CN115206862B - Control device and control method for solving out-of-control precision in silicon wafer handover process - Google Patents
Control device and control method for solving out-of-control precision in silicon wafer handover process Download PDFInfo
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- CN115206862B CN115206862B CN202211128299.XA CN202211128299A CN115206862B CN 115206862 B CN115206862 B CN 115206862B CN 202211128299 A CN202211128299 A CN 202211128299A CN 115206862 B CN115206862 B CN 115206862B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F15/00—Suppression of vibrations in systems; Means or arrangements for avoiding or reducing out-of-balance forces, e.g. due to motion
- F16F15/02—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems
- F16F15/04—Suppression of vibrations of non-rotating, e.g. reciprocating systems; Suppression of vibrations of rotating systems by use of members not moving with the rotating systems using elastic means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The invention discloses a control device and a control method for solving out-of-control precision in a silicon wafer handover process, and the control device comprises a vacuum device, wherein a support is arranged above the vacuum device, a flexible pad is laid on the upper layer of the support, the vacuum device and the support are fixedly connected through a pipe body, at least two adsorption caps are arranged on the support, a plurality of groups of notches are formed in the support, and elastic pads are arranged in the notches; a first frame body is arranged at the lower end of the vacuum device in a sliding mode, an adjusting mechanism is arranged at the end part of the first frame body, and an upright post is inserted in the first frame body in a penetrating mode; the adjusting mechanism comprises an adjusting rod and a touch part, the adjusting rod rotates on the first frame body through a rotating shaft, the touch part is fixed on the adjusting rod, and the touch part is in friction touch with the stand column. Accessible cushion is to the process of placing of silicon chip second segmentation, and adjustment mechanism and detection device operate the silicon chip on the collocation, improve the accurate nature of handing-over.
Description
Technical Field
The invention relates to the technical field of semiconductor processing equipment, in particular to a control device and a control method for solving out-of-control precision in a silicon wafer handover process.
Background
The development of microelectronic technology has promoted the renewal of computer technology, communication technology and other electronic information technology, and has played an important leading and fundamental role in the information industry revolution, the lithography machine is an indispensable tool in the manufacturing industry of microelectronic devices, and the silicon chip transmission subsystem is an important component subsystem of the advanced packaging lithography machine. In the material conveying process, the silicon wafer handover precision, particularly the handover precision of the silicon wafer after pre-alignment centering orientation, directly influences the wafer loading precision of the whole subsystem.
Disclosure of Invention
The present invention is directed to solve the problems of the background art, and provides a control device and a control method for solving the problem of accuracy runaway in the silicon wafer handover process.
The purpose of the invention can be realized by the following technical scheme:
a control device for solving out-of-control precision in a silicon wafer handover process comprises a vacuum device, wherein a support is arranged above the vacuum device, a flexible pad is laid on the upper layer of the support, the vacuum device and the support are fixedly connected through a pipe body, at least two adsorption caps are mounted on the support, a plurality of groups of notches are formed in the support, and elastic pads are mounted in the notches;
a first frame body is arranged at the lower end of the vacuum device in a sliding mode, an adjusting mechanism is arranged at the end part of the first frame body, and an upright post is inserted into the first frame body in a penetrating mode;
the adjusting mechanism comprises an adjusting rod and a touch part, the adjusting rod rotates on the first frame body through a rotating shaft, the touch part is fixed on the adjusting rod, and the touch part is in friction touch with the stand column.
As a further scheme of the invention: the adsorption cap is communicated with the pipe body, and a plurality of vacuum adsorption holes are formed in the adsorption cap.
As a further scheme of the invention: the first frame body with install the telescoping device between the vacuum apparatus, the telescoping device can drive first frame body is in vacuum apparatus goes up the vertical slip.
As a further scheme of the invention: the top end of the upright post is fixed with the support, and an inclined opening is formed at the tail end of the upright post.
As a further scheme of the invention: a second frame body is further arranged below the vacuum device in a rotating mode, and a detection device is installed at the end portion of the second frame body.
As a further scheme of the invention: the vacuum device and a driving part are further installed between the second frame body, and the driving part drives the second frame body to rotate on the vacuum device.
As a further scheme of the invention: the elastic pad comprises a spring and a pad, and the pad is connected with the support through the spring.
A control method for solving the problem of accuracy runaway in a silicon wafer handover process comprises the following steps:
the method comprises the following steps: after the silicon wafer is conveyed to the upper part of the support by the conveying device, the silicon wafer is unloaded, the elastic pad can firstly support the silicon wafer, the pad in the elastic pad can slowly press the spring under the action of the weight of the silicon wafer, finally the silicon wafer is supported by the flexible pad, and meanwhile, the vacuum device can be started to adsorb and fix the silicon wafer through the matching of the tube body and the adsorption cap;
step two: the driving device drives the second frame body to rotate on the vacuum device, so that the detection device rotates, the distance numerical value of the edge of the silicon wafer in the detection device is measured when the detection device rotates, a plurality of numerical values are compared through the processor, and whether the position of the silicon wafer is accurate is judged.
Step three: if not accurate, at first vacuum apparatus will suspend to the absorption of silicon chip fixed, and the telescoping device promotes first support body afterwards and rises, touches a piece and can touch with the bevel connection of stand afterbody, and the adjusting lever rotates, and the adjusting lever top inwards supports through rotatory and presses, can adjust the position of the silicon chip that is in on the flexible pad, and vacuum apparatus adsorbs the silicon chip again afterwards, and detection device reinspects.
The invention has the beneficial effects that:
accessible cushion is to the process of placing of silicon chip second segmentation, and adjustment mechanism and detection device operate the silicon chip on the collocation, improve the accurate nature of handing-over.
Drawings
The invention will be further described with reference to the accompanying drawings.
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is an enlarged view at A in the present invention;
FIG. 3 is a top view of the present invention;
FIG. 4 is a side view of the present invention;
fig. 5 is a partial structural schematic diagram of the present invention.
Fig. 6 is a schematic structural view of the elastic pad of the present invention.
In the figure: 1. a vacuum device; 2. a pipe body; 3. a support; 4. an adsorption cap; 5. an elastic pad; 6. a column; 7. a first frame body; 8. an adjustment mechanism; 81. an adjusting lever; 82. a touch piece; 83. a rotating shaft; 9. a second frame body; 10. and (4) a detection device.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In a first embodiment, referring to fig. 1-6, a control device for solving the problem of out-of-control precision during the silicon wafer handover process of the present invention includes a vacuum device 1;
the vacuum device 1 is mainly a vacuum adsorption machine and is used for limiting and fixing the silicon wafer.
A support 3 is arranged above the vacuum device 1, and a flexible pad is laid on the upper layer of the support 3;
the flexible pad is used for supporting a silicon wafer;
the vacuum device 1 and the bracket 3 are fixedly connected through a pipe body 2;
wherein, the tube body 2 is made of hard material;
at least two adsorption caps 4 are arranged on the bracket 3
The adsorption cap 4 is communicated with the tube body 2, the tube body 2 is also communicated with the vacuum device 1, and the adsorption cap 4 is provided with a plurality of vacuum adsorption holes for specifically adsorbing the silicon wafer through the vacuum adsorption holes;
a plurality of groups of notches are formed in the support 3, and elastic cushions 5 are arranged in the notches;
wherein the elastic pad 5 will slowly descend in the groove after being pressed by force.
The lower end of the vacuum device 1 is provided with a first frame body 7 in a sliding manner;
a telescopic device is arranged between the first frame body 7 and the vacuum device 1, and the telescopic device can drive the first frame body 7 to vertically slide on the vacuum device 1;
wherein, the telescopic device can be an electric telescopic rod and the like;
an adjusting mechanism 8 is arranged at the end part of the first frame body 7;
the adjusting mechanism 8 mainly adjusts the position of the silicon wafer;
the first frame body 7 is inserted with an upright post 6;
the adjusting mechanism 8 comprises an adjusting rod 81 and a touch piece 82, the adjusting rod 81 rotates on the first frame body 7 through a rotating shaft 83, the touch piece 82 is fixed on the adjusting rod 81, and the touch piece 82 is in friction touch with the upright post 6.
In a second embodiment, referring to fig. 1-6, a control device for solving the problem of out-of-control precision during the silicon wafer handover process of the present invention includes a vacuum device 1;
the vacuum device 1 is mainly a vacuum adsorption machine and is used for limiting and fixing the silicon wafer.
A support 3 is arranged above the vacuum device 1, and a flexible pad is laid on the upper layer of the support 3;
the flexible pad is used for supporting the silicon wafer;
the vacuum device 1 and the bracket 3 are fixedly connected through a pipe body 2;
wherein, the tube body 2 is made of hard material;
at least two adsorption caps 4 are arranged on the bracket 3
The adsorption cap 4 is communicated with the tube body 2, the tube body 2 is also communicated with the vacuum device 1, and the adsorption cap 4 is provided with a plurality of vacuum adsorption holes for specifically adsorbing the silicon wafer through the vacuum adsorption holes;
a plurality of groups of notches are formed in the support 3, and elastic cushions 5 are arranged in the notches;
wherein, the elastic cushion 5 will slowly descend in the notch after being pressed by force;
the elastic pad 5 comprises a spring and a pad, and the pad is connected with the bracket 3 through the spring;
a first frame body 7 is arranged at the lower end of the vacuum device 1 in a sliding manner;
a telescopic device is arranged between the first frame body 7 and the vacuum device 1, and the telescopic device can drive the first frame body 7 to vertically slide on the vacuum device 1;
wherein, the telescopic device can be an electric telescopic rod and the like;
an adjusting mechanism 8 is arranged at the end part of the first frame body 7;
the adjusting mechanism 8 mainly adjusts the position of the silicon wafer;
the first frame body 7 is inserted with an upright post 6;
the top end of the upright post 6 is fixed with the bracket 3, and an inclined opening is formed at the tail end of the upright post 6;
the adjusting mechanism 8 comprises an adjusting rod 81 and a touch piece 82, the adjusting rod 81 rotates on the first frame body 7 through a rotating shaft 83, the touch piece 82 is fixed on the adjusting rod 81, and the touch piece 82 is in friction touch with the upright post 6;
wherein, the touch piece 82 is also formed with a bevel, and the bevel of the upright post 6 is correspondingly matched with the bevel of the touch piece 82.
In a third embodiment, referring to fig. 1-6, a control device for solving the problem of out-of-control precision during the silicon wafer handover process of the present invention includes a vacuum device 1;
the vacuum device 1 is mainly a vacuum adsorption machine and is used for limiting and fixing the silicon wafer.
A support 3 is arranged above the vacuum device 1, and a flexible pad is laid on the upper layer of the support 3;
the flexible pad is used for supporting a silicon wafer;
the vacuum device 1 and the bracket 3 are fixedly connected through a pipe body 2;
wherein, the tube body 2 is made of hard material;
at least two adsorption caps 4 are arranged on the bracket 3
The adsorption cap 4 is communicated with the tube body 2, the tube body 2 is also communicated with the vacuum device 1, and the adsorption cap 4 is provided with a plurality of vacuum adsorption holes for specifically adsorbing the silicon wafer through the vacuum adsorption holes;
a plurality of groups of notches are formed in the support 3, and elastic cushions 5 are arranged in the notches;
wherein, the elastic cushion 5 will slowly descend in the notch after being pressed by force;
the elastic pad 5 comprises a spring and a pad, and the pad is connected with the bracket 3 through the spring;
the lower end of the vacuum device 1 is provided with a first frame body 7 in a sliding manner;
a telescopic device is arranged between the first frame body 7 and the vacuum device 1, and the telescopic device can drive the first frame body 7 to vertically slide on the vacuum device 1;
wherein, the telescopic device can be an electric telescopic rod and the like;
an adjusting mechanism 8 is arranged at the end part of the first frame body 7;
the adjusting mechanism 8 mainly adjusts the position of the silicon wafer;
the first frame body 7 is inserted with an upright post 6;
the top end of the upright post 6 is fixed with the bracket 3, and an inclined opening is formed at the tail end of the upright post 6;
the adjusting mechanism 8 comprises an adjusting rod 81 and a touch piece 82, the adjusting rod 81 rotates on the first frame body 7 through a rotating shaft 83, the touch piece 82 is fixed on the adjusting rod 81, and the touch piece 82 is in friction touch with the upright post 6;
wherein, the touch piece 82 is also formed with a bevel, and the bevel of the upright post 6 is correspondingly matched with the bevel of the touch piece 82.
A second frame body 9 is further rotated below the vacuum device 1, and a detection device 10 is mounted at the end part of the second frame body 9;
the detection device 10 is used for detecting the placement accuracy of the silicon wafer;
a driving part is further installed between the vacuum device 1 and the second frame body 9, and the driving part drives the second frame body 9 to rotate on the vacuum device 1;
wherein the driving part may be a motor.
The working principle of the invention is as follows: after conveyor carried the silicon chip to 3 tops of support, lifted its silicon chip off, and cushion 5 will take the lead to carrying out the bearing to the silicon chip, and the pad in cushion 5 will be under the weight effect of silicon chip for the slow pushing down of spring atress, final silicon chip is by the cushion bearing of flexibility, and vacuum device 1 will start to adsorb fixedly to the silicon chip through the cooperation of body 2 and absorption cap 4 simultaneously.
Drive arrangement drives second support body 9 and rotates on vacuum apparatus 1 for detection device 10 rotates, and when detection device 10 pivoted in-process, will measure the silicon chip edge and be in detection device 10's interval numerical value, compares a plurality of numerical values through the treater afterwards, judges whether accurate in silicon chip position.
If not accurate, at first vacuum apparatus 1 will suspend to adsorb fixedly to the silicon chip, and telescoping device promotes first support body 7 and rises afterwards, touches touch piece 82 and can touch with the bevel connection of 6 afterburns of stand, and adjusting lever 81 rotates, and adjusting lever 81 top inwards supports through rotatory and presses, can adjust the position of the silicon chip that is in on the cushion, and vacuum apparatus 1 adsorbs the silicon chip again afterwards, and detection device 10 rechecks.
The number of the adjusting mechanisms 8 is at least three.
While one embodiment of the present invention has been described in detail, the description is only a preferred embodiment of the present invention and should not be taken as limiting the scope of the invention. All equivalent changes and modifications made within the scope of the present invention shall fall within the scope of the present invention.
Claims (1)
1. A control method of a control device for solving the problem of out-of-control precision in a silicon wafer handover process comprises a vacuum device (1), and is characterized in that a support (3) is arranged above the vacuum device (1), a flexible pad is laid on the upper layer of the support (3), the vacuum device (1) and the support (3) are fixedly connected through a pipe body (2), at least two adsorption caps (4) are installed on the support (3), a plurality of groups of notches are formed in the support (3), and elastic pads (5) are installed in the notches;
a first frame body (7) is arranged at the lower end of the vacuum device (1) in a sliding mode, an adjusting mechanism (8) is arranged at the end part of the first frame body (7), and an upright post (6) is inserted into the first frame body (7) in a penetrating mode;
the adjusting mechanism (8) comprises an adjusting rod (81) and a touch piece (82), the adjusting rod (81) rotates on the first frame body (7) through a rotating shaft (83), the touch piece (82) is fixed on the adjusting rod (81), and the touch piece (82) is in friction touch with the upright post (6);
the adsorption cap (4) is communicated with the pipe body (2), and a plurality of vacuum adsorption holes are formed in the adsorption cap (4);
a telescopic device is arranged between the first frame body (7) and the vacuum device (1), and the telescopic device can drive the first frame body (7) to vertically slide on the vacuum device (1);
the top end of the upright post (6) is fixed with the bracket (3), and an inclined opening is formed at the tail end of the upright post (6);
a second frame body (9) is further rotated below the vacuum device (1), and a detection device (10) is mounted at the end part of the second frame body (9);
a driving part is further arranged between the vacuum device (1) and the second frame body (9), and the driving part drives the second frame body (9) to rotate on the vacuum device (1);
the elastic pad (5) comprises a spring and a pad, and the pad is connected with the bracket (3) through the spring;
the control method comprises the following steps:
the method comprises the following steps: after the silicon wafer is conveyed to the position above the support (3) by the conveying device, the silicon wafer is unloaded, the elastic pad (5) can firstly support the silicon wafer, the pad in the elastic pad (5) can slowly press the spring under the action of the weight of the silicon wafer, finally the silicon wafer is supported by the flexible pad, and meanwhile, the vacuum device (1) can be started to adsorb and fix the silicon wafer through the matching of the tube body (2) and the adsorption cap (4);
step two: the driving device drives the second frame body (9) to rotate on the vacuum device (1), so that the detection device (10) rotates, when the detection device (10) rotates, the distance value of the edge of the silicon wafer in the detection device (10) is measured, and then the plurality of values are compared through the processor to judge whether the position of the silicon wafer is accurate or not;
step three: if not accurate, at first vacuum apparatus (1) will suspend to adsorb fixedly to the silicon chip, telescoping device promotes first support body (7) and rises afterwards, touches piece (82) and can touch with the bevel connection of stand (6) afterbody, adjusting lever (81) rotate, and adjusting lever (81) top is inwards supported through rotatory and is pressed, can adjust the position of the silicon chip that is in on the flexible pad, and vacuum apparatus (1) adsorbs the silicon chip again afterwards, and detection device (10) go on reinspecting.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211128299.XA CN115206862B (en) | 2022-09-16 | 2022-09-16 | Control device and control method for solving out-of-control precision in silicon wafer handover process |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202211128299.XA CN115206862B (en) | 2022-09-16 | 2022-09-16 | Control device and control method for solving out-of-control precision in silicon wafer handover process |
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| CN115206862A CN115206862A (en) | 2022-10-18 |
| CN115206862B true CN115206862B (en) | 2023-02-03 |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002359277A (en) * | 2001-05-31 | 2002-12-13 | Daihen Corp | Notch-adjusting device for wafer |
| CN101351878A (en) * | 2006-09-05 | 2009-01-21 | 东京毅力科创株式会社 | Substrate transfer device, substrate processing apparatus and substrate transfer method |
| CN106856186A (en) * | 2015-12-08 | 2017-06-16 | 上海微电子装备有限公司 | A kind of silicon chip handing-over precision control device, silicon chip absorptive table, silicon chip transmission system and silicon chip handover method |
| KR101868907B1 (en) * | 2017-03-15 | 2018-07-20 | (주)에스에스피 | Tilt and height adjustable wafer stage device |
| CN109994404A (en) * | 2017-12-06 | 2019-07-09 | 东京毅力科创株式会社 | Teaching method |
| CN112701075A (en) * | 2021-03-24 | 2021-04-23 | 上海隐冠半导体技术有限公司 | Micro-motion platform, handover method and sports equipment |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN211017041U (en) * | 2020-06-09 | 2020-07-14 | 西安奕斯伟硅片技术有限公司 | Positioning and edge-searching device for wafer |
| CN213660373U (en) * | 2020-12-08 | 2021-07-09 | 深圳科鑫泰电子有限公司 | Pre-alignment device suitable for wafers of different sizes |
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2022
- 2022-09-16 CN CN202211128299.XA patent/CN115206862B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002359277A (en) * | 2001-05-31 | 2002-12-13 | Daihen Corp | Notch-adjusting device for wafer |
| CN101351878A (en) * | 2006-09-05 | 2009-01-21 | 东京毅力科创株式会社 | Substrate transfer device, substrate processing apparatus and substrate transfer method |
| CN106856186A (en) * | 2015-12-08 | 2017-06-16 | 上海微电子装备有限公司 | A kind of silicon chip handing-over precision control device, silicon chip absorptive table, silicon chip transmission system and silicon chip handover method |
| KR101868907B1 (en) * | 2017-03-15 | 2018-07-20 | (주)에스에스피 | Tilt and height adjustable wafer stage device |
| CN109994404A (en) * | 2017-12-06 | 2019-07-09 | 东京毅力科创株式会社 | Teaching method |
| CN112701075A (en) * | 2021-03-24 | 2021-04-23 | 上海隐冠半导体技术有限公司 | Micro-motion platform, handover method and sports equipment |
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| CN115206862A (en) | 2022-10-18 |
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