CN114828383A - Circuit board structure and manufacturing method thereof - Google Patents

Circuit board structure and manufacturing method thereof Download PDF

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Publication number
CN114828383A
CN114828383A CN202110079942.3A CN202110079942A CN114828383A CN 114828383 A CN114828383 A CN 114828383A CN 202110079942 A CN202110079942 A CN 202110079942A CN 114828383 A CN114828383 A CN 114828383A
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CN
China
Prior art keywords
layer
circuit
dielectric layer
glass substrate
forming
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Pending
Application number
CN202110079942.3A
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Chinese (zh)
Inventor
杨秉哲
周存圣
彭彦嘉
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Unimicron Technology Corp
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Unimicron Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unimicron Technology Corp filed Critical Unimicron Technology Corp
Priority to CN202110079942.3A priority Critical patent/CN114828383A/en
Publication of CN114828383A publication Critical patent/CN114828383A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4682—Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The invention provides a circuit board structure and a manufacturing method thereof, wherein the circuit board structure comprises a first dielectric layer, at least one first circuit layer, a second dielectric layer and an insulating protection layer. The first circuit layer is disposed on the first dielectric layer and includes at least one first circuit. The second dielectric layer is disposed on the first circuit layer and includes at least one heat sink and at least one conductive bump. The conductive block is electrically connected to the first line. The insulating protection layer is arranged on the second dielectric layer. Because the radiating block can be in direct contact with a glass substrate to be stripped in the manufacturing process, when the glass substrate is stripped through laser, instantaneous high heat generated by the laser energy can be absorbed by the radiating block, so that the heat generated by the laser energy is dispersed, the temperature is reduced, the circuit stripping problem is improved, and the process yield is improved.

Description

Circuit board structure and manufacturing method thereof
Technical Field
The present invention relates to a circuit board structure and a method for fabricating the same, and more particularly, to a circuit board structure fabricated by a board transferring process and a method for fabricating the same.
Background
Referring to fig. 3A to 3D, in fig. 3A, a glass substrate 31 is provided, in fig. 3B, at least one circuit layer 32 is formed on the glass substrate 31, in fig. 3C, a dielectric layer 33 is formed on the circuit layer, the dielectric layer 33, the circuit layer 32 and the glass substrate 31 are turned over, the turned dielectric layer 33, the circuit layer 32 and the glass substrate 31 are disposed on a core layer 34, and in fig. 3D, the glass substrate 31 is peeled off.
However, in the step of peeling the glass substrate 31, the peelable glue 311 on the glass substrate 31 is removed by a laser process, so that the glass substrate 31 is peeled. However, the laser process generates an instantaneous high temperature, and the instantaneous high temperature generated by the laser process may deteriorate the dielectric material in the circuit layer 32, thereby peeling the circuit 321 in the circuit layer 32, and affecting the process yield of the circuit board.
Disclosure of Invention
In view of the above problems, the present invention provides a circuit board structure and a method for manufacturing the same, which can solve the problem of peeling off the circuit in the circuit layer due to the dielectric material in the circuit layer being deteriorated by the instantaneous high temperature when the glass substrate is peeled off by the laser process.
The circuit board structure of the invention comprises a first dielectric layer, at least one first circuit layer, a second dielectric layer and an insulating protective layer. The at least one first circuit layer is disposed on the first dielectric layer and includes at least one first circuit. The second dielectric layer is arranged on the at least one first circuit layer and comprises at least one heat dissipation block and at least one conductive block. The at least one conductive block is electrically connected with the at least one first circuit. The insulating protection layer is arranged on the at least one second dielectric layer.
In an embodiment of the invention, the circuit board structure further includes at least one second circuit layer. The at least one second circuit layer is arranged between the second dielectric layer and the insulating protection layer and comprises at least one second circuit. The at least one second circuit is electrically connected with the at least one first circuit through the at least one conductive block.
In an embodiment of the invention, the heat dissipation block is an insulating heat conduction block, a heat conduction silica gel block, a ceramic heat conduction block, or a graphene heat conduction block.
The manufacturing method of the circuit board structure comprises the following steps: providing a glass substrate; forming a second dielectric layer on the glass substrate; wherein the second dielectric layer comprises at least one heat dissipation block and at least one conductive block; forming at least one first circuit layer on the second dielectric layer; wherein the at least one first circuit layer comprises at least one first circuit electrically connected to the at least one conductive bump; forming a first dielectric layer on the at least one first circuit layer; turning over the first dielectric layer, the at least one first circuit layer, the second dielectric layer and the glass substrate; the glass substrate was peeled.
In an embodiment of the present invention, the method for manufacturing the circuit board structure further includes the following steps in the step of forming the second dielectric layer on the glass substrate: forming the second dielectric layer; forming at least one first opening and at least one second opening in the second dielectric layer; forming the at least one heat sink within the at least one first opening of the second dielectric layer; forming the at least one conductive block in the at least one second opening of the second dielectric layer.
In an embodiment of the present invention, the method for manufacturing the circuit board structure further includes the following steps after the step of "flipping the first dielectric layer, the at least one first circuit layer, the second dielectric layer and the glass substrate", and before the step of "peeling off the glass substrate": providing a core layer; and arranging the first dielectric layer, the at least one first circuit layer, the second dielectric layer and the glass substrate after being turned over on the core layer.
In an embodiment of the present invention, the method for manufacturing a circuit board structure further includes the following steps after the step of "peeling off the glass substrate": forming at least one second circuit layer on the second dielectric layer; wherein the at least one second circuit layer comprises at least one second circuit electrically connected to the at least one first circuit via the at least one conductive block; forming an insulation protection layer on the at least one second circuit layer.
In addition, another embodiment of the method for manufacturing a circuit board structure of the present invention includes the following steps: providing a glass substrate; forming a second dielectric layer on the glass substrate; wherein the second dielectric layer comprises at least one heat dissipation block and at least one conductive block; forming at least one first circuit layer on the second dielectric layer; wherein the at least one first circuit layer is electrically connected to the at least one conductive block; forming a first dielectric layer on the at least one first circuit layer; peeling the glass substrate; the first dielectric layer, the at least one first circuit layer and the second dielectric layer are turned over.
In another embodiment of the present invention, the method for manufacturing the circuit board structure further includes the following steps after the step of forming the first dielectric layer on the at least one first circuit layer and before the step of peeling the glass substrate: providing a core layer; the first dielectric layer, the at least one first circuit layer, the second dielectric layer and the glass substrate are arranged under the core layer.
In another embodiment of the present invention, the method for manufacturing the circuit board structure further comprises the following steps after the step of "turning over the first dielectric layer, the at least one first circuit layer and the second dielectric layer": forming at least one second circuit layer on the second dielectric layer; wherein the at least one second circuit layer comprises at least one second circuit electrically connected to the at least one first circuit via the at least one conductive block; forming an insulating protection layer on the at least one second circuit layer.
In view of the above, in the circuit board structure and the manufacturing method thereof of the present invention, since the second dielectric layer further includes the at least one heat dissipation block, and the at least one heat dissipation block contacts the glass substrate to be peeled, when the glass substrate is peeled by the laser, the instantaneous high heat generated by the laser energy can be absorbed by the at least one heat dissipation block, thereby dispersing the heat generated by the laser energy, and improving the circuit peeling problem caused by the instantaneous high temperature, so as to improve the process yield of the circuit board.
Drawings
Fig. 1 is a schematic side sectional view of a circuit board structure according to an embodiment of the invention.
Fig. 2A to fig. 2J are schematic flow charts illustrating a method for manufacturing a circuit board structure according to an embodiment of the invention.
Fig. 3A to 3D are schematic flow charts of a method for manufacturing a circuit board structure generally by a board transferring process.
Detailed Description
Fig. 1 is a schematic side sectional view of a circuit board structure 10 according to an embodiment of the invention.
Referring to fig. 1, the circuit board structure 10 includes a first dielectric layer 11, at least a first circuit layer 12, a second dielectric layer 13 and an insulating passivation layer 14. The at least one first circuit layer 12 is disposed on the first dielectric layer 11 and includes at least one first circuit 121. The second dielectric layer 13 is disposed on the at least one first circuit layer 12 and includes at least one heat sink 131 and at least one conductive bump 132. The at least one conductive bump 132 is electrically connected to the at least one first line 121. The insulating passivation layer 14 is disposed on the second dielectric layer 13.
In addition, the circuit board structure 10 further includes at least one second circuit layer 15. The at least one second circuit layer 15 is disposed between the second dielectric layer 13 and the insulating protection layer 14, and includes at least one second circuit 151. The at least one second line 151 is electrically connected to the at least one first line 121 through the at least one conductive bump 132.
In this embodiment, the heat dissipation block 131 is an insulating heat conduction block, a heat conduction silica gel block, a ceramic heat conduction block, or a graphene heat conduction block. The insulating heat conducting strip (SSTCP) has excellent heat conductivity, flexibility, compression and viscosity in design, can reduce the influence of air on heat resistance, can be arranged between a heating element and a radiating element, enables the heating element and the radiating element to be tightly attached, improves the efficiency of heat energy conduction to the radiating element, and has insulating and buffering effects. The heat-conducting silica gel sheet is a heat-conducting interface material synthesized by taking silica gel as a base material and adding various auxiliary materials such as heat-conducting powder, flame retardant and the like through a special process, and can effectively reduce the thermal contact resistance generated between the surface of a heating element and the contact surface of a radiating element. The ceramic heat conducting fin has reliable insulating property, high temperature resistance, ultrahigh heat conducting property and low thermal expansion coefficient, and can adapt to severe environmental changes.
Since the circuit board structure 10 of the present invention is further provided with the second dielectric layer 13, and the at least one heat slug 131 is further included in the second dielectric layer 13. During the manufacturing process of the circuit board structure 10, the at least one heat slug 131 of the second dielectric layer 13 can contact a glass substrate to be peeled off. Therefore, when the glass substrate is stripped by laser, the instantaneous high heat generated by the laser energy can be absorbed by the at least one heat dissipation block 131, so that the heat generated by the laser energy is dispersed, the problem of circuit stripping caused by the instantaneous high temperature is solved, and the process yield of the circuit board is improved.
Fig. 2A to fig. 2J are schematic flow charts illustrating a method for manufacturing a circuit board structure according to an embodiment of the invention.
Referring to fig. 2A, in the present embodiment, a glass substrate 21 is first provided. In the present embodiment, a peelable adhesive layer 211 is further formed on the glass substrate 21.
Referring to fig. 2B, a second dielectric layer 13 is formed on the glass substrate 21.
Referring to fig. 2C, at least one first opening 133 and at least one second opening 134 are formed in the second dielectric layer 13.
Referring to fig. 2D, the at least one heat slug 131 is formed in the at least one first opening 133 of the second dielectric layer 13.
Referring to fig. 2E, the at least one conductive bump 132 is formed in the at least one second opening 134 of the second dielectric layer 13, and further, at least one first circuit layer 12 is formed on the second dielectric layer 13, so that the second dielectric layer 13 includes the at least one heat spreader 131 and the at least one conductive bump 132. The at least one first circuit layer 12 includes at least one first circuit 121, and the at least one first circuit 121 is electrically connected to the at least one conductive bump 132.
Referring to fig. 2F, in some embodiments, the at least one first circuit layer 12 is a plurality of first circuit layers 12. The method for forming the first circuit layers 12 is a common method for manufacturing a multi-layer circuit of a circuit board, and is not described herein again.
Referring to fig. 2G, after the at least one circuit layer 12 is completed, a first dielectric layer 11 is further formed on the at least one circuit layer 12, a core layer 22 is provided, the first dielectric layer 11, the at least one first circuit layer 12, the second dielectric layer 13 and the glass substrate 21 are turned over by a plate turning process, so that the first dielectric layer 11 faces downward and the glass substrate 21 faces upward, the turned first dielectric layer 11, the at least one first circuit layer 12, the second dielectric layer 13 and the glass substrate 21 are further disposed on the core layer 22, and the first dielectric layer 11 is disposed on the core layer 22.
Referring to fig. 2H, the glass substrate 21 is stripped by a stripping process. In the present embodiment, the peeling process peels the glass substrate 21 by laser peeling the peelable glue layer 211 on the glass substrate 21.
Referring to fig. 2I, the core layer 22 is removed.
Referring to fig. 2J, at least one second circuit layer 15 is formed on the second dielectric layer 13. The at least one second circuit layer 15 includes at least one second circuit 151, and the at least one second circuit 151 is electrically connected to the at least one first circuit 121 through the at least one conductive bump 132. And forming an insulating protection layer 14 on the at least one second circuit layer 15 to complete the fabrication of the circuit board structure 10.
The at least one heat slug 131 is further included in the second dielectric layer 13. As shown in fig. 2H, when the peeling process is performed, the at least one heat slug 131 of the second dielectric layer 13 directly contacts the glass substrate 21 to be peeled. Therefore, the instant high heat generated by the laser energy can be absorbed by the at least one heat dissipation block 131 through heat conduction, thereby dispersing the heat generated by the laser energy, improving the circuit peeling problem caused by the instant high temperature, and improving the process yield of the circuit board.
Further, in the present embodiment, the plate rotating process is performed first and then the peeling process is performed, but in other embodiments, the peeling process may be performed first and then the plate rotating process is performed.
For example, referring to fig. 2G, after the glass substrate 21 ', the second dielectric layer 13 ' and the at least one first circuit layer 12 ' are completed, a first dielectric layer 11 ' is further formed on the at least one circuit layer 12 ', a core layer 22 ' is provided, and the glass substrate 21 ', the second dielectric layer 13 ', the at least one first circuit layer 12 ' and the first dielectric layer 11 ' which have not undergone the plate rotating process are disposed under the core layer 22, so that the first dielectric layer 11 ' is disposed under the core layer 22.
Referring to fig. 2H, the glass substrate 21' is stripped by the stripping process. In the present embodiment, the peeling process peels the glass substrate 21 ' by laser peeling the peelable glue layer 211 ' on the glass substrate 21 '.
Referring to fig. 2I, the core layer 22 is removed, and the second dielectric layer 13 ', the at least one first circuit layer 12 ' and the first dielectric layer 11 ' are turned over by the plate-turning process, such that the first dielectric layer 11 ' faces downward and the second dielectric layer 13 ' faces upward.
The subsequent steps are the same as the method of performing the plate rotating process first and then performing the peeling process, and thus are not described again.
In addition, the above two embodiments can be performed simultaneously, but not limited thereto. For example, as shown in fig. 2G, the first dielectric layer 11, the at least one first circuit layer 12, the second dielectric layer 13 and the glass substrate 21 after board rotation, and the first dielectric layer 11 ', the at least one first circuit layer 12', the second dielectric layer 13 'and the glass substrate 21' before board rotation are respectively disposed above and below the core layer 22, so as to fabricate a plurality of circuit board structures simultaneously and improve efficiency.

Claims (10)

1. A circuit board structure, comprising:
a first dielectric layer;
at least one first circuit layer disposed on the first dielectric layer and including at least one first circuit;
a second dielectric layer arranged on the at least one first circuit layer and comprising at least one heat dissipation block and at least one conductive block; wherein the at least one conductive block is electrically connected to the at least one first circuit;
an insulating protection layer is disposed on the second dielectric layer.
2. The circuit board structure of claim 1, further comprising:
at least one second circuit layer arranged between the second dielectric layer and the insulating protective layer and comprising at least one second circuit; wherein the at least one second circuit is electrically connected to the at least one first circuit through the at least one conductive block.
3. The circuit board structure of claim 1 or 2, wherein the heat sink is an insulating heat conducting block, a heat conducting silicone block, a ceramic heat conducting block, or a graphene heat conducting block.
4. A manufacturing method of a circuit board structure is characterized by comprising the following steps:
providing a glass substrate;
forming a second dielectric layer on the glass substrate; wherein the second dielectric layer comprises at least one heat dissipation block and at least one conductive block;
forming at least one first circuit layer on the second dielectric layer; wherein the at least one first circuit layer comprises at least one first circuit electrically connected to the at least one conductive bump;
forming a first dielectric layer on the at least one first circuit layer;
turning over the first dielectric layer, the at least one first circuit layer, the second dielectric layer and the glass substrate;
the glass substrate was peeled.
5. The method of claim 4, wherein the step of forming the second dielectric layer on the glass substrate further comprises the steps of:
forming the second dielectric layer;
forming at least one first opening and at least one second opening in the second dielectric layer;
forming the at least one heat sink within the at least one first opening of the second dielectric layer;
forming the at least one conductive block in the at least one second opening of the second dielectric layer.
6. The method of claim 4, further comprising, after the step of flipping the first dielectric layer, the at least one first circuit layer, the second dielectric layer, and the glass substrate, and before the step of peeling the glass substrate:
providing a core layer;
and arranging the first dielectric layer, the at least one first circuit layer, the second dielectric layer and the glass substrate after being turned over on the core layer.
7. The method for manufacturing a circuit board structure according to any one of claims 4 to 6, further comprising the following steps after the step of peeling the glass substrate:
forming at least one second circuit layer on the second dielectric layer; wherein the at least one second circuit layer comprises at least one second circuit electrically connected to the at least one first circuit via the at least one conductive block;
forming an insulating protection layer on the at least one second circuit layer.
8. A manufacturing method of a circuit board structure is characterized by comprising the following steps:
providing a glass substrate;
forming a second dielectric layer on the glass substrate; wherein the second dielectric layer comprises at least one heat dissipation block and at least one conductive block;
forming at least one first circuit layer on the second dielectric layer; wherein the at least one first circuit layer is electrically connected to the at least one conductive block;
forming a first dielectric layer on the at least one first circuit layer;
peeling the glass substrate;
the first dielectric layer, the at least one first circuit layer and the second dielectric layer are turned over.
9. The method of claim 8, further comprising, after the step of forming a first dielectric layer on the at least one first circuit layer and before the step of peeling the glass substrate:
providing a core layer;
the first dielectric layer, the at least one first circuit layer, the second dielectric layer and the glass substrate are arranged under the core layer.
10. The method of claim 8 or 9, further comprising the steps of, after the step of turning over the first dielectric layer, the at least one first circuit layer and the second dielectric layer:
forming at least one second circuit layer on the second dielectric layer; wherein the at least one second circuit layer comprises at least one second circuit electrically connected to the at least one first circuit via the at least one conductive block;
forming an insulating protection layer on the at least one second circuit layer.
CN202110079942.3A 2021-01-21 2021-01-21 Circuit board structure and manufacturing method thereof Pending CN114828383A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110079942.3A CN114828383A (en) 2021-01-21 2021-01-21 Circuit board structure and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110079942.3A CN114828383A (en) 2021-01-21 2021-01-21 Circuit board structure and manufacturing method thereof

Publications (1)

Publication Number Publication Date
CN114828383A true CN114828383A (en) 2022-07-29

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Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070017815A1 (en) * 2005-07-21 2007-01-25 Shing-Ru Wang Circuit board structure and method for fabricating the same
CN104505467A (en) * 2014-12-05 2015-04-08 上海天马微电子有限公司 Composite substrate, manufacturing method of flexible displayer and flexible displayer
CN106098939A (en) * 2016-08-26 2016-11-09 武汉华星光电技术有限公司 The method of laser nondestructively peeling flexible base board
TWI633822B (en) * 2017-05-08 2018-08-21 欣興電子股份有限公司 Circuit board unit and method for manufacturing the same
CN110335970A (en) * 2019-07-15 2019-10-15 京东方科技集团股份有限公司 Flexible display substrates and its manufacturing method, flexible display apparatus
CN111092023A (en) * 2018-10-23 2020-05-01 碁鼎科技秦皇岛有限公司 Package substrate and manufacturing method thereof
CN111916354A (en) * 2019-05-07 2020-11-10 欣兴电子股份有限公司 Circuit carrier plate and manufacturing method thereof
CN112055482A (en) * 2019-06-06 2020-12-08 欣兴电子股份有限公司 Circuit carrier plate and manufacturing method thereof

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070017815A1 (en) * 2005-07-21 2007-01-25 Shing-Ru Wang Circuit board structure and method for fabricating the same
CN104505467A (en) * 2014-12-05 2015-04-08 上海天马微电子有限公司 Composite substrate, manufacturing method of flexible displayer and flexible displayer
CN106098939A (en) * 2016-08-26 2016-11-09 武汉华星光电技术有限公司 The method of laser nondestructively peeling flexible base board
TWI633822B (en) * 2017-05-08 2018-08-21 欣興電子股份有限公司 Circuit board unit and method for manufacturing the same
CN111092023A (en) * 2018-10-23 2020-05-01 碁鼎科技秦皇岛有限公司 Package substrate and manufacturing method thereof
CN111916354A (en) * 2019-05-07 2020-11-10 欣兴电子股份有限公司 Circuit carrier plate and manufacturing method thereof
CN112055482A (en) * 2019-06-06 2020-12-08 欣兴电子股份有限公司 Circuit carrier plate and manufacturing method thereof
CN110335970A (en) * 2019-07-15 2019-10-15 京东方科技集团股份有限公司 Flexible display substrates and its manufacturing method, flexible display apparatus

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