CN115249758B - Pixel die bonder - Google Patents
Pixel die bonder Download PDFInfo
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- CN115249758B CN115249758B CN202211156181.8A CN202211156181A CN115249758B CN 115249758 B CN115249758 B CN 115249758B CN 202211156181 A CN202211156181 A CN 202211156181A CN 115249758 B CN115249758 B CN 115249758B
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- 238000012545 processing Methods 0.000 claims description 14
- 238000003860 storage Methods 0.000 claims description 11
- 230000000007 visual effect Effects 0.000 claims description 8
- 235000021167 banquet Nutrition 0.000 claims description 7
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- 238000000429 assembly Methods 0.000 abstract description 19
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67294—Apparatus for monitoring, sorting or marking using identification means, e.g. labels on substrates or labels on containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0093—Wafer bonding; Removal of the growth substrate
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Die Bonding (AREA)
Abstract
The invention belongs to the technical field of semiconductor production equipment, and particularly relates to a pixel die bonder, which comprises a lower bottom plate, wherein a head bonding plate is fixed at the upper end of the lower bottom plate, a turret is assembled at the upper end of the head bonding plate, the output end of the turret extends to the lower end of the head bonding plate, a multi-station turntable is fixed at the lower end of the turret, the multi-station turntable is driven by the turret to perform unidirectional circular motion, and a plurality of vertical sliding table assemblies are annularly distributed at the outer side of the multi-station turntable. According to the invention, the pick-up of one (or a plurality of) pixel R, G, B wafers can be completed at a time, the die bonding path and single die bonding time are reduced, meanwhile, the conditions of wafer rotation angle at the lower end of the suction nozzle, cleanliness at the lower end of the suction nozzle, wafer damage, wafer omission and the like can be detected through the image acquisition element, when the wafer angle has deviation, the deflection angle of the wafer can be corrected through the rotation element, and the yield of die bonding is improved.
Description
Technical Field
The invention belongs to the technical field of semiconductor production equipment, and particularly relates to a pixel die bonder.
Background
The die bonder is mechanical equipment for fixing crystals and packaging semiconductors, can transfer and attach wafers on blue films to a substrate to complete chip attachment, and is widely applied to production of products such as LED direct display screens, semiconductor discrete devices, DIP, SOP and the like.
When the LED direct display screen is manufactured by utilizing the die bonder, as each pixel on the LED direct display screen is composed of three different colors of wafers of red (R), green (G) and blue (B), after the wafer is picked up by the die bonder through the suction nozzle in the traditional wafer bonding process, the suction nozzle is driven to move through the swing arm, the wafer on the wafer supply ring is conveyed onto the substrate, and the following problems exist in the wafer bonding process of the traditional die bonder:
1. the swing arm on the die bonding equipment swings reciprocally only once to carry one wafer, one pixel R, G, B wafer is attached to the substrate, the swing arm is required to swing reciprocally three times, and the wafer carrying efficiency and the production efficiency are low;
2. the wafer is conveyed in a swinging way, the requirement on the rigidity and strength of the swinging arm is high, the single die bonding path is long, the single die bonding time is long, the wafer conveying frequency is high, the operation frequency of the fixed platform is high, the reciprocating frequency of the swinging arm is high, the operation stability of die bonding equipment is relatively weakened, the die bonding performance is relatively reduced, and the final substrate yield is affected;
3. after the wafer is picked up by the suction nozzle, if the rotation angle of the wafer on the suction nozzle deviates, the angle is difficult to adjust under the adsorption state, the rotation angle of the wafer cannot be corrected by the existing equipment without an angle correction mechanism, the wafer with the deviation angle is attached to the substrate, the yield of the substrate is reduced, the production cost is further improved, and the product quality is reduced;
based on the above problems, the present solution provides a pixel die bonder to solve the above-mentioned pain points in the industry.
Disclosure of Invention
The invention aims to provide a pixel die bonder, which can sequentially absorb wafers, die bond of one (or a plurality of) pixel R, G, B wafers is completed at a time, the die bond path and single die bond time (efficiency is improved by 3 times or 3*N times) are reduced, meanwhile, the conditions of wafer rotation angle at the lower end of a suction nozzle, cleanliness at the lower end of the suction nozzle, wafer damage, wafer omission and the like can be detected through an image acquisition element, and when the wafer rotation angle has deviation, the deflection angle of the wafers can be corrected through a rotary motor, so that the yield of substrates is improved.
The technical scheme adopted by the invention is as follows:
the utility model provides a solid brilliant machine of pixel, includes the underfloor, the upper end of underfloor is fixed with the banquet board, the upper end of banquet board is equipped with the capstan head, just the output of capstan head extends to the lower extreme of banquet board, the lower extreme of capstan head is fixed with the multistation carousel, the multistation carousel is one-way circular motion under the drive of capstan head, the outside annular distribution of multistation carousel has a plurality of vertical slip table subassemblies, still includes:
the wafer pickup correction assembly is assembled on the vertical sliding table assembly, a real air channel is formed in the wafer pickup correction assembly, and the vertical sliding table assembly can drive the wafer pickup correction assembly to move in the vertical direction;
the suction nozzle is assembled in the wafer pickup correction assembly, and a plurality of adsorption air passages are formed in the suction nozzle;
the pick-up air passage is formed by combining an adsorption air passage and a vacuum air passage, and the suction nozzle can pick up wafers in sequence through the pick-up air passage to finish the pick-up of the pixel R, G, B wafers;
the image acquisition assembly is assembled at the upper end of the lower bottom plate and can detect the rotation angle of the R, G, B wafer;
the R, G, B wafer can synchronously rotate along with the suction nozzle to adjust the rotation angle of the R, G, B wafer.
In a preferred scheme, the wafer picks up correction module includes rotating electrical machines, vacuum seat, axial fixity cover and stop nut, the rotating electrical machines assembles on vertical slip table subassembly, the inside of rotating electrical machines is provided with output axostylus axostyle, just output axostylus axostyle's both ends all extend to the rotating electrical machines outside, the vacuum seat is fixed in the upper end of rotating electrical machines, just vacuum air flue runs through output axostylus axostyle and inside the vacuum seat, the axial fixity cover is fixed in the lower extreme in the output axostylus axostyle outside, the suction nozzle is overlapped in the inside of axial fixity cover, just the upper end of suction nozzle is laminated mutually with the lower extreme of output axostylus axostyle, stop nut threaded connection is in the lower extreme of axial fixity cover, just stop nut can form spacingly to the suction nozzle.
In a preferred scheme, still include base plate clamping assembly, a plurality of wafer supply assembly and a plurality of image positioning assembly, base plate clamping assembly and a plurality of wafer supply assembly all assemble on the lower plate, just wafer supply assembly and image acquisition assembly one-to-one, a plurality of image positioning assembly all assemble on the bang-bang plate, a plurality of image positioning assembly and a plurality of wafer supply assembly and image positioning assembly and base plate clamping assembly between one-to-one, just all be equipped with the cross workstation between base plate clamping assembly and lower plate and wafer supply assembly and the lower plate, through the position that cross workstation can adjust base plate clamping assembly and wafer supply assembly in the horizontal direction.
In a preferred scheme, the suction nozzle can pick up wafers sequentially through the pick-up gas path, and pick up of a group of pixels R, G, B of wafers is completed.
In a preferred scheme, the suction nozzle can pick up wafers sequentially through the pick-up gas path, and pick up of a plurality of groups of pixels R, G, B of wafers is completed.
In a preferred scheme, the suction nozzle can pick up wafers sequentially through the pick-up gas path, and pick up of any plurality of pixels R, G, B wafers is completed.
The control terminal is suitable for the pixel die bonder, and comprises a processing unit, a storage unit and a communication module which are connected through a system bus, wherein an operating system and a CCD visual detection system are stored in the storage unit, and the processing unit can process and calculate images when running the CCD visual detection system.
The invention has the technical effects that:
according to the invention, the suction nozzle can be assembled at the lower end of the output shaft rod through the cooperation of the axial fixing sleeve and the limit nut, the rotation angle of the wafer positioned at the lower end of the suction nozzle is checked through the image acquisition element, if the rotation angle of the wafer deviates, the rotating motor is started, the suction nozzle is driven to rotate through the output shaft rod, and then the rotation angle of the wafer positioned at the lower end of the rotating motor is adjusted through the suction nozzle, so that the deviation of the rotation angle of the wafer during bonding the wafer is avoided, the yield of the solid crystal is reduced, the product quality is improved, and the production cost is reduced;
according to the invention, the multi-station turntable is driven to rotate in one direction through the turret, and the wafers are alternately picked up, carried and attached through the plurality of wafer pickup correction assemblies at the outer side of the multi-station turntable, so that the die bonding path and single die bonding time are reduced, the die bonding efficiency is improved, the operation times of a die bonding platform are reduced, and the operation stability and die bonding performance of the device are relatively improved;
when the wafer is picked up by the suction nozzle, the suction nozzle can sequentially pick up the wafer after negative pressure is formed in the pick-up gas path through the plurality of suction channels formed in the suction nozzle, so that the pick-up of one or more pixel R, G, B wafers is finished, the operation times of the die bonding platform are further reduced, and the die bonding efficiency and the die production capacity are improved;
according to the invention, the image acquisition element is used for acquiring the image at the lower end of the suction nozzle, and the CCD visual detection system is used for processing and calculating the acquired image, so that the rotation angle of the wafer at the lower end R, G, B of the suction nozzle, the cleanliness of the lower end of the suction nozzle, the damage of the wafer, the omission of the wafer and the like can be detected.
Drawings
FIG. 1 is a schematic overall structure of a first embodiment of the present invention;
FIG. 2 is a rear view of the overall structure of the first embodiment of the present invention;
FIG. 3 is a schematic view showing the structure of the upper end of the lower plate in the first embodiment of the present invention;
FIG. 4 is a schematic view showing the structure of a turret and wafer pickup alignment assembly according to a first embodiment of the present invention;
FIG. 5 is an enlarged view of a portion of the invention at A in FIG. 4;
FIG. 6 is a cross-sectional view of a wafer pickup calibration assembly according to an embodiment of the invention;
FIG. 7 is a schematic view of an image capturing assembly according to a first embodiment of the present invention;
FIG. 8 is an exploded view of the structure of an image acquisition assembly in accordance with a first embodiment of the present invention;
FIG. 9 is a schematic view showing the structure of a cleaning assembly according to a first embodiment of the present invention;
FIG. 10 is a schematic view of a substrate clamping assembly according to a first embodiment of the invention;
FIG. 11 is a schematic view of a wafer supply assembly according to an embodiment of the invention;
FIG. 12 is a schematic view of an image positioning assembly according to a first embodiment of the present invention;
fig. 13 is a frame diagram of a control terminal in the first embodiment of the present invention.
In the drawings, the list of components represented by the various numbers is as follows:
10. a lower base plate; 11. a binding plate; 12. a suction nozzle; 20. a turret; 21. a multi-station turntable; 22. a vertical slipway assembly;
30. a wafer pickup correction assembly;
31. a rotating electric machine; 32. a vacuum seat; 33. an axial fixing sleeve; 34. a limit nut; 35. an output shaft;
40. an image acquisition component;
41. a base; 42. a lateral adjustment plate; 43. a longitudinal adjustment plate; 44. a displacement slipway assembly; 45. an image acquisition element;
50. cleaning the assembly;
51. a lower base; 52. a longitudinal sliding table; 53. a transverse sliding table; 54. a driving motor; 55. a dust collection box;
60. a substrate clamping assembly; 70. a wafer supply assembly; 80. an image positioning assembly.
Detailed Description
In order that the above-recited objects, features and advantages of the present invention will become more readily apparent, a more particular description of the invention will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, but the present invention may be practiced in other ways other than those described herein, and persons skilled in the art will readily appreciate that the present invention is not limited to the specific embodiments disclosed below.
Further, reference herein to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic can be included in at least one implementation of the invention. The appearances of the phrase "in one preferred embodiment" in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments.
In describing the embodiments of the present invention in detail, the cross-sectional view of the device structure is not partially enlarged to a general scale, and the schematic drawings are only examples, which should not limit the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in actual fabrication.
Example 1
Referring to fig. 1-5, a first embodiment of the present invention provides a pixel die bonder, which includes a lower base plate 10, a bonding head plate 11 is fixed at an upper end of the lower base plate 10, a turret 20 is assembled at an upper end of the bonding head plate 11, an output end of the turret 20 extends to a lower end of the bonding head plate 11, an electrical slip ring is disposed at an upper end of the turret 20, a multi-station turntable 21 is fixed at a lower end of the turret 20, the multi-station turntable 21 is driven by the turret 20 to perform unidirectional circular motion, a plurality of vertical slip table assemblies 22 are annularly distributed at an outer side of the multi-station turntable 21, and the pixel die bonder further includes:
the wafer pickup correction assembly 30, the wafer pickup correction assembly 30 is assembled on the vertical sliding table assembly 22, a real air channel is formed in the wafer pickup correction assembly 30, and the vertical sliding table assembly 22 can drive the wafer pickup correction assembly 30 to move in the vertical direction;
a suction nozzle 12, wherein the suction nozzle 12 is assembled in the wafer pickup correction assembly 30, and a plurality of suction air passages are formed in the suction nozzle 12;
the pick-up air passage is formed by combining an adsorption air passage and a vacuum air passage, and the suction nozzle 12 can pick up wafers in sequence through the pick-up air passage to finish the pick-up of the wafers;
the wafer pickup can be divided into three types, specifically:
mode one: the suction nozzle 12 can sequentially pick up the wafers through the pick-up air path, thereby completing the pick-up of the wafers of a group of pixels R, G, B.
Mode two: the suction nozzle 12 can sequentially pick up wafers through the pick-up air path, and pick up of a plurality of groups of pixels R, G, B of wafers is completed.
Mode three: the suction nozzle 12 can sequentially pick up the wafers through the pick-up air path, thereby completing the pick-up of any plurality of pixels R, G, B of the wafers.
Of course, the above manner is not limiting of its actual picking, and the specific picking process may be selected according to production requirements.
The image acquisition assembly 40 is assembled at the upper end of the lower base plate 10, and the image acquisition assembly 40 can detect the rotation angle of the R, G, B wafer;
wherein the R, G, B wafer can be rotated synchronously with the suction nozzles 12 to adjust the rotation angle of the R, G, B wafer.
Here, a vacuum pump is used in cooperation with the wafer pickup calibration assembly 30, and after the vacuum pump is operated, a negative pressure is formed inside the pickup air path, and the suction nozzle 12 picks up the R, G, B wafer by the negative pressure inside the pickup air path.
In this embodiment, the turret 20 is started, through the fixed connection between the turret 20 and the multi-station turntable 21, the turret 20 drives the multi-station turntable 21 to do unidirectional circular motion, the multi-station turntable 21 drives the vertical sliding table assembly 22 to rotate due to the fact that the vertical sliding table assembly 22 is distributed on the outer side of the multi-station turntable 21, and then drives the wafer pickup correction assembly 30 and the suction nozzle 12 to rotate, when the suction nozzle 12 rotates to the upper side of the wafer, the vertical sliding table assembly 22 is started, the wafer pickup correction assembly 30 is driven to move in the vertical direction through the vertical sliding table assembly 22, and then the suction nozzle 12 moves in the direction close to the wafer, after the suction nozzle 12 is attached to the wafer, the vacuum pump is started, negative pressure is formed inside the pickup air path, the wafer is picked up through the suction air paths inside the suction nozzle 12, and simultaneously, since three suction air paths are formed inside the suction nozzle 12, the suction nozzle 12 is driven to sequentially rotate to the upper parts of the R wafer, the G wafer and the B wafer through the turret 20, so that the suction nozzle 12 can sequentially absorb the R wafer, the G wafer and the B wafer to finish picking up one pixel R, G, B wafer, after the suction nozzle 12 picks up R, G, B wafer, the suction nozzle 12 is driven to rotate through the turret 20, when the suction nozzle 12 rotates to the upper part of the image acquisition component 40, the rotation angle of the R, G, B wafer is detected through the image acquisition component 40, when the rotation angle of the R, G, B wafer deviates, the wafer pickup correction component 30 is started, the suction nozzle 12 is driven to rotate through the wafer pickup correction component 30, and then the rotation angle of the R, G, B wafer is corrected through the suction nozzle 12, so that the device has the functions of detecting and correcting the rotation angle of the wafer, and the R, G, B wafer is prevented from being attached to a substrate, deviation of the rotation angle occurs, so that the yield of the substrate is reduced, the product quality is improved, and the production cost is reduced.
Referring to fig. 5-6 again, the wafer pick-up calibration assembly 30 includes a rotating motor 31, a vacuum seat 32, an axial fixing sleeve 33 and a limit nut 34, the rotating motor 31 is assembled on the vertical sliding table assembly 22, an output shaft 35 is disposed in the rotating motor 31, two ends of the output shaft 35 extend to the outside of the rotating motor 31, the vacuum seat 32 is fixed at the upper end of the rotating motor 31, a vacuum air passage penetrates through the output shaft 35 and the vacuum seat 32, the axial fixing sleeve 33 is fixed at the lower end of the outer side of the output shaft 35, the suction nozzle 12 is sleeved in the axial fixing sleeve 33, the upper end of the suction nozzle 12 is attached to the lower end of the output shaft 35, the limit nut 34 is in threaded connection with the lower end of the axial fixing sleeve 33, and the limit nut 34 can limit the suction nozzle 12.
The vacuum holder 32 and the vacuum pump are connected by a line.
Further, the sealing element is assembled in the axial fixing sleeve 33, the sealing element is made of flexible material, the limit nut 34 is screwed, the suction nozzle 12 is limited by the limit nut 34, after the upper end of the suction nozzle 12 is attached to the output shaft rod 35, the sealing element made of flexible material is extruded, and further, gaps between the suction nozzle 12 and the output shaft rod 35 are avoided, and the sealing performance of a pick-up air passage is improved
In this embodiment, the vertical sliding table assembly 22 is started, the rotating motor 31 is driven to move in the vertical direction by the vertical sliding table assembly 22, the suction nozzle 12, the axial fixing sleeve 33 and the limit nut 34 are driven to move in the vertical direction by the rotating motor 31, when the suction nozzle 12 is attached to a wafer, the vacuum pump is started, the suction nozzle 12 is used for picking up R, G, B wafers, when the suction nozzle 12 carries R, G, B wafers, the image acquisition assembly 40 is used for detecting the rotation angle of the R, G, B wafers after the suction nozzle 12 is rotated to the upper end of the image acquisition assembly 40, when the rotation angle of the R, G, B wafers deviates, the rotating motor 31 is started, the output shaft rod 35 is enabled to rotate, the axial fixing sleeve 33 and the limit nut 34 are driven to rotate by the fixed connection of the output shaft rod 35 and the axial fixing sleeve 33, the limit nut 34 are further driven to rotate by the axial fixing sleeve 33 and the limit nut 34, and the suction nozzle 12 is further used for correcting the rotation angle of the R, G, B wafers by the suction nozzle 12.
To further understand and illustrate the process of adjusting the rotation angle of the wafer driven by the suction nozzle 12, taking fig. 7-8 as an example, the image acquisition assembly 40 includes a base 41, a transverse adjustment plate 42, a longitudinal adjustment plate 43, a displacement sliding table assembly 44 and an image acquisition element 45, where the base 41 is fixed at the upper end of the lower base 10, the transverse adjustment plate 42 is slidably connected to the upper end of the base 41, the longitudinal adjustment plate 43 is slidably connected to the upper end of the transverse adjustment plate 42, the displacement sliding table assembly 44 is assembled on one side of the longitudinal adjustment plate 43, the image acquisition element 45 is fixed on one side of the displacement sliding table assembly 44, and a light source element, preferably an LED light source element, is further disposed at the upper end of the displacement sliding table assembly 44 and located at the upper end outside the image acquisition element 45, and is capable of providing illumination and brightness supplement in a visual range through the light source element.
Further, the displacement sliding table assembly 44 at least comprises a sliding table base, a displacement sliding block and a positioning assembly, the sliding table base is in sliding connection with the displacement sliding block, the positioning assembly is assembled between the sliding table base and the displacement sliding block, the positioning assembly can limit the displacement sliding block, the sliding base is fixedly connected with the longitudinal adjusting plate 43, and the displacement sliding table is fixedly connected with the image acquisition element 45.
In this embodiment, the position of the image collecting element 45 on the horizontal plane is adjusted by pushing the horizontal adjusting plate 42 and the vertical adjusting plate 43, the limitation of the positioning component on the displacement sliding table is released, the position of the displacement sliding block is adjusted, the position of the image collecting element 45 is adjusted in the vertical direction through the fixed connection of the displacement sliding block and the image collecting element 45, so that the image collecting element 45 is located on the moving track of the suction nozzle 12, the rotation angle of the R, G, B wafer is conveniently detected by the image collecting element 45, meanwhile, the conditions of cleanliness, wafer damage, wafer omission and the like at the lower end of the suction nozzle 12 can be detected by the image collecting element 45, and the yield of the substrate is further improved.
Next, referring to fig. 9 again, the method further includes: the cleaning assembly 50, the cleaning assembly 50 includes a lower base 51, a longitudinal sliding table 52, a transverse sliding table 53, a driving motor 54 and a dust collecting box 55, the lower base 51 is fixed on the lower base plate 10, the longitudinal sliding table 52 is fixed on one side of the lower base 51, the transverse sliding table 53 is fixed on the output end of the longitudinal sliding table 52, the driving motor 54 is fixed on the output end of the transverse sliding table 53, the output end of the driving motor 54 is equipped with a cleaning element, and the dust collecting box 55 is assembled on the output end of the transverse sliding table 53 and is located at the lower end of the cleaning element.
Further, a negative pressure detection module is further disposed on the bonding head plate 11, and when the R, G, B wafer is bonded to the substrate, the negative pressure detection module is used to detect the negative pressure, if there is a negative pressure difference, the turret 20 drives the suction nozzle 12 to rotate to the upper end of the cleaning assembly 50, and the driving motor 54 is used to clean the suction nozzle 12.
In this embodiment, when the image pickup element 45 detects that dirt is present at the lower end of the suction nozzle 12, the suction nozzle 12 with dirt present at the lower end is rotated to the upper end of the cleaning element by the driving of the turret 20, the longitudinal sliding table 52 and the transverse sliding table 53 are started, the cleaning element at the output end of the driving motor 54 is attached to the suction nozzle 12 by the cooperation of the longitudinal sliding table 52 and the transverse sliding table 53, the driving motor 54 is started, the cleaning element is driven to rotate by the driving motor 54, the suction nozzle 12 is cleaned by the cleaning element, and meanwhile, the dirt which is swept down is collected by the dust box 55.
Referring to fig. 1-3 and fig. 10-12, the wafer processing apparatus further includes a substrate clamping assembly 60, a plurality of wafer feeding assemblies 70, and a plurality of image positioning assemblies 80, wherein the substrate clamping assembly 60 and the plurality of wafer feeding assemblies 70 are respectively mounted on the lower plate 10, the wafer feeding assemblies 70 and the image capturing assemblies 40 are respectively in one-to-one correspondence, the plurality of image positioning assemblies 80 are respectively mounted on the bonding head plate 11, the plurality of image positioning assemblies 80 and the plurality of wafer feeding assemblies 70 are respectively in one-to-one correspondence with the substrate clamping assembly 60, and a cross table is respectively mounted between the substrate clamping assembly 60 and the lower plate 10 and between the wafer feeding assemblies 70 and the lower plate 10, so that the positions of the substrate clamping assembly 60 and the wafer feeding assemblies 70 can be adjusted in the horizontal direction through the cross table.
Further, a clamping jig is provided on the substrate clamping assembly 60, the clamping jig is used for clamping a substrate, a wafer feeding ring is provided on the wafer feeding assembly 70 and used for feeding R, G, B wafers to the suction nozzles 12, a blue film is provided on the wafer feeding ring, a jacking device is mounted at the upper end of the lower base plate 10 and at the lower end of the wafer feeding ring, after the suction nozzles 12 suck the wafers, the jacking device is started, the wafers can be jacked up through the jacking device, the wafers are separated from the blue film, an industrial camera is provided on the image positioning assembly 80 and used for accurately positioning the wafers, and the substrate clamping assembly 60 and the wafer feeding assembly 70 can adjust positions in the horizontal direction under the action of a cross workbench at the lower end of the wafer clamping assembly, so as to drive R, G, B wafers on the substrates, the wafer feeding ring and the wafer feeding ring to adjust positions.
Preferably, in this embodiment, the number of the suction nozzles 12 and the wafer pickup correction assemblies 30 is eight, the horizontal included angle between two adjacent wafer pickup correction assemblies 30 is 45 degrees, the rotation angle of R, G, B wafers during the conveyance through the suction nozzles 12 in two adjacent wafer fixing cycles is 45 degrees, so that the wafer fixing path and the single wafer fixing time are shortened, the number of the wafer supply assemblies 70 is three, the eight wafer pickup correction assemblies 30 can alternately pick up the wafers on the three wafer supply assemblies 70, and meanwhile, when the wafers are picked up through the suction nozzles 12, the wafers can be sequentially picked up through the suction nozzles 12 after negative pressure is formed inside the pickup gas circuit, so that the number of times of operation of the wafer supply assemblies 70 is shortened, and the wafer fixing efficiency and the wafer yield are improved.
In this embodiment, before the suction nozzle 12 picks up the R, G, B wafer, the wafer position on the wafer supply ring is accurately acquired through the image positioning component 80, when the wafer position deviates and is not on the moving track of the suction nozzle 12, the cross workbench at the lower end of the wafer supply ring is started, the position of the wafer on the wafer supply ring is adjusted in advance through the cross workbench, so that the suction nozzle 12 can accurately pick up R, G, B wafers, when the suction nozzle 12 picks up R, G, B wafers, the jacking device is synchronously started, the wafer is jacked up through the jacking device to separate from a blue film, the suction nozzle 12 is driven by the turret 20 to rotate, and when the suction nozzle 12 drives R, G, B wafers to rotate to the upper end of the image acquisition component 40, if the rotation angle of the wafer R, G, B at the lower end of the suction nozzle 12 deviates, the wafer is corrected by the wafer acquisition component 30, the wafer is corrected to the rotation angle of the wafer 6792, the wafer is corrected to the upper end of the substrate 6760, and when the wafer is placed to the position of the wafer is corrected to the lower end of the substrate 6760, the substrate is placed on the substrate support component 5428, and when the substrate is placed on the substrate support component 5428, the substrate is positioned, and the substrate is placed on the substrate support component is positioned, and the substrate support is positioned on the substrate support component 60.
The invention also provides a control terminal which can be a computer device, a server or other terminals with data processing capability. The control terminal comprises a processing unit, a storage unit and a communication module which are connected through a system bus, wherein the processing unit at least comprises a CPU (Central processing Unit), a memory, a BIOS (basic input output System) chip and an I/O (input/output) control chip, the CPU is used for processing instructions, executing operations, requiring actions, controlling time and processing data, the memory element is used for temporarily storing operation data in the CPU and data exchanged with an external memory such as a hard disk and the like, the BIOS chip is used for initializing and detecting various hardware devices in the starting process of a computer, and the I/O control chip is used for managing all input/output devices of the system. The storage unit of the control terminal comprises a nonvolatile storage medium and a storage unit. The nonvolatile storage medium stores an operating system and a CCD visual detection system. The memory provides an environment for the operation of the operating system and the CCD visual detection system in the non-volatile storage medium.
It should be noted that, the CCD vision detection system is a system that replaces eyes to complete recognition, measurement, positioning and other functions by using an industrial camera, and is widely applied to electronic connectors, production and manufacturing industries, connector flatness and positioning detection, and has the advantages of high efficiency, low cost, high precision and the like, and will not be described herein.
In this embodiment, the image capturing element 45 captures an image of the wafer R, G, B at the lower end of the suction nozzle 12, the captured image is transmitted to the control terminal, the CCD vision detection system performs image processing and calculation on the image, the rotation angle of the R, G, B wafer is determined, if the rotation angle of the R, G, B wafer is deviated, the rotation angle of the R, G, B wafer is corrected by the rotating motor 31, and at the same time, the CCD vision detection system can detect the cleanliness of the lower end of the suction nozzle 12, wafer damage, wafer omission and the like.
The working principle of the invention is as follows:
the wafer is picked up R, G, B by the suction nozzles 12, the wafer position on the wafer supply assembly 70 is precisely obtained by the image positioning assembly 80 before the wafer is picked up R, G, B by the suction nozzles 12, when the wafer position deviates, the position of the wafer on the wafer supply ring on the wafer supply assembly 70 is adjusted by the cross workbench at the lower end of the wafer supply assembly 70, the wafer pickup correction assembly 30 is started to enable the plurality of suction nozzles 12 to pick up the wafer alternately, when the suction nozzles 12 pick up R, G, B wafers, the jacking device is synchronously started to jack up the wafer by the jacking device to separate the wafer from the blue film, the suction nozzles 12 are driven to rotate by the turret 20 and pass through the upper end of the image acquisition assembly 40 and stay at the upper end of the substrate on the substrate clamping assembly 60, when the suction nozzle 12 drives the R, G, B wafer to rotate to the upper end of the image acquisition component 40, the rotation angle of the R, G, B wafer at the lower end of the suction nozzle 12 is detected through the image acquisition component 40, the wafer pickup correction component 30 is started to correct the R, G, B wafer at the lower end of the suction nozzle 12, the R, G, B wafer picked up by the suction nozzle 12 is placed on the substrate after the suction nozzle 12 rotates to the upper end of the substrate, the position of the substrate is positioned through the image positioning component 80 matched with the substrate clamping component 60 before the R, G, B wafer is placed on the substrate by the suction nozzle 12, deviation of the placing position of the R, G, B wafer is avoided, and when the deviation of the position of the substrate occurs, the cross workbench at the lower end of the substrate clamping component 60 is started to adjust the position of the substrate.
The foregoing is merely a preferred embodiment of the present invention and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present invention, which are intended to be comprehended within the scope of the present invention. Structures, devices and methods of operation not specifically described and illustrated herein, unless otherwise indicated and limited, are implemented according to conventional means in the art.
Claims (8)
1. The utility model provides a solid brilliant machine of pixel, includes lower plate (10), its characterized in that: the upper end of lower plate (10) is fixed with banquet head board (11), the upper end of banquet head board (11) is equipped with capstan head (20), just the output of capstan head (20) extends to the lower extreme of banquet head board (11), the lower extreme of capstan head (20) is fixed with multistation carousel (21), multistation carousel (21) are unidirectional circular motion under the drive of capstan head (20), the outside annular distribution of multistation carousel (21) has a plurality of vertical slip table subassemblies (22), still includes:
the wafer pickup correction assembly (30), the wafer pickup correction assembly (30) is assembled on the vertical sliding table assembly (22), a real air channel is formed in the wafer pickup correction assembly (30), and the vertical sliding table assembly (22) can drive the wafer pickup correction assembly (30) to move in the vertical direction;
the suction nozzle (12) is assembled in the wafer pickup correction assembly (30), a plurality of adsorption air passages are formed in the suction nozzle (12), and three adsorption air passages are formed in the suction nozzle (12);
the pick-up gas circuit is formed by combining an adsorption gas channel and a vacuum gas channel, and the suction nozzle (12) can sequentially pick up wafers through the pick-up gas circuit to finish the pick-up of the pixel R, G, B wafers, wherein the suction nozzle (12) is driven by the turret (20) to sequentially rotate to the upper parts of the R wafer, the G wafer and the B wafer, so that the suction nozzle (12) can sequentially suck the R wafer, the G wafer and the B wafer;
the image acquisition assembly (40) is assembled on the lower base plate (10), and the image acquisition assembly (40) can detect the rotation angle of the R, G, B wafer;
wherein the R, G, B wafer can synchronously rotate along with the suction nozzle (12) to adjust the rotation angle of the R, G, B wafer;
further comprises: the cleaning assembly (50), cleaning assembly (50) include lower base (51), vertical slip table (52), horizontal slip table (53), driving motor (54) and dust collecting box (55), lower base (51) are fixed in on lower bottom plate (10), vertical slip table (52) are fixed in one side of lower base (51), horizontal slip table (53) are fixed in the output of vertical slip table (52), driving motor (54) are fixed in the output of horizontal slip table (53), the output of driving motor (54) is equipped with a cleaning element, dust collecting box (55) is assembled in the output of horizontal slip table (53) and is located cleaning element's lower extreme, still be provided with negative pressure detection module on banquet board (11), after R, G, B wafer and base plate laminating, carry out negative pressure detection to suction nozzle (12) through negative pressure detection module.
2. The die bonder as claimed in claim 1, wherein: the wafer pickup correction assembly (30) comprises a rotating motor (31), a vacuum seat (32), an axial fixing sleeve (33) and a limit nut (34), wherein the rotating motor (31) is assembled on a vertical sliding table assembly (22), an output shaft rod (35) is arranged in the rotating motor (31), two ends of the output shaft rod (35) are all extended to the outside of the rotating motor (31), the vacuum seat (32) is fixed at the upper end of the rotating motor (31), the vacuum air passage penetrates through the output shaft rod (35) and the inside of the vacuum seat (32), the axial fixing sleeve (33) is fixed at the lower end of the outer side of the output shaft rod (35), a suction nozzle (12) is sleeved in the inside of the axial fixing sleeve (33), the upper end of the suction nozzle (12) is attached to the lower end of the output shaft rod (35), and the limit nut (34) is connected with the lower end of the axial fixing sleeve (33) in a threaded mode, and the limit nut (34) can limit the suction nozzle (12).
3. The die bonder as claimed in claim 1, wherein: the image acquisition assembly (40) comprises a base (41), a transverse adjusting plate (42), a longitudinal adjusting plate (43), a displacement sliding table assembly (44) and an image acquisition element (45), wherein the base (41) is fixed at the upper end of the lower base plate (10), the transverse adjusting plate (42) is slidably connected to the upper end of the base (41), the longitudinal adjusting plate (43) is slidably connected with the upper end of the transverse adjusting plate (42), the displacement sliding table assembly (44) is assembled on one side of the longitudinal adjusting plate (43), and the image acquisition element (45) is fixed on one side of the displacement sliding table assembly (44).
4. The die bonder as claimed in claim 1, wherein: still include base plate clamping assembly (60), a plurality of wafer supply subassembly (70) and a plurality of image location subassembly (80), base plate clamping assembly (60) and a plurality of wafer supply subassembly (70) all assemble on lower plate (10), just wafer supply subassembly (70) and image acquisition subassembly (40) one-to-one, a plurality of image location subassembly (80) all assemble on banjo head board (11), a plurality of image location subassembly (80) and a plurality of wafer supply subassembly (70) and image location subassembly (80) and base plate clamping assembly (60) between a pair of homogeneous correspondence, just all be equipped with the cross workstation between base plate clamping assembly (60) and lower plate (10) and wafer supply subassembly (70) and lower plate (10), through cross workstation can be in the position of horizontal direction regulation base plate clamping assembly (60) and wafer supply subassembly (70).
5. The die bonder of claim 1, wherein: the suction nozzle (12) can sequentially pick up the wafers through the pick-up gas path, and pick up of a group of pixels R, G, B wafers is completed.
6. The die bonder of claim 1, wherein: the suction nozzle (12) can sequentially pick up the wafers through the pick-up gas circuit, and pick up of a plurality of groups of pixels R, G, B of wafers is completed.
7. The die bonder of claim 1, wherein: the suction nozzle (12) can sequentially pick up the wafers through the pick-up gas circuit, and pick up of any plurality of wafers R, G, B is completed.
8. A control terminal adapted for use in a pixel die bonder as claimed in any one of claims 1-7, characterized by: the system comprises a processing unit, a storage unit and a communication module, wherein the processing unit, the storage unit and the communication module are connected through a system bus, an operating system and a CCD visual detection system are stored in the storage unit, and when the processing unit runs the CCD visual detection system, images can be processed and calculated.
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| CN115831843B (en) * | 2022-11-23 | 2024-06-18 | 中科长光精拓智能装备(苏州)有限公司 | Precise alignment device and method for semiconductor flip-chip technology |
| CN115763355B (en) * | 2023-01-10 | 2023-04-07 | 深圳市卓兴半导体科技有限公司 | Automatic suction nozzle replacing device for die bonder |
| CN116544132B (en) * | 2023-07-07 | 2023-12-15 | 广东芯乐光光电科技有限公司 | Mini-LED patch detection equipment and detection method |
| CN116598233B (en) * | 2023-07-10 | 2024-04-30 | 珠海市申科谱工业科技有限公司 | Chip detection sorting equipment |
| CN116913796A (en) * | 2023-07-10 | 2023-10-20 | 珠海市申科谱工业科技有限公司 | Chip revolving stage detection mechanism |
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| CN106952848A (en) * | 2017-05-09 | 2017-07-14 | 广东工业大学 | Bonder and its pickup bonding apparatus |
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| JP2005079256A (en) * | 2003-08-29 | 2005-03-24 | Hitachi High-Tech Instruments Co Ltd | Die and method for picking up die |
| CN201259886Y (en) * | 2008-06-20 | 2009-06-17 | 艾逖恩机电(深圳)有限公司 | thimble module |
| JP5961257B2 (en) * | 2012-05-15 | 2016-08-02 | 富士機械製造株式会社 | Electronic component mounting machine |
| CN203367253U (en) * | 2013-07-30 | 2013-12-25 | 万世扬工业股份有限公司 | Improved die bonder material distributing system |
| CN107170879B (en) * | 2017-05-31 | 2019-10-25 | 天下知光科技（深圳）有限公司 | A kind of large area flip LED area source piece and its bonder |
| CN110444498B (en) * | 2018-05-03 | 2022-01-04 | 苏州艾科瑞思智能装备股份有限公司 | Long-distance and accurate chip fast taking and installing device |
| CN110299312A (en) * | 2019-07-04 | 2019-10-01 | 深圳市诺泰自动化设备有限公司 | A kind of rotary type tower bonder |
| CN111916370B (en) * | 2020-05-29 | 2023-09-05 | 佛山市顺德区蚬华多媒体制品有限公司 | Die bonder and semiconductor device packaging method thereof |
| CN112802781A (en) * | 2021-02-09 | 2021-05-14 | 深圳市卓兴半导体科技有限公司 | Material transfer apparatus and wafer transfer apparatus |
| CN114038786A (en) * | 2021-11-25 | 2022-02-11 | 上海赢朔电子科技股份有限公司 | High-speed high-precision die bonder and application method thereof |
| CN114334783A (en) * | 2021-12-31 | 2022-04-12 | 深圳新益昌科技股份有限公司 | Wafer mounting device |
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