CN115157713B - Microwave blind groove shape milling method - Google Patents

Microwave blind groove shape milling method Download PDF

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Publication number
CN115157713B
CN115157713B CN202210825951.7A CN202210825951A CN115157713B CN 115157713 B CN115157713 B CN 115157713B CN 202210825951 A CN202210825951 A CN 202210825951A CN 115157713 B CN115157713 B CN 115157713B
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microwave
blind groove
milling
film
multilayer board
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CN115157713A (en
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雷雨辰
高静茹
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Xian Microelectronics Technology Institute
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Xian Microelectronics Technology Institute
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C69/00Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore
    • B29C69/001Combinations of shaping techniques not provided for in a single one of main groups B29C39/00 - B29C67/00, e.g. associations of moulding and joining techniques; Apparatus therefore a shaping technique combined with cutting, e.g. in parts or slices combined with rearranging and joining the cut parts
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23CMILLING
    • B23C3/00Milling particular work; Special milling operations; Machines therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Laminated Bodies (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)

Abstract

The invention discloses a milling method of a microwave blind groove shape, which comprises the following steps: step 1, pre-cutting the end face of a blind groove of a microwave multilayer board; step 2, placing a compaction film on the microwave multilayer board, preheating until the compaction film is softened, and vacuumizing from the side so that the softened compaction film is covered on the microwave multilayer board and in the blind groove; step 3, film pressing is carried out by using a roller, so that the compacted film fully covers the whole blind groove; step 4, mounting an upper cover plate on the microwave multilayer board; and 5, milling the microwave multilayer board. The problem that burrs of the blind groove port need to be repaired manually is solved, manual operation in the process is reduced, and the processing difficulty of products is reduced.

Description

Microwave blind groove shape milling method
Technical Field
The invention belongs to the technical field of microwave circuits, and particularly relates to a milling method for a microwave blind groove shape.
Background
The design of the blind groove of port can be adopted in microwave multiply wood generally, the blind groove of port is interconnected as the subassembly, the port of signal conversion is used extensively at microwave multiply wood, its blind groove of a large-scale array can be up to thousands or tens of thousands, in the appearance milling process, because microwave panel has "soft, stick, smooth" characteristics, and blind groove port position is in the fretwork state, the pad apron on product surface can't with blind groove position compaction when milling, see fig. 1, the phenomenon that the burr can't excision clean appears very easily in the in-process of milling cutter walking, the burr totally appears on the top of income sword face and nearby, like fig. 2. The redundant burrs need to be manually scraped one by a scraper, and the method for manually removing the burrs at the ports is low in energy and efficiency, so that the processing efficiency of products is severely restricted. At present, in order to solve the problem of port burrs, the blind groove is plugged by filling materials such as silicone rubber and the like in a manual or silk screen printing mode at the blind groove, and then milling is performed. Or when the blind groove depth is shallower, the milling can be directly performed through laser, burrs are not generated in a product obtained by laser milling, but if the blind groove depth is thicker, the laser milling efficiency is reduced in geometric multiple along with the increase of the depth, and when the blind groove thickness is more than or equal to 0.2mm, the laser milling cannot be performed.
Disclosure of Invention
The invention provides a method for milling the appearance of a microwave blind groove, which solves the problem of burrs generated in the process of milling the port of the microwave blind groove, avoids manual repair and improves the machinability of products.
In order to achieve the purpose, the microwave blind groove shape milling method provided by the invention comprises the following steps of:
step 1, pre-cutting the end face of a blind groove of a microwave multilayer board;
step 2, placing a compaction film on the microwave multilayer board, preheating until the compaction film is softened, and vacuumizing from the side so that the softened compaction film is covered on the microwave multilayer board and in the blind groove;
step 3, pressing the film by using a roller to enable the compacted film to cover the whole blind groove;
step 4, mounting an upper cover plate on the microwave multilayer board;
and 5, milling the microwave multilayer board.
In step 1, the precutting is performed by a laser.
In the step 1, the precut depth is 0.1-0.2 mm, the precut width is more than or equal to 0.4mm, and the precut length is equal to the end face of the blind groove.
Further, in step 2, the compacted film was a polyethylene film of 0.2mm thickness.
Further, in the step 2, when the vacuum is pumped, the vacuum degree is less than or equal to 600Pa, and the vacuum degree is kept for 3-5 s.
Further, in step 3, the drum is an air bag.
Further, in the step 3, the process conditions of film pressing are as follows: the temperature is 150-200 ℃, the conveying speed is 0.8-1.5 m/min, and the pressure is 100-400 psi.
Further, in step 4, when the cover plate is assembled, a plurality of pieces of acid-free paper are padded on the microwave multilayer plate.
Further, in step 4, an aluminum foil is padded under the cover plate.
In step 5, a double-edged milling cutter is used for milling, wherein the cutter diameter of the double-edged milling cutter is smaller than or equal to 2 times of the width of the precut.
Compared with the prior art, the invention has at least the following beneficial technical effects:
according to the invention, the port position of the blind groove is pre-cut, the contact position of the blind groove during hollow milling is changed, burrs at the end surface position are reduced, then the polyethylene plastic film is softened, the softened plastic film is covered on the surface of a product and in the blind groove by a vacuumizing method, and the covering quality of the plastic film is improved by performing double pressing by using a roller, so that the blind groove is supported to a certain extent during milling, and the burrs are avoided from the source. Compared with the prior art, the problem that burrs of the blind groove port need to be repaired manually is solved, manual operation in the process is reduced, and the processing difficulty of products is reduced.
The blind groove coating material is a polyethylene film, and can play a certain compaction effect on the blind groove port during milling, but compared with the material of an epoxy or phenolic cover plate, the polyethylene film material is still relatively soft, and the pressure filling effect of the cover plate on the interface cannot be completely achieved. In order to solve the problem of port burrs, the characteristics that the port burrs are concentrated on the end face of the side wall and the side wall burrs are less are utilized, a laser precutting method is adopted, the end face of a blind groove to be milled is precut to a certain depth, and the burrs of the end face are reduced. The auxiliary cushion layer is stacked on the plate surface before milling, so that the purpose of improving milling quality is achieved, and the problem of port milling burrs is thoroughly solved.
Furthermore, the polyethylene film can be easily torn off after being covered, the method can be completed through equipment and instrument operation, the efficiency of removing port burrs can be well improved, the film thickness is proper, enough supporting force is provided when the blind groove is covered and leveled, and the compacting effect is achieved.
Furthermore, the acid-free paper is covered during milling, so that the guidance and chip removal performance of the milling cutter are improved.
Furthermore, aluminum foil is lined during milling, chip removal and heat dissipation of the milling cutter are enhanced, and milling quality is improved.
Drawings
FIG. 1 is a schematic diagram of stacking during conventional milling;
FIG. 2 is a microwave multilayer board port burr;
FIG. 3 is a schematic illustration of a blind slot coating (both microwave multilayer board and press film are semi-sectioned schematic at blind slot);
FIG. 4 is a schematic illustration of a blind slot die (both microwave multilayer board and die are shown in semi-section at the blind slot);
FIG. 5 is a schematic diagram of a mill-type cladding (microwave multilayer board, acid free paper, aluminum foil and cover plate are all schematic in half-section at blind slots);
in the accompanying drawings: 1. 2 parts of microwave multilayer board, 3 parts of blind groove, 3 parts of cover plate, 4 parts of film pressing, 5 parts of roller, 6 parts of acid-free paper, 7 parts of aluminum foil, 8 parts of burr.
Detailed Description
In order to make the purpose and technical scheme of the invention clearer and easier to understand. The present invention will now be described in further detail with reference to the drawings and examples, which are given for the purpose of illustration only and are not intended to limit the invention thereto.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, unless otherwise indicated, the meaning of "a plurality" is two or more. In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
The invention is applied to replace manual work, firstly, the port position of a blind groove is precut to a certain depth by laser, the contact position of the blind groove during hollow milling is changed, burrs at the end face position are reduced, then the polyethylene plastic film is softened in a preheating mode, the softened plastic film is coated on the surface of a product and in the blind groove when the plastic film is hot by a vacuumizing method, and the plastic film coating quality is improved by using a vacuum air bag or other elastic materials for double-pressing, so that the blind groove can be supported to a certain extent during milling, and neutral paper and kraft paper are coated during milling, so that the chip removal and heat dissipation of a milling cutter are enhanced, the milling quality is improved, and the burr generation is solved at the source. Compared with the prior art, the problem that burrs of the blind groove port need to be repaired manually is solved, manual operation in the process is reduced, and the processing difficulty of products is reduced.
Referring to fig. 1, a method for milling a microwave blind groove profile includes the following steps:
step 1, laser precutting
The microwave multilayer board 1 is precut at the position needing milling, namely the blind groove end face, by using ultraviolet lasers including but not limited to picoseconds, nanoseconds, femtoseconds and the like with power of 10W-45W, wherein the precut depth (Z direction in figure 3) is 0.1 mm-0.2 mm, the precut width (Y direction in figure 3) is more than or equal to 0.4mm, and the precut length (X direction in figure 3) is equal to the blind groove end face. The purpose of the precut is to reduce burrs 8 at the ports by changing the stress position of the following milling cutter at the notch of the blind slot 2.
Too narrow a precut width does not act as a guide for the force. The excessive precutting reduces the economy. The depth of precut is related to laser efficiency, and the deeper the depth is, the lower the laser focusing property is, and the precut depth is preferably 0.2mm, and the laser power is preferably 20W.
Step 2, blind groove coating
The microwave multilayer board 1 is covered by a compaction film 4 with the thickness of 0.1-0.4 mm, such as a polyethylene film, wherein the thickness of the polyethylene film directly influences the covering effect of a blind groove, the polyethylene film with the thickness is easily supported by the notch of the blind groove when the blind groove 2 is covered, the blind groove 2 cannot be covered smoothly, the supporting force of the polyethylene film with the thickness is insufficient, the compacting effect cannot be achieved, the polyethylene film with the thickness of 0.2mm is preferably used, the polyethylene film is preheated to 150-200 ℃, preferably 180 ℃, the temperature is kept for about 2-5 s, preferably 4s, the polyethylene film is naturally softened after being heated, the polyethylene film is covered on a product of the microwave blind groove, and meanwhile, the vacuum is pumped from the side, the softened plastic film is coated on the surface of the product and in the blind groove 2 while the plastic film is still hot, the vacuum degree is less than or equal to 600Pa, the plastic film is kept for 3-5 s, preferably 4s, and the plastic film is cooled to the room temperature. As shown in fig. 3.
The compacted film 4 may be a heat-resistant film such as polyvinyl chloride film or polypropylene film at 100-200deg.C, a heat-softenable film, or an extensible film.
Step 3, blind groove film pressing
The air bags or the similar elastic buffer materials of the air bags are used as the roller 5, and the secondary film pressing is carried out under the conditions of 150-200 ℃, preferably 180 ℃, the conveying speed of 0.8-1.5 m/min, preferably 1.0m/min and the pressure of 100-400psi, preferably 200psi, and because the roller 5 has elasticity, the part of the roller 5 above the blind groove 2 can be contacted with the bottom surface of the blind groove, so that the polyethylene film can fully cover the whole blind groove 2, and the coverage quality is improved, as shown in figure 4.
Step 4, milling a cover layer
Referring to fig. 5, a microwave blind groove is used for upward loading, 3 pieces of acid-free paper 6 with the thickness of 0.1mm and 1 piece of aluminum foil 7 with the thickness of 0.2mm are padded above the surface of a microwave multilayer board 1, and then a universal epoxy or phenolic cover board 3 is covered; the acid-free paper 6 is used for lining the guiding performance and the chip removing performance of the milling cutter, and the aluminum foil 7 is used for lining the heat dissipation performance and the chip removing performance of the milling cutter and improving the quality of the milling process.
Step 5, milling
Milling is carried out by using a double-edge milling cutter with the diameter of 0.6mm to 1.5 mm.
The cutter diameter is selected and recommended to be less than or equal to 2 times of the width of the precut, preferably a 0.8mm double-edge milling cutter, and the milling parameters are as follows: the blind groove part does not generate redundant burrs.
Knife diameter/mm Rotational speed/krpm Falling speed/(mm/sec) Feed (mm/sec)
0.7mm or less 46.0 7.0 1.0
0.8~0.9mm 43.0 6.0 3.0
1.0~1.5mm 40.0 5.0 5.0
The above is only for illustrating the technical idea of the present invention, and the protection scope of the present invention is not limited by this, and any modification made on the basis of the technical scheme according to the technical idea of the present invention falls within the protection scope of the claims of the present invention.

Claims (9)

1. The milling method for the profile of the microwave blind groove is characterized by comprising the following steps of:
step 1, pre-cutting the end face of a blind groove (2) of a microwave multilayer board (1);
step 2, placing a compaction film (4) on the microwave multilayer board (1), preheating until the compaction film (4) is softened, and vacuumizing from the side so that the softened compaction film (4) is covered on the microwave multilayer board (1) and in the blind groove (2);
step 3, film pressing is carried out by using a roller (5), so that the compacted film (4) covers the whole blind groove (2);
step 4, mounting an upper cover plate (3) on the microwave multilayer board (1);
step 5, milling the microwave multilayer board (1);
in the step 1, the precut depth is 0.1-0.2 mm, the precut width is more than or equal to 0.4mm, and the precut length is equal to the end face of the blind groove;
in the step 2, the compacted film (4) is a polyethylene film with the thickness of 0.1 mm-0.4 mm.
2. The method according to claim 1, wherein in the step 1, the precutting is performed by laser.
3. A method of milling a microwave blind groove profile according to claim 1, characterized in that in step 2 the compacted film (4) is a polyethylene film of 0.2mm thickness.
4. The method for milling the profile of the microwave blind groove according to claim 1, wherein in the step 2, the vacuum degree is less than or equal to 600Pa and is maintained for 3-5 s when the vacuum is pumped.
5. The method according to claim 1, wherein in the step 3, the drum (5) is an air bag.
6. The method for milling the profile of the microwave blind groove according to claim 1, wherein in the step 3, the process conditions of film pressing are as follows: the temperature is 150-200 ℃, the conveying speed is 0.8-1.5 m/min, and the pressure is 100-400 psi.
7. The method for milling the profile of the microwave blind slot according to claim 1, wherein in the step 4, a plurality of pieces of acid-free paper (6) are padded on the microwave multi-layer board (1) when the cover board (3) is assembled.
8. A method for milling a microwave blind slot profile according to claim 1 or 6, characterized in that in step 4, an aluminum foil (7) is placed under the cover plate (3).
9. The method according to claim 1, wherein in the step 5, a double-edge milling cutter is used for milling, and the diameter of the double-edge milling cutter is 2 times or less than the width of the precut.
CN202210825951.7A 2022-07-14 2022-07-14 Microwave blind groove shape milling method Active CN115157713B (en)

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CN106793580A (en) * 2016-11-18 2017-05-31 中国电子科技集团公司第二十九研究所 A kind of multi-layer PCB edges of boards blind slot processing method
CN110519928A (en) * 2019-08-12 2019-11-29 珠海杰赛科技有限公司 A kind of manufacture craft of blind slot flex plate
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CN215699012U (en) * 2021-08-26 2022-02-01 广东通元精密电路有限公司 Blind groove structure is cut to rigid-flex printed circuit board FR4 laser

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Publication number Priority date Publication date Assignee Title
JPH11274674A (en) * 1998-03-20 1999-10-08 Hitachi Chem Co Ltd Metallic base wiring board and its manufacture
CN106793580A (en) * 2016-11-18 2017-05-31 中国电子科技集团公司第二十九研究所 A kind of multi-layer PCB edges of boards blind slot processing method
CN110519928A (en) * 2019-08-12 2019-11-29 珠海杰赛科技有限公司 A kind of manufacture craft of blind slot flex plate
WO2021258510A1 (en) * 2020-06-24 2021-12-30 惠州市金百泽电路科技有限公司 Machining method capable of preventing burrs of metallized half-hole
CN215699012U (en) * 2021-08-26 2022-02-01 广东通元精密电路有限公司 Blind groove structure is cut to rigid-flex printed circuit board FR4 laser

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