CN115135039A - Production process method of multilayer FPC board - Google Patents
Production process method of multilayer FPC board Download PDFInfo
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- CN115135039A CN115135039A CN202210363343.9A CN202210363343A CN115135039A CN 115135039 A CN115135039 A CN 115135039A CN 202210363343 A CN202210363343 A CN 202210363343A CN 115135039 A CN115135039 A CN 115135039A
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- copper
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a production process method of a multilayer FPC board, which comprises the following steps: manufacturing an inner layer FCCL; manufacturing an outer layer auxiliary FCCL; combining and pressing; shooting and drilling; black holes and copper plating; manufacturing an outer layer circuit; and attaching the outer covering film. The invention solves the difficult point of non-uniform expansion and contraction of the inner and outer bonding pads, reduces the use of two layers of covering films on the inner layer on the material, and omits the procedures of laminating the covering films on the inner layer and uncovering the outer layer on the flow.
Description
Technical Field
The invention relates to the technical field of FPC board manufacturing, in particular to a production process method of a multilayer FPC board.
Background
In multilayer PPC manufacturing industry, along with the continuous development of intelligent technology, intelligent terminal's volume is littleer and more, and its function and performance require also higher and higher, so the function component number of integrated on the FPC is more and more, and the quantity that requires more and more to same area FPC wiring and components and parts, multilayer FPC of multilayer wiring and many plane subsides device must become one of the novel trend of FPC development.
In the production process of the multilayer FPC in the prior art, double-sided flexible boards are manufactured through an inner layer, pure glue is used for windowing in an inner layer device area to press a multilayer board, and then outer-layer waste materials in the inner layer device area are removed in a laser depth control mode.
Accordingly, the prior art is yet to be improved and developed.
Disclosure of Invention
The technical problem to be solved by the invention is to provide a production process method of a multilayer FPC board, which greatly reduces the manufacturing procedures, reduces the production cost and improves the production efficiency.
The technical scheme adopted by the invention for solving the technical problem is as follows:
a production process method of a multilayer FPC board comprises the following steps:
manufacturing an inner layer FCCL;
manufacturing an outer layer auxiliary FCCL;
combining and pressing;
shooting and drilling;
black holes and copper plating;
manufacturing an outer layer circuit;
and attaching the outer covering film.
Preferably, the manufacturing of the inner FCCL includes the following steps:
cutting the inner FCCL;
drilling an inner layer tool hole;
and (3) obtaining the inner layer circuit of the multilayer FPC board through film pressing, exposure, development and etching.
Preferably, the manufacturing of the outer layer auxiliary FCCL includes the following steps:
cutting the outer FCCL;
drilling an inner layer tool hole;
obtaining an outer auxiliary circuit of the multilayer FPC board through film pressing, exposure, development and etching, reserving all copper in an outer circuit area, and etching all copper in uncovering areas of the outer circuit and the secondary outer circuit;
filling and attaching pure glue in the non-circuit area of the secondary outer layer;
and windowing in the inner-layer patch area by adopting a laser mode.
Preferably, the combining and pressing comprises the following steps:
combining the two inner FCCL to obtain a multilayer board structure;
the multi-layer plate structure is bonded into a whole through kiss pressing, full pressing and cold pressing.
Preferably, the target hitting and drilling comprises the following steps:
punching a positioning hole of a drill hole in an X-RAY (X-RAY) targeting mode;
and drilling an outer layer tool hole by adopting a mechanical drilling mode according to the positioning hole.
Preferably, the working parameters of the mechanical drilling are as follows: pressure foot 0.25-0.35MPa, main air pressure 0.68 +/-0.1 MPa, rotating speed: 25-120 kr/min; feeding speed: 0.5-2.5 m/min; the speed of the cutter is 6-25 m/min.
Preferably, the black hole and copper plating comprise the following steps:
after the procedures of laser micropore, microetching and black hole, a layer of carbon powder is attached to the hole wall;
and carrying out whole-plate electrolytic copper on the product after the product passes through the black hole, thickening surface copper and plating the carbon surface of the hole with the required copper thickness.
Preferentially, the step of carrying out whole-plate electrolytic copper on the product produced after the black hole is passed, thickening surface copper and plating the required copper thickness on the carbon surface of the hole also comprises the following steps:
and removing the copper surface oxide and impurity ions.
Preferably, the step of manufacturing the outer layer circuit includes the following steps:
laminating a layer of photosensitive material dry film on the surface of the copper foil by using a film pressing machine;
exciting UV ultraviolet light to irradiate the dry film by using an exposure machine, so that the dry film is subjected to polymerization reaction; transferring the required pattern to the plate surface through the negative film;
dissolving the unexposed part by using weak base;
removing the exposed copper surface;
and removing the dry film of the exposed part.
Preferentially, the working parameters of the film laminator are as follows: the temperature is 90-120 ℃, the speed is 1.2-2.5m/min, and the air pressure is 0.5-1.2mpa/cm 2;
the working parameters of the exposure machine are as follows: the exposure ruler has 3-9 grids, and the air inlet pressure is more than or equal to 0.5 Mpa.
Compared with the prior art, the production process method of the multilayer FPC board provided by the invention has the following beneficial effects:
the mode of pure glue and outer layer auxiliary FCCL windowing and pressing is adopted to replace the traditional process of inner layer cover film windowing and outer layer uncapping, so that the manufacturing process is greatly reduced, the production cost is reduced, and the production efficiency is improved; meanwhile, the use of inner layer covering film materials is reduced, and the material cost is reduced.
Drawings
In order to illustrate the solution of the present application more clearly, the drawings that are needed in the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and that other drawings can be obtained by those skilled in the art without inventive effort.
FIG. 1 is a schematic flow chart showing a preferred embodiment of the process for producing a multi-layer FPC board according to the present invention.
Detailed Description
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "including" and "having," and any variations thereof, in the description and claims of this application and the description of the above figures are intended to cover non-exclusive inclusions. The terms "first," "second," and the like in the description and claims of this application or in the above-described drawings are used for distinguishing between different objects and not for describing a particular order.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the application. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is explicitly and implicitly understood by one skilled in the art that the embodiments described herein can be combined with other embodiments.
The embodiment of the invention provides a production process method of a multilayer FPC board, which comprises the following steps as shown in figure 1: manufacturing an inner layer FCCL; manufacturing an outer auxiliary FCCL; combining and pressing; shooting and drilling; black holes and copper plating; manufacturing an outer layer circuit; and (6) attaching an outer covering film.
The outer layer of circuit is protected through the outer layer of cover film of laminating, exposes outer layer paster pad, accomplishes the empty board preparation of multilayer soft board.
In specific implementation, the manufacturing of the inner layer FCCL includes the following steps: cutting the inner FCCL; drilling an inner layer tool hole; and (3) obtaining the inner layer circuit of the multilayer FPC board through film pressing, exposure, development and etching.
In specific implementation, the manufacturing of the outer layer auxiliary FCCL includes the following steps:
cutting the outer FCCL;
drilling an inner layer tool hole;
pressing a film, exposing, developing and etching to obtain an outer layer auxiliary circuit of the multilayer FPC board, reserving all copper in an outer layer circuit area, and completely etching the copper in the uncovering areas of the outer layer circuit and the secondary outer layer circuit;
filling and attaching pure glue in the non-circuit area of the secondary outer layer;
and windowing in the inner-layer patch area by adopting a laser mode.
The control requirement of the laminated pure rubber is within ten thousand levels of the grade of a dust-free room; the management rules and regulations of the dust-free room are well dressed with dust-free clothes, shoes, hats and masks; temperature of the false pressing machine: 100 plus or minus 5 ℃; and (4) aligning mark lines when the jig is attached, and keeping the tolerance (less than or equal to 0.1 mm).
In specific implementation, the combination and pressing comprises the following steps:
combining the two inner FCCL to obtain a multilayer board structure;
the multi-layer plate structure is bonded into a whole through kiss pressing, full pressing and cold pressing.
The pressing purpose is as follows: because the number of integrated functional elements on the PCB is more and more, the traditional single-double panel can not meet the wiring requirements of products, the design scheme of the multilayer FPC with a plurality of conductive layers becomes the first choice under the condition of not changing the size of the PCB. The lamination is a process of bonding one or more inner layer etched plates and copper foils into a multilayer plate by utilizing the pure glue heated and solidified after high temperature and high pressure, and all the layers of the multilayer plate are combined together by utilizing the pure glue completely solidified under high temperature and high pressure, so that the electrical property and the mechanical property of the multilayer plate are ensured.
The pressing principle is as follows: the lamination is a means of bonding the circuit sheets of each layer into a whole by pure glue, and the bonding is realized by mutual diffusion and permeation of macromolecules on the interface so as to realize crosslinking. The whole process comprises three stages of kiss pressing, full pressing and cold pressing. In the kiss-pressing stage, the resin in the pure glue is melted into low-viscosity resin, the resin is used for infiltrating all bonding surfaces and filling gaps of lines, bubbles are expelled and the dynamic viscosity of the resin is gradually improved, and the resin is completely exhausted after entering high pressure, gap filling and uniform distribution are carried out until the curing and crosslinking reaction of the resin is complete. Cold pressing is the process by which the multilayer sheet remains dimensionally stable upon rapid cooling. Therefore, the following normal pressing parameters are used for pressing.
In specific implementation, the target shooting and drilling comprises the following steps:
punching a positioning hole of a drill hole in an X-RAY (X-RAY) targeting mode;
and drilling an outer layer tool hole by adopting a mechanical drilling mode according to the positioning hole.
In specific implementation, the working parameters of the mechanical drilling are as follows: pressure foot 0.25-0.35MPa, main air pressure 0.68 +/-0.1 MPa, rotating speed: 25-120 kr/min; feeding speed: 0.5-2.5 m/min; the speed of the cutter is 6-25 m/min.
In specific implementation, the black hole and copper plating method comprises the following steps:
a layer of carbon powder is attached to the hole wall through the procedures of laser micropore, micro-etching and black hole;
and carrying out whole-plate electrolytic copper on the product after the product passes through the black hole, thickening surface copper and plating the carbon surface of the hole with the required copper thickness.
The black hole process flow comprises the following steps:
pre-micro-etching → three-way overflow water washing → cleaning segment → three-way overflow water washing → black hole 1# → blow-drying segment → middle-checking segment → water washing segment → whole-hole segment → three-way overflow water washing → black hole 2# → blow-drying & drying segment → middle-checking segment → post-micro-etching → two-way overflow water washing → three-way overflow water washing → blow-drying & drying segment.
The function of the pre-micro-etching is as follows; and removing the copper skin flash and the inner layer copper nail head formed by drilling the hole opening in the early stage.
The washing effect is as follows: cleaning the residual liquid medicine in the holes and on the surface.
The parameters for the black hole process are designed in the following table.
When the concrete implementation, carry out whole board electrocoppering to the product of passing black hole after-production, thickening face copper still includes after the thick step of required copper is plated to hole carbon face:
and removing the copper surface oxide and impurity ions.
The copper plating process flow comprises the following steps:
upper plate → degreasing → double washing → micro etching → double washing → acid leaching → copper plating → washing → lower plate → acid washing → overflow washing → drying → plate collection.
The copper plating process has the following functions:
oil removal: removing stains and surface impurities on the copper surface.
Micro-etching: and removing copper surface oxides and impurity ions, coarsening the copper surface and improving the binding force.
Acid leaching: and removing copper surface oxides and impurity ions, and avoiding the pollution of the copper cylinder.
Copper plating: and (5) performing whole-plate electrolytic copper on the product after the black hole is formed, thickening surface copper and plating the required copper thickness on the carbon surface of the hole.
Acid washing: and removing the copper surface oxide and impurity ions.
Stripping and hanging: and removing the copper powder and the coating on the femto clamp.
The parameters of the copper plating process are designed as shown in the following table.
In specific implementation, the manufacturing of the outer layer circuit comprises the following steps:
laminating a layer of photosensitive material dry film on the surface of the copper foil by using a film pressing machine;
exciting UV ultraviolet light to irradiate the dry film by using an exposure machine, so that the dry film is subjected to polymerization reaction; transferring the required pattern to the plate surface through the negative film;
dissolving the unexposed part by using weak base;
removing the exposed copper surface;
and removing the dry film of the exposed part.
In specific implementation, the working parameters of the laminator are as follows: the temperature is 90-120 ℃, the speed is 1.2-2.5m/min, and the air pressure is 0.5-1.2mpa/cm 2;
the working parameters of the exposure machine are as follows: the exposure ruler has 3-9 lattices, and the air inlet pressure is more than or equal to 0.5 Mpa.
In summary, the invention discloses a production process method of a multilayer FPC board, comprising the following steps: the upper modules are arranged above the pair of lower modules, the end parts of the FPC board are clamped between the lower modules and the upper modules, and the upper modules are fixed with the lower modules through buckles; the edge of the lower module, which is used for clamping the FPC board, is provided with lower anti-slip foam, and the edge of the upper module, which is used for clamping the FPC board, is provided with upper anti-slip foam; the lower module is provided with a jig plate below, the jig plate is provided with a plurality of auxiliary material attaching holes in the part facing the FPC plate, and the problems of plate surface corrugation and FPC plate edge residual glue when the guide plate is attached to the adhesive tape are effectively solved.
It is to be understood that the above-described embodiments are merely illustrative of some, but not restrictive, of the broad invention, and that the appended drawings illustrate preferred embodiments of the invention and do not limit the scope of the invention. This application is capable of embodiments in many different forms and is provided for the purpose of enabling a thorough understanding of the disclosure of the application. Although the present application has been described in detail with reference to the foregoing embodiments, it will be apparent to one skilled in the art that the present application may be practiced without modification or with equivalents of some of the features described in the foregoing embodiments. All equivalent structures made by using the contents of the specification and the drawings of the present application are directly or indirectly applied to other related technical fields and are within the protection scope of the present application.
Claims (10)
1. The production process method of the multilayer FPC board is characterized by comprising the following steps:
manufacturing an inner layer FCCL;
manufacturing an outer layer auxiliary FCCL;
combining and pressing;
shooting and drilling;
black holes and copper plating;
manufacturing an outer layer circuit;
and attaching the outer covering film.
2. The production process method of a multi-layer FPC board as claimed in claim 1, wherein the step of making the inner layer FCCL includes the steps of:
cutting the inner FCCL;
drilling an inner layer tool hole;
and (3) pressing a film, exposing, developing and etching to obtain an inner layer circuit of the multi-layer FPC board.
3. The production process method of the multi-layer FPC board according to claim 1, wherein the step of manufacturing the outer auxiliary FCCL includes the steps of:
cutting the outer FCCL;
drilling an inner layer tool hole;
pressing a film, exposing, developing and etching to obtain an outer layer auxiliary circuit of the multilayer FPC board, reserving all copper in an outer layer circuit area, and completely etching the copper in the uncovering areas of the outer layer circuit and the secondary outer layer circuit;
filling and attaching pure glue in the non-circuit area of the secondary outer layer;
and windowing in the inner-layer patch area by adopting a laser mode.
4. A process for producing a multi-layer FPC board as claimed in claim 3, wherein the assembling and bonding comprises the steps of:
combining the two inner FCCL to obtain a multilayer board structure;
the multi-layer plate structure is bonded into a whole through kiss pressing, full pressing and cold pressing.
5. The production process method of a multi-layer FPC board according to claim 4, wherein said targeting and drilling comprises the steps of:
punching a positioning hole of a drill hole in an X-RAY targeting mode;
and drilling an outer layer tool hole by adopting a mechanical drilling mode according to the positioning hole.
6. The production process method of a multi-layer FPC board according to claim 5, wherein the working parameters of the mechanical drilling are: pressure foot 0.25-0.35MPa, main air pressure 0.68 +/-0.1 MPa, rotating speed: 25-120 kr/min; feeding speed: 0.5-2.5 m/min; the speed of the cutter is 6-25 m/min.
7. The process for producing a multi-layer FPC board according to claim 5, wherein the black holes and copper plating comprise the steps of:
after the procedures of laser micropore, microetching and black hole, a layer of carbon powder is attached to the hole wall;
and carrying out whole-plate electrolytic copper on the product after the product passes through the black hole, thickening surface copper and plating the carbon surface of the hole with the required copper thickness.
8. The process for producing a multi-layer FPC board according to claim 7, wherein the steps of performing whole-board electro-coppering, thickening surface copper and plating the carbon surface of the via with the required copper thickness for the product after the black via is performed further comprise:
and removing the copper surface oxide and impurity ions.
9. The production process method of a multi-layer FPC board according to claim 8, wherein the step of manufacturing the outer layer circuit comprises the steps of:
laminating a layer of photosensitive material dry film on the surface of the copper foil by using a film pressing machine;
exciting UV ultraviolet light to irradiate the dry film by using an exposure machine, so that the dry film is subjected to polymerization reaction; transferring the required pattern to the plate surface through the negative film;
dissolving the unexposed part by using weak base;
removing the exposed copper surface;
and removing the dry film of the exposed part.
10. The production process method of a multilayer FPC board according to claim 9, wherein the working parameters of the laminator are as follows: 2 with the temperature of 90-120 ℃, the speed of 1.2-2.5m/min and the air pressure of 0.5-1.2 mpa/cm;
the working parameters of the exposure machine are as follows: the exposure ruler has 3-9 lattices, and the air inlet pressure is more than or equal to 0.5 Mpa.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210363343.9A CN115135039A (en) | 2022-04-03 | 2022-04-03 | Production process method of multilayer FPC board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210363343.9A CN115135039A (en) | 2022-04-03 | 2022-04-03 | Production process method of multilayer FPC board |
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| CN115135039A true CN115135039A (en) | 2022-09-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210363343.9A Pending CN115135039A (en) | 2022-04-03 | 2022-04-03 | Production process method of multilayer FPC board |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116709666A (en) * | 2023-08-08 | 2023-09-05 | 四川上达电子有限公司 | Manufacturing method of soft and hard combined board with Air-gap structure |
| CN116828826A (en) * | 2023-08-31 | 2023-09-29 | 四川上达电子有限公司 | In-situ opposite blind hole stacking method for multilayer flexible printed circuit board |
-
2022
- 2022-04-03 CN CN202210363343.9A patent/CN115135039A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116709666A (en) * | 2023-08-08 | 2023-09-05 | 四川上达电子有限公司 | Manufacturing method of soft and hard combined board with Air-gap structure |
| CN116828826A (en) * | 2023-08-31 | 2023-09-29 | 四川上达电子有限公司 | In-situ opposite blind hole stacking method for multilayer flexible printed circuit board |
| CN116828826B (en) * | 2023-08-31 | 2024-01-02 | 四川上达电子有限公司 | In-situ opposite blind hole stacking method for multilayer flexible printed circuit board |
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