CN115172499A - Back contact battery, manufacturing method thereof, battery assembly and photovoltaic system - Google Patents
Back contact battery, manufacturing method thereof, battery assembly and photovoltaic system Download PDFInfo
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- 239000000758 substrate Substances 0.000 claims abstract description 75
- 238000000034 method Methods 0.000 claims abstract description 16
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- 239000007788 liquid Substances 0.000 claims description 38
- 239000004642 Polyimide Substances 0.000 claims description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 14
- 229920001721 polyimide Polymers 0.000 claims description 14
- 238000007598 dipping method Methods 0.000 claims description 8
- 235000012239 silicon dioxide Nutrition 0.000 claims description 7
- 239000000377 silicon dioxide Substances 0.000 claims description 7
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- 238000000576 coating method Methods 0.000 claims description 4
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- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
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- 238000003466 welding Methods 0.000 description 4
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0508—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module the interconnection means having a particular shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/05—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
- H01L31/0504—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
- H01L31/0516—Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module specially adapted for interconnection of back-contact solar cells
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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Abstract
The application is applicable to the technical field of solar cells, and provides a back contact cell, a manufacturing method of the back contact cell, a cell module and a photovoltaic system. The manufacturing method of the back contact battery comprises the following steps: providing a battery substrate of a connector to be manufactured, wherein the battery substrate comprises two bus bars which are respectively positioned at two ends of the back surface of the battery substrate; the method comprises the steps that an insulating piece of a connector is manufactured at the end part of a bus bar, the insulating piece comprises a back side insulating part, a front side insulating part and a side insulating part, the back side insulating part, the front side insulating part and the side insulating part respectively cover a back side edge area, a front side edge area and a side face corresponding to the end part, and the bus bar comprises a back side edge area and a back side non-edge area; immersing the end portion in a conductive paste, the conductive paste adhering to the back non-edge region and a side of the insulating member facing away from the cell substrate; and solidifying the conductive paste attached to the end part to form a conductive piece of the connector, wherein the conductive piece is wound from the non-edge region of the back surface to the side of the front surface insulation part, which is far away from the battery substrate, through the back surface insulation part and the side surface insulation part.
Description
Technical Field
The application belongs to the technical field of solar cells, and particularly relates to a back contact cell, a manufacturing method of the back contact cell, a cell module and a photovoltaic system.
Background
Solar cell power generation is a sustainable clean energy source that can convert sunlight into electrical energy using the photovoltaic effect of semiconductor p-n junctions.
All electrodes of the related art back contact battery are on the back surface, and when two adjacent back contact batteries are connected, welding strips are needed for welding. However, the solder ribbon may be exposed from the gap between the adjacent two back contact cells, resulting in poor visual effect of the cell string.
Therefore, how to avoid the solder strip from being exposed from the gap between two adjacent back contact batteries becomes a technical problem to be solved urgently.
Disclosure of Invention
The application provides a back contact cell, a manufacturing method of the back contact cell, a cell assembly and a photovoltaic system, and aims to solve the problem of how to avoid solder strips from being exposed from a gap between two adjacent back contact cells.
In a first aspect, the present application provides a method for manufacturing a back contact battery, including:
providing a battery substrate of a connector to be manufactured, wherein the battery substrate comprises two bus bars respectively positioned at two ends of the back surface of the battery substrate;
making an insulator of the connector at an end of one of the bus bars, the insulator including a back side insulator, a front side insulator, and a side insulator covering a back side edge region, a front side edge region, and a side surface corresponding to the end, respectively, the bus bar including the back side edge region and a back side non-edge region;
dipping the end portion into a conductive paste adhering to the back non-edge region and a side of the insulating member facing away from the cell substrate;
and curing the conductive paste attached to the end part to form a conductive piece of the connector, wherein the conductive piece is wound from the back non-edge area to the front insulating part at the side opposite to the battery substrate through the back insulating part and the side insulating part at the side opposite to the battery substrate.
Optionally, making the insulator of the connector at an end of one of the bus bars comprises:
immersing the end portion in an insulating liquid, the insulating liquid adhering to the back side edge region, the front side edge region, and the side surface;
and solidifying the insulating liquid attached to the end part to form the insulating part.
Optionally, the insulating liquid includes at least one of a polyimide solution and a silicon dioxide coating liquid.
Optionally, in the step of immersing the end portion in the insulating liquid, a back surface of the end portion is immersed in the insulating liquid to a depth of 0.1mm to 10mm.
Optionally, in the step of forming the insulating member by curing the insulating liquid attached to the end portion, the curing temperature is 50 ℃ to 400 ℃.
Optionally, immersing the end portion in an insulating liquid, comprising:
the end portions are vertically immersed in the insulating liquid.
Optionally, immersing the end portion in a conductive paste, comprising:
and obliquely immersing the end part into the conductive paste, wherein the back surface of the end part is immersed into the conductive paste to a depth greater than the front surface of the end part.
Optionally, in the step of curing the conductive paste attached to the end to form the conductive piece of the connector, the curing temperature is 50 ℃ to 400 ℃.
In a second aspect, the back contact battery provided by the present application is manufactured by using any one of the methods for manufacturing a back contact battery.
In a third aspect, the present application provides a back contact battery comprising a battery substrate and a connector, wherein the battery substrate comprises two types of bus bars respectively located at two ends of a back surface of the battery substrate, and the connector is located at an end of one type of the bus bars and comprises an insulating member and a conductive member; the insulating piece comprises a back side insulating part, a front side insulating part and a side insulating part, and the back side edge area, the front side edge area and the side corresponding to the end parts are respectively covered by the insulating piece; the bus bar comprises a back surface edge region and a back surface non-edge region, and the conductive piece is wound from the back surface non-edge region to one side of the front surface insulation part, which faces away from the battery substrate, through the back surface insulation part and one side of the side surface insulation part, which faces away from the battery substrate.
Optionally, the insulator comprises a polyimide insulator or a silicon dioxide insulator.
Optionally, the width of the back edge region is 0.1mm-10mm.
Optionally, the back side insulating portion and the front side insulating portion have the same width.
In a fourth aspect, the present application provides a battery assembly comprising the back contact cell of any of the above.
In a fifth aspect, the present application provides a photovoltaic system including the above-described cell assembly.
According to the back contact battery, the manufacturing method of the back contact battery, the battery assembly and the photovoltaic system, the insulating part and the conductive part are manufactured at the end part corresponding to one bus bar of the battery substrate, so that the conductive part is electrically connected with the non-edge region of the back surface of the bus bar and is wound to the front surface of the battery substrate through the side, away from the battery substrate, of the insulating part, and therefore the back contact battery is connected with another back contact battery in a laminated manner. Therefore, no welding strip is needed, and no welding strip is exposed in the gap between two adjacent back contact batteries, so that the battery is more attractive.
Drawings
Fig. 1 is a schematic flow chart illustrating a method for manufacturing a back contact battery according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of a back contact battery according to an embodiment of the present application;
fig. 3 is a schematic view of a portion of a back contact battery according to an embodiment of the present application;
fig. 4 is a schematic flow chart illustrating a method for manufacturing a back contact battery according to an embodiment of the present disclosure;
description of the main element symbols:
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more clearly understood, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
All electrodes of the related art back contact cells are on the back surface, and the solder ribbons are exposed from the gap between two adjacent back contact cells. In this application, the conductive member is electrically connected to the back non-edge region of the bus bar and wraps around to the front side of the battery substrate through the side of the insulator facing away from the battery substrate, thereby facilitating a shingled connection with another back contact battery. Therefore, solder strips are not needed, and gaps between two adjacent back contact batteries are not exposed, so that the battery is more attractive.
Example one
Referring to fig. 1, fig. 2 and fig. 3, a method for manufacturing a back contact battery 100 according to an embodiment of the present disclosure includes:
step S11: providing a battery substrate on which the connector 20 is to be fabricated, the battery substrate including two types of bus bars respectively located at both ends of a back surface of the battery substrate;
step S12: making an insulator 21 of a connector 20 at an end 10 of a bus bar, the insulator 21 including a back side insulator 211, a front side insulator 213, and a side insulator 212 covering a back side edge region 121, a front side edge region 14, and a side 13 of the end 10, respectively, the bus bar including the back side edge region 121 and a back side non-edge region 122;
step S13: dipping the end portion 10 into a conductive paste which adheres to the back non-edge region 122 and to the side of the insulator 21 facing away from the cell substrate;
step S14: the conductive paste adhering to the end 10 is cured to form the conductive element 22 of the connector 20, the conductive element 22 passing from the back non-edge region 122, through the back side insulating portion 211 and the side insulating portion 212 on the side facing away from the cell substrate, and around to the front side insulating portion 213 on the side facing away from the cell substrate.
In the method for manufacturing the back contact battery 100 according to the embodiment of the present application, the insulating member 21 and the conductive member 22 are manufactured at the end portion 10 corresponding to one of the bus bars of the battery substrate, so that the conductive member 22 is electrically connected to the non-edge region 122 on the back surface of the bus bar and is wound to the front surface of the battery substrate through the side of the insulating member 21 away from the battery substrate, thereby facilitating the imbricated connection with another back contact battery 100. Therefore, solder strips are not needed, and no solder strip is exposed in the gap between two adjacent back contact batteries 100, so that the battery is more attractive.
Specifically, in the case of the shingled connection of two adjacent back contact cells 100, the width of the overlapping portion is 0.1mm to 0.9mm. For example, 0.1mm, 0.2mm, 0.5mm, 0.8mm, 0.9mm. Thus, the width of the overlapping portion of the back contact cell 100 is in a proper range, so that unstable connection caused by too small width can be avoided, and too much sunlight can be prevented from being blocked caused by too large width.
Specifically, in step S11, the battery substrate is a back contact battery piece on which a circuit is fabricated. It is understood that the silicon substrate may be subjected to texturing, diffusion, etching, annealing, passivation, laser film opening, circuit fabrication, and the like to form a cell substrate. Specifically, the silicon substrate may be an N-type silicon wafer or a P-type silicon wafer. The size of the silicon substrate is 182mm or 210mm. The thickness of the silicon substrate is 100 μm-200 μm.
Specifically, the back side of the battery substrate includes positive and negative electrode main grids that are interleaved with each other. Furthermore, the width of the positive electrode main grid is 0.1-2000 μm. The width of the negative electrode main grid is 0.1-2000 μm. Further, the positive electrode main grid can be a silver main grid or an aluminum main grid, and the negative electrode main grid can be a silver main grid or an aluminum main grid. The positive main grid and the negative main grid can be prepared by screen printing, vacuum evaporation and magnetron sputtering.
Specifically, the back surface of the battery substrate further includes a positive electrode bus bar 11 and a negative electrode bus bar 12, the positive electrode bus bar 11 being connected to each positive electrode main grid at one end of the battery substrate, the negative electrode bus bar 12 being connected to each negative electrode main grid at the other end of the battery substrate. The extending directions of the two bus bars are perpendicular to the two main grids.
Specifically, in step S12, "the insulator 21 of the connector 20 is formed at the end 10 of one type of bus bar", the insulator 21 may be formed at the end 10 of the positive electrode bus bar 11, or the insulator 21 may be formed at the end 10 of the negative electrode bus bar 12. The present embodiment is explained and illustrated by taking the example of making the insulating member 21 at the end portion 10 of the negative electrode bus bar 12, but this does not represent a limitation to the above.
Specifically, in step S12, the insulator 21 includes, but is not limited to, a polyimide insulator, a PVC insulator, a PET insulator, a silicon dioxide insulator, and the like. The insulating member 21 may be prepared by hot dipping, evaporation, or the like.
Specifically, in the present embodiment, the insulating member 21 has a U shape.
Specifically, in step S13, the conductive paste is a silver paste. Therefore, the conductive effect of the conductive paste is better. Further, the conductive paste is low-temperature silver paste. It is understood that in other embodiments, the conductive paste may be a high temperature silver paste, an aluminum paste, a silver-aluminum paste, or the like.
Specifically, in step S13, the conductive paste is attached to the entire back surface non-edge region 122. In this way, the entire surface of the conductive device 22 formed by curing covers the back non-edge region 122, so that the conductive device 22 and the bus bar have good electrical contact effect. It is understood that in other embodiments, the conductive paste may be attached to a portion of the back non-edge region 122.
Specifically, in step S13, the conductive paste is attached to the entire surface of the rear surface insulating portion 211 on the side away from the battery substrate. Thus, the whole surface of the solidified conductive member 22 covers the side of the back surface insulation part 211 departing from the battery substrate, so that the area of the conductive member 22 is larger, and the conductive effect is better. It is understood that in other embodiments, the conductive paste may be attached to a portion of the side of the backside insulation 211 facing away from the cell substrate.
Specifically, in step S13, the conductive paste is attached to the entire surface of the side surface insulating portion 212 facing away from the battery substrate. Thus, the whole surface of the conductive component 22 formed by curing covers the side surface of the side surface insulation part 212 which is far away from the battery substrate, so that the area of the conductive component 22 is larger, and the conductive effect is better. It is understood that in other embodiments, the conductive paste may be attached to a portion of the side insulator 212 on the side facing away from the cell substrate.
Specifically, in step S13, the side of the front side insulating part 213 facing away from the cell substrate includes a first region and a second region, and the first region is located between the second region and the side insulating part 212. The conductive paste adheres to the first region. Therefore, the conductive member 22 formed by solidification is covered on the first area, the second area is ensured not to be covered by the conductive member 22, insulation is kept, and short circuit is avoided. It is understood that in other embodiments, the conductive paste may be attached to the entire surface of the front side insulating portion 213 facing away from the cell substrate; the conductive paste may also cover a partial area of the first area.
Specifically, in step S14, the conductive paste adhered to the end portion 10 may be cured using a curing oven.
Specifically, in step S14, the covering manner of the conductive member 22 on the back non-edge region 122 and the insulating member 21 corresponds to the attaching manner of the conductive paste in step S13, which can be referred to and is not described herein again for avoiding redundancy.
Specifically, in step S14, conductive member 22 continuously passes from back non-edge region 122, through back insulation 211 and side insulation 212 on the side facing away from the battery substrate, and around to front insulation 213 on the side facing away from the battery substrate. Thus, the conductive member 22 is prevented from being broken halfway to make the non-edge region electrically connected to the front surface of the battery.
For further explanation and explanation of this embodiment, reference may be made to other parts of the present document, and further explanation is omitted here to avoid redundancy.
Example two
Referring to fig. 4, in some alternative embodiments, step S12 includes:
step S121: immersing the end portion 10 in an insulating liquid, the insulating liquid adhering to the back side edge region 121, the front side edge region 14, and the side surface 13;
step S122: the insulating liquid adhering to the end portion 10 is solidified to form the insulating member 21.
In this way, the end portion 10 is immersed in the insulating liquid and then cured, and the insulating material 21 can be produced easily and efficiently.
Specifically, in step S121, the insulating liquid may be placed in the storage tank, and the end portion 10 may be immersed in the insulating liquid.
Specifically, in step S121, a protective member may be provided on the end portion 10, and the end portion 10 may be immersed in the insulating liquid at a portion below the protective member. In this way, the depth of immersion can be controlled by the position of the protection member, and the position of adhesion of the insulating liquid can be controlled, thereby controlling the height of the insulating member 21.
Specifically, in step S122, the insulating liquid adhering to the end portion 10 may be cured by a curing oven.
It is understood that in other embodiments, the insulating liquid may be applied to the back edge area 121, the front edge area 14, and the side surfaces 13. Thus, the coating range of the insulating liquid can be accurately controlled.
It is understood that in other embodiments, the insulating layer is also formed by heat dipping, spraying, evaporation, etc.
For further explanation and explanation of the embodiment, reference may be made to other parts of the text, and in order to avoid redundancy, further description is omitted here.
EXAMPLE III
In some alternative embodiments, the insulating solution includes at least one of a polyimide solution and a silicon dioxide coating solution. Therefore, the insulating property is better, and the cost is lower.
Specifically, the weight content of the polyimide in the polyimide solution is 15-20%. For example, 15%, 16%, 17%, 18%, 19%, 20%. Preferably, the weight content of the polyimide in the polyimide solution is 18%. Therefore, the content of the insulating material is in a proper range, and the insulating effect is favorably improved.
Specifically, the viscosity of the polyimide solution is 3 pas-7 pas. Examples thereof include 3 pas, 4 pas, 5 pas, 6 pas and 7 pas. In this way, the viscosity of the polyimide solution is in an appropriate range, and the polyimide solution can be prevented from easily flowing to other areas due to too low viscosity, and can be prevented from being difficult to adhere to the end portion 10 due to too high viscosity.
For further explanation and explanation of the embodiment, reference may be made to other parts of the text, and in order to avoid redundancy, further description is omitted here.
Example four
In some alternative embodiments, in step S121, the back surface of the end portion 10 is immersed in the insulating liquid to a depth of 0.1mm to 10mm. For example, 0.1mm, 0.5mm, 1mm, 5mm, 8mm, 10mm.
In this way, the depth of the end portion 10 immersed in the insulating liquid is made to be in an appropriate range, so that the coverage of the insulating member 21 is made appropriate, and the insulation of the back side edge region 121, the front side edge region 14, and the side surface 13 can be efficiently achieved.
Specifically, the width of the bus bar is 0.2mm to 60mm. For example, 0.2mm, 0.5mm, 1mm, 10mm, 30mm, 50mm, 60mm. Thus, the width of the bus bar is in a suitable range, which facilitates the fabrication of the rear surface insulating portion 211 of the insulating member 21 on the bus bar.
Specifically, the back surface of the end portion 10 is immersed in the insulating liquid to a depth smaller than the width of the bus bar. In this manner, it is ensured that the back non-edge region 122 of the bus bar is not adhered by the insulating fluid, and that the subsequent conductive member 22 can make electrical contact with the back non-edge region 122, thereby ensuring that current is conducted from the back non-edge region 122 of the bus bar through the conductive member 22 to the front of the cell, facilitating a shingled connection with another back contact cell 100.
For further explanation and explanation of this embodiment, reference may be made to other parts of the present document, and further explanation is omitted here to avoid redundancy.
EXAMPLE five
In some alternative embodiments, in step S122, the curing temperature is from 50 ℃ to 400 ℃. For example, 50 ℃, 80 ℃, 100 ℃, 150 ℃, 200 ℃, 300 ℃, 380 ℃ and 400 ℃.
Therefore, the curing temperature of the insulating liquid is in a proper range, the slow curing speed and poor effect caused by too low curing temperature can be avoided, and the energy waste or battery damage caused by too high curing temperature can also be avoided.
For further explanation and explanation of this embodiment, reference may be made to other parts of the present document, and further explanation is omitted here to avoid redundancy.
Example six
In some alternative embodiments, step S121 includes:
the end 10 is immersed vertically in the insulating liquid.
In this manner, the vertical immersion may simply and efficiently make the depths of the back and front side immersion the same, so that the widths of the back side edge region 121 and the front side edge region 14 are the same, thereby making the widths of the back side insulating part 211 and the front side insulating part 213 the same.
It is understood that in other embodiments, the end portion 10 may be obliquely immersed in the insulating liquid, and the back surface of the end portion 10 is immersed in the insulating liquid to a depth greater than that of the front surface of the end portion 10, that is, the width of the back surface insulating portion 211 is greater than that of the front surface insulating portion 213; the end portion 10 may be obliquely immersed in the insulating liquid, and the front surface of the end portion 10 may be immersed in the insulating liquid to a depth greater than the depth of the insulating liquid at the back surface of the end portion 10, that is, the width of the front surface insulating portion 213 may be greater than the width of the back surface insulating portion 211.
For further explanation and explanation of this embodiment, reference may be made to other parts of the present document, and further explanation is omitted here to avoid redundancy.
EXAMPLE seven
In some optional embodiments, step S13 includes:
the end portion 10 is obliquely immersed into the conductive paste, and the rear surface of the end portion 10 is immersed into the conductive paste to a depth greater than that of the front surface of the end portion 10.
In this manner, by dipping the end portion 10 obliquely into the conductive paste, the depth of dipping the back surface of the end portion 10 into the conductive paste can be made greater than the depth of dipping the front surface of the end portion 10 into the conductive paste simply and efficiently, thereby ensuring that the conductive paste can adhere to the back surface non-edge region 122 without contacting the cell over the front surface insulating portion 213, thereby avoiding the formation of short circuits.
Specifically, the inclination angle is 30 ° to 60 °. For example 30 °, 32 °, 40 °, 45 °, 60 °. Thus, the inclination angle is in a proper range, so that the conductive paste caused by too small inclination angle can be prevented from being unable to adhere to the front surface of the end portion 10, and the conductive paste caused by too large inclination angle can be prevented from crossing the front surface insulating portion 213 to contact the battery, thereby preventing short circuit.
For further explanation and explanation of this embodiment, reference may be made to other parts of the present document, and further explanation is omitted here to avoid redundancy.
Example eight
In some alternative embodiments, in step S14, the curing temperature is from 50 ℃ to 400 ℃. For example, 50 ℃, 80 ℃, 100 ℃, 150 ℃, 200 ℃, 300 ℃, 380 ℃ and 400 ℃.
Therefore, the curing temperature of the conductive paste is in a proper range, the low curing speed and poor effect caused by the excessively low curing temperature can be avoided, and the energy waste or battery damage caused by the excessively high curing temperature can also be avoided.
For further explanation and explanation of the embodiment, reference may be made to other parts of the text, and in order to avoid redundancy, further description is omitted here.
Example nine
The back contact battery 100 of the embodiment of the present application is manufactured by the method for manufacturing the back contact battery 100 of any one of the first to eighth embodiments.
The back contact battery 100 of the embodiment of the present application is fabricated with the insulator 21 and the conductive member 22 at the corresponding end 10 of one of the bus bars of the battery substrate, such that the conductive member 22 is electrically connected to the back non-edge region 122 of the bus bar and is wound to the front surface of the battery substrate through the side of the insulator 21 facing away from the battery substrate, thereby facilitating a imbricated connection with another back contact battery 100. Therefore, solder strips are not needed, and gaps between two adjacent back contact batteries 100 are not exposed, so that the appearance is more attractive.
For further explanation and explanation of the embodiment, reference may be made to other parts of the text, and in order to avoid redundancy, further description is omitted here.
Example ten
The back contact battery 100 of the embodiment of the present application includes a battery substrate including two kinds of bus bars respectively located at both ends of a back surface of the battery substrate, and a connector 20 located at an end portion 10 of one kind of bus bar and including an insulating member 21 and a conductive member 22; the insulator 21 includes a back side insulating part 211, a front side insulating part 213 and a side insulating part 212, respectively covering the back side edge region 121, the front side edge region 14 and the side 13 corresponding to the end 10; the bus bar comprises a rear edge region 121 and a rear non-edge region 122, and the conductor 22 runs from the rear non-edge region 122 via the rear insulation 211 and the lateral insulation 212 on the side facing away from the cell substrate to the front insulation 213 on the side facing away from the cell substrate.
The back contact battery 100 of the embodiment of the present application is fabricated with the insulating member 21 and the conductive member 22 at the end 10 corresponding to one of the bus bars of the battery substrate, such that the conductive member 22 is electrically connected to the back non-edge region 122 of the bus bar and wraps around to the front of the battery substrate through the side of the insulating member 21 facing away from the battery substrate, thereby facilitating a shingled connection with another back contact battery 100. Therefore, solder strips are not needed, and gaps between two adjacent back contact batteries 100 are not exposed, so that the appearance is more attractive.
For further explanation and explanation of this embodiment, reference may be made to other parts of the present document, and further explanation is omitted here to avoid redundancy.
EXAMPLE eleven
In some alternative embodiments, the insulator 21 comprises a polyimide insulator 21 or a silicon dioxide insulator 21.
For further explanation and explanation of this embodiment, reference may be made to other parts of the present document, and further explanation is omitted here to avoid redundancy.
Example twelve
In some alternative embodiments, the back edge region 121 has a width of 0.1mm to 10mm.
For further explanation and explanation of this embodiment, reference may be made to other parts of the present document, and further explanation is omitted here to avoid redundancy.
EXAMPLE thirteen
In some alternative embodiments, the back side insulation 211 and the front side insulation 213 have the same width.
For further explanation and explanation of the embodiment, reference may be made to other parts of the text, and in order to avoid redundancy, further description is omitted here.
Example fourteen
A battery assembly is provided that includes the back contact battery 100 of any of the above.
In the battery module of the present embodiment, the insulating member 21 and the conductive member 22 are formed at the end portion 10 corresponding to one of the bus bars of the battery substrate, so that the conductive member 22 is electrically connected to the non-edge region 122 of the back surface of the bus bar and is wound to the front surface of the battery substrate through the side of the insulating member 21 facing away from the battery substrate, thereby facilitating the imbrication connection with another back contact battery 100. Therefore, solder strips are not needed, and no solder strip is exposed in the gap between two adjacent back contact batteries 100, so that the battery is more attractive.
For further explanation and explanation of this embodiment, reference may be made to other parts of the present document, and further explanation is omitted here to avoid redundancy.
Example fifteen
The photovoltaic system comprises the battery assembly.
In the photovoltaic system of the embodiment of the present application, the insulating member 21 and the conductive member 22 are fabricated at the corresponding end portion 10 of one of the bus bars of the cell substrate, so that the conductive member 22 is electrically connected to the non-edge region 122 of the back surface of the bus bar and is wound to the front surface of the cell substrate through the side of the insulating member 21 away from the cell substrate, thereby facilitating the imbricated connection with another back contact cell 100. Therefore, solder strips are not needed, and no solder strip is exposed in the gap between two adjacent back contact batteries 100, so that the battery is more attractive.
In this embodiment, the photovoltaic system can be applied to photovoltaic power stations, such as ground power stations, roof power stations, water surface power stations, etc., and can also be applied to devices or apparatuses that generate electricity by using solar energy, such as user solar power sources, solar street lamps, solar cars, solar buildings, etc. Of course, it is understood that the application scenario of the photovoltaic system is not limited thereto, that is, the photovoltaic system can be applied in all fields requiring solar energy for power generation. Taking a photovoltaic power generation system network as an example, a photovoltaic system may include a photovoltaic array, a combiner box and an inverter, the photovoltaic array may be an array combination of a plurality of battery modules, for example, the plurality of battery modules may constitute a plurality of photovoltaic arrays, the photovoltaic array is connected to the combiner box, the combiner box may combine currents generated by the photovoltaic array, and the combined currents are converted into alternating currents required by a utility grid through the inverter and then are connected to the utility grid to realize solar power supply.
For further explanation and explanation of the embodiment, reference may be made to other parts of the text, and in order to avoid redundancy, further description is omitted here.
The present application is intended to cover various modifications, equivalent arrangements, and adaptations of the present application without departing from the spirit and scope of the present application. Furthermore, the particular features, structures, materials, or characteristics described in connection with the embodiments or examples disclosed herein may be combined in any suitable manner in any one or more of the embodiments or examples.
Claims (15)
1. A method for manufacturing a back contact battery, comprising:
providing a battery substrate of a connector to be manufactured, wherein the battery substrate comprises two bus bars respectively positioned at two ends of the back surface of the battery substrate;
fabricating an insulator of the connector at an end of one of the bus bars, the insulator including a back side insulator, a front side insulator, and a side insulator covering corresponding back side edge regions, front side edge regions, and sides of the end, respectively, the bus bar including the back side edge regions and back side non-edge regions;
dipping the end portion into a conductive paste adhering to the back non-edge region and a side of the insulating member facing away from the cell substrate;
and curing the conductive paste attached to the end part to form a conductive piece of the connector, wherein the conductive piece is wound from the back non-edge area to the front insulating part at the side opposite to the battery substrate through the back insulating part and the side insulating part at the side opposite to the battery substrate.
2. The method of claim 1, wherein fabricating the connector insulator at the end of one of the bus bars comprises:
immersing the end portion in an insulating liquid, the insulating liquid adhering to the back side edge region, the front side edge region, and the side surface;
and solidifying the insulating liquid attached to the end part to form the insulating part.
3. The method of claim 2, wherein the insulating solution comprises at least one of a polyimide solution and a silicon dioxide coating solution.
4. The method of claim 2, wherein in the step of immersing the end portion in the insulating liquid, the back surface of the end portion is immersed in the insulating liquid to a depth of 0.1mm to 10mm.
5. The method of claim 2, wherein in the step of curing the insulating liquid adhered to the end portion to form the insulating member, the curing temperature is 50 ℃ to 400 ℃.
6. The method of claim 2, wherein immersing the end portion in an insulating fluid comprises:
the end portions are vertically immersed in the insulating liquid.
7. The method of making a back contact battery according to claim 1, wherein immersing the end portion in a conductive paste comprises:
and obliquely immersing the end part into the conductive paste, wherein the back surface of the end part is immersed into the conductive paste to a greater depth than the front surface of the end part.
8. The method of claim 1, wherein the curing temperature in the step of curing the conductive paste adhered to the end to form the conductive member of the connector is 50 ℃ to 400 ℃.
9. A back contact battery, characterized in that it is manufactured by the method for manufacturing a back contact battery according to any one of claims 1 to 8.
10. A back contact battery comprising a battery substrate including two kinds of bus bars respectively located at both ends of a back surface of the battery substrate, and a connector located at an end of one kind of the bus bars and including an insulating member and a conductive member; the insulating piece comprises a back side insulating part, a front side insulating part and a side insulating part, and the back side edge area, the front side edge area and the side corresponding to the end parts are respectively covered by the insulating piece; the bus bar comprises the back surface edge region and a back surface non-edge region, and the conductive piece is wound from the back surface non-edge region to the side, facing away from the battery substrate, of the front surface insulating part through the back surface insulating part and the side surface insulating part.
11. The back contact battery of claim 1, wherein the insulator comprises a polyimide insulator or a silicon dioxide insulator.
12. The back contact battery of claim 1, wherein the back side edge region has a width of 0.1mm to 10mm.
13. The back contact cell of claim 1, wherein the back side insulating portion and the front side insulating portion have the same width.
14. A battery assembly comprising the back contact battery of claim 9 or any one of claims 10-13.
15. A photovoltaic system comprising the cell assembly of claim 14.
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