CN115312445A - Package manufacturing equipment for integrated circuit - Google Patents
Package manufacturing equipment for integrated circuit Download PDFInfo
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- CN115312445A CN115312445A CN202211237249.5A CN202211237249A CN115312445A CN 115312445 A CN115312445 A CN 115312445A CN 202211237249 A CN202211237249 A CN 202211237249A CN 115312445 A CN115312445 A CN 115312445A
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- integrated circuit
- electric telescopic
- telescopic rod
- circuit board
- plate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Specific Conveyance Elements (AREA)
Abstract
The invention belongs to the technical field of integrated circuit packaging, and relates to packaging and manufacturing equipment for an integrated circuit. The equipment comprises a mounting frame, a conveying belt wound on the mounting frame, a carrying mechanism, a packaging mechanism and a rubber stop lever. The conveying belt is provided with a plurality of through holes, and the conveying belt is provided with a clamping assembly; the clamping assembly comprises two clamping plates which are rotatably arranged on the conveyor belt. The integrated circuit board is placed between the grooves of the two clamping plates, so that the integrated circuit board is clamped more stably, and the integrated circuit board can be effectively prevented from falling off or moving. And does not cause damage or abrasion to the integrated circuit board. The equipment has simple structure, stable operation and small generated vibration, is favorable for the maintenance of the production environment of the integrated circuit board, and reduces dust pollution. The equipment packages two surfaces of the integrated circuit board simultaneously through the simultaneous action of the first wrapper and the second wrapper, and can automatically adapt to the thickness of the integrated circuit board.
Description
Technical Field
The invention belongs to the technical field of integrated circuit packaging, and relates to packaging and manufacturing equipment for an integrated circuit.
Background
In electronic manufacturing, a block of semiconductor material is encapsulated in a supporting housing to prevent physical damage and corrosion. Packaging is therefore an important part of electronic manufacturing.
Among present encapsulation equipment, some encapsulation equipment can't directly encapsulate simultaneously the two sides of circuit, need carry out the turn-over back with the circuit board, are encapsulating the another side, are unfavorable for the improvement of efficiency like this. For example, the application No. CN202111580855.2 discloses a package manufacturing device for a multi-chip integrated circuit, which comprises a base, a turntable, a mounting rack, a feeding trough, a fixing rack and a fixing rod. However, the device has the following problem 1. The air cylinder pushes the chip into the fixed frame and pushes the top block and the second slide bar to slide backwards along the fixed frame through the chip, so that the chip is easily abraded and damaged. 2. The chip is clamped and fixed through the clamping plates, the clamping is unstable, and the chip is easy to fall off between the two clamping plates. 3. The cam drives the turntable to perform intermittent motion through the grooved pulley, so that the equipment generates large vibration during working. In the packaging process of the integrated circuit board, the production and processing environment has specific requirements, and in various forms of pollution, the yield and reliability of the integrated circuit are greatly influenced by dust caused by vibration of equipment.
To solve the above problems, the present invention provides a package manufacturing apparatus for an integrated circuit.
Disclosure of Invention
To solve the problems in the background art, the present invention provides a package manufacturing apparatus for an integrated circuit.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows: the device comprises a mounting rack, wherein the upper end surface of the mounting rack is an upper platform; a rectangular hole is formed in the mounting rack in the longitudinal direction, and a lower platform is arranged at the bottom of the rectangular hole;
the conveying belt is wound on the mounting frame, a plurality of through holes are formed in the conveying belt, and a clamping assembly is arranged on the conveying belt; the clamping assembly comprises two clamping plates which are rotatably arranged on the conveying belt; grooves are formed in the two clamping plates; the two grooves are oppositely arranged;
the carrying mechanism comprises an adsorption component, a cross rod, an extrusion component and a first electric telescopic rod; the first electric telescopic rod is rotatably arranged on one side of the upper platform; the cross rod is transversely and fixedly arranged on the push rod of the first electric telescopic rod; the adsorption component is fixedly arranged on the cross rod; the extrusion assembly is longitudinally movably arranged on the cross rod; the extrusion assembly is matched with the clamping assembly;
a packaging mechanism comprising a first and second packager; the first packaging device is longitudinally movably arranged on the upper platform, and the second packaging device is longitudinally movably arranged on the lower platform; the first wrapper and the second wrapper are arranged oppositely;
and the rubber stop lever is fixedly arranged at one end of the upper platform, which is far away from the carrying mechanism.
