CN115073793B - Graphene heat conducting film, preparation method thereof and heat conducting gasket - Google Patents
Graphene heat conducting film, preparation method thereof and heat conducting gasket Download PDFInfo
- Publication number
- CN115073793B CN115073793B CN202210939968.5A CN202210939968A CN115073793B CN 115073793 B CN115073793 B CN 115073793B CN 202210939968 A CN202210939968 A CN 202210939968A CN 115073793 B CN115073793 B CN 115073793B
- Authority
- CN
- China
- Prior art keywords
- graphene
- film
- graphene oxide
- heat conduction
- oxide slurry
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/06—Coating with compositions not containing macromolecular substances
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2323/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
- C08J2323/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
- C08J2323/04—Homopolymers or copolymers of ethene
- C08J2323/06—Polyethene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2323/00—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers
- C08J2323/02—Characterised by the use of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Derivatives of such polymers not modified by chemical after treatment
- C08J2323/10—Homopolymers or copolymers of propene
- C08J2323/12—Polypropene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2327/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers
- C08J2327/02—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment
- C08J2327/04—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment containing chlorine atoms
- C08J2327/06—Homopolymers or copolymers of vinyl chloride
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2327/00—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers
- C08J2327/02—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment
- C08J2327/12—Characterised by the use of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
- C08J2327/18—Homopolymers or copolymers of tetrafluoroethylene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
- C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/042—Graphene or derivatives, e.g. graphene oxides
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Abstract
The scheme discloses a graphene heat conducting film, a preparation method thereof and a heat conducting gasket, wherein the method comprises the following steps: a. coating graphene oxide slurry on the surface of a substrate; b. waiting for the surface layer of the coated graphene oxide slurry to be dried; c. providing holes and/or grooves which do not penetrate through the surface layer on the dried surface layer, and continuing to coat graphene oxide slurry on the dried surface layer; d. repeating the steps a-c, and drying all the graphene oxide slurry to obtain a graphene oxide film; e. and performing heat treatment on the graphene oxide film to obtain the graphene heat conduction film. The prepared graphene heat conduction film has a layered structure, the prepared graphene heat conduction film is controllable in thickness and layer number, and the prepared graphene heat conduction film cannot be scattered to form an integral structure.
Description
Technical Field
The invention relates to the technical field of heat conduction and heat dissipation materials, in particular to a graphene heat conduction film, a preparation method thereof and a heat conduction gasket.
Background
Along with development of technology, electronic devices with high requirements on heat dissipation, such as smart phones and notebook computers, need a heat conduction gasket with better heat dissipation, so as to reduce heat emitted by the interior of the electronic device and ensure normal operation of the device. With further improvement of heat dissipation requirements of electronic devices, requirements of the applied heat conducting gaskets are further improved.
The graphene heat-conducting film is one of excellent materials for preparing the heat-conducting gasket due to the excellent heat-conducting property. At present, two main processes for preparing the heat-conducting gasket by adopting the graphene heat-conducting film are adopted, namely the graphene heat-conducting film is connected by using an adhesive and is longitudinally stacked into a whole, and the heat-conducting gasket arranged along the thickness direction is adopted; secondly, the graphene heat conduction film is adhered to form an integral structure in the plane direction by using wrinkles and coating adhesives.
However, the graphene is easily layered inside, and the resulting graphene heat conductive gasket is easily cracked, because of the densified structure of the graphene heat conductive film, the inside of which is difficult to be immersed in a matrix material such as a polymer. In contrast, patent document CN112852159A, CN113147115A, CN113290958A, CN113510979a adopts a graphene foam film to prepare a heat-conducting gasket, and uses pores inside the graphene foam to fill high molecules, so as to achieve the effect of improving the internal binding force of the heat-conducting gasket. However, since the pores in the graphene foam film are mostly closed pores with smaller sizes, a great difficulty is added to the impregnation of matrix materials such as polymers, and only a small number of pores can be filled. Therefore, the obtained heat conduction gasket is always poor in mechanical property and easy to crack, and the wide application of the graphene heat conduction gasket is limited.
Disclosure of Invention
An object of the present invention is to provide a method for preparing a graphene heat-conducting film, wherein the prepared graphene heat-conducting film has a layered structure, the prepared thickness and the layer number are controllable, and the obtained graphene heat-conducting film cannot be scattered to form an integral structure.
Another object of the present disclosure is to provide a graphene heat conductive film prepared by the above method.
A third object of the present solution is to provide a thermally conductive gasket.
In order to achieve the above purpose, the scheme is as follows:
a preparation method of a graphene heat conduction film comprises the following steps:
a. coating graphene oxide slurry on the surface of a substrate;
b. waiting for the surface layer of the coated graphene oxide slurry to be dried;
c. providing holes and/or grooves which do not penetrate through the surface layer on the dried surface layer, and continuing to coat graphene oxide slurry on the dried surface layer;
d. repeating the steps a-c, and drying all the graphene oxide slurry to obtain a graphene oxide film;
e. and performing heat treatment on the graphene oxide film to obtain the graphene heat conduction film.
Preferably, the material of the base material is one or more of polyethylene terephthalate (PET), polypropylene (PP), polyethylene (PE), polyvinyl chloride (PVC), polytetrafluoroethylene (PTFE), copper foil, aluminum film and glass.
Preferably, the solid content of the graphene oxide slurry is 1wt.% to 10wt.%; preferably, the solid content of the graphene oxide slurry is 2wt.% to 8wt.%;
the solvent in the graphene oxide slurry is one or more of water, ethanol, methanol, N, N-Dimethylformamide (DMF), N-methylpyrrolidone (NMP), toluene, xylene, ethyl acetate and acetone;
the thickness of the coated graphene oxide slurry is 5-300 mu m; the thickness of the coated graphene oxide slurry is preferably 50 to 200 μm.
