CN114959350A - High-performance Cu-Hf-RE alloy and preparation method thereof - Google Patents
High-performance Cu-Hf-RE alloy and preparation method thereof Download PDFInfo
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- 229910000691 Re alloy Inorganic materials 0.000 title claims abstract description 26
- 238000002360 preparation method Methods 0.000 title claims abstract description 17
- 239000000956 alloy Substances 0.000 claims abstract description 43
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 26
- 238000003723 Smelting Methods 0.000 claims abstract description 17
- 238000000034 method Methods 0.000 claims abstract description 15
- 229910052735 hafnium Inorganic materials 0.000 claims abstract description 8
- 230000000930 thermomechanical effect Effects 0.000 claims abstract description 6
- 239000006104 solid solution Substances 0.000 claims description 38
- 238000002844 melting Methods 0.000 claims description 13
- 230000008018 melting Effects 0.000 claims description 13
- 229910001029 Hf alloy Inorganic materials 0.000 claims description 12
- 238000000265 homogenisation Methods 0.000 claims description 10
- 238000005266 casting Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 5
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 5
- 239000002994 raw material Substances 0.000 claims description 4
- 229910052684 Cerium Inorganic materials 0.000 claims description 3
- 229910052746 lanthanum Inorganic materials 0.000 claims description 3
- 229910052706 scandium Inorganic materials 0.000 claims description 3
- 229910052727 yttrium Inorganic materials 0.000 claims description 3
- 238000005303 weighing Methods 0.000 claims description 2
- 238000004321 preservation Methods 0.000 claims 1
- 239000010949 copper Substances 0.000 abstract description 25
- 229910000881 Cu alloy Inorganic materials 0.000 abstract description 15
- 229910052802 copper Inorganic materials 0.000 abstract description 13
- 230000032683 aging Effects 0.000 description 47
- 238000005097 cold rolling Methods 0.000 description 32
- 238000005098 hot rolling Methods 0.000 description 22
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 12
- 230000006698 induction Effects 0.000 description 11
- 229910052786 argon Inorganic materials 0.000 description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 5
- 229910002804 graphite Inorganic materials 0.000 description 5
- 239000010439 graphite Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000010791 quenching Methods 0.000 description 5
- 230000000171 quenching effect Effects 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 229910000636 Ce alloy Inorganic materials 0.000 description 4
- 229910000542 Sc alloy Inorganic materials 0.000 description 4
- 229910000946 Y alloy Inorganic materials 0.000 description 3
- 229910002530 Cu-Y Inorganic materials 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229910017526 Cu-Cr-Zr Inorganic materials 0.000 description 1
- 229910002482 Cu–Ni Inorganic materials 0.000 description 1
- 229910017816 Cu—Co Inorganic materials 0.000 description 1
- 229910017813 Cu—Cr Inorganic materials 0.000 description 1
- 229910017810 Cu—Cr—Zr Inorganic materials 0.000 description 1
- 229910017827 Cu—Fe Inorganic materials 0.000 description 1
- 229910017824 Cu—Fe—P Inorganic materials 0.000 description 1
- 229910017876 Cu—Ni—Si Inorganic materials 0.000 description 1
- 229910017985 Cu—Zr Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000001000 micrograph Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000036314 physical performance Effects 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
- C22C1/03—Making non-ferrous alloys by melting using master alloys
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/002—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working by rapid cooling or quenching; cooling agents used therefor
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/02—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working in inert or controlled atmosphere or vacuum
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E30/00—Energy generation of nuclear origin
- Y02E30/10—Nuclear fusion reactors
Abstract
The invention discloses a novel high-performance Cu-Hf-RE alloy, which consists of 0.1-1.5 wt.% Hf, 0.04-0.2 wt.% RE and Cu; the invention also discloses a preparation method of the novel high-performance Cu-Hf-RE alloy, which comprises alloy smelting and various thermomechanical treatment processes; the copper alloy prepared by the invention has simple components and process, but excellent comprehensive performance, ensures high strength, high conductivity and high elongation, has the softening temperature of more than 580 ℃, the high-temperature tensile strength of more than 260MPa at 500 ℃ and stable performance.
Description
Technical Field
The invention belongs to the technical field of high-strength and high-conductivity copper alloys, and relates to a novel high-performance Cu-Hf-RE alloy.
The invention also relates to a preparation method of the novel high-performance Cu-Hf-RE alloy.
Background
For copper material parts in severe service environments such as a divertor of a fusion power station, a high-heat-flux radiator, a high-speed train contact line and the like, the materials are required to have the performances of high strength (room temperature/high temperature strength), high conductivity, high thermal stability, high elongation and the like, and higher requirements are provided for the comprehensive performance of the copper material.
Therefore, based on materials such as Cu-Cr, Cu-Zr, Cu-Fe, Cu-Ni and the like, various copper alloys are developed at home and abroad successively, and the copper alloys usually obtain excellent comprehensive properties after solid solution, deformation and aging. However, the electrical conductivity and strength, room temperature strength and high temperature strength, strength and thermal stability are still in conflict with each other, so that intensive research on component design and process selection has been conducted in recent years.
In the precipitation type copper alloy, alloy elements which are dissolved in alpha-Cu crystal lattices in a dissolving way can be precipitated in a nanometer particle mode through aging, so that the strength and the conductivity of the alloy elements are simultaneously improved, and the high strength and the high conductivity are cooperatively matched. The comprehensive performance of the method is improved, and the precipitated phase is closely related to the physical performance, the precipitated morphology (and size) and the orientation relation of the precipitated phase and a matrix. For example, precipitation-strengthened copper alloys such as Cu-Cr-Zr, Cu-Co, Cu-Ni-Si, and Cu-Fe-P have poor and superior properties due to differences in precipitated phase types, morphologies, and dimensions. In order to solve the above problems, it is necessary to develop a novel copper alloy material with excellent comprehensive properties to meet the application requirements of more severe and complex environments.
Disclosure of Invention
The invention aims to research a copper alloy material with excellent comprehensive performance and long service life, prepare a copper alloy with high strength and high conductivity and cooperative matching, and simultaneously have higher thermal stability and high-temperature strength.
The first technical scheme adopted by the invention is that the novel high-performance Cu-Hf-RE alloy comprises 0.1-1.5 wt.% Hf and 0.04-0.2 wt.% RE in percentage by mass, wherein the RE is a rare earth element, the balance is Cu, and the sum of the components is 100%.
The first technical scheme of the invention is also characterized in that:
wherein, Hf element is introduced by pure Hf or Cu-Hf alloy, RE element is introduced by pure RE or Cu-RE alloy, and the rare earth element is La, Ce, Y or Sc.
The second technical scheme adopted by the invention is that the preparation method of the novel high-performance Cu-Hf-RE alloy is implemented according to the following steps:
step 1, weighing 0.1-1.5 wt.% Hf, 0.04-0.2 wt.% RE and the balance Cu according to mass percentage, wherein the sum of the components is 100%, smelting and casting to form ingots;
step 3, carrying out thermal deformation and solid solution treatment on the sample obtained in the step 2;
and 4, carrying out thermomechanical treatment on the solid solution sample obtained in the step 3.
The second technical scheme of the invention is also characterized in that:
wherein the smelting temperature in the step 1 is 1200-1400 ℃, and casting is carried out after the temperature is kept for 5-30 min after the set temperature is reached;
wherein the homogenization temperature in the step 2 is 800-980 ℃, and the homogenization time is 0.5-3 h;
wherein the temperature of the thermomechanical deformation in the step 3 is 850-950 ℃, and the deformation amount of the thermomechanical deformation is 20-90%;
wherein the solid solution temperature in the step 3 is 800-980 ℃, the solid solution time is 0.5-3 h, and the solid solution is rapidly cooled after solid solution;
wherein the temperature in the deformation heat treatment in the step 4 is 300-600 ℃, the heat treatment time is 0.5-3 h, and the deformation is 0-90%.
The invention has the beneficial effects that:
the invention provides a novel Cu-Hf-RE copper alloy with simple components and process, excellent comprehensive performance and stable performance, which is prepared by smelting, homogenizing, thermal deformation and deformation heat treatment processes, wherein the obtained material has excellent comprehensive performance, namely the room-temperature tensile strength is not less than 580MPa, the electric conductivity is more than 80% IACS, the tensile strength of high-temperature stretching at 500 ℃ is more than 260MPa, the softening temperature is more than 560 ℃, and the elongation is more than 12%.
Drawings
FIG. 1 is a metallographic structure diagram of a copper alloy material obtained in example 1 after hot rolling in a method for producing a novel high-performance Cu-Hf-RE alloy according to the present invention;
FIG. 2 is a transmission electron microscope image of the copper alloy material obtained in example 3 after aging in the preparation method of the novel high-performance Cu-Hf-RE alloy of the present invention, wherein (a) is a bright field and (b) is a dark field;
FIG. 3 is a tensile stress-strain curve of the copper alloy material obtained in example 4 of the method for preparing a novel high performance Cu-Hf-RE alloy of the present invention.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.
The invention provides a novel high-performance Cu-Hf-RE alloy, which comprises 0.1-1.5 wt.% Hf, 0.04-0.2 wt.% RE and the balance of Cu in percentage by mass, wherein the sum of all components is 100%;
the Cu raw material is oxygen-free Cu; the Hf raw material is preferably Cu-Hf intermediate alloy, and the Hf content in the Cu-Hf intermediate alloy is between 4 wt.% and 8 wt.%; the rare earth element RE raw material is preferably Cu-RE intermediate alloy, RE elements comprise Ce, Y, Sc, La and the like, and the RE element content in the Cu-RE intermediate alloy is 1-10 wt.%.
The Cu-Hf intermediate alloy and the Cu-RE intermediate alloy adopted by the invention are prepared by vacuum induction melting of oxygen-free Cu, pure Hf and pure RE elements, the melting temperature is 1200-1400 ℃, and the vacuum degree is 5 multiplied by 10 -3 Pa, and the smelting process is protected by argon.
The content of Hf element in the Cu-Hf-RE alloy is 0.1-1.5 wt.%; the RE element content in the Cu-Hf-RE alloy is 0.04 wt.% to 0.2 wt.%;
the invention also provides a preparation method of the novel high-performance Cu-Hf-RE alloy, and the copper alloy with excellent comprehensive performance is prepared through fusion casting, homogenization treatment, hot rolling, solid solution, single-stage aging and multi-stage aging.
Example 1
In the embodiment, the Cu-Hf alloy material comprises the following alloy components in percentage by mass: 0.9 wt.%; the balance being Cu; wherein the Hf element is provided by a Cu-Hf alloy.
The preparation method of the Cu-0.9 wt.% Hf alloy material of the present embodiment sequentially includes the following steps:
step 1, vacuum induction melting: the prepared oxygen-free copper and Cu-Hf intermediate alloy are subjected to induction melting in a graphite crucible, and the vacuum degree requirement reaches 5 multiplied by 10 -3 Pa, and the smelting process is protected by argon. The smelting temperature is 1300 ℃, and finally, the molten metal is cast in a copper mold to obtain a cast ingot;
step 3, hot rolling: carrying out hot rolling deformation on the sample subjected to homogenization treatment in the step 2 at 900 ℃, wherein the total hot rolling deformation is 90%;
solid solution: carrying out solid solution treatment on a sample obtained by hot rolling, wherein the solid solution temperature is 900 ℃, the solid solution time is 1h, and then carrying out water quenching treatment;
The Cu-0.9 wt.% Hf alloy plate obtained in this example had a room temperature tensile strength of 450MPa, an electrical conductivity of 84.1% IACS, a hardness of 146HBW, a post fracture elongation of 16%, and a softening temperature of 580 ℃.
FIG. 1 shows a hot-rolled metallographic structure obtained in step 3 of example 1.
Example 2
In the embodiment, the Cu-Hf alloy material comprises the following alloy components in percentage by mass: 0.9 wt.%; the balance being Cu; wherein the Hf element is provided by a Cu-Hf intermediate alloy.
The preparation method of the Cu-0.9 wt.% Hf alloy material of the present embodiment sequentially includes the following steps:
step 1, vacuum induction melting: the prepared oxygen-free copper and Cu-Hf intermediate alloy are subjected to induction melting in a graphite crucible, and the vacuum degree requirement reaches 5 multiplied by 10 -3 Pa, and the smelting process is protected by argon. The smelting temperature is 1300 ℃, and finally, the molten metal is cast in a copper mold to obtain a cast ingot;
step 3, hot rolling: carrying out hot rolling deformation on the sample subjected to homogenization treatment in the step 2 at 900 ℃, wherein the total hot rolling deformation is 50%;
solid solution: carrying out solid solution treatment on a sample obtained by hot rolling, wherein the solid solution temperature is 900 ℃, the solid solution time is 1h, and then carrying out water quenching treatment;
primary aging: carrying out aging treatment on a sample obtained by cold rolling, wherein the aging temperature is 500 ℃, and the aging time is 2 h;
secondary cold rolling: carrying out cold rolling deformation on the primary aging sample again, wherein the secondary cold rolling deformation is 50%;
secondary aging: and (4) carrying out aging treatment on the sample obtained by secondary cold rolling again, wherein the secondary aging temperature is 450 ℃, and the secondary aging time is 1.5 h.
The Cu-0.9 wt.% Hf alloy plate obtained in this example had a room temperature tensile strength of 520MPa, an electrical conductivity of 82.7% IACS, a hardness of 176HBW, a elongation after fracture of 15%, and a softening temperature of 580 ℃.
Example 3
In the embodiment of the Cu-Hf-Ce alloy material, the alloy component is Hf: 0.9 wt.%; ce: 0.1 wt.%; the balance being Cu; wherein, Hf element is provided by Cu-Hf alloy, Ce element is provided by Cu-Ce alloy;
the preparation method of the Cu-0.9 wt.% Hf-0.1 wt.% Ce alloy material of the embodiment sequentially includes the following steps:
step 1, vacuum induction melting: the prepared oxygen-free copper, Cu-Hf intermediate alloy and Cu-Ce intermediate alloy are subjected to vacuum induction melting in a graphite crucible, and the vacuum degree is required to reach 5 multiplied by 10 -3 Pa, and the smelting process is protected by argon. The smelting temperature is 1300 ℃, and finally, the molten metal is cast in a copper mold to obtain a cast ingot;
step 3, hot rolling: carrying out hot rolling deformation on the sample subjected to homogenization treatment in the step 2 at 900 ℃, wherein the total hot rolling deformation is 50%;
solid solution: carrying out solid solution treatment on a sample obtained by hot rolling, wherein the solid solution temperature is 900 ℃, the solid solution time is 1h, and then carrying out water quenching treatment;
primary aging: carrying out aging treatment on the sample obtained by cold rolling in the step (5), wherein the aging temperature is 500 ℃, and the aging time is 2 h;
secondary cold rolling: carrying out cold rolling deformation on the primary aging sample again, wherein the secondary cold rolling deformation is 50%;
secondary aging: and (4) carrying out aging treatment on the sample obtained by secondary cold rolling again, wherein the secondary aging temperature is 450 ℃, and the aging time is 1.5 h.
The Cu-0.9 wt.% Hf-0.1 wt.% Ce alloy sheet obtained in this example had a room temperature tensile strength of 566MPa, an electrical conductivity of 81.5% IACS, a hardness of 187HBW, a post-fracture elongation of 15%, a softening temperature of 580 ℃, and a tensile strength of 270MPa obtained by high temperature drawing at 500 ℃.
FIG. 2 is a transmission electron microscope structure of the alloy material after the secondary aging in example 3, and it can be seen that the size of the precipitated phase is between 1 nm and 10 nm.
Example 4
In the embodiment of the Cu-Hf-Sc alloy material, the alloy component is Hf: 0.9 wt.%; and (C) Sc: 0.1 wt.%; the balance being Cu; wherein the Hf element is provided by Cu-Hf alloy, and the Sc element is provided by Cu-Sc alloy.
The preparation method of the Cu-0.9 wt.% Hf-0.1 wt.% Sc alloy material of the embodiment sequentially includes the following steps:
step 1, vacuum induction melting: the prepared oxygen-free copper, Cu-Hf intermediate alloy and Cu-Sc intermediate alloy are subjected to vacuum induction melting in a graphite crucible, and the vacuum degree is required to reach 5 multiplied by 10 -3 Pa, and the smelting process is protected by argon. The smelting temperature is 1300 ℃, and finally, the molten metal is cast in a copper mold to obtain a cast ingot;
step 3, hot rolling: carrying out hot rolling deformation on the sample subjected to homogenization treatment in the step 2 at 900 ℃, wherein the total hot rolling deformation is 50%;
solid solution: carrying out solid solution treatment on a sample obtained by hot rolling in a vacuum tube furnace, wherein the solid solution temperature is 900 ℃, the solid solution time is 1h, and then carrying out water quenching treatment;
primary aging: carrying out aging treatment on a sample obtained by cold rolling, wherein the primary aging temperature is 500 ℃, and the primary aging time is 2 h;
secondary cold rolling: carrying out cold rolling deformation on the primary aging sample again, wherein the secondary cold rolling deformation is 50%;
secondary aging: and (4) carrying out aging treatment on the sample obtained by secondary cold rolling again, wherein the secondary aging temperature is 400 ℃, and the secondary aging time is 3 h.
The Cu-0.9 wt.% Hf-0.1 wt.% Sc alloy plate obtained in this example had a room temperature tensile strength of 594MPa, an electrical conductivity of 80.1% IACS, a hardness of 191HBW, a tensile elongation after fracture of 15%, a softening temperature of 590 ℃, and a tensile strength of 275MPa in high temperature stretching at 500 ℃.
FIG. 3 is the tensile curve obtained after the secondary aging of example 4, and it can be seen that example 4 provides a Cu-Hf-Sc copper alloy material with high strength and high elongation.
Example 5
In the embodiment, the Cu-Hf-Y alloy material comprises the following alloy components in percentage by mass: 0.9 wt.%; y: 0.1 wt.%; the balance being Cu; wherein the Hf element is provided by a Cu-Hf alloy, and the Y element is provided by a Cu-Y alloy.
The preparation method of the Cu-0.9 wt.% Hf-0.1 wt.% Y alloy material of the embodiment sequentially includes the following steps:
step 1, vacuum induction melting: the prepared oxygen-free copper, Cu-Hf intermediate alloy and Cu-Y intermediate alloy are subjected to induction melting in a graphite crucible, and the vacuum degree is required to reach 5 multiplied by 10 -3 Pa, and the smelting process is protected by argon. The smelting temperature is 1300 ℃, and finally, the molten metal is cast in a copper mold to obtain a cast ingot;
step 3, hot rolling: carrying out hot rolling deformation on the sample subjected to homogenization treatment in the step 2 at 900 ℃, wherein the total hot rolling deformation is 50%;
solid solution: carrying out solid solution treatment on a sample obtained by hot rolling, wherein the solid solution temperature is 900 ℃, the solid solution time is 2h, and then carrying out water quenching treatment;
primary aging: carrying out aging treatment on a sample obtained by primary cold rolling, wherein the primary aging temperature is 500 ℃, and the primary aging time is 2 h;
secondary cold rolling: carrying out cold rolling deformation on the primary aging sample again, wherein the secondary cold rolling deformation is 50%;
secondary aging: and (3) carrying out aging treatment on the sample obtained by secondary cold rolling again, wherein the secondary aging temperature is 500 ℃, and the secondary aging time is 2 h.
The Cu-0.9 wt.% Hf-0.1 wt.% Y alloy sheet obtained in this example had a tensile strength at room temperature of 553MPa, an electrical conductivity of 83.0% IACS, a hardness of 185HBW, an elongation after fracture of 13.7%, a softening temperature of 580 ℃, and a tensile strength at 500 ℃ high temperature tensile of 253 MPa.
The above embodiments are part of the detailed description of the invention, but the embodiments of the invention are not limited thereto, and suitable composition adjustment and improvement can be made without departing from the scope of the alloy composition and the mechanical heat treatment process proposed by the invention, but all should be considered as falling within the scope of the claims filed by the present invention.
Claims (9)
1. The novel high-performance Cu-Hf-RE alloy is characterized by comprising 0.1-1.5 wt.% Hf and 0.04-0.2 wt.% RE in percentage by mass, wherein the RE is a rare earth element, the balance is Cu, and the sum of the components is 100%.
2. The novel high performance Cu-Hf-RE alloy as claimed in claim 1, wherein the Hf element is introduced as pure Hf or Cu-Hf alloy, the RE element is introduced as pure RE or Cu-RE alloy, and the rare earth element is La, Ce, Y or Sc.
3. The novel high performance Cu-Hf-RE alloy according to claim 2, wherein the Cu raw material is oxygen-free Cu.
4. A preparation method of a novel high-performance Cu-Hf-RE alloy is characterized by comprising the following steps:
step 1, weighing 0.1-1.5 wt.% Hf, 0.04-0.2 wt.% RE and the balance Cu according to the mass percentage, smelting and casting into ingots, wherein the sum of the components is 100%;
step 2, homogenizing the cast ingot obtained in the step 1;
step 3, carrying out thermal deformation and solid solution treatment on the sample obtained in the step 2;
and 4, carrying out thermomechanical treatment on the solid solution sample obtained in the step 3.
5. The preparation method of the novel high-performance Cu-Hf-RE alloy according to claim 4, wherein the smelting temperature in the step 1 is 1200-1400 ℃, and casting is carried out after heat preservation for 5-30 min after melting.
6. The preparation method of the novel high-performance Cu-Hf-RE alloy according to claim 4, wherein the homogenization temperature in step 2 is 800-980 ℃ and the homogenization time is 0.5-3 h.
7. The preparation method of the novel high-performance Cu-Hf-RE alloy according to claim 4, wherein the thermal deformation temperature in step 3 is 850-950 ℃, and the thermal deformation amount is 20-90%.
8. The preparation method of the novel high-performance Cu-Hf-RE alloy according to claim 4, wherein in the step 3, the solid solution temperature is 800-980 ℃, the solid solution time is 0.5-3 h, and the alloy is rapidly cooled after solid solution.
9. The method for preparing the novel high-performance Cu-Hf-RE alloy according to claim 4, wherein the temperature of the thermomechanical treatment in step 4 is 300-600 ℃, the heat treatment time is 0.5-3 h, and the deformation is 0-90%.
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| CN115747557A (en) * | 2022-10-31 | 2023-03-07 | 西安理工大学 | HfB 2 Cu- (Hf) copper-based composite material and preparation method thereof |
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