CN114836036A - Heat conduction material with vertical orientation structure and preparation method and application thereof - Google Patents

Heat conduction material with vertical orientation structure and preparation method and application thereof Download PDF

Info

Publication number
CN114836036A
CN114836036A CN202210632875.8A CN202210632875A CN114836036A CN 114836036 A CN114836036 A CN 114836036A CN 202210632875 A CN202210632875 A CN 202210632875A CN 114836036 A CN114836036 A CN 114836036A
Authority
CN
China
Prior art keywords
heat conduction
vertical orientation
heat
fan
conduction material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202210632875.8A
Other languages
Chinese (zh)
Other versions
CN114836036B (en
Inventor
王玉琼
吕卫帮
高宁萧
杨文刚
曲抒旋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Suzhou Institute of Nano Tech and Nano Bionics of CAS
Qiantang Science and Technology Innovation Center
Original Assignee
Suzhou Institute of Nano Tech and Nano Bionics of CAS
Qiantang Science and Technology Innovation Center
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suzhou Institute of Nano Tech and Nano Bionics of CAS, Qiantang Science and Technology Innovation Center filed Critical Suzhou Institute of Nano Tech and Nano Bionics of CAS
Priority to CN202210632875.8A priority Critical patent/CN114836036B/en
Publication of CN114836036A publication Critical patent/CN114836036A/en
Application granted granted Critical
Publication of CN114836036B publication Critical patent/CN114836036B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/041—Carbon nanotubes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C08K3/042—Graphene or derivatives, e.g. graphene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C08K2003/382—Boron-containing compounds and nitrogen
    • C08K2003/385—Binary compounds of nitrogen with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P20/00—Technologies relating to chemical industry
    • Y02P20/10—Process efficiency

Abstract

The invention provides a heat conduction material with a vertical orientation structure, and a preparation method and application thereof. The preparation method of the heat conduction material with the vertical orientation structure comprises the following steps: 1) the plane heat conduction material is arranged between the gears, and the plane heat conduction material forms a fan-like structure with vertical orientation through the meshing action between the gears; 2) and (3) injecting an elastic material during occlusion to fix the fan-like structure formed in the step 1) to obtain the heat conduction material with the vertical orientation structure. The heat conduction material prepared by the invention can realize the controllable preparation of a vertical orientation structure, has high heat conduction performance in vertical orientation, has good compression resilience and strength, and improves the operability of subsequent die cutting.

Description

Heat conduction material with vertical orientation structure and preparation method and application thereof
Technical Field
The invention belongs to the technical field of heat conduction materials, relates to a heat conduction material, and a preparation method and application thereof, and particularly relates to a heat conduction material with a vertical orientation structure, and a preparation method and application thereof.
Background
Along with the technical development in the fields of 5G, big data, artificial intelligence, the internet of things, industry 4.0 and the like, the power density of electronic devices is continuously rising, so in order to ensure that heat generated by heating electronic components can be timely discharged and electromagnetic signals can be effectively prevented from influencing other devices, efficient heat-conducting and electromagnetic shielding integrated materials and schemes are urgently needed to ensure the efficiency, reliability, safety, durability and continuous stability of products.
The traditional vertical heat conduction material is mainly filled with high heat conduction ceramic particles such as aluminum nitride, aluminum oxide, azotizer, silicon carbide and other materials in a high polymer matrix, but the prepared thermal interface material has low thermal conductivity which is mostly 1-5W/m.K, does not have electromagnetic shielding effect, and is difficult to meet the heat dissipation problem caused by the large increase of the power density of each electronic component.
The metal material has higher heat-conducting property and electromagnetic shielding efficiency, but has no compressibility, cannot fill air gaps among devices, and cannot effectively reduce interface thermal resistance.
Carbon nanomaterials have ultra-high thermal conductivity and have been widely used to solve the problem of heat dissipation. However, the carbon nano material is filled when in use, and the thermal conductivity cannot meet the requirement; the constructed vertically aligned array has problems such as substrate dependence and difficulty in industrial production. At present, two ways are mainly adopted, one way is to blend Graphene or carbon nanotubes with a High Polymer material, but the vertical Thermal conductivity of the obtained material is difficult to exceed 10W/m.k, and the obtained material is accompanied with the product stability brought by the uneven dispersion of the nanomaterial in the High Polymer matrix, Park et al (High Through-Plane Thermal conductivity of Graphene Nanoflake Polymer compounds Melt-Processed in an L-Shape kit Tube, ACSAppl. mater. interface 2015,7,15256.) the Graphene filler is dispersed and directionally arranged in the Polymer, and when the composite material contains 25% of Graphene, the vertical Thermal conductivity of the matrix is 10W/m.k; another Application mode is to construct a vertically oriented Graphene or carbon nanotube array, and to prepare a VG array with a height of 18.7 μm by using an alcohol-based Electric Field Assisted PECVD method by using Electric-Field-Assisted Growth of Vertical Graphene Arrays and the Application in Thermal Interface Materials, adv.Funct.Mater.2020 and 30,2003302 (Kyoto university of Beijing, Zhang teacher, etc.), wherein the Vertical Thermal conductivity can reach 53.5W/m.K, and the Application convenience is still a problem although the material Thermal conductivity is high.
CN109881038B discloses a heat-conducting electromagnetic shielding composite material, which comprises a polymer matrix composite material and a heat-conducting electromagnetic shielding film skeleton embedded therein and having a vertical orientation structure; the framework of the heat-conducting electromagnetic shielding film is parallel to the extension direction of the polymer-based composite material; the heat-conducting electromagnetic shielding film framework is a composite film of any one or more of gold foil, silver foil, copper foil, nickel foil, aluminum foil, iron foil, titanium foil, zinc foil, chromium foil, cobalt foil, stainless steel plate and metal alloy; the thickness of the heat-conducting electromagnetic shielding film framework is 0.01mm-0.2 mm. The invention has low cost, simple structure, simple and easy manufacture, can be produced in mass production, and can be used as a thermal interface material and an electromagnetic shielding material of electronic devices. However, the vertical structure of the material is a vertical orientation structure made of the high thermal conductivity shielding film by a simple mechanical design and processing method such as a rolling method, and the controllable preparation of the vertical orientation structure cannot be realized, and the thermal conductivity and the compressibility need to be further improved.
Therefore, there is a need to develop a material having high thermal conductivity and good compressibility in a vertically oriented structure.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide a heat conduction material with a vertical orientation structure, a preparation method and application thereof.
One of the objectives of the present invention is to provide a method for preparing a heat conductive material with a vertical orientation structure, and to achieve the objective, the present invention adopts the following technical scheme:
a method for preparing a heat conducting material with a vertical orientation structure comprises the following steps:
1) the plane heat conduction material is arranged between the gears, and the plane heat conduction material forms a fan-like structure with vertical orientation through the meshing action between the gears;
2) and (3) injecting an elastic material during occlusion to fix the fan-like structure formed in the step 1) to obtain the heat conduction material with the vertical orientation structure.
According to the preparation method of the heat conduction material with the vertical orientation structure, the fan-shaped structure with the vertical orientation is formed by controlling the meshing effect of the gears, the gap of the fan-shaped structure with the vertical orientation can be effectively controlled, and the controllable preparation of the vertical orientation structure is realized, such as the vertical orientation height of a film and the vertical orientation width; meanwhile, an elastic material is injected, so that the vertical heat conduction performance and the compressibility resilience performance of the film are effectively regulated and controlled; the problems that the current thermal interface material is low in thermal conductivity, pure carbon and metal materials are low in compressibility, single in performance and the like are solved; the heat conduction material prepared by the invention can realize high heat conduction in the vertical direction and compressible joint filling capability, the heat conduction coefficient of the prepared heat conduction material in the vertical orientation is 6-600W/m.K, the compression rate is 10-60%, the stability of the vertical structure can be kept and the situation of slag falling and the like can not occur in the subsequent die cutting and using processes, and the heat conduction material can be applied to the fields of heat management materials and the like.
In step 1), the pitch of the gears is 0.01 to 1000. mu.m, for example, 0.01. mu.m, 0.02. mu.m, 0.03. mu.m, 0.04. mu.m, 0.05. mu.m, 0.06. mu.m, 0.07. mu.m, 0.08. mu.m, 0.09. mu.m, 0.1. mu.m, 0.2. mu.m, 0.3. mu.m, 0.4. mu.m, 0.5. mu.m, 0.6. mu.m, 0.7. mu.m, 0.8. mu.m, 0.9. mu.m, 1. mu.m, 2. mu.m, 3. mu.m, 4. mu.m, 5. mu.m, 6. mu.m, 7. mu.m, 8. mu.m, 9. mu.m, 10. mu.m, 11. mu.m, 12. mu.m, 13. mu.m, 14. mu.m, 15. mu.m, 16. mu.m, 17. mu.m, 18. mu.m, 19. mu.m, 20. mu.m, 21. mu.m, 22. mu.m, 23 μm, 24. mu.m, 25. mu.m, 30 μm, 35 μm, 33. mu.m, 33 μm, 30 μm, 33 μm, 30 μm, 33 μm, 25 μm, 33 μm, 25 μm, 33 μm, 25 μm, 33 μm, 25 μm, 36 μm, 33 μm, 25 μm, 33 μm, 25 μm, 30 μm, 25 μm, 33 μm, 25 μm, 30 μm, 25 μm, 33 μm, 25 μm, 30 μm, 25 μm, 33 μm, 25 μm, 30 μm, 33 μm, 30 μm, 25 μm, 41 μm, 42 μm, 43 μm, 44 μm, 45 μm, 46 μm, 47 μm, 48 μm, 49 μm, 50 μm, 51 μm, 52 μm, 53 μm, 54 μm, 55 μm, 56 μm, 57 μm, 58 μm, 59 μm, 60 μm, 61 μm, 62 μm, 63 μm, 64 μm, 65 μm, 66 μm, 67 μm, 68 μm, 69 μm, 70 μm, 71 μm, 72 μm, 73 μm, 74 μm, 75 μm, 76 μm, 77 μm, 78 μm, 79 μm, 80 μm, 81 μm, 82 μm, 83 μm, 84 μm, 85 μm, 86 μm, 87 μm, 88 μm, 89 μm, 90 μm, 91 μm, 92 μm, 93 μm, 94 μm, 95 μm, 96 μm, 97 μm, 99 μm, 100 μm, 400 μm, 500 μm, 100 μm, 99 μm, 60 μm, and 70 μm, 700 μm, 800 μm, 900 μm or 1000 μm, preferably 0.1 to 50 μm, more preferably 0.5 to 20 μm; the depth of the gear is 10 to 5000 μm, for example, 10 μm, 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, 100 μm, 200 μm, 300 μm, 400 μm, 500 μm, 600 μm, 700 μm, 800 μm, 900 μm, 1000 μm, 1500 μm, 2000 μm, 2500 μm, 3000 μm, 3500 μm, 4000 μm, 4500 μm, 5000 μm, etc., preferably 30 to 2000 μm, more preferably 50 to 1000 μm.
In step 1), the gap of the fan-like structure is 0.005 to 1000 μm, for example, 0.005 μm, 0.01 μm, 0.05 μm, 0.1 μm, 0.5 μm, 1 μm, 5 μm, 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, 55 μm, 60 μm, 65 μm, 70 μm, 75 μm, 80 μm, 85 μm, 90 μm, 95 μm, 100 μm, 200 μm, 300 μm, 400 μm, 500 μm, 600 μm, 700 μm, 800 μm, 900 μm, or 1000 μm, etc., preferably 0.001 to 50 μm, further preferably 0.001 to 20 μm; the height of the fan-like shape is 10 to 5000 μm, for example, 10 μm, 20 μm, 30 μm, 50 μm, 60 μm, 80 μm, 100 μm, 200 μm, 300 μm, 400 μm, 500 μm, 600 μm, 700 μm, 800 μm, 900 μm, 1000 μm, 1500 μm, 2000 μm, 2500 μm, 3000 μm, 3500 μm, 4000 μm, 4500 μm, 5000 μm, etc., preferably 30 to 2000 μm, and more preferably 50 to 1000 μm.
In the step 1), the plane heat conduction material is a carbon-based film and/or an inorganic heat conduction film.
Preferably, the carbon-based thin film is one of graphite, graphene, carbon tubes, or carbon fibers.
Preferably, the inorganic heat conducting film is one of a nitride film or an oxide heat conducting film.
In step 1), the thickness of the planar heat conduction material is 2 to 200 μm, such as 2 μm, 5 μm, 10 μm, 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, 55 μm, 60 μm, 65 μm, 70 μm, 75 μm, 80 μm, 85 μm, 90 μm, 95 μm, 100 μm, 105 μm, 110 μm, 115 μm, 120 μm, 125 μm, 130 μm, 135 μm, 140 μm, 145 μm, 150 μm, 160 μm, 165 μm, 170 μm, 175 μm, 180 μm, 185 μm, 190 μm, 195 μm, or 200 μm, preferably 5 to 50 μm, and further preferably 10 to 30 μm; the density is 0.3-4g/cm 3 For example, 0.3g/cm 3 、0.4g/cm 3 、0.5g/cm 3 、0.6g/cm 3 、0.7g/cm 3 、0.8g/cm 3 、0.9g/cm 3 、1g/cm 3 、1.1g/cm 3 、1.2g/cm 3 、1.3g/cm 3 、1.4g/cm 3 、1.5g/cm 3 、1.6g/cm 3 、1.7g/cm 3 、1.8g/cm 3 、1.9g/cm 3 、2g/cm 3 、2.1g/cm 3 、2.2g/cm 3 、2.3g/cm 3 、2.4g/cm 3 、2.5g/cm 3 、2.6g/cm 3 、3g/cm 3 、3.2g/cm 3 、3.5g/cm 3 、3.8g/cm 3 、4g/cm 3 Etc., preferably 0.6 to 2.5g/cm 3 More preferably 1 to 2g/cm 3 。
Preferably, the planar thermal conductivity of the planar thermal conductive material is 10 to 3000W/mK, for example, 10W/mK, 20W/mK, 30W/mK, 40W/mK, 50W/mK, 60W/mK, 70W/mK, 80W/mK, 90W/mK, 100W/mK, 200W/mK, 300W/mK, 400W/mK, 500W/mK, 600W/mK, 700W/mK, 800W/mK, 900W/mK, 1000W/mK, 1500W/mK, 2000W/mK, 2500W/mK, 3000W/mK, or the like. In the step 2), the elastic material is any one or a mixture of at least two of silica gel resin, silicone rubber resin, acrylic resin, epoxy resin, rubber resin and polyurethane elastomer containing heat-conducting filler; the addition of the heat-conducting filler can improve the heat conductivity coefficient of the elastic material and reduce the thermal resistance of the whole material; the heat conducting filler is any one or a mixture of at least two of graphite, graphene, carbon tubes, carbon fibers, nitrides or oxides.
Preferably, the mass of the heat-conducting filler accounts for 0-90% of the mass of the elastic material; for example, 0, 1%, 5%, 10%, 15%, 20%, 25%, 30%, 35%, 40%, 45%, 50%, 55, 60%, 65%, 70%, 75%, 80%, 85%, 90%, etc.
Preferably, when the using amount of the heat-conducting filler exceeds 90% of the system, the system has the conditions of high viscosity, difficulty in use, reduced compression ratio, easiness in powder falling and the like due to too much heat-conducting filler; on the contrary, when the amount of the heat conductive filler is 0, that is, the amount of the silicone resin, the silicone rubber resin, the acrylic resin, the epoxy resin, the rubber resin, or the polyurethane elastomer added is 100%, the coefficient of thermal conductivity of the system is lowered, but the use and the compressibility are good, and thus an appropriate filling ratio is selected according to the actual situation.
And 2) extruding the fixed fan-like structure, wherein the gap of the fan-like structure can be reduced in an extruding mode, so that the gap of the vertical orientation film structure is effectively controlled, the controllable preparation of the vertical orientation structure is realized, and the heat conductivity and the compression performance of the vertical orientation are further improved.
Wherein the pressure of the extrusion is 0.01 to 20MPa, for example, 0.01MPa, 0.1MPa, 0.5MPa, 1MPa, 2MPa, 3MPa, 4MPa, 5MPa, 6MPa, 7MPa, 8MPa, 9MPa, 10MPa, 11MPa, 12MPa, 13MPa, 14MPa, 15MPa, 16MPa, 17MPa, 18MPa, 19MPa or 20MPa, etc.
Preferably, the gap of the fan-like structure is reduced by 5-60% after extrusion.
The second purpose of the invention is to provide a heat conduction material with a vertical orientation structure prepared by the preparation method.
The third object of the present invention is to provide an application of the second object of the heat conductive material with a vertical orientation structure, wherein the second object of the present invention is to use the second object of the present invention in the preparation of heat management materials, for example, use the second object of the present invention in the fields of computers, telecommunications, consumer goods, medical devices, industrial machinery, automotive electronics, etc., so as to solve the problem of low vertical heat conductivity of the existing materials.
Compared with the prior art, the invention has the beneficial effects that:
the heat conduction material with the vertical orientation structure can realize the controllable preparation of the vertical orientation structure, has high heat conduction performance in vertical orientation, good compression resilience and strength, and improves the operability of subsequent die cutting. Specifically, the prepared heat conduction material has a heat conduction coefficient of 6-600W/m.K in vertical orientation, the compression rate is 10-60%, and the conditions of vertical structure stability, no slag falling and the like can be kept in the subsequent die cutting and using processes.
Drawings
FIG. 1 is a schematic structural view of a thermally conductive material having a vertically oriented structure according to the present invention;
FIG. 2 is a SEM plan view of a thermally conductive material having a vertically oriented structure;
FIG. 3 is a microscope image of a thermally conductive material having a vertically oriented structure;
fig. 4 is a perspective microscope view of a thermally conductive material having a vertically oriented structure.
Detailed Description
The technical scheme of the invention is further explained by the specific implementation mode in combination with the attached figures 1-4.
Unless otherwise specified, various starting materials of the present invention are commercially available or prepared according to conventional methods in the art.
Example 1
The preparation method of the heat conduction material with the vertical orientation structure comprises the following steps:
a commercially available graphite film having a density of 1.8g/cm was placed between two intermeshing gears 3 The plane thermal conductivity coefficient is 1200W/m.K, and the thickness is 12 mu m; the pitch of the gears is 30 μm, and the depth of the gears is 100 μm; the graphite film is formed into a fan-like structure with vertical orientation by the occlusion effect between the gears, and meanwhile, elastic silicone resin (model: DOW SYLGARD 184) is injected, so that the middle gap of the formed fan-like structure is about 20 μm, and the height of the fan-like structure is about 140 μm, and the heat conduction material with the vertical orientation structure is obtained.
The structural diagram of the heat conduction material prepared by the embodiment is shown in fig. 1, the planar SEM is shown in fig. 2, the microscope diagram of the heat conduction material in the vertical orientation structure is shown in fig. 3, and the fan-like structure is shown in fig. 4, so that it can be seen that the heat conduction material prepared by the embodiment has a good vertical orientation structure.
Example 2
The preparation method of the heat conduction material with the vertical orientation structure comprises the following steps:
a commercially available graphite film having a density of 1.8g/cm was placed between two intermeshing gears 3 The plane thermal conductivity coefficient is 1200W/m.K, and the thickness is 12 mu m; the pitch of the gears is 30 μm, and the depth of the gears is 100 μm; the graphite film is formed into a fan-like structure with vertical orientation by the occlusion effect between the gears, meanwhile, elastic silica gel resin (the model is DOW SYLGARD 184) is injected to extrude the formed fan-like structure with vertical orientation, the pressure is 10MPa, the middle gap of the formed fan-like structure is about 14 mu m, the height of the fan-like structure is about 140 mu m, and the heat conduction material with the vertical orientation structure is obtained.
Example 3
A commercially available graphite film having a density of 1.8g/cm was placed between two intermeshing gears 3 The plane thermal conductivity coefficient is 1200W/m.K, and the thickness is 12 mu m; of toothed wheelsThe spacing is 30 μm, and the depth of the gear is 100 μm; the graphite film is formed into a fan-shaped structure with vertical orientation through the meshing effect between the gears, meanwhile, an elastic material is injected, the elastic material consists of 5% of graphene, 5% of carbon nano tubes and 90% of elastic silicone resin (the model is DOW SYLGARD 184) in percentage by mass, the formed fan-shaped structure with vertical orientation is extruded, the pressure is 10MPa, the middle gap of the formed fan-shaped structure is about 14 mu m, and the height of the fan-shaped structure is about 140 mu m, so that the heat conduction material with the vertical orientation structure is obtained.
Example 4
The difference between the embodiment and the embodiment 3 is that the graphite film is replaced by an inorganic high thermal conductive film prepared by adopting a suction filtration mode, specifically, a mixed film of flake boron nitride and spherical aluminum oxide, the specific process is that the flake boron nitride and the spherical aluminum oxide are mixed according to a mass ratio of 8:2, the film is prepared by adopting the suction filtration mode, and the density of the prepared inorganic high thermal conductive film is 2.4g/cm 3 The thickness was 100 μm, the thermal conductivity was 50W/mK, and the other examples were the same as those of example 3.
Example 5
This embodiment is different from embodiment 3 in that the gear pitch is 200 μm, and the others are the same as those of embodiment 3.
Example 6
The difference between the embodiment and the embodiment 3 is that the graphite film is replaced by a carbon nanotube/graphene composite film prepared by a coating method, specifically, the carbon nanotube and graphene are mixed according to a mass ratio of 2: 8 mixing, preparing the carbon nano tube/graphene composite membrane in a coating mode, wherein the density of the prepared composite membrane is 1.4g/cm 3 The thickness was 50 μm, the plane thermal conductivity was 1000W/m.K, and the other examples were the same as those of example 3.
Example 7
This embodiment is different from embodiment 3 in that the gear pitch of 30 μm is replaced with 1000 μm, and the others are the same as those of embodiment 2.
Example 8
This example is different from example 3 in that the elastic silicone resin was changed to an acrylic resin, and the rest was the same as example 3.
Example 9
The present embodiment is different from embodiment 3 in that the elastic material is different, and the elastic material is composed of 70% by mass of elastic silicone resin, 15% by mass of carbon nanotubes, and 15% by mass of graphene, and the rest is the same as that of embodiment 3.
Example 10
This example differs from example 3 in that the elastic material is different and is composed of, by mass percent, 10% of elastic silicone resin, 40% of boron nitride and 50% of silicon dioxide, and is otherwise the same as example 3.
Example 11
This embodiment is different from embodiment 3 in that the pitch of the gears is 0.01 μm, and the others are the same as those of embodiment 3.
Example 12
This example is different from example 3 in that the extrusion pressure is too high, 30MPa, and the film is broken during the preparation process, which is otherwise the same as example 3.
Example 13
The difference between this embodiment and embodiment 3 is that the elastic material is different, and the elastic material is composed of 5% by mass of elastic silicone resin, 45% by mass of carbon nanotubes, and 50% by mass of graphene, and the others are the same as those in embodiment 3, and when the elastic thermal conductive composite material is injected, the conditions of poor uniformity, easy slag removal after drying, difficulty in maintaining a vertically oriented structure of a thermal conductive film, and the like occur due to high viscosity, and the increase of the vertical thermal conductivity of the system is very low.
Example 14
This embodiment is different from embodiment 3 in that the pitch of the gears is 1500 μm, and the others are the same as those of embodiment 3.
Comparative example 1
The present comparative example differs from example 1 in that in step 1), the thermally conductive material was prepared by a conventional calendering method, specifically: the film is placed in a calender for pressing, and a film with a vertical orientation structure cannot be prepared, but the film is more compact in the plane direction.
Comparative example 2
This comparative example is different from example 1 in that in step 1), no elastic material was injected, and the rest is the same as example 1.
The thermal conductivity of the films obtained in examples 1 to 14 and comparative examples 1 to 2 was measured by a laser thermal conductivity method (LFA 447), and the results are shown in Table 1.
TABLE 1
Figure BDA0003679501320000111
Figure BDA0003679501320000121
As can be seen from Table 1, the heat conduction material with the vertical orientation structure, prepared by the invention, can realize the controllable preparation of the vertical orientation structure, has high heat conduction performance in vertical orientation, good compression resilience and strength, and improves the operability of subsequent die cutting. Specifically, the heat conductivity coefficient of the vertical orientation is 6-600W/m.K, and the compressibility is 10-60%.
In comparison with examples 1 to 3, the vertical structure of example 2 in which a certain pressure is applied to compress the film and the addition of the heat conductive filler to the elastic silicone resin in example 3 both improve the vertical heat conductivity of the heat conductive material, compared to example 1.
Compared with the embodiment 3, in the embodiment 6, the graphite heat conducting film of the planar heat conducting material is replaced by the carbon nanotube/graphene composite film prepared by adopting a suction filtration or coating mode, and the two films can well prepare a vertically oriented structure and obtain a higher vertical heat conducting coefficient.
Examples 5 and 7 change the gear pitch from 30 μm to 200 μm and 1000 μm, respectively, as compared to example 3, and gradually decrease the vertical thermal conductivity of the thermally conductive material.
Compared with embodiment 3, embodiment 8 replaces the elastic material with acrylic resin from elastic silicone resin, and the vertical thermal conductivity of the heat conducting material does not change much, so that the compression rate of the heat conducting material is reduced.
Compared with the embodiment 3, the embodiment 9 increases the dosage of the heat-conducting filler and reduces the dosage of the elastic silica gel resin, and the vertical heat conductivity coefficient of the heat-conducting material is increased from 356W/m.K to 461W/m.K.
Compared with embodiment 3, in embodiment 10, 90% of the inorganic heat conductive filler is replaced with 10% of the graphene-carbon nanotube composite heat conductive filler, and even if the amount of the inorganic heat conductive filler is greatly increased, the vertical heat conductivity of the prepared heat conductive material is greatly reduced, and the compressibility is also greatly reduced.
The pressure of example 12 extrusion was too high compared to example 3, which caused the film to break.
Compared with example 3, in example 13, the heat conductive filler is added into the elastic resin system too high, so that the system is easy to remove slag, and the vertical orientation structure of the heat conductive material is easy to damage.
Compared with the embodiment 3, the vertical heat conductivity coefficient of the heat conduction material is greatly reduced by adding the large gear clearance in the embodiment 14.
Comparative example 1 a heat conductive material was prepared by a conventional calendering method, and compared to the material prepared by the gear engagement method of the present application, the method used in comparative example 1 did not result in a vertically oriented structure, and the heat conductive material had a lower vertical heat conductivity coefficient.
Comparative example 2 no injection of the elastic material makes it difficult to maintain the vertically oriented structure of the heat conductive material, which is easily damaged during the subsequent process.
The present invention is illustrated by the above-mentioned examples, but the present invention is not limited to the above-mentioned detailed process equipment and process flow, i.e. it is not meant to imply that the present invention must rely on the above-mentioned detailed process equipment and process flow to be practiced. It should be understood by those skilled in the art that any modification of the present invention, equivalent substitutions of the raw materials of the product of the present invention, addition of auxiliary components, selection of specific modes, etc., are within the scope and disclosure of the present invention.
The preferred embodiments of the present invention have been described in detail, however, the present invention is not limited to the specific details of the above embodiments, and various simple modifications may be made to the technical solution of the present invention within the technical idea of the present invention, and these simple modifications are within the protective scope of the present invention.
It should be noted that the various technical features described in the above embodiments can be combined in any suitable manner without contradiction, and the invention is not described in any way for the possible combinations in order to avoid unnecessary repetition.
In addition, any combination of the various embodiments of the present invention is also possible, and the same should be considered as the disclosure of the present invention as long as it does not depart from the spirit of the present invention.

Claims (10)

1. A preparation method of a heat conduction material with a vertical orientation structure is characterized by comprising the following steps:
1) the plane heat conduction material is arranged between the gears, and the plane heat conduction material forms a fan-like structure with vertical orientation through the meshing action between the gears;
2) and (3) injecting an elastic material during occlusion to fix the fan-like structure formed in the step 1) to obtain the heat conduction material with the vertical orientation structure.
2. The method according to claim 1, wherein the pitch of the gears is 0.01 to 1000 μm and the depth of the gears is 10 to 5000 μm in step 1).
3. The method according to claim 1 or 2, wherein in step 1), the gap of the fan-like structure is 0.005 to 1000 μm, and the height of the fan-like structure is 10 to 5000 μm.
4. The preparation method according to one of claims 1 to 3, wherein in step 1), the planar heat conductive material is a carbon-based thin film and/or an inorganic heat conductive thin film;
preferably, the carbon-based film is one of graphite, graphene, carbon tubes or carbon fibers;
preferably, the inorganic heat conducting film is one of a nitride film or an oxide heat conducting film.
5. The method according to any one of claims 1 to 4, wherein in step 1), the thickness of the planar heat conductive material is 2 to 200 μm, and the density is 0.3 to 4g/cm 3 ；
Preferably, the plane thermal conductivity of the plane heat conduction material is 10-3000W/m.K.
6. The production method according to any one of claims 1 to 5, wherein in the step 2), the elastic material is any one or a mixture of at least two of a silicone resin, a silicone rubber resin, an acrylic resin, an epoxy resin, a rubber resin, and a polyurethane elastomer containing a thermally conductive filler;
preferably, the heat conducting filler is any one or a mixture of at least two of graphite, graphene, carbon tubes, carbon fibers, nitrides or oxides;
preferably, the mass of the heat conductive filler accounts for 0-90% of the mass of the elastic material.
7. The method of any one of claims 1-6, wherein step 2) is followed by the step of extruding the fixed fan-like structure.
8. The production method according to claim 7, wherein the pressure of the extrusion is 0.01 to 20 MPa;
preferably, the gap of the fan-like structure is reduced by 5-60% after extrusion.
9. A heat conductive material having a vertically oriented structure obtained by the production method according to any one of claims 1 to 8.
10. Use of a thermally conductive material having a vertically oriented structure according to claim 9 in the preparation of a thermal management material.
CN202210632875.8A 2022-06-06 2022-06-06 Heat conduction material with vertical orientation structure and preparation method and application thereof Active CN114836036B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202210632875.8A CN114836036B (en) 2022-06-06 2022-06-06 Heat conduction material with vertical orientation structure and preparation method and application thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202210632875.8A CN114836036B (en) 2022-06-06 2022-06-06 Heat conduction material with vertical orientation structure and preparation method and application thereof

Publications (2)

Publication Number Publication Date
CN114836036A true CN114836036A (en) 2022-08-02
CN114836036B CN114836036B (en) 2023-10-03

Family

ID=82574162

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202210632875.8A Active CN114836036B (en) 2022-06-06 2022-06-06 Heat conduction material with vertical orientation structure and preparation method and application thereof

Country Status (1)

Country Link
CN (1) CN114836036B (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005146057A (en) * 2003-11-12 2005-06-09 Polymatech Co Ltd High-thermal-conductivity molding and method for producing the same
CN103805144A (en) * 2014-03-04 2014-05-21 中国科学院宁波材料技术与工程研究所 Graphene heat conducting film and preparation method thereof
CN109109394A (en) * 2017-06-23 2019-01-01 卫普实业股份有限公司 Elastic film composite material and its manufacturing method
CN109881038A (en) * 2019-03-08 2019-06-14 深圳先进技术研究院 A kind of thermally conductive electromagnetic shielding composite material and preparation method thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005146057A (en) * 2003-11-12 2005-06-09 Polymatech Co Ltd High-thermal-conductivity molding and method for producing the same
CN103805144A (en) * 2014-03-04 2014-05-21 中国科学院宁波材料技术与工程研究所 Graphene heat conducting film and preparation method thereof
CN109109394A (en) * 2017-06-23 2019-01-01 卫普实业股份有限公司 Elastic film composite material and its manufacturing method
CN109881038A (en) * 2019-03-08 2019-06-14 深圳先进技术研究院 A kind of thermally conductive electromagnetic shielding composite material and preparation method thereof

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
RONG FEI ETAL: ""Tropical Cyclone Intensification Simulated in the Ooyama-Type Three-Layer Model with a Multilevel Boundary Layer"", 《JOURNAL OF THE ATMOSPHERIC SCIENCES》, vol. 1, no. 1, pages 3799 - 3813 *
陈海斌等: ""基于外力诱导取向的高导热聚合物基复合材料研究进展"", 《复合材料学报》, vol. 39, no. 4, pages 1486 - 1497 *

Also Published As

Publication number Publication date
CN114836036B (en) 2023-10-03

Similar Documents

Publication Publication Date Title
Liu et al. 3D lamellar-structured graphene aerogels for thermal interface composites with high through-plane thermal conductivity and fracture toughness
JP5541400B2 (en) Manufacturing method of heat conductive sheet
CN107434905B (en) heat-conducting polymer composite material and preparation method and application thereof
CN110945647B (en) Heat conducting fin
JP2003321554A (en) Heat-conductive molding and method for producing the same
JP2003112915A (en) Graphitized carbon powder and heat conductive composite material composition
US20080274358A1 (en) Carbon Materials
CN104592950A (en) High-thermal conductivity graphite alkenyl polymer heat conducting film and preparation method thereof
CN1944698A (en) Super high heat conduction, low heat expansion coefficient composite material and its preparing method
CN109161167B (en) Boron nitride-silver/epoxy resin composite material and preparation method and application thereof
JP2005146057A (en) High-thermal-conductivity molding and method for producing the same
EP2871674A1 (en) Thermally conductive sheet
CN113321933B (en) Longitudinal high-thermal-conductivity gasket, preparation method and application
CN112251026A (en) Heat-conducting gasket with fillers orderly arranged in inclined manner and preparation method thereof
CN110713721A (en) Preparation method of high-thermal-conductivity silicone rubber
CN112280540A (en) Preparation method of high-thermal-conductivity graphene-metal particle composite material
CN113771443A (en) Graphene heat conduction gasket enhanced by sintered graphene foam block and preparation method thereof
TWI298045B (en) Heat spreader for printed circuit boards
JP2006045596A (en) Composite body with high thermal conductivity and low thermal expansion, and its manufacturing method
Jiang et al. Highly thermally conductive and negative permittivity epoxy composites by constructing the carbon fiber/carbon networks
CN114836036A (en) Heat conduction material with vertical orientation structure and preparation method and application thereof
CN113829406A (en) Preparation method of heat conducting sheet
WO2019123253A1 (en) Powder composition comprising first and second agglomerates of inorganic particles and polymer composition comprising a polymer and the powder composition
CN112280541A (en) Preparation method of high-thermal-conductivity composite material based on graphitized poly-dopamine-coated metal particles
JP6983345B1 (en) Thermally conductive sheet and electronic equipment

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant