CN102351406A - Method for directly writing micro mechanical parts inside glass by femto-second laser - Google Patents
Method for directly writing micro mechanical parts inside glass by femto-second laser Download PDFInfo
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- CN102351406A CN102351406A CN2011101930729A CN201110193072A CN102351406A CN 102351406 A CN102351406 A CN 102351406A CN 2011101930729 A CN2011101930729 A CN 2011101930729A CN 201110193072 A CN201110193072 A CN 201110193072A CN 102351406 A CN102351406 A CN 102351406A
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Abstract
The invention relates to a method for directly writing micro mechanical parts inside glass by femto-second laser, which comprises the steps of porous glass femto-second laser direct writing, annealing and the like. The method has the characteristics of simplicity, high speed and high precision, and the complicated micro mechanical structure can be realized inside a glass chip.
Description
Technical field
The present invention relates to femtosecond laser processing, particularly a kind of method of utilizing femtosecond laser directly to write micromechanical parts in glass inside.
Background technology
MEMS (micro electro mechanical system), the English MEMS that is called for short is a nanotechnolgy that grows up along with semiconductor integrated circuit technology and ultraprecise Machining Technology.At present, except semicon industry, also have a wide range of applications in fields, forward position such as micro-fluid chip and biological chemistries.Micromechanics is as the important integral part of MEMS (micro electro mechanical system), is the photoetching technique that semicon industry extensively adopts to the traditional method of its processing, and it has had very sophisticated technology in the preparation of material surface micromechanics.Yet the processing for the 3 D stereo micromechanics also needs complex steps such as range upon range of and welding, the more important thing is that photoetching can not prepare micromechanics at material internal, so photoetching method is not real three-dimensional micro-processing technology in essence.
Femtosecond laser has the working accuracy height, heat effect is little, damage threshold is low and can realize three-dimensional micro-machined advantage to transparent material, and the method for the extensive and complex micro structure of a kind of brand-new preparation is provided for us.Femtosecond laser can carry out the local modification to glass through the non-linear absorption process, thereby has high-resolution three-dimensional working ability.The current femtosecond laser parallel micromachining of utilizing mainly contains three kinds of methods:
(1) the femtosecond laser parallel micromachining technology of auxiliary water or other liquid;
(2) directly use the hydrofluoric acid corrosion (referring to document: A. Marcinkevicius, S. Juodkazis, et al., Opt. Lett., 2001,26 (5): 277-279.) behind the femtosecond laser irradiation silica glass;
(3) behind the femtosecond laser irradiation photosensitive glass sample is carried out roasting, corrosion, post-processed such as annealing (referring to document: Sugioka, Y. Cheng, et al., Appl. Phys. A, 2005,81:1-10.).
Using the micro-nano structure limited length of above method processing, only is several millimeters, does not have the practicality of the three-dimensional processing of big scale.And post-processed process more complicated can make the qualification rate of the finished product reduce.In glass machined microstructure; At present report has only hydrofluoric acid corroding method behind the femtosecond laser irradiation (referring to document: Shigeki Matsuo; Satoshi Kiyama; Et al.; APPLIED PHYSICS LETTERS 93; 051107,2008.), still there are a lot of problems in this corroding method.The first, the limited length of processing structure only is several millimeters; The second, depth of corrosion is limited, causes micromechanics embedding glass internal depth limited; The 3rd, the corrosion precision influences working accuracy, and is difficult to control, can't accurately control the whole pattern of micromechanics; The 4th, hydrofluoric acid corrosive post-processed method, dangerous and pollution arranged.These problems have greatly limited the application of caustic solution in fields such as MEMS (micro electro mechanical system).
Summary of the invention
The technical problem that the present invention will solve be to overcome above-mentioned existing laser micro-machining technology in glass internal production micromechanics length limited, the degree of depth is limited, working accuracy is low and the problem of post-processed complicated steps; A kind of method of utilizing femtosecond laser directly to write micromechanical parts in glass inside is provided; This method has simple, quick, high-precision characteristics, can be at the inner micro mechanical structure of complicacy of realizing of glass-chip.
Concrete technical scheme of the present invention is following:
A kind of method of utilizing femtosecond laser directly to write micromechanical parts in glass inside, its characteristics are to comprise the following steps:
(1) femtosecond laser is directly write:
1. the femtosecond laser direct-writing device is installed: three-D displacement platform able to programme is fixed on the microscopical objective table of sharp Bath BX51 research grade difficult to understand; The center position of described three-D displacement platform able to programme has a square opening and is used to place slide; It under this square opening microscopical light source for transmission illumination; Directly over this is microscopical, fix a ccd detector; Described three-D displacement platform able to programme all links to each other with computer with ccd detector; The cellular glass sample is fixed in the transparent sample groove; In this transparent sample groove, add deionized water; With the complete submergence of cellular glass sample; Said transparent sample groove is bonded on the described slide, slide is fixed on the square opening zone of three-D displacement platform able to programme;
2. femtosecond laser gets into described microscope through one group of reflecting element; It is inner to focus on described sintered glass through the oil immersion microcobjective; The described Stage microscope of manual coarse adjustment is immersed in the deionized water fore-end of oil immersion microcobjective, and further fine tuning makes the one-tenth sharply defined image of described ccd detector to sintered glass sample upper surface again; Again computer through sequence of control make three-D displacement platform able to programme to directly over move a distance, to be exactly femtosecond laser focus on afterwards the working depth in the sintered glass sample interior through the oil immersion microcobjective to this distance;
When 3. the work program of writing in advance according to micromechanical parts to be processed drives described three-D displacement platform motion able to programme, start the femtosecond laser light beam said sintered glass sample is carried out irradiation processing, specific operation process is following:
According to the shaped region of size, at first directly write two diversion passages in described shaped region both sides at said sintered glass sample interior appropriate depth selection micromechanical parts;
Then; Described femtosecond laser is focused on the junction of diversion passage and shaped region; The said programming drives platform drive of computer starting sintered glass sample carries out accurate three-dimensional and moves; Make the focus of the relative femtosecond laser of sample produce the accurate three-dimensional relative movement; Said femtosecond laser is in the scan processing of shaped region; And the structural region of irradiation micromechanics not, the structural region of micromechanical parts will not ablated by said femtosecond laser and will be able to keep;
When said femtosecond laser in the shaped region been scanned, will directly write out required micromechanical parts structure in described sample interior; Working accuracy is one micron;
(2) annealing: the sample behind the femtosecond laser irradiation is put into High Temperature Furnaces Heating Apparatus; Annealing is one hour under 1150 ℃ temperature; Nanoporous in the sintered glass of annealing back is closed, and the micromechanical parts structure of directly writing out remains, and finally obtains embedding the transparent inner micromechanical parts of fine and close glass.
Described sintered glass is a porous borosilicate glass.
Principle of work of the present invention:
1. in testing, the substrate that we adopt porous borosilicate glass directly to write as femtosecond laser.Porous borosilicate glass adopts the split-phase method preparation: the suitable SiO of component
2, H
3BO
3, Na
2CO
3Uniform mixing, the melting system according to suitable is fused into glass.Carry out phase-splitting thermal treatment after the moulding at a certain temperature, rich alkali boron separates with Si-rich phase in heat treated process, is respectively the successive reticulation, has formed the borosilicate glass of phase-splitting.The glass of phase-splitting is immersed in the hot acid, and the alkali boron component that is soluble in the acid solution just is dissolved, and staying with the SiO2 skeleton is master's porous three-dimensional communication structure.Before hot acid treatment, the borosilicate glass of phase-splitting is cut into the substrate of 15 * 15 * 3 mm, and polished finish is carried out (referring to document: D. Chen in its surface; H. Miyoshi, et al, Appl.Phys.Lett.; 2005,86 (23): 231908.).The composition that mensuration draws sintered glass is 95.5SiO
2-4B
2O
3-0.5Na
2O (wt.%), mean pore size is about 10nm, porosity is about 40%.Because this vesicular structure, when sintered glass is immersed in the deionized water, water will infiltrate sintered glass inside along these nanometer apertures.
2. when femtosecond laser focused on sintered glass inside through the oil immersion microcobjective, the along power density was very big, will be above the ablation threshold of glass.The ablated glass that falls forms a large amount of small chips.Because sintered glass inside has been full of water, and ablated place is full of by water rapidly, the small chip of ablated generation will be partly dissolved in the water simultaneously.Next femtosecond laser produces air pocket rapidly with the water vapor of infiltrating.Air pocket is made up of vaporous water steam, As time goes on, expand rapidly, air pocket expand continuously water and chip that the pressure that produces will continue to drive the femtosecond laser along along diversion passage (tens microns of diameters) to the sample outer jet.Thereby the chip that produces of will ablating is taken glass inside out of.
3. in the initial stage that laser irradiation is directly write, water can get into the lasing district fast, and the glass chip that laser ablation is produced disperses or dissolves, and along with the increase of microstructure size, occurs the situation of debris easily.But when the speed of laser scanning was enough slow, water can infiltrate the lasing district continuously through the grid structure of sintered glass internal communication, still the chip dissolving of ablating can be formed the microstructure of hollow.Next, the part that multiple scanning fast can allow water dissolution block, the optical pressure that femtosecond laser irradiation produces is taken chip out of glass inside continuously.Multiple scanning several times just can obtain required micromechanical parts structure.
Compared with prior art, the invention has the advantages that:
1. can directly write the big scale micromechanical parts in glass inside fast: the scantling length of working methods such as corrosion processing is limited, only is several millimeters.
2. laser is adjustable continuously in the glass internal focus degree of depth: through selecting suitable pulsed laser energy, sweep parameter and focused condition, can improve the integrated level of device in the inner processing that realizes the multilayer micromechanical parts of different depths of glass.
3. working accuracy is high: there is threshold value property in femtosecond laser ablation sintered glass, can realize the submicron working accuracy through regulating conditions such as laser power.Therefore and laser direct-writing microstructure disposal molding can accurately be controlled the whole pattern of micromechanics.
4. post-processed is simply pollution-free: need not chemical corrosion or hot-drawn and handle, only need in High Temperature Furnaces Heating Apparatus, anneal.
Description of drawings
Fig. 1 utilizes femtosecond laser directly to write the schematic flow sheet of micromechanical parts in glass inside
Among the figure: 1. femtosecond laser is directly write; 2. annealing.
Fig. 2 utilizes femtosecond laser directly to write micromechanical parts experimental installation configuration schematic diagram in glass inside.
Among the figure: 3. femtosecond laser, 4. oil immersion microcobjective, 5. deionized water, 6. sintered glass sample, 7. diversion passage, 9. transparent sample groove, three-D displacement platform 10. able to programme, 11.CCD detector, 12. computers.
Fig. 3 utilizes femtosecond laser directly to write the micromechanical parts femtosecond laser in glass inside directly to write the process synoptic diagram.
Among the figure: 8. little gear.
Fig. 4 utilizes femtosecond laser directly to write micromechanical parts annealing process synoptic diagram in glass inside.
Among the figure: 13. High Temperature Furnaces Heating Apparatuss.
Embodiment
Through embodiment the present invention is described further below, but should limit protection scope of the present invention with this.
See also Fig. 1 earlier; Fig. 1 is that the present invention utilizes femtosecond laser directly to write the schematic flow sheet of micromechanical parts in glass inside; Existing is that example illustrates the inventive method with little gear, and visible by figure, the method that the present invention utilizes femtosecond laser directly to write micromechanical parts in glass inside comprises following two steps:
(1) femtosecond laser is directly write: test used three-D displacement platform 10 able to programme and be fixed on the microscopical Stage microscope of sharp Bath BX51 research grade difficult to understand.The platform center position has a square opening and is used to place slide glass, is the microscope light source for transmission illumination under the square opening.Fix an imaging ccd detector 11 directly over microscopical, three-D displacement platform 10 able to programme all links to each other with same computer 12 with ccd detector 11, can realize respectively that three-dimensional accurately the moving of sample controlled and monitoring in real time.Get the sintered glass sample 6 that is of a size of 10 mm * 5 mm * 3mm and upper and lower surface polishing; Be fixed in the cylindric transparent sample groove 9 after the ultrasonic cleaning and be fixed on the three-D displacement platform 10 the described sintered glass sample 6 of adding deionized water 5 submergences cylindric transparent sample groove 9 in; The milky sintered glass in immersion back becomes transparent.Sample cell 9 after the immersion is bonded on the slide glass, slide glass is fixed on the square opening zone of three-D displacement platform 10 able to programme.Femtosecond laser 3 pulsewidth when the little gear of sintered glass sample 6 machined is 40 ± 2 fs, and centre wavelength is 800 nm, and repetition rate is 1 kHz; The employing numerical aperture is 1.25 oil immersion microcobjective 4 focusing.Femtosecond laser 3 mean powers are 120mW.Femtosecond laser 3 gets into microscope through one group of reflecting element, after oil immersion microcobjective 4 focuses on sintered glass inside.The manual coarse adjustment Stage microscope is immersed in the deionized water 5 oil immersion microcobjective 4 fore-ends, and further fine tuning makes 11 pairs of sintered glass sample 6 upper surfaces of ccd detector become sharply defined image again.At this moment; Again through three-D displacement platform 10 sequence of control able to programme make platform to directly over move 150 microns; This distance is exactly that femtosecond laser 3 focuses on the working depth of back in sintered glass sample 6 inside through oil immersion microcobjective 4, and promptly the focus of femtosecond laser 3 is positioned at 150 microns places, sintered glass sample 6 upper surfaces below.In the time of according to 10 motions of programme driving three-D displacement platform, start femtosecond laser 3 irradiation sintered glass samples 6.In the inner selected gear forming of glass zone, directly write two diversion passages 7 (Fig. 2) according to size in the shaped region both sides.In order to make glass chip can discharge chamber smoothly, need to begin processing from diversion passage 7 and shaped region junction.Start self-editing platform sequence of control, shaped region is successively scanned from the bottom to top.Said time variable control femtosecond laser 3 is at the scanning pattern of shaped region, and the structural region of micromechanics will not ablated by femtosecond laser 3 and is able to keep.Through ccd detector 11 Real Time Observation processing effects,, the ablation poor effect carries out the multiple scanning operation when successively scanning if need adjusting femtosecond laser 3 power.Successively after the been scanned, obtain embedding little gear 8 structures of sintered glass sample 6 inside.Little gear 8 center drillings are nested on the cylindrical axis that processes with little gear 8 one.Little gear 8 working accuracies are one micron (see figure 3).
(2) annealing: the sintered glass sample that will directly write completion is put into High Temperature Furnaces Heating Apparatus 13, hour (see figure 4) of annealing under 1150 ℃ temperature.After the annealing, the nanoporous closure that sintered glass is inner, when feeding fluxion in the chamber, little gear 8 rotates around the said cylindrical axis that one processes.
Claims (2)
1. a method of utilizing femtosecond laser directly to write micromechanical parts in glass inside is characterized in that comprising the following steps:
(1) femtosecond laser is directly write:
1. the femtosecond laser direct-writing device is installed: three-D displacement platform able to programme (10) is fixed on the microscopical objective table of sharp Bath BX51 research grade difficult to understand; The center position of described three-D displacement platform able to programme (10) has a square opening and is used to place slide; It under this square opening microscopical light source for transmission illumination; Directly over this is microscopical, fix a ccd detector (11); Described three-D displacement platform able to programme (10) all links to each other with computer (12) with ccd detector (11); Cellular glass sample (6) is fixed in the transparent sample groove (9); In this transparent sample groove (9), add deionized water (5); With cellular glass sample (6) submergence fully; Said transparent sample groove (9) is bonded on the described slide, this slide is fixed on the square opening zone of three-D displacement platform able to programme;
2. femtosecond laser (3) gets into described microscope through one group of reflecting element; It is inner to focus on described sintered glass through oil immersion microcobjective (4); The described Stage microscope of manual coarse adjustment is immersed in the deionized water (5) fore-end of oil immersion microcobjective (4), and further fine tuning makes the one-tenth sharply defined image of described ccd detector (11) to sintered glass sample (6) upper surface again; Again computer (12) through sequence of control make three-D displacement platform able to programme (10) to directly over move a distance, this distance is exactly that femtosecond laser focuses on the working depth of back in sintered glass sample (6) inside through oil immersion microcobjective (4);
When 3. the work program of writing in advance according to micromechanical parts to be processed drives described three-D displacement platform able to programme (10) motion; Start femtosecond laser (3) light beam said sintered glass sample (6) is carried out irradiation processing, specific operation process is following:
According to the shaped region of size, at first directly write two diversion passages in described shaped region both sides at the inner appropriate depth selection of said sintered glass sample (6) micromechanical parts;
Then; Described femtosecond laser (3) is focused on the junction of diversion passage and shaped region; The said programming drives platform drive sintered glass sample of computer starting (6) carries out accurate three-dimensional and moves; Make the focus of the relative femtosecond laser of sample produce the accurate three-dimensional relative movement; Said femtosecond laser is in the scan processing of shaped region; And the structural region of irradiation micromechanics not, the structural region of micromechanical parts will not ablated by said femtosecond laser and will be able to keep;
When said femtosecond laser in the shaped region been scanned, will directly write out required micromechanical parts structure in described sample interior; Working accuracy is one micron;
(2) annealing: the sample behind the femtosecond laser irradiation is put into High Temperature Furnaces Heating Apparatus; Annealing is one hour under 1150 ℃ temperature; Nanoporous in the sintered glass of annealing back is closed, and the micromechanical parts structure of directly writing out remains, and finally obtains embedding the transparent inner micromechanical parts of fine and close glass.
2. method according to claim 1 is characterized in that described sintered glass sample is a porous borosilicate glass.
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| CN102875031A (en) * | 2012-09-12 | 2013-01-16 | 中国科学院上海光学精密机械研究所 | Method for electrolessly gilding surface of glass selectively |
| CN102981373A (en) * | 2012-11-26 | 2013-03-20 | 中国科学院上海光学精密机械研究所 | Y-shaped waveguide laser direct writing device |
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| CN102981373A (en) * | 2012-11-26 | 2013-03-20 | 中国科学院上海光学精密机械研究所 | Y-shaped waveguide laser direct writing device |
| CN103008882A (en) * | 2012-12-12 | 2013-04-03 | 桂林电子科技大学 | Micro-processing method and system for pulse laser fragile material |
| CN104209652A (en) * | 2013-05-31 | 2014-12-17 | 中自高科（苏州）光电有限公司 | Method for controlling shape of femtosecond laser induction crystalline silicon surface micro-nano structure |
| CN104209652B (en) * | 2013-05-31 | 2016-05-04 | 中自高科（苏州）光电有限公司 | A kind of method of controlling femtosecond laser induction crystal silicon surface micro-nano structure form |
| CN104925746A (en) * | 2015-05-06 | 2015-09-23 | 厦门大学 | Non-contact glass micro-nano structure processing method |
| CN104925746B (en) * | 2015-05-06 | 2017-01-18 | 厦门大学 | Non-contact glass micro-nano structure processing method |
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| CN107765367A (en) * | 2017-10-20 | 2018-03-06 | 河南工业大学 | A kind of femtosecond laser on inverse magnetic photosensitive glass directly inscribes the method for realizing magneto-optic waveguide |
| CN107855662A (en) * | 2017-10-20 | 2018-03-30 | 河南工业大学 | A kind of method that magneto-optic bio-sensing microchannel is prepared on magneto-optic glass |
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| CN108873172A (en) * | 2018-06-29 | 2018-11-23 | 中国科学院上海光学精密机械研究所 | A kind of powering on the preparation method of adjustable height quality thin film micro-optical device |
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