CN114989903A - Composition for cleaning solid wax of LED chip - Google Patents
Composition for cleaning solid wax of LED chip Download PDFInfo
- Publication number
- CN114989903A CN114989903A CN202210757787.0A CN202210757787A CN114989903A CN 114989903 A CN114989903 A CN 114989903A CN 202210757787 A CN202210757787 A CN 202210757787A CN 114989903 A CN114989903 A CN 114989903A
- Authority
- CN
- China
- Prior art keywords
- imidazoline
- solid wax
- composition
- led chip
- agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000007787 solid Substances 0.000 title claims abstract description 41
- 239000000203 mixture Substances 0.000 title claims abstract description 33
- 238000004140 cleaning Methods 0.000 title claims abstract description 27
- MTNDZQHUAFNZQY-UHFFFAOYSA-N imidazoline Chemical compound C1CN=CN1 MTNDZQHUAFNZQY-UHFFFAOYSA-N 0.000 claims abstract description 46
- 239000002736 nonionic surfactant Substances 0.000 claims abstract description 29
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000003995 emulsifying agent Substances 0.000 claims abstract description 18
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 16
- 230000000149 penetrating effect Effects 0.000 claims abstract description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000002738 chelating agent Substances 0.000 claims abstract description 12
- 239000012752 auxiliary agent Substances 0.000 claims abstract description 11
- 239000012498 ultrapure water Substances 0.000 claims abstract description 11
- 238000002360 preparation method Methods 0.000 claims abstract description 9
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 claims description 15
- 239000008096 xylene Substances 0.000 claims description 15
- 238000006243 chemical reaction Methods 0.000 claims description 10
- 238000003756 stirring Methods 0.000 claims description 10
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 9
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 9
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 9
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 9
- 239000000194 fatty acid Substances 0.000 claims description 9
- 229930195729 fatty acid Natural products 0.000 claims description 9
- 150000004665 fatty acids Chemical class 0.000 claims description 9
- 230000002829 reductive effect Effects 0.000 claims description 7
- 239000002904 solvent Substances 0.000 claims description 7
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims description 5
- 239000008367 deionised water Substances 0.000 claims description 5
- 229910021641 deionized water Inorganic materials 0.000 claims description 5
- 238000004821 distillation Methods 0.000 claims description 5
- 239000006260 foam Substances 0.000 claims description 5
- 150000004668 long chain fatty acids Chemical class 0.000 claims description 5
- 238000003786 synthesis reaction Methods 0.000 claims description 5
- BTXXTMOWISPQSJ-UHFFFAOYSA-N 4,4,4-trifluorobutan-2-one Chemical compound CC(=O)CC(F)(F)F BTXXTMOWISPQSJ-UHFFFAOYSA-N 0.000 claims description 4
- BQACOLQNOUYJCE-FYZZASKESA-N Abietic acid Natural products CC(C)C1=CC2=CC[C@]3(C)[C@](C)(CCC[C@@]3(C)C(=O)O)[C@H]2CC1 BQACOLQNOUYJCE-FYZZASKESA-N 0.000 claims description 4
- 229920000768 polyamine Polymers 0.000 claims description 4
- 230000002194 synthesizing effect Effects 0.000 claims description 4
- RWNUSVWFHDHRCJ-UHFFFAOYSA-N 1-butoxypropan-2-ol Chemical compound CCCCOCC(C)O RWNUSVWFHDHRCJ-UHFFFAOYSA-N 0.000 claims description 3
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 claims description 3
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 claims description 3
- XEZNGIUYQVAUSS-UHFFFAOYSA-N 18-crown-6 Chemical compound C1COCCOCCOCCOCCOCCO1 XEZNGIUYQVAUSS-UHFFFAOYSA-N 0.000 claims description 3
- XGDRLCRGKUCBQL-UHFFFAOYSA-N 1h-imidazole-4,5-dicarbonitrile Chemical compound N#CC=1N=CNC=1C#N XGDRLCRGKUCBQL-UHFFFAOYSA-N 0.000 claims description 3
- AEQDJSLRWYMAQI-UHFFFAOYSA-N 2,3,9,10-tetramethoxy-6,8,13,13a-tetrahydro-5H-isoquinolino[2,1-b]isoquinoline Chemical compound C1CN2CC(C(=C(OC)C=C3)OC)=C3CC2C2=C1C=C(OC)C(OC)=C2 AEQDJSLRWYMAQI-UHFFFAOYSA-N 0.000 claims description 3
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 claims description 3
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 claims description 3
- KFDNQUWMBLVQNB-UHFFFAOYSA-N 2-[2-[bis(carboxymethyl)amino]ethyl-(carboxymethyl)amino]acetic acid;sodium Chemical compound [Na].[Na].[Na].[Na].OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KFDNQUWMBLVQNB-UHFFFAOYSA-N 0.000 claims description 3
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 claims description 3
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 claims description 3
- WQZGKKKJIJFFOK-GASJEMHNSA-N Glucose Natural products OC[C@H]1OC(O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-GASJEMHNSA-N 0.000 claims description 3
- 229920001213 Polysorbate 20 Polymers 0.000 claims description 3
- 229920001214 Polysorbate 60 Polymers 0.000 claims description 3
- WQZGKKKJIJFFOK-VFUOTHLCSA-N beta-D-glucose Chemical compound OC[C@H]1O[C@@H](O)[C@H](O)[C@@H](O)[C@@H]1O WQZGKKKJIJFFOK-VFUOTHLCSA-N 0.000 claims description 3
- 235000015165 citric acid Nutrition 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 claims description 3
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 claims description 3
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 claims description 3
- 239000008103 glucose Substances 0.000 claims description 3
- 235000001727 glucose Nutrition 0.000 claims description 3
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 claims description 3
- 229920000191 poly(N-vinyl pyrrolidone) Polymers 0.000 claims description 3
- 239000000256 polyoxyethylene sorbitan monolaurate Substances 0.000 claims description 3
- 235000010486 polyoxyethylene sorbitan monolaurate Nutrition 0.000 claims description 3
- 235000010482 polyoxyethylene sorbitan monooleate Nutrition 0.000 claims description 3
- 229920000053 polysorbate 80 Polymers 0.000 claims description 3
- 239000001509 sodium citrate Substances 0.000 claims description 3
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 claims description 3
- 235000011083 sodium citrates Nutrition 0.000 claims description 3
- 239000000176 sodium gluconate Substances 0.000 claims description 3
- 235000012207 sodium gluconate Nutrition 0.000 claims description 3
- 229940005574 sodium gluconate Drugs 0.000 claims description 3
- 235000019832 sodium triphosphate Nutrition 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 2
- 238000001035 drying Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 abstract description 18
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 abstract description 18
- 229910052751 metal Inorganic materials 0.000 abstract description 14
- 239000002184 metal Substances 0.000 abstract description 14
- 238000005260 corrosion Methods 0.000 abstract description 7
- 230000007797 corrosion Effects 0.000 abstract description 7
- 239000000126 substance Substances 0.000 abstract description 6
- 239000007772 electrode material Substances 0.000 abstract description 4
- 239000004094 surface-active agent Substances 0.000 abstract description 4
- 230000003670 easy-to-clean Effects 0.000 abstract description 3
- 230000000052 comparative effect Effects 0.000 description 7
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 6
- 239000012459 cleaning agent Substances 0.000 description 6
- 230000002209 hydrophobic effect Effects 0.000 description 6
- IAZDPXIOMUYVGZ-WFGJKAKNSA-N Dimethyl sulfoxide Chemical compound [2H]C([2H])([2H])S(=O)C([2H])([2H])[2H] IAZDPXIOMUYVGZ-WFGJKAKNSA-N 0.000 description 4
- 125000004429 atom Chemical group 0.000 description 3
- 239000003599 detergent Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000003628 erosive effect Effects 0.000 description 3
- 150000002430 hydrocarbons Chemical group 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 125000004433 nitrogen atom Chemical group N* 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229940125782 compound 2 Drugs 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 238000000227 grinding Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012512 characterization method Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000006259 organic additive Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
- C11D1/825—Mixtures of compounds all of which are non-ionic
- C11D1/8255—Mixtures of compounds all of which are non-ionic containing a combination of compounds differently alcoxylised or with differently alkylated chains
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D233/00—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings
- C07D233/04—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having one double bond between ring members or between a ring member and a non-ring member
- C07D233/06—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having one double bond between ring members or between a ring member and a non-ring member with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, directly attached to ring carbon atoms
- C07D233/08—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having one double bond between ring members or between a ring member and a non-ring member with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, directly attached to ring carbon atoms with alkyl radicals, containing more than four carbon atoms, directly attached to ring carbon atoms
- C07D233/12—Heterocyclic compounds containing 1,3-diazole or hydrogenated 1,3-diazole rings, not condensed with other rings having one double bond between ring members or between a ring member and a non-ring member with only hydrogen atoms or radicals containing only hydrogen and carbon atoms, directly attached to ring carbon atoms with alkyl radicals, containing more than four carbon atoms, directly attached to ring carbon atoms with substituted hydrocarbon radicals attached to ring nitrogen atoms
- C07D233/16—Radicals substituted by nitrogen atoms
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2003—Alcohols; Phenols
- C11D3/2041—Dihydric alcohols
- C11D3/2044—Dihydric alcohols linear
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2068—Ethers
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/2075—Carboxylic acids-salts thereof
- C11D3/2086—Hydroxy carboxylic acids-salts thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/20—Organic compounds containing oxygen
- C11D3/22—Carbohydrates or derivatives thereof
- C11D3/221—Mono, di- or trisaccharides or derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/33—Amino carboxylic acids
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
- C11D1/667—Neutral esters, e.g. sorbitan esters
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
- C11D1/72—Ethers of polyoxyalkylene glycols
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D1/00—Detergent compositions based essentially on surface-active compounds; Use of these compounds as a detergent
- C11D1/66—Non-ionic compounds
- C11D1/722—Ethers of polyoxyalkylene glycols having mixed oxyalkylene groups; Polyalkoxylated fatty alcohols or polyalkoxylated alkylaryl alcohols with mixed oxyalkylele groups
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- C11D2111/22—
Abstract
The invention belongs to the technical field of surfactants, and particularly relates to a chemical preparation used in the field of LEDs (light-emitting diode), which is a composition used for cleaning LED chip solid wax. Comprises 15 to 20 percent of rosinyl imidazoline nonionic surfactant, 2.5 to 3 percent of penetrating agent, 8 to 10 percent of emulsifying agent, 1.5 to 2 percent of chelating agent, 8 to 10 percent of organic auxiliary agent and the balance of high-purity water. The rosin-based imidazoline non-ionic surfactant, the penetrating agent and the emulsifying agent are mixed, so that the solid wax can be quickly emulsified and dissolved, the metal electrode material is protected, the problem of corrosion of water-based products on the market on the metal electrode is solved, and the rosin-based imidazoline non-ionic surfactant, the penetrating agent and the emulsifying agent are easy to clean and have no residue.
Description
Technical Field
The invention belongs to the technical field of surfactants, and particularly relates to a chemical preparation composition used in the field of LEDs, which is used for cleaning LED chip solid wax.
Background
Before the LED chip packaging test, one surface of the functional area needs to be coated with solid wax, and the functional area is fixed on a grinding disc under the pressure, so that the exposed surface of the chip is ground and polished. And after grinding and polishing, cleaning by using a solid wax cleaning agent to recover the intrinsic functional surface of the chip. The solid wax used in the industry at present contains long-chain fatty acids, rosin and modified rosin derivatives as main components.
The water-based wax removing liquid adopted by the solid wax cleaning agent on the market has low dissolution rate to the solid wax, corrodes the electrode on the surface of the chip, and can achieve the purpose of thoroughly cleaning dirt only by cleaning the subsequent chemical acetone, so that the problems of complex cleaning process, low wax dissolving efficiency, corrosion to the electrode, need of extra solvent acetone cleaning, increased use cost and the like exist. Patent CN 105779151A discloses a dewaxing cleaning solution and a preparation method and application thereof, which adopts a high-efficiency nonionic surfactant, a low-foam-inhibiting surfactant, a dispersion stabilizer and a deionized water system to clean solid wax. The water-based solid wax cleaning agent has the problems of complex cleaning process, low wax dissolving efficiency, electrode corrosion, additional solvent acetone cleaning, increased use cost and the like. The water-based solid wax cleaning agent adopted by the invention can quickly emulsify and dissolve the solid wax by mixing the rosin-based imidazoline nonionic surfactant, the penetrating agent and the emulsifying agent, has a protection effect on metal electrode materials, solves the corrosion problem of water-based products on the market on the metal electrodes, and is easy to clean and free of residues.
Disclosure of Invention
The invention mainly solves the technical problem of providing the composition for cleaning the solid wax of the LED chip, the rosin-based imidazoline nonionic surfactant, the penetrating agent and the emulsifying agent are mixed, so that the solid wax can be quickly emulsified and dissolved, the metal electrode material is protected, the problem of corrosion of water-based products on the market to the metal electrode is solved, and the composition is easy to clean and has no residue.
In order to solve the above problems, the present invention is implemented by the following technical solutions.
The composition for cleaning the solid wax of the LED chip comprises the following components in percentage by mass, wherein the sum of the mass percentages is 100%: 15-20% of rosinyl imidazoline nonionic surfactant, 2.5-3% of penetrating agent, 8-10% of emulsifying agent, 1.5-2% of chelating agent, 8-10% of organic auxiliary agent and the balance of high-purity water.
The structural formula of the rosinyl imidazoline nonionic surfactant is as follows:
The preparation method of the rosinyl imidazoline nonionic surfactant comprises the following steps:
1) synthesis of fatty acid amide 3:
long chain fatty acid 1(0.02mol) and xylene (20mL) were placed in a dry 250mL three-necked round bottom flask equipped with a magnetic stirrer, condenser and addition funnel. A xylene (20mL) solution in which polyamine compound 2(0.02mol) was dissolved was added dropwise to a 250mL three-necked flask and stirred. The mixture was reacted at 140 ℃ and 180 ℃ for 2 hours, cooled to room temperature, and then the xylene was distilled off under reduced pressure. Fatty acid amide 3 was obtained in yields: 90 percent, and the reaction process is as follows:
wherein n is an integer between 14 and 18, and m is an integer between 0 and 2.
2) Synthesis of imidazoline 4:
fatty acid amide 3(0.02mol) was dissolved in 40mL xylene and placed in a 250mL three-necked round bottom flask equipped with a magnetic stirrer, condenser and addition funnel. The reaction was carried out at 200 ℃ and 240 ℃ for 3 hours at room temperature. The solvent was removed by distillation under reduced pressure. Imidazoline 4 was obtained in 90.2% yield. The reaction process is as follows:
wherein n is an integer between 14 and 18, and m is an integer between 0 and 2.
3) Synthesizing rosinyl imidazoline A:
imidazoline 4(0.01mol) was dissolved in 10mL of xylene and placed in a 250mL reaction flask and heated with a magnetic stirrer. Abietic acid 5 (0.01mol) was dissolved in 10mL of xylene solution and added dropwise to a 250mL reaction flask. The mixture was then heated with stirring to 140 ℃ and 180 ℃ for 2 hours. The solvent was removed by distillation under reduced pressure and dried to give rosinyl imidazoline a in 81.5% yield. The reaction process is as follows:
wherein n is an integer between 14 and 18, and m is an integer between 0 and 2.
The rosin group and the long-chain fatty hydrocarbon group in the rosin-based imidazoline nonionic surfactant are similar to and compatible with the structure of the wax, and can dissolve various components in the wax; imidazoline has a special molecular structure, a hydrophilic group contains an N atom with a lone pair electron and is easy to form a coordination bond with a metal atom, so that chemical adsorption is performed to slow down Fuhai, and a hydrophobic branched chain can form a hydrophobic membrane on the surface far away from the metal, thereby effectively preventing further erosion of a corrosive medium.
The penetrating agent is at least one of JFC, JFC-1, JFC-2, JFC-E, JFC-M, fast T, OEP-70, AEP and low-foam penetrating agent SF.
The emulsifier is at least one of E-1003, E-1006, MOA-5, MOA-7, L64, E1310, E1308, peregal O, NPE-105, NPE-108, Tween 20, Tween 60 and Tween 80.
The organic auxiliary agent is any one or more of ethylene glycol methyl ether, ethylene glycol ethyl ether, ethylene glycol butyl ether, ethylene glycol, propylene glycol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether and propylene glycol monobutyl ether.
The chelating agent is one or more of ethylenediamine tetraacetic acid, disodium ethylenediamine tetraacetic acid, tetrasodium ethylenediamine tetraacetic acid, citric acid, sodium citrate, glucose, sodium gluconate, sodium tripolyphosphate and 18-crown-6.
The high-purity water is deionized water, and the conductivity of the high-purity water at 25 ℃ is not lower than 18 MOmega.
The preparation method of the composition comprises the following steps: adding an organic auxiliary agent, then adding the rosinyl imidazoline nonionic surfactant, adding a penetrating agent and an emulsifying agent after the rosin imidazoline nonionic surfactant is completely dissolved, then adding water, forming a uniform system at the stirring speed of 200rpm, and adding a chelating agent while stirring to finally obtain a uniform, stable, clear and transparent solution.
The invention has the following remarkable advantages:
by adding the rosinyl imidazoline nonionic surfactant, the rosin group and the long-chain fatty hydrocarbon group in the rosin imidazoline nonionic surfactant are similar to and dissolved with the wax structure, so that various components in the wax can be dissolved; imidazoline has a special molecular structure, a hydrophilic group contains an N atom with a lone pair electron and is easy to form a coordination bond with a metal atom, so that chemical adsorption is performed to slow down Fuhai, and a hydrophobic branched chain can form a hydrophobic membrane on the surface far away from the metal, thereby effectively preventing further erosion of a corrosive medium.
The rosin-based imidazoline nonionic surfactant, the penetrating agent and the emulsifying agent are mixed, wherein the penetrating agent can accelerate the penetration of a system to the solid wax on the surface of the substrate, so that the emulsifying agent and the rosin-based imidazoline nonionic surfactant can quickly react with the solid wax to quickly emulsify and dissolve the solid wax, and the metal electrode material is protected, the problem of corrosion of water-based products on the market to a metal electrode is solved, and meanwhile, the composition has the characteristics of small smell, no pollution to the environment, low foam, easiness in rinsing and the like.
Detailed Description
A composition for cleaning LED chip solid wax is characterized in that: the composition comprises the following components in percentage by mass, wherein the sum of the mass percentages is 100%: 15-20% of rosinyl imidazoline nonionic surfactant, 2.5-3% of penetrating agent, 8-10% of emulsifying agent, 1.5-2% of chelating agent, 8-10% of organic auxiliary agent and the balance of high-purity water.
The rosinyl imidazoline nonionic surfactant is selected from the following structures:
at least one of surfactants, wherein n is an integer between 14 and 18 and m is an integer between 0 and 2.
The preparation method of the rosinyl imidazoline nonionic surfactant comprises the following steps:
1) synthesis of fatty acid amide 3:
long chain fatty acid 1(0.02mol) and xylene (20mL) were placed in a dry 250mL three-necked round bottom flask equipped with a magnetic stirrer, condenser and addition funnel. A xylene (20mL) solution in which polyamine compound 2(0.02mol) was dissolved was added dropwise to a 250mL three-necked flask and stirred. The mixture was reacted at 140 ℃ and 180 ℃ for 2 hours, cooled to room temperature, and then the xylene was distilled off under reduced pressure. Fatty acid amide 3 was obtained in yields: 90 percent.
Wherein n is an integer between 14 and 18, and m is an integer between 0 and 2.
2) Synthesis of imidazoline 4:
fatty acid amide 3(0.02mol) was dissolved in 40mL xylene and placed in a 250mL three-necked round bottom flask equipped with a magnetic stirrer, condenser and addition funnel. The reaction was carried out at 200 ℃ and 240 ℃ for 3 hours at room temperature. The solvent was removed by distillation under reduced pressure. Imidazoline 4 was obtained in 90.2% yield.
Wherein n is an integer between 14 and 18, and m is an integer between 0 and 2.
3) Synthesizing rosinyl imidazoline A:
imidazoline 4(0.01mol) was dissolved in 10mL of xylene and placed in a 250mL reaction flask and heated with a magnetic stirrer. Abietic acid 5 (0.01mol) was dissolved in 10mL of xylene solution and added dropwise to a 250mL reaction flask. The mixture was then heated with stirring to 140 ℃ and 180 ℃ for 2 hours. The solvent was removed by distillation under reduced pressure and dried to give rosinyl imidazoline a in 81.5% yield.
Wherein n is an integer between 14 and 18, and m is an integer between 0 and 2.
Characterization data for compound a when n =17, m =1 for the rosinyl imidazoline nonionic surfactant used are as follows:
1 H NMR(300MHz，DMSO-d6), δ: 0.88 (m, 9H, CH3), 1.13-1.38(m, CH2, 26H), 1.47-1.91(m, 10H, CH2), 1.5(m, 1H, NH), 1.63 (m, 1H, CH), 1.88 (m, 1H, CH), 2.16-2.26(m, 6H, CH2), 2.64-2.66(m, 4H, CH2), 3.02(t, 1H, CH), 3.32-3.48(m, 6H, CH2), 3.75 (t, 2H, CH2), 5.43-5.47(m, 3H, CH), 5.97(m, 1H, CH), 8.01 (t, 1H, NH).
13 C NMR(125MHz，DMSO-d6), δ: 14.1, 21.1, 21.8, 21.9, 22.7, 22.7, 26, 27.8, 28.7, 29.3, 29.4, 29.5, 29.6, 29.7, 29.9, 31.9, 32.3, 33.7, 34.1, 34.8, 35.0, 35.6, 39.7, 40.0, 42.2, 46.9, 48.5, 49.0, 51.2, 54.1, 129.0, 130.6, 131.0, 132.7, 142.0, 166, 174.1.
HRMS Calculations C42H73N4O (M + H) + 649.57, found 649.15.
The rosin group and the long-chain fatty hydrocarbon group in the rosin-based imidazoline nonionic surfactant are similar to and compatible with the structure of the wax, and can dissolve various components in the wax; imidazoline has a special molecular structure, a hydrophilic group contains an N atom with a lone pair electron and is easy to form a coordination bond with a metal atom, so that chemical adsorption is performed to slow down Fuhai, and a hydrophobic branched chain can form a hydrophobic membrane on the surface far away from the metal, thereby effectively preventing further erosion of a corrosive medium.
The penetrant is at least one of JFC, JFC-1, JFC-2, JFC-E, JFC-M, fast T, OEP-70, AEP and low-foam penetrant SF.
The emulsifier is at least one of E-1003, E-1006, MOA-5, MOA-7, L64, E1310, E1308, peregal O, NPE-105, NPE-108, Tween 20, Tween 60 and Tween 80.
The organic auxiliary agent is any one or more of ethylene glycol methyl ether, ethylene glycol ethyl ether, ethylene glycol butyl ether, ethylene glycol, propylene glycol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether and propylene glycol monobutyl ether.
The chelating agent is one or more of ethylenediamine tetraacetic acid, disodium ethylenediamine tetraacetic acid, tetrasodium ethylenediamine tetraacetic acid, citric acid, sodium citrate, glucose, sodium gluconate, sodium tripolyphosphate and 18-crown-6.
The high-purity water is deionized water, and the conductivity of the high-purity water at 25 ℃ is not lower than 18 MOmega.
The preparation method of the composition comprises the following steps: adding an organic auxiliary agent, then adding the rosinyl imidazoline nonionic surfactant, adding a penetrating agent and an emulsifying agent after the rosin imidazoline nonionic surfactant is completely dissolved, then adding water, forming a uniform system at the stirring speed of 200rpm, and adding a chelating agent while stirring to finally obtain a uniform, stable, clear and transparent solution.
In order to make the present invention more comprehensible, the technical solutions of the present invention are further described below with reference to specific embodiments, but the present invention is not limited thereto.
Detergent compositions of different compositions were formulated according to the formulations in table 1.
TABLE 1 Components and their amounts in different detergent compositions
The chips coated with the solid wax were immersed in the detergent compositions prepared in examples 1 to 4 and comparative examples 1 to 5, respectively, set for an operating time at a set operating temperature, taken out, washed with deionized water, and blown dry with nitrogen. Observation was performed with an optical microscope and an electron microscope to confirm the cleaning effect. The operating conditions and results are shown in Table 2.
TABLE 2 cleaning Effect of different cleaning agent compositions on solid wax on chip
As can be seen from the combination of tables 1-2, the cleaning agent combination of the invention can effectively dissolve the solid wax on the chip within the set temperature and time, and obtain a solution with uniform dissolution, no corrosion to the electrode, easy rinsing and no residue.
In comparison with example 1, comparative example 1 contains no rosin-based imidazoline nonionic surfactant, fails to dissolve the wax on the chip surface at the operating temperature and time, leaves a large amount of solid wax, and corrodes the electrode.
Compared with example 1, comparative example 2 contains no penetrant, most of the solid wax is dissolved at the operation temperature and time, a small amount of the solid wax remains on the surface of the chip, and the electrode is not corroded.
Compared with example 1, comparative example 3 contains no emulsifier, the system is unstable and delaminates, the solid wax is not completely emulsified and dissolved at the operating temperature and time, and the electrode is not corroded.
In comparison with example 1, comparative example 4 contains no chelating agent, the solid wax is dissolved at the operating temperature and time, the electrode is not corroded, and a small amount of the solid wax is adhered back to the surface of the chip.
Compared with the example 1, the comparative example 5 does not contain organic additives, the system is unstable, the solid is dissolved in the operation temperature and time, and oil stains are left on the surface of the chip.
As can be shown from the above example 1 and comparative examples 1 to 5, the rosin-based imidazoline nonionic surfactant, the penetrating agent and the emulsifying agent interact with each other, so that the solid wax on the surface of the chip can be emulsified and dissolved, the electrode is protected, the organic auxiliary agent is helpful for cleaning and stabilizing the system, the chelating agent plays a role in resisting static electricity and preventing dirt from being sticky back, and all the components are not necessary.
The above embodiments describe the present invention in detail, but they are only examples and do not limit the scope of the invention. All equivalent modifications and substitutions made by the present specification are within the scope of the present invention and are included in the patent protection scope of the present invention.
Claims (9)
1. A composition for cleaning LED chip solid wax is characterized in that: the components are as follows by mass percent: 15-20% of rosinyl imidazoline nonionic surfactant, 2.5-3% of penetrating agent, 8-10% of emulsifying agent, 1.5-2% of chelating agent, 8-10% of organic auxiliary agent and the balance of high-purity water.
2. The composition for LED chip solid wax cleaning according to claim 1, wherein: the structural formula of the rosinyl imidazoline nonionic surfactant is as follows:
wherein n is an integer between 14 and 18, and m is an integer between 0 and 2.
3. The composition for LED chip solid wax cleaning according to claim 2, wherein: the preparation method of the rosinyl imidazoline nonionic surfactant comprises the following steps:
1) synthesis of fatty acid amide 3:
stirring and mixing long-chain fatty acid, xylene and a polyamine compound, then reacting for 2h at 140-;
2) synthesizing imidazoline:
dissolving the fatty acid amide obtained in the step (1) in xylene, and reacting for 3h at 200-;
3) synthesizing rosinyl imidazoline:
dissolving the imidazoline obtained in the step (2) in xylene, adding abietic acid, stirring and heating the mixture to 140 ℃ and 180 ℃ for reaction for 2 hours, removing the solvent through reduced pressure distillation, and drying to obtain rosinyl imidazoline;
the long chain fatty acid is
The polyamine compound is
The fatty acid amide is
Imidazoline is
Wherein n is an integer between 14 and 18, and m is an integer between 0 and 2; the abietic acid is
。
4. The composition for LED chip solid wax cleaning according to claim 1, wherein: the penetrant is at least one of JFC, JFC-1, JFC-2, JFC-E, JFC-M, fast T, OEP-70, AEP and low-foam penetrant SF.
5. The composition for LED chip solid wax cleaning according to claim 1, wherein: the emulsifier is at least one of E-1003, E-1006, MOA-5, MOA-7, L64, E1310, E1308, peregal O, NPE-105, NPE-108, Tween 20, Tween 60 and Tween 80.
6. The composition for LED chip solid wax cleaning according to claim 1, wherein: the organic auxiliary agent is any one or more of ethylene glycol methyl ether, ethylene glycol ethyl ether, ethylene glycol butyl ether, ethylene glycol, propylene glycol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether and propylene glycol monobutyl ether.
7. The composition for LED chip solid wax cleaning according to claim 1, wherein: the chelating agent is any one or more of ethylenediamine tetraacetic acid, disodium ethylenediamine tetraacetic acid, tetrasodium ethylenediamine tetraacetic acid, citric acid, sodium citrate, glucose, sodium gluconate, sodium tripolyphosphate and 18-crown-6.
8. The composition for LED chip solid wax cleaning according to claim 1, wherein: the high-purity water is deionized water, and the conductivity of the high-purity water at 25 ℃ is not lower than 18 MOmega.
9. The composition for LED chip solid wax cleaning according to claim 1, wherein: the preparation method of the composition comprises the following steps: firstly adding an organic auxiliary agent, then adding the rosinyl imidazoline nonionic surfactant, after completely dissolving, adding a penetrating agent and an emulsifying agent, then adding high-purity water, forming a uniform system at the stirring speed of 200rpm, and then adding a chelating agent while stirring to finally obtain a uniform, stable, clear and transparent solution.
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