CN114942078A - Infrared temperature measurement sensor and temperature measurement method - Google Patents
Infrared temperature measurement sensor and temperature measurement method Download PDFInfo
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- CN114942078A CN114942078A CN202210637724.1A CN202210637724A CN114942078A CN 114942078 A CN114942078 A CN 114942078A CN 202210637724 A CN202210637724 A CN 202210637724A CN 114942078 A CN114942078 A CN 114942078A
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- 238000009529 body temperature measurement Methods 0.000 title claims abstract description 115
- 238000000034 method Methods 0.000 title claims abstract description 14
- 230000006698 induction Effects 0.000 claims abstract description 17
- 230000005855 radiation Effects 0.000 claims abstract description 15
- 239000000428 dust Substances 0.000 claims abstract description 8
- 230000007613 environmental effect Effects 0.000 claims abstract description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims description 27
- 238000009413 insulation Methods 0.000 claims description 10
- 238000005259 measurement Methods 0.000 abstract description 15
- 238000013461 design Methods 0.000 description 13
- 239000002184 metal Substances 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 5
- 239000000956 alloy Substances 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 4
- 230000001419 dependent effect Effects 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000004568 cement Substances 0.000 description 2
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- 238000000926 separation method Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
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- 238000012546 transfer Methods 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 229910052681 coesite Inorganic materials 0.000 description 1
- 229910052906 cristobalite Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
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- 229910052682 stishovite Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229910052905 tridymite Inorganic materials 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/04—Casings
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/04—Casings
- G01J5/041—Mountings in enclosures or in a particular environment
- G01J5/042—High-temperature environment
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/04—Casings
- G01J5/046—Materials; Selection of thermal materials
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/04—Casings
- G01J5/048—Protective parts
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Abstract
The invention discloses a temperature measurement method of an infrared temperature measurement sensor, which comprises an infrared temperature measurement module and a high-temperature target, and is characterized in that the high-temperature target is arranged in a temperature-measured environment during temperature measurement, the infrared temperature measurement module is arranged outside the temperature-measured environment and is aligned with the high-temperature target to directly sense a temperature signal of the high-temperature target through infrared radiation, and a temperature value of the high-temperature target is obtained; simultaneously with the heat radiation infrared light path seal between infrared induction module and the high temperature target transmit in a closed passage who avoids environmental disturbance, from this through the high temperature target response measured ambient temperature, the infrared induction module obtains high temperature target temperature signal in closed passage to obtain the ambient temperature by the temperature measurement environment. The temperature measuring method of the infrared temperature measuring sensor provided by the invention is not interfered by dust, water vapor and the like in a temperature measuring environment, ensures the high precision and stability of measurement, and is low in use cost and convenient to replace.
Description
Technical Field
The invention relates to a temperature measurement technology, in particular to an infrared temperature measurement sensor and a temperature measurement method.
Background
The thermocouple has high temperature measuring precision and convenient use, and is widely used for temperature measurement, but because the thermocouple carries out contact type temperature measurement, the metal protective sleeve is sleeved outside the temperature sensing element and contacts with a temperature measuring object through the metal protective sleeve, but the metal protective sleeve is still easily damaged, particularly under the condition of high-temperature environment, the metal protective sleeve and the temperature sensing element inside the metal protective sleeve are easily damaged, and finally the thermocouple product is scrapped. The service life is short due to easy damage, so that the temperature measurement cost by adopting the thermocouple is greatly improved.
Disclosure of Invention
The invention aims to solve the defects of the prior art and provide a thermocouple for replacing contact temperature measurement, and the infrared temperature measurement sensor and the temperature measurement method have the same temperature measurement scene as the thermocouple, are low in damage rate and can be used at low cost.
In order to achieve the purpose, the temperature measuring method of the infrared temperature measuring sensor provided by the invention comprises the steps of adopting an infrared temperature measuring module and a high-temperature target, and is characterized in that the high-temperature target is placed in a temperature-measured environment during temperature measurement, the infrared temperature measuring module is placed outside the temperature-measured environment and is aligned with the high-temperature target to directly sense a temperature signal of the high-temperature target through infrared radiation, and the temperature value of the high-temperature target is obtained; simultaneously with the heat radiation infrared light path seal between infrared induction module and the high temperature target transmit in a closed passage who avoids environmental disturbance, from this through the high temperature target response measured ambient temperature, the infrared induction module obtains high temperature target temperature signal in closed passage to obtain the ambient temperature by the temperature measurement environment.
The thermal radiation infrared light path between with infrared induction module and high temperature target seals the transmission in a closed channel who avoids environmental disturbance can be to seal infrared induction module and high temperature target respectively and set up at a pipeline both ends, but the high temperature target is connected through the mode of shirking with pipeline one end, the infrared sensing component of infrared induction module aligns the other end that the high temperature target encapsulates at the pipeline, from this form between infrared induction module and high temperature target and do not receive the heat flow influence, do not receive dust particle in ambient temperature and the environment, the enclosure space of steam influence, make the infrared light path of thermal radiation transmit in this enclosure space's pipeline, the pipeline can constitute by high temperature resistant material.
The invention provides an infrared temperature measurement sensor which comprises an infrared temperature measurement module and a temperature measurement cavity and is characterized in that the temperature measurement cavity is made of a closed high-temperature-resistant material, a high-temperature target is arranged at one end of the temperature measurement cavity, the infrared temperature measurement module comprises an infrared sensing element, and the infrared sensing element is arranged in the temperature measurement cavity and is aligned with the high-temperature target.
In order to avoid the damage of high temperature to the infrared temperature measurement module, a heat insulation layer and a heat insulation filter are arranged between the infrared temperature measurement module and the high-temperature target. Because infrared temperature measurement module not only keeps apart through insulating layer and high temperature part, redesign high temperature filter at infrared temperature measurement module end, play thermal-insulated and the effect of filtering for the temperature measurement module does not receive the influence of high temperature, ensures its work normal atmospheric temperature, improves measuring precision and stability greatly. The high-temperature target and the infrared temperature measurement module are isolated in physical heat transfer through the design of the heat insulation layer, so that the measuring instrument can be protected to work at normal temperature, and the running stability and reliability of the measuring instrument are guaranteed; the design of the high-temperature resistant optical filter is used for transmitting high-temperature gas of a measured object to the infrared lens of the measuring instrument, so that the infrared temperature measuring lens and the instrument are protected from working stably.
According to the infrared temperature measurement sensor and the temperature measurement method provided by the invention, an infrared measurement environment is designed into a closed temperature measurement cavity body made of high-temperature-resistant materials, so that infrared temperature measurement works in the closed cavity body and is not interfered by dust, water vapor and the like in the external environment, and the high precision and stability of measurement are ensured.
Because the high-temperature target is frequently contacted with an object for temperature measurement, the high-temperature target is made of a high-temperature-resistant material, a corrosion-resistant material and a wear-resistant material, the high-temperature target is designed into a consumable part, when the temperature measurement target is damaged, the high-temperature target only needs to be replaced, and the use cost is greatly reduced.
According to the infrared temperature measurement sensor and the temperature measurement method, different materials such as stainless steel, alloy, ceramic and the like are selected for designing the temperature measurement targets with different sizes, different shapes and different volumes according to the requirements of temperature measurement and different working conditions, and the temperature of the temperature measurement target point is obtained according to the volume, the heat conduction coefficient and the like, so that the requirements of different application scenes are met. The design of the temperature measuring target has the advantages of low cost and controllable service life. For example: in the cement industry, the protection tube of the thermocouple is often worn out, which results in the whole being scrapped. Through the design of temperature measurement target, can design not unidimensional solid target head just realizes more wear-resisting, reduces the change cycle. Even if the temperature measuring target is damaged, only the temperature measuring target needs to be replaced, the whole instrument does not need to be replaced, and the cost is greatly reduced.
Designing a closed temperature measuring cavity: due to infrared temperature measurement, the biggest problems are that: the middle light path stroke of the object to be tested and the instrument is interfered by the environment, and the testing precision can be greatly interfered by water vapor, wind dust, particulate matters and the like in the middle. Therefore, the closed temperature measuring cavity is designed, so that the stroke from the temperature measuring instrument to a temperature measuring point is protected by the temperature measuring cavity and is not interfered by the environment, and the temperature measurement is more accurate and stable.
Temperature measurement target, infrared temperature measurement module, temperature measurement cavity separation design, its advantage lies in: the measurement is more convenient. Different temperature measuring targets are designed according to the requirements of the object to be measured. The temperature measurement cavity is designed to protect the red temperature measurement light path (not limited to a straight light path), and the interference of measurement precision is avoided. The temperature measuring instrument can be configured with different temperature measuring modules according to the requirements of object measurement with different precision and different distances.
Compared with thermocouple temperature measurement, the infrared temperature measurement sensor provided by the invention has the advantages that: the thermocouple temperature measurement is measured by the potential difference formed by the heat conduction of different materials. The accuracy and corresponding time of such measurements is substantially dependent on the material itself; and the infrared temperature measurement precision can achieve higher precision and faster response time under the influence of the external environment. For example, thermocouple response times < 3S and infrared response times < 20 mS. The measurement accuracy of the thermocouple is basically dependent on the accuracy of the material itself. The cost of 0.25% accuracy class I is very high. The infrared temperature measurement is not influenced by the environment in a closed environment, and the cost is much lower under the same precision.
Because the design of the thermocouple is integrally designed, the protection tube is scrapped integrally after being worn. Compared with the infrared temperature measuring sensor provided by the invention, only the temperature measuring target needs to be replaced, and the cost is greatly reduced.
Description of the drawings:
FIG. 1 is a schematic structural diagram of an embodiment of the present invention;
fig. 2 is a schematic sectional structure view of fig. 1.
Wherein: the device comprises an infrared temperature measurement module 1, a flange plate 2, a heat insulation layer 3, a heat insulation optical filter 4, a temperature measurement cavity 5, a high-temperature target 6, a heat radiation light path 7, a pipeline 8 and an infrared sensing element 9.
Detailed Description
The invention is further illustrated with reference to the following figures and examples.
Example 1:
the temperature measurement method of the infrared temperature measurement sensor described in this embodiment includes using an infrared temperature measurement module and a high temperature target, and is characterized in that the high temperature target is placed in a temperature-measured environment during temperature measurement, the infrared temperature measurement module is placed outside the temperature-measured environment and aligned with the high temperature target to directly sense a temperature signal of the high temperature target through infrared radiation, and a temperature value of the high temperature target is obtained; meanwhile, a thermal radiation infrared light path between the infrared induction module and the high-temperature target is sealed in a sealed channel for transmission, so that the environment temperature to be measured is induced by the high-temperature target, the infrared induction module obtains a high-temperature target temperature signal in the sealed channel, and the environment temperature of the environment to be measured is obtained; the heat radiation infrared light path between with infrared induction module and high temperature target seals the transmission in a closed channel who avoids the environmental disturbance can be to seal infrared induction module and high temperature target respectively and set up at a pipeline both ends, but the high temperature target is connected through the mode of shirking with pipeline one end, the infrared induction component of infrared induction module aligns the other end that the high temperature target encapsulation was in the pipeline, form the enclosure space that does not receive the influence of heat flow, does not receive dust particle in ambient temperature and the environment, steam influence between infrared induction module and the high temperature target from this, make the infrared light path of heat radiation transmit in this enclosure space's pipeline, the pipeline can constitute by high temperature resistant material.
As shown in fig. 1 and fig. 2, the infrared temperature sensor provided in this embodiment includes an infrared temperature measurement module 1 and a temperature measurement cavity 5, the temperature measurement cavity 5 is made of a closed high temperature resistant material, a high temperature target 6 is disposed at one end of the temperature measurement cavity 5, the infrared temperature measurement module 1 includes an infrared sensing element 9, the infrared sensing element 9 is disposed in the temperature measurement cavity 5 and aligned with the high temperature target 6, the temperature measurement cavity 5 of this embodiment is made of a pipeline 7, and the high temperature target 6 is detachably connected with one end of the pipeline 7 through a thread or a slot structure.
In order to avoid the damage of high temperature to the infrared temperature measurement module 1, a heat insulation layer 3 and a heat insulation filter 4 are arranged between the infrared temperature measurement module 1 and the high temperature target 6. Because infrared temperature measurement module 1 not only keeps apart through insulating layer 3 and high temperature part, redesign high temperature resistant heat-insulating filter 4 at infrared temperature measurement module 1 end, carry out the transmission to the measured object high temperature signal to measuring instrument infrared lens through high temperature heat-insulating filter 4, protection infrared temperature measurement lens and instrument steady operation play thermal-insulated and light filtering's effect, make infrared temperature measurement module 1 not receive the influence of high temperature, guarantee its work is at normal atmospheric temperature, improve measuring precision and stability greatly.
From another perspective, through the design of the thermal insulation layer 3, the high-temperature target 6 and the infrared temperature measurement module 1 are isolated through physical heat transfer, so that electronic components in the infrared temperature measurement sensor provided by the embodiment can be protected to work at normal temperature, and the operation of the infrared temperature measurement sensor is guaranteed to be stable and reliable.
According to the infrared temperature measurement sensor and the temperature measurement method provided by the embodiment, an infrared measurement environment is designed into a closed temperature measurement cavity made of a high-temperature-resistant material, so that infrared temperature measurement works in the closed cavity and is not interfered by external environment dust, water vapor and the like, and the high precision and stability of measurement are guaranteed.
Because the high-temperature target is frequently contacted with an object for measuring temperature, the high-temperature target is made of a high-temperature-resistant material, a corrosion-resistant material and a wear-resistant material, the high-temperature target is designed into an easily-consumed piece, when the temperature measuring target is damaged, the high-temperature target only needs to be replaced, and the use cost is greatly reduced.
According to the infrared temperature measurement sensor and the temperature measurement method, the high-temperature targets are designed by selecting different materials such as stainless steel, alloy, ceramic and the like, the high-temperature targets with different sizes, different shapes and different volumes are designed according to the requirements of temperature measurement and different working conditions, and the temperature of the high-temperature target spot is obtained according to the volume, the heat conduction coefficient and the like, so that the requirements of different application scenes are met. The high-temperature target design has the advantages of low cost and controllable service life. For example: in the cement industry, the protection tube of the thermocouple is often worn out, which results in the whole being scrapped. Through the design of high temperature target, can design not unidimensional solid target head just realizes more wear-resisting, reduces the change cycle. Even if the high-temperature target is damaged, only the high-temperature target needs to be replaced, the whole instrument does not need to be replaced, and the cost is greatly reduced.
Designing a closed temperature measuring cavity: due to infrared temperature measurement, the biggest problems are that: the middle light path stroke of the measured object and the instrument is interfered by the environment, and the measuring precision can be greatly interfered by water vapor, wind dust, particles and the like in the middle. Therefore, the closed temperature measuring cavity is designed, so that the stroke from the temperature measuring instrument to the temperature measuring point is protected by the temperature measuring cavity and is not interfered by the environment, and the temperature measurement is more accurate and stable.
This embodiment adopts high temperature target, infrared temperature measurement module, temperature measurement cavity separation design, and its advantage lies in: the measurement is more convenient. Different high-temperature targets are designed according to the requirements of the object to be tested. The temperature measurement cavity is designed to protect the red temperature measurement light path (not limited to a straight light path), and the interference of measurement precision is avoided. The temperature measuring instrument can be configured with different infrared temperature measuring modules according to the requirements of object measurement with different precision and different distances.
As can be seen from the above detailed analysis, the materials of the high temperature target and the high temperature resistant pipeline in this embodiment have been selected differently according to the requirements of the use environment, and the specific materials are selected by those skilled in the art through N times of experiments in the content of the specification provided in this patent application, and will not be described in detail herein, but the following material performance table may be given as further reference in this embodiment.
The infrared temperature sensor provided by the embodiment has the advantages of temperature measurement relative to a thermocouple: the thermocouple temperature measurement is measured by the potential difference formed by the heat conduction of different materials. The accuracy and corresponding time of such measurements is substantially dependent on the material itself; and the infrared temperature measurement precision can achieve higher precision and faster response time under the influence of the external environment. For example, thermocouple response times < 3S and infrared response times < 20 mS. The measurement accuracy of the thermocouple is basically dependent on the accuracy of the material itself. The cost of 0.25% accuracy class I is very high. The infrared temperature measurement is not influenced by the environment in a closed environment, and the cost is much lower under the same precision.
Because the design of the thermocouple is integrally designed, the protection tube is scrapped integrally after being worn. Compared with the infrared temperature measuring sensor provided by the invention, only the temperature measuring target needs to be replaced, and the cost is greatly reduced.
High-temperature target material type selection: according to the temperature measuring scene and the requirement of the temperature measuring range, different temperature measuring target materials can be adopted. Such as: stainless steel material: the temperature resistance is about 800-. Such as 304, 316L, 310S, etc
Stainless steel 304:
grade: date 304 Date (yyy. mm. dd): 2021.05.17
Alloy materials: high temperature resistance is about 1000-1300 ℃. For example, NH11, NH12, NH13, and the like, such as NH13 alloy:
ceramic material: temperature resistance of about 1300 ℃ and 1600 DEG C
Such as: 99% alumina (alumina/Al 2O3) ceramic product
The material components are as follows:
| composition of | Ratio of |
| AL2O3 | 99.12％ |
| ZrO2 | 0.58％ |
| SiO2 | 0.23％ |
| NaO | 0.05％ |
| The rest(s) | 0.05％ |
| Totaling: | 100％ |
temperature resistance and heat conduction coefficient:
Claims (5)
1. a temperature measurement method of an infrared temperature measurement sensor comprises the steps of adopting an infrared temperature measurement module and a high-temperature target, and is characterized in that the high-temperature target is placed in a temperature-measured environment during temperature measurement, the infrared temperature measurement module is placed outside the temperature-measured environment and is aligned with the high-temperature target to directly sense a temperature signal of the high-temperature target through infrared radiation, and a temperature value of the high-temperature target is obtained; simultaneously with the heat radiation infrared light path seal between infrared induction module and the high temperature target transmit in a closed passage who avoids environmental disturbance, from this through the high temperature target response measured ambient temperature, the infrared induction module obtains high temperature target temperature signal in closed passage to obtain the ambient temperature by the temperature measurement environment.
2. The method as claimed in claim 1, wherein the step of enclosing the thermal radiation infrared path between the infrared sensor module and the high temperature target in a closed channel to avoid environmental interference is to enclose the infrared sensor module and the high temperature target at two ends of a pipe respectively, the high temperature target is detachably connected to one end of the pipe, the infrared sensor element of the infrared sensor module is aligned with the other end of the pipe, so as to form an enclosed space between the infrared sensor module and the high temperature target, which is not affected by heat flow and dust and water vapor in the environment, and the thermal radiation infrared path is transported in the pipe of the enclosed space, and the pipe can be made of high temperature resistant material.
3. The utility model provides an infrared temperature sensor, includes infrared temperature measurement module (1) and temperature measurement cavity (5), characterized by temperature measurement cavity (5) constitute for closed high temperature resistant material, are equipped with high temperature target (6) in the one end of temperature measurement cavity (5), infrared temperature measurement module (1) includes infrared sensing element, and infrared sensing element sets up and aims at high temperature target (6) in temperature measurement cavity (5).
4. The infrared temperature measurement sensor according to claim 3, wherein a heat insulation layer (3) is arranged between the infrared temperature measurement module (1) and the high temperature target (6).
5. An infrared temperature measurement sensor according to claim 3 or 4, characterized in that a heat insulation filter (4) is arranged between the infrared temperature measurement module (1) and the high temperature target (6).
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115752746A (en) * | 2022-12-30 | 2023-03-07 | 苏州摩比信通智能***有限公司 | Intelligent terminal with infrared temperature measurement function and assembling method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115752746A (en) * | 2022-12-30 | 2023-03-07 | 苏州摩比信通智能***有限公司 | Intelligent terminal with infrared temperature measurement function and assembling method thereof |
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