Further, the mounting frame comprises a first mounting plate, a second mounting plate and a rotating roller;
the rotary roller is rotatably arranged between the first mounting plate and the second mounting plate; the two rotating rollers correspond to the two ends of the mounting frame one by one; the conveying belt is wound on the two rotating rollers;
and a motor is fixedly arranged on one side of the mounting frame and is in driving connection with one of the rotary rollers.
Furthermore, an L-shaped first support frame is fixedly arranged on one side of the upper platform; one end of the first support frame is fixedly arranged on the upper platform, and the other end of the first support frame is fixedly provided with a third electric telescopic rod; and the first packaging device is fixedly arranged at the top end of the third electric telescopic rod.
Furthermore, two supporting blocks are fixedly arranged on the lower platform; a supporting plate is fixedly arranged between the two supporting blocks; a fourth electric telescopic rod is fixedly mounted on the supporting plate, and a second packaging device is fixedly mounted on a push rod of the fourth electric telescopic rod.
Further, the adsorption assembly comprises a negative pressure generator and an adsorber; one end of the negative pressure generator is fixedly arranged on the cross rod, and the absorber is matched with the negative pressure generator; the adsorber is fixedly arranged at the lower end of the negative pressure generator.
Further, the extrusion assembly comprises a second electric telescopic rod and an extrusion plate;
the base of the second electric telescopic rod is fixedly arranged at the lower end of the cross rod; the extrusion plate is fixedly arranged on the push rod of the second electric telescopic rod, the extrusion plate is C-shaped, two ends of the extrusion plate are provided with first surfaces, and the two first surfaces are opposite; the stripper plate acts on the clamping plate via the first face.
Furthermore, two rotating shafts are fixedly arranged on the upper platform and correspond to the two clamping plates one by one; the clamping plate is rotatably arranged on the rotating shaft; the rotating shaft is sleeved with a torsion spring, one end of the torsion spring is fixedly connected with the clamping plate, and the other end of the torsion spring is fixedly connected with the mounting frame;
two splint all have the second face, and two second faces set up with two first faces one-to-one, and the second face cooperatees with first face.
Further, the length of the through hole is larger than that of the integrated circuit board, and the width of the through hole is larger than that of the integrated circuit board.
Furthermore, one side of the upper platform is rotatably provided with a rotary table, and the base of the first electric telescopic rod is fixedly arranged on the rotary table.
Further, the one end that transport mechanism was kept away from to the mounting bracket is equipped with the second conveying piece perpendicularly, the one end of second conveying piece is fixed to be set up under on the platform, the other end of second conveying piece extends outside the mounting bracket, the second conveying piece is corresponding with the rubber pin.
Compared with the prior art, the invention has the following beneficial effects:
1. the integrated circuit board is placed between the grooves of the two clamping plates, the integrated circuit board is clamped more stably, the integrated circuit board can be effectively prevented from falling off or moving, and the integrated circuit board cannot be damaged or abraded.
2. The equipment has simple structure, stable operation and small generated vibration, is favorable for the maintenance of the production environment of the integrated circuit board, and reduces dust pollution.
3. The equipment packages two surfaces of the integrated circuit board simultaneously through the simultaneous action of the first packaging device and the second packaging device, and can automatically adapt to the thickness of the integrated circuit board.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the installation of a second package of the present invention;
FIG. 3 is an enlarged view of portion A of FIG. 1 in accordance with the present invention;
FIG. 4 is an enlarged view of the portion B of FIG. 2 in the present invention;
FIG. 5 is a schematic view of the position of the rubber stopper of the present invention;
fig. 6 is a schematic view of the structure of the clamping plate in the present invention.
In the figure: 1. an upper platform; 2. a lower platform; 3. rotating the roller; 4. a motor; 5. a conveyor belt; 6. a through hole; 7. a rotating shaft; 8. a splint; 9. a torsion spring; 10. a first conveying member; 11. a turntable; 12. a first electric telescopic rod; 13. a cross bar; 14. a negative pressure generator; 15. an adsorber; 16. a second electric telescopic rod; 17. a compression plate; 18. a support frame; 19. a third electric telescopic rod; 20. a first encapsulator; 21. a supporting block; 22. a support plate; 23. a fourth electric telescopic rod; 24. a second encapsulator; 25. a rubber stopper rod; 26. a strut; 27. a second conveying member; 28. a support leg; 29. a groove; 30. a first side; 31. a second face.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1 to 6, the technical solution adopted by the present invention is as follows: a package manufacturing device for an integrated circuit comprises a mounting frame, a conveyor belt 5 wound on the mounting frame, a carrying mechanism, a packaging mechanism and a rubber stop rod 25.
The mounting bracket comprises an upper platform 1 and a lower platform 2, wherein the upper platform 1 is positioned on the upper surface of the mounting bracket, a rectangular hole is formed in the middle of the mounting bracket, and the lower platform 2 is positioned at the bottom of the rectangular hole.
Specifically, the mounting bracket includes first mounting panel, second mounting panel, commentaries on classics roller 3.
The first mounting plate and the second mounting plate are fixedly mounted between the upper platform 1 and the lower platform 2. The roller 3 has two, all rotates the setting between first mounting panel and second mounting panel. One of the rollers 3 is arranged at one end between the first mounting plate and the second mounting plate, and the other roller 3 is rotatably arranged at the other end between the first mounting plate and the second mounting plate. The conveyor belt 5 is wound between the two rollers 3.
One side fixed mounting of mounting bracket has motor 4, and motor 4 is connected with one of them commentaries on classics roller 3 drive. The motor 4 drives the roller 3 to rotate, thereby moving the conveyor belt 5.
A plurality of legs 28 are fixedly mounted to the bottom of the first and second mounting plates, and the legs 28 support the mounting bracket at a suitable height.
The conveyor belt 5 is provided with a plurality of through holes 6, the size of the through holes 6 in length is larger than that of the integrated circuit board in length, and the size of the through holes 6 in width is larger than that of the integrated circuit board in width. Therefore, the packaging mechanism can package the upper surface and the lower surface of the integrated circuit board at the same time, and the integrated circuit board can drop from the through hole 6 smoothly, so that the discharging is completed.
The conveying belt 5 is provided with a clamping assembly which is used for clamping and fixing the integrated circuit board. The clamping assembly is matched with the through holes 6, and each through hole 6 is matched with the clamping assembly.
The clamping assembly comprises two clamping plates 8 rotatably arranged on the conveyor belt 5. Two clamping plates 8 are respectively arranged at two sides of the through hole 6 on the conveyor belt 5. The both sides of through-hole 6 are all fixed to be provided with pivot 7 on the conveyer belt 5, and two pivots 7 and two splint 8 one-to-one, every splint 8 all rotate and install on the pivot 7 that corresponds. The cover is equipped with torsional spring 9 on the pivot 7, and torsional spring 9's one end and splint 8 fixed connection, torsional spring 9's the other end and 5 fixed connection of conveyer belt.
As shown in fig. 4, both clamping plates 8 have a second face 31, the second face 31 being located at one end of the clamping plate 8, and the two second faces 31 being arranged away from each other. The second surface 31 may be an inclined surface or a curved surface.
All set up flutedly 29 on two splint 8, two recesses 29 are relative to be set up, and the convenience is fixed more stable of integrated circuit board between two splint 8. The two clamping plates 8 are in a natural state, and the integrated circuit board is positioned between the two grooves 29. The clamping plate 8 holds the integrated circuit board through the groove 29.
The carrying mechanism is arranged on one side of the upper platform 1, a first transmission piece is arranged near the carrying mechanism, and the first transmission piece is matched with the carrying mechanism. The carrying mechanism carries the ic boards on the first conveying member 10 to the corresponding positions on the conveyor 5.
The carrying mechanism comprises an adsorption component, a cross rod 13, an extrusion component and a first electric telescopic rod 12.
One side of the upper platform 1 is rotatably provided with a rotary table 11, and a base of a first electric telescopic rod 12 is fixedly arranged on the rotary table 11. The first electric telescopic rod 12 is rotatably arranged on the upper platform 1 through the rotary table 11. The cross bar 13 is transversely and fixedly arranged on the push rod of the first electric telescopic rod 12.
The adsorption component is fixedly arranged on the cross rod 13.
In particular, the adsorption module includes a negative pressure generator 14 and an adsorber 15. One end of the negative pressure generator 14 is fixedly arranged on the cross rod 13, the absorber 15 is fixedly arranged at the lower end of the negative pressure generator 14, and the absorber 15 is matched with the negative pressure generator 14.
The extrusion assembly is longitudinally movably arranged on the cross rod 13, and the extrusion assembly is matched with the clamping assembly and drives the clamping assembly to move.
Specifically, the squeezing assembly comprises a second electric telescopic rod 16 and a squeezing plate 17. The base of the second electric telescopic rod 16 is fixedly arranged at the lower end of the cross rod 13, and the extrusion plate 17 is fixedly arranged at the top end of the push rod of the second electric telescopic rod 16. The extrusion plate 17 is C-shaped, and both ends of the extrusion plate 17 all have first faces 30, and two first faces 30 are arranged relatively. The two first faces 30 cooperate with the second face 31. The two first surfaces 30 and the two second surfaces 31 are arranged in a one-to-one correspondence manner, and the first surfaces 30 are matched with the corresponding second surfaces 31. The first surface 30 may be an inclined surface or a curved surface. In this embodiment, the first surface 30 is an inclined surface, and the second surface 31 is a curved surface. The first face 30 acts on the second face 31 to produce the movement of the two jaws 8.
Second electric telescopic handle 16 extension makes stripper plate 17 move down, makes first face 30 act on second face 31, makes two splint 8 remove in opposite directions, and then makes splint 8 rotate round corresponding pivot 7, makes the other end of splint 8 open to the outside, and then makes two splint 8 keep away from the increase of distance between the one end on inclined plane, makes things convenient for the adsorption component to place integrated circuit board between two splint 8.
The packaging mechanism includes a first wrapper 20 and a second wrapper 24. The first packing device is longitudinally movably arranged on the upper platform 1, and the second packing device 24 is longitudinally movably arranged on the lower platform 2. The first and second encapsulators 20, 24 are oppositely disposed. A first encapsulator 20 encapsulates the upper side of the integrated circuit board and a second encapsulator 24 encapsulates the lower side of the integrated circuit board. The first packaging device 20 and the second packaging device 24 act simultaneously to package two sides of the integrated circuit board simultaneously, and efficiency is improved.
Specifically, an L-shaped first supporting frame 18 is fixedly arranged on one side of the upper platform 1. One end of the first support frame 18 is fixedly arranged on the upper platform 1, and the other end of the first support frame 18 is fixedly provided with a third electric telescopic rod 19. The first packer 20 is fixedly installed at the top end of the third electric telescopic rod 19.
The third electric telescopic rod 19 drives the first packaging device 20 to move, so that the first packaging device 20 is close to the integrated circuit board below the first packaging device, and the integrated circuit board below the first packaging device is packaged.
Two supporting blocks 21 are fixedly mounted on the lower platform 2, a supporting plate 22 is fixedly mounted between the two supporting blocks 21, a fourth electric telescopic rod 23 is fixedly mounted on the supporting plate 22, and a second packaging device 24 is fixedly mounted on a push rod of the fourth electric telescopic rod 23.
The fourth electric telescopic rod 23 drives the second packaging device 24 to approach the integrated circuit board above the second packaging device, and further packages the lower surface of the integrated circuit board above the second packaging device.
The rubber stop rod 25 is fixedly arranged at one end of the upper platform 1 far away from the carrying mechanism, and the rubber stop rod 25 is matched with the second surface 31 on the clamping plate 8. When the integrated circuit board moves to the second conveying member 27 top under the centre gripping of splint 8, conveyer belt 5 continues to move left, second face 31 on the splint 8 of left side receives the hindrance of rubber pin 25, make left splint 8 rotate around corresponding pivot 7, the one end that second face 31 was kept away from to left splint 8 opens outwards, and then breaks away from with the integrated circuit board, the integrated circuit board moves a bit distance left under the effect of the splint 8 on right side simultaneously, then the integrated circuit board drops on the second conveying member 27 of below through-hole 6 under the effect of gravity. As the conveyor belt 5 moves, the left clamp 8 continues to rotate about the corresponding pivot 7 until the left clamp 8 passes over the pivot 7, and then the left clamp 8 returns to its natural state by the corresponding torsion spring 9.
A second conveying member 27 is vertically arranged at one end of the mounting frame far away from the carrying mechanism. One end of the second transfer member 27 is fixedly disposed on the lower platform 2 by a strut 26, and the other end of the second transfer member 27 extends out of the mounting bracket. The second transfer member 27 corresponds to the rubber stopper 25. The encapsulated integrated circuit boards are moved above the second conveyor 27 by the conveyor 5 and then fall onto the second conveyor 27 by the action of the rubber bars 25, which are then transported by the second conveyor 27 to the next station.
The working principle is as follows: in the initial state, the second electric telescopic rod 16 is in a compressed state, and the lowest end of the squeezing component is higher than the lowest end of the adsorbing component. The first electric telescopic bar 12 is in an extended state. The splint 8 is in a natural state. Naturally, the distance between the two recesses 29 is equal to or slightly less than the distance between the two ends of the integrated circuit board to be clamped. The handling mechanism is above the first conveyor 10.
When the integrated circuit board on the first conveying part 10 moves to the position under the absorber 15, the first electric telescopic rod 12 is started, so that the first electric telescopic rod 12 contracts, the absorber 15 is close to the integrated circuit board, and the first electric telescopic rod 12 is stopped. Then the negative pressure generator 14 is started to make the absorber 15 absorb the integrated circuit board, then the first electric telescopic rod 12 is started again to make the first electric telescopic rod 12 extend, and the absorber 15 drives the integrated circuit board to move upwards to make the integrated circuit board separate from the first conveying piece 10. The first motorized telescopic pole 12 is then closed again.
When the turntable 11 is started, the turntable 11 will drive the carrying mechanism to rotate, so that the carrying mechanism moves to the position above the conveyor belt 5, and the integrated circuit board is positioned right above the clamping assembly, and at this time, the first surface 30 on the pressing plate 17 is positioned right above the second surface 31 on the clamping plate 8. The second electric telescopic rod 16 is started to extend the second electric telescopic rod 16, so that the extrusion plate 17 moves downwards, and the first surface 30 is gradually close to the second surface 31. When the first surface 30 contacts with the second surface 31, along with the downward movement of the pressing plate 17, the pressing plate 17 presses the clamping plate 8 through the first surface 30 and the second surface 31, so that the ends of the two clamping plates 8, which have the second surface 31, are close to each other, and then the clamping plate 8 rotates around the corresponding rotating shaft 7, and the end, away from the second surface 31, of the clamping plate 8 is opened outwards. And the distance between the two clamping plates 8 at the end far away from the second surface 31 is increased until the integrated circuit board can be smoothly placed between the two clamping plates 8. In this process, the torsion spring 9 is deformed to have elastic potential energy.
The second motorized telescoping pole 16 is closed. Then the first electric telescopic rod 12 is started, so that the absorber 15 drives the integrated circuit board to move downwards until the integrated circuit board is positioned between the two grooves 29, and the first electric telescopic rod 12 is closed. The second electric telescopic rod 16 is then activated to move the pressing plate 17 upwards, and the pressing plate 17 gradually disengages from the clamping plate 8 until the initial position is reached. After the pressure of the pressing plate 17 is lost, the clamping plate 8 reversely rotates around the corresponding rotating shaft 7 under the action of the torsion spring 9, the distance between the ends of the two clamping plates 8 with the second surfaces 31 is gradually increased, and the distance between the ends of the two clamping plates 8 far away from the second surfaces 31 is gradually reduced and gradually approaches to the integrated circuit board. The clamping plate 8 is restored to the natural state and the integrated circuit board is located between the two recesses 29. The integrated circuit board is fixed on the conveyor belt 5 under the action of the two clamping plates 8. And then stopping the adsorption of the adsorption device 15 on the integrated circuit board, starting the first electric telescopic rod 12, enabling the adsorption device 15 to move upwards to be separated from the integrated circuit board, returning to the initial position, closing the first electric telescopic rod 12, starting the rotary table 11, and enabling the adsorption device 15 to move above the first conveying piece 10. Ready for the next transport.
And starting the conveyor belt 5, driving the integrated circuit board to move to the packaging mechanism by the conveyor belt 5, and stopping the movement of the conveyor belt 5. The first encapsulator 20 now faces the upper end face of the integrated circuit board and the second encapsulator 24 faces the lower end face of the integrated circuit board. Then, the third electric telescopic rod 19 and the fourth electric telescopic rod 23 are simultaneously started, so that the first packer 20 moves downwards, and the second packer 24 moves upwards. The first encapsulator 20 is brought close to the upper end face of the integrated circuit board and encapsulates the upper end face of the integrated circuit board. While the second encapsulator 24 is adjacent to and encapsulates the lower end surface of the integrated circuit board. After the packaging is completed, the first packaging device 20 is moved upwards by the third electric telescopic rod 19 and returns to the initial position. The second packer 24 is moved downwards by the fourth electric telescopic rod 23 and is returned to the initial position, ready for the next packing.
The conveyor 5 is then activated so that the conveyor 5 moves the packaged ics over the second conveyor 27. The left clamping plate 8 is acted by the rubber stop rod 25 and rotates around the rotating shaft 7, and one end of the left clamping plate 8, which is far away from the second surface 31, is outwards opened, so that the left clamping plate 8 is separated from the integrated circuit board, and the supporting function of the integrated circuit board is lost. At the same time the integrated circuit board will be pushed by the clamping plate 8 on the right side a little distance to the left and then fall under the influence of gravity onto the second conveyor 27 below through the through-hole 6. As the conveyor belt 5 moves leftward, the left-hand clamp 8 continues to rotate about the corresponding pivot shaft 7 until the left-hand clamp 8 passes the rubber stopper 25, during which the corresponding torsion spring 9 is elastically deformed. After the left clamp plate 8 passes over the rubber stopper 25, the left clamp plate 8 reversely rotates around the corresponding rotating shaft 7 under the action of the torsion spring 9 until the left clamp plate 8 returns to a natural state. The right-hand clamp 8 is then blocked by the rubber bars 25 and is rotated about the corresponding pivot axis 7 by the rubber bars 25. The end of the right clamping plate 8 with the second surface 31 is rotated to the right, and the end far away from the second surface 31 is rotated to the left until the right clamping plate 8 also passes over the rubber stop lever 25, and then is restored to the natural state under the action of the torsion spring 9. The encapsulating material thus adhered to the chucking plate 8 can also be thrown off by shaking the chucking plate 8.
The ic boards dropped onto the second transfer member 27 are transported to the next station by the second transfer member 27.
Because the conveying belt 5 is provided with the plurality of clamping assemblies, the carrying mechanism and the packaging mechanism can simultaneously act, and the working efficiency is improved.
Although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described in the foregoing embodiments, or equivalents may be substituted for elements thereof.
Claims (10)
1. A package manufacturing apparatus for an integrated circuit, comprising: the upper end surface of the mounting rack is an upper platform (1); a rectangular hole is formed in the mounting rack in the longitudinal direction, and a lower platform (2) is arranged at the bottom of the rectangular hole; the conveying belt (5) is wound on the mounting frame, a plurality of through holes (6) are formed in the conveying belt (5), and a clamping assembly is arranged on the conveying belt (5); the clamping assembly comprises two clamping plates (8) rotatably arranged on the conveyor belt (5); grooves (29) are formed in the two clamping plates (8); the two grooves (29) are oppositely arranged; the carrying mechanism comprises an adsorption component, a cross rod (13), an extrusion component and a first electric telescopic rod (12); the first electric telescopic rod (12) is rotatably arranged on one side of the upper platform (1); the cross rod (13) is transversely and fixedly arranged on a push rod of the first electric telescopic rod (12); the adsorption component is fixedly arranged on the cross rod (13); the extrusion assembly is longitudinally movably arranged on the cross rod (13); the extrusion assembly is matched with the clamping assembly; a packaging mechanism comprising a first (20) and a second (24) packager; the first packaging device (20) is longitudinally movably arranged on the upper platform (1), and the second packaging device (24) is longitudinally movably arranged on the lower platform (2); the first wrapper (20) and the second wrapper (24) are oppositely arranged; the rubber stop lever (25), rubber stop lever (25) set firmly keep away from the one end of transport mechanism on last platform (1).
2. The package manufacturing apparatus for integrated circuits according to claim 1, wherein: the mounting frame comprises a first mounting plate, a second mounting plate and a rotating roller (3); the rotary roller (3) is rotatably arranged between the first mounting plate and the second mounting plate; the number of the rotary rollers (3) is two, and the two rotary rollers (3) correspond to the two ends of the mounting frame one by one; the conveying belt (5) is wound on the two rotating rollers (3); one side fixed mounting of mounting bracket has motor (4), motor (4) are connected with one of them commentaries on classics roller (3) drive.
3. The package manufacturing apparatus for integrated circuits according to claim 1, wherein: an L-shaped first supporting frame (18) is fixedly arranged on one side of the upper platform (1); one end of the first support frame (18) is fixedly arranged on the upper platform (1), and the other end of the first support frame (18) is fixedly provided with a third electric telescopic rod (19); the first packaging device (20) is fixedly arranged at the top end of the third electric telescopic rod (19).
4. The package manufacturing apparatus for integrated circuits according to claim 1, wherein: two supporting blocks (21) are fixedly arranged on the lower platform (2); a supporting plate (22) is fixedly arranged between the two supporting blocks (21); a fourth electric telescopic rod (23) is fixedly installed on the supporting plate (22), and a second packaging device (24) is fixedly installed on a push rod of the fourth electric telescopic rod (23).
5. The package manufacturing apparatus for integrated circuits according to claim 1, wherein: the adsorption component comprises a negative pressure generator (14) and an adsorber (15); one end of the negative pressure generator (14) is fixedly arranged on the cross rod (13), and the absorber (15) is matched with the negative pressure generator (14); the absorber (15) is fixedly arranged at the lower end of the negative pressure generator (14).
6. The package manufacturing apparatus for integrated circuits according to claim 1, wherein: the extrusion assembly comprises a second electric telescopic rod (16) and an extrusion plate (17); the base of the second electric telescopic rod (16) is fixedly arranged at the lower end of the cross rod (13); the extrusion plate (17) is fixedly arranged on a push rod of the second electric telescopic rod (16), the extrusion plate (17) is C-shaped, two ends of the extrusion plate (17) are respectively provided with a first surface (30), and the two first surfaces (30) are opposite; the pressure plate (17) acts on the clamping plate (8) via a first surface (30).
7. The package manufacturing apparatus for integrated circuits according to claim 6, wherein: the conveying belt (5) is fixedly provided with two rotating shafts (7), and the two rotating shafts (7) correspond to the two clamping plates (8) one by one; the clamping plate (8) is rotatably arranged on the rotating shaft (7); a torsion spring (9) is sleeved on the rotating shaft (7), one end of the torsion spring (9) is fixedly connected with the clamping plate (8), and the other end of the torsion spring (9) is fixedly connected with the conveyor belt (5); two splint (8) all have second face (31), and two second faces (31) and two first faces (30) one-to-one set up, and second face (31) cooperate with first face (30).
8. The package manufacturing apparatus for integrated circuits according to claim 1, wherein: the length of the through hole (6) is larger than that of the integrated circuit board, and the width of the through hole (6) is larger than that of the integrated circuit board.
9. The package manufacturing apparatus for integrated circuits according to claim 1, wherein: one side of the upper platform (1) is rotatably provided with a rotary table (11), and a base of the first electric telescopic rod (12) is fixedly arranged on the rotary table (11).
10. The package manufacturing apparatus for integrated circuits according to claim 1, wherein: the one end that transport mechanism was kept away from to the mounting bracket is equipped with second conveying piece (27) perpendicularly, the fixed setting of one end of second conveying piece (27) is on platform (2) down, the other end of second conveying piece (27) extends to outside the mounting bracket, second conveying piece (27) are corresponding with rubber pin (25).
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| CN202211237249.5A CN115312445B (en) | 2022-10-11 | 2022-10-11 | Package manufacturing equipment for integrated circuit |
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| CN202211237249.5A CN115312445B (en) | 2022-10-11 | 2022-10-11 | Package manufacturing equipment for integrated circuit |
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| CN115312445A true CN115312445A (en) | 2022-11-08 |
| CN115312445B CN115312445B (en) | 2022-12-13 |
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| CN114256109A (en) * | 2021-12-22 | 2022-03-29 | 荣耀智能(山东)电子有限公司 | Packaging manufacturing equipment for multi-chip integrated circuit |
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| US6007631A (en) * | 1997-11-10 | 1999-12-28 | Speedline Technologies, Inc. | Multiple head dispensing system and method |
| US20050006743A1 (en) * | 2003-07-01 | 2005-01-13 | Kim Tae-Hyun | In-line apparatus and method for manufacturing double-sided stacked multi-chip packages |
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| CN115312445B (en) | 2022-12-13 |
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