CN115050908A

CN115050908A - Display panel and manufacturing method thereof

Info

Publication number: CN115050908A
Application number: CN202210653806.5A
Authority: CN
Inventors: 倪晶
Original assignee: Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Current assignee: Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date: 2022-06-09
Filing date: 2022-06-09
Publication date: 2022-09-13
Anticipated expiration: 2042-06-09
Also published as: CN115050908B

Abstract

The invention provides a display panel and a manufacturing method thereof, wherein the display panel comprises: a substrate; a display device on the substrate; an encapsulation layer on the display device; the display panel further comprises a non-cutting road area and a cutting road area positioned on the outer side of the non-cutting road area, and the cutting road area is provided with a groove structure. Through setting up groove structure in the cutting street region, when adopting two processes of cutting of module to cut the panel, can cut the crackle that produces because the cutting, the crackle that produces when avoiding the cutting extends to the display area, meanwhile, strengthens the encapsulation effect of panel to improve the yield and the reliability of panel.

Description

Display panel and manufacturing method thereof

[ technical field ] A

The invention relates to the technical field of display, in particular to a display panel and a manufacturing method thereof.

[ background of the invention ]

Organic Light Emitting Diode (OLED) display panels have received great attention from both academic and industrial fields due to their great potential for development in the direction of solid state lighting and flat panel displays. Also, since OLED display panels can be made lighter and thinner, OLED display technology will be a future development trend. Materials of a flexible substrate in the OLED display panel are usually PI (polyimide) and the like, a thin film transistor is arranged on the flexible substrate, and light emitting regulation and control of an OLED device are achieved through signal control. The OLED device is further coated with an encapsulation layer comprising an inorganic film layer and an organic film layer which are overlapped, so that water oxygen protection is achieved. The packaging layer is covered with a touch layer to realize the touch function of the display panel.

In the manufacturing process of the OLED display panel, a plurality of OLED display panels need to be manufactured on a mother board, and after each OLED display panel is packaged, each OLED display panel is cut along a cutting line (that is, a module secondary cutting process is adopted to cut a screen body), so that a display panel (panel) with a corresponding size is formed. The inorganic film layer is arranged in the packaging layer, and the inorganic film layer is excellent in waterproof and oxygen-proof performance, but is brittle, and after a module secondary cutting process is adopted or when a rear-section module and an arc edge are bent, microcracks are easily generated, and the cracks even extend into the interior of the screen body (such as a display area of a panel), so that the packaging effect is influenced.

Therefore, the prior art has defects and needs to be improved and developed.

[ summary of the invention ]

The invention provides a display panel and a manufacturing method thereof, which are used for improving the water and oxygen isolation capability of the display panel so as to improve the yield and the reliability of the panel.

In order to solve the above problems, the present invention provides a display panel including: a substrate; a display device on the substrate; an encapsulation layer on the display device; the display panel further comprises a non-cutting road area and a cutting road area positioned on the outer side of the non-cutting road area, and the cutting road area is provided with a groove structure.

The packaging layer comprises a first inorganic packaging layer, an organic packaging layer and a second inorganic packaging layer which are stacked on the display device, wherein the first inorganic packaging layer and/or the second inorganic packaging layer cover at least part of the cutting path area.

The display panel further comprises a touch layer, the touch layer is located on the packaging layer, and the touch layer covers the cutting channel area.

The substrate comprises a first organic layer, an inorganic layer and a second organic layer which are arranged in a stacked mode, and the groove structure penetrates through the second organic layer and is connected with the inorganic layer.

The distance between the groove structure and the outer edge of the cutting path area in the first direction is 0-120um, and the first direction is parallel to the substrate.

Wherein, groove structure's width is greater than 5um, and groove structure's degree of depth scope is 1-20 um.

Wherein, groove structure's quantity is a plurality of, and two adjacent groove structure interval on first direction are greater than 10um to and/or a plurality of groove structure have different depths, and first direction is the direction parallel with the base plate.

In order to solve the above problem, the present invention further provides a method for manufacturing a display panel, including: providing a substrate, wherein the substrate comprises a cutting channel area and a non-cutting channel area; forming a groove in the cutting path region; forming a display device on the substrate, wherein part of a film layer of the display device is positioned in the groove to form a first sub-groove structure; forming an encapsulation layer on the display device, wherein part of the film layer of the encapsulation layer is positioned in the groove to form a second sub-groove structure; wherein, the groove structure comprises a first sub-groove structure and a second sub-groove structure.

The substrate comprises a first organic layer, an inorganic layer and a second organic layer, and the step of forming the groove further comprises the step of forming the groove to penetrate through the second organic layer and be connected with the inorganic layer.

The step of forming the display device specifically includes:

forming an array layer on a substrate;

forming a pixel defining layer on the array layer;

wherein the step of forming the display device further comprises forming a planarization layer on the array layer, the step of forming the recess being prior to the step of forming the pixel defining layer, or the step of forming the recess being prior to the step of forming the planarization layer.

The beneficial effects of the invention are: different from the prior art, the invention provides a display panel and a manufacturing method thereof, wherein the display panel comprises: a substrate; a display device on the substrate; an encapsulation layer on the display device; the display panel further comprises a non-cutting road area and a cutting road area positioned on the outer side of the non-cutting road area, and the cutting road area is provided with a groove structure. Through setting up groove structure in the cutting road district, when adopting module two to cut technology to cut the panel, can cut because the crackle that the cutting produced, the crackle that produces when avoiding the cutting extends to the display area, meanwhile, strengthens the encapsulation effect of panel to improve the yield and the reliability of panel.

[ description of the drawings ]

Fig. 1 is a schematic structural diagram of a display panel according to an embodiment of the present invention;

FIG. 2 is a schematic structural diagram of a first embodiment of the present invention, including a groove structure;

FIG. 3 is a schematic structural diagram of a structure including a groove structure according to a second embodiment of the present invention;

FIG. 4 is a schematic structural diagram of a third embodiment of the present invention, including a groove structure;

fig. 5 is a schematic flow chart of a display panel according to an embodiment of the present invention.

[ detailed description ] A

The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be noted that the following examples are only illustrative of the present invention, and do not limit the scope of the present invention. Likewise, the following examples are only some but not all examples of the present invention, and all other examples obtained by those skilled in the art without any inventive step are within the scope of the present invention.

Furthermore, the terms first, second, third, etc. as used herein may be used to describe various elements, but these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first species may be termed a second species, and, similarly, a second species may be termed a first species, without departing from the scope of the present application. Accordingly, the terminology used is for the purpose of describing and understanding the invention and is not intended to be limiting of the invention. In the various figures, elements of similar structure are identified by the same reference numerals. For purposes of clarity, the various features in the drawings are not drawn to scale. Moreover, some well-known elements may not be shown in the figures.

In addition, in the various figures, elements of similar structure are identified by the same reference numerals. When an element is described as being "connected to" another element, it can be directly "connected" or indirectly "connected" to the other element through an intermediate element.

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is further described in detail below with reference to the accompanying drawings.

As shown in fig. 1, the present invention provides a display panel including: a substrate 110; a display device (not shown in the drawings) on the substrate 110; an encapsulation layer 120 on the display device; the display panel further includes a non-scribe line region a1 and a scribe line region a2 located outside the non-scribe line region a1, and the scribe line region a2 is provided with a groove structure 130.

In addition, it should be noted that fig. 1 only shows the structure related to the content of the embodiment of the present invention, and the display panel of the present invention may further include other components and/or structures for realizing the complete function of the display panel.

Specifically, the substrate 110 may be a glass substrate 110, and may also include the glass substrate 110 and one or more thin films disposed on the glass substrate 110. Wherein, one or more layers of the film can be a conductive film and/or a functional film. In addition, the substrate 110 may be a flexible substrate 110, and in general, the material of the flexible substrate 110 may include PI (polyimide). Wherein, the display panel (not shown in the figures) has a non-scribe line region a1 and a scribe line region a2, and the scribe line region a2 may be disposed around the non-scribe line region a1, that is, the scribe line region a2 is disposed outside the non-scribe line region a 1. The non-scribe lane area a1 generally includes a display area (not shown) and a non-display area (e.g., a frame area, not shown). Cut lines C1-C1(cutting lines) are marked at the intersection of the dicing lane region a2 and the non-dicing lane region a1 for cutting along the cut lines C1-C1 to finally form a panel. Among them, the display device is not particularly limited, and the display device may be an OLED display device. Wherein, when the display device is an OLED display device, the display panel may be a flexible OLED display panel.

In addition, as shown in fig. 1, the display device may include an array layer 140 on the substrate 110, a pixel defining layer 150(PDL) on the array layer 140, and a planarization layer 160 (PLN). In addition, the display device may further include an anode layer, a light emitting layer, a cathode layer (not shown in the figures), and the like, which are not described in detail since they are not the invention points of the embodiments of the present invention.

In addition, the cross-sectional shape of the groove structure 130 is not particularly limited, and the cross-sectional shape of the groove structure 130 in a plane (XZ plane) perpendicular to the substrate 110 may be a triangle, an inverted trapezoid, an ellipse, or a rectangle, or may be a combination of at least two of a triangle, an inverted trapezoid, an ellipse, and a rectangle.

In particular, Organic Light Emitting Diode (OLED) display panels have received great attention from academia and industry because they have great potential for development in the direction of solid state lighting and flat panel display. Also, since OLED display panels can be made lighter and thinner, OLED display technology will be a future development trend. Materials of a flexible substrate in the OLED display panel are usually PI (polyimide) and the like, a thin film transistor is arranged on the flexible substrate, and light emitting regulation and control of an OLED device are achieved through signal control. The OLED device is further coated with an encapsulation layer 120 comprising an inorganic film layer and an organic film layer which are overlapped so as to realize water oxygen protection. The packaging layer 120 is covered with a touch film layer to implement a touch function of the display panel.

In the manufacturing process of the OLED display panel, a plurality of OLED display panels need to be prepared on a motherboard, and after each OLED display panel is packaged, each OLED display panel is cut along a cutting line (for example, a module binary cutting process is used to cut a panel body), so as to form a panel (panel) with a corresponding size. The inorganic film layer is provided in the encapsulation layer 120, and the inorganic film layer has excellent water and oxygen resistance, but is brittle, and after a module secondary cutting process is adopted, or when a rear-section module and an arc edge are bent, microcracks are easily generated, and the generated cracks even extend into the screen body, so that the encapsulation effect is affected.

Therefore, by adopting the display panel of the embodiment of the invention, the groove structure 130 is arranged in the cutting street area A2, when the panel is cut by adopting the module double-cutting process, cracks generated by cutting can be cut off, the cracks generated during cutting are prevented from extending towards the display area, and meanwhile, the packaging effect of the panel is enhanced, so that the yield and the reliability of the panel are improved. In addition, on the basis of ensuring the display performance and the product yield of the display panel, the frame width of the display panel is greatly reduced, and the screen occupation ratio of the display panel is effectively improved, so that the display panel provided by the embodiment of the invention can be applied to products such as narrow frames.

The substrate 110 includes a first organic layer 111, an inorganic layer 112, and a second organic layer 113 stacked on each other, and the groove structure 130 passes through the second organic layer 113 and is connected to the inorganic layer 112.

Specifically, the groove structure 130 is connected with the inorganic layer 112, so that the slopes and bottoms of the inorganic layer 112 and the groove structure 130 are overlapped to form a complete packaging region, water and oxygen invasion can be blocked, the water and oxygen invasion path is prolonged, and the packaging effect is more facilitated.

The encapsulation layer 120 includes a first inorganic encapsulation layer 121, an organic encapsulation layer 122, and a second inorganic encapsulation layer 123 stacked on the display device, where the first inorganic encapsulation layer 121 and/or the second inorganic encapsulation layer 123 cover at least a portion of the scribe line region a 2.

Specifically, the defects of the traditional packaging technology can be overcome through the thin film packaging technology, the packaging cover plate and the frame glue are not needed to be used for packaging the OLED display device, the traditional glass packaging is replaced by the thin film packaging, the large-size OLED display device can be packaged, and the OLED display panel is light and thin. So-called thin film encapsulation is to form an inorganic and organic alternating layer on the surface of the OLED to block water and oxygen by depositing a thin film. The main components of the first inorganic encapsulation layer 121 and the second inorganic encapsulation layer 123 are silicon oxide, silicon nitride, etc., which are effective barrier layers for water/oxygen, but some pinholes or foreign defects may be generated in the process of preparing the inorganic encapsulation layers, and the organic encapsulation layer 122 (the main components are high molecular polymers, resins, etc.) serves to cover the defects of the inorganic encapsulation layers, so as to achieve planarization, release stress between the inorganic encapsulation layers, and achieve flexible encapsulation. The organic encapsulation layer 122 is formed mainly by inkjet printing (IJP). Accordingly, the encapsulation layer 120 may include a first inorganic encapsulation layer 121, an organic encapsulation layer 122, and a second inorganic encapsulation layer 123 stacked on the display device, wherein the first inorganic encapsulation layer 121 and/or the second inorganic encapsulation layer 123 may cover at least a portion of the scribe line region a 2. For example, the first inorganic encapsulation layer 121 and/or the second inorganic encapsulation layer 123 cover a portion of the scribe line region a 2. For example, the first inorganic encapsulation layer 121 and/or the second inorganic encapsulation layer 123 completely cover a portion of the scribe line region a 2. When the first inorganic encapsulation layer 121 and/or the second inorganic encapsulation layer 123 completely cover a portion of the scribe lane region a2, the groove structure 130 includes a portion of the first inorganic encapsulation layer 121 and/or the second inorganic encapsulation layer 123.

In general, the inorganic encapsulation layers (e.g., the first inorganic encapsulation layer 121 and the second inorganic encapsulation layer 123) are formed by patterning a metal mask, and the metal mask cannot achieve a zero gap when contacting the substrate 110, so that a certain range of shadows (shadow) may be generated in an edge region of the non-scribe line region a1 close to the scribe line region a2, and when the shadows are located in the scribe line region a2, the formed inorganic encapsulation layers are prone to crack. In the embodiment of the present invention, by providing the groove structure 130 in the scribe lane area a2, when the panel is cut by the die-set double-cut process, cracks generated by cutting can be cut off, and the cracks generated during cutting are prevented from extending toward the display area, so that a part of the inorganic encapsulation layer can be retained in the scribe lane area a2, or the inorganic encapsulation layer located in the scribe lane area a2 can be removed without using patterning (i.e., the inorganic encapsulation layer completely covers the scribe lane area a 2). Compared with the prior art, the embodiment of the invention improves the problem of cracks, reduces the process steps of patterning treatment, correspondingly reduces masks (also called as light covers), and reduces the production cost and the process steps. Meanwhile, the inorganic packaging layer completely covers all the areas, and the extension of the packaging effective area can be realized.

The display panel further includes a touch layer 170, the touch layer 170 is disposed on the encapsulation layer 120, and the touch layer 170 covers the scribe line area a 2.

Specifically, the display panel further includes a touch layer 170, and the touch layer 170 may be located in the non-scribe area a1 for implementing a touch function of the display panel. In addition, the touch layer 170 may cover the entire scribe line region a2, that is, the touch layer 170 may be formed in the non-scribe line region a1 and the scribe line region a2 by a deposition process, and the touch layer 170 located in the scribe line region a2 is removed without performing a patterning process. In the prior art, if the touch layer 170 covers the non-scribe area a1 and the scribe area a2, when the panel is diced by the die-set dicing process, cracks generated by dicing easily extend toward the display area, which affects the touch effect of the panel, so the touch layer 170 is only located in the non-scribe area a 1. In the prior art, the touch layer 170 may be formed by forming a layer of touch material on the encapsulation layer 120, the touch material covering the non-scribe area a1 and the scribe area a2, and then removing the touch material in the scribe area a2 through a patterning process to form the touch layer 170. In the embodiment of the invention, the groove structure 130 is disposed in the scribe line region a2, so that when the panel is cut by the module double-cut process, cracks generated by cutting can be cut off, and the cracks generated during cutting are prevented from extending toward the display region, and therefore, the touch layer 170 in the scribe line region a2 can be removed without using patterning. Compared with the prior art, the embodiment of the invention reduces the process steps of patterning treatment, correspondingly reduces the mask, and reduces the production cost and the process steps. Meanwhile, the touch layer 170 completely covers all the areas (such as the non-dicing-lane area a1 and the dicing-lane area a2), so that the extension of the package active area can be realized. It is understood that the groove structure 130 includes a portion of the touch layer 170 when the touch layer 170 covers all areas (such as the non-scribe area a1 and the scribe area a2) completely.

The distance a between the groove structure 130 and the outer edge of the scribe line region a2 in the first direction is 0-120um, and the first direction is parallel to the substrate 110.

Specifically, in order to ensure the strength and reliability of the display panel after the panel is cut by the die-set binary cutting process, the distance a between the groove structure 130 and the outer edge of the scribe line region a2 in the first direction (X direction) is in the range of 0-120 um. The first direction is a direction parallel to the substrate 110, and is similar to the first direction, and will not be described again.

Wherein, the width c of the groove structure 130 is greater than 5um, and the depth h range of the groove structure 130 is 1-20 um.

Specifically, in order to ensure that when the panel is cut by the module double-cutting process, the cracks generated by cutting are cut off, the effect that the cracks generated by cutting extend towards the display area is avoided, and the strength and reliability of the display panel after the panel is cut by the module double-cutting process are ensured, the width c of the groove structure 130 is greater than 5um, and the depth h of the groove structure 130 ranges from 1 um to 20 um. As shown in fig. 2, the cross-sectional shape of the groove structure 130 is a triangle, and the width c of the groove structure is greater than 5 um.

The number of the groove structures 130 is plural, the distance b between two adjacent groove structures 130 in the first direction is greater than 10um, and/or the groove structures 130 have different depths, and the first direction is parallel to the substrate 110.

Specifically, the number of the grooves 131 may be multiple, and in order to ensure the strength and reliability of the display panel after the panel is cut by the module double-cutting process, the distance b between two adjacent groove structures 130 in the first direction (X direction) is greater than 10 um.

The cross-sectional shape of the groove structure 130 may be a triangle, an inverted trapezoid, an ellipse, or a rectangle. As shown in fig. 2, a schematic structural diagram including a groove structure 130 is provided for the first embodiment of the present invention. As can be seen from fig. 2, the cross-sectional shape of the groove structure 130 in the XZ plane is triangular. In the display panel provided in the first embodiment of the present invention, the number of the groove structures 130 may be multiple. As shown in fig. 3, a schematic structural diagram including a groove structure 130 is provided for the second embodiment of the present invention. As can be seen from fig. 3, the cross-sectional shape of the groove structure 130 in the XZ plane is an inverted trapezoid, and the minimum width d of the groove structure 130 is greater than 5 um. In the display panel provided in the second embodiment of the present invention, the number of the groove structures 130 may be multiple. Fig. 4 is a schematic structural diagram of a third embodiment of the present invention, including a groove structure 130. As can be seen from fig. 4, the cross-sectional shape of the groove structure 130 in the XZ plane is an inverted trapezoid, and the minimum width d of the groove structure 130 is greater than 5 um. In the display panel provided in the third embodiment of the present invention, the number of the groove structures 130 may be multiple, and the groove structures 130 may have different depths. In addition, when the number of the groove structures 130 is plural, the depths of the plural groove structures 130 may be the same or different, and are not particularly limited.

Based on the display panel described in the above embodiment of the present invention, the present invention further provides a manufacturing method of a display panel, as shown in fig. 5, the manufacturing method of a display panel includes:

s101, a step: providing a substrate 110, wherein the substrate 110 comprises a dicing channel area A2 and a non-dicing channel area A1;

s102, a step: forming grooves 131 in the scribe lane regions a 2; forming a display device on the substrate 110, wherein a part of the film layer of the display device is partially located in the groove 131 to form a first sub-groove structure (not shown in the figure);

s103, a step: forming an encapsulation layer 120 on the display device, wherein part of the film layer of the encapsulation layer 120 is located in the groove 131 to form a second sub-groove structure (not shown in the figure); wherein the groove structure 130 includes a first sub-groove structure and a second sub-groove structure.

The step of forming the display device specifically includes:

forming an array layer 140 on the substrate 110;

forming a pixel defining layer 150 on the array layer 140; wherein the step of forming the display device further includes forming a planarization layer 160 on the array layer 140, and the step of forming the recess 131 is before the step of forming the pixel defining layer 150, or the step of forming the recess 131 is before the step of forming the planarization layer 160.

Specifically, the display panel may be manufactured by providing a substrate 110, wherein the substrate 110 includes a scribe line region a2 and a non-scribe line region a 1. Then, a portion of the substrate 110 may be partially etched away in the scribe lane regions a2 by a laser technique, and the grooves 131 may be formed in the substrate 110. Then, a display device is formed on the substrate 110, and one or more layers formed during the process of forming the display device may also be formed in the scribe lane region a2, for example, when the array layer 140 (i.e., array composite layer) is formed in the non-scribe lane region a1 by a deposition process, the array layer 140 may also be formed in the scribe lane region a2, that is, a part of the array layer 140 is located on the inner wall of the groove 131, and the array layer 140 located on the inner wall of the groove 131 forms a first sub-groove structure; after the display device is formed, in order to isolate moisture, an encapsulation layer 120 may be formed on the display device, and in general, the encapsulation layer 120 includes a first inorganic encapsulation layer 121, an organic encapsulation layer 122 and a second inorganic encapsulation layer 123, and one or more layers of films formed during the formation of the encapsulation layer 120 may also be formed in the scribe lane region a2, for example, when the first inorganic encapsulation layer 121 and the second inorganic encapsulation layer 123 are formed in the non-scribe lane region a1 by a deposition process, the first inorganic encapsulation layer 121 and the second inorganic encapsulation layer 123 may also be formed in the scribe lane region a2, that is, a portion of the inorganic encapsulation layer is located on the inner wall of the groove 131, and a portion of the inorganic encapsulation layer located on the inner wall of the groove 131 constitutes a second sub-groove structure (not shown in the drawing); wherein the groove structure 130 includes a first sub-groove structure and a second sub-groove structure. In addition, after the encapsulation layer 120 is formed, a touch layer 170 may be further formed on the encapsulation layer 120. The groove structure may further include a touch layer 170 partially located in the groove 131.

Specifically, by adopting the manufacturing method of the display panel according to the embodiment of the present invention, the groove structure 130 is formed in the dicing street area a2, and when the panel is diced by the module double-dicing process, cracks generated by dicing can be cut off, so that the cracks generated during dicing are prevented from extending toward the display area, and at the same time, the packaging effect of the panel is enhanced, thereby improving the yield and reliability of the panel. In addition, on the basis of ensuring the display performance and the product yield of the display panel, the frame width of the display panel is greatly reduced, and the screen occupation ratio of the display panel is effectively improved, so that the display panel provided by the embodiment of the invention can be applied to products such as narrow frames.

In addition, when the array layer 140, the first inorganic encapsulation layer 121 and the second inorganic encapsulation layer 123 are formed in the non-scribe line region a1, the array layer 140, the first inorganic encapsulation layer 121 and the second inorganic encapsulation layer 123 may be formed in the scribe line region a2, respectively, so that the number of corresponding process steps for patterning the film layer is reduced, and accordingly, the number of masks is reduced, and the production cost and process steps are reduced. Meanwhile, the formation of the array layer 140, the first inorganic encapsulation layer 121, and the second inorganic encapsulation layer 123 may completely cover all areas, thereby extending the encapsulation effective area.

Specifically, the step of forming the display device may specifically include, when the array layer 140 (i.e., array composite layer) is formed on the substrate 110 corresponding to the non-scribe line region a1 through a deposition process, forming the array layer 140 in the scribe line region a2, that is, a portion of the array layer 140 is located on the inner wall of the groove 131, and the array layer 140 located on the inner wall of the groove 131 constitutes a first sub-groove structure; then, a pixel defining layer 150 is formed on the array layer 140. In addition, the step of forming the display device further includes forming a planarization layer 160 on the array layer 140, and the step of forming the recess 131 may be performed before the step of forming the pixel defining layer 150, or may be performed before the step of forming the planarization layer 160. In addition, it should be noted that the step of forming the display device further includes forming an anode layer, a light emitting layer, a cathode layer, and the like, which is not the point of the present invention and is not described in detail.

Wherein the substrate 110 includes a first organic layer 111, an inorganic layer 112, and a second organic layer 113, and the step of forming the groove 131 further includes forming the groove 131 to penetrate the second organic layer 113 and to be in contact with the inorganic layer 112.

Specifically, as can be seen from the above, a portion of the substrate 110 may be partially etched away by laser techniques to form the recess 131. In forming the groove 131, the groove 131 may be formed to a certain depth by controlling a process parameter of the laser technique, such as an operating time or an operating energy of the laser technique, so that the groove 131 passes through the second organic layer 113 and extends into the inorganic layer 112 to be contiguous with the inorganic layer 112. After forming the groove 131 with a certain depth, a portion of the film layer forming the display device and the encapsulation layer 120 may be formed on the inner wall of the groove 131 to finally form the groove structure 130, i.e., the finally formed groove structure 130 passes through the second organic layer 113 and is connected to the inorganic layer 112. By adopting the groove structure 130 to be connected with the inorganic layer 112, the slopes and the bottoms of the inorganic layer 112 and the groove structure 130 are overlapped to form a complete packaging area, so that water and oxygen invasion can be blocked, the water and oxygen invasion path is prolonged, and the packaging effect is more favorable.

In addition, when the groove structure 130 includes the first inorganic encapsulation layer 121 and the second inorganic encapsulation layer 123, by using the groove structure 130 to connect with the inorganic layer 112, so that the inorganic layer 112 and the second inorganic encapsulation layer 123 overlap at the slope and the bottom of the groove structure 130, that is, the second inorganic encapsulation layer 123 in the encapsulation layer 120 directly contacts with the inorganic layer 112 in the substrate 110, while the water and oxygen insulation is ensured, the risk of package failure caused by peeling of the inorganic and organic films in the prior art can be eliminated because the two inorganic layers (such as the second inorganic encapsulation layer 123 and the inorganic layer 112) directly contact.

It should be understood that, for the specific structure and the manufacturing process of the manufacturing method of the display panel in the embodiment of the present application, reference may be made to the above-mentioned embodiment of the display panel, and details are not described here.

According to the above, the present invention provides a display panel and a method for manufacturing the same, the display panel includes: a substrate; a display device on the substrate; an encapsulation layer on the display device; the display panel further comprises a non-cutting road area and a cutting road area positioned on the outer side of the non-cutting road area, and the cutting road area is provided with a groove structure. Through setting up groove structure in the cutting road district, when adopting module two to cut technology to cut the panel, can cut because the crackle that the cutting produced, the crackle that produces when avoiding the cutting extends to the display area, meanwhile, strengthens the encapsulation effect of panel to improve the yield and the reliability of panel.

The above description is intended to be illustrative of the preferred embodiment of the present invention and should not be taken as limiting the invention, but rather, the intention is to cover all modifications, equivalents, and alternatives falling within the spirit and scope of the invention.

Claims

1. A display panel, comprising:

a substrate;

a display device on the substrate;

an encapsulation layer on the display device;

the display panel further comprises a non-cutting road area and a cutting road area located on the outer side of the non-cutting road area, and the cutting road area is provided with a groove structure.

2. The display panel of claim 1, wherein the encapsulation layer comprises a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer in a stacked arrangement over the display device, wherein the first inorganic encapsulation layer and/or the second inorganic encapsulation layer covers at least a portion of the scribe line region.

3. The display panel of claim 1, wherein the display panel further comprises a touch layer on the encapsulation layer, the touch layer covering the scribe lane area.

4. The display panel of claim 1, wherein the substrate comprises a first organic layer, an inorganic layer, and a second organic layer in a stacked arrangement, the groove structure penetrating through the second organic layer and interfacing with the inorganic layer.

5. The display panel of claim 1, wherein the groove structure is spaced from an outer edge of the scribe line region by a distance in a first direction between 0 and 120um, the first direction being parallel to the substrate.

6. The display panel of claim 1, wherein the width of the groove structure is greater than 5um and the depth of the groove structure ranges from 1 to 20 um.

7. The display panel according to claim 1, wherein the number of the groove structures is plural, a distance between two adjacent groove structures in a first direction is greater than 10um, and/or the plurality of groove structures have different depths, and the first direction is a direction parallel to the substrate.

8. A method for manufacturing a display panel is characterized by comprising the following steps:

providing a substrate, wherein the substrate comprises a cutting channel area and a non-cutting channel area;

forming a groove in the cutting path region;

forming a display device on the substrate, wherein part of a film layer of the display device is partially positioned in the groove to form a first sub-groove structure;

forming an encapsulation layer on the display device, wherein part of a film layer of the encapsulation layer is positioned in the groove to form a second sub-groove structure;

wherein the groove structure comprises the first sub-groove structure and the second sub-groove structure.

9. The method of claim 8, wherein the substrate comprises a first organic layer, an inorganic layer, and a second organic layer, and wherein the forming the recess further comprises forming the recess through the second organic layer and in contact with the inorganic layer.

10. The method for manufacturing a display panel according to claim 8, wherein the step of forming the display device specifically includes:

forming an array layer on the substrate;

forming a pixel defining layer on the array layer;

wherein the step of forming the display device further comprises forming a planarization layer on the array layer, the step of forming the recess being before the step of forming the pixel defining layer, or the step of forming the recess being before the step of forming the planarization layer.