CN102886716A - Face grinding machine for sapphire ingot - Google Patents
Face grinding machine for sapphire ingot Download PDFInfo
- Publication number
- CN102886716A CN102886716A CN2011102017075A CN201110201707A CN102886716A CN 102886716 A CN102886716 A CN 102886716A CN 2011102017075 A CN2011102017075 A CN 2011102017075A CN 201110201707 A CN201110201707 A CN 201110201707A CN 102886716 A CN102886716 A CN 102886716A
- Authority
- CN
- China
- Prior art keywords
- grinding machine
- grinding
- face
- crystal bar
- sapphire crystal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Abstract
The invention provides a face grinding machine for a sapphire ingot, belonging to the field of processing devices. The face grinding machine mainly structurally comprises a surface grinding machine, a C-direction orientation device, a turntable, a special clamp, a grinding wheel, an X-Y raster display device and a fine tuning support, wherein a lathe bed is provided with a ray instrument display and a grating ruler, the X-Y raster display device is arranged within a travel of the grinding machine in an X-Y movement direction, the turntable is provided with the special clamp, and a process for face grinding of the face grinding machine comprises the following main steps of: raw material fixation, centering, molecular arrangement and orientation, and grinding; the angle of the special clamp can be adjusted in two vertical directions, the grinding wheel is made of diamond, the surface roughness Ra of a grinded work piece is less than 0.8 mm, and the flatness of the grinded surface is +/-0.01 mm/2 inches. According to the invention, a complicated clamp is removed, and a method similar to on-line measurement is adopted, so that the processing precision and the processing efficiency are greatly improved, and meanwhile, the labor intensity of an operator is reduced.
Description
Technical field
The present invention relates to a kind of process equipment, relate in particular to a kind of grinding machine for sapphire crystal bar end face is processed, especially, the present invention also provides the method for utilizing this grinding machine to carry out the processing of sapphire crystal bar end face.
Background technology
Sapphire crystal is a kind of outstanding multifunctional material, has hardness height, high, the characteristics such as light transmission is good, electrical insulating property is excellent, stable chemical performance of fusing point, but typical difficult processing hard brittle material.
Cylindric sapphire material must be carried out fine grinding to its biend before section, make its rough surface and profile reach following requirement:
A. surface roughness reaches Ra0.8;
B. to parallel, its not parallel franchise is in 5 seconds at C for surface profile and sapphire molecules align.
Prior art is to utilize special fixture and x-ray instrument that the grinding state is fixed and adjusted to the sapphire crystal bar, then related anchor clamps place the Grinder bench face to carry out grinding, this technique has two shortcomings: behind twice clamping of the first, the precision that originally mixed up may change, it two is that anchor clamps add that crystal bar deadweight is not light, and operator's muscle power can not adapt to.
Summary of the invention
In order to solve problem and the deficiency that exists in the existing sapphire biend processing, the invention provides a kind of sapphire crystal bar face grinding machine, be used for cylindric sapphire crystal bar material end face is carried out fine grinding, the present invention also aims to provide a kind of processing method of sapphire crystal bar material end face.
The technical solution adopted in the present invention is as follows:
Sapphire crystal bar face grinding machine, primary structure comprises surface grinding machine, C is to direction finder, special fixture, rotating disk, X-Y grating display system and trimming rack, be provided with protective cover on the surface grinding machine table top, surface grinding machine one middle side part has a column, equipment has alpha cellulose a gage to show and grating scale on the lathe bed, C is to direction finder, the Y grating shows, trimming rack is installed on the grinding machine column, X-Y grating display system is installed within the stroke of the grinding machine X-Y direction of motion, emery wheel passes the bistrique frame and is installed on the interior electric machine main shaft of surface grinding machine, rotating disk is fixed on the grinding machine table top, is provided with special fixture on the rotating disk.
Described surface grinding machine, the emery wheel that this grinding machine is used are the diamond material.
Described C is to direction finder, comprise ray generator, ray receiver, direction finder and directional display, be loaded on grinder head column left side, be used for measuring sapphire crystal ingot molecules align direction, with the angle of adjustment workpiece planarization and grinding machine table top, thereby guarantee that the grinding in-plane reaches required requirement, utilize lift motor to realize fast lifting, when gage outfit and workpiece face near the time, can be by trimming hand wheel manual adjustments gage outfit height.
The combination of above-mentioned special fixture and rotating disk is used for clamping to be ground crystal ingot, utilizes x-ray instrument and rotating disk, but the accurate adjustment workpiece by the inclination angle of flat surface grinding, thereby reach the grinding requirement.
Above-mentioned X-Y grating display system, the demonstration of X-ray grid is installed on the lathe bed left surface, X-ray grid chi is installed on the protective cover bottom, the Y grating scale is installed on the lathe bed right flank, the grating display system is installed within the stroke of the grinding machine X-Y direction of motion, be used for seeking out the home position of cylinder crystal ingot, certainty of measurement is improved in the heart position so that the x-ray instrument gauge head is placed in one.
Above-mentioned trimming rack upper end is provided with lift motor, trimming hand wheel, x-ray instrument and gage outfit, and x-ray instrument and gage outfit can move up and down along fluctuating orbit.
A kind of present device of utilizing provided by the invention is carried out the technique that sapphire end is ground, main flow process comprise raw material fix, to center, directed, the grinding of molecules align, concrete steps are:
1) sapphire crystal bar blank utilization combination special fixture is fixed; Special fixture realizes that two dimension is adjustable, and its angle adjustment scope is 3 °～5 °, and special fixture is fixed on the rotating disk on the plane, and rotating disk is fixed on the Grinder bench;
2) to the center: utilize direction finder that workpiece is carried out the center, orientation can be transferred to parallel with the grinding machine table top direction of motion, utilize the original end face of wheel grinding, end face after grinding is must orientation parallel, take the end face parallel with molecules align as benchmark, the wafer that is cut into will meet its optical quality again;
3) molecules align is directed: utilize direction finder then orientation can be transferred to parallel with the grinding machine table top direction of motion with special fixture, utilize the original end face of wheel grinding, end face after grinding is must orientation parallel, take the end face parallel with molecules align as benchmark, the wafer that is cut into will meet its optical quality again; If α
1Be the angle of X ray and the formation of molecules align direction, α
2For the angle that molecules align direction behind the X ray reflection forms, work as α
1With α
2When equating, i.e. crystal bar grinding position adjustment is finished;
4) grinding, by emery wheel raw material is carried out grinding, sapphire crystal bar end face surface roughness should reach 0.8 after requiring grinding, cylindric sapphire crystal bar molecules align direction and original end face are not parallel, itself and original end face shape be α in an angle, require angle α angular error be not more than ± 5 ' (with the molecules align direction).
Above-mentioned special fixture adjustable angle all on two mutually perpendicular directions.
Above-mentioned emery wheel is the diamond material, and the grinding workpiece surface roughness can reach Ra＜0.8mm, is ground surface planarity to reach ± the 0.01mm/2 inch.
Compare with current technology, the present invention only needs clamped one time, and precision is high, has not only omitted complicated anchor clamps, and has changed light work worker's physical load.
The present invention is with organic reasonable combination of measuring instrument and machining tool, measuring instrument and special fixture are coordinated the associating use, adopt the method for similar on-line measurement, make that machining accuracy is more stable, working (machining) efficiency is greatly improved, greatly alleviated operator's labour intensity simultaneously.
Description of drawings
Fig. 1 is one embodiment of the invention structural representation;
Fig. 2 is the side view of Fig. 1;
Fig. 3 is molecules align orientation principle schematic diagram of the present invention.
The specific embodiment
Below in conjunction with drawings and Examples the present invention is further described
Among the figure: 1-lathe bed, 2-surface grinding machine table top, 3-rotating disk, 4-special fixture, the 5-crystal, 6-emery wheel, 7-column, 8-protective cover, the 90-Y grating shows that the 91-X grating shows that 92-X is to grating scale, and 93-Y is to grating scale, the 100-lift motor, 101-trimming hand wheel, 102-X alpha cellulose a gage, 103-gage outfit, 61-bistrique frame, 11-C be to direction finder, 110-X ray receiver, 111-X ray generator, 112-direction finder installing plate, 113-C be to direction finder, 114-directional display, α
1Be the angle of X ray and the formation of molecules align direction, α
2Angle for molecules align direction formation behind the X ray reflection.
Such as Fig. 1, embodiment illustrated in fig. 2, sapphire crystal bar face grinding machine, primary structure comprises surface grinding machine, C is to direction finder, rotating disk, X-Y grating display system and trimming rack, be provided with protective cover on the surface grinding machine table top, surface grinding machine one middle side part has a column, equipment has alpha cellulose a gage to show and grating scale on the lathe bed, C is to direction finder, the Y grating shows, trimming rack is installed on the grinding machine column, X-Y grating display system is installed within the stroke of the grinding machine X-Y direction of motion, emery wheel passes the bistrique frame and is installed on the interior electric machine main shaft of surface grinding machine, rotating disk is fixed on the grinding machine table top, is provided with special fixture on the rotating disk.
Described surface grinding machine, the emery wheel that this grinding machine is used are the diamond material.
Described C is to direction finder, comprise ray generator, ray receiver, direction finder and directional display, be loaded on grinder head column left side, be used for measuring sapphire crystal ingot molecules align direction, with the angle of adjustment workpiece planarization and grinding machine table top, thereby guarantee that the grinding in-plane reaches required requirement, utilize lift motor to realize fast lifting, when gage outfit and workpiece face near the time, can be by trimming hand wheel manual adjustments gage outfit height.
The combination of above-mentioned special fixture and rotating disk is used for clamping to be ground crystal ingot, utilizes x-ray instrument and rotating disk, but the accurate adjustment workpiece by the inclination angle of flat surface grinding, thereby reach the grinding requirement.
Above-mentioned X-Y grating display system, the demonstration of X-ray grid is installed on the lathe bed left surface, X-ray grid chi is installed on the protective cover bottom, the Y grating scale is installed on the lathe bed right flank, the grating display system is installed within the stroke of the grinding machine X-Y direction of motion, be used for seeking out the home position of cylinder crystal ingot, certainty of measurement is improved in the heart position so that the x-ray instrument gauge head is placed in one.
Above-mentioned trimming rack upper end is provided with lift motor, trimming hand wheel, x-ray instrument and gage outfit, and x-ray instrument and gage outfit can move up and down along fluctuating orbit.
A kind of technique of utilizing present device to carry out sapphire crystal bar end surface grinding provided by the invention, main flow process comprise raw material fix, to center, directed, the grinding of molecules align, concrete steps are:
1) sapphire crystal bar blank utilization combination special fixture is fixed; Special fixture realizes that two dimension is adjustable, and its angle adjustment scope is 3 °～5 °, and special fixture is fixed on the rotating disk on the plane, and rotating disk is fixed on the Grinder bench;
2) to the center: utilize C to direction finder raw material to be carried out the center, orientation can be transferred to parallel with the grinding machine table top direction of motion, utilize the original end face of wheel grinding, end face after grinding is must orientation parallel, take the end face parallel with molecules align as benchmark, the wafer that is cut into will meet its optical quality again;
3) molecules align is directed: utilize direction finder then orientation can be transferred to parallel with the grinding machine table top direction of motion with special fixture, utilize the original end face of wheel grinding, end face after grinding is must orientation parallel, take the end face parallel with molecules align as benchmark, the wafer that is cut into will meet its optical quality again; As shown in Figure 3, work as α
1With α
2When equating, i.e. crystal bar grinding position adjustment is finished, and can enter the grinding link;
4) grinding, by emery wheel raw material is carried out grinding, sapphire crystal bar end face surface roughness should reach 0.8 after requiring grinding, cylindric sapphire crystal bar molecules align direction and original end face are not parallel, itself and original end face shape be α in an angle, require angle α angular error be not more than ± 5 ' (with the molecules align direction).
Above-mentioned special fixture adjustable angle all on two mutually perpendicular directions.
Above-mentioned emery wheel is the diamond material, and the grinding workpiece surface roughness can reach Ra＜0.8, is ground surface planarity to reach ± the 0.01mm/2 inch.
Compare with current technology, the present invention only needs clamped one time, and precision is high, has not only omitted complicated anchor clamps, and has changed light work worker's physical load.
Claims (9)
1. sapphire crystal bar face grinding machine, comprise surface grinding machine on the structure, C is to direction finder, rotating disk, surface grinding machine one middle side part has a column, it is characterized in that, also comprise special fixture on the structure, X-Y grating display system and trimming rack, be provided with protective cover on the surface grinding machine table top, equipment has alpha cellulose a gage to show and grating scale on the lathe bed, C is to direction finder, the Y grating shows, trimming rack is installed on the grinding machine column, X-Y grating display system is installed within the stroke of the grinding machine X-Y direction of motion, emery wheel passes the bistrique frame and is installed on the interior electric machine main shaft of surface grinding machine, and rotating disk is fixed on the grinding machine table top, is provided with special fixture on the rotating disk.
2. sapphire crystal bar face grinding machine according to claim 1 is characterized in that, described surface grinding machine, the emery wheel that this grinding machine is used are the diamond material.
3. sapphire crystal bar face grinding machine according to claim 1, it is characterized in that, described C is to direction finder, comprise ray generator, ray receiver, direction finder and directional display, be loaded on grinder head column left side, be used for measuring sapphire crystal ingot molecules align direction, to adjust the angle of workpiece planarization and grinding machine table top, thereby guarantee that the grinding in-plane reaches required requirement, utilize lift motor to realize fast lifting, when gage outfit and workpiece face near the time, can be by trimming hand wheel manual adjustments gage outfit height.
4. according to sapphire crystal bar face grinding machine claimed in claim 1, it is characterized in that the combination of described special fixture and rotating disk be used for clamping to be ground crystal ingot, and in conjunction with utilizing x-ray instrument and rotating disk, the accurate adjustment workpiece is by the inclination angle of flat surface grinding.
5. according to sapphire crystal bar face grinding machine claimed in claim 1, it is characterized in that, the demonstration of X-ray grid is installed on the lathe bed left surface, X-ray grid chi is installed on the protective cover bottom, the Y grating scale is installed on the lathe bed right flank, the grating display system is installed within the stroke of the grinding machine X-Y direction of motion, seeks the home position of cylinder crystal ingot, x-ray instrument and the gauge head heart position that is placed in one.
6. according to sapphire crystal bar face grinding machine claimed in claim 1, it is characterized in that described trimming rack upper end is provided with lift motor, trimming hand wheel, x-ray instrument and gage outfit, x-ray instrument and gage outfit can move up and down along fluctuating orbit.
7. utilize invention equipment claimed in claim 1 to carry out the technique of sapphire crystal bar end surface grinding, it is characterized in that, main flow process comprise raw material fix, to center, directed, the grinding of molecules align, concrete steps are:
1) sapphire crystal bar blank utilization combination special fixture is fixed; Special fixture realizes that two dimension is adjustable, and its angle adjustment scope is 3 °～5 °, and special fixture is fixed on the rotating disk on the plane, and rotating disk is fixed on the Grinder bench;
2) to the center: utilize direction finder that workpiece is carried out the center, orientation can be transferred to parallel with the grinding machine table top direction of motion, utilize the original end face of wheel grinding, end face after grinding is must orientation parallel, take the end face parallel with molecules align as benchmark, the wafer that is cut into will meet its optical quality again;
3) molecules align is directed: utilize direction finder then orientation can be transferred to parallel with the grinding machine table top direction of motion with special fixture, utilize the original end face of wheel grinding, end face after grinding is must orientation parallel, take the end face parallel with molecules align as benchmark, establishes α again
1Be the angle of X ray and the formation of molecules align direction, α
2For the angle that molecules align direction behind the X ray reflection forms, work as α
1With α
2When equating, i.e. crystal bar grinding position adjustment is finished;
4) grinding, by emery wheel raw material is carried out grinding, the surface roughness of sapphire crystal bar end face should reach 0.8 after the requirement grinding, cylindric sapphire crystal bar molecules align direction and original end face are not parallel, itself and original end face shape be α in an angle, require angle α angular error be not more than ± 5 '.
8. utilize invention equipment claimed in claim 1 to carry out the technique of sapphire crystal bar end surface grinding according to claimed in claim 6, it is characterized in that, described special fixture adjustable angle all on two mutually perpendicular directions.
9. utilize invention equipment claimed in claim 1 to carry out the technique of sapphire crystal bar end surface grinding according to claimed in claim 6, it is characterized in that the grinding workpiece surface roughness can reach Ra＜0.8mm, ground surface planarity to reach ± the 0.01mm/2 inch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110201707.5A CN102886716B (en) | 2011-07-19 | 2011-07-19 | Sapphire ingot face grinding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110201707.5A CN102886716B (en) | 2011-07-19 | 2011-07-19 | Sapphire ingot face grinding machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102886716A true CN102886716A (en) | 2013-01-23 |
| CN102886716B CN102886716B (en) | 2016-02-24 |
Family
ID=47530500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110201707.5A Active CN102886716B (en) | 2011-07-19 | 2011-07-19 | Sapphire ingot face grinding machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102886716B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109227297A (en) * | 2018-11-19 | 2019-01-18 | 洛阳Lyc轴承有限公司 | Reduction process device and its processing method are beaten in the soft region of turntable bearing axial direction raceway |
| CN110405603A (en) * | 2019-08-19 | 2019-11-05 | 安吉圆磨机械科技有限公司 | A kind of carborundum crystals Special shaping all-in-one machine |
| CN110587428A (en) * | 2019-10-09 | 2019-12-20 | 青岛高测科技股份有限公司 | Device and method for calibrating center of Notch groove formed in semiconductor crystal bar |
| CN112873583A (en) * | 2021-03-09 | 2021-06-01 | 北京理工大学 | Low-damage processing method based on sapphire crystal orientation and processing direction synergistic principle |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4662124A (en) * | 1980-11-17 | 1987-05-05 | Tokyo Shibaura Denki Kabushiki Kaisha | Method of grinding a sapphire wafer |
| EP0802029A2 (en) * | 1996-04-16 | 1997-10-22 | HAUSER, Charles | Method for orienting plural single crystal rods on a support in view of cutting up the rods simultaneously in a cutting machine and device for carrying out the method |
| US6159284A (en) * | 1998-06-04 | 2000-12-12 | Wacker Siltronic Gesellschaft Fur Halbleitermaterialien Ag | Process and device for producing a cylindrical single crystal and process for cutting semiconductor wafers |
| RU2284073C1 (en) * | 2005-02-24 | 2006-09-20 | Михаил Викторович Варакин | Method for producing monocrystal wafers |
| CN101036973A (en) * | 2007-03-29 | 2007-09-19 | 上海大学 | Method and device for the on-line measuring roundness level of high-precision roller grinder and roller shape error |
| JP2011031387A (en) * | 2009-07-10 | 2011-02-17 | Mitsubishi Chemicals Corp | Crystal slicing method |
| CN102092004A (en) * | 2010-12-17 | 2011-06-15 | 上海机床厂有限公司 | Grinding-carriage feed system of numerical control grinder |
-
2011
- 2011-07-19 CN CN201110201707.5A patent/CN102886716B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4662124A (en) * | 1980-11-17 | 1987-05-05 | Tokyo Shibaura Denki Kabushiki Kaisha | Method of grinding a sapphire wafer |
| EP0802029A2 (en) * | 1996-04-16 | 1997-10-22 | HAUSER, Charles | Method for orienting plural single crystal rods on a support in view of cutting up the rods simultaneously in a cutting machine and device for carrying out the method |
| US6159284A (en) * | 1998-06-04 | 2000-12-12 | Wacker Siltronic Gesellschaft Fur Halbleitermaterialien Ag | Process and device for producing a cylindrical single crystal and process for cutting semiconductor wafers |
| RU2284073C1 (en) * | 2005-02-24 | 2006-09-20 | Михаил Викторович Варакин | Method for producing monocrystal wafers |
| CN101036973A (en) * | 2007-03-29 | 2007-09-19 | 上海大学 | Method and device for the on-line measuring roundness level of high-precision roller grinder and roller shape error |
| JP2011031387A (en) * | 2009-07-10 | 2011-02-17 | Mitsubishi Chemicals Corp | Crystal slicing method |
| CN102092004A (en) * | 2010-12-17 | 2011-06-15 | 上海机床厂有限公司 | Grinding-carriage feed system of numerical control grinder |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109227297A (en) * | 2018-11-19 | 2019-01-18 | 洛阳Lyc轴承有限公司 | Reduction process device and its processing method are beaten in the soft region of turntable bearing axial direction raceway |
| CN110405603A (en) * | 2019-08-19 | 2019-11-05 | 安吉圆磨机械科技有限公司 | A kind of carborundum crystals Special shaping all-in-one machine |
| CN110587428A (en) * | 2019-10-09 | 2019-12-20 | 青岛高测科技股份有限公司 | Device and method for calibrating center of Notch groove formed in semiconductor crystal bar |
| CN112873583A (en) * | 2021-03-09 | 2021-06-01 | 北京理工大学 | Low-damage processing method based on sapphire crystal orientation and processing direction synergistic principle |
| CN112873583B (en) * | 2021-03-09 | 2022-03-25 | 北京理工大学 | Low-damage processing method based on sapphire crystal orientation and processing direction synergistic principle |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102886716B (en) | 2016-02-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104084651B (en) | The processing method of linear module | |
| CN102248451B (en) | Relief angle adjustable device for automatic grinding of arc-edge diamond lathe tool | |
| CN105033839A (en) | Lithium niobate wafer grinding device with grinding pressure adjusting device and grinding method | |
| CN102886716B (en) | Sapphire ingot face grinding machine | |
| CN204214795U (en) | The directed sizing machine of the automatic X-ray of a kind of pole crystal | |
| CN103286401B (en) | Linear cut localization method | |
| JP2013141725A (en) | Grinding device | |
| CN206192272U (en) | Twin -lens cutter blade image measurement chamfered edge machine | |
| CN108161645B (en) | A kind of the workpiece rotation method grinding attachment and method of Low rigidity high precision plane mirror | |
| CN214080919U (en) | Grinding repair device and silicon rod processing equipment | |
| CN211277376U (en) | Special mechanism for finish machining of rudder sheet substrate | |
| CN105290701B (en) | High pointing accuracy plane finishing method based on measurement process integration | |
| CN200981169Y (en) | Oriented processing flat grinder | |
| CN217702673U (en) | A workstation guide rail grinding frock for flat grinder | |
| CN203109395U (en) | Linear cutting locating device | |
| CN102756335A (en) | High-precision efficient stepped grinding wheel dresser | |
| CN203471577U (en) | V-shaped support with adjustable inner-bore grinder pulling bus | |
| CN202685122U (en) | Sapphire workpiece adhering table | |
| CN211916356U (en) | Prism beveling device | |
| CN203765413U (en) | Precision machining device for diamond arc surface | |
| CN204438992U (en) | A kind of precision measurement apparatus of high precision verticality | |
| CN204471140U (en) | A kind of construction tile angle lap machine | |
| CN203843671U (en) | Horizontal spindle surface grinding machine with circular table | |
| CN102922374A (en) | Jig for grinding long-rod-like cutter | |
| CN113799013A (en) | Anchor clamps for mechanical maintenance |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |