CN114990493A - Evaporation coating device and coating method thereof - Google Patents
Evaporation coating device and coating method thereof Download PDFInfo
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- CN114990493A CN114990493A CN202210719810.7A CN202210719810A CN114990493A CN 114990493 A CN114990493 A CN 114990493A CN 202210719810 A CN202210719810 A CN 202210719810A CN 114990493 A CN114990493 A CN 114990493A
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- 238000001704 evaporation Methods 0.000 title claims abstract description 303
- 230000008020 evaporation Effects 0.000 title claims abstract description 295
- 238000000576 coating method Methods 0.000 title claims abstract description 77
- 239000011248 coating agent Substances 0.000 title claims abstract description 68
- 230000005540 biological transmission Effects 0.000 claims abstract description 7
- 235000012431 wafers Nutrition 0.000 claims description 32
- 239000000463 material Substances 0.000 claims description 20
- 238000007740 vapor deposition Methods 0.000 claims description 17
- 239000000919 ceramic Substances 0.000 claims description 10
- 238000007747 plating Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 6
- 238000010025 steaming Methods 0.000 claims description 2
- 238000009834 vaporization Methods 0.000 abstract description 40
- 230000008016 vaporization Effects 0.000 abstract description 40
- 239000002184 metal Substances 0.000 abstract description 11
- 229910052751 metal Inorganic materials 0.000 abstract description 11
- 230000000694 effects Effects 0.000 description 4
- 239000012528 membrane Substances 0.000 description 4
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
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- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The application discloses an evaporation coating device which comprises an evaporation cavity, an evaporation source, a plurality of evaporation pots, an evaporation pot revolution driving assembly and an evaporation pot rotation driving assembly; the evaporation source is arranged at the bottom of the evaporation cavity, and the evaporation pot revolution driving assembly is arranged at the top of the evaporation cavity and drives the evaporation pots to revolve around the central line of the evaporation source; one end of the evaporation pan autorotation driving assembly is connected with the evaporation pan revolution driving assembly, and the other end of the evaporation pan autorotation driving assembly is in transmission connection with the evaporation pan to control the evaporation pan to autorotate; wherein, the revolution drive assembly of the evaporation pot and the rotation drive assembly of the evaporation pot respectively and independently control the revolution and the rotation of the evaporation pot. This application carries out the rotation through setting up the direct coating by vaporization pot rotation drive assembly who is connected with the coating by vaporization pot control coating by vaporization pot, need not to set up the track that drives the coating by vaporization pot rotation, produces metal debris with the track friction when avoiding the coating by vaporization pot to rotate, reduces the comprehensive yield of product.
Description
Technical Field
The application relates to the technical field of evaporation, in particular to an evaporation coating device and a coating method thereof.
Background
The vapor deposition is a process of forming a film on the surface of an object to be vapor-deposited by converting a vapor deposition material into a gas molecule vapor deposition material, wherein the gas molecule vapor deposition material moves in a vacuum environment and is attached to the surface of the object to be vapor-deposited.
When the existing evaporation equipment is used for evaporating wafers, the wafers are placed on an evaporation pot, the evaporation pot is driven by an rotation motor to rotate and revolve, so that the wafers are driven to rotate and revolve, in order to realize the rotation of the evaporation pot, a track for driving the evaporation pot to rotate is arranged in an evaporation cavity, but when the evaporation pot rotates, metal fragments are easily generated by friction with the track, and the comprehensive yield of products is reduced.
Disclosure of Invention
In view of the above, an object of the present invention is to provide an evaporation coating apparatus and a coating method thereof, which are used to solve the problem of debris generated by friction between an evaporation pan and a track, and improve the overall yield of products.
In order to achieve the purpose, the application provides an evaporation coating device which comprises an evaporation cavity, an evaporation source, a plurality of evaporation pots, an evaporation pot revolution driving assembly and an evaporation pot rotation driving assembly; the evaporation source is arranged at the bottom of the evaporation cavity and used for converting an evaporation material into a gas molecule evaporation material, and the gas molecule evaporation material moves in the evaporation cavity to form an evaporation area; the plurality of evaporation pots are arranged corresponding to the evaporation area; the evaporation pot revolution driving assembly is arranged at the top of the evaporation cavity and drives the evaporation pots to revolve around the central line of the evaporation source; one end of the evaporation pan autorotation driving assembly is fixedly connected with the evaporation pan revolution driving assembly, and the other end of the evaporation pan autorotation driving assembly is in transmission connection with the evaporation pan to control the evaporation pan to autorotate; the vapor deposition pot revolution driving assembly and the vapor deposition pot rotation driving assembly respectively and independently control the revolution and the rotation of the vapor deposition pot.
Optionally, the evaporation pan revolution driving assembly comprises a revolution motor arranged at the top of the evaporation cavity, a planet disc in driving connection with the revolution motor, and a first support arm in connection with the planet disc; the evaporation pot rotation driving assembly comprises a rotation motor and a second supporting arm, one end of the rotation motor is connected with the first supporting arm, and the other end of the rotation motor is connected with the second supporting arm; one end of the second supporting arm is connected with the rotation motor, and the other end of the second supporting arm is fixedly connected with the evaporation pot.
Optionally, the planet dish is provided with three first support arm, the quantity of first support arm with the quantity of coating by vaporization pot is the same, and is three first support arm interval equals, and is three first support arm corresponds threely the coating by vaporization pot becomes equilateral triangle and sets up, and is three contained angle between two arbitrary coating by vaporization pots in the coating by vaporization pot equals, just contained angle less than or equal to 120 degrees, more than or equal to 30 degrees.
Optionally, the rotation motor comprises a rotation shaft, the evaporation pan is provided with a groove, and the rotation shaft penetrates through the groove and is fixed with a screw; be provided with the ceramic axle sleeve that does not have oil in the axis of rotation, the ceramic axle sleeve that does not have oil is established in the axis of rotation, just the ceramic axle sleeve that does not have oil is placed in the recess.
Optionally, the plurality of evaporation pots are the same in size, and wafers with different sizes are arranged in one surface, facing the evaporation source, of each evaporation pot with the same size; or the sizes of the plurality of evaporation pots are different, wafers with different sizes are arranged in one surface of the evaporation pot, which faces the evaporation source, and wafers with the same size are arranged in one surface of the same evaporation pot, which faces the evaporation source.
The application also provides a coating method of the evaporation coating device, which is used for any evaporation coating device and comprises the following steps:
enabling the evaporation pan revolution driving assembly to operate and drive the evaporation pans to revolve around the evaporation source; and
enabling the evaporation pot autorotation driving assembly to operate and drive the corresponding evaporation pot to autorotate by taking the center of the evaporation pot as a circle center;
one end of the evaporation pot rotation driving assembly is connected with the evaporation pot revolution driving assembly, and the other end of the evaporation pot rotation driving assembly is in transmission connection with the evaporation pot to control the evaporation pot to rotate;
the vapor deposition pot revolution driving assembly and the vapor deposition pot rotation driving assembly respectively and independently control revolution and rotation of the vapor deposition pot.
Optionally, the step of operating the evaporation pot rotation driving assembly to drive the corresponding evaporation pot to rotate around the center of the evaporation pot as a circle center includes:
each evaporation pot autorotation driving component controls the autorotation speed of each corresponding evaporation pot to be different;
wherein, the size of the wafer on each evaporation pan is different.
Optionally, the step of making each evaporation pan autorotation driving assembly control the corresponding evaporation pan to have different autorotation speeds includes:
after the preset time is reached, the autorotation direction of the evaporation pot is automatically adjusted and changed;
the duration of the preset time is less than or equal to 1/2 of the total duration of the wafer film forming operation.
Optionally, the step of making the evaporation pan autorotation driving assembly operate to drive the corresponding evaporation pan to autorotate with the center of the evaporation pan as a circle center includes:
the time for each evaporation pot autorotation driving assembly to control the autorotation speed of each corresponding evaporation pot to reach the preset rotating speed is different;
in the plurality of steaming pots, the time for the evaporation pot with small volume to reach the preset speed is less than the time for the evaporation pot with large volume to reach the preset speed.
Optionally, the preset rotation speed ranges from 10rad/min to 20 rad/min.
For the track that is equipped with the rotation of drive coating by vaporization pot in the coating by vaporization cavity, this application provides an evaporation coating device, detach the track of original device, carry out the rotation through the coating by vaporization pot rotation drive assembly control coating by vaporization pot that sets up direct and coating by vaporization pot and be connected, produce metal debris with the track friction when avoiding the coating by vaporization pot rotation, reduce the granularity in coating film space, be favorable to improving the comprehensive yield of product, can also reduce the equipment trouble because of the track problem produces simultaneously.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application, are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the principles of the application. It is obvious that the drawings in the following description are only some embodiments of the application, and that for a person skilled in the art, other drawings can be derived from them without inventive effort. In the drawings:
FIG. 1 is a schematic view of an evaporation coating apparatus according to a first embodiment of the present application;
FIG. 2 is a schematic view of an evaporation pan of an evaporation coating device according to a first embodiment of the present application;
FIG. 3 is a schematic view of a coating method according to a second embodiment of the present application;
FIG. 4 is a schematic view of a coating method according to a third embodiment of the present application;
FIG. 5 is a schematic view of a fourth embodiment of the present application.
100, an evaporation coating device; 110. evaporating a cavity; 120. a vapor deposition source; 121. a centerline; 122. an evaporation area; 130. evaporating a pot; 131. evaporating and plating the surface; 132. an inner concave surface; 140. a revolution driving component of the evaporation pan; 141. a planetary plate; 142. a first support arm; 143. a revolution motor; 150. the self-rotation driving assembly of the evaporation pot; 151. a rotation motor; 152. a second support arm; 153. a housing; 154. a rotation shaft; 155. an oilless ceramic bushing; 160. and (5) a wafer.
Detailed Description
It is to be understood that the terminology, the specific structural and functional details disclosed herein are for the purpose of describing particular embodiments only, and are representative, but that the present application may be embodied in many alternate forms and should not be construed as limited to only the embodiments set forth herein.
In the description of the present application, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating relative importance or as implicitly indicating the number of technical features indicated. Thus, unless otherwise specified, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature; "plurality" means two or more. The terms "comprises" and "comprising," and any variations thereof, are intended to cover a non-exclusive inclusion, such that one or more other features, integers, steps, operations, elements, components, and/or combinations thereof may be present or added.
Further, terms of orientation or positional relationship indicated by "center", "lateral", "upper", "lower", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, are described based on the orientation or relative positional relationship shown in the drawings, are simply for convenience of description of the present application, and do not indicate that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present application.
Furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "coupled" are to be construed broadly and encompass, for example, both fixed and removable coupling as well as integral coupling; can be mechanically or electrically connected; either directly or indirectly through intervening media, or through both elements. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
The present application is described in detail below with reference to the figures and alternative embodiments.
As shown in fig. 1, the present application discloses an evaporation coating device 100, the evaporation coating device 100 includes an evaporation cavity 110, an evaporation source 120, a plurality of evaporation pots 130, an evaporation pot revolution driving assembly 140, and an evaporation pot rotation driving assembly 150; the evaporation source 120 is arranged at the bottom of the evaporation cavity 110 and is used for converting an evaporation material into a gas molecule evaporation material, and the gas molecule evaporation material moves in the evaporation cavity 110 to form an evaporation region 122; the plurality of evaporation pans 130 are arranged corresponding to the evaporation area 122; the evaporation pan revolution driving assembly 140 is disposed at the top of the evaporation chamber 110, and drives the plurality of evaporation pans 130 to revolve around the central line 121 of the evaporation source 120; one end of the evaporation pan rotation driving assembly 150 is fixedly connected with the evaporation pan revolution driving assembly 140, and the other end is in transmission connection with the evaporation pan 130 to control the evaporation pan 130 to rotate; the evaporation pan revolution driving assembly 140 and the evaporation pan rotation driving assembly 150 respectively and independently control the revolution and rotation of the evaporation pan 130.
The boundary line of the evaporation region of the evaporation source 120 passes through the path through which the center point of the evaporation pan 130 revolves to form a circular track; the gas molecule evaporation material generated by the evaporation source 120 is mainly concentrated in the central part, and when the boundary line of the evaporation region 122 of the evaporation source 120 passes through the circular orbit of the revolution of the central point of the evaporation pan 130, the evaporation material can be utilized to the maximum extent on the premise of ensuring the uniformity of the coating film; this application corresponds every coating by vaporization pot and all is equipped with a coating by vaporization pot rotation drive assembly 150, drives through coating by vaporization pot rotation drive assembly 150 coating by vaporization pot 130 carries out the rotation, need not to set up the rotation that the track realized coating by vaporization pot 130, avoids coating by vaporization pot 130 and track contact friction when rotatory to produce metal debris, influence the effect of filming.
Further, the evaporation pan revolution driving assembly 140 includes a revolution motor 143 disposed at the top of the evaporation cavity 110, a planetary plate 141 in driving connection with the revolution motor 143, and a first support arm 142 connected with the planetary plate 141; the evaporation pan rotation driving assembly 150 comprises a rotation motor 151 and a second support arm 152, wherein one end of the rotation motor 151 is connected with the first support arm 142, and the other end of the rotation motor is connected with the second support arm 152; one end of the second supporting arm 152 is connected to the rotation motor 151, and the other end is fixedly connected to the evaporation pot 130; the center of the planetary plate 141 corresponds to the evaporation source 120, the evaporation pot 130 is disposed around the evaporation source 120 with the evaporation source as the center, and the planetary plate 141 is connected with the evaporation pot 130 through the corresponding support arm to realize revolution.
Referring to fig. 1 to 2, in order to realize rotation, the arm end device of the planetary plate may drive the rotation motor 151 of the plating pot to rotate, so as to remove the original orbit, and the rotation of the plating pot is not affected while the evaporation pot 130 revolves around the planetary plate; the rotation and the public do not influence each other; the revolution and rotation directions can be the same or different, and can be adjusted according to the actual film forming condition; for example, the rotation direction can be changed in the middle of autorotation, and trapezoidal deviation of the formed film is improved; in addition, because the rotation motor is added, the original track is removed, and the evaporation pot 130 can not contact with any metal device when the evaporation pot rotates, thereby avoiding the collision and friction between the evaporation pot and the metal device and avoiding metal trivial details from entering the wafer to influence the film forming quality.
In addition, in addition to avoiding metal trivial details caused by friction among other metals, the shell 153 is further arranged corresponding to the rotation motor 151, when the rotation motor 151 rotates, the generated debris is blocked by the shell 153, and is prevented from entering the evaporation region 122 and depositing on the wafer 160 along with the evaporation source material; the rotation motor 151 comprises a rotation shaft 154, the evaporation pan 130 is provided with a groove, and the rotation shaft 154 penetrates through the groove and is fixed with a screw; be provided with oil-free ceramic axle sleeve 155 on the axis of rotation 154, oil-free ceramic axle sleeve 155 cover is established on the axis of rotation 154, just oil-free ceramic axle sleeve 155 is placed in the recess, the triquetrous problem of metal that the friction between axis of rotation 154 and the coating by vaporization pot 130 brought has further been avoided.
Generally, the planet dish is provided with three first support arm 142, first support arm 142's quantity with the quantity of coating by vaporization pot 130 is the same, and is three first support arm 142 interval equals, and is three first support arm 142 corresponds threely the coating by vaporization pot 130 becomes equilateral triangle and sets up, and is three contained angle between two arbitrary coating by vaporization pots in coating by vaporization pot 130 equals, just contained angle less than or equal to 120 degrees, and more than or equal to 30 degrees set up through triangle-shaped can make the coating by vaporization rotate the in-process more stable, and the contained angle between the control coating by vaporization pot is too big in order to avoid the gap between the coating by vaporization pot to cause the waste of coating by vaporization source material in addition.
The evaporation pan is a planetary pan, a pan or a gear-shaped pan; the evaporation pot comprises an evaporation surface, the evaporation surface is the evaporated surface of the evaporation pot, the end surface of the evaporation surface is circular, the evaporation surface comprises an inner concave surface formed by sinking one side of the end surface, which is inwards far away from the end surface, and a wafer is arranged on the inner concave surface; the evaporation source is positioned in the center of the area of the evaporation pot formed by all the evaporation pots, and the molecular material in the evaporation source diffuses to the wafers of all the evaporation pots all around.
The shapes and sizes of the plurality of evaporation pots in the same evaporation cavity can be the same or different, and if the sizes of the plurality of evaporation pots are the same, wafers with different sizes are arranged in one surface, facing the evaporation source, of each evaporation pot with the same size; or the sizes of the evaporation pots are different, wafers with different sizes are arranged in one surface of the evaporation pot with different sizes, which faces the evaporation source, and wafers with the same size are arranged in one surface of the same evaporation pot, which faces the evaporation source; the evaporation pots with different sizes can generate wafers with different batches, and waste of time and cost caused by the fact that a plurality of different devices are used for producing the wafers with different batches is avoided.
As a second embodiment of the present application, as shown in fig. 3, the present application further provides a coating method of an evaporation coating apparatus, which is used for the evaporation coating apparatus according to any one of the above embodiments, and includes the steps of:
s1: enabling the evaporation pan revolution driving assembly to operate and drive the evaporation pans to revolve around the evaporation source; and
s2: enabling the evaporation pot autorotation driving assembly to operate and drive the corresponding evaporation pot to autorotate by taking the center of the evaporation pot as a circle center;
one end of the evaporation pot rotation driving assembly is connected with the evaporation pot revolution driving assembly, and the other end of the evaporation pot rotation driving assembly is in transmission connection with the evaporation pot to control the evaporation pot to rotate; the vapor deposition pot revolution driving assembly and the vapor deposition pot rotation driving assembly respectively and independently control revolution and rotation of the vapor deposition pot.
The rotation of the evaporation pot is independently controlled by adding the rotation driving assembly of the evaporation pot, so that a track is not required to be arranged in the evaporation coating device, the rotation of the evaporation pot is directly controlled by the rotation driving assembly of the evaporation pot, and metal scraps generated by friction between the evaporation pot and the track when the evaporation pot rotates are avoided from entering an evaporation area and being deposited on a wafer along with an evaporation source material, so that the comprehensive yield of products is reduced; the evaporation pot revolution driving assembly and the evaporation pot rotation driving assembly respectively and independently control revolution and rotation of the evaporation pot, and the evaporation pot rotation and the revolution are independent of each other, so that the rotation direction can be adjusted according to the film forming condition of the wafer, and the phenomenon that the revolution and the rotation generate a trapezoidal film layer in the same direction all the time is avoided.
As a third embodiment of the present application, the third embodiment is further limited to the second embodiment, and as shown in fig. 4, the step S2 includes the steps of:
s21: each evaporation pot autorotation driving component controls the autorotation speed of each corresponding evaporation pot to be different;
wherein the size of the wafer on each evaporation pot is different; the rotation speed of each evaporation pot is different, products with different film thicknesses and different precision can be obtained, and the quality of the obtained products is better when the evaporation pots rotate faster.
Because each evaporation pot is provided with an independent rotation motor to realize rotation, the rotation speed of each evaporation pot can be controlled, different rotation speeds are set, and products with different film thicknesses and different accuracies are obtained; in addition, the method is very efficient in the experimental stage of the product, in an evaporation coating device, as long as the rotation speeds of evaporation pots are adjusted to be different, several wafers formed due to different rotation speeds can be obtained after film forming is finished, then the product with the best quality is selected from the wafers, and then the product is produced in batches by adopting the rotation speed and the revolution speed of the product.
In order to further improve the film forming quality, the present application also discloses a film coating method based on the further improvement of the second embodiment and the third embodiment, as shown in fig. 5, in step S21, the method further includes the steps of:
s211: and after the preset time is reached, the autorotation direction of the evaporation pot is automatically adjusted and changed.
Every coating by vaporization pot can change pivoted direction in the midway of rotation, avoids the coating by vaporization pot to rotate towards same direction for produce trapezoidal skew after the wafer film forming, this application is reaching after predetermineeing the time, and the rotation direction produces the change, and on the thick direction that increases of orientation membrane originally, after changing the rotation direction, thick attenuate of membrane, and the thick increase of membrane in the opposite direction of the thick direction that increases of orientation membrane originally, compensate trapezoidal skew when the film forming.
The preset time may be calculated from the time required for producing the film thickness, and is generally 1/2 which is equal to or shorter than the time required for forming the film, for example, when the time required for forming the final film thickness of the wafer is 20 seconds, the preset time is equal to or shorter than 10 seconds, but since the material of the evaporation source is also reduced in the latter half of the film formation, the time period of the preset time is generally equal to or shorter than 10 seconds.
Further, make coating by vaporization pot rotation drive assembly operation work, drive the correspondence the coating by vaporization pot uses the center of coating by vaporization pot carries out the step of rotation as the centre of a circle and includes:
the time for each evaporation pot autorotation driving assembly to control the autorotation speed of each corresponding evaporation pot to reach the preset rotating speed is different;
among a plurality of the steamer, small the time that the coating by vaporization pot reaches predetermineeing speed is less than bulky the coating by vaporization pot reaches predetermineeing the time of speed, can go to correspond the speed that sets up the adjustment difference according to the size of coating by vaporization pot, also can go the speed and the direction that the adjustment that corresponds changes the coating by vaporization pot rotation according to the size of the wafer on the coating by vaporization pot simultaneously.
When the existing evaporation pot rotates, the value range of the preset rotating speed is 10rad/min to 20rad/min, the phenomenon that the rotating speed is too small to influence the film forming quality is avoided, meanwhile, the rotating speed is prevented from being too large, when reversing is carried out, the time required by deceleration is too long, the effect of improving the thickness of a trapezoidal film cannot be achieved, multiple tests prove that the film forming quality is high, when reversing rotation needs to be carried out, the rotation can be stopped within the preset time, and therefore reversing is achieved more quickly, and a wafer with the best film forming effect is obtained.
Certainly, the revolution can also be reversed except for the rotation, when the evaporation pot revolves to the preset time, the revolution direction can also be changed, meanwhile, the revolution speed is generally controlled to be 8rad/min to 12rad/min, the revolution and the rotation can simultaneously change the direction and synchronously rotate towards one direction, namely, when the evaporation pot rotates clockwise, the revolution of the evaporation pot is clockwise and synchronously rotate, and the phenomenon that the distribution of evaporation sources is influenced by airflow formed by different turning directions is avoided. In addition, the rotation and revolution can also change directions at different times, and can rotate towards different directions during rotation, namely when the evaporation pot rotates clockwise, the revolution of the evaporation pot is anticlockwise, and the self-rotation can be carried out according to the distribution condition of the evaporation source materials.
It should be noted that the inventive concept of the present application can form many embodiments, but the present application has a limited space and cannot be listed one by one, so that, on the premise of no conflict, any combination between the above-described embodiments or technical features can form a new embodiment, and after the embodiments or technical features are combined, the original technical effect will be enhanced.
The foregoing is a more detailed description of the present application in connection with specific alternative embodiments, and the specific implementations of the present application are not to be considered limited to these descriptions. For those skilled in the art to which the present application pertains, several simple deductions or substitutions may be made without departing from the concept of the present application, and all should be considered as belonging to the protection scope of the present application.
Claims (10)
1. An evaporation coating apparatus comprising:
evaporating a cavity;
the vapor plating source is arranged at the bottom of the vapor plating cavity and used for converting vapor plating materials into gas molecule vapor plating materials, and the gas molecule vapor plating materials move in the vapor plating cavity to form a vapor plating area; and
a plurality of evaporation pots which are arranged corresponding to the evaporation area;
it is characterized in that the evaporation coating device further comprises:
the evaporation pot revolution driving assembly is arranged at the top of the evaporation cavity and drives the evaporation pots to revolve around the central line of the evaporation source; and
one end of the evaporation pan autorotation driving component is fixedly connected with the evaporation pan revolution driving component, and the other end of the evaporation pan autorotation driving component is in transmission connection with the evaporation pan to control the evaporation pan to autorotate;
the vapor deposition pot revolution driving assembly and the vapor deposition pot rotation driving assembly respectively and independently control the revolution and the rotation of the vapor deposition pot.
2. The evaporation coating device according to claim 1, wherein the evaporation pan revolution driving assembly comprises a revolution motor arranged at the top of the evaporation chamber, a planetary plate in driving connection with the revolution motor, and a first support arm in connection with the planetary plate;
the evaporation pot rotation driving assembly comprises a rotation motor and a second supporting arm, one end of the rotation motor is connected with the first supporting arm, and the other end of the rotation motor is connected with the second supporting arm; one end of the second supporting arm is connected with the rotation motor, and the other end of the second supporting arm is fixedly connected with the evaporation pot.
3. The evaporation coating device according to claim 2, wherein the planetary plate is provided with three first support arms, the number of the first support arms is the same as the number of the evaporation pots, the three first support arms are spaced at equal intervals, the three evaporation pots corresponding to the three first support arms are arranged in an equilateral triangle, the included angle between any two evaporation pots in the three evaporation pots is equal, and the included angle is not less than 120 degrees and not more than 30 degrees.
4. The evaporation coating device of claim 2, wherein the rotation motor comprises a rotation shaft, the evaporation pan is provided with a groove, and the rotation shaft passes through the groove and is fixed with a screw; be provided with the ceramic axle sleeve that does not have oil in the axis of rotation, the ceramic axle sleeve that does not have oil is established in the axis of rotation, just the ceramic axle sleeve that does not have oil is placed in the recess.
5. The evaporation coating device according to claim 1, wherein the plurality of evaporation pots are the same in size, and wafers of different sizes are provided in a surface of each evaporation pot, which faces the evaporation source, the surface being the same in size;
or the sizes of the plurality of evaporation pots are different, wafers with different sizes are arranged in one surface of the evaporation pot, which faces the evaporation source, and wafers with the same size are arranged in one surface of the same evaporation pot, which faces the evaporation source.
6. A coating method of an evaporation coating apparatus for use in the evaporation coating apparatus according to any one of claims 1 to 5, comprising the steps of:
enabling the evaporation pan revolution driving assembly to operate and drive the evaporation pans to revolve around the evaporation source; and
enabling the evaporation pot autorotation driving assembly to operate and drive the corresponding evaporation pot to autorotate by taking the center of the evaporation pot as a circle center;
one end of the evaporation pot rotation driving assembly is connected with the evaporation pot revolution driving assembly, and the other end of the evaporation pot rotation driving assembly is in transmission connection with the evaporation pot to control the evaporation pot to rotate;
and the evaporation pot revolution driving assembly and the evaporation pot rotation driving assembly respectively and independently control the revolution and the rotation of the evaporation pot.
7. The film evaporation method according to claim 6, wherein the step of operating the evaporation pan rotation driving assembly to drive the corresponding evaporation pan to rotate around the center of the evaporation pan comprises:
each evaporation pot autorotation driving component controls the autorotation speed of each corresponding evaporation pot to be different;
wherein, the size of the wafer on each evaporation pan is different.
8. The film evaporation method according to claim 7, wherein the step of controlling the rotation speed of each evaporation pan to be different by each evaporation pan rotation driving assembly comprises:
after the preset time is reached, the autorotation direction of the evaporation pot is automatically adjusted and changed;
the duration of the preset time is less than or equal to 1/2 of the total duration of the wafer film forming operation.
9. The film evaporation method according to claim 6, wherein the step of operating an evaporation pan rotation driving assembly to drive the corresponding evaporation pan to rotate around the center of the evaporation pan comprises:
the time for each evaporation pot autorotation driving assembly to control the autorotation speed of each corresponding evaporation pot to reach the preset rotating speed is different;
in the plurality of steaming pans, the time for the small-size evaporation pan to reach the preset speed is shorter than the time for the large-size evaporation pan to reach the preset speed.
10. The method according to claim 9, wherein the preset rotation speed ranges from 10rad/min to 20 rad/min.
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