CN114958261B - Modified epoxy bridge deck ultra-thin material interface binder and preparation method thereof - Google Patents
Modified epoxy bridge deck ultra-thin material interface binder and preparation method thereof Download PDFInfo
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- CN114958261B CN114958261B CN202110773539.0A CN202110773539A CN114958261B CN 114958261 B CN114958261 B CN 114958261B CN 202110773539 A CN202110773539 A CN 202110773539A CN 114958261 B CN114958261 B CN 114958261B
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- 239000004593 Epoxy Substances 0.000 title claims abstract description 58
- 238000002360 preparation method Methods 0.000 title claims abstract description 31
- 239000000463 material Substances 0.000 title claims abstract description 26
- 239000011230 binding agent Substances 0.000 title claims abstract description 9
- 230000001070 adhesive effect Effects 0.000 claims abstract description 41
- 239000004952 Polyamide Substances 0.000 claims abstract description 40
- 229920002647 polyamide Polymers 0.000 claims abstract description 40
- 239000000853 adhesive Substances 0.000 claims abstract description 39
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000010703 silicon Substances 0.000 claims abstract description 24
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 24
- 239000002994 raw material Substances 0.000 claims abstract description 23
- 239000000126 substance Substances 0.000 claims abstract description 14
- 239000007822 coupling agent Substances 0.000 claims abstract description 13
- 150000004705 aldimines Chemical class 0.000 claims abstract description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 46
- 239000003822 epoxy resin Substances 0.000 claims description 29
- 229920000647 polyepoxide Polymers 0.000 claims description 29
- 239000000843 powder Substances 0.000 claims description 27
- 239000002245 particle Substances 0.000 claims description 18
- 239000003085 diluting agent Substances 0.000 claims description 14
- 239000013008 thixotropic agent Substances 0.000 claims description 13
- 239000012745 toughening agent Substances 0.000 claims description 13
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 claims description 12
- YSUQLAYJZDEMOT-UHFFFAOYSA-N 2-(butoxymethyl)oxirane Chemical compound CCCCOCC1CO1 YSUQLAYJZDEMOT-UHFFFAOYSA-N 0.000 claims description 11
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical group CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 claims description 11
- 238000007599 discharging Methods 0.000 claims description 10
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical group CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 9
- 239000003963 antioxidant agent Substances 0.000 claims description 8
- 230000003078 antioxidant effect Effects 0.000 claims description 8
- 238000006243 chemical reaction Methods 0.000 claims description 8
- 239000005543 nano-size silicon particle Substances 0.000 claims description 8
- 235000012239 silicon dioxide Nutrition 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 7
- XKZQKPRCPNGNFR-UHFFFAOYSA-N 2-(3-hydroxyphenyl)phenol Chemical group OC1=CC=CC(C=2C(=CC=CC=2)O)=C1 XKZQKPRCPNGNFR-UHFFFAOYSA-N 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 6
- 239000001294 propane Substances 0.000 claims description 6
- 238000003756 stirring Methods 0.000 claims description 6
- 238000002156 mixing Methods 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 6
- 238000001035 drying Methods 0.000 abstract description 4
- 238000005260 corrosion Methods 0.000 abstract description 3
- YJTKZCDBKVTVBY-UHFFFAOYSA-N 1,3-Diphenylbenzene Chemical group C1=CC=CC=C1C1=CC=CC(C=2C=CC=CC=2)=C1 YJTKZCDBKVTVBY-UHFFFAOYSA-N 0.000 abstract description 2
- 239000012752 auxiliary agent Substances 0.000 abstract description 2
- 230000007797 corrosion Effects 0.000 abstract description 2
- 230000007613 environmental effect Effects 0.000 abstract description 2
- 229920002521 macromolecule Polymers 0.000 abstract description 2
- 239000000377 silicon dioxide Substances 0.000 description 15
- 239000011384 asphalt concrete Substances 0.000 description 8
- 239000004567 concrete Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 6
- 238000011056 performance test Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- QNYBOILAKBSWFG-UHFFFAOYSA-N 2-(phenylmethoxymethyl)oxirane Chemical compound C1OC1COCC1=CC=CC=C1 QNYBOILAKBSWFG-UHFFFAOYSA-N 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- -1 alkyl glycidyl ether Chemical compound 0.000 description 3
- 238000013329 compounding Methods 0.000 description 3
- 238000010276 construction Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 239000002671 adjuvant Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000036571 hydration Effects 0.000 description 1
- 238000006703 hydration reaction Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910021487 silica fume Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/44—Amides
- C08G59/46—Amides together with other curing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
- C08G59/623—Aminophenols
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
Abstract
The invention belongs to the field of C09J163/00 macromolecules, and particularly relates to a modified epoxy bridge deck ultra-thin material interface binder and a preparation method thereof. The modified epoxy bridge deck ultra-thin material interface adhesive comprises a preparation raw material comprising a component A and a component B; the preparation raw materials of the component A at least comprise: epoxy substances, silicon micropowder and auxiliary agents; the preparation raw materials of the component B at least comprise aldimine, polyamide and a coupling agent. The adhesive prepared by the invention not only has good adhesive property, but also plays roles of water resistance and corrosion resistance; the adhesive prepared by the invention can still be operated and constructed under rainy and watery conditions, and the interface drying treatment is not needed, so that the current situation that rainy and watery cannot be performed is solved; the adhesive prepared by the invention realizes the aim of safety, environmental protection and no national regulations for prohibiting triphenyl monoaldehyde.
Description
Technical Field
The invention belongs to the field of C09J163/00 macromolecules, and particularly relates to a modified epoxy bridge deck ultra-thin material interface binder and a preparation method thereof.
Background
The epoxy resin belongs to an oil-soluble polymer, has strong adhesive force, excellent performance and wide application, and plays an indispensable role in national economy production and life. However, the adhesive has more defects such as high rigidity and high stress shrinkage brittleness, and more importantly, the adhesive is difficult to achieve in a wet environment under the condition of no special modification. Along with the strong development of national economy, the expressway construction of over twenty years in China is rapid, and the path length is the first in the world, and the invention mainly aims at expressway bridge floors, tunnels and urban overhead bridge floors, and in order to reduce bridge loads, the surface asphalt concrete and old and new concrete are paved on the surfaces by adopting two materials of ultrathin asphalt concrete or concrete paved on the surfaces (10-15 mm thick). Because the paving bottom base surface is a box girder concrete body, the ultrathin material is paved on the surface, a layer of adhesive is coated on two interfaces, and the paving bottom base surface is required to be firmly adhered, and the paving bottom base surface also needs to carry out water operation if the paving bottom base surface is paved with concrete, and has the waterproof and anti-corrosion effects.
In the past, a non-epoxy ultrathin paving adhesive is generally adopted in engineering, the service life of the paving adhesive is short, local delamination quickly spreads over a large area and is broken into blocks to fall off once the vehicle runs and shakes, endless trouble is brought to constructors and maintenance units, the surface of the paving adhesive must be repaired as soon as possible after broken, otherwise, the paving adhesive causes traffic limitation, traffic jam, potential safety hazard and economic loss, and the paving adhesive is repeatedly maintained, so that the engineering is hopefully provided with an interface adhesive which is high in efficiency and can be firmly adhered.
Disclosure of Invention
In order to solve the technical problems, the interface epoxy adhesive well solves the problems, is simple to operate, low in cost, quick and convenient, long in service life, and can be used for paving asphalt concrete or concrete under the wet and watery condition, and is highly accepted by the engineering industry at present.
The first aspect of the invention provides a modified epoxy bridge deck ultra-thin material interface adhesive, which is prepared from the raw materials of A component and B component; the preparation raw materials of the component A at least comprise: epoxy substances, silicon micropowder and auxiliary agents; the preparation raw materials of the component B at least comprise aldimine, polyamide and a coupling agent.
In some preferred embodiments, the epoxy-based material includes an epoxy resin, an epoxy diluent, and an epoxy toughening agent.
Preferably, the epoxy resin has an epoxy value of 0.45-0.75Eq/100g; preferably, the epoxy value of the epoxy resin is 0.55-0.56 Eq/100g.
In the experimental process, the applicant finds that the fluidity and the stability of the epoxy resin in the system are greatly influenced as the epoxy resin with different epoxy values is added into the system, and the applicant discovers through a large number of creative experiments that in the system, the epoxy resin with the selected epoxy value of 0.55-0.56 Eq/100g can realize better pavement effect on the asphalt concrete surface, and the applicant speculates that the reason for the phenomenon is as follows: the epoxy resin has different molecular chain segments and different viscosities, so that different effects are caused on the mixing effect of epoxy substances, when the epoxy value is 0.55-0.56 Eq/100g, the epoxy resin can reduce the mixing resistance of an epoxy diluent and a system, further promote the adhesion of silica powder in a system, enhance the construction feasibility of the epoxy resin when the epoxy resin is used for asphalt concrete surface, and improve the adhesion and viscosity of a surface layer, and the paving effect of paving materials.
In some preferred embodiments, the epoxy diluent is an epoxy reactive diluent; the epoxy reactive diluent is at least one selected from benzyl glycidyl ether, n-butyl glycidyl ether and alkyl glycidyl ether.
In the system, the addition of the epoxy reactive diluent not only plays a role in dilution, but also can enhance the toughness of the colloid, and as a preferable technical scheme, the epoxy reactive diluent is benzyl glycidyl ether 692.
Benzyl glycidyl ether 692, cas:89616-40-0;
as a preferred technical scheme, the epoxy reactive diluent is 501 n-butyl glycidyl ether.
501 n-butyl glycidyl ether, CAS:2426-08-6, the structural formula is:
as a preferable technical scheme, the epoxy reactive diluent is 748C 12-C14 alkyl glycidyl ether.
748C 12-C14 alkyl glycidyl ethers, CAS:68609-97-2.
In some preferred embodiments, the epoxy toughening agent is selected from at least one of diphenol propane, 4' -dihydroxydiphenyl sulfone.
In order to further reduce the production cost and improve the scratch resistance and chemical stability of the prepared adhesive, the applicant has found through a great deal of creative experimental researches that the addition of the silica micropowder into the system can greatly improve the water resistance and the anti-friction performance of the adhesive.
In some preferred embodiments, the silica micropowder has a particle size of 200-2000 mesh; further preferably, the particle size of the silica micropowder is 400-800 mesh.
Further preferably, the particle size of the silica fine powder is 600 mesh.
Through a great deal of creative experimental researches of the applicant, the particle size of the silica micropowder added into the system has great influence on the performance of the prepared adhesive, and when the particle size of the silica micropowder is 200-2000 meshes, preferably, when the particle size of the silica micropowder is 400-800 meshes, the prepared adhesive can be ensured to have excellent bending strength and splitting tensile strength, and the reason why the phenomenon appears is presumed to be probably that: in the system, along with the addition of the silica powder, the silica powder is dispersed in a long-chain structure formed in the epoxy substances when the particle size is 400-800 meshes due to the higher specific surface area and surface smoothness of the surface, a communicating bridge structure is formed between the epoxy substances, friction force between the substances is weakened, when the silica powder is subjected to bending or external force stretching, the external force can be rapidly dispersed in a state that molecules are mutually communicated, the phenomenon of cracking of a glue layer caused by stress concentration when the silica powder is subjected to the external force is avoided, and further, the reduction of the binding capacity when the silica powder is used in asphalt concrete is avoided.
In some preferred embodiments, the weight of the silica fume is 40 to 80wt% of the weight of the epoxy resin.
Further preferably, the weight of the silicon micropowder is 75wt% of the weight of the epoxy resin.
In the experimental process, the applicant finds that the addition of the silicon micro powder greatly changes the performance of the adhesive, but the addition of the silicon micro powder has great influence on the system, and the applicant finds that in the system, when the weight of the silicon micro powder is 40-80wt% of the weight of the epoxy resin, particularly when the weight of the silicon micro powder is 75wt% of the weight of the epoxy resin, the shrinkage rate of the asphalt concrete surface layer pavement can be reduced, the forward pull bonding strength and stability of the steel-concrete are improved, and the applicant speculates that the phenomenon occurs: in the system, the adding amount of the silicon micro powder can improve the attaching performance among substances within a certain range, but as the adding amount of the silicon micro powder is increased, the van der Waals acting force among particles is enhanced due to the higher specific surface area, the collision frequency among the particles is greatly increased, the phenomenon that the particles are agglomerated in epoxy resin is caused, the stability of the system is further affected, when the system is used for bonding between steel and concrete, the internal defect of an adhesive layer is caused, and the forward pulling bonding strength of the steel-concrete is greatly reduced.
In some preferred embodiments, the adjuvant comprises at least: modifier, thixotropic agent and antioxidant.
In some preferred embodiments, the modifying agent is a silane coupling agent.
In some preferred embodiments, the silane coupling agent is gamma-aminopropyl triethoxysilane and/or gamma-glycidyl ether propyl trimethoxysilane.
In some preferred embodiments, the thixotropic agent is nanosilica.
In some preferred embodiments, the antioxidant is antioxidant 1010, cas:6683-19-8.
In some preferred embodiments, the polyamide is a 650 low molecular polyamide and/or a 500 low molecular polyamide.
The type of polyamide to be added is selected in the present application based on the actual production requirements, and the type of polyamide to be added is selected in the actual production according to the viscosity of the adhesive to be prepared or the environment of use.
In some preferred embodiments, the polyamides are 650 low molecular polyamides and 500 low molecular polyamides.
In some preferred embodiments, the weight ratio of 650 low molecular polyamide to 500 low molecular polyamide is 1: 5-5: 1.
further preferably, the weight ratio of 650 low molecular polyamide to 500 low molecular polyamide is 1:3.
during the experimental process, the applicant found that the choice of the type of polyamide has a certain influence on the curing effect of the A-component, and when the polyamide is 650 low molecular polyamide and 500 low molecular polyamide, and ensures that the weight ratio thereof is 1:3, the initial setting time of 20 ℃ can be ensured to be less than 3 hours, no bubble or blushing phenomenon occurs in the curing process, and the applicant speculates that the reason for the occurrence of the phenomenon may be: the weight ratio of 650 low molecular polyamide to 500 low molecular polyamide is 1:3 can greatly change the thickness of a hydration layer in the system, further change the compatibility between the epoxy resin and the epoxy resin when the epoxy resin is used for curing the A-component epoxy resin, promote the strong interaction between epoxy groups, form a cured three-dimensional network structure on the surface of asphalt concrete and the like, and improve the bonding strength when in use.
In addition, the applicant found that the amount of 650 low molecular polyamide and 500 low molecular polyamide added greatly influences the interaction force seen by the system materials, and further influences the stability of the formed network structure, and influences the bonding strength.
In some preferred embodiments, the preparation raw materials of the component B further comprise a toughening agent, silica micropowder and thixotropic agent.
In some preferred embodiments, the aldimine is one of ethylenediamine-formaldehyde-phenol condensate and/or triethylenetetramine-formaldehyde-phenol condensate.
In some preferred embodiments, the preparation raw materials of the component a comprise, in parts by weight:
in some preferred embodiments, the preparation raw materials of the component B comprise, in parts by weight:
the second aspect of the invention provides a preparation method of a modified epoxy bridge deck ultra-thin material interface adhesive, which comprises the following steps:
s1: and (3) preparing a component A: adding epoxy substances into a reaction kettle, heating to 60-90 ℃ for reaction for 1-2 hours, cooling to below 40 ℃ and discharging, adding into a dispersing machine, then adding other preparation raw materials of the component A, dispersing, stirring for 20-60 minutes, and discharging;
s2: and (3) preparing a component B: adding aldimine and polyamide into a reaction kettle, heating to 40-70 ℃, reacting for 20-60 minutes, heating to 70-90 ℃, reacting for 1-3 hours, cooling to below 40 ℃, adding the discharged materials into a high-speed dispersing machine, adding other preparation raw materials of the component B, dispersing, stirring for 20-60 minutes, and discharging;
s3: and mixing the prepared component A and the prepared component B for use.
In some preferred embodiments, in step S3, the weight ratio of the a component to the B component is 10:1 to 1:10.
further preferably, when the adhesive is used, the weight ratio of the component A to the component B is 10:3.
the beneficial effects are that: the adhesive prepared by the invention has the following advantages:
1. the adhesive prepared by the invention not only has good adhesive property, but also plays roles of water resistance and corrosion resistance;
2. the adhesive prepared by the invention can still be operated and constructed under rainy and watery conditions, and the interface drying treatment is not needed, so that the current situation that rainy and watery cannot be performed is solved;
3. the adhesive prepared by the invention can greatly save construction cost, shorten the limited operation period and reduce potential safety hazard in the use process;
4. the adhesive prepared by the invention realizes the aim of safety, environmental protection and no national statute prohibition of triphenyl monoaldehyde;
5. the adhesive prepared by the invention meets the GB/50728-2011 requirement.
Detailed Description
Example 1
A modified epoxy bridge deck ultra-thin material interface binder comprises a component A and a component B;
the preparation raw materials of the component A comprise the following components in parts by weight:
the epoxy value of the epoxy resin is 0.55-0.56 Eq/100g, and the resin with the trade mark of 128 is purchased from Baling petrochemical epoxy resin general factories.
The epoxy reactive diluent is 501 n-butyl glycidyl ether, CAS:2426-08-6, the structural formula is:
the epoxy toughening agent is diphenol propane, which is purchased from Shandong Kepler biotechnology Co., ltd;
the coupling agent is gamma-aminopropyl triethoxysilane;
the particle size of the silicon micro powder is 600 meshes, and the silicon micro powder is purchased from Jiangsu Longjing novel material limited company;
the thixotropic agent is nano silicon dioxide;
the antioxidant is antioxidant 1010, CAS:6683-19-8.
The preparation raw materials of the component B comprise the following components in parts by weight:
the aldimine is an ethylenediamine-formaldehyde-phenol condensate, and is purchased from Anhui Huangshan Tian and Jian industry Limited company;
the polyamide is 650 low molecular polyamide and 500 low molecular polyamide, and the weight ratio of the polyamide to the 500 low molecular polyamide is 1:3, purchasing tin-free long drying chemical company;
the toughening agent is purchased from Beijing Jin Daoji Material Co., ltd;
the coupling agent is gamma-aminopropyl triethoxysilane;
the particle size of the silicon micro powder is 600 meshes, and the silicon micro powder is purchased from Jiangsu Longjing novel material limited company;
the thixotropic agent is nano silicon dioxide.
The preparation method of the modified epoxy bridge deck ultra-thin interface adhesive comprises the following steps:
s1: and (3) preparing a component A: weighing epoxy resin, epoxy reactive diluent and epoxy toughening agent, adding into a reaction kettle, heating to 80 ℃, reacting for 1.5 hours at the temperature, then cooling to 35 ℃, discharging, adding into a high-speed dispersing machine, adding coupling agent and silica micropowder, dispersing at a high speed of 1000 rpm for 30min, adding thixotropic agent and antioxidant, dispersing and stirring at a rotating speed of 1000 rpm for 30min, and discharging;
s2: and (3) preparing a component B: adding aldimine, polyamide, a toughening agent and a coupling agent into a reaction kettle, heating to 60 ℃, reacting for 40min, heating to 80 ℃, reacting for 1.5h, cooling to 35 ℃, discharging, adding the coupling agent and silicon micropowder into a high-speed dispersing machine, dispersing at high speed for 30min under the condition of 1000 revolutions per min, adding the thixotropic agent, dispersing and stirring for 30min, and discharging;
s3: mixing the component A and the component B.
In the step S3, when the adhesive is used, the weight ratio of the component A to the component B is 10:3.
example 2
A modified epoxy bridge deck ultra-thin material interface binder comprises a component A and a component B;
the preparation raw materials of the component A comprise the following components in parts by weight:
the epoxy value of the epoxy resin is 0.55-0.56 Eq/100g, and the resin with the trade mark of 128 is purchased from Baling petrochemical epoxy resin general factories.
The epoxy toughening agent is diphenol propane, which is purchased from Shandong Kepler biotechnology Co., ltd;
the coupling agent is gamma-aminopropyl triethoxysilane;
the particle size of the silicon micro powder is 600 meshes, and the silicon micro powder is purchased from Jiangsu Longjing novel material limited company;
the thixotropic agent is nano silicon dioxide;
the antioxidant is antioxidant 1010, CAS:6683-19-8.
The preparation raw materials of the component B comprise the following components in parts by weight:
the aldimine is an ethylenediamine-formaldehyde-phenol condensate, and is purchased from Anhui Huangshan Tian and Jian industry Limited company;
the polyamide is 650 low molecular polyamide and 500 low molecular polyamide, and the weight ratio of the polyamide to the 500 low molecular polyamide is 1:3, purchasing tin-free long drying chemical company;
the toughening agent is purchased from Beijing Jin Daoji Material Co., ltd;
the coupling agent is gamma-aminopropyl triethoxysilane;
the particle size of the silicon micro powder is 600 meshes, and the silicon micro powder is purchased from Jiangsu Longjing novel material limited company;
the thixotropic agent is nano silicon dioxide.
A preparation method of a modified epoxy bridge deck ultra-thin interface adhesive refers to example 1.
Meanwhile, a compounding ratio of the A component and the B component is exemplified in example 1.
Example 3
A modified epoxy bridge deck ultra-thin material interface binder comprises a component A and a component B;
the preparation raw materials of the component A comprise the following components in parts by weight:
the epoxy value of the epoxy resin is 0.55-0.56 Eq/100g, and the resin with the mark of 128 is purchased from Shandong Chuang chemical industry Co.
The epoxy reactive diluent is 501 n-butyl glycidyl ether, CAS:2426-08-6, the structural formula is:
the epoxy toughening agent is diphenol propane, which is purchased from Shandong Kepler biotechnology Co., ltd;
the coupling agent is gamma-aminopropyl triethoxysilane;
the particle size of the silicon micro powder is 200 meshes, and the silicon micro powder is purchased from Jiangsu Longjing novel material limited company;
the thixotropic agent is nano silicon dioxide;
the antioxidant is antioxidant 1010, CAS:6683-19-8.
The kind and parts by weight of the preparation raw materials of the B component are referred to in example 1.
A preparation method of a modified epoxy bridge deck ultra-thin interface adhesive refers to example 1.
Meanwhile, a compounding ratio of the A component and the B component is exemplified in example 1.
Example 4
A modified epoxy bridge deck ultra-thin material interface binder comprises a component A and a component B;
the preparation raw materials of the component A comprise the following components in parts by weight:
the epoxy value of the epoxy resin is 0.55-0.56 Eq/100g, and the resin with the trade mark of 128 is purchased from Baling petrochemical epoxy resin general factories.
The epoxy reactive diluent is 501 n-butyl glycidyl ether, CAS:2426-08-6, the structural formula is:
the epoxy toughening agent is diphenol propane, which is purchased from Shandong Kepler biotechnology Co., ltd;
the coupling agent is gamma-aminopropyl triethoxysilane;
the particle size of the silicon micro powder is 600 meshes, and the silicon micro powder is purchased from Jiangsu Longjing novel material limited company;
the thixotropic agent is nano silicon dioxide;
the antioxidant is antioxidant 1010, CAS:6683-19-8.
The kind and parts by weight of the preparation raw materials of the B component are referred to in example 1.
A preparation method of a modified epoxy bridge deck ultra-thin interface adhesive refers to example 1.
Meanwhile, a compounding ratio of the A component and the B component is exemplified in example 1.
Performance test:
the adhesive prepared in example 1 was subjected to physical and chemical index test, and the specific results are shown in Table 1 below.
Table 1:
the adhesive prepared in example 1 was mixed and then subjected to the following performance test, and the test results were recorded in the following table 2:
table 2:
the performance test data show that the performance test results of the adhesive prepared by the scheme of the application under the condition of carrying water or not carrying water exceed the reference standard, and the performance is greatly improved.
3. The adhesives prepared in examples 2-4 were used for flexural strength testing, test methods were referenced to the standards and methods in performance test 2, and the test results were recorded in table 3 below.
Table 3:
| experiment | Flexural Strength (MPa) |
| Example 2 | 20 |
| Example 3 | 21 |
| Example 4 | 19 |
Claims (2)
1. The modified epoxy bridge deck ultra-thin material interface binder is characterized by comprising a component A and a component B;
the preparation raw materials of the component A comprise the following components in parts by weight:
the component A comprises the following components: the epoxy value of the epoxy resin is 0.55-0.56 Eq/100g;
the epoxy reactive diluent is 501 n-butyl glycidyl ether;
the epoxy toughening agent is diphenol propane;
the coupling agent is gamma-aminopropyl triethoxysilane;
the particle size of the silicon micro powder is 600 meshes;
the thixotropic agent is nano silicon dioxide;
the antioxidant is antioxidant 1010;
the preparation raw materials of the component B comprise the following components in parts by weight:
the component B comprises the following components: the aldimine is ethylenediamine-formaldehyde-phenol condensate;
the polyamide is 650 low molecular polyamide and 500 low molecular polyamide, and the weight ratio of the polyamide to the 500 low molecular polyamide is 1:3, a step of;
the toughening agent is purchased from Beijing Jin Daoji Material Co., ltd;
the coupling agent is gamma-aminopropyl triethoxysilane;
the particle size of the silicon micro powder is 600 meshes;
the thixotropic agent is nano silicon dioxide.
2. A method for preparing the modified epoxy bridge deck ultra-thin material interface adhesive according to claim 1, which is characterized by comprising the following steps:
s1: and (3) preparing a component A: adding epoxy substances into a reaction kettle, heating to 60-90 ℃ for reaction for 1-2 hours, cooling to below 40 ℃ and discharging, adding into a dispersing machine, then adding other preparation raw materials of the component A, dispersing, stirring for 20-60 minutes, and discharging;
s2: and (3) preparing a component B: adding aldimine and polyamide into a reaction kettle, heating to 40-70 ℃, reacting for 20-60 minutes, heating to 70-90 ℃, reacting for 1-3 hours, cooling to below 40 ℃, adding the discharged materials into a high-speed dispersing machine, adding other preparation raw materials of the component B, dispersing, stirring for 20-60 minutes, and discharging;
s3: and mixing the prepared component A and the prepared component B for use.
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