CN114744098B - Preparation method of multicolor LED lamp bead and multicolor LED lamp bead - Google Patents
Preparation method of multicolor LED lamp bead and multicolor LED lamp bead Download PDFInfo
- Publication number
- CN114744098B CN114744098B CN202210649508.9A CN202210649508A CN114744098B CN 114744098 B CN114744098 B CN 114744098B CN 202210649508 A CN202210649508 A CN 202210649508A CN 114744098 B CN114744098 B CN 114744098B
- Authority
- CN
- China
- Prior art keywords
- pin
- white light
- led chip
- lamp bead
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000011324 bead Substances 0.000 title claims abstract description 254
- 238000002360 preparation method Methods 0.000 title claims abstract description 16
- 238000004806 packaging method and process Methods 0.000 claims abstract description 50
- 238000003466 welding Methods 0.000 claims abstract description 29
- 239000000178 monomer Substances 0.000 claims abstract description 27
- 230000003287 optical effect Effects 0.000 claims abstract description 17
- 238000000926 separation method Methods 0.000 claims abstract description 14
- 238000010606 normalization Methods 0.000 claims abstract description 12
- 239000000084 colloidal system Substances 0.000 claims description 47
- 239000000758 substrate Substances 0.000 claims description 34
- 239000000843 powder Substances 0.000 claims description 26
- 238000000034 method Methods 0.000 claims description 19
- 239000011248 coating agent Substances 0.000 claims description 17
- 238000000576 coating method Methods 0.000 claims description 17
- 239000000463 material Substances 0.000 claims description 17
- 229910000679 solder Inorganic materials 0.000 claims description 13
- 239000003292 glue Substances 0.000 claims description 10
- 238000001514 detection method Methods 0.000 claims description 8
- 238000005507 spraying Methods 0.000 claims description 8
- 238000005520 cutting process Methods 0.000 claims description 7
- 238000001035 drying Methods 0.000 claims description 6
- 238000012216 screening Methods 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 239000008393 encapsulating agent Substances 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- PLXMOAALOJOTIY-FPTXNFDTSA-N Aesculin Natural products OC[C@@H]1[C@@H](O)[C@H](O)[C@@H](O)[C@H](O)[C@H]1Oc2cc3C=CC(=O)Oc3cc2O PLXMOAALOJOTIY-FPTXNFDTSA-N 0.000 description 3
- 108010043121 Green Fluorescent Proteins Proteins 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005457 optimization Methods 0.000 description 3
- 238000009877 rendering Methods 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 230000001795 light effect Effects 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- MEFBJEMVZONFCJ-UHFFFAOYSA-N molybdate Chemical compound [O-][Mo]([O-])(=O)=O MEFBJEMVZONFCJ-UHFFFAOYSA-N 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
- Y02B20/72—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps in street lighting
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The application provides a preparation method of a multicolor LED lamp bead and the multicolor LED lamp bead; the preparation method comprises the following steps: performing light splitting and color separation treatment on a plurality of white light beads prepared in advance to obtain standard white light beads; the standard white light lamp beads are white light lamp beads with the wavelength within a preset wavelength range and the voltage within a preset voltage range; fixedly welding the light emitting control chip, at least one standard white light bead and at least one colored LED chip on the first support monomer; and packaging the light-emitting control chip, the standard white light lamp bead, the colored LED chip and the first support monomer to obtain the multicolor LED lamp bead. The creative adding self-feedback module of the application adopts the setting of normalization parameters through calculating the difference value of optical parameters, comprehensively considers multiple factors and can accurately control the color and the brightness of the white light emitted by the multicolor LED lamp bead, thereby ensuring the quality consistency of the multicolor LED lamp bead.
Description
Technical Field
The application relates to the technical field of LED lamp beads, in particular to a preparation method of a multicolor LED lamp bead and the multicolor LED lamp bead.
Background
An LED (Light Emitting Diode) is a solid semiconductor device, which uses a solid semiconductor chip as a Light Emitting material, and generates recombination by carriers to release energy to cause photon emission, thereby directly converting electrical energy into optical energy. The LED lamp has the advantages of high brightness, small size, high efficiency, long service life and the like, and is widely applied to the fields of traffic indication, outdoor full-color display and the like.
The existing preparation method of the multi-color-band white light LED lamp bead is that a plurality of colored LED chips are respectively and fixedly welded on a bracket, then fluorescent materials are coated on the surface of at least one blue LED chip to enable the blue LED chip to emit white light, and finally, all the LED chips are sealed to form a multi-color LED lamp bead.
However, because the dosage of the fluorescent material coated on the surface of the LED chip is difficult to accurately control, the color temperature of the white light emitted by different multi-color LED lamp beads prepared by the above method has a large difference (the light emitted by the LED without spectral color separation is pure white, some is slightly blue, some is yellow), which results in low quality consistency of the multi-color LED lamp beads; in addition, the existing multicolor LED lamp beads have errors of different degrees due to factors such as use time, material dosage and the like, so that the light effect cannot be automatically adjusted, and various parameters of light cannot be comprehensively considered for automatic adjustment, so that the light illumination effect is poor; and the position and the connection mode of the LED chips in the existing multicolor LED lamp bead can not realize the optimization of chromaticity coordinates.
Disclosure of Invention
In view of the above, the present application is proposed to provide a method for preparing a multi-color LED lamp bead and a multi-color LED lamp bead, which overcome or at least partially solve the above problems, including:
a preparation method of a multicolor LED lamp bead comprises the following steps:
performing light splitting and color separation treatment on a plurality of white light beads prepared in advance to obtain standard white light beads; the standard white light lamp beads are white light lamp beads with the wavelength within a preset wavelength range and the voltage within a preset voltage range;
fixedly welding the light-emitting control chip, at least one standard white light bead and at least one color LED chip on the first support monomer; the color LED chip comprises one or more of a red LED chip, a blue LED chip and a green LED chip;
packaging the light-emitting control chip, the standard white light lamp beads, the colored LED chip and the first support monomer by using a packaging colloid to obtain multi-color LED lamp beads;
the multi-color LED lamp bead further comprises a self-feedback module, wherein the self-feedback module acquires the wavelength parameter of the spectrophotometer and the tristimulus value of the photometer in real time so as to acquire chromaticity coordinates, the color temperature parameter of the color temperature meter, the RGB parameter of the light source, and the RGB parameter of the image acquired by the camera; calculating an optical parameter difference value K; adjusting input parameters of the color LED chip according to the optical parameter difference value K; circularly calculating the optical parameter difference value K until the optical parameter difference value K is smaller than a set threshold value, and terminating the calculation;
wherein, the optical parameter difference value K is calculated as follows:
wherein x represents a wavelength parameter obtained by a spectrophotometer, x1 represents a wavelength standard target value, alpha represents a wavelength normalization parameter, y represents a color temperature parameter obtained by a color temperature meter, y1 represents a color temperature standard target value, beta represents a color temperature normalization parameter, z-z1 represents the distance between a current chromaticity coordinate z and a standard target chromaticity coordinate z1, gamma represents a chromaticity coordinate distance normalization parameter, and R, G, B respectively represents an R value, a G value and a B value of an image obtained by a camera; r1, G1, B1 respectively represent target standard values of R, G, B.
Preferably, the step of performing light splitting and color separation on a plurality of white light beads prepared in advance to obtain a standard white light bead includes:
detecting the wavelength and the voltage of the white light beads through a light splitter;
and screening out the white light beads with the wavelengths in the preset wavelength range and the voltages in the preset voltage range from the plurality of white light beads according to the detection result to obtain the standard white light beads.
Preferably, the step of packaging the light-emitting control chip, the standard white light bead, the color LED chip and the first bracket monomer by using a packaging colloid to obtain a multicolor LED bead comprises:
coating the packaging colloid on the surfaces of the light-emitting control chip, the standard white light lamp bead and the color LED chip;
and drying the packaging colloid coated on the surfaces of the luminous control chip, the standard white light lamp beads and the colored LED chip to obtain the multicolor LED lamp beads.
Preferably, polychrome LED lamp pearl still includes bluetooth module, bluetooth module with the light-emitting control chip is connected, bluetooth module with from feedback module connects.
Preferably, the method further comprises the following steps:
fixedly welding a plurality of LED chips to be processed on the second support;
respectively coating fluorescent materials on the surfaces of the LED chips to be processed;
and after the fluorescent material is cured, cutting the second support positioned between the adjacent LED chips to be processed along the arrangement direction of the plurality of LED chips to be processed to obtain a plurality of white light lamp beads.
Preferably, the step of coating the surfaces of the plurality of LED chips to be processed with the fluorescent material includes:
respectively spraying fluorescent powder on the surfaces of the LED chips to be processed;
or;
respectively spot-coating fluorescent glue on the surfaces of the LED chips to be processed; the fluorescent glue comprises epoxy resin and fluorescent powder.
A multi-color LED lamp bead prepared by the preparation method comprises the following steps: the first support monomer, the light emitting control chip, the standard white light bead, the color LED chip and the packaging colloid layer; the light emitting control chip, the standard white light lamp bead and the color LED chip are fixedly welded on the surface of the first support monomer respectively; the packaging colloid layer is coated outside the light-emitting control chip, the standard white light lamp bead and the color LED chip and is adhered to the surface of the first support monomer.
Preferably, the first support unit comprises a substrate unit, a pin assembly arranged on one side of the substrate unit and a solder tail assembly arranged on the other side of the substrate unit; the light emitting control chip, the standard white light lamp bead and the color LED chip are respectively fixed on the surface of the pin component; the light emitting control chip, the standard white light lamp bead and the color LED chip are respectively electrically connected with the pin assembly; the pin assembly is electrically connected with the solder leg assembly through a via hole arranged in the package substrate.
Preferably, the pin assembly comprises a power pin, a grounding pin, an input pin, an output pin and a lamp bead pin; the light-emitting control chip is fixed on the surface of the power supply pin; the color LED chip is fixed on the surface of the grounding pin; the standard white light lamp bead is fixed on the surface between the grounding pin and the lamp bead pin; the light emitting control chip is electrically connected with the output pin, the lamp bead pin, the color LED chip, the grounding pin, the input pin and the power supply pin respectively; the standard white light lamp bead is electrically connected with the grounding pin and the lamp bead pin respectively; the color LED chip is electrically connected with the grounding pin; the power pin, the grounding pin, the input pin and the output pin are electrically connected with the soldering leg assembly through via holes arranged in the packaging substrate respectively.
Preferably, the solder tail assembly comprises a power supply solder tail, a grounding solder tail, an input solder tail and an output solder tail; the power supply pins are electrically connected with the power supply welding pins through via holes arranged in the package substrate; the grounding pin is electrically connected with the grounding welding foot through a through hole arranged in the packaging substrate; the input pins are electrically connected with the input welding pins through via holes arranged in the package substrate; the output pins are electrically connected with the output welding pins through via holes arranged in the packaging substrate.
Preferably, the color LED chip includes a red LED chip, a blue LED chip, and a green LED chip; the cathode of the green LED chip is electrically connected with the grounding pin; the cathode of the blue LED chip is electrically connected with the grounding pin; the light-emitting control chip comprises a chip substrate, and a first pin, a second pin, a third pin, a fourth pin, a fifth pin, a sixth pin, a seventh pin, an eighth pin, a ninth pin, a tenth pin, an eleventh pin and a twelfth pin which are arranged on the chip substrate; the first pin is electrically connected with the output pin; the second pin is electrically connected with the lamp bead pin; the third pin is electrically connected with the cathode of the red LED chip; the fourth pin is electrically connected with the positive electrode of the green LED chip; the fifth pin is electrically connected with the anode of the blue LED chip; the sixth pin is electrically connected with the grounding pin; the seventh pin is electrically connected with the input pin; the seventh pin is electrically connected to the power pin.
The application has the following advantages:
in the embodiment of the application, a plurality of white light beads prepared in advance are subjected to light splitting and color separation treatment to obtain standard white light beads; the standard white light lamp beads are white light lamp beads with the wavelength within a preset wavelength range and the voltage within a preset voltage range; fixedly welding the light-emitting control chip, at least one standard white light bead and at least one color LED chip on the first support monomer; the color LED chip comprises one or more of a red LED chip, a blue LED chip and a green LED chip; packaging the light-emitting control chip, the standard white light lamp bead, the color LED chip and the first support monomer by using a packaging colloid to obtain a multicolor LED lamp bead, and accurately controlling the color and brightness of white light emitted by the multicolor LED lamp bead so as to ensure the quality consistency of the multicolor LED lamp bead; the self-feedback module is creatively added, the setting of normalization parameters is adopted by calculating the difference value of the light parameters and comprehensively considering the color temperature, the chromaticity coordinate, the RGB parameters and the wavelength parameters, so that the accurate control and self-regulation of light are realized, and the self-regulation of light can be automatically realized in real time to achieve the target effect; the standard white light lamp beads are fixed on the surface between the grounding pin and the lamp bead pins, so that the optimization of chromaticity coordinates can be greatly enhanced.
Drawings
In order to more clearly illustrate the technical solutions of the present application, the drawings needed to be used in the description of the present application will be briefly introduced below, and it is apparent that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive labor.
Fig. 1 is a flowchart illustrating steps of a method for manufacturing a multi-color LED lamp bead according to an embodiment of the present disclosure;
fig. 2 is a flowchart illustrating steps of a method for manufacturing a multi-color LED lamp bead according to another embodiment of the present disclosure;
fig. 3 is a schematic front structure view of a multi-color LED lamp bead provided in an embodiment of the present application;
fig. 4 is a schematic diagram of a back surface structure of a multicolor LED lamp bead provided in an embodiment of the present application.
The reference numbers in the drawings of the specification are as follows:
10. a first bracket unit; 110. a substrate monomer; 11. a power supply pin; 12. a ground pin; 13. inputting a pin; 14. an output pin; 15. a lamp bead pin; 16. a power supply leg; 17. a grounding leg; 18. inputting a welding leg; 19. outputting a welding leg; 20. a light emission control chip; 30. a standard white light bead; 40. a color LED chip; 41. a red LED chip; 42. a blue LED chip; 43. and a green LED chip.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, the present application is described in further detail with reference to the accompanying drawings and the detailed description. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1, a method for preparing a multi-color LED lamp bead provided by an embodiment of the present application is shown, including:
s110, performing light splitting and color separation treatment on a plurality of white light beads prepared in advance to obtain standard white light beads 30; the standard white light bead 30 is a white light bead with a wavelength within a preset wavelength range and a voltage within a preset voltage range;
s120, fixedly welding the light-emitting control chip 20, the at least one standard white light bead 30 and the at least one color LED chip 40 on the first support single body 10; the color LED chip 40 includes one or more of a red LED chip 41, a blue LED chip 42, and a green LED chip 43;
s130, packaging the light-emitting control chip 20, the standard white light lamp bead 30, the colored LED chip 40 and the first support monomer 10 by adopting a packaging colloid to obtain a multi-color LED lamp bead; the multi-color LED lamp bead further comprises a self-feedback module, wherein the self-feedback module acquires the wavelength parameter of the spectrophotometer and the tristimulus value of the photometer in real time so as to acquire chromaticity coordinates, the color temperature parameter of the color temperature meter, the RGB parameter of the light source, and the RGB parameter of the image acquired by the camera; calculating an optical parameter difference value K; adjusting the input parameters of the color LED chip 40 according to the optical parameter difference value K; circularly calculating the optical parameter difference value K until the optical parameter difference value K is smaller than a set threshold value, and stopping calculation;
wherein, the optical parameter difference value K is calculated as follows:
wherein x represents a wavelength parameter obtained by a spectrophotometer, x1 represents a wavelength standard target value, alpha represents a wavelength normalization parameter, y represents a color temperature parameter obtained by a color temperature meter, y1 represents a color temperature standard target value, beta represents a color temperature normalization parameter, z-z1 represents the distance between a current chromaticity coordinate z and a standard target chromaticity coordinate z1, gamma represents a chromaticity coordinate distance normalization parameter, and R, G, B respectively represents an R value, a G value and a B value of an image obtained by a camera; r1, G1, B1 respectively represent target standard values of R, G, B.
As in the process of obtaining white light, the following is used:
the dominant wavelength of light emitted by three LED chips is generally: the red light is 615-620 nm, the green light is 530-540 nm, and the blue light is 460-470 nm. To achieve the best luminous efficiency, the best dominant frequency ratio can be selected through experiments in the dominant frequency range of the three lights. If in order to improve the color rendering index, the combination of blue light (460 nm), green light (525 nm), yellow light (580 nm) and red light (635 nm) can be adopted, the optimal color rendering index (more than 95) can be obtained by the dominant frequency proportion of the light, in some embodiments, the recent white light effect is realized by inputting set wavelengths, the light efficiency can reach 35-40 lm/W, and the lowest color temperature can reach 2700K. In order to take account of the light emitting efficiency and the color rendering index, the dominant frequency and the luminous intensity of the light emitted by the three LED chips need to be optimally combined.
Next, a method for manufacturing a multi-color LED lamp bead in the present exemplary embodiment will be further described.
In step S110, a plurality of white light beads prepared in advance are subjected to light splitting and color separation to obtain a standard white light bead 30.
Detecting the light-emitting wavelength and the working voltage of the plurality of white light beads through a light splitter; and screening the white light beads with the wavelength of 450-460nm and the voltage of 2.8-3.6V from the plurality of white light beads according to the detection result to obtain the standard white light bead 30.
As stated in step S120, the light-emitting control chip 20, the at least one standard white light bead 30, and the at least one color LED chip 40 are fixedly soldered on the first bracket unit 10.
Fixing the light emitting control chip 20, the standard white light bead 30 and the color LED chip 40 at corresponding positions of the first bracket unit 10 respectively; wherein, the standard white light bead 30 is a white light bead with a wavelength of 450-460nm and a voltage of 2.8-3.6V; the color LED chip 40 includes one or more of a red LED chip 41, a blue LED chip 42, and a green LED chip 43; the wavelength of the red LED chip 41 is 615-630nm, and the voltage is 2.8-3.6V; the wavelength of the blue LED chip 42 is 460-470nm, and the voltage is 2.8-3.6V; the wavelength of the green LED chip 43 is 520-540nm, and the voltage is 2.8-3.6V; and electrically connecting each part through a bonding wire or silver adhesive to form a lamp bead prefabricated part.
In the step S130, the light-emitting control chip 20, the standard white light bead 30, the color LED chip 40, and the first bracket unit 10 are encapsulated by using an encapsulant to obtain a multi-color LED bead.
As an example, the lamp bead prefabricated member is placed inside a fence; the fence is a prefabricated packaging mold with the shape matched with the lamp bead prefabricated part, when the lamp bead prefabricated part is placed inside the fence, the inner wall of the fence is attached to the edge of the lamp bead prefabricated part, and the top of the fence is higher than the top of the lamp bead prefabricated part; paving the packaging colloid in a fluid state on the surface of the lamp bead prefabricated member through a dispenser; the packaging colloid can be transparent colloid or fog colloid; the packaging colloid can be fully filled in the side edges and the tops of the light-emitting control chip 20, the standard white light beads 30 and the colored LED chips 40 after being flattened.
The messenger the lamp pearl prefab tiling has the one side of encapsulation colloid faces up, will the rail the lamp pearl prefab with the overall structure that the encapsulation colloid constitutes is placed and is toasted the processing in the roaster, until the encapsulation colloid is in lamp pearl prefab surface solidification forms encapsulation colloid layer, takes off the rail obtains polychrome LED lamp pearl.
The packaging colloid layer is fully coated on the light-emitting control chip 20, the standard white light lamp bead 30 and the color LED chip 40, and is stably connected with the first support monomer 10, so that the sealing performance of the multicolor LED lamp bead can be effectively improved, and the multicolor LED lamp bead is prevented from being damped.
It should be noted that, in the above example, a fence dispensing packaging mode is adopted, and in other examples, the bead preforms may be packaged in a mold by placing the bead preforms into a mold and adding a rubber cake.
In this embodiment, the step of performing light splitting and color separation on a plurality of white light beads prepared in advance to obtain the standard white light bead 30 includes:
detecting the wavelength and the voltage of the white light beads through a light splitter;
and screening the white light beads with the wavelengths within the preset wavelength range and the voltages within the preset voltage range from the plurality of white light beads according to the detection result to obtain the standard white light beads 30.
Specifically, firstly, voltage detection is carried out on the plurality of white light beads through the light splitter, and the white light beads with the voltage within the preset voltage range are screened out from the plurality of white light beads according to the voltage detection result to obtain alternative white light beads; and then, performing wavelength detection on the alternative white light beads through the light splitter, and screening the alternative white light beads with the wavelength within the preset wavelength range from the alternative white light beads according to a wavelength detection result to obtain the standard white light bead 30.
In this embodiment, the step of encapsulating the light emission control chip 20, the standard white light bead 30, the color LED chip 40, and the first support unit 10 with an encapsulant to obtain a multicolor LED bead includes:
coating the packaging colloid on the surfaces of the light-emitting control chip 20, the standard white light bead 30 and the color LED chip 40; specifically, the first bracket unit 10 fixedly welded with the light emission control chip 20, the standard white light bead 30 and the color LED chip 40 is placed inside a fence; wherein the top of the fence is higher than the top of the standard white light bead 30 and the color LED chip 40; the packaging colloid is flatly paved on the tops of the light-emitting control chip 20, the standard white light bead 30 and the color LED chip 40 in the fence through a dispenser;
and drying the packaging colloid coated on the surfaces of the light-emitting control chip 20, the standard white light lamp bead 30 and the color LED chip 40 to obtain the multicolor LED lamp bead. Specifically, the packaging colloid coated on the surfaces of the light emission control chip 20, the standard white light bead 30 and the color LED chip 40 is baked for 5-6 hours at the temperature of 130-150 ℃, so that the packaging colloid is cured to form a packaging colloid layer, and the multicolor LED bead is obtained.
In this embodiment, polychrome LED lamp pearl still includes bluetooth module, bluetooth module with light control chip 20 is connected, bluetooth module with from feedback module connects. Specifically, the bluetooth module may be fixedly soldered on the first support unit 10 together with the light emission control chip 20 in step S120, and encapsulated inside the encapsulation colloid in step S130; the bluetooth module obtains the input parameters of the self-feedback module in real time and sends the input parameters to the light-emitting control chip 20, and the light-emitting control chip controls the color LED chips 40 to emit light according to the input parameters.
Referring to fig. 2, in another embodiment of the present application, the preparation method further includes:
s010, fixedly welding a plurality of LED chips to be processed on a second support;
s020, respectively coating fluorescent materials on the surfaces of the LED chips to be processed;
and S030, after the fluorescent material is cured, cutting the second support positioned between the adjacent LED chips to be processed along the arrangement direction of the plurality of LED chips to be processed to obtain a plurality of white light lamp beads.
And step S010, fixedly welding a plurality of LED chips to be processed on the second bracket.
Fixing a plurality of LED chips to be processed on corresponding positions of the second bracket in an array arrangement mode; wherein, the LED chip to be processed is a blue LED chip with the wavelength of 460-470nm and the voltage of 2.8-3.6V; and electrically connecting each component through a bonding wire or silver colloid to form a lamp bead module prefabricated part.
As stated in step S020, fluorescent materials are coated on the surfaces of the LED chips to be processed, respectively.
Respectively spraying fluorescent powder on the surfaces of the LED chips to be processed, or respectively point-coating fluorescent glue formed by mixing epoxy resin and the fluorescent powder on the surfaces of the LED chips to be processed; the fluorescent powder is formed by mixing red fluorescent powder and green fluorescent powder; the red fluorescent powder is one or more of nitrogen/oxide fluorescent powder, tungsten/molybdate fluorescent powder and sulfide fluorescent powder; the green fluorescent powder is one or more of silicate fluorescent powder, nitrogen/oxide fluorescent powder and sulfide fluorescent powder. After the fluorescent material is coated on the surface of the LED chip to be processed, the blue light emitted by the LED chip to be processed, the red light emitted by the red fluorescent powder and the green light emitted by the green fluorescent powder can be mixed to form white light.
In step S030, after the fluorescent material is cured, the second support located between the adjacent LED chips to be processed is cut along the arrangement direction of the LED chips to be processed, so as to obtain a plurality of white light beads.
After the fluorescent material is solidified, cutting the second support located between the adjacent LED chips to be processed to penetrate through the bottom of the second support along the arrangement direction of the LED chips to be processed, and obtaining a plurality of white light lamp beads.
In this embodiment, the step of coating the surfaces of the LED chips to be processed with the fluorescent material includes:
respectively spraying fluorescent powder on the surfaces of the LED chips to be processed;
or; respectively coating fluorescent glue on the surfaces of the LED chips to be processed; the fluorescent glue comprises epoxy resin and fluorescent powder.
Specifically, spraying the atomized fluorescent powder on the surfaces of a plurality of LED chips to be processed through a spraying machine; or; and dispensing the fluorescent glue in a fluid state to the surfaces of the LED chips to be processed through a dispenser.
It should be noted that, in the above embodiment, the standard white light bead 30 and the color LED chip 40 are packaged by using a built-in driver IC (Integrated Circuit), and in the practical application process, the multicolor LED bead is only required to be welded to a power supply wire, a ground wire and a signal wire. In other embodiments, the standard white light bead 30 and the color LED chip 40 may be packaged by using an external driver IC, that is, the light emitting control chip 20 is disposed outside the first single support 10, the standard white light bead 30 and the color LED chip 40 are fixedly welded to the first single support 10, a package colloid is packaged on the surfaces of the standard white light bead 30 and the color LED chip 40, and the standard white light bead 30 and the color LED chip 40 are respectively connected to the external light emitting control chip 20 through a power supply lead, a ground lead and a signal lead.
In a specific implementation, the preparation method of the multicolor LED lamp bead comprises the following steps:
fixedly welding 300 LED chips to be processed on a second bracket in a 20 multiplied by 15 array arrangement mode; respectively coating fluorescent glue on the surface of each LED chip to be processed; after the fluorescent glue is cured, cutting the second support positioned between the adjacent LED chips to be processed along the arrangement direction of the LED chips to be processed to obtain 300 white light lamp beads; performing light splitting and color separation treatment on all the white light beads to obtain 220 standard white light beads 30 with the wavelength of 450-460nm and the voltage of 2.8-3.6V; fixedly welding a light-emitting control chip 20, a standard white light bead 30 and a red LED chip 41 on a first bracket single body 10; coating packaging colloid on the surfaces of the light-emitting control chip 20, the standard white light bead 30 and the red LED chip 41; and drying the packaging colloid coated on the surfaces of the light-emitting control chip 20, the standard white light lamp bead 30 and the red LED chip 41 to obtain the multicolor LED lamp bead.
In another specific implementation, the preparation method of the multicolor LED lamp bead comprises the following steps: fixedly welding 400 LED chips to be processed on a second bracket in a 20 multiplied by 20 array arrangement mode; respectively spraying fluorescent powder on the surface of each LED chip to be processed; after the fluorescent powder is solidified, cutting the second support positioned between the adjacent LED chips to be processed along the arrangement direction of the LED chips to be processed to obtain 400 white light lamp beads; performing light splitting and color separation on all the white light beads to obtain 360 standard white light beads 30 with the wavelength of 450-460nm and the voltage of 2.8-3.6V; fixedly welding a light-emitting control chip 20, a standard white light bead 30, a red LED chip 41 and a green LED chip 43 on the first bracket single body 10; coating packaging colloid on the surfaces of the light-emitting control chip 20, the standard white light bead 30, the red LED chip 41 and the green LED chip 43; and drying the packaging colloid coated on the surfaces of the luminous control chip 20, the standard white light lamp bead 30, the red LED chip 41 and the green LED chip 43 to obtain the multicolor LED lamp bead.
In another specific implementation, the preparation method of the multicolor LED lamp bead comprises the following steps: fixedly welding 225 LED chips to be processed on a second bracket in an array arrangement mode of 15 multiplied by 15; respectively spraying fluorescent powder on the surface of each LED chip to be processed; after the fluorescent powder is solidified, cutting the second support positioned between the adjacent LED chips to be processed along the arrangement direction of the LED chips to be processed to obtain 225 white light lamp beads; performing light splitting and color separation on all the white light beads to obtain 198 standard white light beads 30 with the wavelength of 450-460nm and the voltage of 2.8-3.6V; fixedly welding a light-emitting control chip 20, a standard white light bead 30, a red LED chip 41, a green LED chip 43 and a blue LED chip 42 on the first support single body 10; coating packaging colloid on the surfaces of the light-emitting control chip 20, the standard white light bead 30, the red LED chip 41, the green LED chip 43 and the blue LED chip 42; and drying the packaging colloid coated on the surfaces of the light-emitting control chip 20, the standard white light lamp bead 30, the red LED chip 41, the green LED chip 43 and the blue LED chip 42 to obtain the multicolor LED lamp bead.
Referring to fig. 3 to 4, in an embodiment of the present application, there is further provided a multi-color LED lamp bead prepared by the preparation method according to any one of the above embodiments, including: the first bracket single body 10, the light emitting control chip 20, the standard white light bead 30, the color LED chip 40 and the packaging colloid layer; the light emitting control chip 20, the standard white light bead 30 and the color LED chip 40 are respectively fixedly welded on the surface of the first support unit 10; the packaging colloid layer is coated outside the light-emitting control chip 20, the standard white light bead 30 and the color LED chip 40 and is adhered to the surface of the first bracket single body 10.
It should be noted that the color and brightness of the white light emitted by the multicolor LED lamp beads are uniform, and the quality consistency of the multicolor LED lamp beads is high.
In this embodiment, the first single support 10 includes a single substrate 110, a pin assembly disposed on one side of the single substrate 110, and a solder tail assembly disposed on the other side of the single substrate 110; the light-emitting control chip 20, the standard white light bead 30 and the color LED chip 40 are respectively fixed on the surface of the pin component; the light-emitting control chip 20, the standard white light bead 30 and the color LED chip 40 are electrically connected with the pin assembly respectively; the pin assembly is electrically connected with the solder leg assembly through a via hole arranged in the package substrate.
In this embodiment, the pin assembly includes a power pin 11, a ground pin 12, an input pin 13, an output pin 14, and a lamp bead pin 15; the light emitting control chip 20 is fixed on the surface of the power supply pin 11; the color LED chip 40 is fixed on the surface of the grounding pin 12; the standard white light lamp bead 30 is fixed on the surfaces of the grounding pin 12 and the lamp bead pin 15; the light emitting control chip 20 is electrically connected to the output pin 14, the lamp bead pin 15, the color LED chip 40, the ground pin 12, the input pin 13 and the power pin 11 respectively; the standard white light lamp bead 30 is electrically connected with the grounding pin 12 and the lamp bead pin 15 respectively; the color LED chip 40 is electrically connected with the grounding pin 12; the power pin 11, the ground pin 12, the input pin 13, and the output pin 14 are electrically connected to the solder tail assembly through via holes formed in the package substrate.
In this embodiment, the leg assembly includes a power leg 16, a ground leg 17, an input leg 18, and an output leg 19; the power supply pin 11 is electrically connected with the power supply welding foot 16 through a through hole arranged in the package substrate; the grounding pin 12 is electrically connected with the grounding welding foot 17 through a via hole arranged in the package substrate; the input pins 13 are electrically connected with the input solder tails 18 through via holes arranged inside the package substrate; the output pins 14 are electrically connected to the output solder tails 19 through via holes provided in the package substrate.
In this embodiment, the color LED chips 40 include a red LED chip 41, a blue LED chip 42, and a green LED chip 43; the cathode of the green LED chip 43 is electrically connected to the ground pin 12; the cathode of the blue LED chip 42 is electrically connected with the grounding pin 12; the light emitting control chip 20 includes a chip substrate, and a first pin, a second pin, a third pin, a fourth pin, a fifth pin, a sixth pin, a seventh pin, an eighth pin, a ninth pin, a tenth pin, an eleventh pin, and a twelfth pin disposed on the chip substrate; the first pin is electrically connected with the output pin 14; the second pin is electrically connected with the lamp bead pin 15; the third pin is electrically connected with the cathode of the red LED chip 41; the fourth pin is electrically connected to the positive electrode of the green LED chip 43; the fifth pin is electrically connected to the positive electrode of the blue LED chip 42; the sixth pin is electrically connected with the grounding pin 12; the seventh pin is electrically connected with the input pin 13; the seventh pin is electrically connected to the power supply pin 11.
In a specific implementation, the multi-color LED lamp bead includes the first single support 10, the light emitting control chip 20, the standard white light lamp bead 30, the red LED chip 41, and a packaging colloid layer; the standard white light bead 30 is a white light bead with the voltage of 2.8-3.6V and the wavelength of 450-460 nm; the light emitting control chip 20, the standard white light bead 30 and the red LED chip 41 are respectively fixedly welded on the surface of the first bracket body 10; the packaging colloid layer is coated outside the light emitting control chip 20, the standard white light bead 30 and the red LED chip 41, and is adhered to the surface of the first bracket unit 10.
In another specific implementation, the multi-color LED lamp bead includes the first bracket monomer 10, the light emitting control chip 20, the standard white light lamp bead 30, the red LED chip 41, the green LED chip 43, and a packaging colloid layer; the standard white light bead 30 is a white light bead with the voltage of 2.8-3.6V and the voltage of 450-460 nm; the light emitting control chip 20, the standard white light bead 30, the red LED chip 41, and the green LED chip 43 are respectively fixedly welded on the surface of the first bracket unit 10; the packaging colloid layer is coated outside the light emitting control chip 20, the standard white light bead 30, the red LED chip 41 and the green LED chip 43, and is adhered to the surface of the first support unit 10.
In another specific implementation, the multi-color LED lamp bead includes the first bracket monomer 10, the light emission control chip 20, the standard white light lamp bead 30, the red LED chip 41, the green LED chip 43, the blue LED chip 42, and a packaging colloid layer; the standard white light bead 30 is a white light bead with the voltage of 2.8-3.6V and the voltage of 450-460 nm; the light emitting control chip 20, the standard white light bead 30, the red LED chip 41, the green LED chip 43, and the blue LED chip 42 are respectively fixedly welded on the surface of the first support unit 10; the packaging colloid layer is coated outside the light emitting control chip 20, the standard white light bead 30, the red LED chip 41, the green LED chip 43 and the blue LED chip 42, and is adhered to the surface of the first single support 10.
In the embodiment of the application, a plurality of white light beads prepared in advance are subjected to light splitting and color separation treatment to obtain standard white light beads; the standard white light lamp beads are white light lamp beads with the wavelength within a preset wavelength range and the voltage within a preset voltage range; fixedly welding the light emitting control chip, at least one standard white light bead and at least one colored LED chip on the first support monomer; the color LED chip comprises one or more of a red LED chip, a blue LED chip and a green LED chip; packaging the light-emitting control chip, the standard white light bead, the color LED chip and the first support monomer by using a packaging colloid to obtain a multicolor LED bead, and accurately controlling the color and brightness of white light emitted by the multicolor LED bead so as to ensure the quality consistency of the multicolor LED bead; the self-feedback module is creatively added, the self-regulation of the light can be automatically realized in real time to achieve the target effect, and in the self-feedback module, the color temperature, the chromaticity coordinate, the RGB parameter and the wavelength parameter are comprehensively considered by calculating the difference value of the light parameter, so that the accurate control and the self-regulation of the light are realized; the standard white light bead is fixed between the grounding pin and the bead pin, so that the optimization of chromaticity coordinates can be greatly enhanced.
While preferred embodiments of the present application have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including the preferred embodiment and all such alterations and modifications as fall within the true scope of the embodiments of the application.
Finally, it should also be noted that, in this document, relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or terminal that comprises the element.
The preparation method of the multicolor LED lamp bead and the multicolor LED lamp bead provided by the application are introduced in detail, specific examples are applied in the text to explain the principle and the implementation mode of the application, and the description of the above examples is only used for helping to understand the method and the core idea of the application; meanwhile, for a person skilled in the art, according to the idea of the present application, the specific implementation manner and the application scope may be changed, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. The preparation method of the multicolor LED lamp bead is characterized by comprising the following steps:
performing light splitting and color separation treatment on a plurality of white light beads prepared in advance to obtain standard white light beads; the standard white light lamp beads are white light lamp beads with the wavelength within a preset wavelength range and the voltage within a preset voltage range;
fixedly welding the light emitting control chip, at least one standard white light bead and at least one colored LED chip on the first support monomer; the color LED chip comprises one or more of a red LED chip, a blue LED chip and a green LED chip;
packaging the light-emitting control chip, the standard white light lamp beads, the colored LED chip and the first support monomer by using a packaging colloid to obtain multi-color LED lamp beads;
the multicolor LED lamp bead further comprises a self-feedback module, wherein the self-feedback module acquires the wavelength parameter of a spectrophotometer and the tristimulus value of the photometer in real time so as to acquire chromaticity coordinates, the color temperature parameter of a color temperature meter, the RGB parameter of a light source, and the RGB parameter of an image acquired by a camera; calculating an optical parameter difference value K; adjusting the input parameters of the color LED chip according to the optical parameter difference value K; circularly calculating the optical parameter difference value K until the optical parameter difference value K is smaller than a set threshold value, and terminating the calculation;
wherein, the optical parameter difference value K is calculated as follows:
wherein x represents a wavelength parameter obtained by a spectrophotometer, x1 represents a wavelength standard target value, alpha represents a wavelength normalization parameter, y represents a color temperature parameter obtained by a color temperature meter, y1 represents a color temperature standard target value, beta represents a color temperature normalization parameter, z-z1 represents the distance between a current chromaticity coordinate z and a standard target chromaticity coordinate z1, gamma represents a chromaticity coordinate distance normalization parameter, and R, G, B respectively represents an R value, a G value and a B value of an image obtained by a camera; r1, G1, B1 respectively represent target standard values of R, G, B; δ represents the RGB normalization parameter.
2. The method according to claim 1, wherein the step of performing light splitting and color separation on a plurality of pre-prepared white light beads to obtain a standard white light bead comprises:
detecting the wavelength and the voltage of the white light beads through a light splitter;
and screening the white light beads with the wavelengths within the preset wavelength range and the voltages within the preset voltage range from the plurality of white light beads according to the detection result to obtain the standard white light beads.
3. The method according to claim 1, wherein the step of encapsulating the light emission control chip, the standard white light bead, the color LED chip, and the first support monomer with an encapsulant to obtain a multi-color LED bead comprises:
coating the packaging colloid on the surfaces of the light-emitting control chip, the standard white light lamp bead and the color LED chip;
and drying the packaging colloid coated on the surfaces of the light-emitting control chip, the standard white light lamp bead and the color LED chip to obtain the multicolor LED lamp bead.
4. The method of claim 1, further comprising:
fixedly welding a plurality of LED chips to be processed on the second support;
respectively coating fluorescent materials on the surfaces of the LED chips to be processed;
and after the fluorescent material is cured, cutting the second support positioned between the adjacent LED chips to be processed along the arrangement direction of the LED chips to be processed to obtain a plurality of white light lamp beads.
5. The manufacturing method according to claim 4, wherein the step of coating the surfaces of the LED chips to be processed with the fluorescent material respectively comprises:
respectively spraying fluorescent powder on the surfaces of the LED chips to be processed;
or;
respectively coating fluorescent glue on the surfaces of the LED chips to be processed; the fluorescent glue comprises epoxy resin and fluorescent powder.
6. The multi-color LED lamp bead prepared by the preparation method according to any one of claims 1 to 5, which is characterized by comprising the following steps: the first support monomer, the light emitting control chip, the standard white light bead, the color LED chip and the packaging colloid layer; the light emitting control chip, the standard white light lamp bead and the color LED chip are fixedly welded on the surface of the first support monomer respectively; the packaging colloid layer is coated outside the light-emitting control chip, the standard white light bead and the color LED chip and is adhered to the surface of the first support monomer.
7. The multi-color LED lamp bead according to claim 6, wherein the first bracket unit comprises a substrate unit, a pin assembly disposed on one side of the substrate unit, and a leg assembly disposed on the other side of the substrate unit; the light emitting control chip, the standard white light lamp bead and the color LED chip are respectively fixed on the surface of the pin component; the light-emitting control chip, the standard white light bead and the color LED chip are electrically connected with the pin component respectively; the pin assembly is electrically connected with the solder leg assembly through a via hole arranged in the substrate monomer.
8. The multi-color LED lamp bead according to claim 7, wherein said pin assembly includes a power pin, a ground pin, an input pin, an output pin, and a lamp bead pin; the light-emitting control chip is fixed on the surface of the power supply pin; the color LED chip is fixed on the surface of the grounding pin; the standard white light lamp bead is fixed on the surface between the grounding pin and the lamp bead pin; the light emitting control chip is electrically connected with the output pin, the lamp bead pin, the color LED chip, the grounding pin, the input pin and the power supply pin respectively; the standard white light lamp bead is electrically connected with the grounding pin and the lamp bead pin respectively; the color LED chip is electrically connected with the grounding pin; the power supply pin, the grounding pin, the input pin and the output pin are electrically connected with the welding pin assembly through via holes arranged in the substrate monomer respectively.
9. The multi-color LED lamp bead according to claim 8, wherein said leg assembly includes a power leg, a ground leg, an input leg and an output leg; the power supply pins are electrically connected with the power supply welding pins through via holes arranged in the substrate single body; the grounding pin is electrically connected with the grounding welding foot through a via hole arranged in the substrate monomer; the input pins are electrically connected with the input welding pins through via holes arranged in the substrate single body; the output pins are electrically connected with the output welding feet through via holes arranged in the substrate monomer.
10. The multi-color LED lamp bead according to claim 8, wherein the color LED chips comprise a red LED chip, a blue LED chip and a green LED chip; the cathode of the green LED chip is electrically connected with the grounding pin; the cathode of the blue LED chip is electrically connected with the grounding pin; the light-emitting control chip comprises a chip substrate, and a first pin, a second pin, a third pin, a fourth pin, a fifth pin, a sixth pin, a seventh pin, an eighth pin, a ninth pin, a tenth pin, an eleventh pin and a twelfth pin which are arranged on the chip substrate; the first pin is electrically connected with the output pin; the second pin is electrically connected with the lamp bead pin; the third pin is electrically connected with the cathode of the red LED chip; the fourth pin is electrically connected with the anode of the green LED chip; the fifth pin is electrically connected with the anode of the blue LED chip; the sixth pin is electrically connected with the grounding pin; the seventh pin is electrically connected with the input pin; the seventh pin is electrically connected to the power pin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210649508.9A CN114744098B (en) | 2022-06-10 | 2022-06-10 | Preparation method of multicolor LED lamp bead and multicolor LED lamp bead |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210649508.9A CN114744098B (en) | 2022-06-10 | 2022-06-10 | Preparation method of multicolor LED lamp bead and multicolor LED lamp bead |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114744098A CN114744098A (en) | 2022-07-12 |
| CN114744098B true CN114744098B (en) | 2022-08-23 |
Family
ID=82287724
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210649508.9A Active CN114744098B (en) | 2022-06-10 | 2022-06-10 | Preparation method of multicolor LED lamp bead and multicolor LED lamp bead |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114744098B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010538434A (en) * | 2007-09-07 | 2010-12-09 | アルノルト・ウント・リヒター・シネ・テヒニーク・ゲー・エム・ベー・ハー・ウント・カンパニー・ベトリープス・カー・ゲー | Method and apparatus for adjusting color characteristics or photometric characteristics of LED lighting apparatus |
| CN102458019A (en) * | 2010-10-26 | 2012-05-16 | 财团法人工业技术研究院 | Photochromic modulation method, light emitting diode light source module and packaging structure thereof |
| CN107940253A (en) * | 2017-11-14 | 2018-04-20 | 深圳市爱图仕影像器材有限公司 | A kind of white LED lamp and control method |
| CN108156700A (en) * | 2017-12-19 | 2018-06-12 | 广州市雅江光电设备有限公司 | A kind of LED lamp and control method for improving white light efficiency |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6507159B2 (en) * | 2001-03-29 | 2003-01-14 | Koninklijke Philips Electronics N.V. | Controlling method and system for RGB based LED luminary |
| US9713223B2 (en) * | 2015-07-02 | 2017-07-18 | Vital Vio, Inc. | Automated calibration of LED luminaires based on color coordinates |
-
2022
- 2022-06-10 CN CN202210649508.9A patent/CN114744098B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010538434A (en) * | 2007-09-07 | 2010-12-09 | アルノルト・ウント・リヒター・シネ・テヒニーク・ゲー・エム・ベー・ハー・ウント・カンパニー・ベトリープス・カー・ゲー | Method and apparatus for adjusting color characteristics or photometric characteristics of LED lighting apparatus |
| CN102458019A (en) * | 2010-10-26 | 2012-05-16 | 财团法人工业技术研究院 | Photochromic modulation method, light emitting diode light source module and packaging structure thereof |
| CN107940253A (en) * | 2017-11-14 | 2018-04-20 | 深圳市爱图仕影像器材有限公司 | A kind of white LED lamp and control method |
| CN108156700A (en) * | 2017-12-19 | 2018-06-12 | 广州市雅江光电设备有限公司 | A kind of LED lamp and control method for improving white light efficiency |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114744098A (en) | 2022-07-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6744194B2 (en) | Light emitting diode | |
| US6909234B2 (en) | Package structure of a composite LED | |
| US6858456B2 (en) | Method for manufacturing a light emitting device | |
| EP2400567B1 (en) | Phosphor selection for a Light-Emitting Device | |
| US8294162B2 (en) | LED device and LED lighting apparatus | |
| US10026877B2 (en) | LED module | |
| US20050012457A1 (en) | Light-emitting semiconductor device packaged with light-emitting diode and current-driving integrated circuit | |
| US20110037081A1 (en) | White light-emitting diode packages with tunable color temperature | |
| US9497827B2 (en) | Light-emitting apparatus and method of manufacturing light-emitting apparatus | |
| JP2007066969A (en) | White light emitting diode and its fabrication process | |
| CN102447046B (en) | Light emitting diode packaging structure and manufacturing method thereof | |
| JP4592052B2 (en) | Method for producing pastel LED | |
| US20140167083A1 (en) | Led package with integrated reflective shield on zener diode | |
| CN114744098B (en) | Preparation method of multicolor LED lamp bead and multicolor LED lamp bead | |
| EP2953172B1 (en) | Led light source package structure and led light source packaging method | |
| CN103151434A (en) | Method for improving distribution uniformity of LED (Light Emitting Diode) encapsulated fluorescent powder | |
| CN214176060U (en) | COB light source and lamp with mixed blue light crystal grains and CSP crystal grains | |
| CN211600348U (en) | Make things convenient for COB light source of line design | |
| JP4418057B2 (en) | LED chip | |
| KR20040070870A (en) | White light emitting device having high brightness | |
| KR100567546B1 (en) | Pink Light Emitting Diode and Methode for Manufacturing the same | |
| JP5242661B2 (en) | Method for manufacturing light emitting device | |
| KR200402110Y1 (en) | Light Emitting Diode | |
| CN105514248A (en) | High white light and low light decay LED and preparation method thereof | |
| CN204289437U (en) | A kind of light-emitting diode of high-color rendering |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |