CN115091107B - High-precision clamping device and clamping method for laser processing - Google Patents

High-precision clamping device and clamping method for laser processing Download PDF

Info

Publication number
CN115091107B
CN115091107B CN202211015796.9A CN202211015796A CN115091107B CN 115091107 B CN115091107 B CN 115091107B CN 202211015796 A CN202211015796 A CN 202211015796A CN 115091107 B CN115091107 B CN 115091107B
Authority
CN
China
Prior art keywords
workpiece
adjusting device
horizontal adjusting
edge
microscope
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202211015796.9A
Other languages
Chinese (zh)
Other versions
CN115091107A (en
Inventor
张春雨
崔新蕊
李国�
宋成伟
黄滟荻
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Laser Fusion Research Center China Academy of Engineering Physics
Original Assignee
Laser Fusion Research Center China Academy of Engineering Physics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Laser Fusion Research Center China Academy of Engineering Physics filed Critical Laser Fusion Research Center China Academy of Engineering Physics
Priority to CN202211015796.9A priority Critical patent/CN115091107B/en
Publication of CN115091107A publication Critical patent/CN115091107A/en
Application granted granted Critical
Publication of CN115091107B publication Critical patent/CN115091107B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/04Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
    • B23K37/0426Fixtures for other work
    • B23K37/0435Clamps
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment

Abstract

The invention discloses a high-precision clamping device and a clamping method for laser processing, which relate to the technical field of ultra-precision processing devices and comprise a structural support group, a low-speed rotating shaft, a two-degree-of-freedom micro-displacement platform with two-degree-of-freedom translational motion, a horizontal adjusting device, a high-power microscope and a microscope support; the low-speed rotating shaft is vertically arranged on the structural support group through a bearing seat, the top of the low-speed rotating shaft penetrates through the structural support group and is connected with the bottom of the two-degree-of-freedom micro-displacement platform through a screw and a shaft sleeve, a horizontal adjusting device is arranged at the top of the two-degree-of-freedom micro-displacement platform, the microscope support is movably arranged on one side of the structural support group, the high-power microscope is arranged on the microscope support and is positioned above the horizontal adjusting device, and the upper surface of the horizontal adjusting device is provided with a concentric annular marking and a positioning center which are convenient for placing and primary positioning of a workpiece; the invention can improve the consistency of the machining precision and the machining quality of different positions of the workpiece surface in the laser machining process.

Description

High-precision clamping device and clamping method for laser processing
Technical Field
The invention relates to the technical field of ultra-precise machining devices, in particular to the technical field of high-precision clamping devices and clamping methods for laser machining.
Background
The laser processing is a processing mode for realizing material removal by utilizing interaction of high-energy heat flow generated by laser beams and materials at a focusing position, and particularly has the advantages of high efficiency, accuracy, wide and diversity of processed materials and the like, is an effective means for precisely processing various materials, and is widely applied to processing key parts in the fields of optics, electronics, aerospace, aviation and the like. Along with the high-speed development of the fields of optics, electronics, aerospace, machinery and the like, the requirements on the laser processing efficiency, the processing precision, the processing quality and the like of key parts are also higher and higher.
However, as the laser energy belongs to Gaussian distribution, the laser spot size and the laser energy density can be changed due to different defocus amounts, the laser focal spot and the workpiece can relatively move in the laser processing process, and if the flatness of the workpiece is not high, the defocus amounts of different processing positions on the surface of the workpiece can be changed, so that the consistency of the processing quality and the processing precision of the different positions on the surface of the workpiece can be directly affected; in addition, for the processing of the rotationally symmetrical structure (such as annular grating, spherical and aspherical lenses, radial spline curves, etc.) on the surface of the workpiece, the workpiece needs to realize the high-coaxial-precision rotary motion in the processing process.
Therefore, in order to ensure the consistency of the machining precision and the machining quality of different positions of the workpiece surface in the laser machining process and realize the laser machining of the workpiece surface rotationally symmetrical structure (such as annular grating, spherical and aspherical lenses, radial spline curves and the like) with high coaxial precision, a high-precision clamping device and a clamping method which are specially used for the laser machining and can adjust the workpiece surface flatness and the rotational coaxiality are required to be designed.
Disclosure of Invention
The invention aims at: in order to solve the technical problems, the invention provides the high-precision clamping device and the clamping method for the laser processing, which can realize high-precision adjustment of the surface flatness of a workpiece and the coaxiality of the center of the workpiece and the center of rotation, can improve the consistency of processing precision and processing quality of different positions of the surface of the workpiece in the laser processing process, and can realize the laser processing with high coaxiality precision of a rotationally symmetrical structure (such as a ring grating, a spherical lens, an aspherical lens, a radial spline curve and the like).
The invention adopts the following technical scheme for realizing the purposes:
a high-precision clamping device for laser processing comprises a structural support group, a low-speed rotating shaft, a two-degree-of-freedom micro-displacement platform for realizing two-degree-of-freedom translation of a workpiece in an XY direction, a horizontal adjusting device, a high-power microscope for assisting in determining the flatness and coaxiality of the workpiece and a microscope support;
the low-speed rotating shaft is vertically arranged on the structural support group through the bearing seat, the top of the low-speed rotating shaft penetrates through the structural support group and is connected with the bottom of the two-degree-of-freedom micro-displacement platform through a screw and a shaft sleeve, a horizontal adjusting device is arranged at the top of the two-degree-of-freedom micro-displacement platform, the microscope support is movably arranged on one side of the structural support group, the high-power microscope is arranged on the microscope support and is located above the horizontal adjusting device, and the upper surface of the horizontal adjusting device is provided with a concentric annular marking and a positioning center which are convenient for placing and primary positioning of a workpiece.
Further, the horizontal adjusting device comprises an upper horizontal adjusting device plane, a lower horizontal adjusting device plane, four elastic bolt assemblies connected to the upper horizontal adjusting device plane and four corners of the lower horizontal adjusting device plane, each elastic bolt assembly comprises a horizontal adjusting screw penetrating through the upper horizontal adjusting device plane and the lower horizontal adjusting device plane and a spring sleeved on the horizontal adjusting screw between the upper horizontal adjusting device plane and the lower horizontal adjusting device plane, and concentric circle marking lines and positioning centers, which are processed by laser etching and have a distance of 2mm, are arranged above the upper horizontal adjusting device plane so as to facilitate the placement and preliminary positioning of workpieces.
Further, the structure support group comprises a reverse U-shaped support frame with a downward opening and two support lug plates arranged on two sides of the bottom of the reverse U-shaped support frame, and reinforcing rib plates are arranged between each support lug plate and the reverse U-shaped support frame.
Further, the high-power microscope is provided with scales, the magnification is 21-150 times, the pixel size is 2.75 micrometers, the microscope support comprises a movable seat fixed on the structural support group through bolts, and an L-shaped mounting frame movably inserted on the movable seat, the L-shaped mounting frame comprises a vertical rod movably inserted in the movable seat and a horizontal rod connected with the top of the vertical rod, and the high-power microscope is arranged at the tail end of the horizontal rod.
Further, the two-degree-of-freedom micro-displacement platform comprises a Y-direction movable plate, an X-direction movable plate and a fixed bottom plate, wherein the Y-direction movable plate, the X-direction movable plate and the fixed bottom plate are sequentially arranged from top to bottom, a Y-direction roller guide rail is arranged between the Y-direction movable plate and the X-direction movable plate, an X-direction roller guide rail is arranged between the X-direction movable plate and the fixed bottom plate, and the Y-direction roller guide rail and the X-direction roller guide rail form a crossed roller guide rail assembly.
A high-precision clamping method for laser processing comprises the following steps:
step one: firstly, fixing a structural support group on a machine tool;
step two: referring to the upper surface marking and the positioning center of the horizontal adjusting device, initially positioning a workpiece with the diameter of 4mm and the thickness of 1mm at the center of an upper plane;
step three: after a workpiece is fixed on the upper surface of a horizontal adjusting device, on-site observation is carried out through a high-power microscope, four clockwise directions of the edge of an annular marking on the upper surface of the horizontal adjusting device are defined as A, B, C, D, four elastic bolt assemblies are defined as E, F, G, H clockwise, A is the inner side, E is the inner left side, firstly, a microscope bracket is rotated, the high-power microscope is aligned to the edge of the direction A and focused, and at the moment, the focus is at the same height with the edge of the workpiece;
step four: the workpiece is driven to rotate 90 degrees anticlockwise at a low speed through the low-speed rotating shaft until the workpiece is at the edge of the direction B, and defocusing phenomenon occurs in the rotating process, so that the surface of the workpiece is not horizontal;
step five: finding that the defocusing direction is positive through a high-power microscope, adjusting a F, G elastic bolt assembly corresponding to the B side in the leveling device by using an inner hexagonal wrench for fine adjustment, loosening a spring to enable a plane to be adjusted upwards until a picture in the high-power microscope is clear again, and indicating that the edge in the B direction is adjusted to be at the same height as the edge in the A direction at the moment;
step six: driving the workpiece to rotate 90 degrees counterclockwise at a low speed through the low-speed rotating shaft until the workpiece is at the edge in the C direction, wherein the defocusing phenomenon still occurs in the rotating process, which indicates that the surface of the workpiece is not horizontal;
step seven: through the discovery of a high-power microscope, the defocusing direction is still positive, the G, H elastic bolt assembly corresponding to the C side in the leveling device is adjusted by using an inner hexagonal wrench to carry out fine adjustment, and the spring is loosened to enable the plane to be adjusted upwards until the picture in the microscope display is clear again;
step eight: the workpiece is driven to rotate anticlockwise at a low speed continuously through the low-speed rotating shaft, the phenomenon of defocusing does not occur in the rotating process, and the levelness adjustment of the workpiece is completed;
step nine: firstly, rotating a structural support group to enable a lens to be aligned to the direction A of the edge of a circular workpiece, and calibrating the point to be N through a high-power microscope;
step ten: rotating the rotating shaft at a counterclockwise low speed by 180 ℃ to the edge in the direction of C, observing that the edge in the direction of C of the workpiece is not coincident with a mark point N in the view field, and marking the mark point as M point;
step eleven: measuring the distance L (unit mu m) between the MNs by using a high-power microscope scale, and manually adjusting the distance L/2 to the direction A by using a two-degree-of-freedom micro-displacement platform;
step twelve: rotating the structural support group to enable the lens to be aligned to the direction B of the edge of the round workpiece, calibrating the point to be N1 through a high-power microscope, rotating the rotating shaft at a low speed anticlockwise to the direction D edge by 180 degrees, calibrating the point to be M1, and measuring the distance L1;
step thirteen: the workpiece is moved to the direction B by a distance L1/2 by manually adjusting the two-degree-of-freedom micro-displacement platform;
step fourteen: rotating the structural support group to enable a view field of the structural support group to be aligned to the direction C of the edge of the round workpiece, calibrating the point to be N2 through a high-power microscope, rotating the rotating shaft at a low speed anticlockwise to the direction A edge by 180 degrees, calibrating the point to be M2, and measuring the distance L2;
fifteen steps: the workpiece is moved to the direction C by a distance L2/2 by manually adjusting the two-degree-of-freedom micro-displacement platform;
step sixteen: rotating the structural support group to enable the lens to be aligned to the direction D of the edge of the round workpiece, calibrating the point to be N3 through a high-power microscope, rotating the rotating shaft at a low speed anticlockwise to the direction B edge by 180 degrees, calibrating the point to be M3, and measuring the distance L3;
seventeenth step: the workpiece is moved to the direction B by a distance L3/2 by manually adjusting the two-degree-of-freedom micro-displacement platform;
eighteenth step: and continuing to rotate the workpiece at a low speed, and observing that no offset phenomenon occurs at the edges of the workpiece in all directions in the rotation process, so as to prove that the coaxiality adjustment of the workpiece is finished.
The beneficial effects of the invention are as follows:
the invention can solve the problem of high-precision clamping and positioning of the workpiece in the laser processing process, can realize high-precision adjustment of the workpiece surface flatness and the coaxiality of the workpiece center and the rotation center, can reach the precision within 3 mu m, can improve the consistency of the processing precision and the processing quality of different positions of the workpiece surface in the laser processing process, and can realize the laser processing with high coaxiality precision of rotationally symmetrical structures (such as annular gratings, spherical and aspherical lenses, radial spline curves and the like).
Working principle:
the workpiece levelness adjusting method comprises the following steps: after a workpiece is fixed on the upper plane of a horizontal adjusting device, a high-power microscope is used for in-situ observation, a microscope support rotating shaft is rotated at first, a lens is aligned to the edge of a circular workpiece in the direction of a scribing line A and focused, at the moment, a microscope focus and the edge of the workpiece are positioned at the same height, the motor rotating shaft drives the workpiece to rotate anticlockwise at a low speed by 90 degrees to the edge of the direction of B, if the defocusing phenomenon occurs in the rotating process, the surface of the workpiece is out of level, at the moment, an inner hexagonal wrench can be used for adjusting a bolt corresponding to the side B in the leveling device, if the defocusing direction is positive, an adjusting bolt releases a spring to enable the plane to be adjusted upwards, if the defocusing direction is negative, a bolt compression spring is screwed to enable the plane to be adjusted downwards, in-situ observation is carried out through the high-power microscope in the adjusting process until the picture is clear again, and the edge of the direction of 90 degrees to C, D is rotated anticlockwise in sequence, the steps are repeated until the defocusing phenomenon does not occur in the rotating process of the workpiece, and the levelness of the workpiece is completed.
The method for adjusting the coaxiality of the workpiece and the rotation center of the low-speed rotating shaft comprises the following steps: firstly, rotating a structural support group to enable a lens to be aligned with the edge of a circular workpiece in the A direction, calibrating the point as N through a high-power microscope, rotating a rotating shaft anticlockwise by 180 DEG to the edge in the C direction, when the center of the workpiece is not coaxial with the rotation center, observing that the workpiece is not coincident with the mark point N at the edge in the C direction in a view field, calibrating the point as M point, measuring the distance value L of the point through the scale of the high-power microscope, and manually adjusting the point through a micro-displacement platform to move the distance L/2 in the A direction; and then, rotating the rotating shaft of the high power microscope support to enable the lens to be aligned with the round workpiece at the edge of the direction B, calibrating the point to be N1 through the high power microscope, rotating the rotating shaft anticlockwise for 180 degrees to the edge of the direction D, calibrating the point to be M1, measuring the distance L, and repeating the steps until the center of the workpiece is coaxial with the rotation center of the low-speed rotating shaft.
Drawings
Fig. 1 is a schematic diagram of the overall structure of the invention.
Fig. 2 is a schematic view of a level adjustment device.
Fig. 3 is a top plan view of the level adjustment device.
Fig. 4 is a schematic view of a stent assembly and a gusset.
Fig. 5 is a schematic view of a high power camera and its stand.
Fig. 6 (a) is a schematic diagram of the coaxiality adjustment method.
Fig. 6 (b) is another schematic diagram of the coaxiality adjustment method.
FIG. 7 is a schematic diagram of a two-degree-of-freedom micro-displacement platform.
Fig. 8 is a schematic view of the structure of the low-speed shaft.
Description of the drawings: the microscope comprises a 1-microscope support, a 1-1-movable seat, a 1-2-L-shaped mounting rack, a 2-high-power microscope, an upper plane of a 3-horizontal adjusting device, a 4-horizontal adjusting screw, a 5-spring, a lower plane of a 6-horizontal adjusting device, a 7-two-degree-of-freedom micro-displacement platform, a 7-1-Y-direction movable plate, a 7-2-X-direction movable plate, a 7-3-fixed bottom plate, a 7-4-Y-direction roller guide, a 7-5-X-direction roller guide, an 8-low-speed rotating shaft, a 9-structure support group, a 9-1- 'U' -shaped support frame, a 9-2-support lug plate and a 9-3-reinforcing rib plate.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures. Furthermore, the terms "first," "second," and the like, are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.
In describing embodiments of the present invention, it should be noted that the directions or positional relationships indicated by the terms "inner", "outer", "upper", etc. are directions or positional relationships based on those shown in the drawings, or those that are conventionally put in place when the inventive product is used, are merely for convenience of description and simplification of description, and are not indicative or implying that the apparatus or element in question must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the present invention.
Example 1
As shown in fig. 1 to 8, the present embodiment provides a high-precision clamping device for laser processing, which includes a structural support group 9, a low-speed rotating shaft 8, a two-degree-of-freedom micro-displacement platform 7 for realizing two-degree-of-freedom translation of a workpiece in XY directions, a horizontal adjusting device, a high-power microscope 2 for assisting in determining the flatness and coaxiality of the workpiece, and a microscope support 1;
the low-speed rotating shaft 8 is vertically arranged on the structural support group 9 through a bearing seat, the top of the low-speed rotating shaft 8 penetrates through the structural support group 9 and is connected with the bottom of the two-degree-of-freedom micro-displacement platform 7 through a screw and a shaft sleeve, a horizontal adjusting device is arranged at the top of the two-degree-of-freedom micro-displacement platform 7, the microscope support 1 is movably arranged on one side of the structural support group 9, the high-power microscope 2 is arranged on the microscope support 1 and is positioned above the horizontal adjusting device, and the upper surface of the horizontal adjusting device is provided with a concentric annular marking and a positioning center which are convenient for placing and preliminary positioning of a workpiece.
The horizontal adjusting device comprises an upper horizontal adjusting device plane 3, a lower horizontal adjusting device plane 6, four elastic bolt assemblies connected to four corners of the upper horizontal adjusting device plane 3 and the lower horizontal adjusting device plane 6, wherein each elastic bolt assembly comprises a horizontal adjusting screw 4 penetrating through the upper horizontal adjusting device plane 3 and the lower horizontal adjusting device plane 6 and a spring 5 sleeved on the horizontal adjusting screw 4 between the upper horizontal adjusting device plane 3 and the lower horizontal adjusting device plane 6, and concentric circle marking lines and positioning centers, which are processed by laser etching, with the distance of 2mm, are arranged above the upper horizontal adjusting device plane 3 so as to facilitate the placement and preliminary positioning of workpieces.
The upper plane 3 of the horizontal adjusting device and the lower plane 6 of the horizontal adjusting device are vertically stacked directional plane plates, through holes are formed in four corners of the upper plane 3 of the horizontal adjusting device and the lower plane 6 of the horizontal adjusting device, each elastic bolt assembly is arranged at one group of through holes, a spring is sleeved on the horizontal adjusting screw 4 and is in a compressed state and used for supporting the upper plane 3 of the horizontal adjusting device, and the elastic bolt assemblies can loosen or tighten the spring by adjusting the horizontal adjusting screw 4 so as to adjust the angle of the horizontal adjusting screw 4.
The structure support group 9 comprises a U-shaped support frame 9-1 with a downward opening and two support lug plates 9-2 arranged on two sides of the bottom of the U-shaped support frame 9-1, and a reinforcing rib plate 9-3 is arranged between each support lug plate 9-2 and the U-shaped support frame 9-1.
The high-power microscope 2 is provided with scales, the magnification is 21-150 times, the pixel size is 2.75 micrometers, the microscope support 1 comprises a movable seat 1-1 fixed on the structural support group 9 through bolts, an L-shaped mounting frame 1-2 movably inserted on the movable seat 1-1, the L-shaped mounting frame 1-2 comprises a vertical rod movably inserted in the movable seat 1-1 and a horizontal rod connected with the top of the vertical rod, the high-power microscope 2 is arranged at the tail end of the horizontal rod, and the position of the microscope can be moved by rotating a high-power microscope support shaft during operation.
The two-degree-of-freedom micro-displacement platform 7 comprises a Y-direction movable plate 7-1, an X-direction movable plate 7-2 and a fixed bottom plate 7-3 which are sequentially arranged from top to bottom, wherein a Y-direction roller guide rail 7-4 is arranged between the Y-direction movable plate 7-1 and the X-direction movable plate 7-2, an X-direction roller guide rail 7-5 is arranged between the X-direction movable plate 7-2 and the fixed bottom plate 7-3, and the Y-direction roller guide rail 7-4 and the X-direction roller guide rail 7-5 form a crisscross roller guide rail assembly.
The main body of the two-degree-of-freedom micro-displacement platform 7 is made of high-strength aluminum alloy, the weight is light, and the size of a table top is 60mm. The cross roller guide rail is suitable for high-precision occasions, two-degree-of-freedom translation of the workpiece in the XY direction can be realized, the strokes in the XY direction are respectively +/-6.5 mm, and the motion precision is 0.1mm.
Example 2
A high-precision clamping method for laser processing comprises the following steps:
step one: firstly, the structural support group 9 is fixed on a machine tool, the bottom plate of the support group is connected with the machine tool through a screw with the model of M4, the material of the support group is 45 # steel, and the rib plates on the support group can keep the support stable and not deformed. When the clamp is installed on the machine tool as shown in fig. 1, the clamp bottom plate of the bracket group is connected with the machine tool through screws, as shown in fig. 4;
step two: referring to the upper surface marking line and the positioning center of the horizontal adjusting device, initially positioning a single-side polished CVD diamond workpiece with the diameter of 4mm and the thickness of 1mm at the center of an upper plane;
step three: after a CVD diamond workpiece is fixed on the upper surface of a horizontal adjusting device, a high-power microscope 2 is used for in-situ observation, four clockwise directions of the edge of an annular marking on the upper surface of the horizontal adjusting device are defined as A, B, C, D, four elastic bolt assemblies are defined as clockwise E, F, G, H, A is the inner side, E is the inner left side, a microscope support 1 is rotated firstly, the high-power microscope 2 is aligned at the edge of the A direction and focused, and at the moment, the focus and the edge of the workpiece are at the same height;
step four: the workpiece is driven to rotate 90 degrees anticlockwise at a low speed through the low-speed rotating shaft 8 until the edge of the direction B is reached, and the defocusing phenomenon occurs in the rotating process, so that the surface of the workpiece is not horizontal;
step five: the high power microscope 2 finds that the defocusing direction is positive, an inner hexagonal wrench is used for adjusting a F, G elastic bolt component corresponding to the B side in the leveling device for fine adjustment, a spring is loosened to enable a plane to be adjusted upwards until pictures in the high power microscope 2 are clear again, and the fact that the edge of the B direction is adjusted to be the same height as the edge of the A direction at the moment is explained;
step six: the workpiece is driven to rotate 90 degrees at a low speed anticlockwise through the low-speed rotating shaft 8 until the edge in the C direction is reached, and the defocusing phenomenon still occurs in the rotating process, so that the surface of the workpiece is not horizontal;
step seven: through the discovery of the high-power microscope 2, the defocusing direction is still positive, the G, H elastic bolt assembly corresponding to the C side in the leveling device is adjusted by using an inner hexagonal wrench to carry out fine adjustment, and the spring is loosened to enable the plane to be adjusted upwards until the picture in the microscope display is clear again;
step eight: the workpiece is driven to rotate anticlockwise at a low speed continuously through the low-speed rotating shaft 8, no defocusing phenomenon occurs in the rotating process, and the levelness adjustment of the workpiece is completed;
step nine: firstly, rotating a structural support group 9 to enable a lens to be aligned to the direction of the edge A of a round workpiece, and calibrating the point to be N through a high-power microscope, as shown in FIG. 6 a;
step ten: rotating the rotating shaft at a counterclockwise low speed by 180 ℃ to the edge in the direction of C, observing that the edge in the direction of C of the workpiece is not coincident with a mark point N in the view field, and marking the mark point as a point M, as shown in FIG. 6 b;
step eleven: measuring the distance L unit mu m between MNs by the scale of a high-power microscope 2, and manually adjusting the distance L/2 to the direction A by a two-degree-of-freedom micro-displacement platform 7;
step twelve: rotating the structural support group 9 to enable the lens to be aligned to the direction B of the edge of the round workpiece, calibrating the point to be N1 through a high-power microscope, rotating the rotating shaft at a counter-clockwise low speed for 180 degrees to the direction D edge, calibrating the point to be M1, and measuring the distance L1;
step thirteen: the workpiece is moved to the direction B by a distance L1/2 by manually adjusting the two-degree-of-freedom micro-displacement platform 7;
step fourteen: rotating the structural support group 9 to enable the view field of the structural support group to be aligned with the direction C of the edge of the round workpiece, calibrating the point to be N2 through a high-power microscope, rotating the rotating shaft at a low speed anticlockwise to the direction A edge by 180 degrees, calibrating the point to be M2, and measuring the distance L2;
fifteen steps: the workpiece is moved to the direction C by a distance L2/2 by manually adjusting the two-degree-of-freedom micro-displacement platform 7;
step sixteen: rotating the structural support group 9 to enable the lens to be aligned to the direction D of the edge of the round workpiece, calibrating the point to be N3 through a high-power microscope, rotating the rotating shaft at a low speed anticlockwise to the direction B edge by 180 degrees, calibrating the point to be M3, and measuring the distance L3;
seventeenth step: the workpiece is moved to the direction B by a distance L3/2 by manually adjusting the two-degree-of-freedom micro-displacement platform 7;
eighteenth step: and continuing to rotate the workpiece at a low speed, and observing that no offset phenomenon occurs at the edges of the workpiece in all directions in the rotation process, so as to prove that the coaxiality adjustment of the CVD diamond workpiece is finished.

Claims (1)

1. The high-precision clamping method for laser processing is characterized by comprising a structural support group (9), a low-speed rotating shaft (8), a two-degree-of-freedom micro-displacement platform (7) for realizing two-degree-of-freedom translation of a workpiece in an XY direction, a horizontal adjusting device, a high-power microscope (2) for assisting in determining the flatness and coaxiality of the workpiece and a microscope support (1);
the low-speed rotating shaft (8) is vertically arranged on the structural support group (9) through a bearing seat, the top of the low-speed rotating shaft (8) penetrates through the structural support group (9) and is connected with the bottom of the two-degree-of-freedom micro-displacement platform (7) through a screw, a horizontal adjusting device is arranged at the top of the two-degree-of-freedom micro-displacement platform (7), the microscope support (1) is movably arranged on one side of the structural support group (9), the high-power microscope (2) is arranged on the microscope support (1) and is positioned above the horizontal adjusting device, and concentric annular marks and positioning centers which are convenient for placing and initial positioning of workpieces are arranged on the upper surface of the horizontal adjusting device;
the horizontal adjusting device comprises an upper horizontal adjusting device plane (3), a lower horizontal adjusting device plane (6), four elastic bolt assemblies connected to four corners of the upper horizontal adjusting device plane (3) and the lower horizontal adjusting device plane (6), wherein each elastic bolt assembly comprises a horizontal adjusting screw (4) penetrating through the upper horizontal adjusting device plane (3) and the lower horizontal adjusting device plane (6) and a spring (5) sleeved on the horizontal adjusting screw (4) between the upper horizontal adjusting device plane (3) and the lower horizontal adjusting device plane (6), and concentric circle marking lines and positioning centers with the distance of 2mm are formed above the upper horizontal adjusting device plane (3) by laser etching so as to facilitate the placement and preliminary positioning of workpieces;
the structure support group (9) comprises a reverse U-shaped support frame (9-1) with a downward opening and two support lug plates (9-2) arranged on two sides of the bottom of the reverse U-shaped support frame (9-1), and a reinforcing rib plate (9-3) is arranged between each support lug plate (9-2) and the reverse U-shaped support frame (9-1);
the high power microscope (2) is provided with scales, the microscope bracket (1) comprises a movable seat (1-1) fixed on the structural bracket group (9) through bolts, an L-shaped mounting frame (1-2) movably inserted on the movable seat (1-1), the L-shaped mounting frame (1-2) comprises a vertical rod movably inserted in the movable seat (1-1) and a horizontal rod connected with the top of the vertical rod, the high power microscope (2) is arranged at the tail end of the horizontal rod,
the two-degree-of-freedom micro-displacement platform (7) comprises a Y-direction movable plate (7-1), an X-direction movable plate (7-2) and a fixed bottom plate (7-3) which are sequentially arranged from top to bottom, wherein a Y-direction roller guide rail (7-4) is arranged between the Y-direction movable plate (7-1) and the X-direction movable plate (7-2), an X-direction roller guide rail (7-5) is arranged between the X-direction movable plate (7-2) and the fixed bottom plate (7-3), and the Y-direction roller guide rail (7-4) and the X-direction roller guide rail (7-5) form a crossed roller guide rail assembly;
the clamping method comprises the following steps:
step one: firstly, fixing a structural support group (9) on a machine tool;
step two: referring to the upper surface marking and the positioning center of the horizontal adjusting device, initially positioning a workpiece with the diameter of 4mm and the thickness of 1mm at the center of an upper plane;
step three: after a workpiece is fixed on the upper surface of a horizontal adjusting device, a high-power microscope (2) is used for in-situ observation, four clockwise directions of the edge of an annular marking on the upper surface of the horizontal adjusting device are defined as A, B, C, D, four elastic bolt assemblies are defined as clockwise E, F, G, H, A is the inner side, E is the inner left side, firstly, a microscope bracket (1) is rotated, the high-power microscope (2) is aligned at the edge of the A direction and focused, and at the moment, the focus and the edge of the workpiece are at the same height;
step four: the workpiece is driven to rotate 90 degrees anticlockwise at a low speed through the low-speed rotating shaft (8) until the edge of the direction B is reached, and the defocusing phenomenon occurs in the rotating process, so that the surface of the workpiece is not horizontal;
step five: finding that the defocusing direction is positive through a high-power microscope (2), adjusting a F, G elastic bolt assembly corresponding to the B side in the leveling device by using an inner hexagonal wrench for fine adjustment, loosening a spring to enable a plane to be adjusted upwards until a picture in the high-power microscope (2) is clear again, and indicating that the edge of the B direction is adjusted to be at the same height as the edge of the A direction at the moment;
step six: the workpiece is driven to rotate 90 degrees at a low speed anticlockwise through the low-speed rotating shaft (8) until the edge in the C direction is reached, and the defocusing phenomenon still occurs in the rotating process, so that the surface of the workpiece is not horizontal;
step seven: through the discovery of a high-power microscope (2), the defocusing direction is still positive, a G, H elastic bolt assembly corresponding to the C side in the leveling device is adjusted by an inner hexagonal wrench to carry out fine adjustment, and a spring is loosened to enable a plane to be adjusted upwards until a picture in a microscope display is clear again;
step eight: the workpiece is driven to rotate anticlockwise at a low speed continuously through the low-speed rotating shaft (8), and the phenomenon of defocusing does not occur in the rotating process, so that the levelness adjustment of the workpiece is completed;
step nine: firstly, rotating a structural support group (9) to enable a lens to be aligned to the direction A of the edge of a circular workpiece, and calibrating the point to be N through a high-power microscope;
step ten: rotating the rotating shaft at a counterclockwise low speed by 180 ℃ to the edge in the direction of C, observing that the edge in the direction of C of the workpiece is not coincident with a mark point N in the view field, and marking the mark point as M point;
step eleven: measuring the distance L between the MNs by the scale of the high-power microscope (2), and manually adjusting the distance L/2 towards the direction A by the two-degree-of-freedom micro-displacement platform (7);
step twelve: rotating the structural support group (9) to enable the lens to be aligned to the direction B of the edge of the round workpiece, calibrating the point to be N1 through a high-power microscope, rotating the rotating shaft at a low speed anticlockwise to the direction D edge, calibrating the point to be M1, and measuring the distance L1;
step thirteen: the workpiece is moved to the direction B by a distance L1/2 by manually adjusting the two-degree-of-freedom micro-displacement platform (7);
step fourteen: rotating the structural support group (9) to enable the view field of the structural support group to be aligned with the direction C of the edge of the round workpiece, calibrating the point to be N2 through a high-power microscope, rotating the rotating shaft at a low speed anticlockwise to the direction A edge, calibrating the point to be M2, and measuring the distance L2;
fifteen steps: the workpiece is moved to the direction C by a distance L2/2 by manually adjusting the two-degree-of-freedom micro-displacement platform (7);
step sixteen: rotating the structural support group (9) to enable the lens to be aligned to the direction D of the edge of the round workpiece, calibrating the point to be N3 through a high-power microscope, rotating the rotating shaft at a low speed anticlockwise to the direction B edge by 180 degrees, calibrating the point to be M3, and measuring the distance L3;
seventeenth step: the workpiece is moved to the direction B by a distance L3/2 by manually adjusting the two-degree-of-freedom micro-displacement platform (7);
eighteenth step: and continuing to rotate the workpiece at a low speed, and observing that no offset phenomenon occurs at the edges of the workpiece in all directions in the rotation process, so as to prove that the coaxiality adjustment of the workpiece is finished.
CN202211015796.9A 2022-08-24 2022-08-24 High-precision clamping device and clamping method for laser processing Active CN115091107B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202211015796.9A CN115091107B (en) 2022-08-24 2022-08-24 High-precision clamping device and clamping method for laser processing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202211015796.9A CN115091107B (en) 2022-08-24 2022-08-24 High-precision clamping device and clamping method for laser processing

Publications (2)

Publication Number Publication Date
CN115091107A CN115091107A (en) 2022-09-23
CN115091107B true CN115091107B (en) 2023-04-25

Family

ID=83299910

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202211015796.9A Active CN115091107B (en) 2022-08-24 2022-08-24 High-precision clamping device and clamping method for laser processing

Country Status (1)

Country Link
CN (1) CN115091107B (en)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06137842A (en) * 1992-10-26 1994-05-20 Nachi Fujikoshi Corp Method and device for measuring rotary tool blade part form
US6031201A (en) * 1993-06-04 2000-02-29 Seiko Epson Corporation Laser machining apparatus with rotatable phase grating
CN202021422U (en) * 2011-04-21 2011-11-02 中科中涵激光设备(福建)股份有限公司 Piezoelectric transducer (PZT)-based laser scanning device for micro round holes
CN205096731U (en) * 2015-11-22 2016-03-23 苏州光韵达光电科技有限公司 A optic fibre cutting head for on optic fibre laser cutting machine
CN112935849A (en) * 2021-03-29 2021-06-11 山东大学 Two-axis linkage machining method for micro-lens array
CN114871604A (en) * 2022-05-26 2022-08-09 洛阳科品实业有限公司 Special clamp for laser welding head and leveling and defocusing measuring method

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003007602A (en) * 2001-06-26 2003-01-10 Nikon Corp Instrument and method for measurement, and system and method for exposure
DE60202374T2 (en) * 2002-10-25 2005-12-08 Evotec Technologies Gmbh Method and apparatus for taking three-dimensional images of suspended micro-objects using high-resolution microscopy
US7094193B2 (en) * 2003-08-28 2006-08-22 Philip Morris Usa Inc. High speed laser perforation of cigarette tipping paper
JP5973756B2 (en) * 2012-03-14 2016-08-23 株式会社東光高岳 Focus position changing device and confocal optical device using the same
CN103395090B (en) * 2013-07-19 2015-08-19 长春理工大学 Grating mechanical scratching engineer testing device
JP6698440B2 (en) * 2016-06-21 2020-05-27 株式会社ディスコ Processing equipment
CN106352842B (en) * 2016-10-24 2019-01-15 中国工程物理研究院机械制造工艺研究所 A kind of device measured for disk part by performing flatness and the depth of parallelism
US10500690B2 (en) * 2017-10-25 2019-12-10 United Technologies Corporation Method and apparatus for aligning a process gas jet nozzle and laser machining beam
CN111089835A (en) * 2020-01-02 2020-05-01 河北科技大学 Manual super-hydrophobic surface adhesion testing system stable in operation and accurate in testing
CN111421228B (en) * 2020-04-08 2021-05-18 华中科技大学 Sample precision clamp for cross-scale two-photon polymerization processing and leveling method
CN112108902B (en) * 2020-08-31 2022-06-28 西安精雕精密机械工程有限公司 Leveling structure and leveling method
CN112947007A (en) * 2021-01-19 2021-06-11 上海集成电路装备材料产业创新中心有限公司 Rotary device of rotary platform of photoetching machine
CN113075219B (en) * 2021-03-24 2023-05-26 上海御微半导体技术有限公司 Leveling focusing device
CN114518081A (en) * 2021-12-28 2022-05-20 西南技术物理研究所 Supplementary subsides of unit class device concentricity pastes dress device
CN114509923B (en) * 2022-01-28 2023-11-24 复旦大学 Focusing and leveling device in deep ultraviolet objective lens design and application thereof

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06137842A (en) * 1992-10-26 1994-05-20 Nachi Fujikoshi Corp Method and device for measuring rotary tool blade part form
US6031201A (en) * 1993-06-04 2000-02-29 Seiko Epson Corporation Laser machining apparatus with rotatable phase grating
CN202021422U (en) * 2011-04-21 2011-11-02 中科中涵激光设备(福建)股份有限公司 Piezoelectric transducer (PZT)-based laser scanning device for micro round holes
CN205096731U (en) * 2015-11-22 2016-03-23 苏州光韵达光电科技有限公司 A optic fibre cutting head for on optic fibre laser cutting machine
CN112935849A (en) * 2021-03-29 2021-06-11 山东大学 Two-axis linkage machining method for micro-lens array
CN114871604A (en) * 2022-05-26 2022-08-09 洛阳科品实业有限公司 Special clamp for laser welding head and leveling and defocusing measuring method

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
马浩慧 ; 邢敏剑 ; .水平仪的发展及应用.计量技术.2018,(第07期),20-23. *

Also Published As

Publication number Publication date
CN115091107A (en) 2022-09-23

Similar Documents

Publication Publication Date Title
CN100400225C (en) Non-spherical optical component composite machining and testing machine tools
CN103286452B (en) Laser micropore processing method and laser micropore process equipment
CN113210636B (en) Device and method for machining shift-centering type micro lens array
CN108705410B (en) A kind of co-melting robot large optical mirror process unit of multi-parallel
CN105880827A (en) Micron-sized ultraviolet laser micro processing platform
CN102501143A (en) CCD (charge-coupled device) tool setting and monitoring apparatus for precision machining of complicated microstructural parts
CN204366662U (en) Radius of curvature adjustable aspheric surface concavees lens processing unit (plant)
CN106826474A (en) Small size thin wall complex structure part superfine grinding lathe
CN110000606B (en) Tool setting method for machining terahertz slow-wave structural part
CN104493662A (en) Machining device for curvature radius-adjustable aspheric concave lens
CN101664881A (en) Open-type field six-degree-of-freedom series-parallel processing robot
CN115091107B (en) High-precision clamping device and clamping method for laser processing
CN110640551A (en) Intelligent and automatic sand box production line
CN111561880A (en) High-precision arc edge diamond cutter cutting edge profile optical measurement device
CN212109914U (en) High-precision arc edge diamond cutter cutting edge profile optical measurement device
CN113601257B (en) Microstructure array processing device and method based on variable-pitch fly cutter cutting
CN115302246A (en) Combined machining tool
CN113799013B (en) Anchor clamps for mechanical maintenance
CN112935849B (en) Two-axis linkage machining method for micro-lens array
CN102886716A (en) Face grinding machine for sapphire ingot
CN209623645U (en) Optical centering device for the prepackage of civilian nuclear facilities
CN206595232U (en) A kind of wafer stage chip upside-down mounting locating platform
CN108747510B (en) Machining tool for herringbone magnetic steel mounting groove of rotor shaft of large synchronous motor
CN212470468U (en) Optical alignment device of clamping type diamond micro milling cutter
CN105437199A (en) Line marking accurate-adjustment device and link marking method adopting line marking accurate-adjustment device

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant