CN114664910A

CN114664910A - Display substrate, manufacturing method and display device

Info

Publication number: CN114664910A
Application number: CN202210298542.6A
Authority: CN
Inventors: 谢春燕; 张嵩; 蔡宝鸣
Original assignee: BOE Technology Group Co Ltd
Current assignee: BOE Technology Group Co Ltd
Priority date: 2022-03-25
Filing date: 2022-03-25
Publication date: 2022-06-24

Abstract

The invention discloses a display substrate, a manufacturing method and a display device. The display substrate of one embodiment comprises a display area and a cathode overlapping area surrounding the display area, and further comprises: the display substrate comprises a first barrier area arranged on a substrate of the display substrate and surrounding the display area, wherein the projection of the cathode lap joint area on the substrate covers the projection of the first barrier area on the substrate. This embodiment is through forming first separation zone and cathode overlap area and overlapping the setting, both forms the cathode overlap area in display substrate's non-display area, forms first separation zone again, on the basis of guaranteeing that the overlap function of display substrate's cathode overlap area normally realizes effective demonstration, can also reduce display substrate's marginal size to realize narrow frame design, have extensive application prospect.

Description

Display substrate, manufacturing method and display device

Technical Field

The invention relates to the technical field of display. And more particularly, to a display substrate, a method of manufacturing the same, and a display device.

Background

At present, the application of OLED display is becoming diversified, and the requirement for the form of the display substrate is becoming higher and higher. Particularly, for a frame region without display, the frame is further compressed along with the extreme pursuit of screen occupation ratio, but in order to ensure the normal display function of the display substrate at the same time, a certain length of protection design is often required to be performed on the edge of the display substrate, and for a display device which pursues an extremely narrow frame, how to reduce the edge size of the display substrate is an urgent problem to be solved.

Disclosure of Invention

The present invention is directed to a display substrate, a manufacturing method thereof and a display device, so as to solve at least one of the problems of the prior art.

In order to achieve the purpose, the invention adopts the following technical scheme:

the invention provides a display substrate, comprising a display area and a cathode overlapping area surrounding the display area,

the display substrate further includes: the display substrate comprises a first barrier area arranged on a substrate of the display substrate and surrounding the display area, wherein the projection of the cathode lap joint area on the substrate covers the projection of the first barrier area on the substrate.

Further, the cathode overlapping area comprises a cathode metal layer arranged on the same layer as the cathode layer of the display area and an anode metal layer arranged on the same layer as the anode layer of the display area;

the display substrate further includes:

and the intercepting region is arranged on one side of the first blocking region, which is far away from the display region, surrounds the first blocking region, is arranged between the anode metal layer and the cathode metal layer, and the projection of the cathode overlapping region on the substrate covers the projection of the intercepting region on the substrate.

Further, the display substrate further includes an encapsulation layer, and the encapsulation layer includes:

the covering and packaging area is used for covering the display area, the cathode lap joint area and the interception area; and

the blocking packaging area surrounds the intercepting area and is provided with a tooth-shaped structure;

the covering packaging area and the blocking packaging area are arranged in the same layer.

Further, the display area includes:

a driver circuit layer provided on the substrate:

a planarization layer disposed on the driving circuit layer:

a light emitting device layer disposed on the planarization layer, the light emitting device layer including a pixel defining layer, an anode layer defined by the pixel defining layer, a light emitting material layer disposed on the anode layer, and a cathode layer covering the light emitting material layer and the pixel defining layer;

the cathode overlapping area and the intercepting area are disposed in a non-display area of the display substrate, and the non-display includes:

a planarization material layer disposed in the same layer as the planarization layer:

a layer of intercepting material of the intercepting region disposed in a same layer as the pixel defining layer.

Further, the first blocking region is arranged between the anode metal layer and the cathode metal layer, and the first blocking region comprises at least one first isolation column with an undercut structure, which are sequentially arranged along the direction from the display region to the cathode overlapping region;

wherein the first isolation pillar having an undercut structure includes:

a first material layer disposed on the anode metal layer of the cathode landing zone;

a second layer of material disposed on the first layer of material; and

a third material layer disposed on the second material layer, a projection of the third material layer on the substrate covering a projection of the second material layer on the substrate;

the third material layer cuts off the cathode metal layer, and the cathode metal layer is electrically connected with the anode metal layer through the first material layer, the second material layer and the third material layer.

Further, the blocking packaging region with the tooth-shaped structure comprises:

at least two second isolation pillars arranged in a direction from the display region to the cathode overlapping region; and

the packaging material layer is arranged on the second isolation column and is of a tooth-shaped structure with an undercut structure;

the second isolation column and the first isolation column are arranged on the same layer, and the packaging material layer arranged on the second isolation column and the material layer covering the packaging area are arranged on the same layer. Further, the non-display area further includes: an anode metal layer disposed on the same layer as the anode layer;

the first isolation column is arranged on the anode metal layer;

and the cathode metal layer is arranged on the same layer as the cathode layer and covers the anode metal layer and the cathode metal layer covering the surface of one side, far away from the substrate, of the first isolation column. Further, the first blocking region is arranged between the cathode metal layer and the substrate, and the first blocking region comprises at least one third isolation column with an undercut structure, which are sequentially arranged along the direction from the display region to the cathode overlapping region;

wherein the third isolation pillar having an undercut structure includes:

a fourth material layer disposed on the substrate, the fourth material layer serving as an anode metal layer of the cathode landing zone;

a fifth material layer disposed on the fourth material layer;

a sixth material layer disposed on the fifth material layer, a projection of the sixth material layer on the substrate covering a projection of the fifth material layer on the substrate;

the sixth material layer cuts off the cathode metal layer, and the cathode metal layer is electrically connected with a fourth material layer serving as the anode metal layer through the sixth material layer and the fifth material layer. Further, the blocking packaging region with the tooth-shaped structure comprises:

at least two fourth isolation columns arranged in a direction from the display area to the non-display area; and

the packaging material layer is arranged on the fourth isolation column and is of a tooth-shaped structure with an undercut structure;

the fourth isolation column and the third isolation column are arranged on the same layer, and the packaging material layer arranged on the fourth isolation column and the material layer covering the packaging area are arranged on the same layer.

Further, the non-display area further includes:

a fourth material layer of the third isolation pillar disposed on the planarization material layer;

the fifth material layer and the sixth material layer of the third isolation column are sequentially arranged on the fourth material layer;

and the cathode metal layer is arranged on the same layer as the cathode layer and covers the surfaces of the fourth material layer and the sixth material layer, which are far away from the substrate.

Further, the first barrier region is disposed between the cathode overlapping region and the substrate of the display substrate,

the first barrier region comprises at least:

a seventh material layer disposed on the substrate, an

An eighth material layer disposed on the seventh material layer;

the first barrier region further comprises a first groove structure which is recessed from the surface of the seventh material layer, which is far away from the substrate, in the direction towards the eighth material layer, and the first groove structure penetrates through the eighth material layer and does not penetrate through the seventh material layer;

the anode metal layer is formed on the surfaces of the eighth material layer and the seventh material layer which leak out of the first groove structure and are far away from the substrate;

or

The seventh material layer is a planarization material layer arranged on the same layer as the planarization layer;

the eighth material layer is a passivation layer disposed on the planarization layer.

Further, the projection of the opening of the first groove structure on the seventh material layer on the substrate covers the projection of the opening of the first groove structure on the eighth material layer on the substrate, so that the cathode metal layer of the cathode lap joint region formed on the first barrier region is cut off;

the projection of the first barrier region on the substrate is an annular structure with a gap, and the annular structure is used for electrically connecting the cathode metal layer cut by the first barrier region at the gap.

at least two second groove structures arranged in a direction from the display area to the non-display area, wherein the second groove structures and the first groove structures are arranged in the same layer; and

the packaging material layer is arranged on the second groove structure and is of a tooth-shaped structure with an undercut structure;

the second groove structure and the first groove structure are arranged on the same layer, and the packaging material layer of the second groove structure and the material layer covering the packaging area are arranged on the same layer.

Further, the display substrate further includes:

the driving unit is arranged between the cathode lap joint area and the substrate, the projection of the cathode lap joint area on the substrate covers the projection of the driving unit on the substrate, and the driving unit and the driving circuit layer of the display area are arranged on the same layer;

or

The display substrate further includes:

the power supply wiring surrounds the interception area and is electrically connected with the cathode lap joint area, the projection of the blocking packaging area on the substrate covers the projection of the power supply wiring on the substrate, and the power supply wiring and the driving circuit layer of the display area are arranged on the same layer;

the projection of the barrier packaging area on the substrate covers the projection of the crack detection line on the substrate, and the crack detection line and the power supply wiring are arranged on the same layer;

a crack barrier surrounding the crack detection line, a projection of the barrier encapsulation area on the substrate covering a projection of the crack barrier on the substrate.

A second aspect of the invention provides a method of manufacturing a display substrate of the first aspect of the invention, comprising:

forming a display area and a cathode overlapping area surrounding the display area on a substrate;

forming a first barrier region surrounding the display region on a substrate of the display substrate, wherein a projection of the cathode overlapping region on the substrate covers a projection of the first barrier region on the substrate.

Alternatively, the method further comprises:

forming an intercepting region surrounding the first barrier region, wherein the intercepting region is disposed between the anode metal layer and the cathode metal layer, and a projection of the cathode overlap region on the substrate covers a projection of the intercepting region on the substrate;

or alternatively

The method further includes forming the encapsulation layer,

wherein the forming the encapsulation layer comprises:

forming a cover encapsulation region of the encapsulation layer covering the display region, the cathode overlap region covering the non-display region, and the intercepting region covering the non-display region;

forming a barrier encapsulation area of the encapsulation layer having a tooth structure surrounding the intercepting area.

A third aspect of the invention provides a display device comprising the display substrate of the first aspect of the invention.

The invention has the following beneficial effects:

according to the technical scheme, the first blocking area and the cathode overlapping area are arranged in an overlapping mode, the cathode overlapping area and the first blocking area are formed in the non-display area of the display substrate, and the edge size of the display substrate can be reduced on the basis that the overlapping function of the cathode overlapping area of the display substrate is guaranteed to be normal and effective display is achieved, so that the narrow-frame design is achieved, and the narrow-frame display device has a wide application prospect.

Drawings

The following describes embodiments of the present invention in further detail with reference to the accompanying drawings.

Fig. 1 illustrates a schematic structural view of a related art display substrate;

FIG. 2 is a schematic view of a display substrate according to an embodiment of the present invention;

FIG. 3 is a schematic view of a display substrate according to another embodiment of the present invention;

FIG. 4 is a schematic view of a display substrate according to another embodiment of the present invention;

FIG. 5 is a schematic diagram illustrating a structure of a display region of a display substrate according to an embodiment of the invention;

FIG. 6 is a schematic structural diagram illustrating an undercut structure of the first trench structure of FIG. 4 according to an embodiment of the present invention;

fig. 7 is a schematic view illustrating a state in a top view structure of the display substrate shown in fig. 4;

FIG. 8 is a schematic view of another process for fabricating a display substrate according to the present invention;

FIG. 9 is a schematic flow chart illustrating a process for fabricating a display substrate according to another embodiment of the invention;

FIG. 10 is a schematic flow chart illustrating the fabrication of the display substrate according to the embodiment of FIG. 2;

FIG. 11 is a schematic flow chart illustrating the fabrication of the display substrate according to the embodiment of FIG. 3;

fig. 12 is a schematic flow chart illustrating a process of manufacturing the display substrate according to the embodiment of fig. 4.

Detailed Description

In order to more clearly illustrate the present invention, the present invention will be further described with reference to the following examples and the accompanying drawings. Similar parts in the figures are denoted by the same reference numerals. It is to be understood by persons skilled in the art that the following detailed description is illustrative and not restrictive, and is not to be taken as limiting the scope of the invention.

Fig. 1 is a schematic diagram illustrating a layer structure of a display substrate of the related art, and as shown in fig. 1, the display substrate includes a display area AA and a non-display area, and the non-display area is provided with a GOA driving unit 141, a cathode overlapping area BB, a power line 16, a crack detection line 17, an intercepting structure, and an encapsulation layer 15, and these necessary structures limit the size of the non-display area. In a specific example, the display substrate generally adopts the encapsulation layer 15 to ensure the water and oxygen barrier performance of the display substrate, the encapsulation layer 15 generally is a stacked structure of an inorganic material and an organic material, the inorganic layer needs to extend a certain length to ensure the encapsulation characteristic of the device, and such a structural design further increases the edge dimension of the display substrate. Illustratively, the frame size of the display substrate is generally 0.9-1.5mm, which makes the product have a large black edge, affects the user experience, and is not favorable for narrow frame design.

In view of this, an embodiment of the present invention provides a display substrate, a manufacturing method thereof, and a display apparatus, in which a non-display area of the display substrate is designed to reduce an edge size of the display substrate, so as to implement a narrow-frame design.

As shown in fig. 2, 3, 4 and 5, an embodiment of the invention provides a display substrate including a display area AA.

In an alternative embodiment, the display area AA includes:

a driver circuit layer 14 disposed on the substrate 11. The drive circuit layer 14 includes: the semiconductor device comprises an active layer 142 arranged on a substrate 11, an interlayer dielectric layer 143 covering the active layer 142, a gate electrode 144 arranged on the interlayer dielectric layer 143, a gate insulating layer 145 covering the gate electrode 144, and a source drain metal layer 146 arranged on the gate insulating layer 145.

A planarization layer 24 disposed on the driving circuit layer 14.

A light emitting device layer 50 disposed on the planarization layer 24, the light emitting device layer 50 including a pixel defining layer 25, an anode layer 12 defined by the pixel defining layer 25, a light emitting material layer 51 formed on the anode layer 12, and a cathode layer 13 covering the light emitting material layer 51 and the pixel defining layer 25.

The related layer structure of the display area AA shown in fig. 5 can refer to the related art shown in fig. 1, and is not described herein again.

As shown in fig. 2, 3, and 4, the non-display area includes:

a planarization material layer 241 disposed in the same layer as the planarization layer 24:

a layer 251 of intercepting material of the intercepting region DD disposed in the same layer as the pixel defining layer 25. In an embodiment of the present invention, the display substrate further includes: a cathode overlapping area BB surrounding the display area AA, in this embodiment, the cathode overlapping area BB and the intercepting area DD are disposed in a non-display area of the display substrate.

In an embodiment of the present invention, as shown in fig. 2, fig. 3, and fig. 4, the display substrate further includes: and a first barrier region CC surrounding the display region AA and disposed on a substrate 11 of the display substrate, wherein a projection of the cathode overlapping region BB on the substrate 11 covers a projection of the first barrier region CC on the substrate 11.

Compared with the structural design that the cathode overlapping area BB and the intercepting structure are sequentially arranged in the direction from the display area to the non-display area as shown in FIG. 1, the first barrier area CC and the cathode overlapping area BB are overlapped, as shown in FIGS. 2, 3 and 4, the cathode overlapping area BB and the first barrier area CC are formed in the same area of the edge of the display substrate, so that the edge size of the display substrate can be reduced on the basis of ensuring normal display of the display substrate, and the narrow-frame design is realized.

Considering that the edge region of the display substrate is further provided with other structures, in an alternative embodiment, as shown in fig. 2, 3 and 4, the display substrate further includes:

and an intercepting region DD surrounding the first blocking region CC and disposed on a side of the first blocking region CC away from the display region AA, wherein a projection of the cathode overlapping region BB on the substrate 11 covers a projection of the intercepting region DD on the substrate 11.

Compared with the structures of the cathode overlapping area BB, the intercepting structure, the crack blocking structure 18 and the like shown in fig. 1, which are sequentially arranged in the direction from the display area to the non-display area, as shown in fig. 2, fig. 3 and fig. 4, in this embodiment, on the basis that the first blocking area CC and the cathode overlapping area BB are overlapped, the intercepting area DD and the cathode overlapping area BB are further arranged in a stacked manner, that is, the first blocking area CC is formed at the projection position of the cathode overlapping area BB, and the intercepting area DD surrounding the first blocking area CC is formed at the projection position of the cathode overlapping area BB, so that on the basis of ensuring normal display of the display substrate, the edge size of the display substrate can be further reduced, and a better narrow frame design is realized.

In this embodiment, the cathode overlapping area CC includes an anode metal layer 121 disposed on the same layer as the anode layer 12 of the display area AA and a cathode metal layer 131 disposed on the same layer as the cathode layer 13 of the display area AA, in this embodiment, the cathode metal layer 131 and the anode metal layer 121 of the cathode overlapping area BB are electrically connected, and the cathode overlapping area BB is not damaged by the first blocking area CC and the intercepting area DD, so that normal display of the display substrate can be ensured. In this embodiment, the intercepting region DD is disposed between the anode metal layer 121 and the cathode metal layer 131, and for example, the intercepting region DD can intercept an inkjet printing material (IJP material) of an organic layer in an encapsulation layer, so as to prevent the material from overflowing, and prevent poor display and poor encapsulation.

Considering that the edge region of the display substrate is further provided with other structures, in an alternative embodiment, as shown in fig. 2, 3, 4 and 5, the display substrate further includes: and a driving unit 141 disposed between the cathode overlapping area BB and the substrate 11, wherein a projection of the cathode overlapping area BB on the substrate 11 covers a projection of the driving unit 141 on the substrate 11, and the driving unit 141 is disposed on the same layer as the driving circuit layer 14 of the display area AA.

For example, the driving unit of the present embodiment may be a gate circuit driving unit or an enable circuit driving unit, as shown in fig. 2, fig. 3, fig. 4 and fig. 5, the driving unit 141 is disposed above the substrate 11 of the display substrate, and the driving unit 141 and each device layer of the driving thin film transistor of the driving circuit layer 14 of the display area AA are disposed in the same layer as the active layer 142, the interlayer dielectric layer 143, the gate electrode 144, the gate insulating layer 145 and the source/drain metal layer 146, for example. As shown in fig. 2, 3 and 4, the cathode overlapping area BB, the first blocking area CC and the blocking area DD of the present embodiment are disposed on the driving unit 141 of the non-display area, and the necessary edge structure of the display substrate is structurally optimized in the stacking direction, so that a multi-structure stacking design is formed, the size of the non-display area is compressed to the maximum extent, and the present invention is of great significance in increasing the product screen ratio and realizing a narrow frame design.

In an alternative embodiment, the display substrate further comprises an encapsulation layer 15, the encapsulation layer 15 comprising:

a cover encapsulation region 151 for covering the display region AA, the cathode overlapping region BB, and the intercepting region DD; and

a barrier encapsulation region 152 having a tooth structure surrounding the intercepting region DD;

The encapsulation layer 15 of the present embodiment is formed by two encapsulation structures, the first structure is the cover encapsulation region 151 disposed between the display region AA and the intercepting region DD, as shown in fig. 2, fig. 3, and fig. 4, the cover encapsulation region 151 covers the display region AA, the cathode overlapping region BB, and the intercepting region DD, and for example, the cover encapsulation region 151 and the encapsulation layer 15 shown in fig. 1 may be fabricated by the same process to prevent the invasion of external water and oxygen.

The second structure of the encapsulation layer 15 of the present embodiment is the barrier encapsulation region 152 disposed outside the intercepting region DD, and the barrier encapsulation region 152 is formed on the side of the intercepting region DD away from the display region AA. On one hand, the blocking encapsulation region 151 has the original encapsulation performance, and further, the blocking encapsulation region 152 has a tooth-shaped structure different from that covering the encapsulation region 151 as an outermost edge structure of the non-display region, so that water and oxygen can be further prevented from entering, and the overall encapsulation performance of the display substrate is improved; on the other hand, in the embodiment, the blocking encapsulation region 151 with the tooth-shaped structure can anchor the encapsulation layer, prevent crack propagation when cracks occur at the edge of the display substrate, and effectively protect the display region, so that the display panel has good fracture resistance.

The encapsulation layer 15 of the present embodiment adopts a multi-layer encapsulation structure formed by stacking inorganic materials, organic materials and inorganic materials, as shown in fig. 2, the encapsulation material layer covering the encapsulation region 151 includes a first inorganic material layer 1511, an organic material layer 1512 and a second inorganic material layer 1513 sequentially stacked. Illustratively, the inorganic material layer may be formed by a chemical vapor deposition process, and the organic material layer may be formed by an inkjet printing process.

In this embodiment, as shown in fig. 2, 3 and 4, the cover encapsulation region 151 and the barrier encapsulation region 152 are disposed in the same layer, that is, the cover encapsulation region 151 and the barrier encapsulation region 152 may be formed in the same process, for example, each encapsulation material layer of the barrier encapsulation region 152 may be formed in the same layer as each material layer of the cover encapsulation region, for example, the encapsulation material layer 25 of the barrier encapsulation region includes two inorganic material layers disposed in a stacked manner, and the encapsulation material layer corresponding to the barrier encapsulation region 152 may be formed at the same time when the first inorganic material layer 1511 and the second inorganic material layer 1513 of the cover encapsulation region 151 are formed, so as to save the process flow.

Further, considering that the edge region of the display substrate is further provided with other structures, in another alternative embodiment, the display substrate further includes:

the power trace 16 surrounding the intercepting region DD and electrically connected to the cathode overlapping region BB, the projection of the blocking encapsulation region 152 on the substrate 11 covers the projection of the power trace 16 on the substrate 11, and the power trace 16 is disposed on the same layer as the driving circuit layer 14 of the display region AA, for example, on the same layer as the gate 144 shown in fig. 5, or on the same layer as the source-drain metal layer 146 shown in fig. 5;

a crack detection line 17 surrounding the power supply trace 16, a projection of the barrier encapsulation region 152 on the substrate covering a projection of the crack detection line 17 on the substrate 11, the crack detection line 17 being arranged in a same layer as the power supply trace 16;

a crack barrier 18 surrounding the crack detection line 17, a projection of the barrier encapsulation region 152 on the substrate 11 covering a projection of the crack barrier 18 on the substrate 11. In a specific example, as shown in fig. 1, the crack stoppers 18 may be disposed in the same layer as the planarization layer 24 of the display area AA. In another specific example, as shown in fig. 5, the crack stoppers 18 may also be formed in the same layer as the interlayer dielectric layer 142, the gate insulating layer 143, or another insulating layer formed on the substrate 11. The design of the crack stop 18 should be made by a person skilled in the art according to the actual application and will not be described in detail here.

As shown in fig. 2, 3 and 4, in the present embodiment, the power traces 16 surrounding the driving unit 141, the crack detection lines 17 surrounding the power traces 16, and the crack barriers 18 surrounding the crack detection lines 17 are disposed on the substrate of the display substrate in the non-display area, wherein the power traces 16 are electrically connected to the anode metal layer 121 of the cathode overlapping area BB to realize a normal display function, the crack detection lines 17 are used to form a crack detection circuit to detect whether the display substrate has a crack abnormality, and the crack barriers 18 can prevent cracks from extending into the display area when the display substrate is edge-cut or edge-broken, so that the above-mentioned structure of the non-display area still needs to be retained as an essential structure of the edge, and the present embodiment forms a stacked structure by forming the barrier encapsulation area 152 and the above-mentioned essential structures (the power traces 16, the crack detection lines 17, and the crack barriers 18), therefore, on the basis of ensuring the design of necessary structures at the edge, the design size can be further reduced, and the narrow frame design is favorably realized.

As shown in fig. 2, fig. 3, and fig. 4, the stacked structure of the non-display area of the display substrate according to the embodiment of the present invention is designed as follows:

in the direction from the display area AA to the cathode overlapping area BB, a driving unit 141, a power supply line 16, a crack detection line 17, and a crack stopper 18 are provided in this order on the substrate 11. The driving unit 141 is provided with a stacked structure of a cathode overlapping region BB and a first barrier region CC, and an intercepting region DD surrounding the first barrier region CC. A covering and packaging area 151 is arranged on the display area AA, the cathode overlapping area BB, the first barrier area CC and the interception area DD; a barrier packaging area 152 with a tooth-shaped structure is arranged above the power supply trace 16, the crack detection line 17 and the crack blocking portion 18.

According to the display substrate with the laminated design, the size of the frame of the display substrate can be reduced to be less than 0.6mm, and more preferably to be less than 0.5 mm. Compared with the related art shown in fig. 1, the frame size needs a display substrate with 0.9-1.5mm, which reduces the frame length by about half.

As shown in fig. 2, fig. 3, and fig. 4, the present invention implements a narrow bezel design by the structural design of the non-display region of different embodiments.

Fig. 2 shows a schematic structural diagram of a display substrate according to an embodiment of the present invention, in an alternative embodiment, the first barrier region CC is disposed between the anode metal layer 121 and the cathode metal layer 131, the first barrier region CC includes at least one first isolation pillar 20 having an undercut structure, which is sequentially arranged along a direction from the display region AA to the cathode overlapping region BB, and the first isolation pillar 20 is used to cut off the cathode metal layer 131.

As shown in fig. 2, the first isolation pillars 20 of the present embodiment are disposed outside the display area, and exemplarily, the number of the first isolation pillars of the present embodiment is 4, and the first isolation pillars are sequentially disposed in a direction from the display area AA to the cathode overlapping area BB to surround the display area AA, and in another example, each of the first isolation pillars 20 has a dimension from 3um to 20um, preferably from 5um to 10um, in the direction from the display area AA to the cathode overlapping area BB. The number of the first isolation pillars 20 is not limited in the present invention, and those skilled in the art can design the number of the first isolation pillars 20 according to the projection of the cathode overlapping area BB, which will not be described herein.

As shown in fig. 2, when the encapsulation covering region 151 above the first isolation pillar 20 is fabricated, the first isolation pillar 20 of the present embodiment can block the organic inkjet material of the organic material layer 1512 covering the encapsulation covering region 151, so as to prevent the organic inkjet material from overflowing and ensure the encapsulation effect.

In an alternative embodiment, as shown in fig. 2, the first isolation pillar 20 having an undercut structure includes:

a first material layer 21 disposed on the anode metal layer 121 of the cathode landing zone BB;

a second material layer 22 disposed on the first material layer 21; and

a third material layer 23 disposed on the second material layer 21, a projection of the third material layer 23 on the substrate 11 covering a projection of the second material layer 22 on the substrate 11.

In this embodiment, the first isolation pillar 20 is designed as a multi-layer structure, such that the projection of the third material layer 23 located above covers the projection of the second material layer 22 located in the middle layer, thereby forming an undercut structure, that is, as shown in fig. 2, the outer sidewall of the second material layer 22 of the first isolation pillar 20 is recessed inward compared to the outer sidewall of the third material layer 23, thereby forming a shielding structure similar to an "eave". In the related process, the cathode metal material of the cathode metal layer 131 is deposited by a thermal evaporation process, and because the thermal evaporation process has good verticality, the first isolation pillar 20 cuts off the cathode metal layer 131, that is, the cathode metal layer 131 formed on the third material layer 23 and the cathode metal layer 131 formed on the anode metal layer 121 are designed to be disconnected, so that the path for water and oxygen intrusion is cut off, and the design further improves the water and oxygen resistance of the display substrate and improves the packaging performance.

Therefore, the first isolation pillar 20 having the undercut structure according to the embodiment of the present invention can block material overflow generated during the fabrication of the organic material layer, cut off the cathode to improve the anti-moisture performance of the display substrate, and effectively improve the packaging performance of the display substrate.

In an alternative embodiment, the etching rate of the second material layer 22 is greater than the etching rate of the first material layer 21 and greater than the etching rate of the third material layer 23. In the embodiment, by designing the materials of the second material layer 22 located in the middle layer and the third material layer 23 located above the second material layer 22, when the first isolation pillar 20 is formed through the etching process, the undercut structure of the first isolation pillar 20 is formed at the same time, so as to save the process flow.

Illustratively, by utilizing the characteristic that the etching rates of the two materials are different, when the etching process is performed, the etched area of the second material layer 22 is larger, so that the projection of the third material layer 23 covers the projection of the second material layer 22, and the outer sidewall of the second material layer 22 is recessed inward compared with the outer sidewall of the third material layer 23, thereby forming the first isolation pillar 20 having an undercut structure. In one specific example, the amount of undercut of the second material layer 22 is 0.1-1um, preferably 0.3-0.7 um.

In order to avoid the above problem, in a further alternative embodiment, the third material layer 23 cuts off the cathode metal layer 131, and the cathode metal layer 131 is electrically connected to the anode metal layer through the third material layer 23, the second material layer 22 and the first material layer 21, in order to avoid the above problem, considering that the cathode metal layer 131 is cut off by the first isolation pillar 20 when the cathode metal layer 131 is formed on the first isolation pillar 20, and although the cut-off cathode metal layer 131 can effectively prevent the ingress of water and oxygen, the cut-off cathode metal layer 131 may cause the abnormal lapping of the cathode lap BB because the anode metal layer 121 and the cathode metal layer 131 of the cathode lap BB are electrically connected.

In this embodiment, on the basis that the first isolation pillars 20 are designed to have material layers with different etching speeds to form an undercut structure, each material layer of the first isolation pillars 20 is further designed to be a conductive material, so that the cut cathodes are reconnected through the conductive performance of the first isolation pillars themselves.

In a specific example, the first material layer 21 is Ti, the second material layer 22 is Al, and the third material layer 23 is Ti, so that a Ti/Al/Ti stacked structure is formed, since etching speeds of the two metal materials are different, and an etching speed of Al metal is faster, therefore, in an etching process, a large number of regions are etched away from the second material layer 22, and the first isolation pillar 20 having an undercut structure is formed, and due to metal conductive characteristics of Al and Ti, the cathode metal layer 131 formed on the third material layer 23 can be electrically connected through the third material layer 23, the second material layer 22, the first material layer 21 and the anode metal layer 121, so that a normal display function of the display substrate is ensured, a narrow frame design of the display substrate is realized, and a packaging performance of the display substrate is improved.

In an alternative embodiment, as shown in fig. 2, the blocking encapsulation region 152 having the tooth structure includes:

at least two second separator pillars 24 arranged in a direction from the display area AA to the cathode overlapping area BB; and

and an encapsulation material layer 25 formed on the second isolation pillar 24, wherein the encapsulation material layer 25 is a tooth structure having an undercut structure. .

In this embodiment, as shown in fig. 2, the second isolation pillars 24 of the isolation encapsulation region 152 serve as a substrate of the encapsulation structure, so that the encapsulation material layer 25 disposed on the second isolation pillars 24 forms a tooth-shaped structure. The second isolation pillar 24 and the first isolation pillar 20 of the present embodiment are disposed on the same layer, that is, the second isolation pillar 24 of the present embodiment has the same structure as the first isolation pillar 20, that is, as shown in fig. 2, the second isolation pillar 24 also has an undercut structure, in a specific example, the second isolation pillar 24 also has a structure in which three material layers are stacked, an outer wall of a material layer located in an intermediate layer is recessed inward than an outer wall of a material layer located above, so as to further enable the encapsulation material layer 25 formed on the second isolation pillar 24 to be the undercut structure formed according to the second isolation pillar 24, and the integral barrier encapsulation region 152 is approximately a tooth-shaped structure.

In this embodiment, the encapsulating material layer 25 disposed on the second isolation pillar 24 and the cover encapsulation region 151 are disposed on the same layer. As shown in fig. 2, the cover sealing region 151 is disposed in each of the display region AA, the cathode overlapping region BB, and the intercepting region DD, and the obstructing sealing region 152 having a tooth structure is disposed outside the intercepting region DD.

The encapsulation material layer 25 of the barrier encapsulation region 152 and the encapsulation material layer 25 covering the encapsulation region 151 are formed in the same layer, and for example, the encapsulation material layer 25 of the barrier encapsulation region 152 includes two inorganic material layers stacked and formed in the same layer as the first inorganic material layer 1511 and the second inorganic material layer 1513 covering the encapsulation region 151. That is, the names and functions of the cover encapsulation region 151 and the barrier encapsulation region 152 are different, but in an actual process, the encapsulation material layer of the package structure (including the display region and the non-display region) of the present embodiment may be formed using the same process.

In this embodiment, the manufacturing process, and the material selection of the second isolation pillar 24 in the blocking packaging region 152 shown in fig. 2 may be the same as those of the first isolation pillar 20 in the first blocking region CC, and the specific principle and the process may refer to the first isolation pillar 20 described above, which are not repeated herein. In this embodiment, the number of the second isolation pillars 24 may be designed according to practical applications, and will not be described herein. The manufacturing process, and material selection of the packaging material layer 25 of the blocking packaging region 152 may refer to the cover packaging layer or related technologies, and specific principles and processes may refer to the above-mentioned cover packaging region, which is not described herein again.

As shown in fig. 2, the non-display area of the display substrate of the present embodiment further includes:

the driving unit 141 is disposed on the same layer as the driving circuit layer 14, and exemplarily includes a gate circuit driving unit and an enable circuit driving unit, and the driving unit 141 may be formed on the same layer as the active layer 142, the gate 144, the source-drain metal layer 146, and the like of the driving circuit layer 14 shown in fig. 5. In another specific example, the power traces 16 and the crack detection lines 17 may also be formed in the same layer as the gate 144 and the source-drain metal layer 146 of the driving circuit layer 14 shown in fig. 5.

The anode metal layer 121 is disposed on the planarization material layer 241 in the same layer as the anode layer 12, and the anode metal layer 121 is electrically connected to the power trace 16 through a via hole of the planarization material layer 241.

The first isolation pillar 20 is disposed on the anode metal layer 121, and the first isolation pillar 20 is exemplarily formed between the pixel defining layer 25 of the display area AA and the intercepting material layer 251 of the intercepting area DD. The formation of the first isolation pillar in this embodiment is as described above, and is not described herein again.

And the cathode metal layer 131 is arranged on the same layer as the cathode layer 13 and covers the anode metal layer 121 and the surface of one side, far away from the substrate, of the first isolation column 20. As shown in fig. 2, the cathode metal layer 131 of the present embodiment is isolated by the first isolation pillar 20, and is electrically connected to the anode metal layer 121 through the via hole of the planarization material layer 241 by utilizing the conductive performance of the first isolation pillar 20, and the electrically connected cathode metal layer 131 and anode metal layer 121 form a cathode landing zone BB.

The structure of the display substrate of the embodiment of the invention not only ensures the normal display function of the display substrate, but also realizes the narrow frame design of the display substrate, improves the packaging performance and the product reliability of the display substrate, and has wide application prospect.

As shown in fig. 3, fig. 3 is a schematic structural diagram of a display substrate according to another embodiment of the present invention, and the structure thereof will now be described.

In an alternative embodiment, the first blocking region CC is disposed between the cathode metal layer 131 of the cathode overlapping zone BB and the substrate 11, and exemplarily, the first blocking region CC is disposed between the cathode metal layer 131 and the planarization material layer 241 formed on the substrate 11, and the first blocking region CC includes at least one third isolation pillar 30 having an undercut structure, which is sequentially arranged along the direction from the display region AA to the cathode overlapping zone BB.

As shown in fig. 3, the third isolation pillars 30 of the present embodiment are disposed outside the display region, exemplarily, the number of the third isolation pillars 30 is 4, and in another example, each of the third isolation pillars 30 has a size of 3 to 20um, preferably 5 to 10um, from the display region to the cathode overlap BB region. The number of the third isolation pillars is not limited in the present invention, and those skilled in the art can design the number of the third isolation pillars according to the projection of the cathode overlapping region, which will not be described herein. As shown in fig. 3, when fabricating the package structure covering the package region 151 above the third isolation pillar 30, the third isolation pillar 30 can block the ink-jet material of the organic material layer 1512 from overflowing, so as to ensure the package effect.

In an alternative embodiment, as shown in fig. 3, the third isolation pillar 30 having an undercut structure includes:

a fourth material layer 31 disposed on the substrate 11, the fourth material layer 31 serving as the anode metal layer 121 of the cathode overlap BB. In this embodiment, the anode metal layer 121 of the cathode overlapping area BB is eliminated, and the fourth material layer 31 having a conductive property is used as the overlapping metal layer, thereby simplifying the layer structure of the cathode overlapping area BB in this embodiment.

In an alternative embodiment, the fourth material layer 31 and the source/drain metal layer 146 of the driving circuit layer 14 in the display region are disposed on the same layer, which may better conform to the original process flow. Illustratively, as shown in fig. 5, the process of manufacturing the driving TFT of the driving circuit layer is as follows: an active layer 142 of a driving TFT is formed on a substrate 11, an interlayer dielectric layer 143 covering the active layer 142 is formed, a gate electrode 144 is formed on the interlayer dielectric layer 143, a gate insulating layer 145 is formed on the gate electrode 144, and a source-drain metal layer 146 is formed on the gate insulating layer 145. In forming the source/drain metal layer 146, the fourth material layer 31 may be formed in the non-display area AA at the same time. In a subsequent process, for example, when the planarization layer 24 is further formed on the source/drain metal layer 146 in the display area AA, and the planarization layer 24 is opened to electrically connect the anode layer 12 on the planarization layer and the source/drain metal layer 146, an opening may be formed in the fourth material layer 31 in the non-display area in the same process to form the fifth material layer 32 and the sixth material layer 33 on the fourth material layer 31, so as to form the third isolation pillar 30 with conductive properties.

It should be noted that the forming process of the fourth material layer 31 is only an example, and those skilled in the art may also form the fourth material layer 31 as the anode metal layer 121 in other manners, for example, when the anode layer 12 of the display area AA is formed, the anode metal layer 121 is formed in the non-display area as the fourth material layer 31 by the same process, and for example, the fourth material layer 31 is directly formed on the planarization material layer 241 of the non-display area.

In an alternative embodiment, as shown in fig. 3, the third isolation pillar 30 having an undercut structure further includes:

a fifth material layer 32 disposed on the fourth material layer 31;

a sixth material layer 33 disposed on the fifth material layer 32, a projection of the sixth material layer 33 on the substrate 11 covering a projection of the fifth material layer 32 on the substrate 11.

The third isolation column 30 of this embodiment is also a multilayer structure, and the projection of the sixth material layer 33 located above covers the projection of the fifth material layer 32 located in the middle layer to form an undercut structure, so that the cathode metal layer 131 formed on the sixth material layer 33 is cut off to cut off the path of water and oxygen intrusion, thereby further improving the water and oxygen resistance of the display substrate and improving the packaging performance. Therefore, the third isolation pillar 30 having the undercut structure shown in fig. 3 according to the embodiment of the invention can block material overflow generated during the manufacturing of the organic material layer 1512, and can cut the cathode metal layer 131 to improve the anti-moisture performance of the display substrate, and can also effectively improve the packaging performance of the display substrate.

In an alternative embodiment, the etching rate of the fifth material layer 32 is greater than the etching rate of the sixth material layer 33. In the embodiment, by designing the materials of the fifth material layer 32 located in the middle layer and the sixth material layer 33 located above the fifth material layer 32, when the third isolation pillar 30 is formed through the etching process, the undercut structure of the third isolation pillar 30 is formed at the same time, so as to save the process flow. In one specific example, the amount of undercut of the fifth material layer is 0.1-1um, preferably 0.3-0.7 um.

In this embodiment, the sixth material layer 33 cuts off the cathode metal layer 131, which may cause an abnormal bonding in the cathode bonding area BB, and in an alternative embodiment, the cathode metal layer 131 is electrically connected to the fourth material layer 31 as the anode metal layer 121 through the sixth material layer 33 and the fifth material layer 32.

In a specific example, the fourth material layer 31 is a metal material disposed on the same layer as the source-drain metal layer 146, the fifth material layer is Al, the sixth material layer is Ti, and an Al/Ti laminated structure is formed from bottom to top, because etching speeds of the two materials are different, and an etching speed of Al is faster, in an etching process, a number of regions where the fifth material layer is etched away is larger, the third isolation pillar 30 having an undercut structure is formed, and due to metal conductive characteristics of Al and Ti, the cathode metal layer 131 formed on the sixth material layer 33 can be electrically connected to the fourth material layer 31 serving as the anode metal layer 121 through the sixth material layer 33 and the fifth material layer 32, so that a normal display function of the display substrate is ensured, a narrow frame design of the display substrate is realized, and a packaging performance of the display substrate is improved.

In an alternative embodiment, as shown in fig. 3, the blocking encapsulation region 152 having the tooth structure includes:

at least two fourth separator pillars 34 arranged in a direction from the display area AA to the cathode overlapping area BB; and

an encapsulation material layer 35 formed on the fourth isolation pillar 34, wherein the encapsulation material layer 35 has a tooth-shaped structure with an undercut structure;

wherein the fourth isolation column 34 and the third isolation column 30 are disposed in the same layer.

In this embodiment, the manufacturing process, and the material selection of the fourth isolation pillar 34 of the blocking packaging region 152 may be the same as those of the third isolation pillar 30 of the first blocking region CC, and the specific principle and process may refer to the third isolation pillar 30 described above, which is not described herein again. In this embodiment, the number of the fourth isolation pillars 34 may be designed according to practical applications, and is not described herein again.

In this embodiment, the encapsulating material layer 35 disposed on the fourth isolation pillar 30 and the material layer covering the encapsulation region 151 are disposed on the same layer, as shown in fig. 3, the encapsulation region 151 is disposed in the display region AA, the cathode overlapping region BB, and the blocking region DD, and the blocking encapsulation region 152 with a tooth-shaped structure is disposed outside the blocking region DD. Illustratively, the encapsulation material layer 35 of the barrier encapsulation region 152 includes two inorganic material layers disposed in a stacked arrangement, which may be formed in the same layer as the first inorganic material layer 1511 and the second inorganic material layer 1513 covering the encapsulation region 151.

It should be noted that the names and functions of the cover encapsulation region 151 and the blocking encapsulation region 152 are different, but in an actual process, the encapsulation material layer of the package structure (including the display region and the non-display region) of the present embodiment may be formed by using the same process.

It should be noted that the structure and principle of the blocking packaging region 152 having the tooth-shaped structure shown in fig. 3 of the present embodiment are similar to those of the blocking packaging region 152 shown in fig. 2, and related processes, structures and principles can refer to the discussion of the embodiment of fig. 2, and are not repeated herein.

In an optional embodiment, the non-display area of the display substrate shown in fig. 3 in this embodiment further includes:

a fourth material layer 31 of the third isolation pillar 30 formed on the planarization material layer 241, the fourth material layer 31 serving as the anode metal layer 121 of the cathode landing zone BB.

The fifth material layer 32 and the sixth material layer 33 of the third isolation pillar 30 are sequentially disposed on the fourth material layer 31, the fifth material layer 32 and the sixth material layer 33 of the third isolation pillar 30 are disposed between the pixel defining layer 25 and the intercepting material layer 251 of the display area AA, for example, a projection of the sixth material layer 33 on the substrate 11 covers a projection of the fifth material layer 32 on the substrate 11, and the fourth material layer 31, the fifth material layer 32 and the sixth material layer 33 together form the third isolation pillar 30 with an undercut structure.

And a cathode metal layer 131 which is arranged on the same layer as the cathode layer 13 and covers the surface of the fourth material layer 31 and the sixth material layer 33 far away from the substrate 11. As shown in fig. 3, the cathode metal layer 131 of the present embodiment is isolated by the sixth material layer 33, and is electrically connected to the fourth material layer 31 as the anode metal layer 121 by using the conductive properties of the sixth material layer 33 and the fifth material layer 32 of the third isolation pillar 30.

It should be noted that, reference may be made to fig. 5 and the foregoing processes, structures and principles of the display area in the present embodiment, and details thereof are not repeated herein.

The structure of the encapsulation layer 15 according to the embodiment of the invention shown in fig. 3 can refer to the structure of the encapsulation layer 15 shown in fig. 2, for example, the encapsulation material layer 35 formed on the fourth isolation pillar 30, the first inorganic material layer 1511 formed between the display area AA, and the intercepting area DD and covering the encapsulation area 151, the organic material layer 1512, and the second inorganic material layer 1513 in fig. 3, and related parts can be referred to and are not described herein again.

It should be further noted that the display substrate of the present embodiment is still suitable for the above-mentioned stacked structure design of the non-display area, that is: in the direction from the display area AA to the cathode overlapping area BB, a driving unit 141, a power supply line 16, a crack detection line 17, and a crack stopper 18 are provided in this order on the substrate 11. The driving unit 141 is provided with a stacked structure of a cathode overlapping region BB and a first barrier region CC, and an intercepting region DD surrounding the first barrier region CC. A covering and packaging area 151 is arranged on the display area AA, the cathode overlapping area BB, the first barrier area CC and the interception area DD; a barrier packaging area 152 with a tooth-shaped structure is arranged above the power supply trace 16, the crack detection line 17 and the crack blocking portion 18.

As shown in fig. 4, fig. 4 is a schematic structural diagram of a display substrate according to another embodiment of the present invention, and the structure thereof will now be described.

In an alternative embodiment, as shown in fig. 4, the first barrier region CC is arranged between the cathode landing zone BB and the substrate 11 of the display substrate,

the first barrier region CC comprises at least:

a seventh material layer 41 disposed on the substrate 11, an

An eighth material layer 42 disposed on the seventh material layer 41;

the first barrier region CC further includes a first groove structure 43 recessed in a direction from a surface of the seventh material layer 41 away from the substrate 11 toward the eighth material layer 42, wherein the first groove structure 43 penetrates through the eighth material layer 42 and does not penetrate through the seventh material layer 41; the anode metal layer 121 is disposed on the surfaces of the eighth material layer 42 and the seventh material layer 41 that leak out of the first groove structure 43 on the side away from the substrate 11.

As shown in fig. 4, 4 first groove structures 43 are disposed outside the display area AA, and are sequentially disposed in the direction from the display area AA to the cathode overlapping area BB, surrounding the display area AA. Illustratively, the depth of each first groove structure 43 is 1-3um, preferably 1.2-2um, and in this embodiment, the depth of the first groove structure 43 is a length of a recess of the surface of the eighth material layer 42 on a side away from the substrate 11 toward the substrate 11. Illustratively, each of the first groove structures 43 has a width dimension in a direction from the display area AA to the cathode overlapping area BB of 3 to 20um, preferably 5 to 10 um.

The number and size of the first groove structures 43 are not limited by the present invention, and those skilled in the art can design the number and size of the first groove structures 43 according to the projection of the cathode overlapping area BB, which will not be described herein. When the encapsulating region 151 above the first groove structure 43 is manufactured, the recessed opening of the first groove structure 43 of the present embodiment can accommodate the encapsulating material covering the encapsulating region 151, thereby preventing the encapsulating material from overflowing.

In an alternative embodiment, as shown in fig. 5, the projection of the opening of the first groove structure 43 on the substrate 11 of the seventh material layer 41 covers the projection of the opening of the first groove structure 43 on the substrate 11 of the eighth material layer 42, so that the cathode metal layer 131 of the cathode landing zone BB formed on the first barrier zone CC is cut off.

In this embodiment, the size of the opening of the first groove structure 43 on different material layers is designed, so that the opening of the eighth material layer 42 on the upper layer in the stacked structure is smaller than the opening of the seventh material layer 41 on the lower layer, thereby forming the first groove structure 43 with an undercut structure, as shown in fig. 5, for the first groove structure 43, the sidewall of the opening of the eighth material layer 42 on the upper layer protrudes outward compared with the sidewall of the opening of the seventh material layer 41 on the lower layer, so as to form a shielding structure similar to an "eave", that is, the undercut structure of this embodiment. With this arrangement, the cathode metal layer 131 formed on the first groove structure 43 is cut off, thereby cutting off the path of water and oxygen intrusion, and the design further improves the water and oxygen resistance of the display substrate and improves the packaging performance.

In an optional embodiment, the etching speed of the seventh material layer 41 is greater than the etching speed 42 of the eighth material layer, and in this embodiment, by designing the materials of the two material layers of the first groove structure 43 and utilizing the characteristics of the two materials that the etching speeds are different, when an etching process is performed, the etched area of the seventh material layer 41 located below is larger, and the etched area of the eighth material layer 42 located above is smaller, so that the first groove structure 43 having an undercut structure can be formed. In one specific example, the amount of undercut of seventh material layer 41 is 0.2-2um, preferably 0.3-0.5 um.

In an alternative embodiment, the seventh material layer 41 is a planarization material layer 241 disposed on the same layer 24 as the planarization layer of the display area AA. In this embodiment, the conventional process for forming the planarization layer 24 is utilized, and the seventh material layer 41 of the first groove structure 43 is formed simultaneously during the process flow, that is, the planarization material layer 241 of the non-display region is used as the seventh material layer 41 in this embodiment, so as to simplify the process flow.

In an alternative embodiment, an eighth material layer 42 is disposed on the planarization material layer 241 as the seventh material layer 41, and the eighth material layer 42 is a passivation layer disposed on the planarization material layer 241, and the passivation layer can be used as both the eighth material layer and a hard mask for etching the seventh material layer. For example, the gas for etching the upper eighth material layer 42 may be CHF3, the gas for etching the lower seventh material layer 41 may be mainly O2, and when the seventh material layer 41 is etched, the eighth material layer 42 may serve as a hard mask to perform the etching of the seventh material layer 41, so that the opening of the first groove structure 43 formed by the seventh material layer 41 is larger than the opening of the first groove structure 43 formed by the eighth material layer 42, thereby forming an undercut structure of the first groove structure 43, so that the cathode metal layer 131 disposed above the eighth material layer 42 is cut.

In another alternative embodiment, the first groove structure 43 further includes a dielectric layer (not shown in fig. 4) between the seventh material layer 41 and the eighth material layer 42, that is, the first groove structure 43 of this embodiment includes at least two or more film layers, and when the first groove structure 43 is two or more film layers, a dielectric layer is further disposed between the seventh material layer 41 and the eighth material layer 42, and for example, the dielectric layer of this embodiment may be disposed in the same layer as the insulating layer, the inorganic layer, the organic layer or the metal layer disposed on the planarization layer 24 in the display area AA, that is, the present embodiment does not limit the specific number of layers of the first groove structure 43, the upper layer forms a convex shape of the undercut structure, and the lower layer forms a concave shape of the undercut structure, so as to cut off the cathode metal layer 131 and improve the water and oxygen resistance as a design criterion, which is not described herein again.

For example, the material layer of the first groove structure on the side far from the substrate is an inorganic layer, a metal layer, an alloy layer, or an organic layer, and the material layer of the first groove structure on the side near the substrate is an organic layer, an inorganic layer, or the like.

As shown in fig. 4, the cathode metal layer 131 is cut by the continuous first groove structure 43, and in order to avoid the above problem, considering that the cut cathode metal layer 131 may cause the abnormal lapping of the cathode lapping region BB, in an alternative embodiment, the projection of the first barrier region CC on the substrate 11 is an annular structure with a gap for electrically connecting the cathode metal layer 131 cut by the first barrier region CC at the gap.

As shown in fig. 7, the first groove structure 43 surrounds the display area AA, the intercepting area DD surrounds the first barrier area CC formed by the first groove structure 43, and the second groove structure 44 of the barrier encapsulation area 152 of the encapsulation layer is disposed around the intercepting area DD. In the present embodiment, the first groove structure 43 designed around the display area AA is designed to be a notch, which is exemplarily disposed at the lower frame of the display substrate, and the disconnected cathode metal layer 131 is connected at the notch, that is, although the first groove structure 43 of the present embodiment disconnects the cathode metal layer in the direction from the display area AA to the cathode overlapping area BB shown in fig. 7, the first groove structure 43 is designed to be a notch, so that the cathode metal layer 131 is reconnected again, the overlapping area and the contact resistance of the cathode overlapping area BB are ensured, and on the basis of ensuring good normal display and water and oxygen corrosion resistance, the influence of IR drop can be reduced, and the overall performance of the display substrate can be further improved.

In an alternative embodiment, as shown in fig. 4, the blocking encapsulation region 152 having the tooth structure includes:

at least two second groove structures 44 arranged in a direction from the display area AA to the cathode overlapping area BB, the second groove structures 44 being arranged in the same layer as the first groove structures 43; and

and an encapsulation material layer 45 covering the second groove structure 44, wherein the encapsulation material layer 45 is a tooth-shaped structure with an undercut structure.

In this embodiment, the second groove structure 44 and the first groove structure 43 are disposed in the same layer, that is, in the process flow of forming the first groove structure 43, the second groove structure 44 is formed at the same time, and therefore, the second groove structure 44 of this embodiment has the same structure as the first groove structure 43.

That is, the second groove structure 44 also has the seventh material layer 41 and the eighth material layer 42 disposed on the seventh material layer 41, and likewise, a projection of the opening of the second groove structure 44 on the substrate 11 covers a projection of the opening of the second groove structure 44 on the substrate 44 of the eighth material layer 42, thereby forming the second groove structure 44 with an undercut structure.

As shown in fig. 4, the second groove structure 44 of the blocking encapsulation region 152 serves as a base of the encapsulation structure, so that the encapsulation material layer 45 disposed on the second groove structure 44 is an undercut structure formed according to the second groove structure 44, and the entire blocking encapsulation region 152 is similar to a tooth-shaped structure, which can prevent further expansion of cracks when cracks are generated at the edge of the display substrate, thereby improving crack resistance and product reliability of the display substrate.

In this embodiment, the manufacturing process, and the material selection of the second groove structure 44 of the blocking packaging region 152 of the packaging layer 15 may be the same as those of the first groove structure 43 of the first blocking region CC, and the specific principle and the process may refer to the first groove structure 43 described above, which are not described herein again. In this embodiment, the number of the second groove structures 44 can be designed according to practical applications, and is not described herein again.

In the embodiment where the encapsulant layer 45 of the second groove structure 44 is disposed on the same layer as the material layer covering the encapsulation region 151, the encapsulant layer 45 of the barrier encapsulation region 152 may include two inorganic material layers disposed in a stacked manner, and these two inorganic material layers may be formed on the same layer as the first inorganic material layer 1511 and the second inorganic material layer 1513 covering the encapsulation region 151. In this regard, reference may be made to the discussion of the overlay encapsulation region 151 and the barrier encapsulation region 152 in the previous embodiments, which are not repeated herein.

Now, a manufacturing process of the display substrate having the first groove structure 43 and the second groove structure 44 will be described by taking the display substrate shown in fig. 4 as an example.

The display area of the present embodiment can refer to the display substrate shown in fig. 2 and fig. 3 and fig. 5, and related processes and structural association parts can be referred to, which are not described herein again.

In this embodiment, the non-display area of the display substrate shown in fig. 4 further includes:

the planarization material layer 241 disposed on the same layer 24 as the planarization layer, in this embodiment, the planarization material layer 241 can be used as the seventh material layer 41 of the second groove structure, so as to save the process flow.

The eighth material layer 42 disposed on the planarization layer 41 as the seventh material layer has a first groove structure 43 formed in a direction from the seventh material layer 41 toward the eighth material layer 42 away from the substrate-side surface, and the first groove structure 43 penetrates the eighth material layer 42 and does not penetrate the seventh material layer 41, ensuring an insulating partition from the driving unit 141 disposed below the seventh material layer 41. In one specific example, during the process of forming the first recess structure 43, the second recess structure 44 in the barrier encapsulation region 152 is also formed.

The anode metal layer 131 is disposed on the surfaces of the eighth material layer 42 and the seventh material layer 41 that leak out of the second groove structure 44 on the side away from the substrate 11;

the cathode metal layer 131 disposed on the anode metal layer 121 and the intercepting material layer 251, the first groove structure 43 such that the cathode metal layer 131 is cut off.

A blanket encapsulation area 151 disposed on the cathode metal layer 131, and an encapsulation material layer 45 disposed on the second groove structure 44 of the barrier encapsulation area 152. Illustratively, the encapsulation material layer 45 covering the encapsulation region 151 and the encapsulation material layer 45 formed on the second groove structure 44 are disposed in the same layer. That is, the names and functions of the overlay packaging region and the barrier packaging region are different, but in an actual process, the packaging material layers of the packaging structure (including the display region and the non-display region) of the present embodiment may be formed by the same process.

It should be noted that the driving unit, the power trace, the crack detection line and the crack detection unit in the embodiments of the present invention are also applicable to the embodiments of the present invention, and reference may be made to the above description for relevant parts, which are not described herein again.

As shown in fig. 2 to 4, in the present embodiment, a display substrate of a stacked design is formed by the structural design of the display substrates of the three embodiments, and the driving unit 141, the power supply line 16, the crack detection line 17, and the crack stopper 18 are sequentially provided on the substrate 11 in the direction from the display area AA to the cathode landing area BB. A stacked structure formed by a cathode overlapping area BB and a first barrier area CC and an intercepting area DD surrounding the first barrier area CC are disposed on the driving unit 141, and a cover packaging area 151 is disposed on the display area AA, the cathode overlapping area BB, the first barrier area CC and the intercepting area DD; a barrier encapsulation area 152 is provided above the power traces 16, the crack detection lines 17 and the crack barriers 18.

By using the edge design of the stacked structure of the present embodiment, the frame size of the display substrate can be reduced to less than 0.6mm, and more preferably, less than 0.5 mm. Compared with the related art shown in fig. 1, the frame size needs a display substrate of 0.9-1.5mm, which reduces the frame length by about half.

In accordance with another embodiment of the present invention, a method for manufacturing the display substrate is provided, as shown in fig. 8, the method includes:

s1, forming a display area AA and a cathode overlapping area BB surrounding the display area AA on the substrate 11;

s2, forming a first blocking area CC surrounding the display area AA on the substrate 11 of the display substrate, wherein the projection of the cathode overlapping area BB on the substrate 11 covers the projection of the first blocking area CC on the substrate 11.

The display substrate formed based on the process has the advantages that the cathode overlapping area and the first blocking area are formed in the same area of the edge of the display substrate, so that the edge size of the display substrate can be reduced on the basis of ensuring normal display of the display substrate, and the narrow frame design is realized.

Considering that the edge region of the display substrate is further provided with other structures, in an alternative embodiment, as shown in fig. 9, the method further includes:

s3, forming an intercepting region DD surrounding the first barrier region CC, wherein the intercepting region DD is disposed between the anode metal layer 121 and the cathode metal layer 131, and a projection of the cathode overlapping region BB on the substrate 11 covers a projection of the intercepting region DD on the substrate 11.

In the display substrate formed by the method of the embodiment, the first barrier region CC is formed at the projection position of the cathode overlapping region BB, and the interception region DD surrounding the first barrier region CC is formed at the projection position of the cathode overlapping region BB, so that the edge size of the display substrate can be further reduced on the basis of ensuring normal display of the display substrate, and a better narrow frame design is realized.

In an optional embodiment, the method further comprises:

s4, forming the encapsulation layer 15, wherein the encapsulation layer 15 includes: a cover sealing region 151 covering the display region AA, the cathode overlapping region BB, and the intercepting region DD, and a barrier sealing region 152 having a tooth structure surrounding the intercepting region DD.

The packaging layer with the tooth-shaped structure formed by the method can further prevent water and oxygen from entering, improve the overall packaging performance of the display substrate, anchor the packaging layer, prevent crack propagation and enable the display panel to have good fracture resistance.

FIG. 10 illustrates a method corresponding to the structure of the display substrate shown in FIG. 2, in an alternative embodiment, prior to the forming the encapsulation layer, the method further includes:

forming a layer of planarizing material 241 disposed in a same layer as the planarizing layer 24:

forming an anode metal layer 121 disposed on the planarization material layer 241 in the same layer as the anode layer 12;

forming an intercepting material layer 254 of an intercepting region DD disposed on the same layer as the pixel defining layer 25 on the anode metal layer 121;

forming the first isolation pillar 20 on the anode metal layer 131;

and forming a cathode metal layer 131 which is arranged in the same layer as the cathode layer 13 and covers the anode metal layer 121 and the surface of the first isolation column 20 far away from the substrate 11.

It should be noted that the principle and the working flow of the manufacturing method of the display substrate provided in this embodiment are similar to those of the display substrate described above, and the above description may be referred to for relevant parts, and are not repeated herein.

Fig. 11 illustrates a method corresponding to the structure of the display substrate shown in fig. 3, which in an alternative embodiment, prior to forming the encapsulation layer 15, further comprises:

forming a layer of planarizing material 241 disposed in a same layer as the planarizing layer 24: forming a fourth material layer 31 of the third isolation pillar 30 on the planarization material layer 241, the fourth material layer 31 serving as the anode metal layer 121 of the cathode landing zone BB;

forming an intercepting material layer 251 of an intercepting region DD disposed in the same layer as the pixel defining layer 25 on the fourth material layer 31;

forming a fifth material layer 32 and a sixth material layer 33 of the third isolation pillar 30 on the fourth material layer 31 in sequence;

and forming a cathode metal layer 131 which is arranged in the same layer as the cathode layer 13 and covers the surface of the fourth material layer 31 and the sixth material layer 33 far away from the substrate 11.

It should be further noted that the principle and the working flow of the method of the display substrate provided in this embodiment are similar to those of the display substrate described above, and reference may be made to the above description for relevant points, which are not repeated herein.

Fig. 12 illustrates a method corresponding to the structure of the display substrate shown in fig. 4, which in an alternative embodiment, before forming the encapsulation layer 15, further comprises:

forming the seventh material layer 41 on the substrate 11, where the seventh material layer 41 is a planarization material layer 241 disposed on the same layer as the planarization layer 24 of the display area AA;

forming the eighth material layer 42 on the seventh material layer 41; forming a first groove structure 43 in a direction from a surface of the seventh material layer 41 away from the substrate 11 toward the eighth material layer 42, the first groove structure 43 penetrating the eighth material layer 42 and not penetrating the seventh material layer 41;

forming the anode metal layer 131 on the surfaces of the eighth material layer 42 and the seventh material layer 41 leaking out of the first groove structure 43 on the side away from the substrate 11;

forming an intercepting material layer 251 of the intercepting region DD on the anode metal layer 121;

the cathode metal layer 131 is formed on the anode metal layer 121 and the intercepting material layer 251, and the cathode metal layer 131 is cut by the first groove structure 43.

The size of the frame of the display substrate with the stacked design formed by the method of the embodiment of the invention can be reduced to below 0.6mm, and more preferably below 0.5 mm. Compared with the related art shown in fig. 1, the frame size needs 0.9-1.5mm of display substrate, which reduces the frame length by about half and is beneficial to realizing narrow frame design.

Another embodiment of the present invention provides a display device, including the display substrate according to the above embodiments of the present invention, which can be any product or component requiring a backlight source, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, a vehicle-mounted center console, and an ink screen.

It is further noted that, in the description of the present invention, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the invention and are not intended to limit the embodiments of the present invention, and that various other modifications and variations can be made by one skilled in the art in light of the above description.

Claims

1. A display substrate, comprising a display area and a cathode overlapping area surrounding the display area,

2. The display substrate of claim 1,

the cathode lap joint area comprises a cathode metal layer arranged on the same layer as the cathode layer of the display area and an anode metal layer arranged on the same layer as the anode layer of the display area;

the display substrate further includes:

3. The display substrate of claim 2, further comprising an encapsulation layer, the encapsulation layer comprising:

a cover encapsulation region for covering the display region, the cathode overlapping region, and the intercepting region; and

4. The display substrate according to claim 2 or 3,

the display area includes:

a driver circuit layer provided on the substrate:

a planarization layer disposed on the driving circuit layer:

the cathode overlapping area and the intercepting area are disposed in a non-display area of the display substrate, and the non-display area includes:

5. The display substrate according to claim 4, wherein the first barrier region is disposed between the anode metal layer and the cathode metal layer, and the first barrier region comprises at least one first isolation pillar having an undercut structure sequentially arranged in a direction from the display region to the cathode overlapping region;

wherein the first isolation pillar having an undercut structure includes:

a second layer of material disposed on the first layer of material; and

6. The display substrate of claim 5, wherein the barrier encapsulation region having the tooth structure comprises:

the second isolation column and the first isolation column are arranged on the same layer, and the packaging material layer arranged on the second isolation column and the material layer covering the packaging area are arranged on the same layer.

7. The display substrate according to claim 6, wherein the non-display region further comprises: an anode metal layer disposed on the same layer as the anode layer;

the first isolation column is arranged on the anode metal layer;

and the cathode metal layer is arranged on the same layer as the cathode layer and covers the anode metal layer and the cathode metal layer covering the surface of one side, far away from the substrate, of the first isolation column.

8. The display substrate according to claim 4, wherein the first barrier region is disposed between the cathode metal layer and the substrate, and the first barrier region comprises at least one third isolation pillar having an undercut structure sequentially arranged along a direction from the display region to the cathode overlapping region;

wherein the third isolation pillar having an undercut structure includes:

a fifth material layer disposed on the fourth material layer;

the sixth material layer cuts off the cathode metal layer, and the cathode metal layer is electrically connected with a fourth material layer serving as the anode metal layer through the sixth material layer and the fifth material layer.

9. The display substrate of claim 8, wherein the barrier encapsulation region having the tooth structure comprises:

10. The display substrate according to claim 9, wherein the non-display region further comprises:

and the cathode metal layer is arranged on the same layer as the cathode layer and covers the surfaces of one sides, far away from the substrate, of the fourth material layer and the sixth material layer.

11. The display substrate of claim 4, wherein the first barrier region is disposed between the cathode landing region and a substrate of the display substrate,

the first barrier region comprises at least:

a seventh material layer disposed on the substrate, an

An eighth material layer disposed on the seventh material layer;

or

12. The display substrate of claim 11, wherein the projection of the opening of the first groove structure on the substrate of the seventh material layer covers the projection of the opening of the first groove structure on the substrate of the eighth material layer, such that the cathode metal layer of the cathode landing zone formed on the first barrier zone is cut off;

the projection of the first barrier region on the substrate is an annular structure with a notch, and the annular structure is used for electrically connecting the cathode metal layer cut off by the first barrier region at the notch.

13. The display substrate of claim 12, wherein the barrier encapsulation region having the tooth structure comprises:

the second groove structure and the first groove structure are arranged on the same layer, and the packaging material layer arranged on the second groove structure and the material layer covering the packaging area are arranged on the same layer.

14. The display substrate according to any one of claims 1 to 13,

the display substrate further includes:

the driving unit is arranged between the cathode lap joint area and the substrate, the projection of the cathode lap joint area on the substrate covers the projection of the driving unit on the substrate, and the driving unit and the driving circuit layer of the display area are arranged in the same layer;

or

The display substrate further includes:

the projection of the blocking packaging area on the substrate covers the projection of the crack detection line on the substrate, and the crack detection line and the power supply wiring are arranged on the same layer;

15. A method for manufacturing the display substrate according to any one of claims 1 to 14, comprising:

forming a first barrier region surrounding the display region on a substrate of the display substrate, wherein a projection of the cathode overlapping region on the substrate covers a projection of the first barrier region on the substrate;

or

The method further comprises the following steps:

or

The method further includes forming the encapsulation layer, the encapsulation layer including: the barrier packaging region is formed by covering the display region, the cathode overlapping region, the blocking region and the blocking region, wherein the blocking packaging region is formed by covering the cathode overlapping region, the blocking packaging region is formed by covering the blocking region, and the blocking packaging region is formed by surrounding the blocking region and has a tooth-shaped structure.

16. A display device comprising the display substrate according to any one of claims 1 to 14.