CN217230909U - Evaporation plating equipment for improving evaporation plating uniformity - Google Patents
Evaporation plating equipment for improving evaporation plating uniformity Download PDFInfo
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- CN217230909U CN217230909U CN202221080381.5U CN202221080381U CN217230909U CN 217230909 U CN217230909 U CN 217230909U CN 202221080381 U CN202221080381 U CN 202221080381U CN 217230909 U CN217230909 U CN 217230909U
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Abstract
The utility model relates to a semiconductor manufacturing technology field provides an improve evaporation equipment of coating by vaporization homogeneity, include: evaporating a cavity; the evaporation source is arranged on the inner bottom wall of the evaporation cavity; the plating pot assembly is arranged above the evaporation source; and the heating lamp assembly is arranged below the plating pot assembly and comprises an adjusting structure and a heating lamp connected to the adjusting structure, and the angle of the heating lamp irradiating the plating pot assembly is adjustable under the action of the adjusting mechanism. The utility model discloses a set up angle of adjustment's heating banks spare, make the homogeneity of plating rate improve, the fluctuation reduces, and the coating film compactness of film is better, and the quality obtains improving, and simple structure, low cost.
Description
Technical Field
The utility model relates to a semiconductor manufacturing technology field especially relates to an improve evaporation equipment of coating by vaporization homogeneity.
Background
The vacuum evaporation is a process of converting a coating material into gas molecules through electron beam bombardment heating evaporation, wherein the evaporation material of the gas molecules moves in a vacuum environment and is attached to the surface of an object to be evaporated, so that a film is condensed on the surface of the object to be evaporated.
Current evaporation equipment is when processing treats the coating by vaporization thing, places and fixes the wafer of treating the coating by vaporization through plating the pot, often sets up the heat lamp in the evaporation equipment and heats and plate pot surface and evaporation coating cavity, however, is mostly the mode of fixed angle in view of present heat lamp, along with the inner and outer lane of evaporation coating time the inhomogeneous phenomenon of temperature appears that causes the interior outer lane of coating by vaporization pot easily to cause wafer coating film product unusual, influence coating film compactness and product quality.
SUMMERY OF THE UTILITY MODEL
In view of the above shortcomings in the prior art, the present application aims to provide a vapor deposition apparatus for improving the uniformity of vapor deposition, and aims to solve the problem that the quality of a coating film is affected due to non-uniform temperature of the inner and outer rings of a coating pan.
An evaporation apparatus for improving evaporation uniformity, comprising:
evaporating a cavity;
the evaporation source is arranged on the inner bottom wall of the evaporation cavity;
the plating pot assembly is arranged above the evaporation source; and
the heating lamp assembly is arranged below the plating pot assembly and comprises an adjusting structure and a heating lamp connected to the adjusting structure, and the angle of the heating lamp irradiating the plating pot assembly is adjustable under the action of the adjusting mechanism.
According to the evaporation equipment for improving the evaporation uniformity, the heating lamp assembly with the adjustable angle is arranged, so that the uniformity of the plating rate is improved, the fluctuation is reduced, the coating compactness of a film is better, the quality is improved, the structure is simple, and the cost is low.
Optionally, the heating lamp assemblies are arranged in at least two, and are arranged diagonally in the evaporation cavity. So, through setting up two at least heating lamp subassemblies, can play diversified effect of heating to the plating pot subassembly of pairing rotation to improve coating film homogeneity and compactness.
Optionally, the number of the heating lamp assemblies is four, and the heating lamp assemblies are arranged diagonally in pairs in the evaporation cavity. So, through setting up four heating lamp subassemblies, can play diversified effect of heating to the plating pot subassembly of pairing rotation to improve coating film homogeneity and compactness.
Optionally, the adjustment structure includes support column, connecting rod and extensible member, the support column sets up on the diapire of coating by vaporization cavity, the first end of connecting rod with the support column rotates to be connected, the second end of connecting rod is provided with the lamp shade, the heat lamp is located in the lamp shade, the both ends of extensible member respectively with support column and connecting rod are connected, drive during the extensible member action the heat lamp swing. So, through the cooperation of extensible member and connecting rod, can drive the connecting rod and swing around first end to drive lamp shade and the together swing of heat lamp realize the regulation of heat lamp angle.
Optionally, the extensible member includes sharp cylinder, the stiff end of sharp cylinder is connected on the support column, the expansion end of sharp cylinder is connected on the connecting rod. Therefore, the swinging of the heating lamp can be conveniently controlled through the telescopic action of the linear cylinder, so that the angle of the heating lamp irradiating the plating pot component is adjusted. The linear air cylinder is adopted, so that the structure is simple, the cost is low, and the space is saved.
Optionally, the plating pot assembly comprises a rotating frame and a plating pot arranged on the rotating frame, wherein the rotating frame is connected with a driving piece arranged outside the evaporation cavity body, and the rotating frame rotates around the axis of the rotating frame under the action of the driving piece. Therefore, the rotary frame is arranged to drive the plating pot to rotate, so that the wafers on the plating pot can be completely plated, and the plating rate is improved.
Optionally, the plating pot is arranged obliquely, and the evaporation surface of the plating pot faces the evaporation source. Therefore, the plating pot is obliquely arranged, so that the evaporation surface of the plating pot can be ensured to correspond to the evaporation source, and the evaporation effect is improved.
Optionally, the plating pot is provided with a plurality of, and is a plurality of the plating pot surrounds the swivel mount is the circumference equipartition, and is a plurality of the plating pot is along with the swivel mount revolution. So, through setting up a plurality of pans that plate, can realize a plurality of plating pan on the coating film of wafer, improve coating film efficiency and quantity in the coating by vaporization in-process once.
Optionally, an annular support rail is arranged on the inner side wall of the evaporation plating cavity, and the plating pot is slidably connected to the support rail through a connecting seat. Therefore, by arranging the supporting rails, the supporting function of each plating pot is realized by the supporting rails when the plating pot revolves along with the rotating frame, the stability of the plating pot during revolution is ensured, and the film plating effect is improved.
Optionally, a connecting shaft is rotatably arranged on the connecting seat, the plating pot is arranged at the first end of the connecting shaft, a roller is arranged at the second end of the connecting shaft, the roller is matched with the supporting rail, and the plating pot rotates when the roller rotates. Therefore, the roller matched with the supporting rail is arranged on the connecting shaft, so that the coating pot can revolve along with the rotating frame, and the rotation of the coating pot around the axis of the coating pot is realized, thereby further improving the coating efficiency and the compactness and uniformity of the coating.
Drawings
Fig. 1 is a schematic overall structure diagram of an embodiment of the present invention;
fig. 2 is a schematic structural view of a heating lamp assembly according to an embodiment of the present invention.
Description of reference numerals:
10-evaporation coating cavity; 11-a support rail;
20-evaporation source;
30-plating pot assembly; 31-a rotating frame; 32-plating a pot; 33-a connecting seat;
40-a heating lamp assembly; 41-adjusting structure; 411-support column; 412-a connecting rod; 413-a telescoping member; 42-heating lamps.
Detailed Description
To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are given in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
In view of the mode that the heat lamp among the present evaporation equipment is mostly fixed angle, along with the inner and outer lane of evaporating plating pot phenomenon that the temperature is inhomogeneous appears that causes easily in the passage of coating by vaporization time to cause wafer coating film product unusual, influence coating film compactness and product quality.
Based on this, the present application intends to provide a solution to the above technical problem, the details of which will be explained in the following embodiments.
Referring to fig. 1 and fig. 2, the present application provides an evaporation apparatus for improving evaporation uniformity, including: the thin film deposition device comprises a deposition chamber 10, a deposition source 20, a plating pot assembly 30 and a heating lamp assembly 40, wherein the deposition chamber 10 is a vacuum chamber, which may be an ITO chamber (ITO-indium tin oxide) in this embodiment, and is also applicable to other thin film preparation chambers in other embodiments. The evaporation chamber 10 may have a shape such as a cylinder, an elliptic cylinder, or a cube. The evaporation source 20, the plating pot assembly 30 and the heating lamp assembly 40 are all disposed in the evaporation chamber 10. The evaporation source 20 is arranged on the inner bottom wall of the evaporation cavity 10 and is used for bearing and evaporating evaporation coating materials required by the coating; the plating pot assembly 30 is arranged in the evaporation cavity 10, is positioned above the evaporation source 20, and is used for placing and fixing a wafer to be evaporated, and evaporation coating materials are deposited on the surface of the wafer after evaporation and gasification; the heating lamp assembly 40 is arranged inside the evaporation chamber 10 and located below the plating pot assembly 30, and comprises an adjusting structure 41 and a heating lamp 42 connected to the adjusting structure 41, wherein the angle of the heating lamp 42 irradiating the plating pot assembly 30 is adjustable under the action of the adjusting mechanism.
According to the evaporation equipment for improving the evaporation uniformity, the heating lamp assembly 40 with the adjustable angle is arranged, so that the uniformity of the plating rate is improved, the fluctuation is reduced, the film coating compactness of the film is better, the quality is improved, the structure is simple, and the cost is low.
When the heating lamp 42 is adjusted in angle, the heating lamp 42 always faces the plating pot assembly 30. Specifically, the angle of the heating lamp 42 can be adjusted in time by the adjusting structure 41 according to actual requirements to improve the uniformity of evaporation, and the heating lamp 42 is kept facing the plating pot assembly 30 all the time during adjustment. So, the heating lamp 42 can play the heating effect to plating pot subassembly 30 all the time to improve the heating effect, improve the compactness of coating film among the evaporation plating process.
In some embodiments, the heating lamp assemblies 40 are provided in at least two diagonally arranged in the evaporation chamber 10. In this embodiment, the heating lamp assemblies 40 are provided in two and diagonally arranged. In another embodiment, the heating lamp assemblies 40 are provided in four, and are arranged diagonally in pairs in the evaporation chamber 10. Thus, by arranging at least two heating lamp assemblies 40, the rotary plating pot assembly 30 can be heated in multiple directions, so that the uniformity and compactness of the plated film are improved.
In the above embodiment, the adjusting structure 41 includes the supporting column 411, the connecting rod 412 and the telescopic member 413, the supporting column 411 is disposed on the bottom wall of the evaporation cavity 10, the first end of the connecting rod 412 is rotatably connected to the supporting column 411, the second end of the connecting rod 412 is provided with a lamp cover, the heating lamp 42 is located in the lamp cover, two ends of the telescopic member 413 are respectively connected to the supporting column 411 and the connecting rod 412, and the telescopic member 413 is driven to swing when in operation. Specifically, the support column 411 is an inverted T-shaped structure, the first end of the connecting rod 412 is rotatably connected with the top end of the support column 411, the second end of the connecting rod 412 is fixedly connected with the lampshade, the heating lamp 42 is arranged in the lampshade, and when the connecting rod 412 moves, the lampshade and the heating lamp 42 can also move together. Thus, through the cooperation of the telescopic piece 413 and the connecting rod 412, the connecting rod 412 can be driven to swing around the first end, so as to drive the lamp shade and the heating lamp 42 to swing together, and the angle adjustment of the heating lamp 42 is realized.
Illustratively, the telescopic member 413 includes a linear cylinder, a fixed end of the linear cylinder is connected to the supporting column 411, and a movable end of the linear cylinder is connected to the connecting rod 412. Specifically, the fixed end of the linear cylinder is linked to the side wall of the supporting column 411, and the movable end of the linear cylinder is linked to the side wall of the connecting rod 412. In this way, the swing of the heating lamp 42 can be conveniently controlled by the telescopic action of the linear cylinder, thereby adjusting the angle of the light irradiating the plating pot assembly 30. The linear air cylinder is adopted, so that the structure is simple, the cost is low, and the space is saved.
In some embodiments, the plating pot assembly 30 includes a rotating frame 31 and a plating pot 32 disposed on the rotating frame 31, and the rotating frame 31 is connected to a driving member disposed outside the evaporation chamber 10 and rotates around its axis under the action of the driving member. Specifically, the rotating frame 31 is located at the top center of the evaporation cavity 10, in this embodiment, the rotating frame 31 is a three-jaw stand, the driving element is a driving motor, and the driving motor drives the rotating frame 31 to rotate around its own axis. The plating pot 32 is arranged on the rotating frame 31, the plating pot 32 is divided into an inner loading disc part and an outer loading disc part, the inner loading disc part and the outer loading disc part are both used for bearing a wafer, the inner loading disc part is closer to the center of the plating pot, the outer loading disc part is closer to the outer edge of the plating pot, and the inner loading disc part and the outer loading disc part can be uniformly heated by adjusting the angle of irradiation of the heating lamp to the plating pot, so that the uniformity of a coating film is ensured. The rotary frame 31 is arranged to drive the plating pot 32 to rotate, so that the wafers on the plating pot 32 can be completely plated, and the plating rate is improved.
In the above embodiment, the plating pot 32 is provided obliquely, and the deposition surface of the plating pot 32 faces the deposition source 20. Thus, the inclined arrangement of the plating pot 32 can ensure the corresponding of the evaporation surface and the evaporation source 20, and improve the evaporation effect.
In the above embodiment, the plating pots 32 are provided in plural, the plating pots 32 are evenly distributed around the rotating frame 31 in a circumferential direction, and the plating pots 32 revolve with the rotating frame 31. Specifically, in this embodiment, since the rotating frame 31 is a three-jaw foot frame, three plating pots 32 can be uniformly and correspondingly mounted on the rotating frame, and the three plating pots 32 are uniformly and circumferentially distributed, the weight balance can be ensured. The three plating pots 32 mounted on the rotating frame 31 are rotated together with the rotating frame 31. So, through setting up at least three plating pot 32, can realize plating film of wafer on a plurality of plating pots 32 in one evaporation process, improve coating film efficiency and quantity.
In some embodiments, an annular support rail 11 is disposed on an inner side wall of the evaporation chamber 10, and the plating pot 32 is slidably connected to the support rail 11 through a connection seat 33. Specifically, the annular support rail 11 surrounds the inner side wall of the evaporation cavity 10 for one circle, so that the support rail 11 is arranged, so that each plating pot 32 is supported by the support rail 11 when revolving along with the rotating frame 31, the stability of the plating pot 32 when revolving is ensured, and the film plating effect is improved.
In the above embodiment, the connecting seat 33 is rotatably provided with a connecting shaft, the plating pot 32 is disposed at a first end of the connecting shaft, a roller is disposed at a second end of the connecting shaft, the roller is matched with the supporting rail 11, and the plating pot 32 rotates when the roller rotates. Therefore, the connecting shaft is provided with the roller matched with the supporting rail 11, so that the plating pot 32 can revolve along with the rotating frame 31, and the self rotation of the plating pot 32 around the axis of the plating pot 32 is realized, thereby further improving the film coating efficiency and the compactness and uniformity of the film coating.
When the evaporation device for improving the evaporation uniformity in the embodiment is used specifically, the adjusting structure 41 in the heating lamp assembly 40 can be controlled to adjust the swing angle of the heating lamp 42, so as to change the angle of the heating lamp 42 irradiating the plating pot 32, improve the uniformity of the plating rate, reduce the fluctuation, and improve the film coating compactness of the film.
It is to be understood that the invention is not limited to the above-described embodiments, and that modifications and variations may be made by those skilled in the art in light of the above teachings, and all such modifications and variations are intended to be included within the scope of the invention as defined in the appended claims.
Claims (10)
1. The utility model provides an improve coating by vaporization equipment of coating by vaporization homogeneity which characterized in that includes:
evaporating a cavity;
the evaporation source is arranged on the inner bottom wall of the evaporation cavity;
the plating pot assembly is arranged above the evaporation source; and
the heating lamp assembly is arranged below the plating pot assembly and comprises an adjusting structure and a heating lamp connected to the adjusting structure, and the angle of the heating lamp irradiating the plating pot assembly is adjustable under the action of the adjusting mechanism.
2. The evaporation apparatus for improving evaporation uniformity according to claim 1, wherein the number of the heating lamp assemblies is at least two, and the heating lamp assemblies are arranged diagonally in the evaporation chamber.
3. The evaporation apparatus for improving evaporation uniformity according to claim 2, wherein the number of the heating lamp assemblies is four, and the heating lamp assemblies are arranged diagonally in pairs in the evaporation chamber.
4. The evaporation device for improving evaporation uniformity according to claim 1, wherein the adjusting structure comprises a support column, a connecting rod and a telescopic member, the support column is disposed on a bottom wall of the evaporation cavity, a first end of the connecting rod is rotatably connected with the support column, a second end of the connecting rod is provided with a lampshade, the heating lamp is located in the lampshade, two ends of the telescopic member are respectively connected with the support column and the connecting rod, and the telescopic member drives the heating lamp to swing when acting.
5. The vapor deposition device for improving vapor deposition uniformity according to claim 4, wherein the telescopic member comprises a linear cylinder, a fixed end of the linear cylinder is connected to the supporting column, and a movable end of the linear cylinder is connected to the connecting rod.
6. The evaporation apparatus for improving evaporation uniformity according to claim 1, wherein the plating pot assembly comprises a rotating frame and a plating pot arranged on the rotating frame, and the rotating frame is connected with a driving member arranged outside the evaporation cavity body and rotates around the axis of the rotating frame under the action of the driving member.
7. The evaporation apparatus for improving evaporation uniformity according to claim 6, wherein the plating pot is arranged obliquely, and the evaporation surface of the plating pot faces the evaporation source.
8. The vapor deposition apparatus for improving vapor deposition uniformity according to claim 6, wherein a plurality of the plating pots are arranged, are uniformly distributed around the rotating frame in a circumferential manner, and revolve with the rotating frame.
9. The evaporation apparatus for improving evaporation uniformity according to claim 6, wherein an annular support rail is disposed on an inner sidewall of the evaporation chamber, and the plating pot is slidably connected to the support rail through a connecting seat.
10. The evaporation device for improving evaporation uniformity as recited in claim 9, wherein a connecting shaft is rotatably disposed on said connecting base, said plating pot is disposed at a first end of said connecting shaft, a roller is disposed at a second end of said connecting shaft, said roller is engaged with said supporting rail, and said plating pot rotates when said roller rotates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221080381.5U CN217230909U (en) | 2022-05-07 | 2022-05-07 | Evaporation plating equipment for improving evaporation plating uniformity |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221080381.5U CN217230909U (en) | 2022-05-07 | 2022-05-07 | Evaporation plating equipment for improving evaporation plating uniformity |
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| Publication Number | Publication Date |
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| CN217230909U true CN217230909U (en) | 2022-08-19 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202221080381.5U Active CN217230909U (en) | 2022-05-07 | 2022-05-07 | Evaporation plating equipment for improving evaporation plating uniformity |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117364047A (en) * | 2023-10-18 | 2024-01-09 | 安徽其芒光电科技有限公司 | Vacuum coating equipment |
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2022
- 2022-05-07 CN CN202221080381.5U patent/CN217230909U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117364047A (en) * | 2023-10-18 | 2024-01-09 | 安徽其芒光电科技有限公司 | Vacuum coating equipment |
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