp 311, a third rotating shaft 120 is rotatably connected to the top of the worktable 1, and a clamping mechanism matched with the mask plate 124 is arranged on the third rotating shaft 120.

The clamping mechanism comprises a first clamping plate 122 and a second clamping plate 123, the first clamping plate 122 and the second clamping plate 123 are in threaded connection with the third rotating shaft 120, a connecting plate 125 is fixedly connected to the side wall of the mask plate 124, the bottom of the first clamping plate 122 and the top of the second clamping plate 123 are respectively abutted to the outer walls of the two sides of the connecting plate 125, and a handle 121 is rotatably connected to the top of the third rotating shaft 120.

In the invention, after the wafer body 105 is uniformly coated with glue, the wafer body 105 is placed on the placing plate 119, the screw thread rotating directions of the screw thread connecting parts of the first clamping plate 122 and the second clamping plate 123 and the third rotating shaft 120 are opposite, therefore, after the handle 121 is rotated, the first clamping plate 122 and the second clamping plate 123 are close to each other, the mask plate 124 printed with the pre-designed circuit pattern is placed between the first clamping plate 122 and the second clamping plate 123, the mask plate 124 is fixed, the ultraviolet lamp 311 is turned on after the fixation, the photoresist exposed under the ultraviolet rays is dissolved through the irradiation of the ultraviolet rays, and finally the circuit pattern which is consistent with that on the mask plate 124 can be formed on the surface of the wafer body 105, thereby completing the whole photoetching process.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.

Claims

1. A semiconductor wafer processing device comprises a workbench (1) and a wafer body (105), and is characterized in that a motor (102) is arranged on the workbench (1), the output end of the motor (102) is connected with a first rotating shaft (103), the top of the first rotating shaft (103) is fixedly connected with a placing disc (104), the wafer body (105) is placed in the placing disc (104), the top of the workbench (1) is connected with a packaging plate (3), the top of the packaging plate (3) is provided with a gluing mechanism matched with the wafer body (105), the top of the workbench (1) is fixedly connected with a glue storage tank (2), a glue recovery mechanism is arranged in the glue storage tank (2), the first rotating shaft (103) is fixedly connected with a crankshaft (108) matched with the glue recovery mechanism, and the inner wall of the packaging plate (3) is fixedly connected with a fixing plate (303), and the fixed plate (303) is provided with an ash removal mechanism matched with the gluing mechanism.

2. The semiconductor wafer processing device according to claim 1, wherein the glue coating mechanism comprises a glue storage tank (4), a water pump (301) and a nozzle (302), the glue storage tank (4) and the water pump (301) are both fixedly connected to the top of the packaging plate (3), a first conduit is connected between the water pumping end of the water pump (301) and the glue storage tank (4), a second conduit is connected to the water outlet end of the water pump (301), the nozzle (302) is connected to one end of the second conduit far away from the water pump (301), and the nozzle (302) is located right above the wafer body (105).

3. The semiconductor wafer processing device according to claim 2, wherein the glue recycling mechanism comprises a glue extracting box (109), a piston (110), a return pipe (111) and a glue absorbing pipe (112), the glue extracting box (109) is fixedly connected in the glue storing pool (2), the piston (110) is slidably connected in the glue extracting box (109), the outer wall of the crankshaft (108) is rotatably connected with a connecting rod, one end of the connecting rod, which is far away from the crankshaft (108), is rotatably connected with the side wall of the piston (110), the glue absorbing pipe (112) is connected to the bottom side wall of the glue extracting box (109), two ends of the return pipe (111) are respectively communicated with the glue extracting box (109) and the glue storing box (4), and a one-way valve (114) is arranged in the glue absorbing pipe (112) of the return pipe (111).

4. The semiconductor wafer processing device according to claim 1, wherein a slot (101) is formed in the worktable (1), the motor (102) is fixedly connected in the slot (101), a first pulley (107) is fixedly connected to the first rotating shaft (103), a second rotating shaft (115) is rotatably connected to the slot (101), a second pulley (116) is fixedly connected to the second rotating shaft (115), and a belt is connected between the first pulley (107) and the second pulley (116).

5. The semiconductor wafer processing device according to claim 4, wherein the ash removing mechanism comprises a reciprocating screw rod (305), a conducting plate (307) and a conducting plate (308), a sliding slot (304) is formed in the fixing plate (303), the reciprocating screw rod (305) is rotatably connected in the sliding slot (304), a first bevel gear (117) is fixedly connected to one end of the second rotating shaft (115) far away from the slot (101), a second bevel gear (306) meshed and connected with the first bevel gear (117) is fixedly connected to the reciprocating screw rod (305), the conducting plate (308) is in threaded connection with the reciprocating screw rod (305), the conducting plate (307) is fixedly connected in the sliding slot (304), and the side wall of the conducting plate (308) is attached to the side wall of the conducting plate (307).

6. The semiconductor wafer processing device according to claim 1, wherein a partition plate (118) is fixedly connected between the workbench (1) and the packaging plate (3), a placing plate (119) is fixedly connected to the top of the workbench (1), an ultraviolet lamp (311) is connected to the inner wall of the top of the packaging plate (3), a mask plate (124) is fixedly connected between the placing plate (119) and the ultraviolet lamp (311), a third rotating shaft (120) is rotatably connected to the top of the workbench (1), and a clamping mechanism matched with the mask plate (124) is arranged on the third rotating shaft (120).

7. The semiconductor wafer processing device according to claim 6, wherein the clamping mechanism comprises a first clamping plate (122) and a second clamping plate (123), the first clamping plate (122) and the second clamping plate (123) are both screwed on the third rotating shaft (120), a connecting plate (125) is fixedly connected to a side wall of the mask plate (124), the bottom of the first clamping plate (122) and the top of the second clamping plate (123) respectively abut against outer walls of two sides of the connecting plate (125), and a handle (121) is rotatably connected to the top of the third rotating shaft (120).

8. A semiconductor wafer processing apparatus as claimed in claim 5, wherein a support plate (309) is fixedly attached to a bottom of the fixing plate (303), and a dust box (310) fitted to the conductive plate (308) is fixedly attached to a top of the support plate (309).

9. A semiconductor wafer processing apparatus according to claim 1, wherein the side walls of said holding tray (104) are provided with a plurality of sets of pockets (106).

10. A semiconductor wafer processing apparatus as claimed in claim 3, wherein a suction nozzle (113) is connected to an end of the suction tube (112) remote from the suction box (109).