CN114824025A - LED display module and manufacturing method thereof - Google Patents

LED display module and manufacturing method thereof Download PDF

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Publication number
CN114824025A
CN114824025A CN202110071136.1A CN202110071136A CN114824025A CN 114824025 A CN114824025 A CN 114824025A CN 202110071136 A CN202110071136 A CN 202110071136A CN 114824025 A CN114824025 A CN 114824025A
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layer
ink color
ink
display module
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CN114824025B (en
Inventor
周小波
黄志强
庄文荣
卢敬权
钟宇宏
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Dongguan HCP Technology Co Ltd
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Dongguan HCP Technology Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0025—Processes relating to coatings

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)

Abstract

The invention discloses an LED display module and a manufacturing method thereof, wherein the LED display module comprises: a substrate provided with an LED chip; the ink packaging layer is used for shading and packaging the LED chip and covers the substrate and the LED chip; the imaging layer covers the ink color packaging layer, and a semi-transparent reflection layer is formed on one side, facing the ink color packaging layer, of the imaging layer. According to the LED display module and the manufacturing method thereof, provided by the invention, the optical principle is fully utilized, the semi-transparent reflecting layer is arranged on one side of the imaging layer, the ink color consistency of the LED display module is improved by controlling the surface roughness, the ink color height consistency of the upper screen can be realized without selecting a piece, the display chromatic aberration at different angles is eliminated, and the display module with high contrast is presented.

Description

LED display module and manufacturing method thereof
Technical Field
The invention belongs to the technical field of display, and particularly relates to an LED display module and a manufacturing method thereof.
Background
The LED indoor display application technology is developed vigorously, and currently, there are more or less technical bottlenecks in adopting display technologies such as projection, LCD and OLED. Mini & micro led display has attracted much attention as a novel small-space high-definition display technology, especially in indoor large-screen high-definition display applications, such as application scenarios in command centers, conference centers, security monitoring, household large-screen televisions, and the like.
The Mini & MicroLED small-space display screen module is mainly manufactured by three technical schemes: 1. SMD; 2. IMDs (2in 1,4in1, etc.); 3. chip On Board (COB). The COB is more attractive due to its good display effect, high integration level, simple structure and fine-pitch (currently, IMD and SMD are difficult to achieve below pitch 1). Current COB module mainly has 3 defects: 1. a large amount of manual picking sheets are required before screen installation, and even a large display screen formed by modules with good ink color consistency is selected, the problem of poor overall ink color consistency also exists, and the problems of ink color difference, white frames, black frames and the like appear at different positions, different viewing angles and different light rays are specifically reflected; 2. the front side and the side surface have color difference, which is mainly caused by non-uniform light emitting effect of the packaging body; 3. the prior display screens such as computers, mobile phones, spliced LCD screens and the like are all in a mirror mode, namely, images outside the world can be clearly seen through the display screens and can be used as mirror surfaces.
In the actual production process, the inconsistent ink colors of the LED display modules bring huge losses to enterprises, and a large amount of manpower is needed to sort, so that the labor cost is greatly improved, and the production efficiency is reduced; meanwhile, the inconsistent ink color easily causes the difference of display screen products, which is not favorable for market promotion.
In the prior art, chinese patent with patent publication No. CN112018226A and invention name of a display module and a method for manufacturing the same discloses a similar technology, but the technology still has some defects, and although the consistency of ink colors is greatly improved, the problem of inconsistent ink colors still exists. Also, although some layers in the package structure are ground or polished in the prior art, this is only a routine practice in the industry and there is no substantial improvement in achieving the full ink color uniformity.
In view of the above, research and development personnel of the applicant make more intensive research to overcome the technical problems which plague enterprises for a long time.
Disclosure of Invention
The invention aims to provide an LED display module and a manufacturing method thereof, which are used for solving or at least partially solving the problem of inconsistent ink colors.
In order to achieve the purpose, the invention adopts the following technical scheme:
in a first aspect, there is provided an LED display module comprising:
a substrate provided with an LED chip;
the ink packaging layer is used for shading and packaging the LED chip and covers the substrate and the LED chip;
the imaging layer covers the ink color packaging layer, a transflective layer is formed on one side of the imaging layer, which faces the ink color packaging layer, the surface roughness Ra of the transflective layer, which faces one side of the ink color packaging layer, is less than 1 micron, and the Rz is less than 2 microns.
Optionally, the surface roughness Ra of the side of the imaging layer opposite to the ink color packaging layer is less than 2 micrometers, and Rz is less than 4 micrometers.
Optionally, the surface roughness Ra of the side of the ink encapsulation layer facing away from the substrate is less than 1 micrometer, and Rz is less than 2 micrometers.
Optionally, the ink color packaging layer comprises a packaging layer and an ink color layer covered on the packaging layer, wherein the surface roughness Ra of one side, opposite to the substrate, of the packaging layer is less than 3 micrometers, and Rz is less than 6 micrometers.
Optionally, the surface roughness Ra of the side of the ink color layer opposite to the packaging layer is less than 1 micrometer, and Rz is less than 2 micrometers.
Optionally, the encapsulation layer comprises epoxy, silicone or polyurethane;
the packaging layer is added with diffusion powder, black pigment and matting powder;
the mass ratio of the black pigment to the packaging layer is 0.1-5%, and the mass ratio of the extinction powder to the packaging layer is 0.1-5%;
the black pigment comprises at least one of graphite powder, carbon powder, iron black and black resin.
Optionally, the ink color layer comprises a mixture of a black pigment and at least one of fluorocarbon resin, epoxy resin, silicone, and polyurethane;
diffusion powder or matting powder is also added into the ink color layer;
the mass ratio of the black pigment to the ink layer is 3-80%.
Optionally, the imaging layer comprises a mixture of at least one of fluorocarbon resin, epoxy resin, silica gel and polyurethane and a diffusion powder or matting powder;
the thickness of the imaging layer is 1-200 microns, the imaging layer is a transparent layer, and the transparency is 50% -100%.
In a second aspect, a method for manufacturing an LED display module is provided, which includes:
forming an ink color packaging layer for shading and packaging the LED chip on a substrate and the LED chip on the substrate;
forming an imaging layer on the ink encapsulation layer; and a semi-transparent reflection layer is formed on one side of the imaging layer, which faces the ink color packaging layer, the surface roughness Ra of the semi-transparent reflection layer, which faces the ink color packaging layer, is less than 1 micrometer, and Rz is less than 2 micrometers.
Optionally, the forming an ink color encapsulation layer for shielding light and encapsulating the LED chip on the substrate and the LED chip on the substrate includes:
forming an ink color packaging layer at one time; or the packaging layer and the ink color layer are formed in sequence, and the ink color layer covers the packaging layer.
Compared with the prior art, the embodiment of the invention has the following beneficial effects:
according to the LED display module and the manufacturing method thereof provided by the embodiment of the invention, the optical principle is fully utilized, the semi-transparent reflecting layer is arranged on one side of the imaging layer, the roughness of the surface of the semi-transparent reflecting layer is controlled, the ink color consistency of the LED display module is improved, the ink color height consistency of the upper screen can be realized without selecting the sheet, the display color difference at different angles is eliminated, and the display module with high contrast is presented.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
The structures, ratios, sizes, and the like shown in the present specification are only used for matching with the contents disclosed in the specification, so that those skilled in the art can understand and read the present invention, and do not limit the conditions for implementing the present invention, so that the present invention has no technical significance, and any structural modifications, changes in the ratio relationship, or adjustments of the sizes, without affecting the functions and purposes of the present invention, should still fall within the scope covered by the contents disclosed in the present invention.
Fig. 1 is an exploded view of an LED display module according to an embodiment of the present invention;
fig. 2 is a structural diagram of an LED display module according to an embodiment of the present invention;
fig. 3 is a flowchart of a method for manufacturing an LED display module according to an embodiment of the present invention;
fig. 4 is a structural diagram of an LED display module according to an embodiment of the present invention;
fig. 5 is a structural diagram of an LED display module according to an embodiment of the present invention.
Illustration of the drawings:
10. a substrate; 11. an LED chip; 12. patterning the light blocking layer; 13. a black matrix; 20. a packaging layer; 30. an ink layer; 40. an imaging layer; 41. a transflective layer; 50. and (7) an ink color packaging layer.
Detailed Description
In order to make the objects, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the embodiments described below are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
Referring to fig. 1 and 2, in the present embodiment, an LED display module is provided, which makes full use of the optical principle, and a transflective layer 41 is disposed on one side of an imaging layer 40, so that different black regions of the same display module are continuously reflected inside, so that human eyes can see the same display module more uniformly, the ink color consistency of the LED display module is improved, the uniformity of the ink color height of the upper screen can be realized without a tab, and the display color difference at different angles is eliminated, thereby presenting a display module with high contrast.
Specifically, the LED display module includes a substrate 10, an LED chip 11 flip-chip mounted on the substrate 10, and an ink encapsulation layer 50 covering the substrate 10 and the LED chip 11 for shielding light and encapsulating the LED chip 11. Alternatively, the ink encapsulation layer 50 is formed at once, as shown in fig. 2; or alternatively, the ink encapsulation layer 50 is composed of the encapsulation layer 20 and the ink layer 30 formed in sequence. An ink color layer 30 overlies the encapsulation layer 20, as shown in fig. 1.
The height of the ink encapsulation layer 50 is higher than the height of the LED chip 11.
Optionally, the substrate 10 is a PCB, glass, ceramic or other substrate.
An imaging layer 40 is further disposed on the ink color packaging layer 50, and a transflective layer 41 is formed on the imaging layer 40 facing the ink color packaging layer 50. The surface of the transflector 41 facing the ink encapsulation 50 (i.e., the lower surface of the transflector in FIG. 1) has a roughness Ra < 1 micron and Rz < 2 microns. In a preferred embodiment, the roughness Ra may be 0.5 micrometers or less, 0.1 micrometers or less, or 0.01 micrometers or less, and the Rz may be 0.1 micrometers or less, 0.05 micrometers or less, or 0.02 micrometers or less, respectively.
To further improve the ink consistency of the LED display module, the surface of the imaging layer 40 is planarized. Optionally, the surface of the imaging layer 40 opposite the ink encapsulating layer 50 (i.e., the top surface of the imaging layer in FIG. 1) is a mirror surface with a roughness Ra < 2 microns and Rz < 4 microns. As a preferred embodiment, the roughness Ra may be 1.5 micrometers or less, 0.5 micrometers or less, or 0.1 micrometers or less, respectively, and the Rz may be 3 micrometers or less, 1 micrometer or less, or 0.2 micrometers or less, respectively, to improve the ink color consistency of the display module.
In this embodiment, in order to improve the ink consistency of the LED display module, the surface of the ink encapsulation layer 50 is planarized, so that the surface of the ink encapsulation layer 50 opposite to the substrate 10 is a mirror surface.
Alternatively, the planarization process may be implemented by polishing, grinding, or smooth release film lamination.
Furthermore, in order to make the LED display module have higher ink color consistency, the roughness of the mirror surface can be controlled to make the surface roughness Ra of the side of the ink color packaging layer 50 opposite to the substrate 10 less than 1 micron, and Rz less than 2 microns. In a preferred embodiment, the roughness Ra may be 0.5 micrometers or less, 0.1 micrometers or less, or 0.01 micrometers or less, and the Rz may be 0.1 micrometers or less, 0.05 micrometers or less, or 0.02 micrometers or less, respectively. Optionally, the ink color encapsulation layer 50 includes a mixture of black pigment and at least one of epoxy, silicone, and polyurethane; diffusion powder and matting powder are added into the ink color packaging layer 50; the black pigment comprises at least one of graphite powder, carbon powder, iron black and/or black resin.
Alternatively, when the ink encapsulation layer 50 includes the encapsulation layer 20 and the ink layer 30, the ink uniformity of the display module can be improved by controlling the roughness of the surface of the encapsulation layer 20, so that the roughness Ra is less than 3 micrometers, and Rz is less than 6 micrometers. Alternatively, the values of Ra and Rz may be measured using a step tester. In a preferred embodiment, the roughness Ra may be 2 micrometers or less, 1 micrometer or less, or 0.5 micrometers or less, and the Rz may be 1 micrometer or less, 0.5 micrometer or less, or 0.25 micrometer or less, respectively.
The ink color consistency of the display module can also be improved by controlling the surface roughness of the ink color layer 30. Optionally, the roughness Ra is controlled to be less than 1 micron, and Rz is controlled to be less than 2 microns. In a preferred embodiment, the roughness Ra may be 0.5 micrometers or less, 0.1 micrometers or less, or 0.01 micrometers or less, and the Rz may be 0.1 micrometers or less, 0.05 micrometers or less, or 0.02 micrometers or less, respectively.
The encapsulation layer 20 includes epoxy, silicone or polyurethane. Optionally, a diffusing powder, a black pigment and a matting powder are added in the encapsulating layer 20. Optionally, the mass ratio of the black pigment to the packaging layer 20 is 0.1-5%, and the mass ratio of the matting powder to the packaging layer 20 is 0.1-5%; optionally, the black pigment includes at least one of graphite powder, carbon powder, iron black, and black resin. Optionally, the thickness of the encapsulation layer 20 is 30-400 microns.
The ink color layer 30 includes a mixture of at least one of fluorocarbon resin, epoxy resin, silicone, and polyurethane with a black pigment. Optionally, a diffusing powder or a matting powder is further added to the ink color layer 30. Optionally, the mass ratio of the black pigment to the ink layer 30 is 3-80%. Optionally, the black pigment includes at least one of graphite powder, carbon powder, iron black, and black resin. Optionally, the ink color layer 30 has a thickness of 1-100 microns.
It should be noted that the image forming layer 40 includes a mixture of at least one of fluorocarbon resin, epoxy resin, silicone, and polyurethane, and a diffusing powder or matting powder. Optionally, the thickness of the imaging layer 40 is 1-200 micrometers, the imaging layer 40 is a transparent layer, and the transparency is 50% -100%. Optionally, the imaging layer 40 has a thickness of 1-100 microns. Further, the imaging layer 40 may include functions of fingerprint prevention, bump prevention, and static electricity discharge.
Referring to fig. 3, another embodiment of the present application provides a manufacturing method, which can manufacture the LED display module provided in the above embodiment. Specifically, the manufacturing method comprises the following steps:
s101, forming an ink color packaging layer 50 on the substrate 10 and the LED chip 11 on the substrate 10; can be formed by spraying or film pressing;
s102, forming an imaging layer 40 on the ink color packaging layer 50, wherein a semi-transparent reflection layer 41 is formed on one side, facing the ink color packaging layer 50, of the imaging layer 40; can be formed by spraying or film pressing; the surface roughness Ra of the side, facing the ink color packaging layer 50, of the semi-transparent reflection layer 41 is less than 1 micrometer, and Rz is less than 2 micrometers.
Alternatively, the ink color encapsulation layer 50 may be formed at a time, or may be composed of an encapsulation layer 20 and an ink color layer 30 formed in sequence, wherein the ink color layer 30 covers the encapsulation layer 20.
Optionally, planarizing the surface of the encapsulation layer 20; the surface of the encapsulation layer 20 opposite to the substrate 10 is a mirror surface, and the surface roughness Ra is less than 3 micrometers, and Rz is less than 6 micrometers. Alternatively, the values of Ra and Rz may be measured using a step tester. In a preferred embodiment, the roughness Ra may be 2 micrometers or less, 1 micrometer or less, or 0.5 micrometers or less, and the Rz may be 1 micrometer or less, 0.5 micrometer or less, or 0.25 micrometer or less, respectively.
Carrying out flattening treatment on the surface of the ink color layer 30; the surface of the ink layer 30 opposite to the packaging layer 20 is a mirror surface, the roughness Ra is less than 1 micron, and the Rz is less than 2 microns. In a preferred embodiment, the roughness Ra may be 0.5 micrometers or less, 0.1 micrometers or less, or 0.01 micrometers or less, and the Rz may be 0.1 micrometers or less, 0.05 micrometers or less, or 0.02 micrometers or less, respectively.
Alternatively, when the ink color encapsulation layer 50 is formed at one time, after the ink color encapsulation layer 50 is formed; flattening the surface of the ink color packaging layer 50; the surface of the ink color packaging layer 50, which is opposite to the substrate 10, is a mirror surface, the roughness Ra of the mirror surface is less than 1 micrometer, and the Rz of the mirror surface is less than 2 micrometers. In a preferred embodiment, the roughness Ra may be 0.5 micrometers or less, 0.1 micrometers or less, or 0.01 micrometers or less, and the Rz may be 0.1 micrometers or less, 0.05 micrometers or less, or 0.02 micrometers or less, respectively. Optionally, planarizing the surface of the imaging layer 40; the surface of the imaging layer 40 opposite to the ink color packaging layer 50 is a mirror surface, the roughness Ra is less than 2 micrometers, and the Rz is less than 4 micrometers. As a preferred embodiment, the roughness Ra may be 1.5 micrometers or less, 0.5 micrometers or less, or 0.1 micrometers or less, respectively, and the Rz may be 3 micrometers or less, 1 micrometer or less, or 0.2 micrometers or less, respectively, to improve the ink color consistency of the display module.
Since the components of the encapsulation layer 20, the ink color layer 30, the imaging layer 40 and the ink color encapsulation layer 50 are specifically described in the above embodiments, the description thereof is omitted.
Optionally, the planarization process may be implemented by polishing, grinding, or smooth release film lamination.
The manufacturing method provided by the embodiment makes full use of the optical principle, and by arranging the semi-transparent reflection layer 41 on one side of the imaging layer 40 and controlling the roughness, the ink consistency of the LED display module can be obviously improved, the ink height consistency of the upper screen can be realized without picking up the sheet, the display chromatic aberration at different angles is eliminated, and the display module with high contrast is presented.
As an alternative to any of the above embodiments, the encapsulating layer 20 is divided into two parts, a primer layer and a matte layer.
Referring to fig. 4 and 5, the primer layer may form a black matrix 13, which is distributed between the LED chips 11 in the LED array. A matte layer is over the primer layer. Alternatively, the undercoat layer is a resin material mixed with a melanin pigment (carbon powder, iron black, etc.), and the matte layer is a resin material mixed with a scattering powder, a diffusing powder, or a matting powder. The resin material is epoxy resin, silica gel or polyurethane.
As an alternative implementation manner of any of the above embodiments, the LED chip 11 includes a LED chip group, and a QD layer is disposed on the LED chip group.
The substrate 10 is provided with a patterned light-blocking layer 12, LED chip units in an LED chip group are limited in a light-limiting unit of the patterned light-blocking layer 12, the LED chip units may be one pixel (three RGB chips) or a single LED chip, and the size of the light-limiting unit matches with that of the LED chip units.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.

Claims (10)

1. An LED display module, comprising:
a substrate provided with an LED chip;
the ink packaging layer is used for shading and packaging the LED chip and covers the substrate and the LED chip;
the imaging layer covers the ink color packaging layer, a semi-transparent reflection layer is formed on one side, facing the ink color packaging layer, of the imaging layer, the surface roughness Ra of the semi-transparent reflection layer, facing one side of the ink color packaging layer, is less than 1 micrometer, and Rz is less than 2 micrometers.
2. The LED display module of claim 1, wherein the imaging layer has a surface roughness Ra < 2 microns and Rz < 4 microns on a side facing away from the ink encapsulation layer.
3. The LED display module as claimed in claim 1, wherein the surface roughness Ra < 1 micron and Rz < 2 microns of the side of the ink encapsulation layer facing away from the substrate.
4. The LED display module of claim 1, wherein the ink encapsulation layer comprises an encapsulation layer and an ink layer covering the encapsulation layer, wherein the surface roughness Ra of the side of the encapsulation layer facing away from the substrate is less than 3 micrometers, and Rz is less than 6 micrometers.
5. The LED display module of claim 4, wherein the ink color layer has a surface roughness Ra < 1 micron and Rz < 2 microns on a side facing away from the encapsulation layer.
6. The LED display module of claim 4, wherein the encapsulation layer comprises epoxy, silicone, or polyurethane;
the packaging layer is added with diffusion powder, black pigment and matting powder;
the mass ratio of the black pigment to the packaging layer is 0.1-5%, and the mass ratio of the extinction powder to the packaging layer is 0.1-5%;
the black pigment comprises at least one of graphite powder, carbon powder, iron black and black resin.
7. The LED display module of claim 4, wherein the ink color layer comprises a mixture of black pigment and at least one of fluorocarbon resin, epoxy resin, silicone, and polyurethane;
diffusion powder or matting powder is also added into the ink color layer;
the mass ratio of the black pigment to the ink layer is 3-80%.
8. The LED display module of claim 1, wherein the imaging layer comprises a mixture of at least one of fluorocarbon resin, epoxy resin, silica gel, and polyurethane with a diffusing powder or matting powder;
the thickness of the imaging layer is 1-200 microns, the imaging layer is a transparent layer, and the transparency is 50% -100%.
9. A manufacturing method of an LED display module is characterized by comprising the following steps:
forming an ink color packaging layer for shading and packaging the LED chip on a substrate and the LED chip on the substrate;
forming an imaging layer on the ink encapsulation layer; and a semi-transparent reflection layer is formed on one side of the imaging layer, which faces the ink color packaging layer, the surface roughness Ra of the semi-transparent reflection layer, which faces the ink color packaging layer, is less than 1 micrometer, and Rz is less than 2 micrometers.
10. The method of manufacturing according to claim 9, wherein the forming of an ink color encapsulation layer for shielding light and encapsulating the LED chip on the substrate and the LED chip on the substrate includes:
forming an ink color packaging layer at one time; or the packaging layer and the ink color layer are formed in sequence, and the ink color layer covers the packaging layer.
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