CN115216269B - Single-component organic silicon pouring sealant and preparation method thereof - Google Patents
Single-component organic silicon pouring sealant and preparation method thereof Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/221—Oxides; Hydroxides of metals of rare earth metal
- C08K2003/2213—Oxides; Hydroxides of metals of rare earth metal of cerium
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2265—Oxides; Hydroxides of metals of iron
- C08K2003/2272—Ferric oxide (Fe2O3)
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
- C08K2003/282—Binary compounds of nitrogen with aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
Abstract
The invention discloses a single-component organic silicon pouring sealant which comprises the following raw materials in parts by weight: 1 to 10 parts of hydrogen-containing silicone oil, 2 to 10 parts of heat-resistant additive, 0.1 to 5 parts of tackifier, 0.1 to 0.8 part of modified catalyst, 20 to 50 parts of heat-conducting filler and 100 parts of base material. The preparation method comprises the following steps: (1) weighing the raw materials; (2) Adding the base material into a planetary stirrer, heating, adding the heat-conducting filler, the heat-resistant additive and the tackifier under the stirring state, stirring in vacuum, uniformly mixing, and cooling; (3) Adding hydrogen-containing silicone oil and a modified catalyst, stirring, and vacuum defoaming to obtain the catalyst. According to the invention, the flexible bipyridine coordination modified platinum catalyst is used for reducing the catalytic activity of platinum at normal temperature, so that the storage stability of a product is improved; the traditional inhibitors such as alkynol and the like are not required to be added, the quick curing can be realized by heating, and no volatile matters are generated in the curing process; the packaging is single-component, does not need mixing, and is convenient to use.
Description
Technical Field
The invention relates to the technical field of pouring sealants, in particular to a single-component organic silicon pouring sealant and a preparation method thereof.
Background
The organic silicon pouring sealant is a polymer composed of a Si-O main chain and a Si-C side chain, has excellent high and low temperature resistance, electrical insulation performance, weather resistance, ozone resistance and moisture resistance due to a unique reticular structure, and is widely applied to the fields of aerospace, automobiles, electronic appliances and the like.
The silicone potting adhesive can be classified into a condensation type and an addition type according to a vulcanization mechanism. Compared with condensation type pouring sealant, the addition type organic silicon pouring sealant has no byproducts in reaction, does not release small molecular substances such as gas and the like, and can more effectively protect the sealing component. At present, most of addition type organosilicon pouring sealants on the market are two-component products, bubbles are easy to generate in the mixing process, and a proper operation time is required at room temperature after mixing. Compared with the single-component pouring sealant, the single-component pouring sealant is composed of single components, mixing stirring and vacuum defoaming are not needed, and the operation is simpler and more convenient.
The traditional addition type organic silicon pouring sealant needs to be added with a platinum catalyst so as to catalyze hydrosilylation reaction and realize crosslinking and curing at room temperature or under heating. In the prior art, a large amount of alkynol inhibitors are required to be added for solving the stability of storage at room temperature and good high-temperature curability of the single-component addition type organic silicon pouring sealant, but the alkynol inhibitors have the characteristics of low boiling point, easy volatilization, poor inhibition performance and the like, and the platinum complex and the alkynol compound coexist to change the properties, have poor storage stability and influence the final gelling effect.
For example, chinese patent CN103146203B discloses a one-component addition type silicone rubber and a preparation method thereof, in which a large amount of inhibitors, such as alkynol inhibitors, are required to be added to maintain a low-temperature storage period thereof; the alkynol inhibitor releases platinum catalytic activity through volatilization in the curing process so as to catalyze an addition reaction, but the volume shrinkage rate of the product is easily increased in the volatilization process of the alkynol inhibitor, so that the flatness of the surface of the product is affected.
Therefore, how to develop a one-component addition type organic silicon heat conduction pouring sealant without adding the traditional inhibitor is a problem to be solved by the technicians in the field.
Disclosure of Invention
In view of the above, the invention aims to provide a single-component organic silicon pouring sealant and a preparation method thereof, so as to solve the defects in the prior art.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
the single-component organic silicon pouring sealant comprises the following raw materials in parts by weight: 1 to 10 parts of hydrogen-containing silicone oil, 2 to 10 parts of heat-resistant additive, 0.1 to 5 parts of tackifier, 0.1 to 0.8 part of modified catalyst, 20 to 50 parts of heat-conducting filler and 100 parts of base material.
Further, the viscosity of the hydrogen-containing silicone oil is 30 to 2000 mPas, and the hydrogen content is 0.1 to 1.2%.
Further, the heat-resistant additive is at least one of iron oxide red, cerium oxide, cerium hydroxide and manganese oxide.
Further, the tackifier is at least one of gamma-methacryloxypropyl trimethoxysilane, allyl triethoxysilane, and gamma- (2, 3-glycidoxy) propyl trimethoxysilane.
Further, the preparation method of the modified catalyst comprises the following steps: dissolving a ligand in a methanol solution, adding a chloroplatinic acid isopropanol solution, introducing nitrogen for protection, heating at 80 ℃ for reflux reaction for 2 hours, and fractionating to remove low-boiling-point substances after the reaction is finished to obtain a modified catalyst;
the structural formula of the ligand is as follows:
wherein R is 1 Is thatn is an integer of 1 to 6, and m is an integer of 1 to 4;
the molar ratio of the ligand to the chloroplatinic acid is (1.2-2.5): 1; the mass concentration of platinum in the modified catalyst is 1000-5000 ppm.
The technical scheme has the beneficial effects that the flexible bipyridine has stronger deformability because the pyridine spacer group contains sigma unit price, and forms a ligand with a special stable space structure with platinum at normal temperature, so that the activity of the catalyst is reduced, and the storage performance of the pouring sealant at normal temperature is ensured. The space structure of the catalyst is destroyed at high temperature, platinum is released from the ligand, and the catalyst restores the activity to catalyze the addition reaction, so that the solidification is accelerated. Specifically, the curing temperature is 160-200 ℃ and the curing time is 1h.
Further, the heat conductive filler is at least one of alumina, quartz powder, aluminum nitride and boron nitride.
Further, the preparation method of the base material comprises the following steps: sequentially adding vinyl-terminated silicone oil, fumed silica and hexamethyldisilazane into a planetary stirrer, mixing and stirring for 1-2 h under the vacuum condition of 130 ℃, and cooling to room temperature to obtain a base material;
the viscosity of the vinyl-terminated silicone oil is 200-10000 mPa.s, and the vinyl content is 0.2-1.5%; the specific surface area of the fumed silica is more than or equal to 200m 2 /g；
The mass ratio of the vinyl-terminated silicone oil to the fumed silica to the hexamethyldisilazane is 100 (5-30): 3-20.
The preparation method of the single-component organic silicon pouring sealant specifically comprises the following steps:
(1) Weighing the raw materials according to the weight parts of the single-component organic silicon pouring sealant;
(2) Adding the base material into a planetary stirrer, heating, adding the heat-conducting filler, the heat-resistant additive and the tackifier under the stirring state, stirring in vacuum, uniformly mixing, and cooling to obtain a mixed material;
(3) And adding hydrogen-containing silicone oil and a modified catalyst into the mixed material, stirring, and vacuum defoaming to obtain the single-component organic silicon pouring sealant.
Further, in the step (2), heating to 120 ℃; the rotation speed of vacuum stirring is 500-800 r/min, and the time is 1-2 h; cooled to room temperature.
In the step (3), the stirring speed is 200-400 r/min, and the stirring time is 0.5-1 h.
Compared with the prior art, the invention has the following beneficial effects:
1. the invention provides a flexible bipyridine coordination modified platinum catalyst with strong platinum inhibition capability at room temperature, so that a single-component addition type organic silicon heat-conducting pouring sealant without adding a traditional inhibitor is obtained.
2. According to the invention, the flexible bipyridine coordination modified platinum catalyst is used for reducing the catalytic activity of platinum at normal temperature, so that the storage stability of the product is improved.
3. The invention can be quickly cured by heating without adding traditional inhibitors such as alkynol and the like, and no volatile is generated in the curing process.
4. The single-component organic silicon pouring sealant is packaged in a single component mode, does not need mixing, and is convenient to use.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely, and it is apparent that the described embodiments are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Example 1
The single-component organic silicon pouring sealant comprises the following raw materials in parts by weight: 3kg of hydrogen-containing silicone oil, 2kg of iron oxide red, 0.5kg of gamma-methacryloxypropyl trimethoxysilane, 0.3kg of modified catalyst, 30kg of aluminum oxide and 100kg of base material;
wherein the viscosity of the hydrogen-containing silicone oil is 500 mPas and the hydrogen content is 1.2%;
the preparation method of the modified catalyst comprises the following steps: dissolving 2.4g of ligand in 150mL of methanol solution, adding 500mL of chloroplatinic acid isopropanol solution with the mass concentration of platinum of 3000ppm, introducing nitrogen for protection, heating and refluxing at 80 ℃ for 2 hours, and after the reaction is finished, fractionally removing low-boiling substances, and diluting isopropanol to obtain a modified catalyst with the mass concentration of platinum of 3000 ppm; wherein, the structural formula of the ligand is:
the preparation method of the base material comprises the following steps: sequentially adding vinyl-terminated silicone oil, fumed silica and hexamethyldisilazane into a planetary stirrer according to the mass ratio of 100:20:15, mixing and stirring for 1-2 h under the vacuum condition of 130 ℃, and cooling to room temperature to obtain a base material; wherein, the liquid crystal display device comprises a liquid crystal display device,the viscosity of the vinyl-terminated silicone oil is 230 mPas, and the vinyl content is 0.7%; the specific surface area of the fumed silica is 230m 2 /g；
The preparation method of the single-component organic silicon pouring sealant specifically comprises the following steps:
(1) Weighing all the raw materials according to the weight of the single-component organic silicon pouring sealant;
(2) Adding the base material into a planetary stirrer, heating to 120 ℃, adding aluminum oxide, iron oxide red and gamma-methacryloxypropyl trimethoxy silane in a stirring state, stirring for 2 hours in vacuum at a rotating speed of 500r/min, uniformly mixing, and cooling to room temperature to obtain a mixed material;
(3) Adding hydrogen-containing silicone oil and a modified catalyst into the mixed material, stirring for 1h at a rotating speed of 200r/min, and vacuum defoaming to obtain the single-component organic silicon pouring sealant.
Example 2
The single-component organic silicon pouring sealant comprises the following raw materials in parts by weight: 6kg of hydrogen-containing silicone oil, 2kg of cerium hydroxide, 0.5kg of gamma- (2, 3-glycidoxy) propyl trimethoxy silane, 0.5kg of modified catalyst, 20kg of aluminum nitride and 100kg of base material;
wherein the viscosity of the hydrogen-containing silicone oil is 300 mPas and the hydrogen content is 0.7%;
the preparation method of the modified catalyst comprises the following steps: dissolving 6.2g of ligand in 300mL of methanol solution, adding 800mL of chloroplatinic acid isopropanol solution with the mass concentration of platinum of 3000ppm, introducing nitrogen for protection, heating and refluxing at 80 ℃ for 2 hours, and after the reaction is finished, fractionating to remove low-boiling substances and diluting isopropanol to obtain a modified catalyst with the mass concentration of platinum of 3000 ppm; wherein, the structural formula of the ligand is:
the preparation method of the base material comprises the following steps: sequentially adding vinyl-terminated silicone oil, fumed silica and hexamethyldisilazane into a planetary stirrer according to the mass ratio of 100:20:15, mixing and stirring for 1-2 h under the vacuum condition of 130 ℃, and cooling to room temperature to obtain a base material; wherein the viscosity of the vinyl-terminated silicone oil is 230 mPa.s, vinyl content is 0.7%; the specific surface area of the fumed silica is 230m 2 /g；
The preparation method of the single-component organic silicon pouring sealant specifically comprises the following steps:
(1) Weighing all the raw materials according to the weight of the single-component organic silicon pouring sealant;
(2) Adding the base material into a planetary stirrer, heating to 120 ℃, adding aluminum nitride, cerium hydroxide and gamma- (2, 3-glycidoxy) propyl trimethoxy silane in a stirring state, stirring for 1.5 hours in vacuum at a rotating speed of 600r/min, uniformly mixing, and cooling to room temperature to obtain a mixed material;
(3) Adding hydrogen silicone oil and a modified catalyst into the mixed material, stirring for 1h at the rotation speed of 300r/min, and vacuum defoaming at the rotation speed of stirring to obtain the single-component organic silicon pouring sealant.
Comparative example 1
The only difference from example 1 is that the modified catalyst was replaced with a commercially available Kadster catalyst having a platinum mass concentration of 3000ppm, and 0.5kg of an ethynyl cyclohexanol inhibitor was added in step (2).
Comparative example 2
The only difference from example 2 is that the modified catalyst was replaced with an unmodified chloroplatinic acid isopropyl alcohol solution having a platinum mass concentration of 3000ppm, and 0.8kg ethynyl cyclohexanol inhibitor was added in step (2).
Performance testing
The single-component organic silicon pouring sealants prepared in examples 1-2 and comparative examples 1-2 were tested for surface drying time at different temperatures according to GB/T13477.5-2002.
The single-component silicone potting adhesives prepared in examples 1 to 2 and comparative examples 1 to 2 were poured into a mold, heated at 180℃for 1 hour to cure, and measured for hardness according to GB/T531-1999 and for thermal conductivity according to ASTM D5470-2006, respectively.
The test results are shown in Table 1.
TABLE 1 Single-component organosilicon casting glue Performance test results
As can be seen from Table 1, examples 1-2 have a longer open time, demonstrating that the flexible bipyridine-modified platinum catalyst effectively reduces the catalytic activity of platinum at normal temperature. Compared with comparative examples 1-2, the single-component organic silicon pouring sealant prepared by the invention has excellent storage stability at room temperature, the storage time at room temperature is longer than 1 year, and the single-component organic silicon pouring sealant can be completely cured within 1h at 180 ℃ and meets the requirement of high-temperature vulcanization.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (9)
1. The single-component organic silicon pouring sealant is characterized by comprising the following raw materials in parts by weight: 1 to 10 parts of hydrogen-containing silicone oil, 2 to 10 parts of heat-resistant additive, 0.1 to 5 parts of tackifier, 0.1 to 0.8 part of modified catalyst, 20 to 50 parts of heat-conducting filler and 100 parts of base material;
the preparation method of the modified catalyst comprises the following steps: dissolving a ligand in a methanol solution, adding a chloroplatinic acid isopropanol solution, introducing nitrogen for protection, heating at 80 ℃ for reflux reaction for 2 hours, and fractionating to remove low-boiling-point substances after the reaction is finished to obtain the modified catalyst;
the structural formula of the ligand is as follows:
wherein R is 1 Is thatn is an integer of 1 to 6, and m is an integer of 1 to 4;
the molar ratio of the ligand to the chloroplatinic acid is (1.2-2.5): 1; the mass concentration of platinum in the modified catalyst is 1000-5000 ppm.
2. The single-component organic silicon pouring sealant according to claim 1, wherein the viscosity of the hydrogen-containing silicone oil is 30-2000 mPa.s, and the hydrogen content is 0.1% -1.2%.
3. The one-component silicone potting adhesive of claim 1, wherein the heat-resistant additive is at least one of iron oxide red, cerium oxide, cerium hydroxide, and manganese oxide.
4. The one-component silicone potting adhesive of claim 1, wherein the adhesion promoter is at least one of gamma-methacryloxypropyl trimethoxysilane, allyl triethoxysilane, and gamma- (2, 3-glycidoxy) propyl trimethoxysilane.
5. The one-component silicone potting adhesive of claim 1, wherein the thermally conductive filler is at least one of alumina, quartz powder, aluminum nitride, and boron nitride.
6. The single-component organic silicon pouring sealant according to claim 1, wherein the preparation method of the base material is as follows: sequentially adding vinyl-terminated silicone oil, fumed silica and hexamethyldisilazane into a planetary stirrer, mixing and stirring for 1-2 h under the vacuum condition of 130 ℃, and cooling to room temperature to obtain the base material;
the viscosity of the vinyl-terminated silicone oil is 200-10000 mPa.s, and the vinyl content is 0.2-1.5%; the specific surface area of the fumed silica is more than or equal to200m 2 /g；
The mass ratio of the vinyl-terminated silicone oil to the fumed silica to the hexamethyldisilazane is 100 (5-30): 3-20.
7. The preparation method of the single-component organic silicon pouring sealant is characterized by comprising the following steps of:
(1) Weighing the raw materials according to the weight parts of the single-component organic silicon pouring sealant according to any one of claims 1-6;
(2) Adding the base material into a planetary stirrer, heating, adding the heat-conducting filler, the heat-resistant additive and the tackifier under the stirring state, stirring in vacuum, uniformly mixing, and cooling to obtain a mixed material;
(3) And adding hydrogen-containing silicone oil and a modified catalyst into the mixed material, stirring, and vacuum defoaming to obtain the single-component organic silicon pouring sealant.
8. The method for preparing a one-component silicone potting adhesive according to claim 7, wherein in the step (2), the heating is performed to 120 ℃; the rotation speed of the vacuum stirring is 500-800 r/min, and the time is 1-2 h; cooled to room temperature.
9. The preparation method of the single-component organic silicon pouring sealant according to claim 7, wherein in the step (3), the stirring rotation speed is 200-400 r/min, and the stirring time is 0.5-1 h.
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