CN114779849A - Semiconductor temperature control equipment and temperature control method - Google Patents
Semiconductor temperature control equipment and temperature control method Download PDFInfo
- Publication number
- CN114779849A CN114779849A CN202210272638.5A CN202210272638A CN114779849A CN 114779849 A CN114779849 A CN 114779849A CN 202210272638 A CN202210272638 A CN 202210272638A CN 114779849 A CN114779849 A CN 114779849A
- Authority
- CN
- China
- Prior art keywords
- temperature control
- evaporator
- inlet
- outlet
- compressor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 title claims abstract description 12
- 239000007788 liquid Substances 0.000 claims abstract description 71
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 61
- 239000003507 refrigerant Substances 0.000 claims abstract description 31
- 238000001816 cooling Methods 0.000 abstract description 4
- 230000001502 supplementing effect Effects 0.000 abstract 1
- 238000005057 refrigeration Methods 0.000 description 8
- 230000001105 regulatory effect Effects 0.000 description 5
- 230000001276 controlling effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
- Y02B30/70—Efficient control or regulation technologies, e.g. for control of refrigerant flow, motor or heating
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Control Of Temperature (AREA)
Abstract
The invention provides semiconductor temperature control equipment and a temperature control method, and relates to the technical field of semiconductors. The refrigerant is used for pre-cooling the circulating liquid through the first evaporator, and the heat exchange device is matched with the water tank, so that the refrigerant is used for supplementing and exchanging heat for the circulating liquid, the requirement on the temperature control precision of the outlet of the first evaporator is reduced, and the temperature control precision of the temperature control equipment is improved. Because the heat exchange device and the pipeline are arranged in the water tank, the appearance and the size of the temperature control equipment and the appearance and the size of parts are not changed, and the space utilization rate of the temperature control equipment is improved.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to semiconductor temperature control equipment and a temperature control method.
Background
Most of the existing temperature control equipment cascade refrigeration systems for wafer processing only perform one-time heat exchange between circulating liquid and a refrigerant, and the heat exchange effect is limited. Although the plate heat exchanger has relatively high heat exchange efficiency, the size of the heat exchanger cannot be too large due to the limitation of the semiconductor industry on the size of equipment.
Disclosure of Invention
The invention provides semiconductor temperature control equipment and a temperature control method, which are used for solving the problems of low heat exchange efficiency and low temperature control precision of the conventional temperature control equipment.
The present invention provides a semiconductor temperature control device, comprising:
the circulating system comprises a water pump and a water tank, wherein a liquid inlet of the water pump is communicated with a liquid outlet of the water tank, a liquid outlet of the water pump is communicated with a liquid inlet of load equipment, and a first temperature sensor is arranged at a liquid inlet of the load equipment;
refrigerating system, including refrigerating plant and refrigerant cycle device, refrigerant cycle device includes first evaporimeter, heat transfer device and first compressor, heat transfer device set up in the water tank, heat transfer device's entry with the first entry of first evaporimeter communicates jointly refrigerating plant's export, heat transfer device's entry is provided with first automatically controlled valve, heat transfer device's export with the first export of first evaporimeter communicates jointly the entry of first compressor, the export of first compressor with refrigerating plant's entry intercommunication, the second export of first evaporimeter with the inlet intercommunication of water tank, the second entry of first evaporimeter with the liquid outlet intercommunication of load equipment.
According to the semiconductor temperature control device provided by the embodiment of the invention, the refrigerating device comprises a condenser, a second compressor, an electronic expansion valve and a second evaporator, wherein the condenser is connected in series on a plant water branch, and the condenser, the electronic expansion valve, the second evaporator and the second compressor are sequentially connected in series to form a refrigerating circuit; the outlet of the first compressor is communicated with the first inlet of the second evaporator, and the inlet of the heat exchange device and the first inlet of the first evaporator are communicated with the first outlet of the second evaporator together.
According to a semiconductor temperature control device provided by an embodiment of the present invention, the refrigerant cycle device further includes:
and the outlet of the heat exchange device and the first outlet of the first evaporator are communicated with the inlet of the first compressor and the first connecting port of the expansion container, and the outlet of the first compressor and the second connecting port of the expansion container are communicated with the first inlet of the second evaporator.
According to the semiconductor temperature control device provided by the embodiment of the invention, the second connecting port of the expansion container is provided with the second electric control valve.
According to the semiconductor temperature control device provided by the embodiment of the invention, the liquid outlet of the load device is provided with the second temperature sensor.
According to the semiconductor temperature control device provided by the embodiment of the invention, the first inlet of the first evaporator is provided with the third electric control valve, and the first electric control valve, the second electric control valve and the third electric control valve are all electronic expansion valves.
According to the semiconductor temperature control device provided by the embodiment of the invention, the heat exchange device and the water tank are integrally formed, and the water tank is provided with the liquid level meter.
The invention also provides a semiconductor temperature control method based on the semiconductor temperature control equipment, which comprises the following steps:
acquiring a temperature value of the liquid inlet of the load equipment;
comparing the temperature value with a preset temperature value;
and if the difference value between the preset temperature value and the temperature value is judged to exceed a preset range, adjusting the opening degree of the first electric control valve.
According to the semiconductor temperature control method provided by the embodiment of the invention, if it is determined that the difference value between the preset temperature value and the temperature value exceeds the preset range, the adjusting the opening degree of the first electric control valve comprises the following steps:
if the difference value between the preset temperature value and the temperature value is larger than the maximum value of the preset range, controlling the opening of the first electric control valve to increase;
and if the difference value between the preset temperature value and the temperature value is smaller than the minimum value of the preset range, controlling the opening of the first electric control valve to be reduced.
According to the semiconductor temperature control method provided by the embodiment of the invention, the preset range is +/-1 ℃.
According to the semiconductor temperature control device provided by the embodiment of the invention, the first evaporator is used for realizing the pre-cooling of the circulating liquid by the refrigerant, and the heat exchange device is matched with the water tank, so that the supplementary heat exchange of the circulating liquid by the refrigerant is realized, the requirement on the temperature control precision of the outlet of the first evaporator is reduced, and the temperature control precision of the temperature control device is improved. Because heat transfer device and pipeline set up inside the water tank, do not change the appearance and the size of temperature control equipment to and the appearance and the size of spare part, consequently improved temperature control equipment's space utilization.
Drawings
In order to more clearly illustrate the technical solutions of the present invention or the prior art, the drawings needed for the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a semiconductor temperature control device according to an embodiment of the present invention.
Reference numerals are as follows:
1. a pressure regulating valve; 2. a first electrically controlled valve; 3. a thermal device; 4. a water pump; 5. a first temperature sensor; 6. a second temperature sensor; 7. a water tank; 8. a first evaporator; 9. a third electrically controlled valve; 10. a condenser; 11. an electronic expansion valve; 12. a second compressor; 13. a second evaporator; 14. a second electrically controlled valve; 15. a first compressor; 16. an expansion vessel; 17. a load device.
Detailed Description
The embodiments of the present invention will be described in further detail with reference to the drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
In the description of the embodiments of the present invention, it should be noted that the terms "center", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the embodiments of the present invention and simplifying the description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the embodiments of the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the embodiments of the present invention, it should be noted that, unless explicitly stated or limited otherwise, the terms "connected" and "connected" are to be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. Specific meanings of the above terms in the embodiments of the present invention can be understood in specific cases by those of ordinary skill in the art.
In embodiments of the invention, unless expressly stated or limited otherwise, a first feature may be "on" or "under" a second feature such that the first and second features are in direct contact, or the first and second features are in indirect contact via an intermediary. Also, a first feature "on," "above," and "over" a second feature may be directly on or obliquely above the second feature, or simply mean that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
In the description of the present specification, reference to the description of "one embodiment," "some embodiments," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the embodiments of the present invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Moreover, various embodiments or examples and features of various embodiments or examples described in this specification can be combined and combined by one skilled in the art without being mutually inconsistent.
Fig. 1 illustrates a schematic structural principle diagram of a semiconductor temperature control device according to an embodiment of the present invention, and as shown in fig. 1, the semiconductor temperature control device includes a circulation system and a refrigeration system, where the circulation system includes a water pump 4 and a water tank 7, a liquid inlet of the water pump 4 is communicated with a liquid outlet of the water tank 7, a liquid outlet of the water pump 4 is communicated with a liquid inlet of a load device 17, and a liquid inlet of the load device 17 is provided with a first temperature sensor 5.
The refrigerating system comprises a refrigerating device and a refrigerant circulating device, the refrigerant circulating device comprises a first evaporator 8, a heat exchange device 3 and a first compressor 15, the heat exchange device 3 is arranged in a water tank 7, an inlet of the heat exchange device 3 and a first inlet of the first evaporator 8 are communicated with an outlet of the refrigerating device, an inlet of the heat exchange device 3 is provided with a first electric control valve 2, an outlet of the heat exchange device 3 and a first outlet of the first evaporator 8 are communicated with an inlet of the first compressor 15, an outlet of the first compressor 15 is communicated with an inlet of the refrigerating device, a second outlet of the first evaporator 8 is communicated with a liquid inlet of the water tank 7, and a second inlet of the first evaporator 8 is communicated with a liquid outlet of a load device 17.
According to the semiconductor temperature control device provided by the embodiment of the invention, the first evaporator 8 is used for pre-cooling the circulating liquid by the refrigerant, and the heat exchange device 3 is matched with the water tank 7, so that the supplementary heat exchange of the circulating liquid by the refrigerant is realized, the requirement on the temperature control precision of the outlet of the first evaporator 8 is reduced, and the temperature control precision of the temperature control device is improved. Because the heat exchange device 3 and the pipeline are arranged in the water tank 7, the appearance and the size of the temperature control equipment and the appearance and the size of parts are not changed, and the space utilization rate of the temperature control equipment is improved.
In the embodiment of the present invention, the water pump 4, the water tank 7, the load device 17 and the first evaporator 8 form a circulation pipeline of the circulation fluid, and the water pump 4 is used for driving the circulation fluid to circulate in the circulation pipeline, so that heat exchange is completed.
In the embodiment of the present invention, the refrigeration apparatus includes a condenser 10, a second compressor 12, an electronic expansion valve 11, and a second evaporator 13, the condenser 10 is connected in series to the plant water branch, that is, a first inlet of the condenser 10 is communicated with a liquid outlet pipe of the plant water branch, and a first outlet of the condenser 10 is communicated with a liquid return pipe of the plant water branch. The condenser 10, the electronic expansion valve 11, the second evaporator 13 and the second compressor 12 are sequentially connected in series to form a refrigeration circuit, that is, a second outlet of the condenser 10 is communicated with an inlet of the electronic expansion valve 11, an outlet of the electronic expansion valve 11 is communicated with a second inlet of the second evaporator 13, a second outlet of the second evaporator 13 is communicated with an inlet of the second compressor 12, and an outlet of the second compressor 12 is communicated with a second inlet of the condenser 10. The outlet of the first compressor 15 is communicated with the first inlet of the second evaporator 13, and the inlet of the heat exchange device 3 and the first inlet of the first evaporator 8 are communicated with the first outlet of the second evaporator 13.
The condenser 10 is used for heat exchange with the liquid in the plant water branch and the second evaporator 13 is used for heat exchange with the refrigerant circuit. The first compressor 15 conveys the refrigerant to the second evaporator 13 to carry out heat exchange, so that the temperature of the refrigerant is reduced, the refrigerant after the temperature reduction respectively enters the first evaporator 8 and the heat exchange device 3, wherein the refrigerant is pre-cooled in the first evaporator 8 with the circulating liquid, the circulating liquid is subjected to supplementary heat exchange in the water tank 7 through the heat exchange device 3, the requirement on the temperature control precision of a second outlet of the first evaporator 8 is reduced, and the temperature control precision of the temperature control equipment is improved. By adopting PID control, the heat exchange amount in the water tank 7 can be automatically adjusted, and the amount of the refrigerant entering the water tank 7 for heat exchange is controlled according to the detection temperature values of the liquid inlet and the liquid outlet of the load equipment 17. The heat exchange between the circulating liquid and the refrigerant is realized by utilizing the inner space of the water tank 7, and the integral heat exchange quantity of the system is increased. The cooling in the first evaporator 8 of the refrigerating system by only depending on the circulating liquid is avoided, and the load of the refrigerating system is reduced. The output fluctuation of the compressor is avoided to be overlarge, and the opening degree of the electronic expansion valve 11 fluctuates back and forth, so that the service life and the long-term stability of the whole system are favorably improved.
In the embodiment of the present invention, the refrigerant cycle device further includes an expansion container 16, the outlet of the heat exchanging device 3 and the first outlet of the first evaporator 8 are communicated with the inlet of the first compressor 15 and the first connection port of the expansion container 16, the outlet of the first compressor 15 and the second connection port of the expansion container 16 are communicated with the first inlet of the second evaporator 13, and the second connection port of the expansion container 16 is provided with the second electrically controlled valve 14.
It should be noted here that, since the refrigerant is gaseous at normal temperature, and expands greatly, when the temperature is-70 ℃, the refrigerant is liquid, but if the temperature returns to normal temperature after the shutdown, the internal pressure of the pipeline is very high, so that the expansion container 16 is arranged on the pipeline, the volume of the whole system can be increased, and after the refrigerant expands, the internal pressure of the pipeline is not increased to be very high, thereby effectively improving the safety of the temperature control device. By providing the second electrically controlled valve 14 the amount of refrigerant entering the interior of the expansion vessel 16 can be controlled.
In the embodiment of the present invention, a pressure regulating valve 1 is disposed at an outlet of the heat exchanging device 3, the pressure regulating valve 1 is used for regulating the pressure of the refrigerant at the outlet of the heat exchanging device 3, and the heat exchanging device 3 may be a heat exchanger with a heat exchanging tube or a fin type.
In the embodiment of the invention, the second temperature sensor 6 is arranged at the liquid outlet of the load equipment 17, the second temperature sensor 6 is used for detecting the temperature value of the liquid outlet of the load equipment 17, and the amount of the refrigerant entering the water tank 7 for heat exchange is controlled according to the temperature values of the liquid outlet and the liquid inlet of the load equipment 17, so that the temperature control precision of the temperature control equipment can be further improved.
In the embodiment of the present invention, the third electronic control valve 9 is disposed at the first inlet of the first evaporator 8, and the first electronic control valve 2, the second electronic control valve 14 and the third electronic control valve 9 are all electronic expansion valves, and the electronic expansion valves, the first temperature sensor 5 and the second temperature sensor 6 are electrically connected to the PID controller, respectively, so as to realize automatic control of the temperature control device.
In the embodiment of the invention, the heat exchange device 3 and the water tank 7 are integrally formed, the water tank 7 is provided with the liquid level meter, and the amount of the circulating liquid in the water tank 7 can be conveniently observed by arranging the liquid level meter.
One embodiment of the present invention is described below in conjunction with fig. 1: in fig. 1, the semiconductor temperature control device includes a circulation system and a refrigeration system, the circulation system includes a water pump 4 and a water tank 7, a liquid inlet of the water pump 4 is communicated with a liquid outlet of the water tank 7, a liquid outlet of the water pump 4 is communicated with a liquid inlet of a load device 17, and a liquid inlet of the load device 17 is provided with a first temperature sensor 5.
The refrigeration system comprises a refrigeration device and a refrigerant circulating device, the refrigeration device comprises a condenser 10, a second compressor 12, an electronic expansion valve 11 and a second evaporator 13, a first inlet of the condenser 10 is communicated with a liquid outlet pipe of the plant water branch, and a first outlet of the condenser 10 is communicated with a liquid return pipe of the plant water branch. A second outlet of the condenser 10 communicates with an inlet of the electronic expansion valve 11, an outlet of the electronic expansion valve 11 communicates with a second inlet of the second evaporator 13, a second outlet of the second evaporator 13 communicates with an inlet of the second compressor 12, and an outlet of the second compressor 12 communicates with a second inlet of the condenser 10.
The refrigerant circulating device comprises a first evaporator 8, an expansion container 16, a heat exchange device 3 and a first compressor 15, wherein the heat exchange device 3 is arranged in a water tank 7, an inlet of the heat exchange device 3 and a first inlet of the first evaporator 8 are communicated with a first outlet of a second evaporator 13, an outlet of the heat exchange device 3 and a first outlet of the first evaporator 8 are communicated with an inlet of the first compressor 15 and a first connecting port of the expansion container 16, an outlet of the first compressor 15 and a second connecting port of the expansion container 16 are communicated with a first inlet of the second evaporator 13, the inlet of the heat exchange device 3 is provided with a first electric control valve 2, a second outlet of the first evaporator 8 is communicated with a liquid inlet of the water tank 7, and a second inlet of the first evaporator 8 is communicated with a liquid outlet of a load device 17. The second connection port of the expansion container 16 is provided with a second electronic control valve 14, the first inlet of the first evaporator 8 is provided with a third electronic control valve 9, and the first electronic control valve 2, the second electronic control valve 14 and the third electronic control valve 9 are all electronic expansion valves 11. The outlet of the heat exchange device 3 is provided with a pressure regulating valve 1, the liquid outlet of the load equipment 17 is provided with a second temperature sensor 6, the heat exchange device 3 and the water tank 7 are integrally formed, and the water tank 7 is provided with a liquid level meter.
The embodiment of the invention also provides a semiconductor temperature control method based on the semiconductor temperature control equipment, which comprises the following steps:
step a1, obtaining a temperature value of a liquid inlet of the load equipment 17;
it should be noted here that the purpose of detecting the temperature value of the liquid inlet of the load device 17 is to determine whether the temperature of the circulating liquid entering the liquid inlet of the load device 17 reaches a predetermined temperature value.
Step a2, comparing the temperature value with a preset temperature value;
the purpose of comparing the temperature value with the preset temperature value is to calculate a difference between the preset temperature value and the temperature value.
Step a3, if the difference value between the preset temperature value and the temperature value is judged to exceed the preset range, the opening degree of the first electric control valve 2 is adjusted.
In an embodiment of the present invention, if it is determined that the difference between the preset temperature value and the temperature value exceeds the preset range, the adjusting the opening degree of the first electronic control valve 2 includes:
if the difference value between the preset temperature value and the temperature value is larger than the maximum value of the preset range, controlling the opening of the first electric control valve 2 to increase;
the difference value between the preset temperature value and the temperature value is larger than the maximum value of the preset range, which indicates that the temperature value of the circulating liquid entering the liquid inlet of the load equipment 17 is too high, so that the opening degree of the first electric control valve 2 is increased, and the temperature value of the circulating liquid entering the liquid inlet of the load equipment 17 is reduced.
And if the difference value between the preset temperature value and the temperature value is smaller than the minimum value of the preset range, controlling the opening degree of the first electric control valve 2 to be reduced.
The difference value between the preset temperature value and the temperature value is smaller than the minimum value of the preset range, which indicates that the temperature value of the circulating liquid entering the liquid inlet of the load equipment 17 is too low, so that the opening degree of the first electric control valve 2 is reduced, and the temperature value of the circulating liquid entering the liquid inlet of the load equipment 17 is increased.
In an embodiment of the present invention, if the difference between the preset temperature value and the temperature value is within the preset range, the first electronic control valve 2 does not need to be controlled accordingly.
In the embodiment of the present invention, the preset range is ± 1 ℃, and of course, the preset range is not limited thereto, and is specifically determined according to the temperature control precision of the temperature control device.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A semiconductor temperature control device, comprising:
the circulating system comprises a water pump and a water tank, wherein a liquid inlet of the water pump is communicated with a liquid outlet of the water tank, a liquid outlet of the water pump is communicated with a liquid inlet of the load equipment, and a first temperature sensor is arranged at a liquid inlet of the load equipment;
refrigerating system, including refrigerating plant and refrigerant cycle device, refrigerant cycle device includes first evaporimeter, heat transfer device and first compressor, heat transfer device set up in the water tank, heat transfer device's entry with the first entry of first evaporimeter communicates jointly refrigerating plant's export, heat transfer device's entry is provided with first automatically controlled valve, heat transfer device's export with the first export of first evaporimeter communicates jointly the entry of first compressor, the export of first compressor with refrigerating plant's entry intercommunication, the second export of first evaporimeter with the inlet intercommunication of water tank, the second entry of first evaporimeter with the liquid outlet intercommunication of load equipment.
2. The semiconductor temperature control device according to claim 1, wherein the refrigerating apparatus includes a condenser, a second compressor, an electronic expansion valve, and a second evaporator, the condenser is connected in series to a plant water branch, and the condenser, the electronic expansion valve, the second evaporator, and the second compressor are connected in series in this order to form a refrigerating circuit; the outlet of the first compressor is communicated with the first inlet of the second evaporator, and the inlet of the heat exchange device and the first inlet of the first evaporator are communicated with the first outlet of the second evaporator together.
3. The semiconductor temperature control apparatus according to claim 2, wherein the refrigerant cycle device further comprises:
and the outlet of the heat exchange device and the first outlet of the first evaporator are communicated with the inlet of the first compressor and the first connecting port of the expansion container, and the outlet of the first compressor and the second connecting port of the expansion container are communicated with the first inlet of the second evaporator.
4. The semiconductor temperature control device according to claim 3, wherein the second connection port of the expansion vessel is provided with a second electrically controlled valve.
5. The semiconductor temperature control device according to any one of claims 1 to 4, wherein the liquid outlet of the load device is provided with a second temperature sensor.
6. The semiconductor temperature control device according to claim 4, wherein the first inlet of the first evaporator is provided with a third electrically controlled valve, and the first electrically controlled valve, the second electrically controlled valve and the third electrically controlled valve are all electronic expansion valves.
7. The semiconductor temperature control apparatus of any one of claims 1 to 4, wherein the heat exchanging device is integrally formed with the water tank, and the water tank is provided with a level gauge.
8. A semiconductor temperature control method based on the semiconductor temperature control device according to any one of claims 1 to 7, comprising the steps of:
acquiring a temperature value of the liquid inlet of the load equipment;
comparing the temperature value with a preset temperature value;
and if the difference value between the preset temperature value and the temperature value is judged to exceed a preset range, adjusting the opening of the first electric control valve.
9. The method of claim 8, wherein if it is determined that the difference between the preset temperature value and the temperature value exceeds a preset range, adjusting the opening of the first electrically controlled valve comprises:
if the difference value between the preset temperature value and the temperature value is larger than the maximum value of the preset range, controlling the opening of the first electric control valve to increase;
and if the difference value between the preset temperature value and the temperature value is smaller than the minimum value of the preset range, controlling the opening degree of the first electric control valve to be reduced.
10. The semiconductor temperature control method according to claim 8 or 9, wherein the predetermined range is ± 1 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210272638.5A CN114779849B (en) | 2022-03-18 | 2022-03-18 | Semiconductor temperature control equipment and temperature control method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210272638.5A CN114779849B (en) | 2022-03-18 | 2022-03-18 | Semiconductor temperature control equipment and temperature control method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114779849A true CN114779849A (en) | 2022-07-22 |
| CN114779849B CN114779849B (en) | 2023-11-17 |
Family
ID=82426023
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210272638.5A Active CN114779849B (en) | 2022-03-18 | 2022-03-18 | Semiconductor temperature control equipment and temperature control method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114779849B (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20130069025A (en) * | 2011-12-16 | 2013-06-26 | 부경대학교 산학협력단 | A hybrid type cascade refrigeration system |
| US20130220579A1 (en) * | 2012-02-27 | 2013-08-29 | Mr. Lior YOSEF | Efficient temperature forcing of semiconductor devices under test |
| CN103868265A (en) * | 2014-03-03 | 2014-06-18 | 北京自动化技术研究院 | Temperature control device with cold accumulation/heat accumulation function |
| CN211372806U (en) * | 2019-12-24 | 2020-08-28 | 北京京仪自动化装备技术有限公司 | Semiconductor temperature control device system |
| CN112346493A (en) * | 2020-10-29 | 2021-02-09 | 北京京仪自动化装备技术有限公司 | Temperature control equipment and method |
| CN112797656A (en) * | 2021-02-03 | 2021-05-14 | 合肥亦威科技有限公司 | Extremely high extremely low temperature control system |
| CN113419574A (en) * | 2021-06-18 | 2021-09-21 | 北京京仪自动化装备技术股份有限公司 | Low-temperature control equipment for semiconductor |
| CN113654260A (en) * | 2021-08-02 | 2021-11-16 | 北京京仪自动化装备技术股份有限公司 | Double-circulation temperature control equipment and method for cascade refrigeration system |
| JP2022026751A (en) * | 2020-07-31 | 2022-02-10 | 啓旨 谷口 | Temperature control device using multistage refrigeration cycle and temperature control method using the same |
-
2022
- 2022-03-18 CN CN202210272638.5A patent/CN114779849B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20130069025A (en) * | 2011-12-16 | 2013-06-26 | 부경대학교 산학협력단 | A hybrid type cascade refrigeration system |
| US20130220579A1 (en) * | 2012-02-27 | 2013-08-29 | Mr. Lior YOSEF | Efficient temperature forcing of semiconductor devices under test |
| CN103868265A (en) * | 2014-03-03 | 2014-06-18 | 北京自动化技术研究院 | Temperature control device with cold accumulation/heat accumulation function |
| CN211372806U (en) * | 2019-12-24 | 2020-08-28 | 北京京仪自动化装备技术有限公司 | Semiconductor temperature control device system |
| JP2022026751A (en) * | 2020-07-31 | 2022-02-10 | 啓旨 谷口 | Temperature control device using multistage refrigeration cycle and temperature control method using the same |
| CN112346493A (en) * | 2020-10-29 | 2021-02-09 | 北京京仪自动化装备技术有限公司 | Temperature control equipment and method |
| CN112797656A (en) * | 2021-02-03 | 2021-05-14 | 合肥亦威科技有限公司 | Extremely high extremely low temperature control system |
| CN113419574A (en) * | 2021-06-18 | 2021-09-21 | 北京京仪自动化装备技术股份有限公司 | Low-temperature control equipment for semiconductor |
| CN113654260A (en) * | 2021-08-02 | 2021-11-16 | 北京京仪自动化装备技术股份有限公司 | Double-circulation temperature control equipment and method for cascade refrigeration system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114779849B (en) | 2023-11-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN112965546B (en) | Temperature control system and temperature control method for semiconductor temperature control | |
| CN112416029B (en) | Temperature control system and temperature control method for semiconductor production | |
| WO2014113397A1 (en) | Air cooled chiller with heat recovery | |
| CN211372806U (en) | Semiconductor temperature control device system | |
| CN112611140A (en) | Temperature control device and method | |
| CN114396734B (en) | Control method of temperature control system and temperature control system | |
| CN113007926B (en) | Refrigeration system and temperature control method | |
| CN112902484B (en) | Temperature regulation and control system and temperature regulation and control method | |
| CN108131854B (en) | Direct expansion type liquid supply multi-parallel screw low-temperature water chilling unit | |
| CN112594980A (en) | Refrigerating system and temperature control system | |
| CN114779849B (en) | Semiconductor temperature control equipment and temperature control method | |
| CN115167561B (en) | Wide-temperature-range overlapping temperature control system and temperature control method | |
| KR102581931B1 (en) | vapor compression system | |
| CN114740915B (en) | Temperature control equipment capable of realizing double precooling and temperature control method | |
| CN112833576A (en) | Semiconductor temperature control device and control method thereof | |
| CN114779848A (en) | Semiconductor temperature control equipment with precooling function and temperature control method | |
| US7011744B2 (en) | Brine supply unit | |
| CN112856852A (en) | Multichannel constant temperature device and control method thereof | |
| CN211823226U (en) | Industrial oil cooling machine | |
| CN113485485B (en) | Heat recovery type semiconductor temperature control device and semiconductor production equipment | |
| CN114396733A (en) | Control method of temperature control system and temperature control system | |
| CN113154725A (en) | Control method of multi-chamber electronic expansion valve of refrigeration system and refrigeration system | |
| CN220892598U (en) | Water chiller with high temperature control precision | |
| CN115289705B (en) | Temperature control system and temperature control method | |
| CN113433983A (en) | Multi-channel energy-saving semiconductor temperature control device and semiconductor production equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |