CN114709162A - Transfer device and preparation method of display panel - Google Patents
Transfer device and preparation method of display panel Download PDFInfo
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- CN114709162A CN114709162A CN202210306232.4A CN202210306232A CN114709162A CN 114709162 A CN114709162 A CN 114709162A CN 202210306232 A CN202210306232 A CN 202210306232A CN 114709162 A CN114709162 A CN 114709162A
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- 238000002360 preparation method Methods 0.000 title description 5
- 239000000758 substrate Substances 0.000 claims abstract description 155
- 230000005291 magnetic effect Effects 0.000 claims abstract description 144
- 238000004519 manufacturing process Methods 0.000 claims abstract description 9
- 238000000034 method Methods 0.000 claims description 28
- 239000000696 magnetic material Substances 0.000 claims description 22
- 229910052751 metal Inorganic materials 0.000 claims description 19
- 239000002184 metal Substances 0.000 claims description 19
- 229920002120 photoresistant polymer Polymers 0.000 claims description 18
- 239000000523 sample Substances 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 7
- 238000005538 encapsulation Methods 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 5
- 238000000059 patterning Methods 0.000 claims description 3
- 239000003292 glue Substances 0.000 abstract description 22
- 239000000126 substance Substances 0.000 description 10
- 238000005516 engineering process Methods 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 5
- 230000005389 magnetism Effects 0.000 description 5
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 230000005294 ferromagnetic effect Effects 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 229910000640 Fe alloy Inorganic materials 0.000 description 2
- -1 Ferrous metals Chemical class 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000005292 diamagnetic effect Effects 0.000 description 2
- 230000005293 ferrimagnetic effect Effects 0.000 description 2
- 239000003302 ferromagnetic material Substances 0.000 description 2
- 229910001004 magnetic alloy Inorganic materials 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 230000005298 paramagnetic effect Effects 0.000 description 2
- 229910052761 rare earth metal Inorganic materials 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229910001018 Cast iron Inorganic materials 0.000 description 1
- 229910000805 Pig iron Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910000828 alnico Inorganic materials 0.000 description 1
- 230000005290 antiferromagnetic effect Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- BIJOYKCOMBZXAE-UHFFFAOYSA-N chromium iron nickel Chemical compound [Cr].[Fe].[Ni] BIJOYKCOMBZXAE-UHFFFAOYSA-N 0.000 description 1
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- 229910017052 cobalt Inorganic materials 0.000 description 1
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- 229910052760 oxygen Inorganic materials 0.000 description 1
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- 238000005240 physical vapour deposition Methods 0.000 description 1
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- 229910000859 α-Fe Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68368—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The embodiment of the application provides a transfer device and a manufacturing method of a display panel; the transfer device comprises a transfer substrate and a plurality of magnetic members, wherein each magnetic member is used for grabbing a corresponding target light-emitting device, the plurality of magnetic members are magnetically connected with the transfer substrate, and the target light-emitting devices are transferred onto the target substrate through the magnetic members and the transfer substrate; according to the transfer device, the plurality of magnetic members correspond to the plurality of target light-emitting devices one to one, each magnetic member is used for grabbing the corresponding target light-emitting device, and meanwhile, the transfer substrate is magnetically connected with the plurality of magnetic members, so that the plurality of target light-emitting devices are synchronously transferred to the appointed position of the target substrate through the magnetic members and the transfer substrate, a transfer glue head is not needed to be used for realizing reliable, accurate, rapid and cheap mass transfer of the target light-emitting devices, and the problem of glue residue between the transfer glue head and the transfer glue head in the original transfer device is further solved.
Description
Technical Field
The application relates to the field of display, in particular to a transfer device and a preparation method of a display panel.
Background
A light emitting device (Micro-led) is a novel self-luminous display technology, and a display device having the advantages of high brightness, good light emitting efficiency, low power consumption, long service life, lightness, thinness, and the like is expected to become a next-generation mainstream display technology. The micro LED technology mainly arranges micro LEDs of several micrometers to several tens of micrometers in an array on a substrate to form a high-density micro-sized LED array.
The development of the micro led is limited by key technologies such as chip (bulk) transfer, and the bulk transfer and the bonding of the chip and the substrate after the bulk transfer are bottlenecks in achieving yield improvement of the micro led display technology. The existing transfer device for the MicroLED uses an adhesive suction head to absorb and transfer the MicroLED device, and the adhesiveness of glue is utilized. However, after the transfer device is transferred, a glue residue problem is generated between the adjacent transfer heads.
Therefore, a transfer device and a method for manufacturing a display panel are needed to solve the above-mentioned problems.
Disclosure of Invention
The embodiment of the application provides a transfer device and a preparation method of a display panel, which can solve the technical problem that glue residues exist in the process of transferring a large amount of light-emitting devices at present.
The embodiment of the application provides a transfer device, which is used for transferring a target light-emitting device and comprises a transfer substrate and a plurality of magnetic members arranged on one side of the transfer substrate, wherein one end of each magnetic member, which is far away from the transfer substrate, is used for grabbing the corresponding target light-emitting device;
wherein a plurality of the magnetic members are magnetically connected to the transfer substrate, and the target light emitting device is transferred onto the target substrate through the magnetic members and the transfer substrate.
Optionally, in some embodiments of the present application, the magnetic member is an organic photoresist doped with a magnetic material.
Optionally, in some embodiments of the present application, the transfer base plate includes a metal substrate, and a material of the metal substrate is a metal magnetic material.
Optionally, in some embodiments of the present application, the transfer substrate includes a body structure and a plurality of magnetic probes fixedly connected to the body structure, the plurality of magnetic probes being fixed to one side of the body structure;
wherein the body structure is capable of generating a magnetic field to enable each of the probes to magnetically attract the corresponding magnetic member.
Optionally, in some embodiments of the present application, the main body structure is made of a magnetic material or is capable of generating a magnetic field when energized.
Correspondingly, the embodiment of the application further provides a preparation method of the display panel, and the method comprises the following steps:
providing a bearing substrate and a transfer device, wherein a plurality of target light-emitting devices are arranged on the bearing substrate in an array manner, and the transfer device is the transfer device as described in any one of the above items;
transferring a plurality of the target light emitting devices onto a target substrate by the transferring means;
and forming an encapsulation layer on each target light-emitting device to obtain the display panel.
Optionally, in some embodiments of the present application, the step of transferring the target light emitting devices onto a target substrate by the transfer device further includes:
forming a plurality of magnetic members on the carrier substrate, the plurality of magnetic members corresponding to the plurality of target light emitting devices one to one;
transferring the transfer substrate onto the bearing substrate, so that one side of the transfer substrate, which is close to the bearing substrate, is magnetically connected with the plurality of magnetic members;
synchronously moving the transfer substrate, the plurality of magnetic members and the plurality of target light-emitting devices to a target substrate, so that the plurality of target light-emitting devices are transferred to specified positions on the target substrate;
removing the plurality of magnetic members and the transfer substrate.
Optionally, in some embodiments of the present application, the step of forming a plurality of magnetic members on the carrier substrate, where the plurality of magnetic members correspond to a plurality of target light-emitting devices one to one, further includes:
forming a magnetic light resistance layer on the bearing substrate, wherein the magnetic light resistance layer completely covers the target light-emitting devices;
and patterning the magnetic light resistance layer to form a plurality of magnetic members, wherein the plurality of magnetic members correspond to the plurality of target light-emitting devices one by one.
Optionally, in some embodiments of the present application, the removing the plurality of magnetic members and the transfer substrate further includes:
removing the plurality of magnetic members by a laser lift-off process or an exposure etching process;
moving the transfer substrate to a side away from the target substrate.
Optionally, in some embodiments of the present application, the magnetic member is an organic photoresist doped with a magnetic material.
The embodiment of the application provides a transfer device and a manufacturing method of a display panel; the transfer device comprises a transfer substrate and a plurality of magnetic members arranged on one side of the transfer substrate, wherein one end, far away from the transfer substrate, of each magnetic member is used for grabbing the corresponding target light-emitting device, the plurality of magnetic members are magnetically connected with the transfer substrate, and the target light-emitting device is transferred onto the target substrate through the magnetic members and the transfer substrate; according to the transfer device, the plurality of magnetic members are in one-to-one correspondence with the plurality of target light-emitting devices, each magnetic member is used for grabbing the corresponding target light-emitting device, and the transfer substrate is magnetically connected with the plurality of magnetic members, so that the plurality of target light-emitting devices are synchronously transferred to the appointed position of the target substrate through the magnetic members and the transfer substrate, and therefore the large transfer of the target light-emitting devices can be reliably, accurately, quickly and cheaply realized without using a transfer glue head, and the problem of glue residue between the transfer glue head and the transfer glue head in the original transfer device is further solved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic view of a first transfer device provided in an embodiment of the present application during a transfer process of a light emitting device;
fig. 2 is a schematic view of a second transferring apparatus for transferring a light emitting device according to an embodiment of the present disclosure;
fig. 3 is a flowchart of a manufacturing method of a display panel according to an embodiment of the present disclosure.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application. Furthermore, it should be understood that the detailed description and specific examples, while indicating exemplary embodiments of the invention, are given by way of illustration and explanation only, and are not intended to limit the scope of the invention. In the present application, unless indicated to the contrary, the use of the directional terms "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, and more particularly to the orientation of the figures of the drawings; while "inner" and "outer" are with respect to the outline of the device.
The embodiment of the application aims at the technical problem that glue residue exists in the process of transferring a large amount of the current light-emitting device, and the embodiment of the application can improve the technical problem.
The technical solution of the present application will now be described with reference to specific embodiments.
Referring to fig. 1 to 2, an embodiment of the present application provides a transfer apparatus 10 for transferring a target light emitting device 20, where the transfer apparatus 10 includes a transfer substrate 11 and a plurality of magnetic members 12 disposed on one side of the transfer substrate 11, and one end of each of the magnetic members 12 away from the transfer substrate 11 is used for grabbing the corresponding target light emitting device 20;
wherein a plurality of the magnetic members 12 are magnetically connected to the transfer substrate 11, and the target light emitting device 20 is transferred onto the target substrate 30 through the magnetic members 12 and the transfer substrate 11.
The above-mentioned transfer device 10 that this application embodiment provided is through with a plurality of magnetic member 12 and a plurality of target luminescent device 20 one-to-one, and each magnetic member 12 is used for snatching the correspondence target luminescent device 20, makes simultaneously transfer base plate 11 with a plurality of magnetic member 12 magnetism is connected, thereby makes a plurality ofly target luminescent device 20 pass through magnetic member 12 with transfer base plate 11 shifts to the assigned position of target base plate 30 in step, thereby need not to use the transfer to glue the head and just can realize reliably, accurately, fast, cheaply shifting the huge amount of target luminescent device 20, has further solved the gluey residue problem that exists between transfer to glue the head and the transfer to glue the head in original transfer device 10.
The technical solution of the present application will now be described with reference to specific embodiments.
Example one
As shown in fig. 1, a schematic diagram of a first transferring apparatus 10 provided for the embodiment of the present application in a transferring process of a light emitting device; the transfer device 10 is used for transferring a target light-emitting device 20, the transfer device 10 includes a transfer substrate 11 and a plurality of magnetic members 12 disposed on one side of the transfer substrate 11, and one end of each magnetic member 12 away from the transfer substrate 11 is used for grabbing the corresponding target light-emitting device 20;
wherein a plurality of the magnetic members 12 are magnetically connected to the transfer substrate 11, and the target light emitting device 20 is transferred onto the target substrate 30 through the magnetic members 12 and the transfer substrate 11.
In the embodiment of the present application, the magnetic member 12 is an organic photoresist doped with a magnetic material; among them, substances can be classified into diamagnetic substances, paramagnetic substances, ferromagnetic substances, antiferromagnetic substances, and ferrimagnetic substances according to the strength of magnetism exhibited by the substances in an external magnetic field. Most materials are diamagnetic or paramagnetic and they are less reactive to external magnetic fields. Ferromagnetic substances and ferrimagnetic substances are ferromagnetic substances, and a ferromagnetic material is generally referred to as a magnetic material. For a magnetic material, the magnetization curve and the hysteresis loop are characteristic curves reflecting its basic magnetic properties. Specifically, ferromagnetic materials are generally Fe, Co, Ni elements and alloys thereof, rare earth elements and alloys thereof, and some Mn-containing compounds.
In the embodiment of the present application, the transfer base plate 11 includes a metal substrate, and a material of the metal substrate is a metal magnetic material. Wherein the metal magnetic material is generally ferrous metal, which has magnetism; wherein, the metal magnetic material comprises iron alloy, iron, cobalt, nickel and the like. Specifically, the ferrous metal is a material having optical luster, good electrical conductivity, thermal conductivity and mechanical properties, and a positive temperature coefficient of resistance. According to the characteristics of the color, the property and the like of the metal, the metal is divided into two main categories of ferrous metal and non-ferrous metal. Ferrous metals refer primarily to iron and its alloys, such as steel, pig iron, iron alloys, and cast iron.
In the above embodiments of the present application, the target light emitting device 20 is a micro light emitting diode or a mini light emitting diode. Wherein, the micro light emitting diode means a light emitting diode with a grain size less than 100 micrometers. The mini led, which is a size between the conventional led and the micro led, generally means a led with a grain size of about 100 to 200 μm.
Aiming at the technical problem that glue residues exist in the process of transferring a large amount of current light-emitting devices, the embodiment of the present application provides a transferring apparatus 10, where the transferring apparatus 10 includes a transferring substrate 11 and a plurality of magnetic members 12 disposed on one side of the transferring substrate 11, and one end of each of the magnetic members 12, which is away from the transferring substrate 11, is used for grabbing a corresponding target light-emitting device 20, where the magnetic member 12 is an organic photoresist doped with a magnetic material, the transferring substrate 11 is made of a metal magnetic material, the plurality of magnetic members 12 are magnetically connected with the transferring substrate 11, and the target light-emitting device 20 is transferred onto a target substrate 30 through the magnetic members 12 and the transferring substrate 11; the transfer device 10 is configured to correspond the plurality of magnetic members 12 to the plurality of target light emitting devices 20 one by one, and each of the magnetic members 12 is configured to capture the corresponding target light emitting device 20, and at the same time, the transfer substrate 11 is magnetically connected to the plurality of magnetic members 12, so that the plurality of target light emitting devices 20 are synchronously transferred to the designated position of the target substrate 30 through the magnetic members 12 and the transfer substrate 11, and thus, a large amount of transfer of the target light emitting devices 20 can be reliably, accurately, quickly and cheaply achieved without using a transfer head, and the problem of glue residue existing between the transfer head and the transfer head in the original transfer device 10 is further solved.
Example two
Fig. 2 is a schematic diagram illustrating a transferring process of the second transferring apparatus 10 in transferring the light emitting device according to the embodiment of the present application; the structure of the transfer device 10 in the second embodiment of the present application is the same as or similar to the structure of the transfer device 10 in the first embodiment of the present application, except that the transfer substrate 11 includes a main body structure 111 and a plurality of probes 112 having magnetism, and each of the probes 112 is fixed on one side of the main body structure 111;
wherein the main body structure 111 can generate a magnetic field to enable each probe 112 to magnetically attract the corresponding magnetic member 12.
In the embodiment of the present application, since the main body structure 111 can generate a magnetic field in the transferring apparatus 10, so that each of the probes 112 can magnetically attract one of the magnetic members 12, and the main body structure 111 can attract a large number of target light-emitting elements at a time through the probes 112, a huge amount of transferring of the target light-emitting elements can be realized.
In the embodiment of the present application, the main body structure 111 is made of a magnetic material or the main body structure 111 can generate a magnetic field when being powered on. The magnetic material may be, for example, an alnico permanent magnetic alloy, an iron-chromium-nickel permanent magnetic alloy, a permanent magnetic ferrite, other rare earth permanent magnetic materials, or a composite permanent magnetic material made of the above materials. Alternatively, the main body structure 111 is an electromagnetic flat plate, and can generate a magnetic field after being electrified.
Aiming at the technical problem that the prior light-emitting device has glue residue in the process of transferring a large amount of light-emitting devices, the embodiment of the application provides a transferring device 10, the transfer device 10 comprises a transfer substrate 11 and a plurality of magnetic members 12 arranged on one side of the transfer substrate 11, one end of each magnetic member 12 far away from the transfer substrate 11 is used for grabbing the corresponding target light-emitting device 20, wherein the magnetic member 12 is an organic photoresist doped with a magnetic material, the transfer substrate 11 includes a body structure 111 and a plurality of probes 112 having magnetism, the body structure 111 is capable of generating a magnetic field, so that each of the probes 112 can magnetically attract the corresponding magnetic member 12, a plurality of the magnetic members 12 are magnetically connected to the transfer substrate 11, the target light emitting device 20 is transferred onto the target substrate 30 through the magnetic member 12 and the transfer substrate 11; the transfer device 10 is configured to correspond the plurality of magnetic members 12 to the plurality of target light emitting devices 20 one by one, and each of the magnetic members 12 is configured to capture the corresponding target light emitting device 20, and at the same time, the transfer substrate 11 is magnetically connected to the plurality of magnetic members 12, so that the plurality of target light emitting devices 20 are synchronously transferred to the designated position of the target substrate 30 through the magnetic members 12 and the transfer substrate 11, and thus, a large amount of transfer of the target light emitting devices 20 can be reliably, accurately, quickly and cheaply achieved without using a transfer head, and the problem of glue residue existing between the transfer head and the transfer head in the original transfer device 10 is further solved. In this embodiment, compared with the first embodiment, the magnetic member 12 is attracted by the probe 112, so that the contact area between the transfer substrate 11 and the magnetic member 12 can be reduced, and the phenomenon that the magnetic member 12 is difficult to be peeled from the transfer substrate 11 in the subsequent process can be effectively prevented.
As shown in fig. 3, which is a flowchart of a manufacturing method of a display panel provided in the embodiment of the present application (described in the first embodiment of the present application); wherein the method comprises the following steps:
s10, providing a carrier substrate on which a plurality of target light emitting devices 20 are arranged in an array, and a transfer device 10, wherein the transfer device 10 is the transfer device 10 as described in any one of the above.
Specifically, the S10 further includes:
firstly, providing a bearing substrate, wherein a plurality of target light-emitting devices 20 are arranged on the bearing substrate in an array manner; meanwhile, a transfer device 10 is provided, the transfer device 10 is used for transferring the target light-emitting device 20, the transfer device 10 includes a transfer substrate 11 and a plurality of magnetic members 12 disposed on one side of the transfer substrate 11, one end of each of the magnetic members 12 away from the transfer substrate 11 is used for grabbing the corresponding target light-emitting device 20, wherein the plurality of magnetic members 12 are magnetically connected with the transfer substrate 11.
In the embodiment of the present application, the target light emitting device 20 is a semi-finished micro light emitting diode device, and the micro light emitting diode device includes a light emitting diode semiconductor layer, a first insulating layer covering the light emitting diode semiconductor layer, and a first electrode and a second electrode which are disposed on the first insulating layer and are in contact with the light emitting diode semiconductor layer.
In the embodiment of the present application, the transfer base plate 11 is a metal substrate.
S20, transferring a plurality of the target light emitting devices 20 onto a target substrate 30 by the transferring apparatus 10.
Specifically, the S20 further includes:
firstly, forming a plurality of magnetic members 12 on the carrier substrate, wherein the plurality of magnetic members 12 correspond to the plurality of target light-emitting devices 20 one by one; specifically, a magnetic photoresist layer is formed on the carrier substrate, and the magnetic photoresist layer completely covers the plurality of target light emitting devices 20; then, the magnetic photoresist layer is patterned to form a plurality of magnetic members 12, and the plurality of magnetic members 12 correspond to the plurality of target light emitting devices 20 one to one. The step of patterning the magnetic photoresist layer comprises the following steps: exposing the magnetic photoresist layer by using a customized photomask, etching off a part of the magnetic photoresist layer outside the target light-emitting device 20, and finally, reserving a part of the magnetic photoresist layer on the target light-emitting device 20, thereby forming a plurality of magnetic members 12, wherein the plurality of magnetic members 12 correspond to the plurality of target light-emitting devices 20 one to one.
In the embodiment of the present application, the magnetic photoresist layer is an organic photoresist doped with a magnetic material, and is coated on the target light emitting device 20 in a form of a coating film by a chemical vapor deposition method or a physical vapor deposition method, so that the magnetic photoresist layer and the target light emitting device 20 have a better stable connection; and in the top view direction of the carrying substrate, the orthographic projection of the magnetic member 12 on the carrying substrate is coincident with the orthographic projection of the target light-emitting device 20 on the carrying substrate.
Then, moving the transfer substrate 11 to the upper part of the bearing substrate, so that the orthographic projection of the transfer substrate 11 on the bearing substrate is superposed with the bearing substrate in the top view direction of the bearing substrate; then, moving the transfer substrate 11 in a direction perpendicular to the carrier substrate to bring the transfer substrate 11 close to the carrier substrate; wherein the transfer substrate 11 and the magnetic member 12 are attracted to each other by the magnetic force, so that the transfer substrate 11 and the target light emitting device 20 are fixedly connected.
Then, the transfer substrate 11, the plurality of magnetic members 12, and the plurality of target light emitting devices 20 are moved onto a target substrate 30 in synchronization, so that the plurality of target light emitting devices 20 are transferred to designated positions on the target substrate 30.
Finally, the plurality of magnetic members 12 and the transfer substrate 11 are removed. Wherein the plurality of magnetic members 12 are removed by a laser lift-off process or an exposure etching process; and the transfer substrate 11 is moved to the side away from the target substrate 30.
In the process of removing the plurality of magnetic members 12 by the laser lift-off process or the exposure etching process, since the transfer substrate 11 is made of a metal material and laser cannot penetrate the transfer substrate 11, the magnetic members 12 need to be laser-peeled off from the side surfaces of the transfer substrate 11.
S30, forming an encapsulation layer on each of the target light emitting devices 20, resulting in the display panel.
Specifically, the S30 further includes:
first, after all the target light emitting devices 20 are filled at the designated positions of the target substrate 30, so that each of the sub-pixel regions corresponds to one of the target light emitting devices 20, the first electrode and the second electrode of the target light emitting device 20 in each of the sub-pixel regions are bonded to the first electrode contact and the second electrode contact in the sub-pixel region, respectively.
Then, a test voltage is supplied to the first electrode contact and the second electrode contact to test whether each of the target light emitting devices 20 on the target substrate 30 can be normally turned on; if each target light-emitting device 20 on the target substrate 30 cannot be normally turned on, replacing the target light-emitting device 20 that cannot be normally turned on with a new light-emitting device, and re-testing until all the target light-emitting devices 20 on the target substrate 30 can be normally turned on.
Finally, an encapsulation layer is formed on each of the target light emitting devices 20, resulting in the display panel.
S30, forming an encapsulation layer on each of the target light emitting devices 20, resulting in the display panel. Wherein the encapsulation layer is used to protect the target light emitting device 20 from external water and oxygen.
The transfer device 10 provided by the embodiment of the application does not leave glue when transferring the target light emitting device 20, does not cause circuit breaking, avoids waste of glue materials, can reliably, accurately, quickly and cheaply complete the transfer of the target light emitting device 20, and further effectively improves the transfer efficiency of the target light emitting device 20.
The embodiment of the application provides a transfer device 10 and a manufacturing method of a display panel; the transfer device 10 comprises a transfer substrate 11 and a plurality of magnetic members 12 arranged on one side of the transfer substrate 11, wherein one end of each magnetic member 12 far away from the transfer substrate 11 is used for grabbing the corresponding target light-emitting device 20, the plurality of magnetic members 12 are magnetically connected with the transfer substrate 11, and the target light-emitting device 20 is transferred onto a target substrate 30 through the magnetic members 12 and the transfer substrate 11; the transfer device 10 is configured to correspond the plurality of magnetic members 12 to the plurality of target light emitting devices 20 one by one, and each of the magnetic members 12 is configured to capture the corresponding target light emitting device 20, and at the same time, the transfer substrate 11 is magnetically connected to the plurality of magnetic members 12, so that the plurality of target light emitting devices 20 are transferred to the designated position of the target substrate 30 synchronously through the magnetic members 12 and the transfer substrate 11, and thus, a large amount of transfer of the target light emitting devices 20 can be reliably, accurately, quickly and cheaply achieved without using a transfer head, and the problem of glue residue between the transfer head and the transfer head in the original transfer device 10 is further solved.
The above detailed description is provided for the transfer device 10 and the manufacturing method of the display panel provided in the embodiments of the present application, and the principles and embodiments of the present application are explained in the present application by applying specific examples, and the description of the above embodiments is only used to help understanding the method and the core ideas of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. A transfer apparatus for transferring a target light emitting device, comprising:
transferring the substrate; and
the magnetic members are arranged on one side of the transfer substrate, and one end, far away from the transfer substrate, of each magnetic member is used for grabbing the corresponding target light-emitting device;
wherein a plurality of the magnetic members are magnetically connected to the transfer substrate, and the target light emitting device is transferred onto the target substrate through the magnetic members and the transfer substrate.
2. The transfer device of claim 1, wherein the magnetic member is an organic photoresist doped with a magnetic material.
3. The transfer device according to claim 1, characterized in that the transfer base plate comprises a metal substrate, the material of which is a metal magnetic material.
4. The transfer device of claim 1, wherein the transfer substrate comprises a body structure and a plurality of magnetic probes fixedly attached to the body structure, the plurality of probes being fixed to one side of the body structure;
wherein the body structure is capable of generating a magnetic field to enable each of the probes to magnetically attract the corresponding magnetic member.
5. The transfer device of claim 4, wherein the body structure is a magnetic material or is capable of generating a magnetic field when energized.
6. A method for manufacturing a display panel, the method comprising:
providing a carrier substrate on which a plurality of target light emitting devices are arrayed, and a transfer device according to any one of claims 1 to 5;
transferring a plurality of the target light emitting devices onto a target substrate by the transferring means;
and forming an encapsulation layer on each target light-emitting device to obtain the display panel.
7. The method according to claim 6, wherein the step of transferring the target light emitting devices onto a target substrate by the transfer device further comprises:
forming a plurality of magnetic members on the carrier substrate, the plurality of magnetic members corresponding to the plurality of target light emitting devices one to one;
transferring the transfer substrate onto the bearing substrate, so that one side of the transfer substrate, which is close to the bearing substrate, is magnetically connected with the plurality of magnetic members;
synchronously moving the transfer substrate, the plurality of magnetic members and the plurality of target light-emitting devices to a target substrate, so that the plurality of target light-emitting devices are transferred to specified positions on the target substrate;
removing the plurality of magnetic members and the transfer substrate.
8. The method according to claim 7, wherein the step of forming a plurality of magnetic members on the carrier substrate, the plurality of magnetic members corresponding to the plurality of target light-emitting devices one-to-one further comprises:
forming a magnetic light resistance layer on the bearing substrate, wherein the magnetic light resistance layer completely covers the target light-emitting devices;
and patterning the magnetic photoresist layer to form a plurality of magnetic members, wherein the plurality of magnetic members correspond to the plurality of target light-emitting devices one by one.
9. The method according to claim 7, wherein the step of removing the plurality of magnetic members and the transfer substrate further comprises:
removing the plurality of magnetic members by a laser lift-off process or an exposure etching process;
moving the transfer substrate to a side away from the target substrate.
10. The method of manufacturing a display panel according to claim 7, wherein the magnetic member is an organic photoresist doped with a magnetic material.
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