CN114839398A - Capacitive flexible acceleration sensor and preparation method thereof - Google Patents
Capacitive flexible acceleration sensor and preparation method thereof Download PDFInfo
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- CN114839398A CN114839398A CN202210457588.8A CN202210457588A CN114839398A CN 114839398 A CN114839398 A CN 114839398A CN 202210457588 A CN202210457588 A CN 202210457588A CN 114839398 A CN114839398 A CN 114839398A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0862—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with particular means being integrated into a MEMS accelerometer structure for providing particular additional functionalities to those of a spring mass system
Abstract
The invention discloses a capacitive flexible acceleration sensor and a preparation method thereof. The anchor area fixing layer comprises four symmetrically arranged anchor area fixing structures which are respectively positioned on four sides of the square; the second flexible conductive substrate comprises a square area positioned in the center and snake-shaped bent spring structures respectively positioned on the periphery of the square area; one ends of the four serpentine bent spring structures are respectively and fixedly connected with four edges of the square area; the other ends of the four serpentine-shaped bent spring structures are respectively fixed on the upper surfaces of the four anchor area fixing structures. The capacitive flexible sensor disclosed by the invention can realize the detection of acceleration, and has the advantages of large measuring range, high sensitivity, simple and easy preparation method and high feasibility.
Description
Technical Field
The invention relates to a capacitive acceleration sensor, in particular to a high-sensitivity capacitive flexible acceleration sensor structure and a preparation method thereof.
Background art:
the MEMS accelerometer has the advantages of small volume, low cost, low power consumption, good stability and the like, is widely applied to tests of acceleration, vibration, impact, inclination angle and the like in the fields of military, medical treatment, automobiles and industrial control, and is a core component of a miniaturized inertial measurement unit. The MEMS accelerometers have different detection principles, such as capacitance, piezoresistive, resonant, optical, tunneling current, etc., and the capacitance detection is widely adopted by the middle-high MEMS accelerometers due to its good sensitivity, temperature characteristics and dynamic characteristics.
The capacitive accelerometer can be mainly divided into a comb type, a torsional pendulum type, a cantilever beam type and the like according to the structure. The comb tooth type micro accelerometer has the characteristics of high sensitivity, good temperature stability, relatively simple structure, relatively low power consumption, good direct current characteristic and the like, but is easily subjected to electromagnetic interference. The accelerometer can improve the resolution ratio by connecting a plurality of capacitors with smaller polar plate areas to form a relatively larger capacitor, and can manufacture a feedback structure to realize that closed-loop control is beneficial to improving the precision. The torsional pendulum type capacitive accelerometer is also called as a teeterboard pendulum type capacitive accelerometer, and is named because the sensitive mass is twisted around the elastic beam to be shaped like a teeterboard. A typical representation of this is the micromechanical accelerometer developed by Draper laboratories in 1990, the sensitive mass of which forms a differential sensing capacitance with the underlying glass substrate. Because the mass and the inertia moment of the mass plate are respectively positioned at two sides of the torque-bearing beam are not equal, when acceleration vertical to the mass plate is input, the mass plate rotates around the supporting beam, so that the corresponding pair of differential capacitors is increased and decreased one by one, and the acceleration input along the sensitive shaft can be obtained by measuring the differential capacitance value. The cantilever beam type silicon micro mechanical accelerometer is also called Sandwich pendulum type capacitance accelerometer, and is a micro mechanical accelerometer with a Sandwich structure, so that the name of the cantilever beam type silicon micro mechanical accelerometer is that a movable polar plate is clamped in the middle of a fixed polar plate to form a Sandwich (Sandwich). The structure is relatively simple, the movable polar plate of the capacitor is made of the upper and lower surfaces of the sensitive mass silicon pendulous reed in the middle by an electroplating method, and the movable polar plate and the corresponding fixed polar plate form a group of differential capacitors to sense the magnitude of the input acceleration. When the mass block is excited by acceleration to move up and down, the distance between the capacitor plates changes, the size of the differential capacitor changes, the theoretical derivation shows that the size of the differential capacitor and the acceleration are in an approximate linear proportional relation under the condition that the displacement of the mass block is small, and the cantilever beam type structure has the advantages of large sensitive mass, few error sources, large precision potential and the like.
With the rise of the era of intelligent terminals and internet of things, acceleration sensors are used as basic sensing devices in the internet of things, and application requirements of acceleration monitoring on curved surfaces and movable substrates are increased, such as intelligent robots, industrial applications, smart medical applications, wearable applications and the like. The rigid substrate of the traditional silicon-based MEMS acceleration sensor cannot be compatible with a flexible or curved surface substrate to be measured, so that the development of the flexible acceleration sensor is urgent.
Disclosure of Invention
The purpose of the invention is as follows: aiming at the technical problem, a capacitive flexible acceleration sensor and a preparation method thereof are provided.
The technical scheme is as follows: the invention discloses a capacitive flexible acceleration sensor which comprises a first flexible conductive substrate, an anchor area fixing layer, a second flexible conductive substrate and a mass block, wherein the first flexible conductive substrate, the anchor area fixing layer, the second flexible conductive substrate and the mass block are sequentially arranged from bottom to top; the first flexible conductive substrate comprises a first base layer and a capacitor lower electrode layer arranged on the upper surface of the first base layer; the anchor area fixing layer comprises four symmetrically arranged anchor area fixing structures which are respectively positioned on four sides of the square; the second flexible conductive substrate comprises a second base layer and a capacitor upper electrode layer arranged on the lower surface of the second base layer. The second substrate layer and the capacitor upper electrode layer have the same structure; the second substrate layer and the capacitor upper electrode layer respectively comprise a square area positioned in the center and snake-shaped bent spring structures respectively positioned on the periphery of the square area; one ends of the four serpentine bent spring structures are respectively and fixedly connected with four edges of the square area; the other ends of the four serpentine-shaped bent spring structures are respectively fixed on the upper surfaces of the four anchor area fixing structures. The mass block is located on the upper surface of the square area of the second flexible conductive substrate.
When the sensor accelerates, the distance between the upper electrode layer and the lower electrode layer of the capacitor changes, and thus the capacitance between the upper electrode layer and the lower electrode layer of the capacitor also changes, so that the acceleration can be known according to the change of the capacitance.
Furthermore, the first substrate layer and the second substrate layer are flexible and bendable organic layers and have certain thickness.
Further, the first flexible conductive substrate is made of a polyethylene terephthalate (PET) -Indium Tin Oxide (ITO) commercial material and has a flexible organic material, wherein the PET is a base layer, and the ITO is a capacitor lower electrode layer with a size of 60mm by 2 mm.
The anchor area fixing structure is made of stretchable flexible organic materials with high elastic modulus, specifically polydimethylsiloxane PDMS, and is prepared in a pouring and molding mode, and the size of the anchor area fixing structure is 20mm x 5mm x 1 mm.
Furthermore, the second flexible conductive substrate is made of an ITO-PET material, and a laser cutting method is adopted to form a snake-shaped bent spring structure with a middle square area and symmetrical periphery. The middle square area is 20mm, wherein Indium Tin Oxide (ITO) is the conductive layer of the upper electrode layer of the capacitor.
Furthermore, the mass block is made of polydimethylsiloxane PDMS material in a pouring and molding mode, has the size of 18mm by 2mm, and is attached to the center of the square area in the middle of the second flexible conductive substrate.
The invention discloses a preparation method of a capacitive flexible acceleration sensor, which comprises the following steps:
step 1: laser cutting a first flexible conductive substrate, wherein the first flexible conductive substrate comprises a basal layer and a capacitor lower electrode layer;
step 2: preparing four same cuboid structures serving as anchor area fixing structures by adopting a pouring and molding mode, and attaching the four anchor area fixing structures to the surface of the first flexible conductive substrate in a centrosymmetric manner;
and 3, step 3: laser cutting the second flexible conductive substrate into a square area in the middle of the ruler and a snake-shaped bent spring structure with symmetrical periphery;
and 4, step 4: the cuboid structure is prepared by adopting a pouring and die building mode to serve as a mass block, the mass block is attached to the surface of a square area of the second flexible conductive substrate, and then the tail end of the snake-shaped bent spring structure is attached to the upper surface of the anchor area fixing structure, so that the acceleration sensor is manufactured.
Has the advantages that: compared with the prior art, the capacitive flexible acceleration sensor has the following advantages:
firstly, in terms of structural design and material selection, a substrate layer is made of flexible and bendable PET materials; the anchoring area fixing structure is made of PDMS material with good mechanical stability, the process is simple and safe, and the sensor substrate can be attached to the curved surface;
secondly, when the sensor is excited by acceleration to move up and down, the distance between the capacitor plates is changed, the size of the differential capacitor is changed, and the snake-shaped bent spring structure improves the maximum stress which can be borne by the sensor, so that the sensor has a large measuring range;
thirdly, the snake-shaped bent spring structure and the mass block can increase the distance of change of the distance between the capacitor plates under the action of acceleration, and the sensitivity of the device can be improved.
Drawings
Fig. 1 is a schematic structural diagram and a structural cross-sectional view of a capacitive flexible acceleration sensor according to an embodiment of the present invention.
Fig. 2 is a schematic diagram and a structural cross-sectional view of a first step of a manufacturing method of a capacitive flexible acceleration sensor according to an embodiment of the present invention.
Fig. 3 is a schematic diagram and a structural cross-sectional view of a second step of the manufacturing method of the capacitive flexible acceleration sensor in the embodiment of the invention.
Fig. 4 is a schematic diagram and a structural cross-sectional view of a third step of the manufacturing method of the capacitive flexible acceleration sensor in the embodiment of the invention.
Fig. 5 is a schematic diagram and a structural cross-sectional view of a fourth step of the manufacturing method of the capacitive flexible acceleration sensor in the embodiment of the invention.
Wherein, 1, a first substrate layer; 2. a capacitor lower electrode layer; 3. an anchor area securing structure; 4. a second flexible conductive substrate; 41. a second substrate layer; 42. an upper electrode layer of a capacitor; 411. a square region; 412. a serpentine bent spring structure; 5. and a mass block.
Detailed Description
The invention is further explained below with reference to the drawings.
The invention discloses a capacitive flexible acceleration sensor which comprises a first flexible conductive substrate, an anchor area fixing layer, a second flexible conductive substrate 4 and a mass block 5 which are sequentially arranged from bottom to top;
the first flexible conductive substrate comprises a first base layer 1 and a capacitance lower electrode layer 2 arranged on the upper surface of the first base layer 1; the first base layer 1 is a flexible and bendable organic layer and has a certain thickness, the first flexible conductive substrate is made of a polyethylene terephthalate (PET) -Indium Tin Oxide (ITO) commercial material and has a flexible and bendable organic material, wherein the PET is the base layer, and the ITO is a capacitor lower electrode layer 2 with the size of 60mm 2 mm.
The anchor area fixing layer comprises four symmetrically arranged anchor area fixing structures 3, and the four anchor area fixing structures 3 are respectively positioned on four sides of the square; the anchor area fixing structure 3 is made of stretchable flexible organic material Polydimethylsiloxane (PDMS) with high elastic modulus in a pouring and molding mode, and the size of the anchor area fixing structure is 20mm x 5mm x 1 mm.
The second flexible conductive substrate 4 includes a second base layer 41, and a capacitor upper electrode layer 42 disposed on a lower surface of the second base layer 41. The second substrate layer 41 and the capacitor upper electrode layer 42 have the same structure; the second flexible conductive substrate 4 is made of ITO-PET, wherein ITO is a conductive layer of an upper electrode layer of the capacitor, and the PET layer is a second substrate layer. Manufacturing the spring into a middle square area 411 and the periphery of the square area, wherein the size of the middle square area is 20mm x 20mm, and serpentine bent spring structures 412 are respectively positioned on the periphery of the square area, and one ends of the four serpentine bent spring structures 412 are respectively and fixedly connected with four edges of the square area 411; the other ends of the four serpentine-shaped bent spring structures 412 are respectively fixed on the upper surfaces of the four anchor region fixing structures 3.
The proof mass 5 is located on the upper surface of the square area 411 of the second flexible conductive substrate 4. The flexible conductive substrate is made of polydimethylsiloxane PDMS materials in a pouring and molding mode, the size of the PDMS materials is 18mm 2mm, and the PDMS materials are attached to the center of the square area 411 in the middle of the second flexible conductive substrate 4.
When the sensor accelerates, the distance between the upper capacitor electrode 42 and the lower capacitor electrode 2 changes, and the capacitance between the upper capacitor electrode 42 and the lower capacitor electrode 2 also changes, so the acceleration is known according to the change of the capacitance.
The invention discloses a preparation method of a capacitive flexible acceleration sensor, which comprises the following steps:
step 1: laser cutting a first flexible conductive substrate, wherein the first flexible conductive substrate comprises a basal layer and a capacitor lower electrode layer 2; the first flexible conductive substrate is 2mm in thickness and 60mm x 60mm in size, the first flexible conductive substrate is a PET-ITO flexible conductive substrate, the PET layer is used as a base layer, and the ITO layer is used as a lower electrode layer 2 of the capacitor;
step 2: preparing PDMS into four identical cuboid structures serving as anchor area fixing structures 3 with the specific size of 20mm x 5mm x 1mm by adopting a pouring and molding mode, and attaching the four anchor area fixing structures 3 to the surface of the first flexible conductive substrate in a centrosymmetric manner;
and step 3: laser cutting the second flexible conductive substrate 4 into a square area 411 in the middle of the ruler and a serpentine bent spring structure 412 with symmetrical periphery; the second flexible conductive substrate is an ITO-PET flexible conductive substrate with the thickness of 2mm, and the size of the middle square area 411 is 20mm by 20mm
And 4, step 4: preparing a cubic structure with the size of 18mm x 2mm as a mass block 5 by adopting a pouring and die-building mode, attaching the mass block 5 to the surface of the square area 411 of the second flexible conductive substrate, and then attaching the tail end of the snake-shaped bent spring structure 412 to the upper surface of the anchor area fixing structure 3 to complete the manufacture of the acceleration sensor.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and amendments can be made without departing from the principle of the present invention, and these modifications and amendments should also be considered as the protection scope of the present invention.
Claims (8)
1. A capacitive flexible acceleration sensor is characterized by comprising a first flexible conductive substrate, an anchor area fixing layer, a second flexible conductive substrate and a mass block which are sequentially arranged from bottom to top;
the first flexible conductive substrate comprises a first base layer and a capacitor lower electrode layer arranged on the upper surface of the first base layer;
the anchor area fixing layer comprises four symmetrically arranged anchor area fixing structures which are respectively positioned on four edges of the square;
the second flexible conductive substrate comprises a second base layer and a capacitor upper electrode layer arranged on the lower surface of the second base layer; the second substrate layer and the capacitor upper electrode layer have the same structure;
the second substrate layer and the capacitor upper electrode layer respectively comprise a square area positioned in the center and snake-shaped bent spring structures respectively positioned on the periphery of the square area; the four serpentine bending spring structures are symmetrically arranged, and one ends of the four serpentine bending spring structures are fixedly connected with four edges of the square area respectively; the other ends of the four serpentine bending spring structures are respectively fixed on the upper surfaces of the four anchor area fixing structures;
the mass block is located on the upper surface of the square area of the second flexible conductive substrate.
2. The capacitive flexible acceleration sensor of claim 1, characterized in, that the first substrate layer and the second substrate layer are both flexible bendable organic layers.
3. The capacitive flexible acceleration sensor of claim 2, characterized in that the first flexible conductive substrate is made of PET-ITO, wherein PET is a base layer and ITO is a lower electrode layer of the capacitor.
4. The capacitive flexible acceleration sensor of claim 1, characterized in that the anchor area fixing structure is made of stretchable flexible organic material with high elastic modulus.
5. The capacitive flexible acceleration sensor of claim 1, characterized in, that the anchor area fixing structure is in particular polydimethylsiloxane PDMS.
6. The capacitive flexible acceleration sensor of claim 1, wherein the second flexible conductive substrate is made of ITO-PET, and is formed by laser cutting to form a serpentine-shaped bent spring structure with a middle square area and a periphery being symmetrical.
7. The capacitive flexible acceleration sensor of claim 1, characterized in that, the mass block is made of polydimethylsiloxane PDMS and attached to the center of the square area in the middle of the second flexible conductive substrate.
8. A method for manufacturing a capacitive flexible acceleration sensor according to claim 1, characterized in that it comprises the following steps:
step 1: laser cutting a first flexible conductive substrate, wherein the first flexible conductive substrate comprises a basal layer and a capacitor lower electrode layer;
step 2: preparing four same cuboid structures serving as anchor area fixing structures by adopting a pouring and molding mode, and attaching the four anchor area fixing structures to the surface of the first flexible conductive substrate in a centrosymmetric manner;
and step 3: laser cutting the second flexible conductive substrate into a square area in the middle of the ruler and a snake-shaped bent spring structure with symmetrical periphery;
and 4, step 4: and preparing a cuboid structure as a mass block by adopting a pouring and molding mode, attaching the mass block to the surface of a square area of the second flexible conductive substrate, and then attaching the tail end of the S-shaped bent spring structure to the upper surface of the anchor area fixing structure to complete the manufacture of the acceleration sensor.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115389782A (en) * | 2022-08-26 | 2022-11-25 | 南京高华科技股份有限公司 | MEMS capacitive accelerometer and preparation method thereof |
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