CN114982386A - 柔性电路板及显示装置 - Google Patents
柔性电路板及显示装置 Download PDFInfo
- Publication number
- CN114982386A CN114982386A CN202080003650.5A CN202080003650A CN114982386A CN 114982386 A CN114982386 A CN 114982386A CN 202080003650 A CN202080003650 A CN 202080003650A CN 114982386 A CN114982386 A CN 114982386A
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- China
- Prior art keywords
- sub
- circuit board
- body region
- layer
- flexible circuit
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- 239000010410 layer Substances 0.000 claims abstract description 274
- 210000000746 body region Anatomy 0.000 claims abstract description 54
- 239000002356 single layer Substances 0.000 claims abstract description 53
- 239000000758 substrate Substances 0.000 claims description 39
- 239000012790 adhesive layer Substances 0.000 claims description 35
- 230000001681 protective effect Effects 0.000 claims description 19
- 239000002355 dual-layer Substances 0.000 claims description 8
- 239000010408 film Substances 0.000 description 191
- 238000000034 method Methods 0.000 description 14
- 238000005538 encapsulation Methods 0.000 description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 9
- 239000010949 copper Substances 0.000 description 9
- 230000014509 gene expression Effects 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- 230000036961 partial effect Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 239000007769 metal material Substances 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 3
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- 238000010924 continuous production Methods 0.000 description 2
- 230000000670 limiting effect Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000002829 reductive effect Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000002096 quantum dot Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09218—Conductive traces
- H05K2201/09227—Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10128—Display
- H05K2201/10136—Liquid Crystal display [LCD]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/061—Lamination of previously made multilayered subassemblies
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4635—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating flexible circuit boards using additional insulating adhesive materials between the boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
本公开提供了一种柔性电路板和显示装置。柔性电路板包括:主体区;绑定区,绑定区与主体区的第一侧结合,绑定区包括多个绑定引脚;和伸出区,伸出区与主体区的第二侧结合,第一侧和第二侧是主体区的两个相对侧。所述主体区包括第一子主体区和第二子主体区,所述第二子主体区位于所述第一子主体区靠近所述伸出区的一侧,所述多条走线至少包括第一走线、第二走线和第三走线,所述第一走线、所述第二走线和所述第三走线都在所述第一子主体区中延伸,所述第一走线和所述第二走线在所述第二子主体区中延伸。所述第一子主体区具有多层板结构,所述第二子主体区具有单层板或双层板结构,所述第二子主体区的厚度小于所述第一子主体区的厚度。
Description
PCT国内申请,说明书已公开。
Claims (24)
- PCT国内申请,权利要求书已公开。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/CN2020/139459 WO2022134013A1 (zh) | 2020-12-25 | 2020-12-25 | 柔性电路板及显示装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN114982386A true CN114982386A (zh) | 2022-08-30 |
Family
ID=82157125
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202080003650.5A Pending CN114982386A (zh) | 2020-12-25 | 2020-12-25 | 柔性电路板及显示装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20220240386A1 (zh) |
CN (1) | CN114982386A (zh) |
WO (1) | WO2022134013A1 (zh) |
Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040112632A1 (en) * | 2002-12-13 | 2004-06-17 | Shigeru Michiwaki | Printed wiring board having rigid portion and flexible portion, and method of fabricating the board |
US20140369009A1 (en) * | 2013-06-18 | 2014-12-18 | Samsung Electronics Co., Ltd. | Display device |
CN104460119A (zh) * | 2014-08-29 | 2015-03-25 | 友达光电股份有限公司 | 显示面板及其制造方法 |
CN105430889A (zh) * | 2015-12-29 | 2016-03-23 | 广东欧珀移动通信有限公司 | 柔性电路板及终端 |
CN107180594A (zh) * | 2017-06-30 | 2017-09-19 | 厦门天马微电子有限公司 | 一种显示面板和显示装置 |
CN108241240A (zh) * | 2018-02-08 | 2018-07-03 | 上海天马微电子有限公司 | 一种显示面板以及显示装置 |
CN211090137U (zh) * | 2020-02-24 | 2020-07-24 | 京东方科技集团股份有限公司 | 显示装置 |
WO2020156595A2 (zh) * | 2019-01-30 | 2020-08-06 | 京东方科技集团股份有限公司 | 柔性电路板及制作方法、显示装置、电路板结构及其显示面板 |
CN111511098A (zh) * | 2020-06-10 | 2020-08-07 | 京东方科技集团股份有限公司 | 一种柔性线路板fpc及显示装置 |
CN112002246A (zh) * | 2020-09-28 | 2020-11-27 | 上海天马有机发光显示技术有限公司 | 显示面板及显示装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011043318A1 (ja) * | 2009-10-05 | 2011-04-14 | 株式会社村田製作所 | 回路基板 |
US11129284B2 (en) * | 2019-09-16 | 2021-09-21 | Apple Inc. | Display system and rigid flex PCB with flip chip bonded inside cavity |
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2020
- 2020-12-25 US US17/603,395 patent/US20220240386A1/en active Pending
- 2020-12-25 CN CN202080003650.5A patent/CN114982386A/zh active Pending
- 2020-12-25 WO PCT/CN2020/139459 patent/WO2022134013A1/zh active Application Filing
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040112632A1 (en) * | 2002-12-13 | 2004-06-17 | Shigeru Michiwaki | Printed wiring board having rigid portion and flexible portion, and method of fabricating the board |
US20140369009A1 (en) * | 2013-06-18 | 2014-12-18 | Samsung Electronics Co., Ltd. | Display device |
CN104460119A (zh) * | 2014-08-29 | 2015-03-25 | 友达光电股份有限公司 | 显示面板及其制造方法 |
CN105430889A (zh) * | 2015-12-29 | 2016-03-23 | 广东欧珀移动通信有限公司 | 柔性电路板及终端 |
CN107180594A (zh) * | 2017-06-30 | 2017-09-19 | 厦门天马微电子有限公司 | 一种显示面板和显示装置 |
CN108241240A (zh) * | 2018-02-08 | 2018-07-03 | 上海天马微电子有限公司 | 一种显示面板以及显示装置 |
WO2020156595A2 (zh) * | 2019-01-30 | 2020-08-06 | 京东方科技集团股份有限公司 | 柔性电路板及制作方法、显示装置、电路板结构及其显示面板 |
CN211090137U (zh) * | 2020-02-24 | 2020-07-24 | 京东方科技集团股份有限公司 | 显示装置 |
CN111511098A (zh) * | 2020-06-10 | 2020-08-07 | 京东方科技集团股份有限公司 | 一种柔性线路板fpc及显示装置 |
CN112002246A (zh) * | 2020-09-28 | 2020-11-27 | 上海天马有机发光显示技术有限公司 | 显示面板及显示装置 |
Also Published As
Publication number | Publication date |
---|---|
WO2022134013A1 (zh) | 2022-06-30 |
US20220240386A1 (en) | 2022-07-28 |
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