WO2020156475A1 - 柔性电路板及制作方法、电子装置模组及电子装置 - Google Patents

柔性电路板及制作方法、电子装置模组及电子装置 Download PDF

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Publication number
WO2020156475A1
WO2020156475A1 PCT/CN2020/073940 CN2020073940W WO2020156475A1 WO 2020156475 A1 WO2020156475 A1 WO 2020156475A1 CN 2020073940 W CN2020073940 W CN 2020073940W WO 2020156475 A1 WO2020156475 A1 WO 2020156475A1
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WO
WIPO (PCT)
Prior art keywords
bridge
circuit board
wiring
sub
main body
Prior art date
Application number
PCT/CN2020/073940
Other languages
English (en)
French (fr)
Inventor
熊韧
汤强
Original Assignee
京东方科技集团股份有限公司
成都京东方光电科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202010075431.XA external-priority patent/CN111511109B/zh
Application filed by 京东方科技集团股份有限公司, 成都京东方光电科技有限公司 filed Critical 京东方科技集团股份有限公司
Priority to JP2020561738A priority Critical patent/JP2022519960A/ja
Priority to EP20748627.5A priority patent/EP3920672A4/en
Priority to US16/958,937 priority patent/US11419212B2/en
Publication of WO2020156475A1 publication Critical patent/WO2020156475A1/zh
Priority to US17/864,731 priority patent/US11589461B2/en
Priority to US18/094,683 priority patent/US11765828B2/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits

Definitions

  • the embodiments of the present disclosure relate to a flexible circuit board and a manufacturing method thereof, an electronic device module, and an electronic device.
  • Flexible Printed Circuit is a highly reliable and flexible printed circuit board made of flexible film as a substrate.
  • Flexible circuit boards have the characteristics of high wiring density, light weight, thin thickness, and good flexibility, and are widely used in various electronic devices such as mobile phones, computers, and displays.
  • the flexible circuit board includes a main body sub-circuit board, including a first substrate, and a first bridge end, a second bridge end, and a first bridge provided on the first substrate.
  • a wiring portion and a second wiring portion, the first wiring portion and the second wiring portion are spaced apart from each other and electrically connected to the first bridge terminal and the second bridge terminal, respectively;
  • a bridge sub-circuit The board includes a second substrate, a third bridge end, a fourth bridge end, and a third wiring part for the first functional wiring provided on the second substrate, the third bridge end and the first
  • the four bridge terminals are electrically connected by the third wiring part, wherein the first substrate and the second substrate are not in direct contact, and the bridge sub-circuit board is configured to connect the third bridge terminal and the The fourth bridge end is electrically connected to the first bridge end and the second bridge end respectively, and is mounted on the main body sub-circuit board.
  • the bridge sub-circuit board is mounted on the main body sub-circuit board so that the first wiring portion, the third wiring portion and the second wiring portion The two wiring parts are electrically connected in sequence to obtain the first functional wiring.
  • the flexible circuit board provided by at least one embodiment of the present disclosure further includes a first control circuit coupling structure, the first control circuit coupling structure is disposed on the main body sub-circuit board, and is electrically connected to the first wiring portion , Or the first control circuit coupling structure is arranged on the bridge sub-circuit board and electrically connected to the third wiring part; the first control circuit coupling structure is configured to provide the first functional wiring The first electrical signal or the first electrical signal is received from the first functional wiring.
  • the main body sub-circuit board further includes a second functional wiring, and the second functional wiring is connected to the second functional wiring provided on the main sub-circuit board.
  • a control circuit combined structure is electrically connected, and the first control circuit combined structure is further configured to provide a second electrical signal to the second functional wiring or receive a second electrical signal from the second functional wiring.
  • the main body sub-circuit board further includes a third functional wiring, and the third functional wiring is located between the first wiring part and the second wiring. Between the line parts and cross the bridge sub-circuit board mounted on the main body sub-circuit board.
  • the first wiring portion, the second wiring portion, and the third functional wiring are routed in the same direction.
  • the main body sub-circuit board includes a first main body wiring layer located on the first side of the first substrate and a layer laminated on the first main body wiring layer
  • the first main body insulating layer on the side away from the first substrate, the first main body wiring layer includes the first wiring portion, the second wiring portion, the first bridge end and the The second bridge end, the first bridge end and the second bridge end are exposed by the first main body insulating layer.
  • the main body sub-circuit board further includes a second main body wiring layer located on a second side of the first substrate opposite to the first side and a stack
  • the second main body insulating layer on the side of the second main body wiring layer away from the first substrate, the second main body wiring layer includes the first wiring portion and the second wiring portion .
  • the main body sub-circuit board includes a first main body wiring layer located on the first side of the first substrate and a layer laminated on the first main body wiring layer The first main body insulating layer on the side away from the first substrate, the main body sub-circuit board further includes a second main body wiring layer located on a second side of the first substrate opposite to the first side, and A second main body insulating layer laminated on the side of the second main body wiring layer away from the first substrate, the first main body wiring layer including the first wiring part and the second wiring Part and the first bridging end, the first bridging end is exposed by the first main body insulating layer; the second main body wiring layer includes the first wiring part, the second wiring part and The second bridge end, the second bridge end is exposed by the second main insulation layer.
  • the bridge sub-circuit board includes a first bridge wiring layer on the first side of the second substrate and a layer stacked on the first bridge wiring
  • the first bridge insulating layer on the side of the layer away from the second substrate, the first bridge wiring layer includes the third wiring portion.
  • the bridge sub-circuit board further includes a ground layer on a second side of the second substrate opposite to the first side, and the bridge sub-circuit board When the circuit board is mounted on the main body sub-circuit board, and the second side is closer to the main body sub-circuit board relative to the first side.
  • the bridge sub-circuit board further includes a shielding layer on the second side of the second substrate, and the shielding laminated layer is on the ground layer. The side away from the second electrode plate.
  • the bridge sub-circuit board further includes a second bridge wiring layer on a second side of the second substrate opposite to the first side and a stack Layer on the second bridge insulating layer on the side of the second bridge wiring layer away from the second substrate, the second bridge wiring layer includes the third wiring portion, the third bridge end and The fourth bridge end, the third bridge end and the fourth bridge end are exposed by the second bridge insulation layer; when the bridge sub-circuit board is mounted on the main body sub-circuit board, The second side is closer to the main body sub-circuit board than the first side.
  • the bridge sub-circuit board further includes a second bridge wiring layer on a second side of the second substrate opposite to the first side and a stack Layer on the second bridge insulating layer on the side of the second bridge wiring layer away from the second substrate, the first bridge wiring layer further includes the third bridge end, the third bridge end is The first bridging insulating layer is exposed; the second bridging wiring layer includes the third wiring portion and the fourth bridging end, and the fourth bridging end is exposed by the second bridging insulating layer.
  • the bridge sub-circuit board further includes a bridge sub-circuit board on the second side of the second substrate and laminated on the second bridge insulating layer away from the first Two shielding layer on one side of the substrate.
  • the third bridge end and the fourth bridge end of the bridge sub-circuit board are connected to each other through anisotropic conductive glue, soldering material, or a connector.
  • the first bridge end and the second bridge end of the main body sub-circuit board are connected to each other through anisotropic conductive glue, soldering material, or a connector.
  • the main body sub-circuit board includes a plurality of the first bridge terminals and a plurality of the second bridge terminals; there are a plurality of the bridge sub-circuit boards, The plurality of bridge sub-circuit boards are respectively electrically connected to the plurality of first bridge ends and the plurality of second bridge ends through the plurality of third bridge ends and the plurality of fourth bridge ends, and Installed on the main body sub-circuit board.
  • the flexible circuit board includes a main body sub-circuit board, including a first substrate, and a first bridge end, a second bridge end, and a first bridge provided on the first substrate.
  • a wiring portion and a second wiring portion, the first wiring portion and the second wiring portion are spaced apart from each other and electrically connected to the first bridge terminal and the second bridge terminal, respectively;
  • a bridge sub-circuit The board includes a second substrate, a third bridge end, a fourth bridge end, and a third wiring part for the first functional wiring provided on the second substrate, the third bridge end and the first
  • the four bridge terminals are electrically connected by the third wiring part, wherein the first substrate and the second substrate are not in direct contact, and the bridge sub-circuit board is configured to connect the third bridge terminal and the The fourth bridge terminal is electrically connected to the first bridge terminal and the second bridge terminal, and is mounted on the main body sub-circuit board;
  • the main body sub-circuit board includes a first side of the first substrate A first main body
  • At least one embodiment of the present disclosure provides an electronic device module, the electronic device module includes an electronic device substrate and any of the above-mentioned flexible circuit boards; wherein the electronic device substrate includes a first functional circuit structure, and the flexible circuit The first functional wiring of the board is electrically connected to the first functional circuit structure.
  • the flexible circuit board further includes a second functional wiring
  • the first functional circuit structure includes a first signal transmission part and a second signal transmission part.
  • a functional wiring is electrically connected to the first signal transmission part
  • the second functional wiring is electrically connected to the second signal transmission part.
  • the electronic device substrate further includes a second functional circuit structure
  • the flexible circuit board further includes a third functional wiring, the third functional wiring electrical Connect the second functional circuit structure.
  • the first functional circuit structure is a touch circuit structure
  • the second functional circuit structure is a display circuit structure
  • the first signal transmission part is a touch drive circuit of the touch circuit
  • the second signal transmission part is a touch drive circuit of the touch circuit.
  • the first signal transmission part is a touch sensor circuit of the touch circuit
  • the second signal transmission part is a touch drive circuit of the touch circuit.
  • At least one embodiment of the present disclosure provides an electronic device including the electronic device module of any one of the above claims.
  • At least one embodiment of the present disclosure provides a method for manufacturing a flexible circuit board, including: providing a main body sub-circuit board, the main body sub-circuit board including a first substrate, and a first bridge terminal and a second substrate provided on the first substrate.
  • Two bridging ends, a first wiring portion and a second wiring portion, the first wiring portion and the second wiring portion are spaced apart from each other and are respectively connected to the first bridging end and the second bridging end Electrical connection; providing a bridge sub-circuit board, the bridge sub-circuit board includes a second substrate and a third bridge end, a fourth bridge end and a third route for the first functional wiring provided on the second substrate The third bridge end and the fourth bridge end are electrically connected by the third wiring part, and the third bridge end and the fourth bridge end of the bridge sub-circuit board are electrically connected to each other. Connected to the first bridge terminal and the second bridge terminal of the main body sub-circuit board so that the bridge sub-circuit board is mounted on the main body sub-circuit board, the first substrate and the second The two substrates are not in direct contact.
  • the third bridge end of the bridge sub-circuit board and the fourth bridge terminal are connected to each other by hot pressing, soldering, or a connector.
  • the bridge ends are respectively connected to the first bridge end and the second bridge end of the main body sub-circuit board.
  • FIG. 1A is a schematic plan view of a flexible circuit board provided by at least one embodiment of the present disclosure
  • FIG. 1B is a schematic plan view of a flexible circuit board provided by at least one embodiment of the present disclosure
  • FIG. 1C is a schematic plan view of a flexible circuit board provided by at least one embodiment of the present disclosure.
  • 1D is a schematic plan view of a flexible circuit board provided by at least one embodiment of the present disclosure.
  • FIG. 2 is a schematic plan view of a main body sub-circuit board of a flexible circuit board provided by at least one embodiment of the present disclosure
  • FIG. 3 is a schematic plan view of a bridge sub-circuit board of a flexible circuit board provided by at least one embodiment of the present disclosure
  • 4A is a schematic plan view of a main body sub-circuit board of a flexible circuit board provided by at least one embodiment of the present disclosure
  • 4B is a schematic plan view of a bridge sub-circuit board of a flexible circuit board provided by at least one embodiment of the present disclosure
  • 5A is a schematic plan view of a main body sub-circuit board of a flexible circuit board provided by at least one embodiment of the present disclosure
  • 5B is a schematic plan view of the main body sub-circuit board of the flexible circuit board provided by at least one embodiment of the present disclosure
  • 6A is a schematic cross-sectional view of a main body sub-circuit board of a flexible circuit board provided by at least one embodiment of the present disclosure
  • 6B is a schematic cross-sectional view of the main body sub-circuit board of the flexible circuit board provided by at least one embodiment of the present disclosure
  • FIG. 7A is another schematic cross-sectional view of the main body sub-circuit board of the flexible circuit board provided by at least one embodiment of the present disclosure
  • FIG. 7B is another schematic cross-sectional view of the main body sub-circuit board of the flexible circuit board provided by at least one embodiment of the present disclosure.
  • FIG. 8A is a schematic cross-sectional view of a bridge sub-circuit board of a flexible circuit board provided by at least one embodiment of the present disclosure
  • FIG. 8B is a schematic cross-sectional view of a bridge sub-circuit board of a flexible circuit board provided by at least one embodiment of the present disclosure
  • 8C is a schematic cross-sectional view of a bridge sub-circuit board of a flexible circuit board provided by at least one embodiment of the present disclosure
  • 8D is a schematic cross-sectional view of a bridge sub-circuit board of a flexible circuit board provided by at least one embodiment of the present disclosure
  • 9A is another schematic cross-sectional view of the bridge sub-circuit board of the flexible circuit board provided by at least one embodiment of the present disclosure.
  • 9B is another schematic cross-sectional view of the bridge sub-circuit board of the flexible circuit board provided by at least one embodiment of the present disclosure.
  • 10A is a schematic diagram of an electronic device module provided by at least one embodiment of the present disclosure.
  • 10B is a schematic diagram of another electronic device module provided by at least one embodiment of the present disclosure.
  • FIG. 11 is a schematic diagram of an electronic device provided by some embodiments of the disclosure.
  • FIG. 12 is a manufacturing flow chart of a flexible circuit board provided by some embodiments of the disclosure.
  • Flexible circuit boards can usually integrate multiple signal traces to transmit different types of signals.
  • the wiring difficulty in the flexible circuit board will also increase. Big.
  • flexible circuit boards are often formed with multiple wiring layers, such as four or six wiring layers, etc., so as to facilitate the layout of multiple wirings, so that multiple wirings can be distributed on different layers , Thereby reducing the mutual interference between different types of wiring.
  • For signal crosstalk between different traces it is also necessary to form (electromagnetic signal) shielding layers between different traces, all of which increase the difficulty of manufacturing the flexible circuit board.
  • the flexible circuit board includes a first substrate, and a main body sub-circuit board and a bridge sub-circuit board disposed on the first substrate;
  • the main body sub-circuit board includes a first bridge end, a second Two bridge terminals, a first wiring part and a second wiring part, the first wiring part and the second wiring part are spaced apart from each other and electrically connected to the first bridge terminal and the second bridge terminal respectively;
  • the bridge sub-circuit board includes The second substrate and the third bridge end, the fourth bridge end, and the third wiring part provided on the second substrate, the third bridge end and the fourth bridge end are electrically connected by the third wiring part, the first substrate and the second
  • the substrate is not in direct contact, and the bridge sub-circuit board is configured to be mounted on the main sub-circuit board by electrically connecting the third bridge terminal and the fourth bridge terminal to the first bridge terminal and the second bridge terminal, respectively.
  • An electronic device module provided by at least one embodiment of the present disclosure includes an electronic device substrate and the above-mentioned flexible circuit board; the electronic device substrate includes a first functional circuit structure, and the first functional wiring of the flexible circuit board is electrically connected to the first function Circuit configuration.
  • At least one embodiment of the present disclosure provides an electronic device including the above-mentioned electronic device module.
  • FIG. 1A is a schematic plan view of the flexible circuit board.
  • the flexible circuit board 10 includes a main body sub-circuit board 100 and a bridge sub-circuit board 200, and the bridge sub-circuit board 200 may be electrically connected to the main body sub-circuit board 100.
  • FIG. 2 is a schematic plan view of the main body sub-circuit board 100.
  • the main body sub-circuit board 100 includes a first substrate and a first bridge terminal 101, a second bridge terminal 102, a first wiring portion 103, and a second wiring portion 104 disposed on the first substrate;
  • a wiring portion 103 and a second wiring portion 104 are separated from each other by a predetermined space (distance), and are electrically connected to the first bridge terminal 101 and the second bridge terminal 102, respectively.
  • the first bridge end 101 includes a plurality of first contact pads
  • the second bridge end 102 includes a plurality of second contact pads.
  • the first wiring portion 103 includes a plurality of wirings, and one end of the plurality of wirings is electrically connected to the plurality of first contact pads included in the first bridge terminal 101 in a one-to-one correspondence;
  • the second wiring portion 104 also includes multiple One wire, and one end of the wire is electrically connected to the plurality of second contact pads included in the first bridge terminal 102 in a one-to-one correspondence.
  • the figure only shows two wires included in the first wire portion 103 and two wires included in the second wire portion 104, the embodiments of the present disclosure are not limited thereto.
  • FIG. 3 is a schematic plan view of the bridge sub-circuit board 200.
  • the bridge sub-circuit board 200 includes a second substrate, a third bridge end 201, a fourth bridge end 202, and a third wiring portion 203 disposed on the second substrate, the third bridge end 201 and the fourth
  • the bridge terminal 202 is electrically connected by the third wiring part 203.
  • the third bridging end 201 includes a plurality of third contact pads
  • the fourth bridging end 202 includes a plurality of fourth contact pads
  • the third trace portion 203 includes a plurality of traces, and these traces are connected to the third bridging end at one end.
  • the plurality of third contact pads included in 201 are electrically connected in one-to-one correspondence, and the other end is electrically connected in one-to-one correspondence with the plurality of fourth contact pads included in the fourth bridge terminal 202. Although only two wires included in the third wire portion 203 are shown in the figure, the embodiment of the present disclosure is not limited thereto.
  • the bridge sub-circuit board 200 is configured to be able to mount the bridge sub-circuit board 200 to the main sub-circuit by electrically connecting the third bridge terminal 201 and the fourth bridge terminal 202 to the first bridge terminal 101 and the second bridge terminal 102, respectively On board 100.
  • the first wiring portion 103, the third wiring portion 203, and the second wiring portion 104 are sequentially electrically connected to obtain the first functional wiring, thereby
  • the signal may be transmitted from the first wiring section 103 to the second wiring section 104 through the third wiring section 203, or may be transmitted from the second wiring section 104 to the first wiring section through the third wiring section 203 103.
  • FIG. 1A shows a situation where the bridge sub-circuit board 200 is mounted on the main sub-circuit board 100 through the third bridge end 201 and the fourth bridge end 202 respectively being joined to the first bridge end 101 and the second bridge end 102
  • the main body sub-circuit board 100 and the bridge sub-circuit board 200 may also be in a state to be connected, that is, the separate main body sub-circuit board 100 and the bridge sub-circuit board 200 are also within the protection scope of the present disclosure.
  • the flexible circuit board 10 may further include a first control circuit combining structure 105, and the first control circuit combining structure 105 is disposed on the main sub-circuit board 100.
  • the first control circuit combining structure 105 includes a plurality of contact pads for mounting the first control circuit, and a part of the plurality of contact pads is electrically connected to the other end of the plurality of wires included in the first wiring portion 103 one by one. connection.
  • the first control circuit combined structure 105 is configured to provide a first electrical signal to the first functional wiring or receive a first electrical signal from the first functional wiring.
  • the first control circuit may be a driver IC chip.
  • packaging methods such as tape carrier package (TCP), chip on film (COF) packaging, and so on.
  • TCP tape carrier package
  • COF chip on film
  • the flexible circuit board includes multiple contact pads, and the multiple pins of the driver IC chip are soldered to the multiple contact pads of the flexible circuit board in a one-to-one correspondence (such as eutectic soldering), or through anisotropic conductive glue ( ACF)
  • ACF anisotropic conductive glue
  • One-to-one electrical connection, and at least the soldering part is protected by, for example, epoxy resin; in order to increase the bendability of the flexible circuit board in the TCP mode, a slit (Slit) can be formed in the package part.
  • the flexible circuit board includes multiple contact pads, and the multiple pins of the driver IC chip are directly crimped on the multiple contact pads of the flexible circuit board through ACF, so that the multiple pins of the driver IC chip and the flexible circuit
  • the multiple contact pads of the board are electrically connected in a one-to-one correspondence.
  • the size and arrangement of the contact pads on the flexible circuit board used to combine the driver IC chip can be adjusted according to different types of packaging or the driver IC chip to be packaged.
  • the contact pads can be arranged long Bars or arranged in rectangles.
  • the embodiment of the present disclosure does not limit the packaging method of the driver IC chip.
  • the main body sub-circuit board 100 of the flexible circuit board 10 may further include a second functional wiring 106.
  • the second functional wiring 106 includes multiple wirings, and the first control circuit Another part of the contact pads in the bonding structure 105 are electrically connected to the multiple wirings included in the second functional wiring 106 in a one-to-one correspondence.
  • the first control circuit mounted on the first control circuit bonding structure 105 is also configured to provide The second functional wiring 106 provides a second electrical signal or receives a second electrical signal from the second functional wiring 106.
  • the main sub-circuit board 100 of the flexible circuit board 10 further includes a third functional wiring 107, and the third functional wiring 107 is located in the first wiring portion 103 and Between the second wiring portions 104, thereby passing through the predetermined space between the first wiring portion 103 and the second wiring portion 104, for example, the third functional wiring 107 is connected to the main body sub-circuit board 100
  • the bridge sub-circuit board 200 crosses in a direction perpendicular to the surface of the main body sub-circuit board 100.
  • the third portion of the wiring 203 on the bridge sub-circuit board 200 crosses the third functional wiring 107 to electrically connect the first portion 103 and the second portion of the wiring 104 on both sides of the main sub-circuit board 100,
  • this design can also simplify the wiring layout of the main body sub-circuit board 100, making the manufacturing process of the main sub-circuit board simple.
  • the first wiring portion 103, the second wiring portion 104, and the third functional wiring 107 are wired in the same direction, such as parallel wiring or substantially parallel wiring (as long as the wiring It does not need to cross), such as parallel wiring in the vertical direction as shown in the figure.
  • the above-mentioned multiple types of wiring on the main body sub-circuit board 100 have no crossover parts, and the wiring layout is simpler.
  • these traces may be arranged in the same trace layer, thereby reducing the number of trace layers and simplifying the layered structure of the flexible circuit board.
  • the flexible circuit board 10 may further include a second control circuit combining structure 108, and the second control circuit combining structure 108 is disposed on the main sub-circuit board 100.
  • the second control circuit combining structure 108 includes a plurality of contact pads for mounting the second control circuit, and at least a part of the plurality of contact pads is electrically connected to one end of the third functional wiring 107 in a one-to-one correspondence.
  • the second control circuit combined structure 108 is configured to provide a third electrical signal to the third functional wiring 107 or receive a third electrical signal from the third functional wiring 107.
  • the third function trace 107 is divided into two parts, the first part of the third function trace 107 is electrically connected to the first end (the lower end shown in the figure) of the second control circuit combination structure 108, and the third function trace The second part of 107 is electrically connected between the second end (shown as the upper end in the figure) of the second control circuit coupling structure 108 and the contact pad (described below) formed on one side edge of the main sub-circuit board 100.
  • the second control circuit may also be a driver IC chip.
  • the first control circuit and the second control circuit are respectively used to implement different driving functions.
  • the method of coupling the driver IC chip to the flexible circuit board is, for example, tape carrier package (TCP), chip on film (COF) package, and the like.
  • the second control circuit bonding structure 108 includes a plurality of contact pads for connecting with the driving IC chip.
  • the size, arrangement, etc. of the contact pads can be adjusted according to different types of packaging methods or driver IC chips to be packaged, which are not specifically limited in the embodiments of the present disclosure.
  • the first control circuit combination structure 105 may also be formed on the bridge sub-circuit board 200.
  • the first wiring The part 103 and the second wiring part 104 are electrically connected to the first bridge terminal 101 and the second bridge terminal 102, respectively.
  • the third wiring part 203 is divided into two parts, and the third wiring part 203 The first part of is electrically connected between the first control circuit coupling structure 105 and the third bridge terminal 201, and the second part of the third wiring part 203 is electrically connected between the first control circuit coupling structure 105 and the fourth bridge terminal 202 .
  • the first wiring portion 103 and the second wiring portion 104 on the main sub-circuit board 100 are electrically connected to the first control circuit combination structure 105 on the bridge sub-circuit board 200, respectively.
  • the main body sub-circuit board 100 includes a plurality of first bridge terminals 101 and a plurality of second bridge terminals 102, and the plurality of bridge sub-circuit boards 200 respectively pass through a plurality of third bridge terminals 201 and a plurality of fourth bridge terminals thereon.
  • 202 is electrically connected to a plurality of first bridge terminals 101 and a plurality of second bridge terminals 102, respectively, so as to be mounted on the main body sub-circuit board 100.
  • bridge sub-circuit boards 200 there are two bridge sub-circuit boards 200, but the embodiment of the present disclosure is not limited to this, and the number of bridge sub-circuit boards 200 can be selected according to actual needs. In the embodiment of the present disclosure, the number of bridge sub-circuit boards 200 is not limited.
  • the embodiment of the present disclosure does not specifically limit the arrangement of the bridge sub-circuit board 200.
  • the bridge sub-circuit board 200 is arranged horizontally, so that the left and right sides of the main sub-circuit board 100 are routed.
  • the wires located in the middle of the main body sub-circuit board 100 pass under the bridge sub-circuit board 200.
  • the arrangement direction of the bridge sub-circuit board 200 can also be bridged vertically, thereby bridging the traces located on the upper and lower sides of the main sub-circuit board 100, and are located on the main sub-circuit board 100.
  • the traces on the left and right sides pass under the bridge sub-circuit board 200.
  • FIG. 5A shows a schematic plan view of another main body sub-circuit board provided by an embodiment of the present disclosure.
  • the main body sub-circuit board adopts a different shape and circuit arrangement from the foregoing embodiment.
  • the main body sub-circuit board is elongated, and the main body sub-circuit board has a first bridge terminal 101, a second bridge terminal 102, a first wiring portion 103, a second wiring portion 104, and Structures such as the second functional wiring 106 have a similar arrangement to the main body sub-circuit board of the above-mentioned embodiment.
  • Structures such as the second functional wiring 106 have a similar arrangement to the main body sub-circuit board of the above-mentioned embodiment.
  • the third wiring portion 107 extends from the middle part of the main sub-circuit board and is on one side of the main sub-circuit board ( The lower side shown in the figure) is turned to the left side of the main body sub-circuit board and electrically connected to the terminal 111 on the left side of the main body sub-circuit board.
  • the terminal 111 has a plurality of contact pads, and the plurality of wires in the third wiring portion 107 correspond to the plurality of contact pads on the terminal 111 and are electrically connected.
  • the terminal 111 may be used for electrical connection with other electronic devices or control chips, which are not limited in the embodiment of the present disclosure.
  • the main sub-circuit board may have a single-layer wiring structure or a multi-layer wiring structure (such as a double-layer wiring structure or a three-layer wiring structure, etc.), which is not done in the embodiments of the present disclosure. limited.
  • FIG. 6A shows a schematic cross-sectional view of a main body sub-circuit board provided by some embodiments of the present disclosure, and the cross-sectional view is, for example, cut along the line A-A in FIG. 2.
  • the main sub-circuit board 100 has a single-layer wiring structure.
  • the main body sub-circuit board 100 includes a first substrate 1001 and a first main body wiring layer 1002 and a first main body insulating layer 1003 stacked on one side of the first substrate 1001.
  • the first main wiring layer 1002 includes a first wiring portion 103, a second wiring portion 104, a first bridge terminal 101 and a second bridge terminal 102.
  • the first bridge terminal 101 and the second bridge terminal 102 are separated by the first The body insulating layer 1003 is exposed.
  • the first main body insulating layer 1003 serves as a protective layer to provide structural and electrical protection to the first main body wiring layer 1002.
  • the first main body insulating layer 1003 may be bonded to the first main body through an adhesive layer (not shown in the figure).
  • an opening 1013 is formed in the first main insulating layer 1003, and in the opening 1013, for example, the exposed portion of the first wiring layer 1002 corresponding to the first bridge terminal 101 or the second bridge terminal 102 may be subjected to surface treatment (for example, The solder layer is plated), thereby forming a plurality of patterned contact pads, and correspondingly forming the first bridge terminal 101 or the second bridge terminal 102.
  • surface treatment for example, The solder layer is plated
  • the main body sub-circuit board further includes the second function wiring 106 and the third function wiring 107
  • the second function wiring 106 and the third function wiring 107 are also arranged in the first wiring layer 1002.
  • the main body sub-circuit board has a single-layer wiring structure with a single-layer wiring layer.
  • FIG. 6B shows a schematic cross-sectional view of another main body sub-circuit board provided by some embodiments of the present disclosure, and the cross-sectional view is cut along the line A-A in FIG. 2, for example.
  • the main sub-circuit board 100 has a multi-layer wiring structure.
  • the main sub-circuit board 100 has a double-layer wiring structure as an example for description with reference to FIG. 6B, but the embodiment of the present disclosure does not limit this.
  • the main body sub-circuit board 100 includes a first substrate 1001, a first main body wiring layer 1002 and a first main wiring layer 1002 and a second substrate located on the first side of the first substrate 1001 (shown as the upper side in the figure).
  • a main insulation layer 1003 further includes a second main wiring layer 1004 and a second main insulation layer 1005 that are located on the second side of the first substrate 1001 (shown as the lower side in the figure) and stacked.
  • the first main body insulating layer 1003 serves as a protective layer to provide structure and electrical protection for the first main body wiring layer 1002.
  • the first main body insulating layer 1003 can be bonded to the first main body wiring through an adhesive layer (not shown in the figure) Layer 1002 and the first substrate 1001; the second insulating layer 1005 is used as a protective layer to provide structure and electrical protection for the second main body wiring layer 1004, for example, the second main body insulating layer 1005 may pass through an adhesive layer (not shown in the figure) Bonded to the second main wiring layer 1004 and the first substrate 1001.
  • the first main body wiring layer 1002 includes a first wiring portion 103 and a second wiring portion 104. At this time, the first wiring portion 103 and the second wiring portion 104 can be routed on the first main body.
  • the wiring layer 1002 and the second main wiring layer 1004 are arranged crosswise. For example, two wirings adjacent to each other of the first wiring portion 103 on the main body sub-circuit board 100 may be located on the first main wiring layer. 1002 and the second main body wiring layer 1004, thereby facilitating wiring arrangement.
  • the second wiring part 104 can also be similarly arranged.
  • the second functional wiring 106 and the third functional wiring 107 can also be on the first main wiring layer 1002 and the second functional wiring layer 1002.
  • the main wiring layer 1004 is arranged crosswise.
  • the first main wiring layer 1002 may include a first wiring portion 103 and a second wiring portion 104
  • the second main wiring layer 1004 may include a second functional wiring 106 and a third functional wiring 107, that is, different
  • the wiring layer can be arranged with different functional wiring.
  • the embodiment of the present disclosure does not specifically limit the wiring layout on the main body sub-circuit board 100.
  • the wiring in the second main wiring layer 1004 has a similar arrangement to the wiring in the first main wiring layer 1002, and each wiring in the second main wiring layer 1004 can pass through Vias (such as the black dots shown in FIG. 5B) are electrically connected to the first body wiring layer 1002, and are exposed by the corresponding insulating layer to form bridge terminals.
  • the first bridge terminal 101 and the second bridge terminal 102 may be exposed by the first body insulating layer 1003.
  • an opening 1013 is formed in the first body insulating layer 1003, and in the opening 1013, for example, a portion of the exposed first body wiring layer 1002 corresponding to the first bridge terminal 101 or the second bridge terminal 102 can be processed.
  • a plurality of patterned contact pads are formed, corresponding to the first bridging end 101 or the second bridging end 102; similarly, for the wiring located in the second main wiring layer 1004, you can pass through
  • the via hole 1011 in the first substrate 1001, the first main body wiring layer 1002 and the opening 1013 of the first main body insulating layer 1003 form a bridge end.
  • the via hole 1011 in the first substrate 1001 and the opening 1013 of the first body insulating layer 1003 are arranged in a staggered manner. Therefore, during the manufacturing process, the position of the opening 1013 is relatively flat, which facilitates the formation of contact pads.
  • the first bridge terminal 101 and the second bridge terminal 102 may be respectively exposed on different sides of the main body sub-circuit board, so that the first bridge terminal 101 and the second bridge terminal 102 are arranged on the main body sub-circuit board. Different sides.
  • FIG. 7A shows a schematic cross-sectional view of a main sub-circuit board provided by some embodiments of the present disclosure, and the cross-sectional view is, for example, cut along the line C-C in FIG. 2.
  • the main body sub-circuit board has a single-layer wiring structure.
  • the first bridge terminal 101 of the main body sub-circuit board is exposed by the first main insulation layer 1003, as shown in FIG. 6A; the second bridge terminal 102 is exposed by the first substrate 1001, thereby connecting the first bridge terminal 101 and the second bridge terminal 102 Set on different sides of the main body sub-circuit board.
  • FIG. 7B shows a schematic cross-sectional view of another main body sub-circuit board provided by some embodiments of the present disclosure, and the cross-sectional view is cut along the line C-C in FIG. 2, for example.
  • the main body sub-circuit board has a double-layer wiring structure.
  • the first bridge end 101 of the main body sub-circuit board is exposed by the first main body insulating layer 1003, as shown in FIG. 6B; the second bridge end 102 is exposed by the second main body insulating layer 1005, thereby connecting the first bridge end 101 and the second bridge
  • the terminals 102 are arranged on different sides of the main body sub-circuit board.
  • the main body sub-circuit board may also have a three-layer wiring structure, a four-layer wiring structure and other multilayer wiring structures.
  • various parts of the wiring on the main sub-circuit board such as the first wiring part, the second wiring part, the second function wiring, and the third function wiring, may be arranged in a multilayer wiring layer.
  • the first wiring portion, the second wiring portion, the second functional wiring, and the third functional wiring are alternately arranged in multiple wiring layers, or are arranged in different wiring layers.
  • the embodiments of the present disclosure do not specifically limit the number of wiring layers and the wiring arrangement of the main body sub-circuit board.
  • the bridge sub-circuit board may also have a single-layer wiring structure or a multi-layer wiring structure.
  • FIG. 8A shows a schematic cross-sectional view of a bridge sub-circuit board provided by some embodiments of the present disclosure. The cross-sectional view is, for example, cut along the line B-B in FIG. 3A.
  • the bridge daughter circuit board 200 has a single-layer wiring structure.
  • the bridge sub-circuit board 200 includes a second substrate 2001, and a first bridge wiring layer 2002 and a first bridge insulation layer on the first side (the upper side shown in the figure) of the second substrate 2001.
  • Layer 2003, the first bridge wiring layer 2002 includes a third wiring portion 203.
  • the first bridge insulating layer 2003 serves as a protective layer to provide structural and electrical protection to the first bridge wiring layer 2002.
  • the first bridge insulating layer 2003 can be bonded to the first bridge via an adhesive layer (not shown in the figure).
  • the wiring layer 2002 and the second substrate 2001 are examples of the first bridge wiring layer 2002 and the second substrate 2001.
  • the second substrate 2001 has an opening 2011, and in the opening 2011, for example, the exposed part of the first bridge wiring layer 2002 corresponding to the third bridge end 201 or the fourth bridge end 202 may be subjected to surface treatment to form The patterned multiple contact pads form the third bridge end 201 or the fourth bridge end 202 correspondingly.
  • the bridge sub-circuit board 200 may further include a shielding layer 2006, and the shielding layer 2006 is disposed on the side of the second substrate 2001 away from the first bridge wiring layer 2002.
  • the shielding layer 2006 can be grounded, so as to achieve an electromagnetic shielding effect and prevent signal crosstalk from the wiring in the main sub-circuit board and the bridge sub-circuit board.
  • the shielding layer 2006 has a hollow structure 2016 that corresponds to the opening 2011 in the second substrate 2001 to expose the third bridge end 201 or the fourth bridge end 202.
  • FIG. 8C shows a schematic cross-sectional view of another bridge sub-circuit board provided by some embodiments of the present disclosure.
  • the cross-sectional view is, for example, cut along the line B-B in FIG. 3A.
  • the bridge sub-circuit board 200 has a multi-layer structure. The following describes with reference to FIG. 8C taking the bridge sub-circuit board 200 having a double-layer structure as an example, but the embodiment of the present disclosure does not limit this.
  • the bridge sub-circuit board 200 includes a second substrate 2001, and a first bridge wiring layer 2002 and a first bridge insulating layer 2003 on the first side (the upper side shown in the figure) of the second substrate 2001.
  • the first bridge wiring layer 2002 includes a third wiring portion 203.
  • the first bridge insulating layer 2003 serves as a protective layer to provide structural and electrical protection to the first bridge wiring layer 2002.
  • the first bridge insulating layer 2003 can be bonded to the first bridge via an adhesive layer (not shown in the figure).
  • the wiring layer 2002 and the second substrate 2001 are examples of the first bridge wiring layer 2002 and the second substrate 2001.
  • the bridge sub-circuit board 200 may further include a second bridge wiring layer 2004 on a second side (shown as the lower side in the figure) opposite to the first side of the second substrate 2001 and The second bridge insulating layer 2005 is laminated on the second bridge wiring layer 2004.
  • the second bridging wiring layer 2004 may also include a third wiring portion 203.
  • the third wiring portions 203 may be alternately arranged in the first bridging wiring layer 2002 and the second bridging wiring layer 2004.
  • two traces of the third trace portion 203 adjacent to each other on the board surface of the bridge sub-circuit board 200 may be located in the first bridging trace layer 2002 and the second bridging trace layer 2004 respectively, thereby facilitating Wiring arrangement.
  • the dotted line in FIG. 8D indicates that the wiring portions located on both sides of the second bridge wiring layer 2004 are not electrically connected.
  • the third wiring portion 203 located on the first side of the bridge sub-circuit board 200 is exposed and led out through the via 2011 in the second substrate 2001 and the opening 2015 in the second bridge insulating layer 2005, for example, a pattern is formed by surface treatment A plurality of contact pads formed to form the third bridge end 201 or the fourth bridge end 202.
  • the opening 2015 in the second bridge insulating layer 2005 is formed at the position indicated by the dashed frame shown in FIG. 8C or at other suitable positions, which is not limited in the embodiment of the present disclosure.
  • the bridge sub-circuit board 200 may further include a shielding layer 2006 on the second side of the second substrate 2001.
  • the shielding layer 2006 is, for example, provided on the second bridging insulating layer 2005. The side away from the second substrate 2001.
  • the shielding layer 2006 is grounded to achieve an electromagnetic shielding effect.
  • the shielding layer 2006 has a hollow structure 2016 at a position corresponding to the opening 2015 of the second bridging insulating layer 2005, thereby forming the exposed third bridging end 201 or the fourth bridging end 202.
  • the shielding layer 2006 is located between the wiring layer in the main sub-circuit board 100 and the wiring layer bridging the sub-circuit board 200.
  • the shielding layer 2006 can prevent the wiring layer in the main sub-circuit board 100 from bridging the sub-circuit Signal crosstalk occurs between the wiring layers of the board 200.
  • the second bridge wiring layer 2004 may be a ground layer including multiple ground wirings.
  • the third wiring portion 203 may be all disposed in the first bridging wiring layer 2002. Therefore, there is also a ground layer between the wiring layer in the main sub-circuit board 100 and the wiring layer of the bridge sub-circuit board 200, which can further prevent the wiring layer in the main sub-circuit board 100 and the bridge sub-circuit Signal crosstalk occurs between the wiring layers of the board 200.
  • the third wiring portion 203 may be partially disposed in the first bridging wiring layer 2002, and another part is disposed in the second bridging wiring layer 2004. At this time, the second bridging wiring layer The ground traces in the layer 2004 and some traces of the third trace portion 203 may be arranged alternately. Therefore, the second bridge wiring layer 2004 can also play a role in preventing signal crosstalk.
  • the grounding layer 2004 and the shielding layer 2006 can achieve a double shielding effect, preventing the wires on the main sub-circuit board 100 from bridging the wires on the sub-circuit board 200 Signal crosstalk occurs.
  • the bridge sub-circuit board 200 may further include an insulating layer (not shown in the figure) outside the shielding layer 2006 (that is, the side away from the second substrate 2001) to provide protection to the shielding layer 2006
  • the insulating layer may be bonded to the shielding layer 2006 through an adhesive layer.
  • the insulating layer may further include an opening corresponding to the opening 2015 and the hollow structure 2016 to expose the bridging end.
  • the via hole 2011 in the second substrate 2001 and the opening 2015 of the second bridging insulating layer 2005 are arranged in a staggered manner. Therefore, during the manufacturing process, the position of the opening 1015 is relatively flat, which facilitates the formation of contact pads.
  • the third bridge terminal 201 or the fourth bridge terminal 202 of the bridge sub-circuit board 200 may be exposed on different sides of the bridge sub-circuit board 200, so that the third bridge terminal 201 and the fourth bridge terminal are exposed.
  • 202 is arranged on different sides of the bridge sub-circuit board 200.
  • FIG. 9A shows a schematic cross-sectional view of another bridge sub-circuit board provided by some embodiments of the present disclosure.
  • the cross-sectional view is, for example, cut along the line D-D in FIG. 3A.
  • the bridge daughter circuit board has a single-layer wiring structure.
  • the third bridge end 201 of the bridge sub-circuit board is exposed by the second substrate 2001, as shown in FIG. 8A; the fourth bridge end 202 is exposed by the opening 2013 in the first bridge insulating layer 2003, as shown in FIG. 9A, thereby
  • the third bridge terminal 201 and the fourth bridge terminal 202 are arranged on different sides of the bridge sub-circuit board.
  • FIG. 9B shows a schematic cross-sectional view of another bridge sub-circuit board provided by some embodiments of the present disclosure, and the cross-sectional view is cut along the line D-D in FIG. 3A, for example.
  • the bridge sub-circuit board has a double-layer wiring structure.
  • the third bridge terminal 201 of the bridge sub-circuit board is exposed by the second bridge insulating layer 2005, as shown in FIG. 8C; the fourth bridge terminal 202 is exposed by the opening 2013 in the first bridge insulating layer 2003, as shown in FIG. 9B Therefore, the third bridge terminal 201 and the fourth bridge terminal 202 are arranged on different sides of the bridge sub-circuit board.
  • the bridge sub-circuit board may also have a multi-layer wiring structure such as a three-layer wiring structure and a four-layer wiring structure.
  • the third part of the wiring on the bridge sub-circuit board can be arranged in a multilayer wiring layer.
  • the third part of the wiring can be alternately arranged in multiple wiring layers.
  • the embodiments of the present disclosure do not specifically limit the number of wiring layers and the wiring arrangement of the bridge sub-circuit board.
  • the third bridge terminal 201 and the fourth bridge terminal 202 of the bridge sub-circuit board can be electrically connected to the first bridge terminal 101 and the first bridge terminal 101 on different sides of the main sub-circuit board.
  • the second bridge terminal 102 or when the first bridge terminal 101 and the second bridge terminal 102 of the main body sub-circuit board are arranged on different sides of the main body sub-circuit board, and bridge the third bridge terminal 201 and the fourth bridge terminal of the sub-circuit board
  • the third bridge end 201 and the fourth bridge end 202 of the bridge sub-circuit board can be electrically connected to the first bridge end 101 and the first bridge end 101 on different sides of the main sub-circuit board by bending.
  • the second bridge terminal 102 so that the bridge sub-circuit board can be bridged on the main sub-circuit board in a form similar to a "issue card".
  • the first substrate 1001 and the second substrate 2001 can be made of flexible materials such as polyimide or polyester, each wiring layer can be made of copper, silver, aluminum and other metal materials or alloy materials, and each insulating layer can be made of polyimide. Insulating materials such as amine or polyester.
  • the grounding layer 2004 is made of metal materials (such as copper layer or copper foil).
  • the shielding layer 2006 includes an insulating base and a conductive material filled in the insulating base.
  • the insulating base is made of epoxy resin and filled with conductive material.
  • the material is copper powder, graphite powder, etc.; or, in some embodiments, the shielding layer 2006 may also be a metal material.
  • the present disclosure does not specifically limit the material of each functional layer; the adhesive layer is made of epoxy resin or polyethylene.
  • the third bridge end 201 and the fourth bridge end 202 of the bridge sub-circuit board 200 are respectively connected to the first bridge end 101 and the second bridge end of the main sub-circuit board 100 by anisotropic conductive glue, soldering material or a connector. 102.
  • the connector includes a Zero Insertion Force (ZIF) connector or a Board to Board (BTB) connector, etc.
  • ZIF Zero Insertion Force
  • BTB Board to Board
  • a board-to-board type connector is used to connect the main body sub-circuit board 100 and the bridge sub-circuit board 200.
  • the connector includes a male connector and a female connector that cooperate with each other.
  • the first bridge end 101 and the second bridge end 102 of the main sub-circuit board 100 are provided with female connectors
  • the third bridge end 201 and the fourth bridge end 202 of the bridge sub-circuit board 200 are provided with male connectors, thereby connecting via male
  • the mating of the connector and the female connector connects the bridge daughter circuit board 200 and the main body daughter circuit board 100.
  • the flexible circuit board provided by the embodiment of the present disclosure has a main body sub-circuit board and a bridge sub-circuit board, and the wiring on both sides of the main sub-circuit board is bridged by the bridge sub-circuit board, which can avoid the crossing of the wiring on the main sub-circuit board. Therefore, it is possible to prevent or reduce signal crosstalk, or to avoid adding additional functional layers to prevent signal crosstalk, thereby avoiding the complexity of the circuit board structure.
  • the main sub-circuit board and the bridge sub-circuit board have a simple single-layer or double-layer structure, so the wiring layout is simpler, which can reduce the difficulty of manufacturing the main sub-circuit board and the bridge sub-circuit board.
  • FIG. 10A shows a schematic diagram of the electronic device module.
  • the electronic device module 1 includes an electronic device substrate 11 and any of the above-mentioned flexible circuit boards 10, and the electronic device substrate 11 includes a first functional circuit structure 20.
  • the first functional wiring (including the first wiring portion 103, the second wiring portion 104 and the third wiring portion 203) of the flexible circuit board 10 is electrically connected to the first functional circuit structure 20.
  • the flexible circuit board 10 further includes a second functional wiring 106
  • the first functional circuit structure 20 includes a first signal transmission portion 21 and a second signal transmission portion 22, and the first functional wiring is electrically connected to the second signal transmission portion.
  • a signal transmission part 21, and the second functional wiring 106 is electrically connected to the second signal transmission part 22.
  • the electronic device substrate 11 further includes a second functional circuit structure 23, and the flexible circuit board further includes a third functional wiring 107, and the third functional wiring 107 is electrically connected to the second functional circuit structure 23.
  • the electronic device substrate 11 is a substrate with a display function and a touch function.
  • the first functional circuit structure 20 is a touch circuit structure
  • the second functional circuit structure 23 is a display circuit structure.
  • the electronic device substrate 11 is a substrate with a display function and a fingerprint recognition function.
  • the first functional circuit structure 20 is a fingerprint recognition circuit structure.
  • the fingerprint recognition circuit structure is a capacitive fingerprint recognition circuit.
  • the second functional circuit structure 23 is a display circuit structure including detecting driving electrodes and detecting sensing electrodes that are arranged crosswise. In the following, description is made by taking the first functional circuit structure 20 as a touch circuit structure as an example.
  • the arrangement of the touch circuit structure on the electronic device substrate 11 may be a built-in type or an externally mounted type.
  • the form of the touch circuit structure may be capacitive, for example, a mutual capacitive touch circuit structure.
  • the mutual-capacitive touch circuit structure includes a plurality of first electrodes extending in a first direction and a plurality of second electrodes extending in a second direction (intersecting the first direction).
  • a detection capacitance will be formed, that is, the two sets of electrodes respectively constitute the two poles of the capacitance.
  • the capacitance change data of the touch circuit structure and the coordinates of each capacitance the coordinates of each touch point can be obtained.
  • the horizontal electrode is used as a touch drive circuit to send out excitation signals in turn
  • the vertical electrode is used as a touch sensing circuit to receive signals at the same time or sequentially, so that the capacitance value of the intersection of all horizontal and vertical electrodes can be obtained, that is, the entire touch
  • the capacitance of the two-dimensional plane of the structure Therefore, even if there are multiple touch points on the touch control structure, the true coordinates of each touch point can be determined.
  • the first signal transmission part 21 may include touch driving traces electrically connected to the touch drive (Tx) circuit of the touch circuit
  • the second signal transmission part 22 may include touch driving traces electrically connected to the touch circuit.
  • the first control circuit 1051 is a touch drive IC, which can provide an excitation signal to the touch drive circuit through the touch drive trace, and can receive the sensing signal of the touch sensing circuit through the touch sensing trace, and can be based on the above The signal determines the touch position and responds.
  • the touch driving circuit is bridged, and the touch sensing circuit is directly electrically connected to the first control circuit coupling structure 105.
  • the distance between the touch sensing circuit and the first control circuit coupling structure 105 is closer.
  • the first control circuit 1051 installed on the touch control circuit 1051 is closer to the touch driver IC, so the sensing signal received by the touch sensing circuit is transmitted to the touch driver IC in a shorter path, so the sensing signal may be interfered by the signal Smaller, which can make the touch operation more accurate.
  • the touch driving wiring and the touch sensing wiring extend to the same side of the electronic device substrate 11 (the lower side in the figure), and are connected to the contact pad 211 and the contact pad 221 formed on the side. Electrically connect separately.
  • the first signal transmission part 21 may also include touch sensing traces electrically connected to the touch sensing (Rx) circuit of the touch circuit, and the second signal transmission part 22 may include electrical connections.
  • the touch sensing circuit is bridged, and the touch drive circuit is directly electrically connected to the first control circuit combination structure 105, so the touch drive circuit and The distance between the first control circuit and the structure 105 is closer, that is, the distance between the first control circuit 1051, that is, the touch drive IC mounted on it, is closer. Therefore, in this embodiment, the touch control circuit in the touch drive circuit The driving signal is less likely to be interfered by the signal.
  • the flexible circuit board 10 has a terminal 110 on one side (for example, the upper side in the figure), a plurality of contact pads are provided on the terminal 110, and the other end of the plurality of wires included in the second wiring portion 104 is connected to the wiring.
  • Some of the contact pads in the terminal 110 are electrically connected in a one-to-one correspondence
  • the other ends of the multiple wirings included in the second functional wiring 106 are electrically connected to another part of the contact pads in the terminal 110 in a one-to-one correspondence
  • the third functional wiring The other ends of the multiple traces included in 107 are electrically connected to another part of the contact pads in the terminal 110 in a one-to-one correspondence.
  • part of the contact pads respectively electrically connected to the second wiring portion 104, the third functional wiring 107, and the second functional wiring 106 are arranged at intervals or continuously at the terminal 110, which is not specifically described in the embodiment of the present disclosure. limited.
  • the contact pads connected to them can be arranged continuously on the terminal 110; when the second wiring portion 104.
  • the contact pads connected to them can be arranged at intervals on the terminal 110.
  • the spaced arrangement shown in FIG. 10A can be formed Multiple sets of contact pads.
  • the terminal 110 is arranged in the wiring area 110A of the main sub-circuit board (that is, the oblique area under the terminal 110 in the figure).
  • the wiring area 110A area only has a wiring layer and a part of an insulating layer, but does not have a shielding layer. Therefore, the wiring area 110A has high transparency.
  • the contact pads of the terminals 110 on the side of the flexible circuit board 10 and the contact pads on the side of the electronic device substrate 11 can be directly crimped together, for example, in
  • the contact pads of the terminals 110 on the side of the flexible circuit board 10 and the contact pads on the side of the electronic device substrate 11 are electrically connected to each other through, for example, ACF, thereby connecting the first functional wiring on the flexible circuit board 10 to
  • the touch driving trace connected to the first signal transmission part 21 is electrically connected through the contact pad 211
  • the touch sensing trace connecting the second function trace on the flexible circuit board to the second signal transmission part 22 is electrically connected through the contact pad 221. Connection, thereby electrically connecting the first functional wiring and the second functional wiring of the flexible circuit board 10 with the touch circuit structure of the electronic device substrate 11.
  • the second functional circuit structure 23, that is, the display circuit structure, includes multiple data lines (and also gate lines, etc.), the multiple data lines are electrically connected to the pixel units, and the multiple data lines extend to the electronic device substrate 11 On one side (the lower side in the figure), and is electrically connected to the contact pad 231 formed on the side.
  • the pixel unit includes a display driving circuit, for example, the display driving circuit includes a plurality of transistors, capacitors, and light emitting devices, for example, formed in various forms such as 2T1C, 3T1C, or 7T1C.
  • the multiple contact pads on the terminals 110 of the flexible circuit board 10 also combine the third functional wiring on the flexible circuit board with the second functional circuit structure
  • the data lines in 23 are electrically connected through the contact pads 231, thereby electrically connecting the third function traces of the flexible circuit board 10 and the display circuit structure of the electronic device substrate 11.
  • the main sub-circuit board 100 may also have a second control circuit combination structure 108 and a second control circuit 1081 provided on the second control circuit combination structure 108.
  • the second control circuit 1081 is a display driver IC, which can provide data signals for the display driver circuit, so that the light-emitting state of the light-emitting device can be controlled by the data line number provided by the display driver IC to achieve different display effects.
  • the pixel unit includes a switching element and a first electrode (pixel electrode) and a second electrode (common electrode) for controlling the deflection of liquid crystal, and the switching element is electrically connected to the first electrode.
  • the second functional circuit structure 23 that is, the display circuit structure, includes a plurality of data lines respectively connected to the pixel unit.
  • the second control circuit is a display driver IC, which can provide different data voltage signals to the pixel unit through the data lines. In this way, the twisting state of the liquid crystal is controlled to achieve different display effects.
  • the flexible circuit board is bonded to the electronic device substrate 11 by binding.
  • the flexible circuit board can be bent to the back of the electronic device substrate 11 and fixed after being bound to the electronic device substrate 11 , That is, installed on the non-display side of the electronic device substrate 11 to facilitate the large-screen design of the display screen.
  • the wiring parts on the main body sub-circuit board that are respectively electrically connected to the touch drive circuit are bridged by the bridge sub-circuit board, so that the main body sub-circuit The touch drive circuit on the board and the display drive circuit do not intersect, and they are shielded from each other at the intersection of the main sub-circuit board and the bridge sub-circuit board, so the signal routing in the main sub-circuit board and the bridge sub-circuit board can be avoided Crosstalk, meanwhile, the structure of the main sub-circuit board and the bridge sub-circuit board are simple, and the wiring layout is simple, which is beneficial to simplify the manufacturing process.
  • FIG. 11 shows a schematic diagram of the electronic device.
  • the electronic device 2 includes any of the above-mentioned electronic device modules, and the electronic device module includes an electronic device substrate 11 and a flexible circuit board 10.
  • the upper side of the electronic device substrate 11 shown in FIG. 11 is the display side, and the lower side is the non-display side; at this time, the flexible circuit board 10 is bent and placed on the non-display side of the electronic device substrate 11 after being bound. In order to realize the large-screen design of the display screen.
  • the electronic device 2 may be, for example, any product or component with a display function, such as a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, etc.
  • a display function such as a mobile phone, a tablet computer, a television, a monitor, a notebook computer, a digital photo frame, a navigator, etc.
  • the embodiment of the present disclosure does not specifically limit this.
  • Some embodiments of the present disclosure provide a manufacturing method of a flexible circuit board. As shown in FIG. 12, the manufacturing method includes steps S101-S103.
  • Step S101 Provide the main body sub-circuit board.
  • the main body sub-circuit board 100 includes a first bridge terminal 101, a second bridge terminal 102, a first wiring portion 103 and a second wiring portion 104.
  • the first wiring portion 103 and the second wiring portion 104 are mutually connected. Spaced apart and electrically connected to the first bridge terminal 101 and the second bridge terminal 102 respectively.
  • the main body sub-circuit board 100 is formed by sequentially forming a first wiring layer 1002 and a first insulating layer 1003 on the first substrate 1001.
  • the first substrate 1001 is made of polyimide or polyester
  • the first wiring layer 1002 is made of copper, silver, aluminum and other metal materials or alloy materials
  • the first insulating layer 1003 is also made of polyimide or polyester.
  • other materials for example, firstly, a copper metal layer is formed on the first substrate 1001 by sputtering, and then the copper metal layer is patterned to form the first wiring layer 1002, and then the first wiring layer 1002 is formed by coating.
  • a first insulating layer 1003 is formed thereon, and openings are formed in the first insulating layer 1003 to form structures such as bridge ends.
  • Step S102 Provide a bridge sub-circuit board.
  • the bridge sub-circuit board 200 includes a third bridge end 201, a fourth bridge end 202, and a third wiring portion 203, and the third bridge end 201 and the fourth bridge end 202 are electrically connected by the third wiring portion 203.
  • the bridge sub-circuit board 200 is formed by sequentially forming a first bridge wiring layer 2002 and a first bridge insulating layer 2003 on the first side of the second substrate 2001.
  • the first substrate 2001 is made of polyimide or polyester
  • the first bridge wiring layer 2002 is made of copper, silver, aluminum and other metal materials or alloy materials
  • the first bridge insulating layer 2003 is also made of polyimide or Materials such as polyester.
  • a copper metal layer is formed on the first substrate 2001 by sputtering, and then the copper metal layer is patterned to form the first bridge wiring layer 2002, and then the first bridge wiring layer 2002 is formed by coating.
  • a first bridging insulating layer 2003 is formed on the layer 2002.
  • forming the bridge sub-circuit board 200 further includes sequentially forming a second bridge wiring layer 2004 and a second bridge insulating layer on the second side of the second substrate 2001 opposite to the first side. 2005.
  • the second bridging wiring layer 2004 may be a grounding layer, using materials such as copper, and the second bridging insulating layer 2005 using materials such as polyimide or polyester.
  • openings are formed in the second substrate 2001 and the second bridge insulating layer 2005 by patterning, etc., and the third wiring portion 203 formed on the first side of the bridge sub-circuit board 200 passes through the second substrate 2001
  • the vias 2011 in the second bridge insulation layer 2005 and the opening 2015 in the second bridge insulating layer 2005 are exposed and lead out.
  • a plurality of contact pads are formed by surface treatment to form bridge ends.
  • forming the bridge sub-circuit board 200 further includes forming a shielding layer 2006 on the second side of the second substrate 2001.
  • the shielding layer 2006 may be suspended or configured to be electrically connected to the ground wire.
  • the second bridge wiring layer 2004 when the second bridge wiring layer 2004 is a ground layer, an opening 2025 is also formed in the second bridge insulating layer 2005, and the shield layer 2006 is connected to the second bridge through the opening 2025.
  • the ground traces in the trace layer 2004 are electrically connected.
  • the shielding layer 2006 can play a double shielding role, preventing the wiring on the main sub-circuit board 100 from each wiring on the bridging sub-circuit board 200 Signal crosstalk occurs on the line.
  • the shielding layer 2006 is formed with a hollow structure 2016 at a position corresponding to the opening 2015 of the second bridging insulating layer 2005, thereby exposing the bridging end.
  • the shielding layer 2006 includes an insulating base and a conductive material filled in the insulating base.
  • the insulating base is made of epoxy resin, and the filled conductive material is copper powder, graphite powder, etc.; or in some embodiments, the shielding layer 2006 may also It is a metal material, which is not specifically limited in the embodiments of the present disclosure.
  • the shielding layer may be directly attached to the second side of the bridge sub-circuit board 200 after being formed.
  • Step S103 Mount the bridge sub-circuit board on the main sub-circuit board.
  • the third bridge end 201 and the fourth bridge end 202 of the bridge sub-circuit board 200 are electrically connected to the first bridge end 101 and the second bridge end 102 of the main sub-circuit board 100, so that the bridge sub-circuit board The 200 is mounted on the main body sub-circuit board 100, and the first wiring portion 103, the third wiring portion 203 and the second wiring portion 104 are electrically connected in sequence to obtain the first functional wiring.
  • the second side of the bridge sub-circuit board 200 is closer to the main sub-circuit board 100 than the first side, so that the wiring on the main sub-circuit board 100 and the wiring on the bridge sub-circuit board 200 can pass through the ground layer 2004 and the shielding layer 2006 are shielded to prevent signal crosstalk.
  • the third bridge end 201 and the fourth bridge end 202 of the bridge sub-circuit board 200 can be connected to the first bridge end 101 and the second bridge end 101 and the second bridge end of the main body sub-circuit board 100 respectively by hot pressing, soldering, or by connectors.
  • Two bridging end 102 For example, in a hot pressing method, an anisotropic conductive glue is formed between two bridge terminals, and then the bridge terminals are subjected to a hot pressing operation to connect the two bridge terminals together with the anisotropic conductive glue.
  • the connector includes a Zero Insertion Force (ZIF) connector or a Board to Board (BTB) connector, etc.
  • ZIF Zero Insertion Force
  • BTB Board to Board
  • a board-to-board type connector is used to connect the main body sub-circuit board 100 and the bridge sub-circuit board 200.
  • the connector includes a male connector and a female connector that cooperate with each other.
  • the first bridge end 101 and the second bridge end 102 of the main sub-circuit board 100 are provided with female connectors
  • the third bridge end 201 and the fourth bridge end 202 of the bridge sub-circuit board 200 are provided with male connectors, so that the The mating of the connector and the female connector connects the bridge daughter circuit board 200 to the main body daughter circuit board 100.
  • the manufacturing method of the flexible circuit board of the embodiment of the present disclosure provides a main body sub-circuit board and a bridge sub-circuit board, and bridges the traces located on both sides of the main sub-circuit board through the bridge sub-circuit board.
  • This method can avoid the wiring in the main body.
  • the sub-circuit boards are crossed to prevent or reduce signal crosstalk, or to avoid adding additional functional layers to prevent signal crosstalk, thereby avoiding the complexity of the circuit board structure; in addition, the main sub-circuit board and bridge sub-circuit board provided by the manufacturing method It has a simple single-layer or double-layer structure, so the wiring layout is simpler, which can reduce the difficulty of making the main sub-circuit board and the bridge sub-circuit board.

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Abstract

一种柔性电路板及其制作方法、电子装置模组及电子装置。该柔性电路板(10)包括主体子电路板(100)和桥接子电路板(200)；主体子电路板(100)包括第一基板(1001)以及设置在第一基板(1001)上的第一桥接端(101)、第二桥接端(102)、第一走线部分(103)和第二走线部分(104)，第一走线部分(103)和第二走线部分(104)彼此间隔开且分别与第一桥接端(101)和第二桥接端(102)电连接；桥接子电路板(200)包括第二基板(2001)以及设置在第二基板(2001)上的第三桥接端(201)、第四桥接端(202)和用于第一功能走线的第三走线部分(203)，第三桥接端(201)和第四桥接端(202)由第三走线部分(203)电连接；第一基板(1001)和第二基板(2001)不直接接触，桥接子电路板(200)配置为通过将第三桥接端(201)和第四桥接端(202)分别电连接到第一桥接端(101)和第二桥接端(102)，而安装到主体子电路板(100)上。该柔性电路板(10)的走线布图简单，易于制作。

Description

柔性电路板及制作方法、电子装置模组及电子装置
本申请要求于2019年1月30日递交的中国专利申请第201910093341.0号和于2020年1月22日递交的中国专利申请第202010075431.X号的优先权，在此全文引用上述中国专利申请公开的内容以作为本申请的一部分。
技术领域
本公开的实施例涉及一种柔性电路板及其制作方法、电子装置模组及电子装置。
背景技术
柔性电路板(Flexible Printed Circuit，FPC)是以柔性薄膜为基材制成的一种具有高度可靠性、可挠性的印刷电路板。柔性电路板具有配线密度高、重量轻、厚度薄、弯折性好等特点，被广泛应用于手机、电脑以及显示器等各种电子设备中。
发明内容
本公开至少一实施例提供一种柔性电路板，该柔性电路板包括：主体子电路板，包括第一基板以及设置在所述第一基板上的第一桥接端、第二桥接端、第一走线部分和第二走线部分，所述第一走线部分和所述第二走线部分彼此间隔开且分别与所述第一桥接端和所述第二桥接端电连接；桥接子电路板，包括第二基板以及设置在所述第二基板上的第三桥接端、第四桥接端和用于第一功能走线的第三走线部分，所述第三桥接端和所述第四桥接端由所述第三走线部分电连接，其中，所述第一基板和所述第二基板不直接接触，所述桥接子电路板配置为通过将所述第三桥接端和所述第四桥接端分别电连接到所述第一桥接端和所述第二桥接端，而安装到所述主体子电路板上。
例如，本公开至少一实施例提供的柔性电路板中，所述桥接子电路板安装到所述主体子电路板，使得所述第一走线部分、所述第三走线部分和所述第二走线部分依次电连接以得到所述第一功能走线。
例如，本公开至少一实施例提供的柔性电路板还包括第一控制电路结合结构，所述第一控制电路结合结构设置在所述主体子电路板上，与所述第一走线部分电连接，或者所述第一控制电路结合结构设置在所述桥接子电路板上，与所述第三走线部分电连接；所述第一控制电路结合结构配置为给所述第一功能走线提供第一电信号或从所述第一功能走线接收第一电信号。
例如，本公开至少一实施例提供的柔性电路板中，所述主体子电路板还包括第二功能走线，所述第二功能走线与设置在所述主体子电路板上的所述第一控制电路结合结构电连接，所述第一控制电路结合结构还配置为给所述第二功能走线提供第二电信号或从所述第二功能走线接收第二电信号。
例如，本公开至少一实施例提供的柔性电路板中，所述主体子电路板还包括第三功能走线，所述第三功能走线位于所述第一走线部分和所述第二走线部分之间，且与安装到所述主体子电路板上的所述桥接子电路板相交叉。
例如，本公开至少一实施例提供的柔性电路板中，所述第一走线部分、所述第二走线部分和所述第三功能走线沿相同方向布线。
例如，本公开至少一实施例提供的柔性电路板中，所述主体子电路板包括位于所述第一基板第一侧的第一主体走线层以及叠层在所述第一主体走线层的远离所述第一基板一侧的第一主体绝缘层，所述第一主体走线层包括所述第一走线部分、所述第二走线部分、所述第一桥接端和所述第二桥接端，所述第一桥接端和所述第二桥接端由所述第一主体绝缘层暴露。
例如，本公开至少一实施例提供的柔性电路板中，所述主体子电路板还包括位于所述第一基板的与所述第一侧相对的第二侧的第二主体走线层以及叠层在所述第二主体走线层的远离所述第一基板一侧的第二主体绝缘层，所述第二主体走线层包括所述第一走线部分和所述第二走线部分。
例如，本公开至少一实施例提供的柔性电路板中，所述主体子电路板包括位于所述第一基板第一侧的第一主体走线层以及叠层在所述第一主体走线层的远离所述第一基板一侧的第一主体绝缘层，所述主体子电路板还包括位于所述第一基板的与所述第一侧相对的第二侧的第二主体走线层以及叠层在所述第二主体走线层的远离所述第一基板一侧的第二主体绝缘层，所述第一主体走线层包括所述第一走线部分、所述第二走线部分和所述第一桥接端，所述第一桥接端由所述第一主体绝缘层暴露；所述第二主体走线层包括所述第一走线部分、所述第二走线部分和所述第二桥接端，所述第二桥接端 由所述第二主体绝缘层暴露。
例如，本公开至少一实施例提供的柔性电路板中，所述桥接子电路板包括位于所述第二基板的第一侧的第一桥接走线层和叠层在所述第一桥接走线层的远离所述第二基板一侧的第一桥接绝缘层，所述第一桥接走线层包括所述第三走线部分。
例如，本公开至少一实施例提供的柔性电路板中，所述桥接子电路板还包括位于所述第二基板的与所述第一侧相对的第二侧的接地层，在所述桥接子电路板安装到所述主体子电路板上的情况下，且所述第二侧相对于所述第一侧更靠近所述主体子电路板。
例如，本公开至少一实施例提供的柔性电路板中，所述桥接子电路板还包括在所述第二基板的所述第二侧的屏蔽层，所述屏蔽层叠层在所述接地层的远离所述第二极板的一侧。
例如，本公开至少一实施例提供的柔性电路板中，所述桥接子电路板还包括位于所述第二基板的与所述第一侧相对的第二侧的第二桥接走线层以及叠层在所述第二桥接走线层的远离所述第二基板一侧的第二桥接绝缘层，所述第二桥接走线层包括所述第三走线部分、所述第三桥接端和所述第四桥接端，所述第三桥接端和所述第四桥接端由所述第二桥接绝缘层暴露；在所述桥接子电路板安装到所述主体子电路板上的情况下，所述第二侧相对于所述第一侧更靠近所述主体子电路板。
例如，本公开至少一实施例提供的柔性电路板中，所述桥接子电路板还包括位于所述第二基板的与所述第一侧相对的第二侧的第二桥接走线层以及叠层在所述第二桥接走线层的远离所述第二基板一侧的第二桥接绝缘层，所述第一桥接走线层还包括所述第三桥接端，所述第三桥接端由所述第一桥接绝缘层暴露；所述第二桥接走线层包括所述第三走线部分和所述第四桥接端，所述第四桥接端由所述第二桥接绝缘层暴露。
例如，本公开至少一实施例提供的柔性电路板中，所述桥接子电路板还包括在所述第二基板的所述第二侧且叠层在所述第二桥接绝缘层远离所述第二基板一侧的屏蔽层。
例如，本公开至少一实施例提供的柔性电路板中，所述桥接子电路板的所述第三桥接端和所述第四桥接端分别通过各向异性导电胶、焊接材料或者连接器连接到所述主体子电路板的所述第一桥接端和所述第二桥接端。
例如，本公开至少一实施例提供的柔性电路板中，所述主体子电路板包括多个所述第一桥接端和多个所述第二桥接端；所述桥接子电路板为多个，多个所述桥接子电路板分别通过多个所述第三桥接端和多个所述第四桥接端分别电连接到多个所述第一桥接端和多个所述第二桥接端，而安装到所述主体子电路板上。
本公开至少一实施例提供一种柔性电路板，该柔性电路板包括：主体子电路板，包括第一基板以及设置在所述第一基板上的第一桥接端、第二桥接端、第一走线部分和第二走线部分，所述第一走线部分和所述第二走线部分彼此间隔开且分别与所述第一桥接端和所述第二桥接端电连接；桥接子电路板，包括第二基板以及设置在所述第二基板上的第三桥接端、第四桥接端和用于第一功能走线的第三走线部分，所述第三桥接端和所述第四桥接端由所述第三走线部分电连接，其中，所述第一基板和所述第二基板不直接接触，所述桥接子电路板配置为通过将所述第三桥接端和所述第四桥接端分别电连接到所述第一桥接端和所述第二桥接端，而安装到所述主体子电路板上；所述主体子电路板包括位于所述第一基板第一侧的第一主体走线层以及叠层在所述第一主体走线层的远离所述第一基板一侧的第一主体绝缘层，所述第一主体走线层包括所述第一走线部分、所述第二走线部分、所述第一桥接端和所述第二桥接端，所述第一桥接端和所述第二桥接端由所述第一主体绝缘层暴露；所述主体子电路板还包括位于所述第一基板的与所述第一侧相对的第二侧的第二主体走线层以及叠层在所述第二主体走线层的远离所述第一基板一侧的第二主体绝缘层，所述第二主体走线层包括所述第一走线部分和所述第二走线部分；所述桥接子电路板包括位于所述第二基板的第一侧的第一桥接走线层和叠层在所述第一桥接走线层的远离所述第二基板一侧的第一桥接绝缘层，所述第一桥接走线层包括所述第三走线部分；所述桥接子电路板还包括位于所述第二基板的与所述第一侧相对的第二侧的第二桥接走线层以及叠层在所述第二桥接走线层的远离所述第二基板一侧的第二桥接绝缘层，所述第二桥接走线层包括所述第三走线部分、所述第三桥接端和所述第四桥接端，所述第三桥接端和所述第四桥接端由所述第二桥接绝缘层暴露；在所述桥接子电路板安装到所述主体子电路板上的情况下，所述第二侧相对于所述第一侧更靠近所述主体子电路板。
本公开至少一实施例提供一种电子装置模组，该电子装置模组包括电子 装置基板以及上述任一的柔性电路板；其中，所述电子装置基板包括第一功能电路结构，所述柔性电路板的第一功能走线电连接所述第一功能电路结构。
例如，本公开至少一实施例提供的电子装置模组中，所述柔性电路板还包括第二功能走线，所述第一功能电路结构包括第一信号传输部分和第二信号传输部分，第一功能走线电连接所述第一信号传输部分，所述第二功能走线电连接所述第二信号传输部分。
例如，本公开至少一实施例提供的电子装置模组中，所述电子装置基板还包括第二功能电路结构，所述柔性电路板还包括第三功能走线，所述第三功能走线电连接所述第二功能电路结构。
例如，本公开至少一实施例提供的电子装置模组中，所述第一功能电路结构为触控电路结构，所述第二功能电路结构为显示电路结构。
例如，本公开至少一实施例提供的电子装置模组中，所述第一信号传输部分为所述触控电路的触控驱动电路，所述第二信号传输部分为所述触控电路的触控感应电路；或者所述第一信号传输部分为所述触控电路的触控感应电路，所述第二信号传输部分为所述触控电路的触控驱动电路。
本公开至少一实施例提供一种电子装置，包括权利要求上述任一的电子装置模组。
本公开至少一实施例提供一种柔性电路板的制作方法，包括：提供主体子电路板，所述主体子电路板包括第一基板以及设置在所述第一基板上的第一桥接端、第二桥接端、第一走线部分和第二走线部分，所述第一走线部分和所述第二走线部分彼此间隔开且分别与所述第一桥接端和所述第二桥接端电连接；提供桥接子电路板，所述桥接子电路板包括第二基板以及设置在所述第二基板上的第三桥接端、第四桥接端和用于第一功能走线的第三走线部分，所述第三桥接端和所述第四桥接端由所述第三走线部分电连接，将所述桥接子电路板的所述第三桥接端和所述第四桥接端分别电连接到所述主体子电路板的所述第一桥接端和所述第二桥接端，以使所述桥接子电路板安装到所述主体子电路板上，所述第一基板和所述第二基板不直接接触。
例如，本公开至少一实施例提供的柔性电路板的制作方法中，通过热压的方式、焊接的方式或者通过连接器将所述桥接子电路板的所述第三桥接端和所述第四桥接端分别连接到所述主体子电路板的所述第一桥接端和所述 第二桥接端。
附图说明
为了更清楚地说明本公开实施例的技术方案，下面将对实施例的附图作简单地介绍，显而易见地，下面描述中的附图仅仅涉及本公开的一些实施例，而非对本公开的限制。
图1A为本公开至少一实施例提供的柔性电路板的平面示意图；
图1B为本公开至少一实施例提供的柔性电路板的平面示意图；
图1C为本公开至少一实施例提供的柔性电路板的平面示意图；
图1D为本公开至少一实施例提供的柔性电路板的平面示意图；
图2为本公开至少一实施例提供的柔性电路板的主体子电路板的平面示意图；
图3为本公开至少一实施例提供的柔性电路板的桥接子电路板的平面示意图；
图4A为本公开至少一实施例提供的柔性电路板的主体子电路板的平面示意图；
图4B为本公开至少一实施例提供的柔性电路板的桥接子电路板的平面示意图；
图5A为本公开至少一实施例提供的柔性电路板的主体子电路板的平面示意图；
图5B为本公开至少一实施例提供的柔性电路板的主体子电路板的平面示意图；
图6A为本公开至少一实施例提供的柔性电路板的主体子电路板的截面示意图；
图6B为本公开至少一实施例提供的柔性电路板的主体子电路板的截面示意图；
图7A为本公开至少一实施例提供的柔性电路板的主体子电路板的另一截面示意图；
图7B为本公开至少一实施例提供的柔性电路板的主体子电路板的另一截面示意图；
图8A为本公开至少一实施例提供的柔性电路板的桥接子电路板的截面 示意图；
图8B为本公开至少一实施例提供的柔性电路板的桥接子电路板的截面示意图；
图8C为本公开至少一实施例提供的柔性电路板的桥接子电路板的截面示意图；
图8D为本公开至少一实施例提供的柔性电路板的桥接子电路板的截面示意图；
图9A为本公开至少一实施例提供的柔性电路板的桥接子电路板的另一截面示意图；
图9B为本公开至少一实施例提供的柔性电路板的桥接子电路板的另一截面示意图；
图10A为本公开至少一实施例提供的电子装置模组的示意图；
图10B为本公开至少一实施例提供的另一电子装置模组的示意图；
图11为本公开一些实施例提供的电子装置的示意图
图12为本公开一些实施例提供的一种柔性电路板的制作流程图。
具体实施方式
为使本公开实施例的目的、技术方案和优点更加清楚，下面将结合本公开实施例的附图，对本公开实施例的技术方案进行清楚、完整地描述。显然，所描述的实施例是本公开的一部分实施例，而不是全部的实施例。基于所描述的本公开的实施例，本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例，都属于本公开保护的范围。
除非另外定义，本公开使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。“包括”或者“包含”等类似的词语意指出现该词前面的元件或者物件涵盖出现在该词后面列举的元件或者物件及其等同，而不排除其他元件或者物件。“连接”或者“相连”等类似的词语并非限定于物理的或者机械的连接，而是可以包括电性的连接，不管是直接的还是间接的。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则该相对位置关系也可能相应地改变。
柔性电路板上通常可以集成多种信号走线，用于传递不同类型的信号。当柔性电路板上的信号走线的数量种类较多时，例如同时需要具有用于显示信号、触控信号、指纹识别信号等的多种信号走线时，柔性电路板中的布线难度也会增大。对此，柔性电路板往往形成为具有多层走线层，例如具有四层、六层走线层等，从而为多种走线的布置提供便利，使得多种走线可以分布在不同层上，从而降低不同种类的走线之间的相互干扰。但是，在制作具有多层走线层的柔性电路板的过程中，还需要形成位于相邻走线层之间的绝缘层(以及相应的粘结层)，必要时，为了避免不同走线之间的信号串扰，还需要在不同的走线之间形成(电磁信号)屏蔽层，这些都增加了柔性电路板的制作难度。
本公开至少一实施例提供一种柔性电路板，该柔性电路板包括第一基板以及设置在第一基板上的主体子电路板和桥接子电路板；主体子电路板包括第一桥接端、第二桥接端、第一走线部分和第二走线部分，第一走线部分和第二走线部分彼此间隔开且分别与第一桥接端和第二桥接端电连接；桥接子电路板包括第二基板以及设置在第二基板上第三桥接端、第四桥接端和第三走线部分，第三桥接端和第四桥接端由第三走线部分电连接，第一基板和第二基板不直接接触，桥接子电路板配置为通过将第三桥接端和第四桥接端分别电连接到第一桥接端和第二桥接端，而安装到主体子电路板上。
本公开至少一实施例提供的一种电子装置模组，包括电子装置基板以及上述柔性电路板；该电子装置基板包括第一功能电路结构，柔性电路板的第一功能走线电连接第一功能电路结构。
本公开至少一实施例提供一种电子装置，包括上述电子装置模组。
下面通过几个具体的实施例对本公开的柔性电路板及其制作方法、电子装置模组及电子装置进行说明。
本公开的一些实施例提供一种柔性电路板，图1A为该柔性电路板的平面示意图。如图1A所示，该柔性电路板10包括主体子电路板100和桥接子电路板200，桥接子电路板200可以被电连接到主体子电路板100。
图2为主体子电路板100的平面示意图。如图2所示，主体子电路板100包括第一基板以及设置在第一基板上的第一桥接端101、第二桥接端102、第一走线部分103和第二走线部分104；第一走线部分103和第二走线部分104彼此间隔开预定空间(距离)，且分别与第一桥接端101和第二桥接端 102电连接。例如，第一桥接端101包括多个第一接触垫，第二桥接端102包括多个第二接触垫。例如，第一走线部分103包括多条走线，该多条走线的一端与第一桥接端101包括的多个第一接触垫一一对应电连接；第二走线部分104也包括多条走线，该多条走线的一端与第一桥接端102包括的多个第二接触垫一一对应电连接。虽然图中仅示出了第一走线部分103包括的两条走线以及第二走线部分104包括的两条走线，但是本公开的实施例不限于此。
图3为桥接子电路板200的平面示意图。如图3所示，桥接子电路板200包括第二基板以及设置在第二基板上的第三桥接端201、第四桥接端202和第三走线部分203，第三桥接端201和第四桥接端202由第三走线部分203电连接。例如，第三桥接端201包括多个第三接触垫，第四桥接端202包括多个第四接触垫，第三走线部分203包括多条走线，这些走线在一端与第三桥接端201包括的多个第三接触垫一一对应电连接，在另一端与第四桥接端202包括的多个第四接触垫一一对应电连。虽然图中仅示出了第三走线部分203包括的两条走线，但是本公开的实施例不限于此。
桥接子电路板200配置为可通过将第三桥接端201和第四桥接端202分别电连接到第一桥接端101和第二桥接端102，从而可将桥接子电路板200安装到主体子电路板100上。当桥接子电路板200安装到主体子电路板100上时，第一走线部分103、第三走线部分203和第二走线部分104依次电连接以得到第一功能走线，由此电信号可以从第一走线部分103经第三走线部分203被传输到第二走线部分104，或者可以从第二走线部分104经第三走线部分203被传输到第一走线部分103。
例如，图1A示出了桥接子电路板200通过第三桥接端201和第四桥接端202分别与第一桥接端101和第二桥接端102接合而安装到主体子电路板100上的情形，在一些实施例中，主体子电路板100和桥接子电路板200也可以处于待连接状态，即单独的主体子电路板100和桥接子电路板200也在本公开的保护范围之内。
例如，在一些实施例中，如图2所示，柔性电路板10还可以包括第一控制电路结合结构105，该第一控制电路结合结构105设置在主体子电路板100上。例如，第一控制电路结合结构105包括多个接触垫，用于安装第一控制电路，该多个接触垫的一部分与第一走线部分103包括的多条走线的另 一端一一对电连接。第一控制电路结合结构105配置为给第一功能走线提供第一电信号或从第一功能走线接收第一电信号。
例如，第一控制电路可以为驱动IC芯片。将驱动IC芯片结合到柔性电路板的方式(即封装方式)有多种，例如带载封装(Tape Carrier Package，TCP)、膜上芯片(Chip on Film,COF)封装等。在TCP方式中，柔性电路板包括多个接触垫，驱动IC芯片的多个引脚与柔性电路板的多个接触垫一一对应焊接(例如共晶焊)，或者通过各向异性导电胶(ACF)一一对应电连接，并且至少通过例如环氧树脂对焊接部分进行保护；为了增加TCP方式下柔性电路板的可弯折性，可以在封装部分形成狭缝(Slit)。在COF封装方式中，柔性电路板包括多个接触垫，驱动IC芯片的多个引脚通过ACF直接压接在柔性电路板的多个接触垫上，使得驱动IC芯片的多个引脚与柔性电路板的多个接触垫一一对应电连接。例如，柔性电路板上用于结合驱动IC芯片的接触垫的大小、排布方式等，可根据不同类型的封装方式或要封装的驱动IC芯片进行相应的调整，例如这些接触垫可以排列为长条形或排列为矩形。本公开的实施例对于驱动IC芯片的封装方式不作限定。
例如，在一些实施例中，如图2所示，柔性电路板10的主体子电路板100还可以包括第二功能走线106，第二功能走线106包括多条走线，第一控制电路结合结构105中的另一部分接触垫与第二功能走线106包括的多条走线一一对应地电连接，此时，第一控制电路结合结构105上安装的第一控制电路还配置为给第二功能走线106提供第二电信号或从第二功能走线106接收第二电信号。
例如，在一些实施例中，如图1A和图2所示，柔性电路板10的主体子电路板100还包括第三功能走线107，第三功能走线107位于第一走线部分103和第二走线部分104之间，由此穿过第一走线部分103和第二走线部分104之间的预定空间，例如，第三功能走线107与安装到主体子电路板100上的桥接子电路板200在垂直于主体子电路板100板面的方向上相交叉。此时，桥接子电路板200上的第三部分走线203跨过第三功能走线107将位于主体子电路板100两侧的第一走线部分103和第二部分走线104电连接，从而避免在主体子电路板100本身上形成交叉的走线，进而可以避免或减弱不同走线之间发生信号串扰，或者避免为防止信号串扰而增加额外的功能层，从而避免电路板结构复杂化；另外，该设计还可以简化主体子电路板100的 走线布图，使主体子电路板的制作工艺变得简单。
例如，在一些实施例中，如图2所示，第一走线部分103、第二走线部分104和第三功能走线107沿相同方向布线，例如平行布线或者基本平行布线(只要走线不交叉即可)，例如图中示出的沿竖直方向平行布线。由此，主体子电路板100上的上述多种走线没有交叉的部分，并且走线布图更加简单。例如在一些实施例中，这些走线可以布置在同一走线层中，从而可以减少走线层数，简化柔性电路板的层状结构。
例如，在一些实施例中，如图1B和图2所示，柔性电路板10还可以包括第二控制电路结合结构108，该第二控制电路结合结构108设置在主体子电路板100上。例如，第二控制电路结合结构108包括多个接触垫，用于安装第二控制电路，该多个接触垫的至少一部分与第三功能走线107的一端一一对应电连接。第二控制电路结合结构108配置为给第三功能走线107提供第三电信号或从第三功能走线107接收第三电信号。例如，第三功能走线107分为两部分，第三功能走线107的第一部分电连接在第二控制电路结合结构108的第一端(图中示出为下端)，第三功能走线107的第二部分电连接在第二控制电路结合结构108的第二端(图中示出为上端)与形成于主体子电路板100一侧边缘的接触垫(如下所述)之间。
例如，第二控制电路也可以为驱动IC芯片。第一控制电路和第二控制电路分别用于实现不同的驱动功能。如上所述，该驱动IC芯片结合到柔性电路板的方式例如为带载封装(Tape Carrier Package，TCP)、膜上芯片(Chip on Film,COF)封装等。例如，第二控制电路结合结构108包括多个接触垫，以用于与驱动IC芯片连接。同样地，这些接触垫的大小、排布方式等，可根据不同类型的封装方式或要封装的驱动IC芯片进行相应的调整，本公开的实施例对此不作具体限定。
例如，如图4A和图4B所示，在一些实施例中，第一控制电路结合结构105还可以形成在桥接子电路板200上，此时，在主体子电路板100上，第一走线部分103和第二走线部分104分别电连接至第一桥接端101和第二桥接端102，在桥接子电路板200上，第三走线部分203分为两部分，第三走线部分203的第一部分电连接在第一控制电路结合结构105与第三桥接端201之间，第三走线部分203的第二部分电连接在第一控制电路结合结构105与第四桥接端202之间。由此，主体子电路板100上的第一走线部分103和 第二走线部分104分别电连接至桥接子电路板200上的第一控制电路结合结构105。
例如，在一些实施例中，如图1C所示，桥接子电路板200为可以多个(图中示出为两个)，此时，多个桥接子电路板200可以同时安装到主体子电路板100上。例如，主体子电路板100包括多个第一桥接端101和多个第二桥接端102，多个桥接子电路板200分别通过其上的多个第三桥接端201和多个第四桥接端202分别电连接到多个第一桥接端101和多个第二桥接端102，从而安装到主体子电路板100上。
需要说明的是，在图1C示出的实施例中，桥接子电路板200为两个，但本公开的实施例并不局限于此，桥接子电路板200的个数可以根据实际需求进行选择，本公开的实施例对桥接子电路板200的个数不做限制。
另外，本公开的实施例对桥接子电路板200的设置方式也不做具体限定，例如，在上述实施例中，桥接子电路板200横向设置，从而将主体子电路板100左右两侧的走线桥接，位于主体子电路板100中间部分的走线从桥接子电路板200下方穿过。在另一些实施例中，如图1D所示，桥接子电路板200的设置方向也可以竖向桥接，从而将位于主体子电路板100上下两侧的走线桥接，而位于主体子电路板100左右两侧的走线从桥接子电路板200下方穿过。
例如，图5A示出了本公开实施例提供的另一种主体子电路板的平面示意图。该主体子电路板采用与上述实施例不同的形状与电路排布。
例如，如图5所示，该主体子电路板呈长条形，该主体子电路板的第一桥接端101、第二桥接端102、第一走线部分103、第二走线部分104以及第二功能走线106等结构具有与上述实施例的主体子电路板相似的排布。与上述实施例的主体子电路板不同的是，在图5示出的主体子电路板中，第三走线部分107从主体子电路板的中间部分延伸并在主体子电路板的一侧(图中示出的下侧)转至主体子电路板的左侧，并电连接在主体子电路板左侧的接线端111。接线端111上具有多个接触垫，第三走线部分107中的多条走线与接线端111上的多个接触垫一一对应且电连接。例如，接线端111可用于与其他电子装置或者控制芯片等电连接，本公开的实施例对此不做限定。
例如，在一些实施例中，主体子电路板可以为单层走线结构或者多层走线结构(例如双层走线结构或者三层走线结构等)，本公开的实施例对此不 做限定。
例如，图6A示出了本公开一些实施例提供的一种主体子电路板的截面示意图，该截面图例如是沿图2中的A-A线剖切得到的。在这些实施例中，主体子电路板100为单层走线结构。如图6A所示，主体子电路板100包括第一基板1001以及位于第一基板1001一侧叠层的第一主体走线层1002和第一主体绝缘层1003。第一主体走线层1002包括第一走线部分103、第二走线部分104、第一桥接端101和第二桥接端102等结构，第一桥接端101和第二桥接端102由第一主体绝缘层1003暴露。例如，第一主体绝缘层1003作为保护层，对于第一主体走线层1002提供结构以及电气保护，例如第一主体绝缘层1003可以通过粘结层(图中未示出)结合到第一主体走线层1002以及第一基板1001。例如，第一主体绝缘层1003中形成有开口1013，在开口1013中例如可以对暴露的第一走线层1002中对应于第一桥接端101或第二桥接端102的部分进行表面处理(例如镀覆焊锡层)，从而形成图案化的多个接触垫，对应地形成第一桥接端101或第二桥接端102。
例如，当主体子电路板还包括第二功能走线106和第三功能走线107时，第二功能走线106和第三功能走线107也排布在第一走线层1002中。此时，主体子电路板为具有单层走线层的单层走线结构。
例如，图6B示出了本公开一些实施例提供的另一种主体子电路板的截面示意图，该截面图例如是沿图2中的A-A线剖切得到的。在这些实施例中，主体子电路板100为多层走线结构，下面参考图6B以主体子电路板100具有双层走线结构为例进行说明，但是本公开的实施例对此不作限制。
如图6B所示，该示例中，主体子电路板100包括第一基板1001、位于第一基板1001第一侧(图中示出为上侧)且层叠的第一主体走线层1002和第一主体绝缘层1003，还包括位于第一基板1001第二侧(图中示出为下侧)且层叠的第二主体走线层1004和第二主体绝缘层1005。第一主体绝缘层1003作为保护层，对于第一主体走线层1002提供结构以及电气保护，例如第一主体绝缘层1003可以通过粘结层(图中未示出)结合到第一主体走线层1002以及第一基板1001；第二绝缘层1005作为保护层，对于第二主体走线层1004提供结构以及电气保护，例如第二主体绝缘层1005可以通过粘结层(图中未示出)结合到第二主体走线层1004以及第一基板1001。
例如，在一些示例中，第一主体走线层1002包括第一走线部分103和 第二走线部分104，此时第一走线部分103和第二走线部分104可以在第一主体走线层1002和第二主体走线层1004中交叉排布，例如第一走线部分103在主体子电路板100的板面上彼此相邻的两条走线可以分别位于第一主体走线层1002和第二主体走线层1004，由此便于走线布置。例如，第二走线部分104也可以类似地设置。
例如，当主体子电路板还包括第二功能走线106和第三功能走线107时，第二功能走线106和第三功能走线107也可以在第一主体走线层1002和第二主体走线层1004中交叉排布。或者，第一主体走线层1002可以包括第一走线部分103和第二走线部分104，第二主体走线层1004可以包括第二功能走线106和第三功能走线107，即不同的走线层可分别布置不同的功能走线。本公开的实施例对主体子电路板100上的走线布图不作具体限定。
例如，在图5A所示的实施例中，当主体子电路板100上的第一走线部分103、第二走线部分104、第二功能走线106和第三功能走线107在第一主体走线层1002和第二主体走线层1004中交替排布时，第一主体走线层1002的平面示意图如图5A所示，第二主体走线层1004的平面示意图如图5B所示，此时，第二主体走线层1004中的各走线与第一主体走线层1002中的各走线具有相似的排布，并且第二主体走线层1004中的各走线可以通过过孔(例如图5B中示出的黑点)电连接到第一主体走线层1002，并被相应地绝缘层暴露，以形成桥接端。
例如，在一些实施例中，如图6B所示，第一桥接端101和第二桥接端102可以由第一主体绝缘层1003暴露。例如，类似地，第一主体绝缘层1003中形成有开口1013，在开口1013中例如可以对暴露的第一主体走线层1002中对应于第一桥接端101或第二桥接端102的部分进行通过表面处理，从而形成图案化的多个接触垫，对应地形成第一桥接端101或第二桥接端102；类似地，对于位于第二主体走线层1004中的走线，则可以通过穿过第一基板1001中的过孔1011、第一主体走线层1002和第一主体绝缘层1003的开口1013形成桥接端。例如，第一基板1001中的过孔1011和第一主体绝缘层1003的开口1013错位设置，由此在制备工艺中，开口1013位置处较为平坦，易于接触垫的形成。
例如，在一些实施例中，第一桥接端101和第二桥接端102可以分别在主体子电路板的不同侧暴露，从而将第一桥接端101和第二桥接端102设置 在主体子电路板的不同侧。
例如，图7A示出了本公开一些实施例提供的一种主体子电路板的截面示意图，该截面图例如是沿图2中的C-C线剖切得到的。在该实施例中，主体子电路板具有单层走线结构。主体子电路板的第一桥接端101由第一主体绝缘层1003暴露，如图6A所示；第二桥接端102由第一基板1001暴露，从而将第一桥接端101和第二桥接端102设置在主体子电路板的不同侧。
例如，图7B示出了本公开一些实施例提供的另一种主体子电路板的截面示意图，该截面图例如是沿图2中的C-C线剖切得到的。在该实施例中，主体子电路板具有双层走线结构。主体子电路板的第一桥接端101由第一主体绝缘层1003暴露，如图6B所示；第二桥接端102由第二主体绝缘层1005暴露，从而将第一桥接端101和第二桥接端102设置在主体子电路板的不同侧。
例如，在一些实施例中，主体子电路板也可以具有三层走线结构、四层走线结构等多层走线结构。此时，主体子电路板上的各部分走线，例如第一走线部分、第二走线部分、第二功能走线和第三功能走线可以在多层走线层中排布。例如，第一走线部分、第二走线部分、第二功能走线和第三功能走线在多层走线层中交替排布，或者分别在不同走线层中排布。本公开的实施例对主体子电路板的走线层的数量以及走线的排布不做具体限定。
类似地，桥接子电路板也可以具有单层走线结构或多层走线结构。例如，图8A示出了本公开一些实施例提供的一种桥接子电路板的截面示意图，该截面图例如是沿图3A中的B-B线剖切得到的。在这些实施例中，桥接子电路板200为单层走线结构。
例如，如图8A所示，桥接子电路板200包括第二基板2001以及位于第二基板2001的第一侧(图中示出为上侧)的第一桥接走线层2002和第一桥接绝缘层2003，第一桥接走线层2002包括第三走线部分203。同样，第一桥接绝缘层2003作为保护层，对于第一桥接走线层2002提供结构以及电气保护，例如第一桥接绝缘层2003可以通过粘结层(图中未示出)结合到第一桥接走线层2002以及第二基板2001。
例如，第二基板2001中具有开口2011，在开口2011中例如可以对暴露的第一桥接走线层2002中对应于第三桥接端201或者第四桥接端202的部分进行通过表面处理，从而形成图案化的多个接触垫，对应地形成第三桥接 端201或者第四桥接端202。
例如，在一些实施例中，如图8B所示，桥接子电路板200还可以包括屏蔽层2006，屏蔽层2006设置在第二基板2001的远离第一桥接走线层2002的一侧。例如，屏蔽层2006可以接地，从而可起到电磁屏蔽的效果，防止主体子电路板和桥接子电路板中的走线发生信号串扰。例如，屏蔽层2006中具有镂空结构2016，该镂空结构对应于第二基板2001中的开口2011，以暴露第三桥接端201或者第四桥接端202。
例如，图8C示出了本公开一些实施例提供的另一种桥接子电路板的截面示意图，该截面图例如是沿图3A中的B-B线剖切得到的。在这些实施例中，桥接子电路板200为多层结构，下面参考图8C以桥接子电路板200具有双层结构为例进行说明，但是本公开的实施例对此不作限制。
如图8C所示，桥接子电路板200包括第二基板2001以及位于第二基板2001的第一侧(图中示出为上侧)的第一桥接走线层2002和第一桥接绝缘层2003，第一桥接走线层2002包括第三走线部分203。同样，第一桥接绝缘层2003作为保护层，对于第一桥接走线层2002提供结构以及电气保护，例如第一桥接绝缘层2003可以通过粘结层(图中未示出)结合到第一桥接走线层2002以及第二基板2001。
例如，如图8C所示，桥接子电路板200还可以包括位于第二基板2001的与第一侧相对的第二侧(图中示出为下侧)的第二桥接走线层2004以及与第二桥接走线层2004叠层的第二桥接绝缘层2005。例如，第二桥接走线层2004也可以包括第三走线部分203，此时，第三走线部分203可以在第一桥接走线层2002和第二桥接走线层2004中交替排布。例如，第三走线部分203在桥体子电路板200的板面上彼此相邻的两条走线可以分别位于第一桥接走线层2002和第二桥接走线层2004中，由此便于走线布置。例如，如图8D中的虚线表示位于第二桥接走线层2004两侧的走线部分没有电连接。
例如，位于桥接子电路板200的第一侧的第三走线部分203通过第二基板2001中的过孔2011以及第二桥接绝缘层2005中的开口2015暴露并引出，例如通过表面处理形成图案化的多个接触垫，以构成第三桥接端201或者第四桥接端202。例如，第二桥接绝缘层2005中的开口2015形成在图8C示出的虚线框标示的位置或者形成在其他合适的位置，本公开的实施例对此不做限定。
例如，如图8D所示，在一些实施例中，桥接子电路板200还可以进一步包括在第二基板2001的第二侧的屏蔽层2006，屏蔽层2006例如设置在第二桥接绝缘层2005的远离第二基板2001的一侧。例如，屏蔽层2006接地，可起到电磁屏蔽的效果。例如，屏蔽层2006在对应于第二桥接绝缘层2005的开口2015的位置具有镂空结构2016，从而形成暴露第三桥接端201或者第四桥接端202。
例如，当桥接子电路板200被安装到主体子电路板100上时，第二侧相对于第一侧更靠近主体子电路板100。由此，屏蔽层2006位于主体子电路板100中的走线层与桥接子电路板200的走线层之间，该屏蔽层2006可防止主体子电路板100中的走线层与桥接子电路板200的走线层之间发生信号串扰。
例如，在一些实施例中，第二桥接走线层2004可以为接地层，包括多条接地走线。此时，第三走线部分203可以全部设置在第一桥接走线层2002中。由此，主体子电路板100中的走线层与桥接子电路板200的走线层之间还具有接地层，该接地层可进一步防止主体子电路板100中的走线层与桥接子电路板200的走线层之间发生信号串扰。或者，在一些实施例中，第三走线部分203可以部分设置在第一桥接走线层2002中，而另一部分设置在第二桥接走线层2004中，此时，在第二桥接走线层2004中的接地走线与第三走线部分203的部分走线可以交替排布。由此，第二桥接走线层2004也可以起到防止信号串扰的作用。
当桥接子电路板同时具有接地层与屏蔽层2006时，接地层2004与屏蔽层2006可达到双重屏蔽效果，防止主体子电路板100上的各走线与桥接子电路板200上的各走线发生信号串扰。
例如，在一些实施例中，桥接子电路板200还可以进一步包括在屏蔽层2006外侧(即远离第二基板2001一侧)的绝缘层(图中未示出)，以对屏蔽层2006提供保护，该绝缘层例如可以通过粘结层粘结到屏蔽层2006上。该绝缘层还可以包括对应于开口2015和镂空结构2016的开口以暴露桥接端。例如，第二基板2001中的过孔2011和第二桥接绝缘层2005的开口2015错位设置，由此在制备工艺中，开口1015位置处较为平坦，易于接触垫的形成。
例如，在一些实施例中，桥接子电路板200的第三桥接端201或者第四 桥接端202可以分别在桥接子电路板200的不同侧暴露，从而将第三桥接端201和第四桥接端202设置在桥接子电路板200的不同侧。
例如，图9A示出了本公开一些实施例提供的另一种桥接子电路板的截面示意图，该截面图例如是沿图3A中的D-D线剖切得到的。在该实施例中，桥接子电路板具有单层走线结构。例如，桥接子电路板的第三桥接端201由第二基板2001暴露，如图8A所示；第四桥接端202由第一桥接绝缘层2003中的开口2013暴露，如图9A所示，从而将第三桥接端201和第四桥接端202设置在桥接子电路板的不同侧。
例如，图9B示出了本公开一些实施例提供的另一种桥接子电路板的截面示意图，该截面图例如是沿图3A中的D-D线剖切得到的。在该实施例中，桥接子电路板具有双层走线结构。例如，桥接子电路板的第三桥接端201由第二桥接绝缘层2005暴露，如图8C所示；第四桥接端202由第一桥接绝缘层2003中的开口2013暴露，如图9B所示，从而将第三桥接端201和第四桥接端202设置在桥接子电路板的不同侧。
例如，在一些实施例中，桥接子电路板也可以具有三层走线结构、四层走线结构等多层走线结构。此时，桥接子电路板上的第三部分走线可以在多层走线层中排布。例如，第三部分走线可以在多层走线层中交替排布。本公开的实施例对桥接子电路板的走线层的数量以及走线的排布不做具体限定。
例如，在一些实施例中，当主体子电路板的第一桥接端101和第二桥接端102设置在主体子电路板的不同侧，且桥接子电路板的第三桥接端201和第四桥接端202也分别设置在桥接子电路板的不同侧时，桥接子电路板的第三桥接端201和第四桥接端202可以分别电连接到主体子电路板不同侧的第一桥接端101和第二桥接端102，或者，当主体子电路板的第一桥接端101和第二桥接端102设置在主体子电路板的不同侧，且桥接子电路板的第三桥接端201和第四桥接端202设置在桥接子电路板的相同侧时，桥接子电路板的第三桥接端201和第四桥接端202可以通过弯折而分别电连接到主体子电路板不同侧的第一桥接端101和第二桥接端102，从而桥接子电路板可以以类似于“发卡”的形式桥接在主体子电路板上。
例如，第一基板1001和第二基板2001可以采用聚酰亚胺或者聚酯等柔性材料，各走线层可以由铜、银、铝等金属材料或者合金材料制备，各绝缘层采用聚酰亚胺或者聚酯等绝缘材料，接地层2004采用金属材料(例如铜 层或铜箔)，屏蔽层2006包括绝缘基底以及填充在绝缘基底中的导电材料，例如绝缘基底采用环氧树脂，填充的导电材料为铜粉、石墨粉末等；或者，在一些实施例中，屏蔽层2006还可以为金属材料，本公开对各功能层的材料不作具体限定；粘结层采用环氧树脂或聚乙烯等。
例如，桥接子电路板200的第三桥接端201和第四桥接端202分别通过各向异性导电胶、焊接材料或者连接器连接到主体子电路板100的第一桥接端101和第二桥接端102。例如，连接器包括零***力型(Zero Insertion Force，ZIF)连接器或者板对板型(Board to Board，BTB)连接器等，本公开的实施例对各桥接端的连接方式不做具体限定。
例如，在一个示例中，采用板对板型连接器连接主体子电路板100和桥接子电路板200。此时，该连接器包括相互配合的公连接器和母连接器。例如，主体子电路板100的第一桥接端101和第二桥接端102设置母连接器，桥接子电路板200的第三桥接端201和第四桥接端202设置公连接器，从而通过公连接器和母连接器的插合使桥接子电路板200与主体子电路板100连接。
本公开实施例提供的柔性电路板具有主体子电路板和桥接子电路板，通过桥接子电路板将位于主体子电路板两侧的走线桥接，可以避免走线在主体子电路板上交叉，从而可以防止或减弱信号串扰，或者可以避免为防止信号串扰而增加额外的功能层，从而可以避免电路板结构复杂化。本公开的一些实施例中，主体子电路板和桥接子电路板具有简单的单层或者双层结构，因此走线布图更简单，可降低主体子电路板和桥接子电路板的制作难度。
本公开一些实施例提供一种电子装置模组，图10A示出了该电子装置模组的示意图。如图10A所示，电子装置模组1包括电子装置基板11以及上述任一的柔性电路板10，电子装置基板11包括第一功能电路结构20。柔性电路板10的第一功能走线(包括第一走线部分103、第二走线部分104和第三走线部分203)电连接第一功能电路结构20。
例如，在一些实施例中，柔性电路板10还包括第二功能走线106，第一功能电路结构20包括第一信号传输部分21和第二信号传输部分22，第一功能走线电连接第一信号传输部分21，第二功能走线106电连接第二信号传输部分22。
例如，在一些实施例中，电子装置基板11还包括第二功能电路结构23， 柔性电路板还包括第三功能走线107，第三功能走线107电连接第二功能电路结构23。
例如，在一些实施例中，电子装置基板11为具有显示功能与触控功能的基板，此时，第一功能电路结构20为触控电路结构，第二功能电路结构23为显示电路结构。在另一些实施例中，电子装置基板11为具有显示功能与指纹识别功能的基板，此时，第一功能电路结构20为指纹识别电路结构，例如该指纹识别电路结构为电容式指纹识别电路，包括交叉设置的检测驱动电极和检测感应电极，第二功能电路结构23为显示电路结构。下面以第一功能电路结构20为触控电路结构为例进行说明。
例如，触控电路结构在电子装置基板11上的设置方式可以是内置式，也可以是外挂式。触控电路结构的形式可以是电容式，例如为互电容式触控电路结构。例如，该互电容式触控电路结构包括沿第一方向延伸的多个第一电极与沿第二方向(与第一方向相交叉)延伸的多个第二电极，两组电极交叉的位置将会形成检测电容，也即这两组电极分别构成了电容的两极。当手指触摸到该触控电路结构时，手指会影响触摸点附近两个电极之间的耦合状态，从而改变了这两个电极之间的检测电容的电容量。根据触控电路结构电容变化量数据以及各个电容的坐标，可以得出每一个触摸点的坐标。在检测电容大小时，横向电极作为触控驱动电路依次发出激励信号，纵向电极作为触控感应电路同时或依次接收信号，这样可以得到所有横向和纵向电极交汇点的电容值大小，即整个触控结构的二维平面的电容大小。因此，触控结构上即使有多个触摸点，也能确定出每个触摸点的真实坐标。
例如，在上述情况下，第一信号传输部分21可以包括电连接触控电路的触控驱动(Tx)电路的触控驱动走线，第二信号传输部分22可以包括电连接触控电路的触控感应(Rx)电路的触控感应走线。此时，第一控制电路1051为触控驱动IC，可通过触控驱动走线为触控驱动电路提供激励信号，可通过触控感应走线接收触控感应电路的感应信号，并可基于上述信号判断触控位置并进行响应。例如，在上述示例中，触控驱动电路被桥接，触控感应电路直接电连接至第一控制电路结合结构105，因此触控感应电路与第一控制电路结合结构105的距离更近，即与其上安装的第一控制电路1051，即触控驱动IC的距离更近，因此触控感应电路接受到的感应信号传输至触控驱动IC的路径更短，因此该感应信号受到信号干扰的可能性更小，从而可 以使触控操作更加准确。例如，如图所示，触控驱动走线和触控感应走线延伸到电子装置基板11的同一侧(图中的下侧)，并且与在该侧边形成的接触垫211和接触垫221分别电连接。
例如，在本公开的其他实施例中，也可以是第一信号传输部分21包括电连接触控电路的触控感应(Rx)电路的触控感应走线，第二信号传输部分22包括电连接触控电路的触控驱动(Tx)电路的触控驱动走线，此时，触控感应电路被桥接，触控驱动电路直接电连接至第一控制电路结合结构105，因此触控驱动电路与第一控制电路结合结构105的距离更近，即与其上安装的第一控制电路1051，即触控驱动IC的距离更近，由此，在该实施例中，触控驱动电路中的触控驱动信号受到信号干扰的可能性更小。
例如，柔性电路板10在其一侧(例如图中的上侧)具有接线端110，接线端110上具有多个接触垫，第二走线部分104包括的多条走线的另一端与接线端110中的部分接触垫一一对应电连接，第二功能走线106包括的多条走线的另一端与接线端110中的另一部分接触垫一一对应电连接，而且第三功能走线107包括的多条走线的另一端与接线端110中的再一部分接触垫一一对应电连接。例如，分别电连接到第二走线部分104、第三功能走线107和第二功能走线106的部分接触垫在接线端110间隔设置或者连续设置，本公开的实施例对此不做具体限定。例如，当第二走线部分104、第三功能走线107和第二功能走线106中走线的数量较多时，与其相连的接触垫可以在接线端110连续布置；当第二走线部分104、第三功能走线107和第二功能走线106中走线的数量较少时，与其相连的接触垫可以在接线端110间隔布置，此时，例如可以形成图10A所示的间隔设置的多组接触垫。
例如，接线端110设置在主体子电路板的接线区110A(即图中接线端110下方的斜线区域)，例如，接线区110A区只具有走线层和部分绝缘层，而不具有屏蔽层等结构，因此接线区110A具有较高的透明度，当柔性电路板10结合到电子装置基板11的过程中，可以实现清楚对位，以便于柔性电路板10和电子装置基板11的准确电连接。
例如，当将柔性电路板10结合到电子装置基板11时，可以将柔性电路板10侧边的接线端110的接触垫与电子装置基板11侧边的接触垫直接压接在一起，例如，在一些实施例中，将柔性电路板10侧边的接线端110的接触垫与电子装置基板11侧边的接触垫彼此通过例如ACF电连接，从而将柔 性电路板10上的第一功能走线与第一信号传输部分21连接的触控驱动走线通过接触垫211电连接、将柔性电路板上的第二功能走线与第二信号传输部分22连接的触控感应走线通过接触垫221电连接，由此将柔性电路板10的第一功能走线和第二功能走线与电子装置基板11的触控电路结构电连接。
例如，第二功能电路结构23，即显示电路结构，包括多条数据线(以及还包括栅线等)，该多条数据线分别与像素单元电连接，多条数据线延伸到电子装置基板11的一侧(图中的下侧)，并且与在该侧边形成的接触垫231电连接。对于有机发光二极管(OLED)显示基板的情形，像素单元包括显示驱动电路，例如显示驱动电路包括多个晶体管、电容以及发光器件等，例如形成为2T1C、3T1C或者7T1C等多种形式。例如，当将柔性电路板10结合到电子装置基板11时，柔性电路板10的接线端110上具有的多个接触垫，还将柔性电路板上的第三功能走线与第二功能电路结构23中的数据线通过接触垫231电连接，由此将柔性电路板10的第三功能走线与电子装置基板11的显示电路结构电连接。
例如，在一些实施例中，如图10B所示，主体子电路板100上还可以具有第二控制电路结合结构108以及设置在第二控制电路结合结构108上的第二控制电路1081，此时，第二控制电路1081为显示驱动IC，可为显示驱动电路提供数据信号，从而可通过显示驱动IC提供的数据线号控制发光器件的发光状态，实现不同的显示效果。
对于液晶显示(LCD)基板的情形，像素单元包括开关元件和用于控制液晶偏转的第一电极(像素电极)和第二电极(公共电极)，该开关元件与第一电极电连接。第二功能电路结构23，即显示电路结构，包括分别连接于像素单元的多条数据线，此时，第二控制电路为显示驱动IC，可通过数据线为像素单元提供不同的数据电压信号，从而控制液晶的扭转状态，实现不同的显示效果。
例如，柔性电路板通过绑定的方式结合在电子装置基板11上，在绑定时，柔性电路板可在绑定于电子装置基板11上之后被弯折到电子装置基板11的背面并被固定，即安装到电子装置基板11的非显示侧，以便于显示屏幕的大屏化设计。
在上述本公开的一些实施例中电子装置基板的柔性电路板中，通过桥接子电路板将位于主体子电路板上分别与触控驱动电路电连接的走线部分桥 接，从而使得在主体子电路板上触控驱动电路与显示驱动电路不相交，并且在主体子电路板与桥接子电路板交叉的部位二者也互相屏蔽，因此可以避免主体子电路板与桥接子电路板中走线的信号串扰，同时，该主体子电路板与桥接子电路板的结构简单，走线布图简单，有利于简化其制作工艺。
本公开至少一实施例提供一种电子装置，图11示出了该电子装置的示意图。如图11所示，电子装置2包括上述任一的电子装置模组，该电子装置模组包括电子装置基板11以及柔性电路板10。例如，图11中示出的电子装置基板11的上侧为显示侧，下侧为非显示侧；此时，柔性电路板10绑定之后被弯折放置于电子装置基板11的非显示侧，以便于实现显示屏幕的大屏化设计。
该电子装置2例如可以为手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或部件，本公开的实施例对此不作具体限定。
本公开一些实施例提供一种柔性电路板的制作方法，如图12所示，该制作方法包括步骤S101-S103。
步骤S101：提供主体子电路板。
参照图2，主体子电路板100包括第一桥接端101、第二桥接端102、第一走线部分103和第二走线部分104，第一走线部分103和第二走线部分104彼此间隔开且分别与第一桥接端101和第二桥接端102电连接。
例如，参照图6A，主体子电路板100通过依次在第一基板1001上形成第一走线层1002以及第一绝缘层1003形成。例如，第一基板1001采用聚酰亚胺或者聚酯等材料，第一走线层1002采用铜、银、铝等金属材料或者合金材料，第一绝缘层1003也采用聚酰亚胺或者聚酯等材料。例如，首先在第一基板1001上采用溅射等方法形成一层铜金属层，其次对铜金属层进行构图以形成第一走线层1002，然后采用涂覆等方式在第一走线层1002上形成第一绝缘层1003，并在第一绝缘层1003中形成开口以形成桥接端等结构。
步骤S102：提供桥接子电路板。
参照图3，桥接子电路板200包括第三桥接端201、第四桥接端202和第三走线部分203，第三桥接端201和第四桥接端202由第三走线部分203电连接。
例如，参照图8A，桥接子电路板200通过在第二基板2001的第一侧依次形成第一桥接走线层2002和第一桥接绝缘层2003形成。例如，第一基板2001采用聚酰亚胺或者聚酯等材料，第一桥接走线层2002采用铜、银、铝等金属材料或者合金材料，第一桥接绝缘层2003也采用聚酰亚胺或者聚酯等材料。例如，首先在第一基板2001上采用溅射等方法形成一层铜金属层，然后对铜金属层进行构图以形成第一桥接走线层2002，然后采用涂覆等方式在第一桥接走线层2002上形成第一桥接绝缘层2003。
例如，参照图8C，在一些实施例中，形成桥接子电路板200还包括在第二基板2001的与第一侧相对的第二侧依次形成第二桥接走线层2004以及第二桥接绝缘层2005。例如，第二桥接走线层2004可以为接地层，采用铜等材料，第二桥接绝缘层2005采用聚酰亚胺或者聚酯等材料。例如，第二基板2001和第二桥接绝缘层2005中通过构图等方式形成开口(或过孔)，形成于桥接子电路板200的第一侧的第三走线部分203通过第二基板2001中的过孔2011以及第二桥接绝缘层2005中的开口2015暴露并引出，例如还通过表面处理形成多个接触垫，构成桥接端。
例如，继续参照图8C，在一些实施例中，形成桥接子电路板200还包括在第二基板2001的第二侧形成屏蔽层2006。例如，屏蔽层2006例如悬空，或配置为可与接地线电连接。
例如，在一些实施例中，如图8D所示，当第二桥接走线层2004为接地层时，第二桥接绝缘层2005中还形成有开口2025，屏蔽层2006通过开口2025与第二桥接走线层2004中的接地走线电连接。
例如，当第二桥接走线层2004为接地层时，接地层2004与屏蔽层2006可起到双重屏蔽作用，防止主体子电路板100上的各走线与桥接子电路板200上的各走线发生信号串扰。例如，屏蔽层2006在对应于第二桥接绝缘层2005的开口2015的位置形成有镂空结构2016，从而暴露桥接端。
例如，屏蔽层2006包括绝缘基底以及填充在绝缘基底中的导电材料，例如绝缘基底采用环氧树脂，填充的导电材料为铜粉、石墨粉末等；或者在一些实施例中，屏蔽层2006还可以为金属材料，本公开的实施例对此不作具体限定。例如，屏蔽层可以在形成好后直接贴附在桥接子电路板200的第二侧。
步骤S103：将桥接子电路板安装到主体子电路板上。
参照图1A，将桥接子电路板200的第三桥接端201和第四桥接端202分别电连接到主体子电路板100的第一桥接端101和第二桥接端102，以使桥接子电路板200安装到主体子电路板100上，并将第一走线部分103、第三走线部分203和第二走线部分104依次电连接以得到第一功能走线。在安装时，桥接子电路板200的第二侧相对于第一侧更靠近主体子电路板100，从而主体子电路板100上的走线与桥接子电路板200上的走线可以通过接地层2004以及屏蔽层2006屏蔽，以防止信号串扰。
例如，可以通过热压的方式、焊接的方式或者通过连接器将桥接子电路板200的第三桥接端201和第四桥接端202分别连接到主体子电路板100的第一桥接端101和第二桥接端102。例如，在热压的方式中，在两个桥接端之间形成各向异性导电胶，然后对桥接端进行热压操作，以利用各向异性导电胶将两个桥接端连接在一起。例如，连接器包括零***力型(Zero Insertion Force，ZIF)连接器或者板对板型(Board to Board，BTB)连接器等，本公开的实施例对连接方式不做具体限定。
例如，在一个示例中，采用板对板型连接器连接主体子电路板100和桥接子电路板200。此时，该连接器包括相互配合的公连接器和母连接器。例如，主体子电路板100的第一桥接端101和第二桥接端102设置母连接器，桥接子电路板200的第三桥接端201和第四桥接端202设置公连接器，从而可以通过公连接器和母连接器的插合使桥接子电路板200与主体子电路板100连接。
本公开实施例的柔性电路板的制作方法提供了主体子电路板和桥接子电路板，并通过桥接子电路板将位于主体子电路板两侧的走线桥接，该方法可以避免走线在主体子电路板上交叉，防止或减弱信号串扰，或者避免为防止信号串扰而增加额外的功能层，从而可以避免电路板结构复杂化；另外，该制作方法提供的主体子电路板和桥接子电路板具有简单的单层或者双层结构，因此走线布图更简单，可以降低主体子电路板和桥接子电路板的制作难度。
还有以下几点需要说明：
(1)本公开实施例附图只涉及到与本公开实施例涉及到的结构，其他结构可参考通常设计。
(2)为了清晰起见，在用于描述本公开的实施例的附图中，层或区域 的厚度被放大或缩小，即这些附图并非按照实际的比例绘制。可以理解，当诸如层、膜、区域或基板之类的元件被称作位于另一元件“上”或“下”时，该元件可以“直接”位于另一元件“上”或“下”或者可以存在中间元件。
(3)在不冲突的情况下，本公开的实施例及实施例中的特征可以相互组合以得到新的实施例。
以上所述，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，可轻易想到变化或替换，都应涵盖在本公开的保护范围之内。因此，本公开的保护范围应以权利要求的保护范围为准。

Claims (26)

  1. 一种柔性电路板，包括：
    主体子电路板，包括第一基板以及设置在所述第一基板上的第一桥接端、第二桥接端、第一走线部分和第二走线部分，所述第一走线部分和所述第二走线部分彼此间隔开且分别与所述第一桥接端和所述第二桥接端电连接；
    桥接子电路板，包括第二基板以及设置在所述第二基板上的第三桥接端、第四桥接端和用于第一功能走线的第三走线部分，所述第三桥接端和所述第四桥接端由所述第三走线部分电连接，
    其中，所述第一基板和所述第二基板不直接接触，所述桥接子电路板配置为通过将所述第三桥接端和所述第四桥接端分别电连接到所述第一桥接端和所述第二桥接端，而安装到所述主体子电路板上。
  2. 根据权利要求1所述的柔性电路板，其中，所述桥接子电路板安装到所述主体子电路板，使得所述第一走线部分、所述第三走线部分和所述第二走线部分依次电连接以得到所述第一功能走线。
  3. 根据权利要求1或2所述的柔性电路板，还包括第一控制电路结合结构，所述第一控制电路结合结构设置在所述主体子电路板上，与所述第一走线部分电连接，或者所述第一控制电路结合结构设置在所述桥接子电路板上，与所述第三走线部分电连接；
    所述第一控制电路结合结构配置为给所述第一功能走线提供第一电信号或从所述第一功能走线接收第一电信号。
  4. 根据权利要求3所述的柔性电路板，其中，所述主体子电路板还包括第二功能走线，
    所述第二功能走线与设置在所述主体子电路板上的所述第一控制电路结合结构电连接，所述第一控制电路结合结构还配置为给所述第二功能走线提供第二电信号或从所述第二功能走线接收第二电信号。
  5. 根据权利要求4所述的柔性电路板，其中，所述主体子电路板还包括第三功能走线，
    所述第三功能走线位于所述第一走线部分和所述第二走线部分之间，且与安装到所述主体子电路板上的所述桥接子电路板相交叉。
  6. 根据权利要求5所述的柔性电路板，其中，所述第一走线部分、所述第二走线部分和所述第三功能走线沿相同方向布线。
  7. 根据权利要求1-6任一所述的柔性电路板，其中，所述主体子电路板包括位于所述第一基板第一侧的第一主体走线层以及叠层在所述第一主体走线层的远离所述第一基板一侧的第一主体绝缘层，
    所述第一主体走线层包括所述第一走线部分、所述第二走线部分、所述第一桥接端和所述第二桥接端，所述第一桥接端和所述第二桥接端由所述第一主体绝缘层暴露。
  8. 根据权利要求7所述的柔性电路板，其中，所述主体子电路板还包括位于所述第一基板的与所述第一侧相对的第二侧的第二主体走线层以及叠层在所述第二主体走线层的远离所述第一基板一侧的第二主体绝缘层，
    所述第二主体走线层包括所述第一走线部分和所述第二走线部分。
  9. 根据权利要求1-6任一所述的柔性电路板，其中，所述主体子电路板包括位于所述第一基板第一侧的第一主体走线层以及叠层在所述第一主体走线层的远离所述第一基板一侧的第一主体绝缘层，
    所述主体子电路板还包括位于所述第一基板的与所述第一侧相对的第二侧的第二主体走线层以及叠层在所述第二主体走线层的远离所述第一基板一侧的第二主体绝缘层，
    所述第一主体走线层包括所述第一走线部分、所述第二走线部分和所述第一桥接端，所述第一桥接端由所述第一主体绝缘层暴露；所述第二主体走线层包括所述第一走线部分、所述第二走线部分和所述第二桥接端，所述第二桥接端由所述第二主体绝缘层暴露。
  10. 根据权利要求1-6任一所述的柔性电路板，其中，所述桥接子电路板包括位于所述第二基板的第一侧的第一桥接走线层和叠层在所述第一桥接走线层的远离所述第二基板一侧的第一桥接绝缘层，
    所述第一桥接走线层包括所述第三走线部分。
  11. 根据权利要求10所述的柔性电路板，其中，所述桥接子电路板还包括位于所述第二基板的与所述第一侧相对的第二侧的接地层，
    在所述桥接子电路板安装到所述主体子电路板上的情况下，所述第二侧相对于所述第一侧更靠近所述主体子电路板。
  12. 根据权利要求11所述的柔性电路板，其中，所述桥接子电路板还 包括在所述第二基板的所述第二侧的屏蔽层，所述屏蔽层叠层在所述接地层的远离所述第二极板的一侧。
  13. 根据权利要求10所述的柔性电路板，其中，所述桥接子电路板还包括位于所述第二基板的与所述第一侧相对的第二侧的第二桥接走线层以及叠层在所述第二桥接走线层的远离所述第二基板一侧的第二桥接绝缘层，
    所述第二桥接走线层包括所述第三走线部分、所述第三桥接端和所述第四桥接端，所述第三桥接端和所述第四桥接端由所述第二桥接绝缘层暴露；
    在所述桥接子电路板安装到所述主体子电路板上的情况下，所述第二侧相对于所述第一侧更靠近所述主体子电路板。
  14. 根据权利要求10所述的柔性电路板，其中，所述桥接子电路板还包括位于所述第二基板的与所述第一侧相对的第二侧的第二桥接走线层以及叠层在所述第二桥接走线层的远离所述第二基板一侧的第二桥接绝缘层，
    所述第一桥接走线层还包括所述第三桥接端，所述第三桥接端由所述第一桥接绝缘层暴露；
    所述第二桥接走线层包括所述第三走线部分和所述第四桥接端，所述第四桥接端由所述第二桥接绝缘层暴露。
  15. 根据权利要求13或14所述的柔性电路板，其中，所述桥接子电路板还包括在所述第二基板的所述第二侧且叠层在所述第二桥接绝缘层远离所述第二基板一侧的屏蔽层。
  16. 根据权利要求1-15任一所述的柔性电路板，其中，所述桥接子电路板的所述第三桥接端和所述第四桥接端分别通过各向异性导电胶、焊接材料或者连接器连接到所述主体子电路板的所述第一桥接端和所述第二桥接端。
  17. 根据权利要求1-16任一所述的柔性电路板，其中，所述主体子电路板包括多个所述第一桥接端和多个所述第二桥接端；所述桥接子电路板为多个，多个所述桥接子电路板分别通过多个所述第三桥接端和多个所述第四桥接端分别电连接到多个所述第一桥接端和多个所述第二桥接端，而安装到所述主体子电路板上。
  18. 一种柔性电路板，包括：
    主体子电路板，包括第一基板以及设置在所述第一基板上的第一桥接端、第二桥接端、第一走线部分和第二走线部分，所述第一走线部分和所述 第二走线部分彼此间隔开且分别与所述第一桥接端和所述第二桥接端电连接；
    桥接子电路板，包括第二基板以及设置在所述第二基板上的第三桥接端、第四桥接端和用于第一功能走线的第三走线部分，所述第三桥接端和所述第四桥接端由所述第三走线部分电连接，
    其中，所述第一基板和所述第二基板不直接接触，所述桥接子电路板配置为通过将所述第三桥接端和所述第四桥接端分别电连接到所述第一桥接端和所述第二桥接端，而安装到所述主体子电路板上；
    所述主体子电路板包括位于所述第一基板第一侧的第一主体走线层以及叠层在所述第一主体走线层的远离所述第一基板一侧的第一主体绝缘层，所述第一主体走线层包括所述第一走线部分、所述第二走线部分、所述第一桥接端和所述第二桥接端，所述第一桥接端和所述第二桥接端由所述第一主体绝缘层暴露；所述主体子电路板还包括位于所述第一基板的与所述第一侧相对的第二侧的第二主体走线层以及叠层在所述第二主体走线层的远离所述第一基板一侧的第二主体绝缘层，所述第二主体走线层包括所述第一走线部分和所述第二走线部分；
    所述桥接子电路板包括位于所述第二基板的第一侧的第一桥接走线层和叠层在所述第一桥接走线层的远离所述第二基板一侧的第一桥接绝缘层，所述第一桥接走线层包括所述第三走线部分；所述桥接子电路板还包括位于所述第二基板的与所述第一侧相对的第二侧的第二桥接走线层以及叠层在所述第二桥接走线层的远离所述第二基板一侧的第二桥接绝缘层，所述第二桥接走线层包括所述第三走线部分、所述第三桥接端和所述第四桥接端，所述第三桥接端和所述第四桥接端由所述第二桥接绝缘层暴露；在所述桥接子电路板安装到所述主体子电路板上的情况下，所述第二侧相对于所述第一侧更靠近所述主体子电路板。
  19. 一种电子装置模组，包括电子装置基板以及权利要求1-18任一所述的柔性电路板；其中，所述电子装置基板包括第一功能电路结构，所述柔性电路板的第一功能走线电连接所述第一功能电路结构。
  20. 根据权利要求19所述的电子装置模组，其中，所述柔性电路板还包括第二功能走线，
    所述第一功能电路结构包括第一信号传输部分和第二信号传输部分，第 一功能走线电连接所述第一信号传输部分，所述第二功能走线电连接所述第二信号传输部分。
  21. 根据权利要求20所述的电子装置模组，其中，所述电子装置基板还包括第二功能电路结构，所述柔性电路板还包括第三功能走线，所述第三功能走线电连接所述第二功能电路结构。
  22. 根据权利要求21所述的电子装置模组，其中，所述第一功能电路结构为触控电路结构，所述第二功能电路结构为显示电路结构。
  23. 根据权利要求22所述的电子装置模组，其中，所述第一信号传输部分为所述触控电路的触控驱动电路，所述第二信号传输部分为所述触控电路的触控感应电路；或者
    所述第一信号传输部分为所述触控电路的触控感应电路，所述第二信号传输部分为所述触控电路的触控驱动电路。
  24. 一种电子装置，包括权利要求19-23任一所述的电子装置模组。
  25. 一种柔性电路板的制作方法，包括：
    提供主体子电路板，所述主体子电路板包括第一基板以及设置在所述第一基板上的第一桥接端、第二桥接端、第一走线部分和第二走线部分，所述第一走线部分和所述第二走线部分彼此间隔开且分别与所述第一桥接端和所述第二桥接端电连接；
    提供桥接子电路板，所述桥接子电路板包括第二基板以及设置在所述第二基板上的第三桥接端、第四桥接端和用于第一功能走线的第三走线部分，所述第三桥接端和所述第四桥接端由所述第三走线部分电连接，
    将所述桥接子电路板的所述第三桥接端和所述第四桥接端分别电连接到所述主体子电路板的所述第一桥接端和所述第二桥接端，以使所述桥接子电路板安装到所述主体子电路板上，所述第一基板和所述第二基板不直接接触。
  26. 根据权利要求25所述的制作方法，其中，通过热压的方式、焊接的方式或者通过连接器将所述桥接子电路板的所述第三桥接端和所述第四桥接端分别连接到所述主体子电路板的所述第一桥接端和所述第二桥接端。
PCT/CN2020/073940 2019-01-30 2020-01-23 柔性电路板及制作方法、电子装置模组及电子装置 WO2020156475A1 (zh)

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