CN115298666A - Rfid标签 - Google Patents
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- G06K19/0723—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
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Abstract
本发明涉及一种具有正面和背面的RFID标签(11)。所述RFID标签(11)包括可打印的表面(13)、天线(2)和电连接到所述天线(2)的芯片(4)上的集成电路。所述RFID标签包括电介质基板(1)、电介质层(7)和在所述基板(1)之下的接地面(3)。所述基板(1)具有第一面和第二面。所述基板(1)包括在所述基板(1)的所述第一面上的天线(2)。所述天线(2)和所述接地面(3)被配置为重叠。所述基板(1)以所述接地面(3)被配置为在所述RFID标签(11)的所述背面覆盖所述天线(2)的方式被折叠在所述电介质层(7)的至少一个边缘(7a;7b)上。
Description
技术领域
本发明涉及一种具有正面和背面的RFID标签,该RFID标签包括天线和芯片上的集成电路。
背景技术
与上述标签相关的问题之一是它不一定适用于每个表面。另一个问题是标签不能被同时编码和打印。还有一个问题是天线必须根据需要进行设计,并且它可能比预期的要长。
发明内容
本发明的目的在于提供一种RFID标签以解决上述问题。本发明的目的通过一种RFID标签来实现,该RFID标签的特征在于独立权利要求中陈述的内容。在从属权利要求中公开了本发明的优选实施方式。
本发明的RFID标签的优点在于它适用于每个表面,即它对它所附接的材料不敏感。相同的标签适用于不同的电介质(dielectric)表面,例如水箱、塑料或涂层金属。标签的背面既用作屏蔽接地,又用作天线的一部分。标签具有较窄的频带,因为可以在不增加带宽的情况下获得稳定的射频频带。
标签可以被同时编码和打印。天线可能很长,但不会使标签变大。
RFID标签通常是具有正面和背面的扁平结构。RFID标签可以包括若干相互叠置的片状层。这些层在本文中是从正面描述的。这些层可以是薄且柔性的。正面上的层可具有可打印的表面。在这种情况下,可打印的表面意味着该表面可以由设计用于打印RFID标签的打印机-编码器打印,并且打印质量足以例如用于无瑕疵条形码。可打印的表面可以是单独的层,例如纸或塑料层,或者它可以是在结构中已经具有特定任务的层,并且它具有可打印的表面作为额外特征,即没有用于打印的单独的层。然而,可打印的表面可以覆盖有漆或涂层。
标签可以是标记(label)。标记可为薄且适形的,因为它必须通过打印机-编码器。标记可在其背面上具有粘合剂,诸如压敏粘合剂。
RFID标签包括天线和电连接到天线的芯片上的集成电路。天线可以在850MHz至960MHz之间的UHF频率下工作。
RFID标签(射频识别标签)包括电介质基板、电介质层和电介质基板之下的接地面。换句话说,接地面位于基板的下侧,或它位于电介质基板之下的其自己的接地面基板上。电介质基板和电介质层可以是塑料材料。电介质基板可以是例如聚酯。可以使用纸来代替塑料材料。
电介质层可以是例如聚丙烯。电介质层优选地由泡沫制成,即轻质多孔材料,其中,在制造过程中会形成气泡。代替塑料材料,电介质层可以是电介质粘合剂。
基板具有第一面(side)和第二面。基板包括在基板的第一面上的天线。基板可以包括在基板的第二面上的接地面。天线和接地面可以被蚀刻或打印到基板,但是在相反的面上,或者它们可以被蚀刻或打印在它们自己的基板上。
天线和接地面被配置为重叠。它们可以以这样的方式重叠:基板的第一面上的天线至少部分地在基板的第二面上的接地面的顶部上延伸,或者电介质基板上的天线至少部分地在接地面自己的接地面基板上的接地面的顶部上延伸。在准备好的RFID标签中,电介质基板以接地面被配置为在RFID标签的背面覆盖天线的方式被折叠在电介质层上。接地面可以覆盖RFID标签的整个背面。接地面稳定天线的辐射。
基板可以折叠在电介质层的一个边缘上,或者它可以折叠在电介质层的两个相反边缘上。天线和接地面通过电容耦合进行耦合。因此,接地面可以用作屏蔽接地以及和与天线一起用作辐射元件。RFID标签可以被同时打印和编码,因为能够通过接地面从RFID应答器的背面进行天线的近场通信。
RFID标签可以通过卷对卷工艺制造。RFID标签可以粘附到释放衬垫。当它们在卷材(web)或片材的表面上时,它们可以一个接一个地打印。
附图说明
在下文中,将参照附图通过优选实施方式更详细地描述本发明,在附图中,
图1示出了从上方观察的一个包括连续的RFID标签的卷材;
图2示出了从上方观察的另一个包括连续的RFID标签的卷材;
图3a示出了图1的RFID标签的横截面;
图3b示出了图1的RFID标签的另一横截面;
图4示出了图2的RFID标签的横截面;
图5示出了从上方观察的基板。
具体实施方式
图1示出了包括在释放衬垫9上的连续RFID标签11的卷材10。在连续的RFID标签11之间可以存在间隔件12,该间隔件12防止打印机-编码器的打印头落入连续的RFID标签11之间的间隙中。
在RFID标签11之一中示出了芯片4和天线2位于标签中的位置。图1中的横截面A-A在图3中示出。
图2示出了包括在释放衬垫9上的连续RFID标签11的卷材10。在连续的RFID标签11之间可以存在间隔件12,该间隔件12防止打印机-编码器的打印头落入连续的RFID标签11之间的间隙中。
在RFID标签11之一中示出了芯片4和天线2位于标签中的位置。图2中的横截面A-A在图4中示出。
图3a示出了RFID标签11的一种可能结构。RFID标签11包括基板1、电介质层7和面层8。RFID标签11可以附接到释放衬垫9。基板1、电介质层7和面层8可以通过粘合剂附接在一起。图3中的虚线表示使用粘合剂的可能位置。
基板1包括天线2、接地面3和芯片4。芯片电连接到天线2。天线2和接地面3位于基板1的相反的面上。基板1以接地面3被配置为在RFID标签的背面覆盖天线2的方式被折叠在电介质层7的边缘7a上。
在一些情况下可以省略面层8。基板1的面向RFID标签11的正面的面可以是可打印的表面。在这种情况下,必须以满足可打印的表面的先决条件的方式选择基板。
在一些情况下,如图3b所示,接地面3可以在电介质基板1之下的其自己的接地面基板12上。
因此,可能存在具有在同一基板1上的天线2和接地面3的标签11,或者可能存在具有在单独的基板1、12上的天线2和接地面3的标签11。上述两种替代方案在有或没有面层8的情况下都是可行的。
图4示出了RFID标签11的另一个可能的结构。RFID标签包括基板1、电介质层7和面层8。RFID标签可以附接到释放衬垫9。基板1、电介质层7和面层8可以通过粘合剂附接在一起。图4中的虚线表示使用粘合剂的可能位置。
基板1包括天线2、接地面3和芯片4。芯片电连接到天线2。天线2和接地面3位于基板1的相反的面上。基板1以天线2缠绕在电介质层7周围的方式折叠在电介质层7的两个相反边缘7a、7b上。接地面3被配置为在RFID标签的背面覆盖天线2。
在一些情况下可以省略面层8。基板1的面向RFID标签11的正面的面可以是可打印的表面。在这种情况下,必须以满足可打印的表面的先决条件的方式选择基板。
在一些情况下,接地面3可以在电介质基板1之下的其自己的接地面基板上。
因此,可能存在具有在同一基板1上的天线2和接地面3的标签11,或者可能存在具有在单独的基板1、12上的天线2和接地面3的标签11,如图3b所示。相同的细节也可以应用于图4的结构。上述两种替代方案在有或没有面层8的情况下都是可行的。
图5示出了当基板1呈直线(straight)形式时基板1的第一面的示例。基板包括在第一面上的天线2和在第二面上的接地面3(虚线)。天线2和接地面3可以通过蚀刻或打印形成。天线2和接地面3可以是金属材料,诸如铝或铜,或者它们可以是导电聚合物。
天线2和接地面3在区域6中重叠。区域6仅示意性地在图5中示出,因此其长度可以根据基板1的使用位置而变化。
基板1进一步包括在芯片4上的集成电路,该芯片4通过导体电连接到天线2。芯片4的导体可以以与天线2和接地面3相同的方式形成。在图5中,通过从空间5去除天线材料来形成导体。
对于本领域技术人员来说显而易见的是,随着技术的进步,可以以各种方式实现本发明构思。本发明及其实施方式不限于上述示例而是可以在权利要求书的范围内变化。
Claims (8)
1.一种具有正面和背面的RFID标签(11),所述RFID标签(11)包括能够打印的表面(13)、天线(2)和电连接到所述天线(2)的芯片(4)上的集成电路,其特征在于,所述RFID标签包括电介质基板(1)、电介质层(7)和在所述基板(1)之下的接地面(3),所述基板(1)具有第一面和第二面,所述基板(1)包括在所述基板(1)的所述第一面上的天线(2),所述天线(2)和所述接地面(3)被配置为重叠,所述基板(1)以所述接地面(3)被配置为在所述RFID标签(11)的所述背面覆盖所述天线(2)的方式被折叠在所述电介质层(7)的至少一个边缘(7a;7b)上。
2.根据权利要求1所述的RFID标签,其特征在于,所述基板(1)包括在所述基板(1)的所述第二面上的接地面(3)。
3.根据权利要求1所述的RFID标签,其特征在于,所述接地面(3)位于所述接地面(3)自己的接地面基板(12)上。
4.根据前述权利要求中任一项所述的RFID标签,其特征在于,所述基板折叠在所述电介质层(7)的两个相反边缘(7a、7b)上。
5.根据前述权利要求中任一项所述的RFID标签,其特征在于,所述电介质层(7)是泡沫。
6.根据前述权利要求中任一项所述的RFID标签,其特征在于,所述能够打印的表面(13)是纸或塑料层。
7.根据前述权利要求中任一项所述的RFID标签,其特征在于,所述能够打印的表面(13)是所述基板(1)的面向所述RFID标签(11)的所述正面的所述第二面。
8.根据权利要求7所述的RFID标签,其特征在于,所述基板(1)的所述第二面包括漆或涂层。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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PCT/CN2020/080797 WO2021189228A1 (en) | 2020-03-24 | 2020-03-24 | Rfid tag |
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CN115298666A true CN115298666A (zh) | 2022-11-04 |
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CN202080098626.4A Pending CN115298666A (zh) | 2020-03-24 | 2020-03-24 | Rfid标签 |
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US (1) | US20230351140A1 (zh) |
EP (1) | EP4128046A4 (zh) |
CN (1) | CN115298666A (zh) |
BR (1) | BR112022018373A2 (zh) |
WO (1) | WO2021189228A1 (zh) |
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CN114335987B (zh) * | 2022-03-15 | 2022-06-07 | 英内物联网科技启东有限公司 | 一种具有rfid电子标签式的天线模块 |
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Publication number | Priority date | Publication date | Assignee | Title |
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US6107920A (en) * | 1998-06-09 | 2000-08-22 | Motorola, Inc. | Radio frequency identification tag having an article integrated antenna |
US7652636B2 (en) * | 2003-04-10 | 2010-01-26 | Avery Dennison Corporation | RFID devices having self-compensating antennas and conductive shields |
ES2291903T3 (es) * | 2003-04-10 | 2008-03-01 | Avery Dennison Corporation | Antenas auto-compensadas para substratos que tienen valores de constante dilectrica diferentes. |
US20060290498A1 (en) * | 2005-06-23 | 2006-12-28 | Ncr Corporation | Incorporation of RFID devices into labels |
JP2007286757A (ja) * | 2006-04-13 | 2007-11-01 | Brother Ind Ltd | 無線タグラベル、タグテープロール、無線タグ回路素子カートリッジ |
FI120018B (fi) * | 2006-04-28 | 2009-05-29 | Wisteq Oy | Etätunniste ja sen aihio sekä rakennustapa etätunnistimen valmistamiseksi |
JP2007326307A (ja) * | 2006-06-08 | 2007-12-20 | Brother Ind Ltd | タグラベル作成装置 |
JP2008176240A (ja) * | 2007-01-22 | 2008-07-31 | Sato Corp | 表裏表示rfidシートおよびその作成方法 |
US20090085750A1 (en) * | 2007-09-27 | 2009-04-02 | 3M Innovative Properties Company | Extended RFID tag |
EP2198397B1 (en) * | 2007-10-12 | 2012-08-29 | Solstice Medical, Llc. | Small gamma shielded shorted patch rfid tag |
TWI355610B (en) * | 2007-12-21 | 2012-01-01 | Ind Tech Res Inst | Anti-metal rf identification tag and the manufactu |
WO2016024035A1 (en) * | 2014-08-13 | 2016-02-18 | Nokia Technologies Oy | Apparatus and method for radio communication and energy storage |
WO2016059285A1 (en) * | 2014-10-14 | 2016-04-21 | Confidex Oy | Rfid transponder and rfid transponder web |
CN111801692A (zh) * | 2018-02-08 | 2020-10-20 | 艾利丹尼森零售信息服务公司 | 边缘可附接的射频识别标签 |
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2020
- 2020-03-24 BR BR112022018373A patent/BR112022018373A2/pt unknown
- 2020-03-24 WO PCT/CN2020/080797 patent/WO2021189228A1/en unknown
- 2020-03-24 EP EP20927142.8A patent/EP4128046A4/en active Pending
- 2020-03-24 US US17/910,172 patent/US20230351140A1/en active Pending
- 2020-03-24 CN CN202080098626.4A patent/CN115298666A/zh active Pending
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BR112022018373A2 (pt) | 2022-11-08 |
EP4128046A1 (en) | 2023-02-08 |
US20230351140A1 (en) | 2023-11-02 |
WO2021189228A8 (en) | 2021-11-04 |
WO2021189228A1 (en) | 2021-09-30 |
EP4128046A4 (en) | 2023-12-20 |
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