CN114779849B - Semiconductor temperature control equipment and temperature control method - Google Patents
Semiconductor temperature control equipment and temperature control method Download PDFInfo
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- CN114779849B CN114779849B CN202210272638.5A CN202210272638A CN114779849B CN 114779849 B CN114779849 B CN 114779849B CN 202210272638 A CN202210272638 A CN 202210272638A CN 114779849 B CN114779849 B CN 114779849B
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 38
- 238000000034 method Methods 0.000 title claims abstract description 11
- 239000007788 liquid Substances 0.000 claims abstract description 74
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 58
- 239000003507 refrigerant Substances 0.000 claims abstract description 33
- 238000005057 refrigeration Methods 0.000 claims description 6
- 230000001105 regulatory effect Effects 0.000 description 6
- 238000012546 transfer Methods 0.000 description 5
- 238000004891 communication Methods 0.000 description 4
- 230000001276 controlling effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
- Y02B30/70—Efficient control or regulation technologies, e.g. for control of refrigerant flow, motor or heating
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- Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
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Abstract
The invention provides semiconductor temperature control equipment and a temperature control method, and relates to the technical field of semiconductors. The circulating liquid is pre-cooled by the refrigerant through the first evaporator, and the refrigerant is matched with the water tank through the heat exchange device, so that the refrigerant can perform supplementary heat exchange on the circulating liquid, the requirement on the temperature control precision of the outlet of the first evaporator is reduced, and the temperature control precision of temperature control equipment is improved. Because the heat exchange device and the pipeline are arranged in the water tank, the appearance and the size of the temperature control equipment and the appearance and the size of parts are not changed, so that the space utilization rate of the temperature control equipment is improved.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to semiconductor temperature control equipment and a temperature control method.
Background
At present, most of overlapping refrigerating systems of temperature control equipment for wafer processing are used for carrying out heat exchange on circulating liquid and refrigerant only once, and the heat exchange effect is limited. Although the plate heat exchanger has relatively high heat exchange efficiency, the heat exchanger cannot be oversized due to equipment size limitation in the semiconductor industry.
Disclosure of Invention
The invention provides a semiconductor temperature control device and a temperature control method, which are used for solving the problems of low heat exchange efficiency and low temperature control precision of the conventional temperature control device.
The present invention provides a semiconductor temperature control device, comprising:
the circulating system comprises a water pump and a water tank, wherein a liquid inlet of the water pump is communicated with a liquid outlet of the water tank, a liquid outlet of the water pump is communicated with a liquid inlet of load equipment, and a first temperature sensor is arranged at the liquid inlet of the load equipment;
refrigerating system, including refrigerating plant and refrigerant cycle device, refrigerant cycle device includes first evaporimeter, heat transfer device and first compressor, heat transfer device set up in the water tank, heat transfer device's entry with the first entry intercommunication of first evaporimeter refrigerating plant's export jointly, heat transfer device's entry is provided with a first automatically controlled valve, heat transfer device's export with the first export intercommunication of first evaporimeter the entry of first compressor jointly, the export of first compressor with refrigerating plant's entry intercommunication, the second export of first evaporimeter with the inlet intercommunication of water tank, the second entry of first evaporimeter with load equipment's liquid outlet intercommunication.
According to the semiconductor temperature control device provided by the embodiment of the invention, the refrigerating device comprises a condenser, a second compressor, an electronic expansion valve and a second evaporator, wherein the condenser is connected in series on a service water branch, and the condenser, the electronic expansion valve, the second evaporator and the second compressor are sequentially connected in series to form a refrigerating loop; the outlet of the first compressor is communicated with the first inlet of the second evaporator, and the inlet of the heat exchange device is communicated with the first inlet of the first evaporator together with the first outlet of the second evaporator.
According to the semiconductor temperature control device provided by the embodiment of the invention, the refrigerant circulation device further comprises:
the outlet of the heat exchange device is communicated with the first outlet of the first evaporator together with the inlet of the first compressor and the first connecting port of the expansion container, and the outlet of the first compressor is communicated with the second connecting port of the expansion container together with the first inlet of the second evaporator.
According to the semiconductor temperature control device provided by the embodiment of the invention, the second connecting port of the expansion container is provided with the second electric control valve.
According to the semiconductor temperature control device provided by the embodiment of the invention, the liquid outlet of the load device is provided with the second temperature sensor.
According to the semiconductor temperature control device provided by the embodiment of the invention, the first inlet of the first evaporator is provided with the third electric control valve, and the first electric control valve, the second electric control valve and the third electric control valve are all electronic expansion valves.
According to the semiconductor temperature control device provided by the embodiment of the invention, the heat exchange device and the water tank are integrally formed, and the water tank is provided with the liquid level meter.
The invention also provides a semiconductor temperature control method based on the semiconductor temperature control equipment, which comprises the following steps:
acquiring a temperature value of a liquid inlet of the load equipment;
comparing the temperature value with a preset temperature value;
and if the difference value between the preset temperature value and the temperature value exceeds the preset range, adjusting the opening of the first electric control valve.
According to the semiconductor temperature control method provided by the embodiment of the invention, if the difference value between the preset temperature value and the temperature value is judged to be out of the preset range, the adjusting the opening of the first electric control valve comprises:
if the difference value between the preset temperature value and the temperature value is larger than the maximum value of the preset range, controlling the opening of the first electric control valve to be increased;
and if the difference value between the preset temperature value and the temperature value is smaller than the minimum value of the preset range, controlling the opening degree of the first electric control valve to be reduced.
According to the semiconductor temperature control method provided by the embodiment of the invention, the preset range is +/-1 ℃.
According to the semiconductor temperature control equipment provided by the embodiment of the invention, the circulating liquid is pre-cooled by the refrigerant through the first evaporator, and then the circulating liquid is subjected to supplementary heat exchange by the refrigerant through the heat exchange device and the water tank, so that the requirement on the temperature control precision of the outlet of the first evaporator is reduced, and the temperature control precision of the temperature control equipment is improved. Because the heat exchange device and the pipeline are arranged in the water tank, the appearance and the size of the temperature control equipment and the appearance and the size of parts are not changed, so that the space utilization rate of the temperature control equipment is improved.
Drawings
In order to more clearly illustrate the invention or the technical solutions of the prior art, the following description will briefly explain the drawings used in the embodiments or the description of the prior art, and it is obvious that the drawings in the following description are some embodiments of the invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a semiconductor temperature control device according to an embodiment of the present invention.
Reference numerals:
1. a pressure regulating valve; 2. a first electrically controlled valve; 3. a thermal device; 4. a water pump; 5. a first temperature sensor; 6. a second temperature sensor; 7. a water tank; 8. a first evaporator; 9. a third electrically controlled valve; 10. a condenser; 11. an electronic expansion valve; 12. a second compressor; 13. a second evaporator; 14. a second electrically controlled valve; 15. a first compressor; 16. an expansion vessel; 17. and a load device.
Detailed Description
Embodiments of the present invention are described in further detail below with reference to the accompanying drawings and examples. The following examples are illustrative of the invention but are not intended to limit the scope of the invention.
In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the embodiments of the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In describing embodiments of the present invention, it should be noted that, unless explicitly stated and limited otherwise, the terms "coupled," "coupled," and "connected" should be construed broadly, and may be either a fixed connection, a removable connection, or an integral connection, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the above terms in embodiments of the present invention will be understood in detail by those of ordinary skill in the art.
In embodiments of the invention, unless expressly specified and limited otherwise, a first feature "up" or "down" on a second feature may be that the first and second features are in direct contact, or that the first and second features are in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the embodiments of the present invention. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
In the following, referring to fig. 1, a semiconductor temperature control device according to an embodiment of the present invention is described, and fig. 1 illustrates a schematic structural diagram of a semiconductor temperature control device, as shown in fig. 1, the semiconductor temperature control device includes a circulation system and a refrigeration system, the circulation system includes a water pump 4 and a water tank 7, a liquid inlet of the water pump 4 is communicated with a liquid outlet of the water tank 7, a liquid outlet of the water pump 4 is communicated with a liquid inlet of a load device 17, and the liquid inlet of the load device 17 is provided with a first temperature sensor 5.
The refrigerating system comprises a refrigerating device and a refrigerant circulating device, the refrigerant circulating device comprises a first evaporator 8, a heat exchange device 3 and a first compressor 15, the heat exchange device 3 is arranged in a water tank 7, an inlet of the heat exchange device 3 is communicated with a first inlet of the first evaporator 8 together to form an outlet of the refrigerating device, the inlet of the heat exchange device 3 is provided with a first electric control valve 2, the outlet of the heat exchange device 3 is communicated with a first outlet of the first evaporator 8 together to form an inlet of the first compressor 15, the outlet of the first compressor 15 is communicated with the inlet of the refrigerating device, a second outlet of the first evaporator 8 is communicated with a liquid inlet of the water tank 7, and a second inlet of the first evaporator 8 is communicated with a liquid outlet of a load device 17.
According to the semiconductor temperature control equipment provided by the embodiment of the invention, the circulating liquid is pre-cooled by the refrigerant through the first evaporator 8, and then the circulating liquid is subjected to supplementary heat exchange by the refrigerant through the heat exchange device 3 and the water tank 7, so that the requirement on the temperature control precision of the outlet of the first evaporator 8 is reduced, and the temperature control precision of the temperature control equipment is improved. Because the heat exchange device 3 and the pipeline are arranged in the water tank 7, the appearance and the size of the temperature control equipment and the appearance and the size of the parts are not changed, so that the space utilization rate of the temperature control equipment is improved.
In the embodiment of the present invention, the water pump 4, the water tank 7, the load device 17 and the first evaporator 8 constitute a circulation line of the circulation liquid, and the water pump 4 is used to drive the circulation liquid to circulate in the circulation line, thereby completing heat exchange.
In the embodiment of the invention, the refrigerating device comprises a condenser 10, a second compressor 12, an electronic expansion valve 11 and a second evaporator 13, wherein the condenser 10 is connected in series on the water-service branch, i.e. the first inlet of the condenser 10 is communicated with the liquid outlet pipe of the water-service branch, and the first outlet of the condenser 10 is communicated with the liquid return pipe of the water-service branch. The condenser 10, the electronic expansion valve 11, the second evaporator 13 and the second compressor 12 are sequentially connected in series to form a refrigeration loop, namely, a second outlet of the condenser 10 is communicated with an inlet of the electronic expansion valve 11, an outlet of the electronic expansion valve 11 is communicated with a second inlet of the second evaporator 13, a second outlet of the second evaporator 13 is communicated with an inlet of the second compressor 12, and an outlet of the second compressor 12 is communicated with a second inlet of the condenser 10. The outlet of the first compressor 15 communicates with the first inlet of the second evaporator 13, and the inlet of the heat exchange device 3 communicates with the first inlet of the first evaporator 8 together with the first outlet of the second evaporator 13.
The condenser 10 is used for exchanging heat with the liquid in the service water branch, and the second evaporator 13 is used for exchanging heat with the refrigerant circuit. The first compressor 15 conveys the refrigerant to the second evaporator 13 for heat exchange, so that the temperature of the refrigerant is reduced, the refrigerant with reduced temperature respectively enters the first evaporator 8 and the heat exchange device 3, wherein the refrigerant is pre-cooled with circulating liquid in the first evaporator 8, and the circulating liquid is subjected to supplementary heat exchange in the water tank 7 through the heat exchange device 3, thereby reducing the temperature control precision requirement on the second outlet of the first evaporator 8 and improving the temperature control precision of temperature control equipment. Through adopting PID control, the inside heat exchange quantity of water tank 7 can be automatically regulated, the refrigerant quantity of the inside heat exchange of entering water tank 7 is controlled according to the detected temperature value of the liquid inlet and the liquid outlet of load equipment 17. The heat exchange between the circulating liquid and the refrigerant is realized by utilizing the inner space of the water tank 7, so that the overall heat exchange quantity of the system is increased. The cooling in the first evaporator 8 of the refrigeration system is avoided by means of the circulating liquid only, and the load of the refrigeration system is reduced. The excessive fluctuation of the output of the compressor is avoided, the opening of the electronic expansion valve 11 fluctuates back and forth, and the overall service life and long-term stability of the system are improved.
In the embodiment of the present invention, the refrigerant cycle device further includes an expansion vessel 16, the outlet of the heat exchange device 3 is commonly communicated with the inlet of the first compressor 15 and the first connection port of the expansion vessel 16 together with the first outlet of the first evaporator 8, the outlet of the first compressor 15 is commonly communicated with the second connection port of the expansion vessel 16 with the first inlet of the second evaporator 13, and the second connection port of the expansion vessel 16 is provided with the second electrically controlled valve 14.
It should be noted that, since the refrigerant is in a gaseous state at normal temperature and expands very much, the refrigerant is in a liquid state at-70 ℃, but if the refrigerant is returned to normal temperature after stopping, the internal pressure of the pipeline is extremely high, so that the expansion vessel 16 is arranged on the pipeline, the volume of the whole system can be increased, the internal pressure of the pipeline is not increased extremely high after the refrigerant expands, and the safety of the temperature control device is effectively improved. By providing the second electrically controlled valve 14, the amount of refrigerant entering the interior of the expansion vessel 16 can be controlled.
In the embodiment of the invention, the outlet of the heat exchange device 3 is provided with a pressure regulating valve 1, the pressure regulating valve 1 is used for regulating the pressure of the refrigerant at the outlet of the heat exchange device 3, and the heat exchange device 3 can be a heat exchanger in the form of a heat exchange tube or a fin.
In the embodiment of the invention, the liquid outlet of the load device 17 is provided with the second temperature sensor 6, the second temperature sensor 6 is used for detecting the temperature value of the liquid outlet of the load device 17, and the temperature control precision of the temperature control device can be further improved by controlling the amount of the refrigerant entering the water tank 7 for heat exchange according to the temperature values of the liquid outlet and the liquid inlet of the load device 17.
In the embodiment of the invention, the first inlet of the first evaporator 8 is provided with the third electric control valve 9, the first electric control valve 2, the second electric control valve 14 and the third electric control valve 9 are all electronic expansion valves, and the automatic control of the temperature control equipment can be realized by respectively and electrically connecting the electronic expansion valves, the first temperature sensor 5 and the second temperature sensor 6 with the PID controller.
In the embodiment of the invention, the heat exchange device 3 and the water tank 7 are integrally formed, the water tank 7 is provided with a liquid level meter, and the amount of circulating liquid in the water tank 7 can be conveniently observed through the liquid level meter.
One specific embodiment of the present invention is described below in conjunction with fig. 1: in fig. 1, the semiconductor temperature control device comprises a circulating system and a refrigerating system, the circulating system comprises a water pump 4 and a water tank 7, a liquid inlet of the water pump 4 is communicated with a liquid outlet of the water tank 7, a liquid outlet of the water pump 4 is communicated with a liquid inlet of a load device 17, and the liquid inlet of the load device 17 is provided with a first temperature sensor 5.
The refrigerating system comprises a refrigerating device and a refrigerant circulating device, the refrigerating device comprises a condenser 10, a second compressor 12, an electronic expansion valve 11 and a second evaporator 13, a first inlet of the condenser 10 is communicated with a liquid outlet pipe of the plant water branch, and a first outlet of the condenser 10 is communicated with a liquid return pipe of the plant water branch. The second outlet of the condenser 10 is in communication with the inlet of the electronic expansion valve 11, the outlet of the electronic expansion valve 11 is in communication with the second inlet of the second evaporator 13, the second outlet of the second evaporator 13 is in communication with the inlet of the second compressor 12, and the outlet of the second compressor 12 is in communication with the second inlet of the condenser 10.
The refrigerant circulation device comprises a first evaporator 8, an expansion container 16, a heat exchange device 3 and a first compressor 15, wherein the heat exchange device 3 is arranged in a water tank 7, an inlet of the heat exchange device 3 is communicated with a first inlet of the first evaporator 8 together with a first outlet of a second evaporator 13, an outlet of the heat exchange device 3 is communicated with a first outlet of the first evaporator 8 together with an inlet of the first compressor 15 and a first connection port of the expansion container 16, an outlet of the first compressor 15 is communicated with a second connection port of the expansion container 16 together with a first inlet of the second evaporator 13, an inlet of the heat exchange device 3 is provided with a first electric control valve 2, a second outlet of the first evaporator 8 is communicated with a liquid inlet of the water tank 7, and a second inlet of the first evaporator 8 is communicated with a liquid outlet of a load device 17. The second connection port of the expansion vessel 16 is provided with a second electrically controlled valve 14, the first inlet of the first evaporator 8 is provided with a third electrically controlled valve 9, and the first electrically controlled valve 2, the second electrically controlled valve 14 and the third electrically controlled valve 9 are all electronic expansion valves 11. The outlet of the heat exchange device 3 is provided with a pressure regulating valve 1, the liquid outlet of the load equipment 17 is provided with a second temperature sensor 6, the heat exchange device 3 and the water tank 7 are integrally formed, and the water tank 7 is provided with a liquid level meter.
The embodiment of the invention also provides a semiconductor temperature control method based on the semiconductor temperature control device according to any one of the embodiments, comprising the following steps:
step a1, obtaining a temperature value of a liquid inlet of load equipment 17;
here, the purpose of detecting the temperature value of the liquid inlet of the load device 17 is to determine whether the temperature of the circulating liquid entering the liquid inlet of the load device 17 reaches a predetermined temperature value.
Step a2, comparing the temperature value with a preset temperature value;
the purpose of comparing the temperature value with the preset temperature value is to calculate the difference between the preset temperature value and the temperature value.
And a step a3, if the difference value between the preset temperature value and the temperature value exceeds the preset range, adjusting the opening of the first electric control valve 2.
In the embodiment of the present invention, if it is determined that the difference between the preset temperature value and the temperature value exceeds the preset range, adjusting the opening of the first electronically controlled valve 2 includes:
if the difference between the preset temperature value and the temperature value is larger than the maximum value of the preset range, controlling the opening of the first electric control valve 2 to be increased;
the difference between the preset temperature value and the temperature value is larger than the maximum value of the preset range, which means that the temperature value of the circulating liquid entering the liquid inlet of the load device 17 is too high, so that the opening degree of the first electric control valve 2 is increased, and the temperature value of the circulating liquid entering the liquid inlet of the load device 17 is reduced.
If the difference between the preset temperature value and the temperature value is smaller than the minimum value of the preset range, the opening of the first electric control valve 2 is controlled to be reduced.
The difference between the preset temperature value and the temperature value is smaller than the minimum value of the preset range, which means that the temperature value of the circulating liquid entering the liquid inlet of the load equipment 17 is too low, so that the opening degree of the first electric control valve 2 is reduced, and the temperature value of the circulating liquid entering the liquid inlet of the load equipment 17 is improved.
In one embodiment of the present invention, if the difference between the preset temperature value and the temperature value is within the preset range, it is not necessary to control the first electrically controlled valve 2 correspondingly.
In the embodiment of the present invention, the preset range is ±1 ℃, and of course, the preset range is not limited thereto, and is specifically determined according to the temperature control accuracy of the temperature control apparatus.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present invention, and are not limiting; although the invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (9)
1. A semiconductor temperature control device, comprising:
the circulating system comprises a water pump and a water tank, wherein a liquid inlet of the water pump is communicated with a liquid outlet of the water tank, a liquid outlet of the water pump is communicated with a liquid inlet of load equipment, and a first temperature sensor is arranged at the liquid inlet of the load equipment;
the refrigerating system comprises a refrigerating device and a refrigerant circulating device, wherein the refrigerant circulating device comprises a first evaporator, a heat exchange device and a first compressor, the heat exchange device is arranged in the water tank, an inlet of the heat exchange device is communicated with a first inlet of the first evaporator together to form an outlet of the refrigerating device, the inlet of the heat exchange device is provided with a first electric control valve, the outlet of the heat exchange device is communicated with the first outlet of the first evaporator together to form an inlet of the first compressor, the outlet of the first compressor is communicated with the inlet of the refrigerating device, a second outlet of the first evaporator is communicated with a liquid inlet of the water tank, and a second inlet of the first evaporator is communicated with a liquid outlet of the load equipment;
acquiring a temperature value of a liquid inlet of the load equipment;
comparing the temperature value with a preset temperature value;
and if the difference value between the preset temperature value and the temperature value exceeds the preset range, adjusting the opening of the first electric control valve.
2. The semiconductor temperature control device according to claim 1, wherein the refrigeration unit comprises a condenser, a second compressor, an electronic expansion valve and a second evaporator, wherein the condenser is connected in series on a service water branch, and the condenser, the electronic expansion valve, the second evaporator and the second compressor are connected in series in sequence to form a refrigeration loop; the outlet of the first compressor is communicated with the first inlet of the second evaporator, and the inlet of the heat exchange device is communicated with the first inlet of the first evaporator together with the first outlet of the second evaporator.
3. The semiconductor temperature control device according to claim 2, wherein the refrigerant cycle means further comprises:
the outlet of the heat exchange device is communicated with the first outlet of the first evaporator together with the inlet of the first compressor and the first connecting port of the expansion container, and the outlet of the first compressor is communicated with the second connecting port of the expansion container together with the first inlet of the second evaporator.
4. A semiconductor temperature control device according to claim 3, wherein the second connection port of the expansion vessel is provided with a second electrically controlled valve.
5. The semiconductor temperature control device according to any one of claims 1 to 4, wherein a liquid outlet of the load device is provided with a second temperature sensor.
6. The semiconductor temperature control device of claim 4, wherein the first inlet of the first evaporator is provided with a third electrically controlled valve, and wherein the first, second and third electrically controlled valves are all electronic expansion valves.
7. A semiconductor temperature control device according to any one of claims 1 to 4, wherein the heat exchanging means is integrally formed with the water tank, the water tank being provided with a level gauge.
8. A semiconductor temperature control method based on the semiconductor temperature control device according to any one of claims 1 to 7, wherein adjusting the opening degree of the first electronic control valve if it is determined that the difference between the preset temperature value and the temperature value is out of a preset range comprises:
if the difference value between the preset temperature value and the temperature value is larger than the maximum value of the preset range, controlling the opening of the first electric control valve to be increased;
and if the difference value between the preset temperature value and the temperature value is smaller than the minimum value of the preset range, controlling the opening degree of the first electric control valve to be reduced.
9. The semiconductor temperature control method according to claim 8, wherein the preset range is ±1 ℃.
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| CN103868265A (en) * | 2014-03-03 | 2014-06-18 | 北京自动化技术研究院 | Temperature control device with cold accumulation/heat accumulation function |
| CN211372806U (en) * | 2019-12-24 | 2020-08-28 | 北京京仪自动化装备技术有限公司 | Semiconductor temperature control device system |
| JP2022026751A (en) * | 2020-07-31 | 2022-02-10 | 啓旨 谷口 | Temperature control device using multistage refrigeration cycle and temperature control method using the same |
| CN112346493A (en) * | 2020-10-29 | 2021-02-09 | 北京京仪自动化装备技术有限公司 | Temperature control equipment and method |
| CN112797656A (en) * | 2021-02-03 | 2021-05-14 | 合肥亦威科技有限公司 | Extremely high extremely low temperature control system |
| CN113419574A (en) * | 2021-06-18 | 2021-09-21 | 北京京仪自动化装备技术股份有限公司 | Low-temperature control equipment for semiconductor |
| CN113654260A (en) * | 2021-08-02 | 2021-11-16 | 北京京仪自动化装备技术股份有限公司 | Double-circulation temperature control equipment and method for cascade refrigeration system |
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