CN114985216B - Electronic chip packaging equipment with protection structure - Google Patents
Electronic chip packaging equipment with protection structure Download PDFInfo
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- CN114985216B CN114985216B CN202210924257.0A CN202210924257A CN114985216B CN 114985216 B CN114985216 B CN 114985216B CN 202210924257 A CN202210924257 A CN 202210924257A CN 114985216 B CN114985216 B CN 114985216B
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- glue
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- bin
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 40
- 239000003292 glue Substances 0.000 claims abstract description 152
- 230000006835 compression Effects 0.000 claims abstract description 20
- 238000007906 compression Methods 0.000 claims abstract description 20
- 239000000428 dust Substances 0.000 claims abstract description 20
- 230000001681 protective effect Effects 0.000 claims abstract description 9
- 235000014676 Phragmites communis Nutrition 0.000 claims description 42
- 238000007599 discharging Methods 0.000 claims description 15
- 230000003028 elevating effect Effects 0.000 claims description 6
- 230000006978 adaptation Effects 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims 2
- 238000004146 energy storage Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 description 5
- 238000009423 ventilation Methods 0.000 description 5
- 239000003921 oil Substances 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229920000297 Rayon Polymers 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000010720 hydraulic oil Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
- B05C9/10—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation being performed before the application
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0225—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work characterised by flow controlling means, e.g. valves, located proximate the outlet
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/04—Cleaning by suction, with or without auxiliary action
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
Abstract
The invention discloses electronic chip packaging equipment with a protective structure, and relates to the technical field of packaging board dispensing. According to the electronic chip packaging equipment with the protection structure, dust on the packaging plate is sucked away through the dust collector, the second compression spring is extruded through the second hydraulic plate to be compressed for energy storage, when the ball moves towards the inner side of the glue outlet pipe, the glue pushing plate pushes glue to be sprayed out of the glue outlet pipe and simultaneously drives the rotating block to rotate, and the sprayed glue is in a circular ring shape.
Description
Technical Field
The invention relates to the technical field of packaging board dispensing, in particular to electronic chip packaging equipment with a protection structure.
Background
The chip package is a shell for mounting a semiconductor integrated circuit chip, plays a role in placing, fixing, sealing, protecting the chip and enhancing the electric heating performance, and is also a bridge for communicating the internal world of the chip with an external circuit, namely, a joint on the chip is connected to pins of the package shell by leads, and the pins are connected with other devices by leads on a printed board.
After the chip is installed in the package board, the package board needs to be fixed on the substrate, most of the prior art adopts a glue dispensing and adhering mode, glue is dispensed on the package board through a glue dispenser, then the glue dispensing surface of the package board is pressed down towards the substrate, and the glue is cooled.
The glue dispenser mostly discharges glue at a point when dispensing, and in order to improve the adhesion fastness, the common mode is to increase the volume of discharging glue, but increase the volume of discharging glue and increased the glue loss on the one hand, on the other hand probably leads to glue when the adhesion to ooze out to the base plate from the gap between encapsulation board and base plate on, influences the operation of base plate circuit.
Disclosure of Invention
The invention aims to: the utility model provides an electronic chip packaging equipment with protective structure to solve the current some glue mode glue loss that provides in the above-mentioned background art and big and have the problem of hidden danger.
In order to achieve the purpose, the invention adopts the following technical scheme:
the invention provides electronic chip packaging equipment with a protective structure, which comprises a first shell, wherein a glue dispensing mechanism is arranged on the first shell, the glue dispensing mechanism comprises a second shell, a glue outlet bin is arranged on the second shell, a rotating block is axially and rotatably arranged in the glue outlet bin, glue outlet pipes extending to the outer side of the second shell are symmetrically arranged on the side wall of the rotating block relative to one side of the glue outlet bin, a ball is movably arranged at the end part of one end, positioned at the outer side of the second shell, of each glue outlet pipe, second hydraulic plates are symmetrically arranged in the glue outlet bin relative to the rotating block, glue pushing plates are arranged on the opposite sides of the two second hydraulic plates, a second compression spring is arranged between the second hydraulic plates and the glue pushing plates, movable grooves are symmetrically arranged on the second shell relative to the glue outlet bin, oil pipes communicated with the inner side of the glue outlet bin are arranged on the side wall of each movable groove, and anti-falling assemblies are arranged in the movable grooves and comprise dust collectors.
Further, anti-drop subassembly still includes the pole that receives that removes along vertical direction, the one end that receives the pole extends to the outside of second casing, other end fixed mounting has first hydraulic plate.
Furthermore, a ventilation pipe is arranged in the pressed rod along the axial lead direction, a notch communicated to the inner side of the air pipe is formed in the side wall of one end, located at the outer side of the second shell, of the pressed rod, a hose communicated to the inner side of the air pipe is arranged on the side wall of one end, located at the inner side of the movable groove, of the pressed rod, and the other end of the hose is externally connected with the dust collector.
Further, the compression rod is fixedly installed on the side wall of the inner side of the movable groove, and a first compression spring is arranged between the mounting plate and the side wall of the movable groove.
Further, anti-drop subassembly still includes circuit breaker, circuit breaker includes first reed, second reed, third reed and fourth reed, two all be provided with first reed and second reed on the lateral wall of mounting panel opposite side, third reed and fourth reed fixed mounting are on the lateral wall of activity groove, the position of third reed is less than the mounting panel, the fourth reed is located between mounting panel and the first hydraulic plate and is less than the hose.
Further, still be provided with the elevating system who orders about the second casing and remove along vertical direction on the first casing, elevating system includes the driving case, install the driving source in the driving case, the assembly groove has been seted up on the first casing, driving case fixed mounting is in the assembly groove, fixed mounting has the first bevel gear that is located the driving case outside on the output of driving source, be provided with the pivot along vertical direction in the assembly groove, fixed mounting has the second bevel gear with first bevel gear meshing on the lateral wall of pivot, set up the recess on the lateral wall of assembly groove, the one end fixed mounting of pivot has the stopper that is located the recess inboard.
Furthermore, a connecting column moving along the vertical direction is arranged in the assembling groove, a connecting hole is formed in the end portion, facing the rotating shaft, of the connecting column, the rotating shaft extends into the connecting hole relative to one end of the limiting block, external threads are arranged on the side wall of the rotating shaft, and internal threads matched with the external threads are arranged on the inner wall of the connecting hole.
Furthermore, a dispensing channel is arranged on the first shell in the horizontal direction, a conveyor belt is arranged in the dispensing channel, a support plate is fixedly mounted in the dispensing channel, an assembly plate located on the inner side of the dispensing channel is fixedly mounted at one end of the connecting column, the assembly plate is fixedly mounted on one side of the connecting column relative to the second shell, and the support plate is located under the second shell.
Furthermore, a plurality of through holes which are obliquely arranged along the axial lead direction are arranged on the rotating block in a penetrating mode, and a micro bearing is arranged between the rotating block and the side wall of the glue outlet bin.
Furthermore, a glue storage bin is arranged on the second shell, and a one-way valve is arranged between the glue storage bin and the glue outlet bin.
Compared with the prior art, the above one or more technical schemes have the following beneficial effects:
according to the electronic chip packaging equipment with the protection structure, when the pressed rod moves upwards, the dust collector is started to suck dust on the packaging plate away, the situation that the dust is retained on the surface of the packaging plate to cause that glue is not firmly bonded is prevented, meanwhile, the two glue pushing plates are pressed together to extrude the glue, and the second compression spring is pressed to store energy because the ball blocks the pipe orifice of the glue outlet pipe;
when the ball moves towards the inner side of the glue outlet pipe, the second compression spring drives the glue to enter the glue outlet pipe from the rotating block, the glue penetrates through a gap between the ball and the inner wall of the glue outlet pipe and is sprayed out from the pipe opening, and the rotating block is driven to rotate when the glue passes through the arc-shaped through hole, so that the sprayed glue is in a circular ring shape, the glue outlet amount is saved, and the glue is firmly bonded;
when the ball starts to move, the second reed is just contacted with the fourth reed, the dust collector stops, and the air generated by the dust collector is prevented from influencing the dispensing.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the invention and together with the description serve to explain the invention and not to limit the invention.
In the drawings:
fig. 1 is a schematic structural diagram of a packaging apparatus provided in the present invention;
FIG. 2 is a schematic cross-sectional view of a packaging apparatus provided in the present invention;
FIG. 3 is an enlarged view taken at A in FIG. 2;
fig. 4 is a schematic cross-sectional structure diagram of a second housing provided in the present invention;
FIG. 5 is an enlarged view of FIG. 4 at B;
FIG. 6 is an enlarged view at C of FIG. 4;
fig. 7 is an enlarged view of fig. 4 at D.
In the figure:
1. a first housing; 11. a dispensing channel; 12. assembling the groove; 13. a support plate; 2. a drive box; 21. a first bevel gear; 22. a rotating shaft; 23. a second bevel gear; 24. a limiting block; 25. connecting columns; 26. connecting holes; 27. assembling a plate; 3. a second housing; 31. a glue storage bin; 32. a one-way valve; 33. discharging the glue from a glue bin; 34. an oil pipe; 35. a movable groove; 351. a third reed; 352. a fourth reed; 4. a pressure receiving rod; 41. a first hydraulic plate; 42. mounting a plate; 421. a first reed; 422. a second reed; 43. a first compression spring; 44. a ventilation pipe; 45. a hose; 46. a second hydraulic plate; 47. a second compression spring; 48. pushing the rubber plate; 49. rotating the block; 410. a through hole; 411. discharging the rubber tube; 412. a ball bearing; 413. a micro bearing; 5. and (4) a conveyor belt.
Detailed Description
In order to make the technical solutions of the present application better understood by those skilled in the art, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that the terms "first," "second," and the like in the description and claims of this application and in the accompanying drawings are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances in order to facilitate the description of the embodiments of the application herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
In this application, the terms "upper", "lower", "left", "right", "front", "rear", "top", "bottom", "inner", "outer", "middle", "vertical", "horizontal", "lateral", "longitudinal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings. These terms are used primarily to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.
Moreover, some of the above terms may be used in other meanings besides orientation or positional relationship, for example, the term "upper" may also be used in some cases to indicate a certain attaching or connecting relationship. The specific meaning of these terms in this application will be understood by those of ordinary skill in the art as appropriate.
Furthermore, the terms "mounted," "disposed," "provided," "connected," and "sleeved" are to be construed broadly. For example, it may be a fixed connection, a removable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
The invention provides electronic chip packaging equipment with a protection structure, which comprises a first shell 1, wherein a glue dispensing mechanism is arranged on the first shell 1, the glue dispensing mechanism comprises a second shell 3, a glue outlet bin 33 is arranged on the second shell 3, a rotating block 49 is axially and rotatably arranged in the glue outlet bin 33, glue outlet pipes 411 extending to the outer side of the second shell 3 are symmetrically arranged on the side wall of the rotating block 49 opposite to one side of the glue outlet bin 33, balls 412 are movably arranged at the end parts of the glue outlet pipes 411 positioned at one end of the outer side of the second shell 3, second hydraulic plates 46 are symmetrically arranged in the glue outlet bin 33 relative to the rotating block 49, glue pushing plates 48 are arranged on the opposite sides of the two second hydraulic plates 46, and second compression springs 47 are arranged between the second hydraulic plates 46 and the glue pushing plates 48.
The packaging plate is conveyed into the glue dispensing channel 11 on the first shell 1 through the conveyor belt 5, so that the packaging plate is positioned under the glue outlet pipe 411, during glue dispensing, the driving source in the driving box 2 drives the first bevel gear 21 to rotate, and further drives the rotating shaft 22 to rotate through the second bevel gear 23 which is meshed with the first bevel gear, the rotating shaft 22 drives the connecting column 25 to move downwards through the connecting hole 26 which is in threaded connection with the rotating shaft, and further drives the second shell 3 which is installed on the assembling plate 27 to move downwards, the pressed rod 4 firstly pushes against the packaging plate to prevent the packaging plate from moving left and right, and the second shell 3 continues to be driven to descend, the first hydraulic plate 41 which is fixedly installed on the end portion of the pressed rod 4, which is located on the inner side end portion of the movable groove 35, pushes hydraulic oil to move towards the glue outlet bin 33 along the oil pipe 34, and further pushes the two second hydraulic plates 46 to be drawn together, the second hydraulic plates 46 push the glue plates 48 to be drawn together, so that glue in the glue outlet bin 33 enters the glue outlet pipe 411 and is sprayed onto the packaging plate through the glue outlet pipe 411.
Preferably, an elevating mechanism for driving the second housing 3 to move in the vertical direction is further disposed on the first housing 1, the elevating mechanism includes a driving box 2, a driving source is mounted in the driving box 2, an assembly groove 12 is formed in the first housing 1, the driving box 2 is fixedly mounted in the assembly groove 12, a first bevel gear 21 located outside the driving box 2 is fixedly mounted at an output end of the driving source, a rotating shaft 22 is disposed in the assembly groove 12 in the vertical direction, and a second bevel gear 23 engaged with the first bevel gear 21 is fixedly mounted on a side wall of the rotating shaft 22.
In order to prevent the rotating shaft 22 from moving up and down along with the connecting column 25, a groove is formed on the side wall of the assembling groove 12, and a limiting block 24 located inside the groove is fixedly installed at one end of the rotating shaft 22.
Conventional chip package dispensing equipment is when gluing the packaging board, and the most is directly scribbled a glue point on the packaging board, glues the packaging board on the mainboard again, in order to guarantee the firm of viscose, need once only extrude a great amount of glue, and when the packaging board laminating was on the mainboard, a large amount of glue received the extrusion to overflowing all around scattered, probably covered the circuit on the mainboard, influenced the normal operating of mainboard circuit.
Therefore, the rotatable rotating block 49 is adopted, the two glue outlet pipes 411 are arranged on the rotating block 49, and during glue dispensing, the rotating block 49 drives the two glue outlet pipes 411 to rotate, so that glue extruded by the glue outlet pipes 411 on the packaging plate is in a circular ring shape, the glue outlet amount can be reduced while the firmness of adhesion between the packaging plate and the main plate is ensured, and the glue is prevented from overflowing and scattering on the main plate.
The rotating block 49 is provided with a plurality of through holes 410 in a penetrating manner, and in order to drive the rotating block 49 to rotate when glue passes through the rotating block 49, the through holes 410 on the rotating block 49 are specifically arranged in a way of inclining downwards along the axial lead direction of the rotating block 49.
In order to enable the glue to have enough impact force to drive the rotating block 49 to rotate when passing through the through hole 410, a second compression spring 47 is installed between the second hydraulic plate 46 and the glue pushing plate 48, please refer to fig. 4-7 below, a pipe orifice of the glue outlet pipe 411 is bent inwards, a ball 412 is arranged in the pipe orifice, the diameter of the ball 412 is larger than a pipe orifice converging position and smaller than the diameter of the inner wall of the glue outlet pipe 411, when the glue pushing plate 48 is pressed and closed, the glue in the glue outlet bin 33 is pushed to move into the glue outlet pipe 411, so that downward pressure is applied to the ball 412, the ball is tightly attached to the pipe orifice of the glue outlet pipe 411, the glue cannot leave the glue outlet pipe 411, at this time, the glue pushing plate 48 cannot push the glue continuously, the second hydraulic plate 46 continues to push the second compression spring 47, so that the second compression spring 47 starts to be pressed and store energy; along with the downward movement of the second housing 3, when the ball 412 abuts against the surface of the packaging plate, the ball 412 cannot descend any more, and the glue outlet pipe 411 still continues to descend, so that the ball 412 is no longer attached to the pipe opening, because the diameter of the ball 412 is smaller than the diameter of the inner wall of the glue outlet pipe 411, when a gap occurs between the ball 412 and the inner wall of the glue outlet pipe 411, the second compression spring 47 pushes the glue pushing plate 48 to close, so as to squeeze the glue in the glue outlet bin 33 into the glue outlet pipe 411, and the glue passes through the gap between the ball 412 and the inner wall of the glue outlet pipe 411 and is ejected out of the pipe opening of the glue outlet pipe 411 onto the packaging plate, and when the glue is pressed through the through hole 410 obliquely arranged on the rotating block 49, the rotating block 49 is driven to rotate, so as to drive the glue outlet pipe 411 to rotate, and the annular glue is ejected out of the packaging plate.
In order to reduce the friction between the rotating block 49 and the side wall of the glue discharging bin 33, a micro bearing 413 is installed between the rotating block 49 and the side wall of the glue discharging bin 33.
Before dispensing, dust or particle impurities generated by cutting a plate material may remain on the surface of the packaging board, and if dispensing is directly performed on the packaging board, the dust or the particle impurities may affect adhesion of the glue, possibly causing the packaging board to fall off from the main board.
In order to prevent the package plate from falling off from the main board due to impurity and dust mixed with glue, movable grooves 35 are symmetrically arranged on the second shell 3 relative to the glue outlet bin 33, an oil pipe 34 communicated with the inner side of the glue outlet bin 33 is arranged on the side wall of each movable groove 35, an anti-falling assembly is arranged in each movable groove 35 and comprises a dust collector, each anti-falling assembly further comprises a pressure rod 4 moving along the vertical direction, one end of each pressure rod 4 extends to the outer side of the second shell 3, a first hydraulic plate 41 is fixedly arranged at the other end of each pressure rod 4, a ventilation pipe 44 is arranged on each pressure rod 4 along the axial direction of the pressure rod 4, a notch communicated with the inner side of the ventilation pipe 44 is arranged on the side wall of one end, located at the inner side of the movable groove 35, of each pressure rod 4, a hose 45 communicated with the ventilation pipe 44 is connected to the side of the corresponding one end of the corresponding movable groove 35, and the dust collector is externally connected to the other end of the corresponding hose 45.
In order to prevent the dust collector from working when dispensing and influencing dispensing, the invention is provided with a circuit breaking switch which comprises a first reed 421, a second reed 422, a third reed 351 and a fourth reed 352, wherein the first reed 421 and the second reed 422 are respectively arranged at the same end of a mounting plate 42, the third reed 351 and the fourth reed 352 are fixedly arranged on the side wall of a movable groove 35, the position of the third reed 351 is lower than that of the mounting plate 42, the fourth reed 352 is positioned between the mounting plate 42 and a first hydraulic plate 41 and is lower than a hose 45, in an initial state, the first reed 421 is abutted against the third reed 351, the dust collector is powered off, when a pressed rod 4 touches an encapsulation plate and moves towards the inner side of a second shell 3, the third reed 351 is disengaged from the first reed 421, the dust collector is powered on and started, when the end part of a rubber outlet pipe 411 touches the encapsulation plate, the second reed 422 is abutted against the fourth reed 352, the dust collector is powered off, and the dust collector is prevented from influencing the dispensing process.
In order to prevent the glue in the glue outlet bin 33 from entering the glue storage bin 31 under the action of the glue pushing plate 48, a one-way valve 32 is installed at the communication part between the glue storage bin 31 and the glue outlet bin 33.
After the glue dispensing is completed, the driving source drives the second shell 3 to ascend, the first compression spring 43 pulls the mounting plate 42 to enable the pressed rod 4 to reset, the first hydraulic plate 41 is driven to reset, the second hydraulic plate 46 is driven to drive the glue pushing plate 48 to reset, the glue outlet bin 33 is in a negative pressure state, and glue in the glue storage bin 31 enters the glue outlet bin 33 through the one-way valve 32.
Be provided with some glue passageway 11 along the horizontal direction on first casing 1, be provided with conveyer belt 5 in some glue passageway 11, conveyer belt 5 is used for transporting the packaging board to some glue and carries out some glue in the passageway 11, and the one end fixed mounting of spliced pole 25 has the pilot panel 27 that is located some glue passageway 11 inboards, and pilot panel 27 has second casing 3 for one side fixed mounting of spliced pole 25.
In order to prevent the packaging board from being pressed to drive the conveyor belt 5 to sink during dispensing, a support plate 13 is arranged right below the second shell 3, and the upper end face of the support plate 13 is attached to the conveyor belt 5.
While the invention has been described with respect to the preferred embodiments, it will be understood by those skilled in the art that various changes and modifications may be made, and it is intended to cover: it will be apparent to those skilled in the art that various modifications and adaptations can be made without departing from the principles of the invention, and such modifications and adaptations are intended to be within the scope of the invention.
Claims (5)
1. The utility model provides an electronic chip packaging equipment with protective structure which characterized in that: the glue dropping device comprises a first shell (1), a glue dropping mechanism is arranged on the first shell (1), the glue dropping mechanism comprises a second shell (3), a glue discharging bin (33) is formed in the second shell (3), a rotating block (49) is axially and rotatably arranged in the glue discharging bin (33), glue discharging pipes (411) extending to the outer side of the second shell (3) are symmetrically arranged on the side wall of one side of the glue discharging bin (33) of the rotating block (49), balls (412) are movably arranged at the end part of one end, located at the outer side of the second shell (3), of the glue discharging pipes (411), second hydraulic plates (46) are symmetrically arranged in the glue discharging bin (33) relative to the rotating block (49), glue pushing plates (48) are respectively arranged at the opposite sides of the two second hydraulic plates (46), second compression springs (47) are arranged between the second hydraulic plates (46) and the glue pushing plates (48), movable grooves (35) are symmetrically arranged on the glue discharging bin (33), the movable grooves (35) are communicated to the inner side wall of the glue discharging bin (33), and anti-falling-off components are arranged in the glue discharging bin (35);
the anti-falling assembly further comprises a pressed rod (4) moving in the vertical direction, one end of the pressed rod (4) extends to the outer side of the second shell (3), and the other end of the pressed rod is fixedly provided with a first hydraulic plate (41);
a vent pipe (44) is arranged in the compression rod (4) along the axial lead direction, a notch communicated with the inner side of the vent pipe (44) is arranged on the side wall of one end, positioned at the outer side of the second shell (3), of the compression rod (4), a hose (45) communicated with the inner side of the vent pipe (44) is arranged on the side wall of one end, positioned at the inner side of the movable groove (35), of the compression rod (4), and the other end of the hose (45) is externally connected with the dust collector;
the side wall of the compression rod (4) positioned at the inner side of the movable groove (35) is fixedly provided with an installation plate (42), and a first compression spring (43) is arranged between the installation plate (42) and the side wall of the movable groove (35);
the anti-falling assembly further comprises a circuit breaker, the circuit breaker comprises a first reed (421), a second reed (422), a third reed (351) and a fourth reed (352), the side walls of the two mounting plates (42) on the opposite sides are respectively provided with the first reed (421) and the second reed (422), the third reed (351) and the fourth reed (352) are fixedly mounted on the side wall of the movable groove (35), the position of the third reed (351) is lower than that of the mounting plate (42), and the fourth reed (352) is located between the mounting plate (42) and the first hydraulic plate (41) and is lower than the hose (45);
a plurality of through holes (410) which are obliquely arranged along the axial lead direction are arranged on the rotating block (49) in a penetrating way, and a micro bearing (413) is arranged between the rotating block (49) and the side wall of the glue outlet bin (33).
2. The electronic chip packaging apparatus with protective structure of claim 1, wherein: still be provided with the elevating system who orders about second casing (3) and remove along vertical direction on first casing (1), elevating system includes drive case (2), install the driving source in drive case (2), assembly groove (12) have been seted up on first casing (1), drive case (2) fixed mounting is in assembly groove (12), fixed mounting has first bevel gear (21) that are located the drive case (2) outside on the output of driving source, be provided with pivot (22) along vertical direction in assembly groove (12), fixed mounting has second bevel gear (23) with first bevel gear (21) meshing on the lateral wall of pivot (22), set up flutedly on the lateral wall of assembly groove (12), the one end fixed mounting of pivot (22) has stopper (24) that are located the recess inboard.
3. The electronic chip packaging apparatus with protective structure of claim 2, wherein: be provided with in assembly groove (12) along the spliced pole (25) that vertical direction removed, connecting hole (26) have been seted up towards the tip of pivot (22) to spliced pole (25), pivot (22) extend to in connecting hole (26) for the one end of stopper (24), be provided with the external screw thread on the lateral wall of pivot (22), be provided with the internal thread with the external screw thread adaptation on the inner wall of connecting hole (26).
4. The electronic chip packaging apparatus with protective structure of claim 3, wherein: be provided with some glue passageway (11) along the horizontal direction on first casing (1), be provided with conveyer belt (5) in some glue passageway (11), some glue passageway (11) internal fixed mounting has backup pad (13), the one end fixed mounting of spliced pole (25) has assembly plate (27) that are located some glue passageway (11) inboard, assembly plate (27) have for one side fixed mounting of spliced pole (25) second casing (3), backup pad (13) are located under second casing (3).
5. The electronic chip packaging apparatus with protective structure of claim 1, wherein: the glue storage bin (31) is arranged on the second shell (3), and a one-way valve (32) is arranged between the glue storage bin (31) and the glue outlet bin (33).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210924257.0A CN114985216B (en) | 2022-08-03 | 2022-08-03 | Electronic chip packaging equipment with protection structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210924257.0A CN114985216B (en) | 2022-08-03 | 2022-08-03 | Electronic chip packaging equipment with protection structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114985216A CN114985216A (en) | 2022-09-02 |
| CN114985216B true CN114985216B (en) | 2022-11-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210924257.0A Active CN114985216B (en) | 2022-08-03 | 2022-08-03 | Electronic chip packaging equipment with protection structure |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200810840A (en) * | 2006-08-18 | 2008-03-01 | Hon Hai Prec Ind Co Ltd | Dispenser apparatus |
| CN211412601U (en) * | 2019-10-30 | 2020-09-04 | 杨春慧 | Be used for window frame to seal mucilage binding and put |
| CN112536198A (en) * | 2020-11-12 | 2021-03-23 | 赣州欧翔电子有限公司 | Earphone dispensing equipment |
| CN212856429U (en) * | 2020-07-28 | 2021-04-02 | 济南报业文新印务有限公司 | Paper folding bonding auxiliary device for rotary machine |
| CN113941478A (en) * | 2021-10-25 | 2022-01-18 | 刘洋 | Chip packaging dispensing equipment |
-
2022
- 2022-08-03 CN CN202210924257.0A patent/CN114985216B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200810840A (en) * | 2006-08-18 | 2008-03-01 | Hon Hai Prec Ind Co Ltd | Dispenser apparatus |
| CN211412601U (en) * | 2019-10-30 | 2020-09-04 | 杨春慧 | Be used for window frame to seal mucilage binding and put |
| CN212856429U (en) * | 2020-07-28 | 2021-04-02 | 济南报业文新印务有限公司 | Paper folding bonding auxiliary device for rotary machine |
| CN112536198A (en) * | 2020-11-12 | 2021-03-23 | 赣州欧翔电子有限公司 | Earphone dispensing equipment |
| CN113941478A (en) * | 2021-10-25 | 2022-01-18 | 刘洋 | Chip packaging dispensing equipment |
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|---|---|
| CN114985216A (en) | 2022-09-02 |
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Denomination of invention: An electronic chip packaging device with a protective structure Granted publication date: 20221118 Pledgee: Zaozhuang rural commercial bank Limited by Share Ltd. Yicheng sub branch Pledgor: Shandong Hanxin Technology Co.,Ltd. Registration number: Y2024980003094 |