CN115188519A - Silver-coated copper-silver paste and preparation method thereof - Google Patents
Silver-coated copper-silver paste and preparation method thereof Download PDFInfo
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- CN115188519A CN115188519A CN202210779926.XA CN202210779926A CN115188519A CN 115188519 A CN115188519 A CN 115188519A CN 202210779926 A CN202210779926 A CN 202210779926A CN 115188519 A CN115188519 A CN 115188519A
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- silver
- coated copper
- powder
- epoxy resin
- silver paste
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- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 182
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 130
- 239000004332 silver Substances 0.000 title claims abstract description 130
- YCKOAAUKSGOOJH-UHFFFAOYSA-N copper silver Chemical compound [Cu].[Ag].[Ag] YCKOAAUKSGOOJH-UHFFFAOYSA-N 0.000 title claims abstract description 38
- 238000002360 preparation method Methods 0.000 title abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 49
- 239000003822 epoxy resin Substances 0.000 claims abstract description 32
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 32
- 239000000843 powder Substances 0.000 claims abstract description 16
- 239000004593 Epoxy Substances 0.000 claims abstract description 15
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 15
- 239000003960 organic solvent Substances 0.000 claims abstract description 15
- 238000003756 stirring Methods 0.000 claims abstract description 13
- 238000005303 weighing Methods 0.000 claims abstract description 7
- MTHSVFCYNBDYFN-UHFFFAOYSA-N anhydrous diethylene glycol Natural products OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims description 24
- 239000002245 particle Substances 0.000 claims description 14
- 239000002002 slurry Substances 0.000 claims description 12
- 239000004844 aliphatic epoxy resin Substances 0.000 claims description 9
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 claims description 8
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 5
- 238000007747 plating Methods 0.000 claims description 4
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 claims description 3
- DCQBZYNUSLHVJC-UHFFFAOYSA-N 3-triethoxysilylpropane-1-thiol Chemical compound CCO[Si](OCC)(OCC)CCCS DCQBZYNUSLHVJC-UHFFFAOYSA-N 0.000 claims description 3
- 239000012530 fluid Substances 0.000 claims description 3
- 238000000227 grinding Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 14
- 238000007650 screen-printing Methods 0.000 abstract description 10
- RRKGBEPNZRCDAP-UHFFFAOYSA-N [C].[Ag] Chemical compound [C].[Ag] RRKGBEPNZRCDAP-UHFFFAOYSA-N 0.000 abstract 1
- 239000011268 mixed slurry Substances 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 16
- 229910021419 crystalline silicon Inorganic materials 0.000 description 10
- 239000007788 liquid Substances 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- 239000010409 thin film Substances 0.000 description 6
- 238000005245 sintering Methods 0.000 description 5
- 239000000126 substance Substances 0.000 description 4
- 229910021417 amorphous silicon Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
Abstract
The application relates to the technical field of battery piece screen printing silver paste, in particular to silver-coated copper silver paste and a preparation method thereof, wherein the silver-coated copper silver paste comprises the following components in parts by weight: 22 to 25 portions of micron silver powder, 40 to 50 portions of nano silver powder, 20 to 22 portions of silver-coated copper powder, 2.5 to 9 portions of epoxy resin, 0.1 to 0.5 portion of epoxy curing accelerator, 2 to 4 portions of organic solvent and 0.5 to 1 portion of silane coupling agent; the preparation method comprises the following steps: accurately weighing each component, and mixing and stirring the components in sequence to obtain the silver-carbon mixed slurry. The application of the silver-coated copper silver paste can reduce the production cost of the silver paste and can also promote the conductivity of the silver paste, so that the application range of the HJT heterojunction solar cell is expanded.
Description
Technical Field
The application relates to the technical field of battery piece screen printing silver paste, in particular to silver-coated copper silver paste and a preparation method thereof.
Background
The conventional crystalline silicon solar cell is prepared by taking a monocrystalline silicon or polycrystalline silicon wafer as a substrate, sintering at high temperature to prepare a PN junction, leading out collecting electrodes from the surface and the back of the conventional crystalline silicon solar cell, printing high-temperature sintered solar silver paste on the surface of the conventional crystalline silicon solar cell through screen printing, and sintering at high temperature of about 700 ℃ to form a conductive silver wire. The silver paste used by the conventional crystalline silicon solar cell is high-temperature sintering type silver paste, the high-temperature sintering type silver paste can have good adhesion with the surface of a silicon wafer at the temperature of over 700 ℃, but the high-temperature solar silver paste does not have good adhesion with the silicon wafer after being pre-dried at a low temperature. The HJT heterojunction solar cell is a silicon-based thin-film solar cell, n-type crystalline silicon is used as a substrate, an intrinsic amorphous silicon thin film (i-a-Si: H) and a p-type amorphous thin film (p-a-Si: H) are prepared by deposition through a Plasma Enhanced Chemical Vapor Deposition (PECVD), so that a p-n heterojunction is formed, the processing temperature of all the production processes is lower than 250 ℃, the conventional crystalline silicon solar paste can have adhesion property only by high-temperature (700 ℃) sintering, the adhesion force to a base material is weak and the conductivity is poor under the condition of being lower than 200 ℃, and the HJT heterojunction solar cell cannot be used for preparing a surface collector of the HJT heterojunction solar cell. Due to the excellent photoelectric conversion performance of the HJT heterojunction solar cell, the research on the screen printing silver paste for the HJT heterojunction solar cell is more and more.
The silver paste for screen printing of the conventional HJT heterojunction solar cell has high silver content, so that the cost of the manufactured solar silicon wafer cell is high, and the application of the HJT heterojunction solar cell is restricted in many aspects due to the high production cost of the solar silicon wafer cell.
Disclosure of Invention
In order to reduce the production cost of the HJT heterojunction solar cell, the application provides the silver-coated copper-silver paste and the preparation method thereof.
The application provides a silver-coated copper-silver paste and a preparation method thereof, which adopt the following technical scheme:
in a first aspect, the application provides a silver-coated copper-silver paste, which comprises the following components in parts by weight: 22 to 25 portions of micron silver powder, 40 to 50 portions of nano silver powder, 20 to 22 portions of silver-coated copper powder, 2.5 to 9 portions of epoxy resin, 0.1 to 0.5 portion of epoxy curing accelerator, 2 to 4 portions of organic solvent and 0.5 to 1 portion of silane coupling agent.
Preferably, the particle size of the micron silver powder is 1.5-2 microns.
Preferably, the particle size of the nano silver powder is 5-20 nm.
Preferably, the silver-coated copper powder is prepared by silver plating on the surface of copper powder.
Preferably, the particle size of the silver-coated copper powder is 1 to 3 μm.
Preferably, the epoxy resin includes an aliphatic epoxy resin and a bisphenol a type epoxy resin.
Preferably, the weight portion of the aliphatic epoxy resin is 2 to 4 portions, and the weight portion of the bisphenol A type epoxy resin is 0.5 to 5 portions.
Preferably, the organic solvent is one or a mixture of two of diethylene glycol and diethylene glycol butyl ether acetate.
Preferably, the silane coupling agent comprises one or a mixture of two of aminoethylaminopropyltrimethoxysilane and gamma-mercaptopropyltriethoxysilane.
In a second aspect of the present invention, the present application provides a method for preparing a silver-coated copper silver paste, including the following steps:
s1, weighing epoxy resin and an organic solvent according to corresponding parts by weight, adding part of the epoxy resin, stirring, and stirring until the epoxy resin is in a transparent fluid state to obtain a carrier;
s2, weighing nano silver powder, micron silver powder, silver-coated copper powder, an epoxy curing accelerator and a silane coupling agent, adding the nano silver powder, the micron silver powder, the silver-coated copper powder, the epoxy curing accelerator and the silane coupling agent into the carrier obtained in the step S1, and continuously stirring and dispersing to obtain uniform slurry;
and S3, grinding the slurry obtained in the step S2, and adding the residual organic solvent into the slurry under the stirring condition to adjust the viscosity of the slurry to be in the range of 15000-30000CPS so as to obtain the silver-coated copper silver paste.
The application has the following beneficial technical effects:
the silver paste is mixed with the micron silver powder with the larger particle size and the nanometer silver powder with the smaller particle size, the contact area between adjacent silver particles is larger due to the micron silver powder, the transmission of electric signals is facilitated, the resistance is smaller after the film is formed, and the conductive performance is excellent; the silver-coated copper powder is formed by silver plating on the surface of copper powder, the silver layer on the surface of the silver-coated copper powder can prevent the copper powder from being oxidized, the conductivity can be improved, the chemical property is more stable, the silver-coated copper powder is not easy to react with other substances, and the conductivity of the silver-coated copper powder can be fully exerted; the epoxy resin can enable the components to be better connected, so that a silver paste system is more stable, and meanwhile, the silver paste and the solar crystalline silicon cell can be more tightly connected by utilizing the adhesion property of the epoxy resin; the epoxy curing accelerator can quickly cure the epoxy resin, can improve the drying time of the silver paste, and improves the efficiency of silver paste screen printing; the organic solvent can enable the micron silver powder, the nanometer silver powder and the silver-coated copper powder to be dispersed in the epoxy resin more uniformly, so that the conductivity of the silver paste is improved; the silane coupling agent can enable micron silver powder, nanometer silver powder and silver-coated copper powder which are inorganic materials to be tightly combined with epoxy resin which is organic materials, and the possibility that the silver powder and the epoxy resin in the silver paste are separated is avoided; the application of the silver-coated copper silver paste can reduce the production cost of the silver paste and can also promote the conductivity of the silver paste, so that the application range of the HJT heterojunction solar cell is expanded.
Detailed Description
The existing silver paste for screen printing of the HJT heterojunction solar cell is good in conductivity, a large amount of silver powder is required to be added generally, but the price of the silver powder is high, the manufacturing cost of the HJT heterojunction solar cell can be increased in actual production, and therefore the popularization and application of the HJT heterojunction solar cell are limited. The inventor finds that the silver-coated copper powder is added into the silver paste in the research, so that the production cost of the silver paste can be reduced, and the conductivity of the silver paste can be improved.
The present application is further illustrated below with reference to examples.
The grain diameter of the micron silver powder is 1.5-2 mu m; the grain diameter of the nano silver powder is 5-20 nm. Because this application has mixed the great micron silver powder of particle diameter and the less nanometer silver powder of particle diameter in the silver-coated copper silver thick liquid, the micron makes area of contact between the adjacent silver particle bigger, is favorable to the transmission of signal of telecommunication, and the resistance is less after the film-forming, has excellent electric conductive property
The silver-coated copper powder is prepared by silver plating on the surface of copper powder, and the particle size of the silver-coated copper powder is 1-3 mu m. The silver-coated copper powder has the advantages that the silver layer on the surface of the silver-coated copper powder can prevent the copper powder from being oxidized, the conductivity can be improved, the chemical property is more stable, the silver-coated copper powder is not easy to react with other substances, and the conductivity of the silver-coated copper powder can be fully exerted.
The epoxy resin in the application comprises aliphatic epoxy resin and bisphenol A epoxy resin, wherein the alicyclic epoxy resin is DAICEL 2021P which is purchased from New materials of Nantong Xinnaxi Co; the bisphenol A epoxy resin is EPICLON 840, which is available from Sichuan Tingmei New materials science and technology Co. The combination of alicyclic epoxy resin and bisphenol A epoxy resin can make and connect between each component better, makes the silver thick liquid system more stable, still can utilize its adhesion to make simultaneously to be connected between silver thick liquid and the solar energy crystalline silicon battery more inseparabler.
The epoxy curing accelerator in the application is Ancamine 1110, shanghai Kaiyin chemical Co., ltd. The epoxy curing accelerator can quickly cure epoxy resin, can prolong the drying time of the silver paste, and improves the efficiency of silver paste screen printing.
The organic solvent in the application is one or a mixture of two of diethylene glycol and diethylene glycol butyl ether acetate. Specifically, the organic solvent in the present application is diethylene glycol. The organic solvent can enable the micron silver powder, the nanometer silver powder and the silver-coated copper powder to be dispersed in the epoxy resin more uniformly, and the conductivity of the silver paste is improved.
The silane coupling agent herein includes one or a mixture of aminoethylaminopropyltrimethoxysilane or gamma-mercaptopropyltriethoxysilane. Specifically, the silane coupling agent in the present application is aminoethylaminopropyltrimethoxysilane. The silane coupling agent can enable micron silver powder, nanometer silver powder, silver-coated copper powder of inorganic materials and epoxy resin of organic materials to be tightly combined, and the possibility of separation of the silver powder and the epoxy resin in silver paste is prevented
Example 1
The silver-coated copper silver paste comprises the following components in parts by weight: 22 to 25 portions of micron silver powder, 40 to 50 portions of nano silver powder, 20 to 22 portions of silver-coated copper powder, 2 to 4 portions of aliphatic epoxy resin, 0.5 to 5 portions of bisphenol A type epoxy resin, 0.1 to 0.5 portion of epoxy curing accelerator, 2 to 4 portions of diethylene glycol and 0.5 to 1 portion of aminoethyl aminopropyl trimethoxysilane.
The silver-coated copper silver paste comprises the following components in parts by weight: 22 parts of micron silver powder, 40 parts of nano silver powder, 20 parts of silver-coated copper powder, 2 parts of aliphatic epoxy resin, 0.1 part of bisphenol A epoxy resin, 2 parts of diethylene glycol and 0.5 part of aminoethyl aminopropyl trimethoxysilane.
Taking example 1 as an example, the preparation method of the silver-coated copper silver paste comprises the following steps:
s1, weighing epoxy resin and an organic solvent according to corresponding parts by weight, adding part of the epoxy resin, stirring, and stirring until the epoxy resin is in a transparent fluid state to obtain a carrier;
s2, weighing nano silver powder, micron silver powder, silver-coated copper powder, an epoxy curing accelerator and a silane coupling agent, adding the nano silver powder, the micron silver powder, the silver-coated copper powder, the epoxy curing accelerator and the silane coupling agent into the carrier obtained in the step S1, and continuously stirring and dispersing to obtain uniform slurry;
and S3, grinding the slurry obtained in the step S2, and adding the residual organic solvent into the slurry under the stirring condition to adjust the viscosity of the slurry to be in the range of 15000-30000CPS so as to obtain the silver-coated copper silver paste.
Example 2
The silver-coated copper silver paste comprises the following components in parts by weight: 24 parts of micron silver powder, 45 parts of nano silver powder, 21 parts of silver-coated copper powder, 3 parts of aliphatic epoxy resin, 3 parts of bisphenol A epoxy resin, 0.3 part of epoxy curing accelerator, 3 parts of diethylene glycol and 0.8 part of aminoethyl aminopropyl trimethoxysilane. The method of making the silver-coated copper paste of example 2 was the same as example 1.
Example 3
The silver-coated copper silver paste comprises the following components in parts by weight: 25 parts of micron silver powder, 50 parts of nano silver powder, 22 parts of silver-coated copper powder, 4 parts of aliphatic epoxy resin, 5 parts of bisphenol A type epoxy resin, 0.5 part of epoxy curing accelerator, 4 parts of diethylene glycol and 1 part of aminoethyl aminopropyl trimethoxysilane. The method of making the silver-coated copper silver paste of example 3 is the same as example 1.
Comparative example 1
Comparative example 1 is compared to example 2 with the exception that no silver-coated copper powder was added in comparative example 1.
Comparative example 2
Comparative example 2 is compared with example 1 except that the silver-coated copper powder of example 2 was replaced with an equal amount of ultra-fine copper powder having a particle size of 50nm to 100nm.
Performance detection
The silver-coated copper-silver paste of examples 1 to 3 was applied to the HJT heterojunction solar cell by screen printing to obtain a flexible thin film, and the physical properties of the flexible thin film were measured, and the results are shown in table 1.
TABLE 1 results of testing the properties of examples 1-3
Combining examples 1-3 and table 1, it can be seen that the resistivity, tensile force, hardness and weather resistance of the silver-coated copper mixed silver pastes of examples 1-3 have little difference, and the silver paste yield has slight difference. It can be seen that the overall performance of the silver-coated copper silver paste in examples 1-3 of the present application is close to that of the silver-coated copper silver paste, and the silver-coated copper silver paste has good physical properties.
The physical properties of the flexible thin film prepared by coating the silver-coated copper-silver paste in comparative examples 1-2 on the HJT heterojunction solar cell through a screen printing process were tested, and the test results are shown in table 2.
TABLE 2 results of the Performance test of example 2 and comparative examples 1 to 2
By combining the example 2 and the comparative examples 1-2 and combining the table 2, it can be seen that the viscosity of the silver-coated copper silver paste in the example 2 is much lower than that of the comparative examples 1 and 2, which indicates that the addition of the silver-coated copper powder can reduce the overall viscosity of the silver paste, so that the silver paste has better leveling property when printed on the surface of the crystalline silicon solar cell and is easier to process. The resistivity of the embodiment 2 is far lower than that of the comparative example 1 and the comparative example 2, and therefore the addition of the silver-coated copper powder can effectively improve the conductivity of silver paste and reduce the using amount of silver powder, so that the production cost of the crystalline silicon cell is reduced, and the application range of the HJT heterojunction solar cell is expanded. The hardness of the dried silver paste printed in the example 2 is higher than that of the comparative example 1 and the comparative example 2, which shows that the hardness of the dried silver paste can be improved by the silver-coated copper powder. The weather resistance resistivity of example 2 is smaller than that of comparative examples 1 and 2, which shows that the silver paste added with the silver-coated copper powder has good oxidation resistance and can keep good conductivity for a long time. The silver paste yield of comparative example 2 is higher than that of example 2, and the silver paste yield of example 2 is higher than that of comparative example 1. This shows that the mode that adopts silver-coated copper powder or superfine copper powder to replace silver powder can increase the number of pieces of per kilogram silver thick liquid printing silicon chip, promotes the utilization ratio of silver thick liquid to can promote the production volume, reduce the manufacturing cost of per piece of silicon chip on average.
The application of this silver-clad copper silver thick liquid can reduce the manufacturing cost of silver thick liquid, can also promote the electric conductive property of silver thick liquid simultaneously to enlarge HJT heterojunction solar cell's range of application.
The present embodiment is only for explaining the present application, and it is not limited to the present application, and those skilled in the art can make modifications of the present embodiment without inventive contribution as needed after reading the present specification, but all of them are protected by patent law within the scope of the claims of the present application.
Claims (10)
1. The silver-coated copper-silver paste is characterized by comprising the following components in parts by weight: 22 to 25 portions of micron silver powder, 40 to 50 portions of nano silver powder, 20 to 22 portions of silver-coated copper powder, 2.5 to 9 portions of epoxy resin, 0.1 to 0.5 portion of epoxy curing accelerator, 2 to 4 portions of organic solvent and 0.5 to 1 portion of silane coupling agent.
2. The silver-coated copper silver paste according to claim 1, wherein the particle size of the micron silver powder is 1.5 to 2 μm.
3. The silver-coated copper silver paste according to claim 1 or 2, wherein the nano silver powder has a particle size of 5 to 20nm.
4. The silver-coated copper-silver paste according to claim 1 or 2, wherein the silver-coated copper powder is made by surface plating of silver on a copper powder.
5. The silver-coated copper-silver paste according to claim 1 or 2, wherein the particle size of the silver-coated copper powder is 1 to 3 μm.
6. The silver-clad copper-silver paste according to claim 1, wherein the epoxy resin comprises an aliphatic epoxy resin and a bisphenol a type epoxy resin.
7. The silver-coated copper-silver paste according to claim 6, wherein the aliphatic epoxy resin is 2 to 4 parts by weight, and the bisphenol A epoxy resin is 0.5 to 5 parts by weight.
8. The silver-coated copper-silver paste according to claim 1, wherein the organic solvent is one or a mixture of diethylene glycol and diethylene glycol butyl ether acetate.
9. The silver-coated copper-silver paste according to claim 1, wherein the silane coupling agent comprises one or a mixture of aminoethylaminopropyltrimethoxysilane or gamma-mercaptopropyltriethoxysilane.
10. The method for preparing the silver-coated copper silver paste according to any one of claims 1 to 9, wherein the method comprises the following steps:
s1, weighing epoxy resin and an organic solvent according to corresponding parts by weight, adding part of the epoxy resin, stirring, and stirring until the epoxy resin is in a transparent fluid state to obtain a carrier;
s2, weighing nano silver powder, micron silver powder, silver-coated copper powder, an epoxy curing accelerator and a silane coupling agent, adding the nano silver powder, the micron silver powder, the silver-coated copper powder, the epoxy curing accelerator and the silane coupling agent into the carrier obtained in the step S1, and continuously stirring and dispersing to obtain uniform slurry;
and S3, grinding the slurry obtained in the step S2, and adding the residual organic solvent into the slurry under the stirring condition to adjust the viscosity of the slurry to be in the range of 15000-30000CPS so as to obtain the silver-coated copper silver paste.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210779926.XA CN115188519A (en) | 2022-07-04 | 2022-07-04 | Silver-coated copper-silver paste and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210779926.XA CN115188519A (en) | 2022-07-04 | 2022-07-04 | Silver-coated copper-silver paste and preparation method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115805310A (en) * | 2023-01-17 | 2023-03-17 | 苏州星翰新材料科技有限公司 | Silver-coated copper powder, preparation method, application in silver-coated copper slurry and method for detecting compactness of silver-coated layer in silver-coated copper powder |
| CN116206799A (en) * | 2023-01-12 | 2023-06-02 | 四川东树新材料有限公司 | Silane coupling agent modified silver coated copper powder heterojunction battery silver paste and preparation method thereof |
-
2022
- 2022-07-04 CN CN202210779926.XA patent/CN115188519A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116206799A (en) * | 2023-01-12 | 2023-06-02 | 四川东树新材料有限公司 | Silane coupling agent modified silver coated copper powder heterojunction battery silver paste and preparation method thereof |
| CN115805310A (en) * | 2023-01-17 | 2023-03-17 | 苏州星翰新材料科技有限公司 | Silver-coated copper powder, preparation method, application in silver-coated copper slurry and method for detecting compactness of silver-coated layer in silver-coated copper powder |
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