CN114910194A - Flexible pressure sensor with integrated structure and function and manufacturing method thereof - Google Patents
Flexible pressure sensor with integrated structure and function and manufacturing method thereof Download PDFInfo
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- CN114910194A CN114910194A CN202210831355.XA CN202210831355A CN114910194A CN 114910194 A CN114910194 A CN 114910194A CN 202210831355 A CN202210831355 A CN 202210831355A CN 114910194 A CN114910194 A CN 114910194A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 229910001338 liquidmetal Inorganic materials 0.000 claims abstract description 41
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 239000002905 metal composite material Substances 0.000 claims abstract description 15
- 238000000034 method Methods 0.000 claims abstract description 7
- 238000010146 3D printing Methods 0.000 claims abstract description 6
- 238000001291 vacuum drying Methods 0.000 claims abstract description 5
- 238000007789 sealing Methods 0.000 claims abstract description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 11
- 239000000956 alloy Substances 0.000 claims description 11
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 4
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 4
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 3
- 239000002041 carbon nanotube Substances 0.000 claims description 3
- 229910021389 graphene Inorganic materials 0.000 claims description 3
- 229920002379 silicone rubber Polymers 0.000 claims description 3
- 239000004945 silicone rubber Substances 0.000 claims description 3
- 229920005839 ecoflex® Polymers 0.000 claims description 2
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims 1
- 230000010354 integration Effects 0.000 claims 1
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 claims 1
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 claims 1
- 230000035945 sensitivity Effects 0.000 abstract description 6
- 238000002360 preparation method Methods 0.000 abstract description 3
- 230000008569 process Effects 0.000 abstract description 3
- 230000006870 function Effects 0.000 description 5
- 239000004433 Thermoplastic polyurethane Substances 0.000 description 4
- 238000011049 filling Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 3
- GJKGAPPUXSSCFI-UHFFFAOYSA-N 2-Hydroxy-4'-(2-hydroxyethoxy)-2-methylpropiophenone Chemical compound CC(C)(O)C(=O)C1=CC=C(OCCO)C=C1 GJKGAPPUXSSCFI-UHFFFAOYSA-N 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052733 gallium Inorganic materials 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 239000002086 nanomaterial Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000005086 pumping Methods 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229920006236 copolyester elastomer Polymers 0.000 description 1
- 125000004386 diacrylate group Chemical group 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 150000002009 diols Chemical class 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- -1 polydimethylsiloxane Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/005—Measuring force or stress, in general by electrical means and not provided for in G01L1/06 - G01L1/22
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/30—Auxiliary operations or equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
- B33Y40/20—Post-treatment, e.g. curing, coating or polishing
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/04—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor characterised by the coating material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
- C23C2/26—After-treatment
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Pressure Sensors (AREA)
Abstract
The invention discloses a structure function integrated flexible pressure sensor and a manufacturing method thereof, wherein the structure function integrated flexible pressure sensor comprises a flexible substrate, wherein a space interconnection conductive network is arranged in the flexible substrate; the liquid metal or the liquid metal composite material is filled in the space interconnection conductive network; and the two electrodes are embedded into the flexible substrate and are respectively connected with the upper layer and the lower layer of the space interconnection conductive network. The preparation method comprises the following steps: designing a flexible pressure sensor structure according to the pressure range and modeling; processing and manufacturing the flexible substrate by 3D printing according to modeling; immersing the flexible substrate in a container containing liquid metal; putting the container into a vacuum drying oven, vacuumizing to-0.1 MPa and keeping for 10min-20 min; opening a valve of the vacuum box to communicate the interior of the vacuum box with the atmospheric pressure, and keeping the interior of the vacuum box for 10-20 min; and after the liquid metal is filled in the space interconnection conductive network, inserting the electrode leads into the upper and lower electrode inlets of the flexible substrate, and curing and sealing. The invention has the advantages of high sensitivity, wide process application range and convenient processing.
Description
Technical Field
The invention relates to the technical field of sensors, in particular to a structure-function integrated flexible pressure sensor and a manufacturing method thereof.
Background
As a novel electronic device, the flexible pressure sensor has wide application in the application fields of human-computer interaction, medical health, robot touch and the like. However, the existing flexible pressure sensor has the problems of low sensitivity, small detection range and the like. The complex three-dimensional micro-nano structure can realize higher performance in a limited space, and the functional structure in the flexible pressure sensing system develops towards a three-dimensional (3D) geometric characteristic structure. If a hollow three-dimensional structure or a three-dimensional micro-nano structure (pyramid, cylinder, hemisphere and the like) is introduced, the stress bearing area is reduced, and the sensitivity and the lowest detection limit of the flexible pressure sensor can be improved. The existing three-dimensional complex structure manufactured based on MEMS and other traditional processes has many problems, such as high cost, incapability of manufacturing a true three-dimensional structure, insufficient adaptability of a complex curved surface, difficulty in controlling large-area bonding rate and consistency, difficulty in compatibility with a functional structure manufacturing process, packaging requirement, easiness in leakage of a liquid metal conducting layer and the like.
Disclosure of Invention
The invention aims to provide a structure and function integrated flexible pressure sensor and a manufacturing method thereof. The invention has the advantages of high sensitivity, wide process application range and convenient processing.
The technical scheme of the invention is as follows: a structure function integrated flexible pressure sensor comprises a flexible substrate, wherein a space interconnection conductive network is arranged in the flexible substrate;
the liquid metal or the liquid metal composite material is filled in the space interconnection conductive network;
and the two electrodes are embedded into the flexible substrate and are respectively connected with the upper layer and the lower layer of the space interconnection conductive network.
In the above structure-function integrated flexible pressure sensor, the flexible substrate is PEGDA, PDMS, TPU, Ecoflex or silicone rubber.
In the structure-function integrated flexible pressure sensor, the thickness of the flexible substrate is 0.5mm-2 mm;
in the structurally and functionally integrated flexible pressure sensor, the liquid metal is a Ga-based alloy.
In the structure-function integrated flexible pressure sensor, the liquid metal composite material is a mixture of Ga-based alloy and carbon nanotubes, copper and/or graphene.
In the structure-function integrated flexible pressure sensor, the electrode is made of Ga-based alloy.
In the structure-function integrated flexible pressure sensor, the thickness of the electrode is 0.1mm-0.3 mm;
in the structure-function integrated flexible pressure sensor, the space interconnection conductive network is an octahedron interconnection structure or a dodecahedron interconnection structure.
In the structure-function integrated flexible pressure sensor, the edge diameter of the space interconnection conductive network is 0.05mm-0.1 mm.
The manufacturing method of the structure-function integrated flexible pressure sensor comprises the following steps:
s1: designing a flexible pressure sensor structure according to the pressure range and modeling;
s2: processing and manufacturing the flexible substrate by 3D printing according to modeling;
s3: immersing the flexible substrate in a container containing a liquid metal or liquid metal composite;
s4: putting the container into a vacuum drying oven, vacuumizing to-0.1 MPa and keeping for 10min-20 min;
s5: opening a valve of the vacuum box to communicate the interior of the vacuum box with the atmospheric pressure, and keeping the interior of the vacuum box for 10-20 min;
s6: and after the liquid metal or the liquid metal composite material is filled in the space interconnection conductive network, inserting the electrode leads into the upper electrode inlet and the lower electrode inlet of the flexible substrate, and curing and sealing.
Compared with the prior art, the flexible pressure sensor adopts the space interconnection conductive network, has high structural sensitivity, and can adjust and control the pressure range by adjusting the size of the network. The preparation method effectively combines the advantages of 3D printing technology and easy filling of liquid metal or liquid metal composite material, can realize structure-function integrated manufacturing of the flexible sensor, avoids multilayer bonding and packaging, prevents liquid metal leakage, and improves device stability. The method has strong technological adaptability, and provides a new idea for manufacturing various flexible sensors with complex three-dimensional conductive structures.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic diagram of a manufacturing process of the present invention.
Detailed Description
The technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings, but is not to be taken as a basis for limiting the present invention.
Example 1: a structure function integrated flexible pressure sensor is shown in figure 1 and comprises a flexible substrate 1, wherein a space interconnected conductive network 2 is arranged in the flexible substrate 1;
the liquid metal 3 is filled in the space interconnection conductive network 2;
and the two electrodes 4 are embedded in the flexible substrate 1 and are respectively connected with the upper layer liquid metal 3 and the lower layer liquid metal 3 of the space interconnection conductive network 2.
In this embodiment, the flexible substrate is PEGDA (polyethylene glycol (diol) diacrylate); also PDMS (polydimethylsiloxane), TPU (thermoplastic polyurethane elastomer); TPU (aliphatic aromatic random copolyester) or silicone rubber.
The thickness of the flexible substrate is 2 mm; the liquid metal is an alloy consisting of 68.5% of Ga, 21.5% of In and 10% of Sn by mass fraction, or a mixture of Ga-based alloy and carbon nano tube, copper and/or graphene; the thickness of the electrode is 0.1mm, and the material of the electrode is consistent with that of the liquid metal; the space interconnection conductive network is of a dodecahedron structure and can also be of an octahedron structure. The edge diameter of the space interconnected conductive network is 0.05 mm.
As shown in fig. 2, the manufacturing steps are as follows:
s1: modeling according to the structure size of the flexible pressure sensor, and exporting files with formats such as STL (Standard template language) or OBJ (object-based joint);
s2: importing format files such as STL (Standard template library) and the like into a DLP (digital light processing) photocuring micro-nano 3D printer, and selecting PEGDA (99%) as a structural material and Irgacure2959 (1%) as a photoinitiator for printing and processing;
s3: sample post-treatment, dipping the flexible substrate into a container containing liquid metal (68.5% Ga, 21.5% In and 10% Sn);
s4: putting the container into a vacuum drying oven, vacuumizing to-0.1 MPa, keeping for 15min, and pumping out air in the cavity;
s5: opening a valve of the vacuum box to enable the interior of the vacuum box to be communicated with the atmospheric pressure, keeping the pressure for 15min, and filling liquid metal into an interconnected network cavity structure (namely a space interconnected conductive network) by utilizing the atmospheric pressure;
s6: after the liquid metal filled the space interconnected conductive network, the electrode leads were inserted into the upper and lower electrode inlets and coated with a mixture of PEGDA (99%) and Irgacure2959 (1%), cured and sealed with 365nm UV light source.
Example 2: a structure function integrated flexible pressure sensor is shown in figure 1 and comprises a flexible substrate 1, wherein a space interconnected conductive network 2 is arranged in the flexible substrate 1;
the liquid metal composite material 3 is filled in the space interconnection conductive network 2;
and the two electrodes 4 are embedded in the flexible substrate 1 and are respectively connected with the upper layer liquid metal 3 and the lower layer liquid metal 3 of the space interconnection conductive network 2.
In this embodiment, Agilus30(Stratasys) is selected as the flexible substrate; agilus30 is a PolyJet photosensitive resin with excellent tear strength and is able to withstand repeated flexing. The thickness of the flexible substrate is 2 mm; the liquid metal composite material is formed by mixing an alloy consisting of 68.5 mass percent of Ga, 21.5 mass percent of In and 10 mass percent of Sn with copper nano powder (50 nm); the thickness of the electrode is 0.1mm, and the material is an alloy consisting of 68.5% of Ga, 21.5% of In and 10% of Sn by mass fraction; the space interconnection conductive network is of a dodecahedron structure; the edge diameter of the space interconnected conductive network is 0.05 mm.
The manufacturing steps are as follows:
s1: modeling according to the structure size of the flexible pressure sensor, and exporting files with formats such as STL (Standard template language) or OBJ (object-based joint);
s2: importing the STL format file into an ink-jet printer J750, and selecting Agilus30 as a structural material for printing and processing;
s3: uniformly stirring an alloy consisting of 68.5% of Ga, 21.5% of In and 10% of Sn by mass percent and a liquid metal composite material consisting of copper nano powder (50 nm), wherein the mass percent of copper In the mixture is 5%;
s4: 3D printing sample post-treatment, namely immersing the flexible substrate with the cavity structure into a container filled with a liquid metal composite material;
s5: putting the container into a vacuum drying oven, vacuumizing to-0.1 MPa, keeping for 15min, and pumping out air in the cavity;
s6: opening a valve of the vacuum box to enable the interior of the vacuum box to be communicated with the atmospheric pressure, keeping the pressure for 15min, and filling the mixture into the cavity structure of the interconnection network by utilizing the atmospheric pressure;
s7: and after the liquid metal composite material is filled in the space interconnection conductive network, inserting the electrode leads into the inlets of the upper electrode and the lower electrode, coating Agilus30, curing and sealing.
The flexible pressure sensor adopts a space interconnection conductive network, has high structural sensitivity, and can adjust and control the pressure range by adjusting the size of the network. The preparation method effectively combines the advantages of 3D printing technology and easy filling of liquid metal, can realize structure-function integrated manufacturing of the flexible sensor, avoids multilayer bonding and packaging, prevents liquid metal leakage, and improves device stability. The method has strong technological adaptability, and provides a new idea for manufacturing various flexible sensors with complex three-dimensional conductive structures.
Claims (10)
1. The utility model provides a flexible pressure sensor of structure function integration which characterized in that: the flexible substrate is internally provided with a space interconnection conductive network;
the liquid metal or the liquid metal composite material is filled in the space interconnection conductive network;
and the two electrodes are embedded into the flexible substrate and are respectively connected with the upper layer and the lower layer of the space interconnection conductive network.
2. The structurally-functionally integrated flexible pressure sensor of claim 1, wherein: the flexible substrate is PEGDA, PDMS, TPU, Ecoflex or silicone rubber.
3. The structurally-functionally integrated flexible pressure sensor of claim 1, wherein: the thickness of the flexible substrate is 0.5mm-2 mm.
4. The structurally-functionally integrated flexible pressure sensor of claim 1, wherein: the liquid metal is a Ga-based alloy.
5. The structurally-functionally integrated flexible pressure sensor of claim 1, wherein: the liquid metal composite material is a mixture of Ga-based alloy and carbon nano tubes, copper and/or graphene.
6. The structurally-integrated flexible pressure sensor of claim 1, wherein: the electrode is made of Ga-based alloy.
7. The structurally-integrated flexible pressure sensor of claim 1, wherein: the thickness of the electrode is 0.1mm-0.3 mm.
8. The structurally-functionally integrated flexible pressure sensor of claim 1, wherein: the space interconnection conductive network is of an octahedral interconnection structure or a dodecahedral interconnection structure.
9. The structurally-integrated flexible pressure sensor of claim 8, wherein: the edge diameter of the space interconnection conductive network is 0.05mm-0.1 mm.
10. A method for manufacturing a structurally and functionally integrated flexible pressure sensor according to any one of claims 1 to 9, wherein: the method comprises the following steps:
s1: designing a flexible pressure sensor structure according to the pressure range and modeling;
s2: processing and manufacturing the flexible substrate by 3D printing according to modeling;
s3: immersing the flexible substrate in a container containing a liquid metal or liquid metal composite;
s4: putting the container into a vacuum drying oven, vacuumizing to-0.1 MPa and keeping for 10min-20 min;
s5: opening a valve of the vacuum box to communicate the interior of the vacuum box with the atmospheric pressure, and keeping the interior of the vacuum box for 10-20 min;
s6: and after the liquid metal or the liquid metal composite material is filled in the space interconnection conductive network, inserting the electrode leads into the upper electrode inlet and the lower electrode inlet of the flexible substrate, and curing and sealing.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210831355.XA CN114910194A (en) | 2022-07-15 | 2022-07-15 | Flexible pressure sensor with integrated structure and function and manufacturing method thereof |
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| CN202210831355.XA CN114910194A (en) | 2022-07-15 | 2022-07-15 | Flexible pressure sensor with integrated structure and function and manufacturing method thereof |
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|---|---|---|---|---|
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| CN111964815A (en) * | 2020-08-17 | 2020-11-20 | 常州大学 | Flexible pressure sensor and manufacturing method thereof |
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| CN113724921A (en) * | 2021-09-22 | 2021-11-30 | 宁波韧和科技有限公司 | Flexible structure unit, flexible pressure switch and flexible pressure sensor |
-
2022
- 2022-07-15 CN CN202210831355.XA patent/CN114910194A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20190234816A1 (en) * | 2016-10-04 | 2019-08-01 | Jeffrey LaBelle | Flexible sensors incorporating piezoresistive composite materials and fabrication methods |
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| JP2021148652A (en) * | 2020-03-19 | 2021-09-27 | 国立大学法人大阪大学 | Tactile sensor |
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| Title |
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| 张琦: "基于液态金属的柔性压力传感器的研究", 《中国优秀硕士学位论文全文数据库 工程科技Ⅰ辑》 * |
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Application publication date: 20220816 |