If the thickness of the single-coated graphene oxide slurry is less than 5 mu m, the dried film is too thin and is easy to crack; if the thickness of the single coating is more than 300. Mu.m, bubbles are easily generated inside.
Preferably, the drying temperature of the graphene oxide slurry is 40-150 ℃.
If the drying temperature is higher than 150 ℃, the drying is too fast, and the film is easy to crack.
Preferably, in the step c, holes and/or grooves which do not penetrate the surface layer are provided along the thickness direction of the graphene oxide film; the pore diameter of the pore is 10-40 mu m, preferably 50-200 mu m; the hole spacing of the holes is 500-2000 mu m, preferably 800-1200 mu m; the length of the groove is 200-8000 mu m, preferably 500-5000 mu m; the width of the groove is 20-1000 μm, preferably the width of the groove is 100-800 μm; the pitch of the grooves is 500 to 2000. Mu.m, preferably 800 to 1000. Mu.m.
If the size of the non-penetrating holes and/or the non-penetrating grooves is too small, the connection effect between the two adjacent graphene films is poor, the graphene films are easy to disperse, and the graphene films cannot form a whole; if the size of the non-penetrating holes and/or the non-penetrating grooves is too large, the delamination effect of the graphene film is not obvious.
Preferably, the heat treatment temperature in the step e is 2400 ℃ or higher, and preferably 2800 ℃ or higher.
In a second aspect, a graphene heat-conducting film is provided, the graphene heat-conducting film is prepared by any one of the preparation methods, the prepared graphene heat-conducting film contains multiple layers of graphene, every two adjacent layers of graphene of the multiple layers of graphene have a pore structure, and the pore structure is a hole and/or a groove which does not penetrate through the graphene layer; at least one through hole penetrating through the multilayer graphene layer is formed in the multilayer graphene layer;
the thickness of the graphene heat conduction film is 10-200 mu m, and the thickness of the graphene heat conduction film is 20-150 mu m preferably; the thickness of the graphene layer is 0.5-5 μm, and preferably the thickness of the graphene layer is 1-3 μm.
If the thickness of the graphene heat conduction film is less than 10 mu m, the graphene heat conduction film has poor mechanical properties and is easy to break; if the thickness of the graphene heat-conducting film is higher than 200 μm, the graphene heat-conducting film is easily curled and wrinkled, resulting in cracking.
If the thickness of the graphene layer is less than 0.5 μm, cracking is easily caused inside; if the thickness of the graphene layer is greater than 5 μm, the layering effect is not obvious, and the graphene layer is not easy to combine with matrix materials such as polymers during application.
The inside of the graphene heat conduction film provided by the application is formed by connecting a plurality of thin-layer graphene films, so that a plurality of larger pore structures are formed, and the pores inside the graphene heat conduction film of the structure are connected, so that matrix materials such as high polymers can be easily filled, and good binding force is realized. If the graphene thin layers are not connected, the graphene thin layers are scattered and cannot form a whole; if the internal pores are not connected, the polymer matrix material is difficult to fill due to the closed cell structure.
In a third aspect, a heat conducting gasket is provided, which is prepared from the graphene heat conducting film, and includes the following steps:
dipping a graphene heat conduction film in an adhesive;
stacking the impregnated graphene heat-conducting films layer by layer into blocks;
solidifying the obtained block;
cutting the blocks along the stacking direction to obtain the heat-conducting gasket.
In the impregnation step, the graphene film layers are impregnated with an adhesive.
In the curing step, heating curing or normal temperature curing is generally adopted, and the curing temperature is preferably 150 ℃ or lower.
When cutting, the cutting direction is cutting along the thickness direction of the stack; the cutting mode comprises wire cutting, laser cutting, ultrasonic cutting, blade cutting or freezing cutting; the thickness of the cut sheet is generally 0.1 to 5mm, preferably 0.25 to 2mm.
Preferably, the adhesive comprises one or more of epoxy resin, phenolic resin, furfural resin, polyurethane, acrylic resin and organic silica gel; preferably, the adhesive is an organic silica gel; more preferably the adhesive is a liquid silicone gel; the liquid silicone gum includes one or more of polydimethylsiloxane, dimethyldiphenylpolysiloxane, alpha, omega-dihydroxypolydimethylsiloxane, alpha, omega-divinyl polydimethylsiloxane, and alpha, omega-dihydroxypolymethyl3, 3-trifluoropropyl siloxane.
Preferably, the content of graphene in the heat conduction gasket is 25wt.% to 75wt.%; preferably, the graphene content is 35wt.% to 65wt.%.
The beneficial effects of this scheme are as follows:
the method can prepare the graphene heat-conducting film with the layered structure, wherein the thickness and the number of layers of the graphene heat-conducting film are controllable; prepared into
The graphene heat conducting film cannot be scattered to form an integral structure; when the prepared graphene heat-conducting film is used as a composite material reinforcement to prepare the heat-conducting gasket, a matrix material can be directly injected into a gap of the graphene heat-conducting film, so that the simple preparation of the composite material is realized, and the prepared heat-conducting gasket is better in compactness, higher in heat conductivity coefficient, better in compressibility and compression rebound resilience and wider in applicability.
Detailed Description
Embodiments of the present solution are described in further detail below. It is clear that the described embodiments are only some of the embodiments of the present solution, not an exhaustive list of all embodiments. It should be noted that, in the case of no conflict, the embodiments and features in the embodiments in the present solution may be combined with each other.
It should be understood that the term "and/or" as used herein is merely one relationship describing the association of the associated objects, meaning that there may be three relationships, e.g., a and/or B, may represent: a exists alone, A and B exist together, and B exists alone.
The application scene of the conventional graphene heat conduction film needs that the graphene heat conduction film is compact enough and does not delaminate, but the conventional graphene heat conduction film is often accompanied with the risk of delamination for various reasons, wherein the delamination refers to uncontrollable delamination inside the internal graphene heat conduction film and is often randomly divided into 2-3 layers.
The application discloses graphene heat conduction film, this graphene heat conduction film inside contains multilayer graphene layer, has both interconnect and has a plurality of pore structure between these graphene layers, and the connection between the graphene layer is realized through the hole that runs through in the setting between the graphene layer, and a plurality of pore structure between the graphene layer then is the hole and/or the groove that set up on the graphene layer and do not run through the graphene layer.
The graphene heat conduction film has a layered structure and can be divided into multiple layers through control; the thickness of each layer can be regulated and controlled through the thickness of each coating; at least one area for connecting the graphene layers is formed between two adjacent graphene layers, so that the integrity of the graphene heat conduction film is ensured, and the graphene heat conduction film is not easy to scatter.
The graphene heat conduction film prepared by the method has the advantages that the graphene heat conduction film is internally provided with a pore structure, so that matrix materials such as high polymers and the like can be easily filled, and good binding force between the high polymer materials and graphene is realized. And bonding and stacking the graphene heat-conducting films filled with the macromolecules layer by layer to form a composite block, and cutting the composite block into pieces along the stacking direction to obtain the graphene heat-conducting gasket. The graphene heat-conducting gasket prepared by the scheme has the advantages of high longitudinal heat-conducting property, good mechanical property and difficulty in cracking.
A preparation method of a graphene heat conduction film comprises the following steps:
a. coating graphene oxide slurry on the surface of a substrate;
b. waiting for the surface layer of the coated graphene oxide slurry to be dried;
c. providing holes and/or grooves which do not penetrate through the surface layer on the dried surface layer, and continuing to coat graphene oxide slurry on the dried surface layer;
d. repeating the steps a-c, and drying all the graphene oxide slurry to obtain a graphene oxide film;
e. and performing heat treatment on the graphene oxide film to obtain the graphene heat conduction film.
A preparation method of a heat conduction gasket comprises the following steps:
f. dipping a graphene heat conduction film in an adhesive;
g. stacking the impregnated graphene heat-conducting films layer by layer into blocks;
h. solidifying the obtained block;
i. cutting the blocks along the stacking direction to obtain the heat-conducting gasket.
In one embodiment, the substrate coated with the graphene oxide slurry is one or more of polyethylene terephthalate, polypropylene, polyethylene, polyvinyl chloride, polytetrafluoroethylene, copper foil, aluminum film and glass.
In one embodiment, the solid content of the graphene oxide slurry used for coating is 1wt.% to 10wt.%; the preferred graphene oxide slurry has a solids content of 2wt.% to 8wt.%, such as 2wt.%,2.5wt.%,3wt.%,3.5wt.%,4wt.%,4.5wt.%,5wt.%,5.5wt.%,6wt.%,6.5wt.%,7wt.%,7.5wt.%, or 8wt.%.
In one embodiment, the solvent used for dispersing graphene oxide in the graphene oxide slurry for coating is one or more of water, ethanol, methanol, N, N-dimethylformamide, N-methylpyrrolidone, toluene, xylene, ethyl acetate and acetone.
In one embodiment, the thickness of the coating is 5-300 μm when the graphene oxide slurry is coated; the thickness of the coating is preferably 50 to 200. Mu.m, such as 50. Mu.m, 55. Mu.m, 60. Mu.m, 65. Mu.m, 70. Mu.m, 75. Mu.m, 80. Mu.m, 85. Mu.m, 90. Mu.m, 95. Mu.m, 100. Mu.m, 110. Mu.m, 120. Mu.m, 130. Mu.m, 140. Mu.m, 150. Mu.m, 160. Mu.m, 170. Mu.m, 180. Mu.m, 190. Mu.m or 200. Mu.m.
In one embodiment, the coated graphene oxide slurry is dried at a temperature of 40 to 150 ℃.
In one embodiment, holes and/or grooves which do not penetrate through the surface layer of the dried graphene oxide slurry are arranged along the thickness direction of the graphene oxide film; the pores have a pore diameter of 10 to 40. Mu.m, preferably 50 to 200. Mu.m, such as 50. Mu.m, 55. Mu.m, 60. Mu.m, 65. Mu.m, 70. Mu.m, 75. Mu.m, 80. Mu.m, 85. Mu.m, 90. Mu.m, 95. Mu.m, 100. Mu.m, 110. Mu.m, 120. Mu.m, 130. Mu.m, 140. Mu.m, 150. Mu.m, 160. Mu.m, 170. Mu.m, 180. Mu.m, 190. Mu.m or 200. Mu.m.
In one embodiment, holes and/or grooves that do not penetrate the surface layer of the dried graphene oxide slurry are provided in the thickness direction of the graphene oxide film, and the hole pitch of the holes is 500 to 2000 μm, preferably the hole pitch of the holes is 800 to 1200 μm, such as 800 μm,900 μm,1000 μm,1100 μm or 1200 μm.
In one embodiment, holes and/or grooves that do not penetrate the surface layer of the dried graphene oxide slurry are provided in the thickness direction of the graphene oxide film, and the length of the opened grooves is 200 to 8000 μm, preferably 500 to 5000 μm, such as 500 μm,600 μm,700 μm,800 μm,900 μm,1000 μm,1500 μm,2000 μm,2500 μm,3000 μm,3500 μm,4000 μm,4500 μm or 5000 μm.
In one embodiment, holes and/or grooves that do not penetrate the surface layer of the dried graphene oxide slurry are provided in the thickness direction of the graphene oxide film, and the width of the opened grooves is 20 to 1000 μm, preferably the width of the grooves is 100 to 800 μm, such as 100 μm,200 μm,300 μm,400 μm,500 μm,600 μm,700 μm, or 800 μm.
In one embodiment, holes and/or grooves that do not penetrate the surface layer of the dried graphene oxide slurry are provided in the thickness direction of the graphene oxide film, the grooves are opened at a groove pitch of 500 to 2000 μm, preferably at a groove pitch of 800 to 1000 μm, such as 800 μm,850 μm,900 μm,950 μm or 1000 μm.
In one embodiment, the heat treatment temperature in step e is 2400 ℃ or higher, preferably the heat treatment temperature is 2800 ℃ or higher.
In one embodiment, the prepared graphene heat-conducting film contains multiple layers of graphene, and a pore structure is arranged between two adjacent layers of graphene of the multiple layers of graphene, wherein the pore structure is a hole and/or a groove which does not penetrate through the graphene layer; meanwhile, through holes penetrating through the multi-layer graphene layers are formed between the multi-layer graphene layers.
In one embodiment, the graphene thermal conductive film is produced to a thickness of 10 to 200 μm, preferably 20 to 150 μm, such as 20 μm,25 μm,30 μm,35 μm,40 μm,45 μm,50 μm,55 μm,60 μm,65 μm,70 μm,75 μm,80 μm,85 μm,90 μm,95 μm,100 μm,110 μm,120 μm,130 μm,140 μm or 150 μm.
In one embodiment, the graphene layer in the graphene thermal conductive film has a thickness of 0.5 to 5 μm, preferably 1 to 3 μm, such as 1 μm,1.1 μm,1.2 μm,1.3 μm,1.4 μm,1.5 μm,1.6 μm,1.7 μm,1.8 μm,1.9 μm,2.0 μm,2.1 μm,2.2 μm,2.3 μm,2.4 μm,2.5 μm,2.6 μm,2.7 μm,2.8 μm,2.9 μm or 3.0 μm.
In one embodiment, the adhesive used in step f comprises one or more of epoxy, phenolic, furfural, polyurethane, acrylic and silicone; preferably, the adhesive is an organic silica gel; more preferably the adhesive is a liquid silicone gel; the liquid silicone gum includes one or more of polydimethylsiloxane, dimethyldiphenylpolysiloxane, alpha, omega-dihydroxypolydimethylsiloxane, alpha, omega-divinyl polydimethylsiloxane, and alpha, omega-dihydroxypolymethyl3, 3-trifluoropropyl siloxane.
In one embodiment, the graphene layers of the graphene thermal conductive film are impregnated with an adhesive.
In one embodiment, the curing in step h is generally a thermal or ambient curing, preferably at a temperature of 150 ℃ or less.
In one embodiment, the cutting direction in step i is cutting in the thickness direction of the stack; the cutting mode is not limited, and wire cutting, laser cutting, ultrasonic cutting, blade cutting or freezing cutting are preferably adopted; the sheet thickness is generally 0.1 to 5mm, preferably 0.25 to 2mm.
The method is illustrated by the following specific examples.
In the application, liquid silica gel is used as an adhesive to prepare a heat-conducting gasket in each of the following examples and comparative examples, and in order to reflect the comparison effect, the thickness of a slice of each of the following examples is 1mm, and the application thermal resistance and compression rebound resilience of the slice are tested;
the thermal diffusivity of the graphene film was tested with reference to ASTM E1461; specific heat capacity of graphene films was tested with reference to ASTM E1269-2018; the density of the graphene film was tested with reference to GB 4472-1984; testing the thermal conductivity of the thermal pad under 40psi conditions, the applied thermal resistance (the sum of the intrinsic thermal resistance and the thermal contact resistance of the upper and lower surfaces) with reference to ASTM D5470; the thermal pad was tested for compression set elastic properties after 30 minutes at 50% strain with reference to ASTM D575. The thermal conductivity coefficient is calculated as follows:
the thermal conductivity of graphene having a lamellar void structure is calculated using the formula shown in formula (1):
K＝λ·C p ·ρ (1)
in the formula (1), the components are as follows,
k-coefficient of thermal conductivity, unit W/(m.K);
Λ -thermal diffusivity in mm 2 /s；
C p Specific heat capacity, unit J/kg/K;
Pi-Density in g/cm 3 。
The steps for preparing the graphene thermal pads in examples 1 to 5 are the same, except that the graphene film thickness, the graphene layer thickness, the solvent in the graphene oxide slurry, the substrate material, the solid content of the graphene oxide slurry, the dried surface layer of the coated graphene oxide slurry is provided with no matter the holes or grooves, the pore size and the groove size, and the hole spacing, the groove spacing, the drying temperature and the heat treatment temperature of the graphene oxide film.
The steps for preparing the graphene heat-conducting film in each example and comparative example are as follows:
a. coating graphene oxide slurry on the surface of a substrate;
b. waiting for the surface layer of the coated graphene oxide slurry to be dried;
c. providing holes and/or grooves which do not penetrate through the surface layer on the dried surface layer, and continuing to coat graphene oxide slurry on the dried surface layer;
d. repeating the steps a-c, and drying all the graphene oxide slurry to obtain a graphene oxide film;
e. and performing heat treatment on the graphene oxide film to obtain the graphene heat conduction film.
The procedure for preparing the thermally conductive gaskets for each example and comparative example is as follows:
f. dipping a graphene heat conduction film in an adhesive;
g. stacking the impregnated graphene heat-conducting films layer by layer into blocks;
h. solidifying the obtained block;
i. cutting the blocks along the stacking direction to obtain the heat-conducting gasket.
Example 1
In the embodiment, the thickness of a graphene heat conduction film is 10 μm, the thickness of a graphene layer in the graphene heat conduction film is 0.5 μm, a solvent in graphene oxide slurry is water, a base material is PET, the solid content of the graphene oxide slurry is 1 wt%, a non-penetrating groove with the length of 500 μm and the width of 100 μm is arranged on a dried surface layer of the coated graphene oxide slurry, the spacing between grooves is 500 μm, the drying temperature for forming the graphene oxide film is normal temperature, and the temperature for performing heat treatment on the graphene oxide film is 3000 ℃;
the liquid silica gel used for the heat conduction gasket is polydimethylsiloxane, and the mass percentage of graphene in the heat conduction gasket is 75wt.%.
Through testing, the performance of the graphene film is as follows:
coefficient of thermal diffusion: 493.13mm 2 /s；
Specific heat capacity: 0.71J/kg/K;
density: 0.34g/cm 3 ；
Thermal conductivity coefficient: 119.04W/(mK);
the properties of the obtained graphene heat conduction gasket are as follows:
thermal conductivity coefficient: 29.23W/(mK);
applying thermal resistance: 0.303K cm 2 /W；
Compression ratio: 70.13%;
compression spring rate: 73.02%.
Example 2
In the embodiment, the thickness of a graphene heat conduction film is 200 mu m, the thickness of a graphene layer in the graphene heat conduction film is 5 mu m, a solvent in graphene oxide slurry is ethanol, a base material is PP, the solid content of the graphene oxide slurry is 10 wt%, a non-penetrating groove with the length of 8000 mu m and the width of 800 mu m is arranged on a dried surface layer of the coated graphene oxide slurry, the spacing between grooves is 1000 mu m, the drying temperature for forming the graphene oxide film is normal temperature, and the temperature for performing heat treatment on the graphene oxide film is 2500 ℃;
the liquid silica gel used for heat conduction Dan Dianpian is polydimethylsiloxane, and the mass percentage of graphene in the heat conduction gasket is 25wt.%;
through testing, the performance of the graphene film is as follows:
coefficient of thermal diffusion: 453.23mm 2 /s；
Specific heat capacity: 0.74J/kg/K;
density: 0.30g/cm 3 ；
Thermal conductivity coefficient: 100.62W/(mK);
the properties of the obtained graphene heat conduction gasket are as follows:
thermal conductivity coefficient: 25.23W/(mK);
applying thermal resistance: 0.366K cm 2 /W；
Compression ratio: 82.50%;
compression spring rate: 83.22%.
Example 3
In the embodiment, the thickness of a graphene heat conduction film is 20 μm, the thickness of a graphene layer in the graphene heat conduction film is 1 μm, a solvent in graphene oxide slurry is methanol, a base material is PE, the solid content of the graphene oxide slurry is 2 wt%, non-penetrating holes with the diameter of 50 μm are formed in a dried surface layer of the coated graphene oxide slurry, the hole pitch is 800 μm, the drying temperature for forming the graphene oxide film is normal temperature, and the temperature for performing heat treatment on the graphene oxide film is 2500 ℃;
the liquid silica gel used by the heat conduction gasket is dimethyl diphenyl polysiloxane, and the mass percentage of graphene in the heat conduction gasket is 35wt.%;
through testing, the performance of the graphene film is as follows:
coefficient of thermal diffusion: 589.47mm 2 /s；
Specific heat capacity: 0.72J/kg/K;
density: 0.31g/cm 3 ；
Thermal conductivity coefficient: 131.56W/(mK);
the properties of the obtained graphene heat conduction gasket are as follows:
thermal conductivity coefficient: 37.23W/(mK);
applying thermal resistance: 0.291K cm 2 /W；
Compression ratio: 75.00%;
compression spring rate: 71.33%.
Example 4
In the embodiment, the thickness of the graphene heat conduction film is 90 μm, the thickness of the graphene layer in the graphene heat conduction film is 2 μm, the solvent in the graphene oxide slurry solvent is DMF, the substrate is PVC, the solid content of the graphene oxide slurry is 5 wt%, non-penetrating holes with the diameter of 120 μm are formed in the dried surface layer of the coated graphene oxide slurry, the hole spacing is 1000 μm, the drying temperature for forming the graphene oxide film is 80 ℃, and the temperature for performing heat treatment on the graphene oxide film is 3100 ℃;
the liquid silica gel used for the heat conduction gasket is alpha, omega-dihydroxyl polydimethylsiloxane, and the mass percentage of graphene in the heat conduction gasket is 50wt.%;
through testing, the performance of the graphene film is as follows:
coefficient of thermal diffusion: 747.22mm 2 /s；
Specific heat capacity: 0.71J/kg/K;
density: 0.32g/cm 3 ；
Thermal conductivity coefficient: 169.77W/(mK);
the properties of the obtained graphene heat conduction gasket are as follows:
thermal conductivity coefficient: 42.67W/(mK);
applying thermal resistance: 0.251K cm 2 /W；
Compression ratio: 77.12%;
compression spring rate: 80.07%.
Example 5
In the embodiment, the thickness of a graphene heat conduction film is 150 mu m, the thickness of a graphene layer in the graphene heat conduction film is 3 mu m, a solvent in graphene oxide slurry is toluene, a base material is PTFE, the solid content of the graphene oxide slurry is 8 wt%, non-penetrating holes with the diameter of 200 mu m are formed in a dried surface layer of the coated graphene oxide slurry, the hole pitch is 1200 mu m, the drying temperature for forming the graphene oxide film is 100 ℃, and the heat treatment temperature for the graphene oxide film is 3400 ℃;
the liquid silica gel used by the heat conduction gasket is alpha, omega-divinyl polydimethylsiloxane, and the mass percentage of graphene in the heat conduction gasket is 65wt.%;
through testing, the performance of the graphene film is as follows:
coefficient of thermal diffusion: 701.52mm 2 /s；
Specific heat capacity: 0.70J/kg/K;
density: 0.33g/cm 3 ；
Thermal conductivity coefficient: 162.05W/(mK);
the properties of the obtained graphene heat conduction gasket are as follows:
thermal conductivity coefficient: 40.13W/(mK);
application ofThermal resistance: 0.269K cm 2 /W；
Compression ratio: 76.22%;
compression spring rate: 77.51%.
Comparative example 1
In the comparative example, the thickness of the graphene heat conduction film is 90 mu m, the thickness of the graphene layer in the graphene heat conduction film is 2 mu m, the solvent in the graphene oxide slurry is DMF, the base material is PVC, the solid content of the graphene oxide slurry is 0.5 wt%, non-penetrating holes with the diameter of 120 mu m are arranged on the dried surface layer of the coated graphene oxide slurry, the hole spacing is 1000 mu m, the drying temperature for forming the graphene oxide film is 80 ℃, and the temperature for performing heat treatment on the graphene oxide film is 3100 ℃;
the liquid silica gel used for the heat conduction gasket is alpha, omega-dihydroxyl polydimethylsiloxane, and the mass percentage of graphene in the heat conduction gasket is 50wt.%;
through testing, the performance of the graphene film is as follows:
coefficient of thermal diffusion: 372.15mm 2 /s；
Specific heat capacity: 0.71J/kg/K;
density: 0.28g/cm 3 ；
Thermal conductivity coefficient: 73.98W/(mK);
the properties of the obtained graphene heat conduction gasket are as follows:
thermal conductivity coefficient: 19.79W/(mK);
applying thermal resistance: 0.375K cm 2 /W；
Compression ratio: 78.67%;
compression spring rate: 71.22%;
the solid content of the slurry is too low, the prepared graphene film is too thin and is easy to break in the stacking process, the prepared graphene heat conduction gasket is unstable in directional arrangement, and the heat conduction coefficient is low.
Comparative example 2
In the comparative example, the thickness of the graphene heat conduction film is 90 mu m, the thickness of the graphene layer in the graphene heat conduction film is 2 mu m, the solvent in the graphene oxide slurry is DMF, the base material is PVC, the solid content of the graphene oxide slurry is 25 wt%, non-penetrating holes with the diameter of 120 mu m are formed in the dried surface layer of the coated graphene oxide slurry, the hole spacing is 1000 mu m, the drying temperature for forming the graphene oxide film is 80 ℃, and the temperature for carrying out heat treatment on the graphene oxide film is 3100 ℃;
the liquid silica gel used for the heat conduction gasket is alpha, omega-dihydroxyl polydimethylsiloxane, and the mass percentage of graphene in the heat conduction gasket is 50wt.%;
through testing, the performance of the graphene film is as follows:
coefficient of thermal diffusion: 479.14mm 2 /s；
Specific heat capacity: 0.74J/kg/K;
density: 0.30g/cm 3 ；
Thermal conductivity coefficient: 106.37W/(mK);
the properties of the obtained graphene heat conduction gasket are as follows:
thermal conductivity coefficient: 25.31W/(mK);
applying thermal resistance: 0.343K cm 2 /W；
Compression ratio: 75.67%.
Compression spring rate: 73.22%;
the solid content of the slurry is too high, the prepared graphene film is too thick, the layering effect is not obvious, the bonding effect with the adhesive is poor in the prepared graphene heat conduction gasket, and the gasket is easy to crack.
Comparative example 3
In the comparative example, the thickness of the graphene heat conduction film is 90 mu m, the thickness of the graphene layer in the graphene heat conduction film is 2 mu m, the solvent in the graphene oxide slurry is DMF, the base material is PVC, the solid content of the graphene oxide slurry is 5 wt%, non-penetrating holes with the diameter of 120 mu m are formed in the dried surface layer of the coated graphene oxide slurry, the hole spacing is 1000 mu m, the drying temperature for forming the graphene oxide film is 80 ℃, and the heat treatment temperature for the graphene oxide film is 3100 ℃;
the liquid silica gel used for the heat conduction gasket is alpha, omega-dihydroxyl polydimethylsiloxane, and the mass percentage of graphene in the heat conduction gasket is 10wt.%;
through testing, the performance of the graphene film is as follows:
coefficient of thermal diffusion: 747.22mm 2 /s；
Specific heat capacity: 0.71J/kg/K;
density: 0.32g/cm 3 ；
Thermal conductivity coefficient: 169.77W/(mK);
the properties of the obtained graphene heat conduction gasket are as follows:
thermal conductivity coefficient: 12.36W/(mK);
applying thermal resistance: 0.495K cm 2 /W；
Compression ratio: 88.33%;
compression spring rate: 81.34%;
the graphene is low in proportion, the adhesive is high in proportion, and the heat conducting performance of the gasket is poor.
Comparative example 4
In the comparative example, the thickness of the graphene heat conduction film is 90 mu m, the thickness of the graphene layer in the graphene heat conduction film is 2 mu m, the solvent in the graphene oxide slurry is DMF, the base material is PVC, the solid content of the graphene oxide slurry is 5 wt%, non-penetrating holes with the diameter of 120 mu m are formed in the dried surface layer of the coated graphene oxide slurry, the hole spacing is 1000 mu m, the drying temperature for forming the graphene oxide film is 80 ℃, and the heat treatment temperature for the graphene oxide film is 3100 ℃;
the liquid silica gel used for the heat conduction gasket is alpha, omega-dihydroxyl polydimethylsiloxane, and the mass percentage of graphene in the heat conduction gasket is 90wt.%;
through testing, the performance of the graphene film is as follows:
coefficient of thermal diffusion: 747.22mm 2 /s；
Specific heat capacity: 0.71J/kg/K;
density: 0.32g/cm 3 ；
Thermal conductivity coefficient: 169.77W/(mK);
the adhesive content is too low, and the graphene heat conduction gasket is not formed.
In the embodiment of the invention, the liquid silica gel is used as a representative of the adhesive, and other types of adhesives are also suitable.
According to the embodiment 4 and the comparative examples 3 and 4, the higher the graphene content in the gasket, the better the thermal conductivity coefficient of the prepared graphene gasket, but the graphene content exceeds the preferred range, the lower the adhesive content, so that the prepared graphene thermal conductive film enhances the thermal conductive gasket, the insufficient internal binding force can cause cracking and delamination of the sample, even the sample is not molded, and the too high adhesive content can cause the poor performance of the prepared sample; according to example 4, comparative examples 1 and 2, too little solid content of the slurry may result in too thin graphene film, poor alignment of the prepared spacers, and insufficient heat conduction effect; the solid content is too high, the layering effect is not obvious, and the gasket is easy to crack. According to the embodiment, when each parameter satisfies the preferred range, the prepared graphene film and the graphene gasket reinforced by using the same have the best performance.
The graphene heat conducting film with the layered structure prepared by the method is used as the reinforcing material, the layered structure of the graphene heat conducting film is convenient for dipping and bonding between layers, so that the bonding force between the graphene heat conducting film and the matrix material is better, and the problems of easiness in cracking and layering of the graphene heat conducting film reinforced heat conducting gasket in practical application are greatly reduced.
Because the bonding agent can be fully impregnated between the graphene heat conducting films, the structure is more compact, and therefore the heat conducting gasket prepared from the graphene heat conducting films prepared by the application is excellent in compressibility and compression resilience performance.
It should be understood that the foregoing examples of the present invention are provided merely for clearly illustrating the present invention and are not intended to limit the embodiments of the present invention, and that various other changes and modifications may be made therein by one skilled in the art without departing from the spirit and scope of the present invention as defined by the appended claims.
Claims (19)
1. The preparation method of the graphene heat conduction film is characterized by comprising the following steps of:
a. coating graphene oxide slurry on the surface of a substrate, wherein the solid content of the graphene oxide slurry is 1-10 wt%;
b. waiting for the surface layer of the coated graphene oxide slurry to be dried;
c. setting holes and/or grooves which do not penetrate through the surface layer on the dried surface layer, and continuously coating graphene oxide slurry on the dried surface layer, wherein the hole diameter of the holes is 50-200 mu m, and the hole spacing of the holes is 500-2000 mu m; the length of the grooves is 200-8000 mu m, the width of the grooves is 20-1000 mu m, and the groove spacing between the grooves is 500-2000 mu m;
d. repeating the steps a-c, and drying all the graphene oxide slurry to obtain a graphene oxide film;
e. and carrying out heat treatment on the graphene oxide film to obtain a graphene heat conduction film, wherein the graphene heat conduction film contains multiple layers of graphene, connection between graphene layers is realized by arranging penetrating holes between graphene layers, the thickness of the graphene heat conduction film is 10-200 mu m, and the thickness of the graphene layer is 0.5-5 mu m.
2. The method according to claim 1, wherein the substrate is one or more of polyethylene terephthalate, polypropylene, polyethylene, polyvinyl chloride, polytetrafluoroethylene, copper foil, aluminum film and glass.
3. The method of claim 1, wherein the graphene oxide slurry has a solids content of 2wt.% to 8wt.%.
4. The preparation method according to claim 1, wherein the solvent in the graphene oxide slurry is one or more of water, ethanol, methanol, N-dimethylformamide, N-methylpyrrolidone, toluene, xylene, ethyl acetate and acetone.
5. The preparation method according to claim 1, wherein the thickness of the coated graphene oxide slurry is 5-300 μm.
6. The method according to claim 5, wherein the thickness of the coated graphene oxide slurry is 50 to 200 μm.
7. The preparation method of claim 1, wherein the drying temperature of the graphene oxide slurry is 40-150 ℃.
8. The method according to claim 1, wherein in step c, holes and/or grooves which do not penetrate the surface layer are provided in the thickness direction of the graphene oxide film; the hole spacing of the holes is 800-1200 mu m; the length of the groove is 500-5000 mu m; the width of the groove is 100-800 mu m; the groove spacing between the grooves is 800-1000 mu m.
9. The method according to claim 1, wherein the heat treatment temperature in the step e is 2400 ℃ or higher.
10. The production method according to claim 9, wherein the heat treatment temperature is 2800 ℃ or higher.
11. A graphene heat conducting film, characterized in that the graphene heat conducting film is prepared by the preparation method of any one of claims 1 to 10, the prepared graphene heat conducting film contains a plurality of layers of graphene, each two adjacent layers of graphene of the plurality of layers of graphene have a pore structure, and the pore structure is a hole and/or a groove which does not penetrate through a graphene layer; at least one through hole penetrating through the multilayer graphene layer is formed in the multilayer graphene layer;
the thickness of the graphene heat conduction film is 10-200 mu m; the thickness of the graphene layer is 0.5-5 mu m.
12. The graphene thermal conductive film according to claim 11, wherein the thickness of the graphene thermal conductive film is 20-150 μm.
13. The graphene thermal conductive film according to claim 11, wherein the thickness of the graphene layer is 1-3 μm.
14. A thermally conductive gasket, characterized by being prepared from the graphene thermally conductive film according to any one of claims 11-13, comprising the steps of:
dipping a graphene heat conduction film in an adhesive;
stacking the impregnated graphene heat-conducting films layer by layer into blocks;
solidifying the obtained block;
and cutting the blocks along the stacking direction to obtain the heat-conducting gasket, wherein the mass percentage of graphene in the heat-conducting gasket is 25-75 wt%.
15. The thermally conductive gasket of claim 14, wherein the adhesive comprises one or more of epoxy, phenolic, furfural, polyurethane, acrylic, and silicone.
16. The thermally conductive gasket of claim 15 wherein said adhesive is a silicone gel.
17. The thermally conductive gasket of claim 16 wherein said adhesive is a liquid silicone gel.
18. The thermally conductive gasket of claim 17 wherein said liquid silicone comprises one or more of polydimethylsiloxane, dimethyldiphenylpolysiloxane, α, ω -dihydroxypolydimethylsiloxane, α, ω -divinyl polydimethylsiloxane, and α, ω -dihydroxypolymethyl3, 3-trifluoropropyl) siloxane.
19. The thermally conductive gasket of claim 14, wherein the graphene is present in an amount of 35wt.% to 65wt.%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210939968.5A CN115073793B (en) | 2022-08-05 | 2022-08-05 | Graphene heat conducting film, preparation method thereof and heat conducting gasket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210939968.5A CN115073793B (en) | 2022-08-05 | 2022-08-05 | Graphene heat conducting film, preparation method thereof and heat conducting gasket |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN115073793A CN115073793A (en) | 2022-09-20 |
| CN115073793B true CN115073793B (en) | 2023-07-18 |
Family
ID=83244216
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210939968.5A Active CN115073793B (en) | 2022-08-05 | 2022-08-05 | Graphene heat conducting film, preparation method thereof and heat conducting gasket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN115073793B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116715231B (en) * | 2023-04-26 | 2024-01-30 | 中国科学院国家空间科学中心 | Method for transferring graphene film to grid |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05109947A (en) * | 1991-10-12 | 1993-04-30 | Sumitomo Special Metals Co Ltd | Heat conducting material and its manufacture |
| WO2018181802A1 (en) * | 2017-03-31 | 2018-10-04 | 太陽ホールディングス株式会社 | Curable resin composition, dry film, cured product, electronic component, and printed-wiring board |
| CN107973290A (en) * | 2017-11-24 | 2018-05-01 | 多凌新材料科技股份有限公司 | Elastic graphite alkene Heat Conduction Material and preparation method thereof |
| CN212781314U (en) * | 2020-06-09 | 2021-03-23 | 苏州苏大维格科技集团股份有限公司 | Heat dissipation optical stealth material and electronic product |
| CN113290958B (en) * | 2021-01-11 | 2023-10-27 | 常州富烯科技股份有限公司 | Graphene foam film reinforced heat conduction gasket and preparation method thereof |
| CN112852159B (en) * | 2021-01-11 | 2022-09-09 | 常州富烯科技股份有限公司 | Graphene composite foam film and preparation method thereof |
| CN113183544A (en) * | 2021-04-22 | 2021-07-30 | 常州富烯科技股份有限公司 | Heat-conducting gasket and preparation method thereof |
| CN113147115B (en) * | 2021-04-26 | 2023-05-16 | 常州富烯科技股份有限公司 | Heat conduction gasket and preparation method thereof |
| CN113510979B (en) * | 2021-07-15 | 2022-08-30 | 常州富烯科技股份有限公司 | Graphene composite heat conduction gasket and preparation method thereof |
| CN114512706B (en) * | 2021-12-24 | 2023-08-04 | 合肥国轩高科动力能源有限公司 | Lithium ion battery diaphragm slurry and lithium ion battery diaphragm |
| CN114703565B (en) * | 2022-04-21 | 2023-07-28 | 常州富烯科技股份有限公司 | Graphene fiber, graphene fiber reinforced heat conduction gasket and preparation method |
-
2022
- 2022-08-05 CN CN202210939968.5A patent/CN115073793B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN115073793A (en) | 2022-09-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109913185B (en) | Multilayer structure heat-conducting composite material containing heat-conducting film and preparation method thereof | |
| Wu et al. | Epoxy composites with high cross-plane thermal conductivity by constructing all-carbon multidimensional carbon fiber/graphite networks | |
| EP3885135B1 (en) | Thermal conductive sheet and method for manufacturing same | |
| CN113290958B (en) | Graphene foam film reinforced heat conduction gasket and preparation method thereof | |
| US10186472B2 (en) | Apparatus and methods for processing exfoliated graphite materials | |
| CN113147115B (en) | Heat conduction gasket and preparation method thereof | |
| CN115073793B (en) | Graphene heat conducting film, preparation method thereof and heat conducting gasket | |
| CN111589675B (en) | High-thermal-conductivity electromagnetic wave absorption composite sheet and preparation method thereof | |
| CN114703565B (en) | Graphene fiber, graphene fiber reinforced heat conduction gasket and preparation method | |
| CN112852159B (en) | Graphene composite foam film and preparation method thereof | |
| JP2009066817A (en) | Thermally-conductive sheet | |
| CN113556925B (en) | Heat conduction gasket and preparation method thereof | |
| An et al. | The polymer-based thermal interface materials with improved thermal conductivity, compression resilience, and electromagnetic interference shielding performance by introducing uniformly melamine foam | |
| Liu et al. | Three-dimensional network of hexagonal boron nitride filled with polydimethylsiloxane with high thermal conductivity and good insulating properties for thermal management applications | |
| CN115850968A (en) | MXene-based high-thermal-conductivity fireproof composite film and preparation method and application thereof | |
| Zeng et al. | Carbon aerogel with high thermal conductivity enabled by shrinkage control | |
| Wang et al. | Highly thermally conductive polymer composite enhanced by constructing a dual thermal conductivity network | |
| Miao et al. | Self-Stacked 3D Anisotropic BNNS Network Guided by Para-Aramid Nanofibers for Highly Thermal Conductive Dielectric Nanocomposites | |
| CN1273289C (en) | Process for preparing high performance copper-clad polytetrafluoroethylene plate | |
| He et al. | Substantial improvement of thermal conductivity and mechanical properties of polymer composites by incorporation of boron nitride nanosheets and modulation of thermal curing reaction | |
| CN115092920B (en) | Graphene heat conduction gasket and preparation method thereof | |
| US4784893A (en) | Heat conductive circuit board and method for manufacturing the same | |
| CN115159511B (en) | Graphene material, preparation method thereof and heat conduction gasket | |
| Wu et al. | Construction of three-dimensional interconnected boron nitride/sliver networks within epoxy composites for enhanced thermal conductivity | |
| Zhu et al. | Research Progress in Thermal Conductivity of Polymer Matrix Composites |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |