CN114918670A - Device and method for machining microchannel by using paraxial jet water assisted laser and micro milling - Google Patents
Device and method for machining microchannel by using paraxial jet water assisted laser and micro milling Download PDFInfo
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- CN114918670A CN114918670A CN202210651943.5A CN202210651943A CN114918670A CN 114918670 A CN114918670 A CN 114918670A CN 202210651943 A CN202210651943 A CN 202210651943A CN 114918670 A CN114918670 A CN 114918670A
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- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P23/00—Machines or arrangements of machines for performing specified combinations of different metal-working operations not covered by a single other subclass
- B23P23/02—Machine tools for performing different machining operations
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
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Abstract
The device comprises a base arranged on a micro machine tool, a machine tool X-Y movable platform arranged on the base, a micro dynamometer positioned on the machine tool X-Y movable platform, and a workpiece arranged above the micro dynamometer; carrying out water-assisted laser processing on the workpiece through a laser and a paraxial ejector; the micro milling processing is carried out on the workpiece by the large length-diameter ratio micro-diameter milling cutter, the multi-degree-of-freedom CCD electron microscope I is detachably connected with the laser, and the multi-degree-of-freedom CCD electron microscope II is detachably connected with the air-floatation high-speed electric spindle; the liquid storage tank is arranged on the miniature dynamometer, the workpiece is positioned in the liquid storage tank, and the liquid storage tank is connected with the waste liquid recoverer. The micro-channel micro-milling device has the effect of compounding the laser processing technology into the micro-milling process so as to break through the technical bottleneck of the micro-milling process in the aspect of micro-channel preparation.
Description
Technical Field
The invention relates to the field of micro-machining, in particular to a device and a method for machining a micro-channel by combining paraxial jet water with auxiliary laser and micro-milling.
Background
At present, micron-sized fluid micro-channels are core parts of a microreactor, and the forming quality of the micro-channels is the key for determining the work-doing performance of the whole microreactor system. The micro-reactor becomes an industrial sharp device with the advantage of green production cost, and the micro-channel reactor usually consists of millions of micro-channels, has small channel size and complex geometric structure, particularly high-aspect-ratio micro-channels (less than 1mm and more than 2), and has complex forming process, low yield and high production cost.
The problems of material adaptability, processing quality stability, channel shape accuracy, preparation process high efficiency and the like of the traditional micro-processing technologies such as injection molding, photoetching technology, chemical etching and the like cannot be effectively solved at the same time, so that the channel surface integrity is insufficient and the consistency is poor, and the requirement of high service performance of the microreactor is difficult to meet.
The micro milling integrates the characteristics of a mature process, high precision, high quality and the like, and has unique advantages in the aspect of processing a three-dimensional complex-shaped microstructure. However, when a micro milling technology is used for processing a high aspect ratio or multi-cycle complex microchannel, the milling parameter selection range is reduced due to the weakened rigidity caused by the increase of the length-diameter ratio of the micro milling cutter and the limitation of the micro cutter manufacturing technology, and simultaneously, the overall strength and rigidity of the micro milling cutter are obviously reduced along with the increase of the length-diameter ratio of the micro milling cutter, so that the cutter is easy to excessively wear or prematurely lose efficacy, the service life and the cutting processing performance of the micro milling cutter are seriously influenced, and the requirements of the core microchannel processing quality and the processing efficiency cannot be simultaneously met by pure micro milling.
The laser processing has the characteristics of strong material adaptability, energy concentration, high flexibility and the like, and can heat and raise the temperature of the material in a micro area to realize efficient removal. The composite laser processing method is based on the micro-milling technology to meet the increasingly developed complicated and precise requirements of the micro-milling technology, and is an important development trend of the current micro-milling technology. Therefore, how to combine the laser processing technology into the micro-milling process to break through the technical bottleneck of the micro-milling process in the aspect of micro-channel preparation is a key problem to be solved urgently by those skilled in the art.
Disclosure of Invention
In order to compound a laser processing technology into a micro-milling processing process and break through the technical bottleneck of micro-milling processing in the aspect of micro-channel preparation, the application provides a device and a method for processing a micro-channel by combining paraxial jet water-assisted laser and micro-milling.
First aspect, the utility model provides a paraxial efflux water is assisted laser and is milled device of combined machining microchannel a little adopts following technical scheme:
a device for processing a microchannel by combining paraxial jet water-assisted laser and micro milling comprises a base, a machine tool X-Y movable platform, a large-length-diameter-ratio micro-diameter milling cutter, a laser, a paraxial jet device, a multi-degree-of-freedom CCD electron microscope I and a multi-degree-of-freedom CCD electron microscope II, wherein the base is arranged on a micro machine tool; the multi-degree-of-freedom CCD electron microscope I is detachably connected with the laser and is positioned above the workpiece, and the multi-degree-of-freedom CCD electron microscope II is detachably connected with the air-floatation high-speed electric spindle and is positioned above the workpiece; the paraxial ejector and the large length-diameter ratio micro-diameter milling cutter are respectively positioned at two sides of the laser.
Optionally, the machine tool further comprises a micro dynamometer, the micro dynamometer is located on the machine tool X-Y movable platform, and a workpiece is mounted above the micro dynamometer through a special tool.
Optionally, the device also comprises a liquid storage tank and a waste liquid recoverer, wherein the liquid storage tank is arranged on the miniature dynamometer, the workpiece is positioned in the liquid storage tank, and the liquid storage tank is connected with the waste liquid recoverer.
Optionally, the milling cutter with the large length-diameter ratio and the small diameter is connected with an air-floating high-speed electric spindle through a special tool holder, and the air-floating high-speed electric spindle is driven by a motor and controlled by a PMAC control system.
In a second aspect, the method for machining the microchannel by combining the paraxial jet water-assisted laser and the micro-milling adopts the following technical scheme:
a method for machining a micro-channel by combining paraxial jet water-assisted laser and micro-milling comprises the following steps:
s1: the method comprises the following steps of (1) preprocessing a workpiece to be processed, polishing the surface of the workpiece and ultrasonically cleaning the workpiece to remove impurities and organic stains on the surface of the workpiece;
s2: mounting a pre-treated workpiece to be processed on an X-Y movable platform of a machine tool through a special clamp, and adjusting the surface of the workpiece to be processed to be in a horizontal state;
s3: moving a workpiece to be processed below a laser lens, adjusting a multi-freedom-degree CCD electron microscope I, and determining the position of the object when the object image is cleaned and visible; opening a laser, adjusting the relative position of a lens and the surface of a workpiece to be processed, and setting laser processing parameters; adjusting the paraxial jet device to incline the paraxial jet device by a certain angle and keep a proper offset distance with the laser focus position, starting the paraxial jet device, and sequentially carrying out laser processing on the workpiece under the auxiliary action of water jet to obtain a microchannel with a certain thickness of an altered layer;
s4: moving a workpiece to be processed to the position below the large length-diameter ratio micro-diameter milling cutter, adjusting a multi-degree-of-freedom CCD electron microscope II, adjusting the relative position of the large length-diameter ratio micro-diameter milling cutter and the surface of the workpiece under the observation state of the multi-degree-of-freedom CCD electron microscope II, finishing tool setting, then adjusting again to enable the large length-diameter ratio micro-diameter milling cutter to be positioned at the inlet position of a first micro-channel on the workpiece, setting processing parameters, starting micro-milling processing of a deteriorated layer material, and withdrawing the tool after processing of all channels on the workpiece is finished to enable the large length-diameter ratio micro-diameter milling cutter to be positioned at a safe position outside the workpiece;
s5: adjusting the laser focus to descend Amm along the depth direction of the micro-channel obtained in the step S3, wherein the size of A is determined by the specific processing material characteristics and the thickness of the altered layer formed under the action of the laser, and the steps S3 and S4 are sequentially repeated;
s6: repeating S5 until the depth of the micro-channel is close to the original set depth and a certain finishing allowance is left;
s7: and (8) continuing to perform micro milling on the basis of S6 until finishing allowance is completely removed, and obtaining the micro channel with set depth and periodicity.
Optionally, the laser emitted by the laser is nanosecond or picosecond laser, and the pulse width is less than or equal to 100 ns.
Optionally, the altered layer formed by the paraxial water-assisted laser processing is obtained by one or more laser scans, and the micro milling of the material of the altered layer is completed by one-time processing.
In summary, the present application includes at least one of the following beneficial technical effects:
1. through the arrangement of the laser, the paraxial ejector and the large-length-diameter-ratio micro-diameter milling cutter, the effect of realizing high-efficiency and accurate molding of a high depth-to-width ratio or a complex multi-period micro-channel on a hard and brittle material or other metal materials can be achieved;
2. the novel method for preparing the microchannel by alternately compounding the paraxial jet water assisted laser and the micro-milling is characterized in that a workpiece is processed by high-energy laser under the action of water jet cooling and scouring, and is sequentially and quickly removed, a deteriorated layer with a certain thickness is formed on the surface of the inner wall of the channel, a micro-milling cutter with a large length-diameter ratio is driven at the inlet of a first microchannel, and the micro-milling processing of the deteriorated layer is carried out according to set processing parameters, so that the microchannel with a certain depth is obtained; the operations are alternately repeated by adopting the jet flow water assisted laser and the micro milling until the required micro channel is processed; the wear rate of the milling cutter with the micro-diameter and the large length-diameter ratio can be obviously reduced, the service life of the milling cutter is prolonged, the laser heat damage in the laser and micro-milling composite machining process can be reduced, and the consistency and the surface integrity of a channel are improved.
Drawings
Fig. 1 is a schematic view of the overall structure of the apparatus for composite processing of microchannels according to the present application.
Description of reference numerals: 1. a base; 2. a machine tool X-Y movable platform; 3. a miniature dynamometer; 4. a workpiece; 5. a paraxial ejector; 6. a multi-freedom CCD electron microscope I; 7. a laser; 8. air-floating high-speed motorized spindle; 9. a micro-diameter milling cutter with large length-diameter ratio; 10. a multi-degree-of-freedom CCD electron microscope II; 11. a liquid storage tank; 12. a waste liquid recoverer.
Detailed Description
The present application is described in further detail below with reference to fig. 1.
The embodiment of the application discloses a device for machining a micro-channel by combining paraxial jet water-assisted laser and micro-milling. Referring to fig. 1, the device for processing the microchannel by combining paraxial jet water-assisted laser and micro milling comprises a base 1 arranged on a micro machine tool, a machine tool X-Y movable platform 2, a large length-diameter ratio micro-diameter milling cutter 9, a micro dynamometer 3, a laser 7, a paraxial jet device 5, a multi-degree-of-freedom CCD electron microscope I6, a multi-degree-of-freedom CCD electron microscope II10, a liquid storage tank 11 and a waste liquid recoverer 12. The base 1 is a marble base, and the X-Y movable platform 2 of the machine tool is arranged on the base 1. The micro force measuring instrument 3 is positioned on the machine tool X-Y movable platform 2, the position of the machine tool X-Y movable platform 2 in two directions of X, Y is adjustable, so that the state of a workpiece 4 to be machined can be controlled, and the micro force measuring instrument 3 can measure micro milling force in the micro milling machining process. The workpiece 4 is installed above the miniature dynamometer 3 through a special tool, and the laser 7 and the paraxial jet device 5 are positioned above the workpiece 4 and carry out water-assisted laser processing on the workpiece 4.
The large length-diameter ratio micro-diameter milling cutter 9 is connected with an air-floatation high-speed electric spindle 8 through a special cutter holder, and the air-floatation high-speed electric spindle 8 is driven by a motor and controlled by a PMAC control system. The large-length-diameter-ratio micro-diameter milling cutter 9 is positioned above a workpiece 4 and performs micro milling processing on the workpiece 4, the multi-freedom-degree CCD electron microscope I6 is detachably connected with the laser 7 and is positioned above the workpiece 4, the multi-freedom-degree CCD electron microscope II10 is detachably connected with the air-floating high-speed electric spindle 8 and is positioned above the workpiece 4, the positions and angles of the multi-freedom-degree CCD electron microscope I6 and the multi-freedom-degree CCD electron microscope II10 can be freely adjusted, an operator can conveniently observe the processing state of the large-length-diameter-ratio micro-diameter milling cutter 9 in real time, the multi-freedom-degree CCD electron microscope II10 can be adjusted in multiple angles up and down and left and right, the large-length-diameter-ratio micro-diameter milling cutter 9 and the workpiece 4 can be conveniently observed, and the occupied space on the X-Y movable platform 2 of the machine tool can be reduced. The paraxial ejector 5 and the large length-diameter ratio micro-diameter milling cutter 9 are respectively positioned at two sides of the laser 7, the liquid storage tank 11 is arranged on the micro dynamometer 3, the workpiece 4 is positioned in the liquid storage tank 11, and the liquid storage tank 11 is connected with the waste liquid recoverer 12. The liquid storage tank 11 can store waste water and residues generated in the water-assisted laser machining process and cutting liquid generated in the micro-milling machining process, and the waste liquid recoverer 12 can control the height of waste liquid in the liquid storage tank 11 and recover the waste liquid.
Referring to fig. 1, when processing the microchannel, the laser 7 can sequentially etch the workpiece 4 under the assistance of the paraxial water jet, so as to obtain the microchannel with a certain thickness of the deteriorated layer. And (3) positioning the large length-diameter ratio micro-diameter milling cutter 9 at the inlet position of the first micro-channel on the workpiece 4, setting processing parameters, carrying out micro-milling processing on the material of the deteriorated layer, and withdrawing the cutter after all the channels on the workpiece 4 are processed to ensure that the large length-diameter ratio micro-diameter milling cutter 9 is positioned at a safe position outside the workpiece 4. The focal point of the laser 7 is adjusted to descend Amm along the depth direction of the micro-channel obtained by micro-milling, and the laser and micro-milling are sequentially carried out, wherein the size of A is determined by the specific processing material characteristics and the thickness of the affected layer formed by the laser. And continuously repeating the laser and micro milling until the depth of the micro channel is close to the original set depth, and reserving a certain fine machining allowance.
And continuing to perform micro-milling until finishing allowance is completely removed to obtain a micro-channel with set depth and cycle number, and simultaneously adjusting a multi-freedom-degree CCD electron microscope II10 to monitor the relative position of the large-length-diameter-ratio micro-diameter milling cutter 9 and the workpiece 4 and the use condition of the large-length-diameter-ratio micro-diameter milling cutter 9 in real time, reduce the heat influence of the laser 7 on the processing process of the workpiece 4, obtain the micro-channel with high surface integrity and consistency, reduce the wear rate of the large-length-diameter-ratio micro-diameter milling cutter 9 and prolong the service life of the micro-channel. The equivalent diameter of a single channel of the micro-channel is less than 1mm, the depth-to-width ratio is more than 2, and the number of the channel cycles is between 1 and 200.
Referring to FIG. 1, a method for machining a microchannel by combining paraxial jet water-assisted laser and micro-milling, wherein Al is used as the lower part 2 O 3 Ceramic micro-channelFor example, the laser 7 adopts a nanosecond pulse fiber laser, uses a high-precision three-axis micro-milling machine, adopts a side-axis jet water assisted laser-micro-milling combined processing mode, and specifically comprises the following steps:
s1: and (3) pretreating the workpiece 4, namely performing surface polishing treatment on the workpiece 4 with the size of 40mm multiplied by 10mm multiplied by 5mm, and ultrasonically cleaning the workpiece 4 in an acetone solution for 10 minutes to obtain the clean and pollution-free workpiece 4 to be processed.
S2: a workpiece 4 is clamped on an X-Y movable platform 2 of a machine tool by a special fixture, and the flatness error is ensured to be lower than 1 mu m by the auxiliary leveling of a high-precision double-shaft digital display inclinometer, wherein the model of the high-precision double-shaft digital display inclinometer is TLL-90S, and the resolution is 0.001 degrees.
S3: and moving the workpiece 4 to be processed below the lens of the laser 7, adjusting the multi-freedom-degree CCD electron microscope I6, and determining the position of the workpiece when the object image is cleaned and visible. The laser emitted by the laser 7 is nanosecond laser or picosecond laser, and the pulse width is less than or equal to 100 ns. And opening the laser 7, adjusting the relative position of the lens and the surface of the workpiece 4 to be processed, and adjusting the paraxial jet device 5 to incline the paraxial jet device by a certain angle and keep a proper offset distance with the focal position of the laser. Setting parameters of a laser 7, the average laser power of 5W, the scanning speed of 1mm/s, the repetition frequency of 20kHz and the pulse width of 100ns, starting the paraxial jet device 5, and sequentially carrying out laser processing on the microchannel to be processed under the assistance of water jet to obtain the microchannel with a certain metamorphic layer thickness.
S4: and moving the workpiece 4 to be processed to the position below the large length-diameter ratio micro-diameter milling cutter 9, adjusting the multi-degree-of-freedom CCD electron microscope II10, and adjusting the relative position of the large length-diameter ratio micro-diameter milling cutter 9 and the surface of the workpiece 4 under the observation state of the multi-degree-of-freedom CCD electron microscope II 10. Adjusting the relative position of a commercial hard alloy spiral end mill with the diameter of 0.5mm and the length-diameter ratio of 3 and the surface of a workpiece 4 to finish tool setting, adjusting a micro-diameter milling cutter 9 with the large length-diameter ratio to be positioned at the inlet position of a first micro-channel on the workpiece 4, setting micro-milling processing parameters, setting the rotating speed of a main shaft to 20000r/min, feeding amount per tooth to 2 mu m/z, and axial cutting depth to 2 mu m. And opening the air-floatation high-speed electric spindle 8 of the machine tool, starting the micro milling processing of the metamorphic layer material, and withdrawing the cutter after the processing of all channels on the workpiece 4 is finished so as to enable the micro-diameter milling cutter 9 with the large length-diameter ratio to be positioned at a safe position outside the workpiece 4. The height of the waste water generated in the paraxial water-assisted laser process in the liquid storage tank 11 can be adjusted, and the purposes of cooling the workpiece 4 and protecting the large-length-diameter-ratio micro-diameter milling cutter 9 can be achieved in the subsequent micro-milling processing stage.
S5: the laser focus is adjusted to descend Amm in the depth direction of the microchannel obtained in S4, and S3 and S4 are sequentially repeated.
S6: s5 is repeated until the microchannel depth approaches the original set depth, leaving some finishing margin.
S7: and closing the laser 7, the paraxial ejector 5 and the multi-degree-of-freedom CCD electron microscope I6, and continuing to perform micro milling until finishing allowance is completely removed, so as to obtain the microchannel with the set depth and the set periodicity. The affected layer formed by paraxial water-assisted laser processing is obtained by one or more laser scans, and the micro-milling of the affected layer material is completed by one-time processing.
S8: and retracting the cutter, and closing the multi-freedom-degree CCD electron microscope II10, the air-floating high-speed motorized spindle 8, the control system and the machine tool cooling device.
The above embodiments are preferred embodiments of the present application, and the protection scope of the present application is not limited by the above embodiments, so: all equivalent changes made according to the structure, shape and principle of the present application shall be covered by the protection scope of the present application.
Claims (7)
1. The utility model provides a device of laser is assisted with micro-milling combined machining microchannel to paraxial efflux water which characterized in that: the micro-milling machine tool comprises a base (1) arranged on a micro-fine machine tool, a machine tool X-Y movable platform (2), a large-length-diameter-ratio micro-diameter milling cutter (9), a laser (7), a paraxial ejector (5), a multi-degree-of-freedom CCD electron microscope I (6) and a multi-degree-of-freedom CCD electron microscope II (10), wherein the machine tool X-Y movable platform (2) is arranged on the base (1), a workpiece is arranged on the machine tool X-Y movable platform (2) through a special tool, and the laser (7) and the paraxial ejector (5) are positioned above the workpiece (4) and carry out water-assisted laser processing on the workpiece (4);
the micro-diameter milling cutter (9) with the large length-diameter ratio is positioned above the workpiece (4) and performs micro-milling processing on the workpiece (4), the multi-degree-of-freedom CCD electron microscope I (6) is detachably connected with the laser (7) and is positioned above the workpiece (4), and the multi-degree-of-freedom CCD electron microscope II (10) is detachably connected with the air-floatation high-speed electric spindle (8) and is positioned above the workpiece (4); the paraxial ejector (5) and the large length-diameter ratio micro-diameter milling cutter (9) are respectively positioned at two sides of the laser (7).
2. The device for machining the micro-channel by combining the paraxial jet water-assisted laser and the micro-milling according to claim 1, which is characterized in that: the machine tool is characterized by further comprising a miniature dynamometer (3), wherein the miniature dynamometer (3) is located on the X-Y movable platform (2) of the machine tool, and a workpiece (4) is installed above the miniature dynamometer (3) through a special tool.
3. The device for the paraxial jet water-assisted laser and micro-milling combined machining of the microchannel as claimed in claim 2, wherein: the device is characterized by further comprising a liquid storage tank (11) and a waste liquid recoverer (12), wherein the liquid storage tank (11) is installed on the miniature dynamometer (3), the workpiece (4) is located in the liquid storage tank (11), and the liquid storage tank (11) is connected with the waste liquid recoverer (12).
4. The device for the paraxial jet water-assisted laser and micro-milling combined machining of the microchannel as claimed in claim 1, wherein: the large length-diameter ratio micro-diameter milling cutter (9) is connected with an air-floatation high-speed electric spindle (8) through a special cutter holder, and the air-floatation high-speed electric spindle (8) is driven by a motor and controlled by a PMAC control system.
5. A method for the paraxial jet water-assisted laser and micro-milling composite machining of a microchannel according to any one of claims 1 to 4, which is characterized by comprising the following steps:
s1: pretreating a workpiece (4) to be processed, and performing surface polishing and ultrasonic cleaning on the workpiece (4) to remove impurities and organic stains on the surface of the workpiece;
s2: installing a pre-treated workpiece (4) to be processed on a machine tool X-Y movable platform (2) through a special clamp, and adjusting the surface of the workpiece (4) to be in a horizontal state;
s3: moving a workpiece (4) to be processed to the position below a lens of a laser (7), adjusting a multi-freedom-degree CCD electron microscope I (6), and determining the position of the object when an object image is cleaned and visible; opening a laser (7), adjusting the relative position of a lens and the surface of the workpiece (4) to be processed, and setting laser processing parameters; adjusting the paraxial jet device (5) to incline a certain angle and keep a proper offset distance with the laser focus position, starting the paraxial jet device (5), and sequentially carrying out laser processing on the workpiece (4) under the auxiliary action of water jet to obtain a microchannel with a certain metamorphic layer thickness;
s4: moving a workpiece (4) to be processed to the position below a large length-diameter ratio micro-diameter milling cutter (9), adjusting a multi-degree-of-freedom CCD electron microscope II (10), adjusting the relative position of the large length-diameter ratio micro-diameter milling cutter (9) and the surface of the workpiece (4) under the observation state of the multi-degree-of-freedom CCD electron microscope II (10), finishing tool setting, then adjusting again to enable the large length-diameter ratio micro-diameter milling cutter (9) to be located at the inlet position of a first micro-channel on the workpiece (4), setting processing parameters, starting micro-milling processing of a deteriorated layer material, and retracting to enable the large length-diameter ratio micro-diameter milling cutter (9) to be located at a safe position outside the workpiece (4) after all micro-channels on the workpiece (4) are processed;
s5: adjusting the laser focus to descend Amm along the depth direction of the micro-channel obtained in the step S3, wherein the size of A is determined by the specific processing material characteristics and the thickness of the altered layer formed under the action of the laser, and the steps S3 and S4 are sequentially repeated;
s6: repeating S5 until the depth of the micro-channel is close to the original set depth and a certain finishing allowance is left;
s7: and (8) continuing to perform micro milling on the basis of S6 until finishing allowance is completely removed, and obtaining the micro channel with set depth and cycle number.
6. The method for machining the micro-channel by combining the paraxial jet water-assisted laser and the micro-milling as claimed in claim 5, wherein the method comprises the following steps: the laser emitted by the laser (7) is nanosecond or picosecond laser, and the pulse width is less than or equal to 100 ns.
7. The method for machining the micro-channel by combining the paraxial jet water-assisted laser and the micro-milling as claimed in claim 5, wherein the method comprises the following steps: the affected layer formed by the paraxial water-assisted laser processing is obtained by one or more laser scanning, and the micro milling of the affected layer material is completed by one-time processing.
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